Invention content
For the above-mentioned problems in the prior art, a kind of method of measurement silicon chip input reproducibility is now provided.
Specific technical solution is as follows：
A method of it measuring silicon chip and puts into reproducibility, apply in liquid immersion type litho machine, include the following steps：
Step S1：A test silicon wafer is provided, in test badge is arranged in the test silicon wafer；
Step S2：The test silicon wafer is positioned in the conveyer system of the liquid immersion type litho machine；
Step S3：The test silicon wafer is sent to by adjustment location using the conveyer system, is located at the adjustment locationThe test silicon wafer do not contacted with the liquid flood zone of the liquid immersion type litho machine；
Step S4：It uses label measuring equipment to carry out position to the test badge to measure to obtain one group of test data；
Step S5：The test silicon wafer is removed by the adjustment location using the conveyer system；
Step S6：Judge whether the quantity of the test data meets preset quantity required；
If so, entering step S7；If it is not, then return to step S3；
Step S7：All test datas are calculated, the test result of silicon chip input reproducibility is obtained.
Preferably, the liquid flood zone is arranged at the middle part of the view field of the liquid immersion type litho machine.
Preferably, the adjustment location is generally aligned in the same plane with the view field.
Preferably, the test silicon wafer and the view field for being located at the adjustment location are overlapped.
Preferably, the test badge is set to the test silicon wafer when positioned at the adjustment location close to the immersionThe side in region.
Preferably, in the step S4, the label measuring equipment includes a measurement camera lens, and the measurement camera lens is to describedThe marked region of test silicon wafer is tested.
Preferably, the marked region is a square region.
Preferably, the test badge includes multiple mark points.
Preferably, each mark point is arranged in the marked region.
Preferably, the test data is the offset of test badge and normal place；
In the step S7, uses and calculate the average value of the test data to obtain the test result.
Above-mentioned technical proposal has the following advantages that or advantageous effect：
Installation position using adjustment adjustment location and test badge makes test silicon wafer avoid contacting with liquid flood zone,Achieve the purpose that without being coated with waterproof coating, to avoid the test badge on silicon chip from being depleted, raising amount in test silicon waferThe accuracy of survey extends the service life of test silicon wafer.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, completeSite preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based onEmbodiment in the present invention, those of ordinary skill in the art obtained under the premise of not making creative work it is all itsHis embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phaseMutually combination.
The invention will be further described in the following with reference to the drawings and specific embodiments, but not as limiting to the invention.
In a kind of preferred embodiment of the present invention, according to Fig. 1, a method of it measuring silicon chip and puts into reproducibility, fortuneFor in liquid immersion type litho machine, including the following steps：
Step S1：A test silicon wafer is provided, in test badge is arranged in test silicon wafer；
Step S2：Test silicon wafer is positioned in the conveyer system of liquid immersion type litho machine；
Step S3：Test silicon wafer is sent to by adjustment location using conveyer system, be located at adjustment location test silicon wafer withThe liquid flood zone of liquid immersion type litho machine does not contact；
Step S4：It uses label measuring equipment to carry out position to test badge to measure to obtain one group of test data；
Step S5：Test silicon wafer is removed by adjustment location using conveyer system；
Step S6：Judge whether the quantity of test data meets preset quantity required；
If so, entering step S7；If it is not, then return to step S3；
Step S7：All test datas are calculated, the test result of silicon chip input reproducibility is obtained.
Specifically, in the present embodiment, test silicon wafer is transmitted using conveyer system, in specified position to test siliconThe test badge of on piece measures, to obtain test data, by carrying out calculating final acquisition to the data repeatedly testedThe test result of reproducibility is put into silicon chip.
Using the setting to adjustment location, control test silicon wafer refuses the contact of liquid flood zone, avoids in test silicon waferWaterproof coating is set, the accuracy of the efficiency and test of the test of silicon chip input reproducibility is improved.
In a kind of preferred embodiment of the present invention, liquid flood zone is arranged in the view field of liquid immersion type litho machinePortion.
In a kind of preferred embodiment of the present invention, adjustment location is generally aligned in the same plane with view field.
Specifically, in the present embodiment, it is arranged in same plane using by adjustment location and view field, realizing will testSilicon chip puts into the operating process that reproducibility is put into silicon chip in actual etching process and is consistent, and there is only the areas of horizontal positionNot, to reach and the most similar test data of practical operation.
In a kind of preferred embodiment of the present invention, test silicon wafer and the view field for being located at adjustment location are overlapped.
Specifically, in the present embodiment, test silicon wafer and view field's position relationship are further defined so that test processWith practical operation more closely, avoiding contact of the liquid flood zone with test silicon wafer simultaneously, reach preferably test effect.
In a kind of preferred embodiment of the present invention, test badge is set to test silicon wafer when positioned at adjustment location close to leachingThe side of water area.
Specifically, in the present embodiment, test badge is arranged in the side of test silicon wafer so that when adjustment location is arrangedThe position between liquid flood zone and test silicon wafer is more easily controlled, avoids being arranged in test silicon wafer due to test badgePortion leads to not realize that liquid flood zone does not contact and mark measuring equipment spy to get test badge with test silicon wafer simultaneously.
In a kind of preferred embodiment of the present invention, in step S4, label measuring equipment includes a measurement camera lens, measures camera lensThe marked region of test silicon wafer is tested.
Specifically, in the present embodiment, using the image measured in camera lens acquisition test silicon wafer, and then judge test badge institutePosition.
In a kind of preferred embodiment of the present invention, marked region is a square region.
In a kind of preferred embodiment of the present invention, test badge includes multiple mark points.
Specifically, in the present embodiment, make to mark measuring equipment by comparing multiple mark points using multiple mark pointsTest, to get more accurate test data.
In a kind of preferred embodiment of the present invention, each mark point is arranged in marked region.
In a kind of preferred embodiment of the present invention, test data is the offset of test badge and normal place；
In step S7, use the average value for calculating test data to obtain test result.
In a kind of preferred embodiment of the present invention, according to Fig.3, test silicon wafer 1 is not overlapped with liquid flood zone 3Contact, since the marked region 5 and the position of liquid flood zone 3 that measure camera lens measurement are relatively fixed, by setting test badge 2It sets and is realized test silicon wafer 1 and view field 4 by adjusting adjustment location by the side through liquid flood zone 3, realizingLiquid flood zone 3 detaches, and relative to existing testing scheme shown in Fig. 2, technical scheme of the present invention solves test silicon wafer 1The technical issues of needing to smear waterproof coating.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection modelIt encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic contentEquivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.