Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Specifically, referring to fig. 1 to 3, an embodiment of the present application provides an electronic device, which may be an electronic device such as a smart phone, a tablet computer, and a display screen. Referring to fig. 1, theelectronic device 100 includes aglass housing 10, afunctional assembly 20, afirst sealing member 30, asecond sealing member 40, and anantenna structure 50.
Theglass housing 10 includes afirst opening 11 and asecond opening 13 disposed opposite to each other, and areceiving space 12 extending from the first opening 11 to thesecond opening 13.
Theglass housing 10 may be made of sapphire or the like. Theglass housing 10 has afirst surface 101 and asecond surface 102. For example, when theelectronic device 100 is displayed on a single side, thefirst surface 102 may be a display side of the electronic device, and thesecond surface 102 may be a rear case surface of the electronic device. For example, thefirst surface 102 and thesecond surface 102 may both be display surfaces of an electronic device, so as to realize a double-sided display of the electronic device. At least one side of theglass housing 10 may be a touch screen glass side capable of touch control. For example, theglass housing 10 may implement a double-sided touch screen.
Wherein thefirst opening 11 can be disposed on any side of theglass housing 10, and thesecond opening 13 is disposed opposite to thefirst opening 11. For example, taking a mobile phone as an example, thefirst opening 11 may be disposed at the top end of the mobile phone, and the correspondingsecond opening 13 may be disposed at the bottom end of the mobile phone; for another example, thefirst opening 11 may be disposed at the lower end of the mobile phone, and the correspondingsecond opening 13 may be disposed at the upper end of the mobile phone. In some embodiments, thefirst opening 11 may also be disposed on the left or right side of the handset, and the corresponding second opening is disposed on the right or left side of the handset.
Thefunctional module 20 is accommodated in theaccommodating space 12, and thefunctional module 20 at least includes adisplay module 21 and acontrol circuit 22 connected to thedisplay module 21.
The area of theglass housing 10 corresponding to thedisplay module 21 is a display area.
Thedisplay module 21 may be an LCD display module or an OLED display module.
As shown in fig. 1 or fig. 2, thefunctional component 20 has adisplay module 21, and afirst surface 101 of theglass housing 10 corresponding to thedisplay module 21 is a display surface of theelectronic device 100.
As shown in fig. 3, thedisplay module 21 includes afirst display module 211 and asecond display module 212, wherein thecontrol circuit 22 is located between thefirst display module 211 and thesecond display module 212, thefirst surface 101 corresponding to thefirst display module 211 is a first display surface of theelectronic device 100, and thefirst surface 102 corresponding to thesecond display module 212 is a second display surface of theelectronic device 100, so as to implement a double-sided screen display of theelectronic device 100, for example, a double-sided color screen capable of displaying the same performance parameters on both sides can be implemented. Theelectronic equipment 100 can also realize one-side color screen and the other-side black-and-white screen, for example, the black screen can be a black-and-white electronic ink screen, wherein the black-and-white electronic ink screen has the characteristics of no screen flicker, long endurance time, texture close to paper and the like, and the adoption of the two-side screen with the one-side color screen and the other-side black-and-white screen can flexibly switch the display screens according to the electric quantity of the battery, so that the endurance capacity is increased. Theelectronic equipment 100 with the double-sided screen can realize diversification of display effects, increase entertainment of theelectronic equipment 100, improve user experience, and simultaneously can reasonably switch the display screen in combination with battery power to increase cruising ability of theelectronic equipment 100.
In some embodiments, thecontrol circuit 22 may be a control circuit for individually controlling thedisplay modules 21. Thecontrol circuit 22 is connected to thedisplay module 21, and thecontrol circuit 22 outputs an electrical signal to thedisplay module 21 to control thedisplay module 21 to display information, receive a touch signal, turn on or off the screen, and the like. Thecontrol circuit 22 may also be connected to a processor in theelectronic device 100, so as to control thedisplay module 21 to display information, receive a touch signal, turn on or off the screen, and the like according to an instruction of the processor.
In some embodiments, thecontrol circuit 22 may be a motherboard of theelectronic device 100. Themain board 22 is provided with a grounding point to realize grounding of themain board 22, wherein the grounding point may be a whole machine ground of theelectronic apparatus 100. Other functional components such as a camera, an audio module, a sensor, a wireless fidelity module, a radio frequency module, a bluetooth module, a memory, and a processor may be integrated on themotherboard 22. Meanwhile, thedisplay module 21 may be electrically connected to themain board 22.
A first sealingmember 30 and asecond sealing member 40 are respectively provided at thefirst opening 11 and thesecond opening 13 to seal thefunctional assembly 20 within theglass housing 10.
In some embodiments, a sealant for bonding the first sealingmember 30 and theglass housing 10 such that the first sealingmember 30 tightly seals thefirst opening 11 and a sealant for bonding the second sealingmember 40 and theglass housing 10 such that the second sealingmember 40 tightly seals thesecond opening 13 may be respectively disposed between the first sealingmember 30 and the second sealingmember 40 and theglass housing 10, and thefunctional component 20 is sealed in theglass housing 10 by the first sealingmember 30 and the second sealingmember 40. For example, the sealant can be a hot melt adhesive, a photosensitive adhesive, an optical adhesive, and the like. For example, the colloid is a transparent OCA optical cement.
Theglass housing 10 is fully sealed at other positions except for thefirst opening 11 and thesecond opening 13, and thefirst opening 11 and thesecond opening 13 can be respectively sealed by thefirst sealing element 30 and thesecond sealing element 40, so that thefunctional component 20 can be well sealed in theglass housing 10, and the waterproof performance of the electronic device can be effectively improved. And thedisplay module 21 thatfunctional unit 20 includes is whole to be acceptd in the accommodating space ofglass housing 10, and the display area ofwhole display module 21 can be intact to show through thisglass housing 10, does not have the black frame of display screen, can realize electronic equipment's full screen, promotes the screen and accounts for the ratio.
Theglass housing 10 has asecond opening 15, thesecond opening 15 being disposed opposite to thefirst opening 11, and asecond sealing member 40 being disposed at thesecond opening 15.
Wherein the first sealingmember 30 and the second sealingmember 40 are respectively disposed at thefirst opening 11 and thesecond opening 13 to seal thefunctional assembly 20 within theglass housing 10, the assembly of the electronic device can be made more convenient. For example, thefunctional module 20 may be selectively inserted into the receivingspace 12 of theglass housing 10 from thefirst opening 11 or pushed into the receivingspace 12 of theglass housing 10 from thesecond opening 13 during mounting. When disassembling, thefunctional assembly 20 can be selectively taken out from thefirst opening 11 or thesecond opening 13. Afirst seal 30 is provided at thefirst opening 11 and asecond seal 40 is provided at thesecond opening 13, by means of whichfirst seal 30 andsecond seal 40 thefunctional component 20 can be sealed within theglass housing 10. Through set upfirst opening 11 andsecond opening 13 in the relative both sides ofglass casing 10, can makefunctional unit 20 push in accommodatingspace 12 of glass casing 10 from arbitrary opening at will, and convenient assembling, and easy maintenance, in case one of them opening onglass casing 10 damages, then can directly change the sealing member that corresponds can, adopt the sealing member fixed seal after changing to the opening that has damaged, then realize normal installation or dismantlement through another opening that does not damage, avoided having had single open-ended electronic equipment to lead to whole glass casing to get rid of the condition because of the opening damages. When a certain sealing element is damaged, only the corresponding sealing element needs to be replaced, so that the equipment maintenance cost can be reduced.
In some embodiments, both thefirst seal 40 and thesecond seal 40 may be made of a glass material.
In some embodiments, thefirst seal 40 and/or thesecond seal 40 may be made of a transparent material, which may include plastic, glass, plexiglass, composite materials, and the like.
In some embodiments, as shown in fig. 1, a seal may be disposed over the corresponding opening, e.g., a first seal may be disposed over thefirst opening 11 and a second seal may be disposed over thesecond opening 13.
In some embodiments, as shown in fig. 2 or 3, the seals may be received in corresponding openings, such as thefirst seal 30 received in thefirst opening 11 and thesecond seal 40 received in thesecond opening 13. By accommodating the sealing member in the corresponding opening, theelectronic device 100 gives a user a seamless or non-gap whole when viewing the appearance of theelectronic device 100 from the front or back of theelectronic device 100, so that theelectronic device 100 is more beautiful.
In some embodiments, one of the seals may be disposed over the corresponding opening and the other seal may be received within the corresponding opening, e.g., a first seal may be disposed over thefirst opening 11 and a second seal may be received within thesecond opening 13. For example, a first seal member may be received in thefirst opening 11 and a second seal member may be disposed over thesecond opening 13.
And anantenna structure 50 disposed on the first sealingmember 30 and the second sealingmember 40, wherein theantenna structure 50 is provided with a feeding point and a grounding point, the feeding point is electrically connected to thecontrol circuit 22, and the grounding point is connected to theoverall ground 60.
In some embodiments, theantenna structure 50 may have one, two, three, or more. Here, two antenna structures are taken as an example for explanation, and the number of theantenna structures 50 is not limited thereto. As shown in fig. 1, theantenna structures 50 may be respectively disposed on the outer surfaces of the sealing members. Theantenna structure 50 includes afirst antenna structure 51 and asecond antenna structure 52, wherein thefirst antenna structure 51 is formed on theouter surface 301 of the first sealingmember 30, and thesecond antenna structure 52 is formed on theouter surface 401 of the second sealingmember 40.
Theouter surface 301 of the first sealingmember 30 is provided with afirst groove 31, thefirst groove 31 is provided with a first throughhole 311 and a second throughhole 312, the first throughhole 311 and the second throughhole 312 penetrate from theouter surface 301 of the first sealingmember 30 to theinner surface 302 of the first sealingmember 30, thefirst groove 31, the first throughhole 311 and the second throughhole 312 are filled with aconductive material 70 to form afirst antenna structure 51, and a part of the conductive material filled in the first throughhole 311 and the second throughhole 312 forms afirst feeding point 511 and afirst grounding point 512. For example, thefirst feeding point 511 is electrically connected to thecontrol circuit 22, thecontrol circuit 22 adjusts the operating frequency band of the rf signal of thefirst antenna structure 51, and thefirst grounding point 512 is connected to theoverall ground 60.
Theouter surface 401 of the second sealingmember 40 is provided with asecond groove 41, thesecond groove 41 is provided with a third throughhole 411 and a fourth throughhole 412, the third throughhole 411 and the fourth throughhole 412 penetrate from theouter surface 401 of the second sealingmember 40 to theinner surface 402 of the second sealingmember 40, thesecond groove 41, the third throughhole 411 and the fourth throughhole 412 are filled with theconductive material 70 to form thesecond antenna structure 52, and the portions of the conductive material filled in the third throughhole 411 and the fourth throughhole 412 form asecond feeding point 521 and a second grounding point 522. For example, thesecond feeding point 521 is electrically connected to thecontrol circuit 22, the operating frequency band of the rf signal of thesecond antenna structure 52 is adjusted by thecontrol circuit 22, and the second grounding point 522 is connected to theoverall ground 60.
Taking a manufacturing process of theantenna structure 50 as an example, after forming thefirst groove 31 on theouter surface 301 of the first sealingmember 30 or forming thesecond groove 41 on theouter surface 401 of the second sealingmember 40 by etching, stamping, cutting, etc., the liquidconductive material 70 is injected into thefirst groove 31 or thesecond groove 41, and a part of theconductive material 70 flows into through holes respectively disposed on thefirst groove 31 or thesecond groove 41, so that the liquidconductive material 70 is changed into a solid conductive material by sintering, etc., and finally theantenna structure 50 is formed.
Set upantenna structure 50 at the surface of sealing member, thisantenna structure 50 can be coupled withcontrol circuit 22,antenna structure 50 is outside not sheltered from, under the unchangeable circumstances of electronic equipment shell structure, compare the antenna structure who sets up at the frame internal surface of center structure, the headroom region ofantenna structure 50 of this application is equivalent to the accommodating space who has increasedglass housing 10, make the space grow that holds functional unit, this application is under the unchangeable circumstances of electronic equipment size promptly, can increase the headroom region, and the antenna structure who is located the sealing member surface is not sheltered from by other subassemblies, the intensity of promotion antenna structure radiation signal that can be better, reduce the influence that other devices caused to antenna structure.
In some embodiments, referring to fig. 4-6, theantenna structures 50 may be disposed inside the sealing member, respectively. Theantenna structure 50 includes afirst antenna structure 51 and asecond antenna structure 52, thefirst antenna structure 51 being formed inside the first sealingmember 30, and thesecond antenna structure 52 being formed inside the second sealingmember 40.
Thefirst cavity 32 is disposed inside thefirst sealing element 30, thefirst cavity 32 is disposed with afirst opening 321 and asecond opening 322, the openings of thefirst opening 321 and thesecond opening 322 face theinner surface 302 of thefirst sealing element 30, thefirst cavity 32, thefirst opening 321, and thesecond opening 322 are filled with theconductive material 70 to form thefirst antenna structure 51, and a portion of the conductive material filled in thefirst opening 321 and thesecond opening 322 forms thefirst feeding point 511 and thefirst grounding point 512. For example, thefirst feeding point 511 is electrically connected to thecontrol circuit 22, thecontrol circuit 22 adjusts the operating frequency band of the rf signal of thefirst antenna structure 51, and thefirst grounding point 512 is connected to theoverall ground 60.
Thesecond cavity 42 is disposed inside the second sealingmember 40, thesecond cavity 42 is disposed with athird opening 421 and afourth opening 422, the openings of thethird opening 421 and thefourth opening 422 face theinner surface 402 of the second sealingmember 40, thesecond cavity 42, thethird opening 421 and thefourth opening 422 are filled with theconductive material 70 to form thesecond antenna structure 52, and a portion of the conductive material filled in thethird opening 421 and thefourth opening 422 forms thesecond feeding point 521 and the second grounding point 522. For example, thesecond feeding point 521 is electrically connected to thecontrol circuit 22, the operating frequency band of the rf signal of thesecond antenna structure 52 is adjusted by thecontrol circuit 22, and the second grounding point 522 is connected to theoverall ground 60.
Taking the manufacturing process of theantenna structure 50 as an example, after forming thefirst cavity 32 inside thefirst sealing element 30 or forming thesecond cavity 42 inside thesecond sealing element 40 by etching, stamping, mold forming, etc., and opening thefirst cavity 32 and thesecond cavity 42 respectively, for example, opening afirst opening 321 and asecond opening 322 on thefirst cavity 32, opening athird opening 421 and afourth opening 422 on thesecond cavity 42, the openings facing the inner surface of the corresponding sealing element, i.e., the openings facing the receivingspace 12, then injecting the liquidconductive material 70 into thefirst cavity 32 from thefirst opening 321 and thesecond opening 322, and injecting the liquidconductive material 70 into thesecond cavity 42 from thethird opening 421 and thefourth opening 422 until theconductive material 70 overflows the openings, making the liquidconductive material 70 become a solid conductive material by sintering, etc., excessconductive material 70 that overflows the openings is then cut away to form theantenna structure 50.
With theantenna structure 50 disposed inside the sealing member, theantenna structure 50 can be coupled to thecontrol circuit 22, and under the condition that the housing structure of the electronic device is not changed, compared with the antenna structure disposed on the inner surface of the frame of the middle frame structure, the clearance area of theantenna structure 50 of the present application is equivalent to increase the accommodating space of theglass housing 10, so that the space for accommodating the functional components becomes larger, that is, under the condition that the size of the electronic device is not changed, the clearance area can be increased. And the antenna structure positioned in the sealing element is not easy to deform when being rubbed, dropped or collided, and the waterproof effect of the antenna structure is better. In addition, because the sealing member is made of non-metallic materials such as glass, the intensity of the radiation signal of the antenna structure cannot be influenced even if the sealing member is arranged inside the sealing member.
As shown in fig. 4 or fig. 5, thefunctional component 20 has adisplay module 21, and afirst surface 101 of theglass housing 10 corresponding to thedisplay module 21 is a display surface of theelectronic device 100.
As shown in fig. 6, thedisplay module 21 includes afirst display module 211 and asecond display module 212, wherein thecontrol circuit 22 is located between thefirst display module 211 and thesecond display module 212, thefirst surface 101 corresponding to thefirst display module 211 is a first display surface of theelectronic device 100, and thefirst surface 102 corresponding to thesecond display module 212 is a second display surface of theelectronic device 100, so as to implement a double-sided screen display of theelectronic device 100.
In some embodiments, theconductive material 70 is a transparent conductive material to form the transparentfirst antenna structure 51 and thesecond antenna structure 52. For example, theconductive material 70 may be a transparent conductive material, and other non-transparent conductive materials may be used. For example, theconductive material 70 may be a conductive silver paste or a nano silver paste.
In some embodiments, a conductive polymer with an electrochromic function may be doped into theconductive material 70, so that theantenna structure 50 formed on the sealing member has an electrochromic function at the same time, and when the antenna structure is powered on to start receiving and transmitting the radio frequency signal, theantenna structure 50 may show different colors according to different voltage values output to theantenna structure 50 by thecontrol circuit 22, so that theelectronic device 100 is more interesting. And an abnormal situation can be known from a color change of theantenna structure 50 when theantenna structure 50 is damaged or abnormal. For example, the conductive polymer material may include polythiophene (polythiophene), polyaniline (polyaniline), polypyrrole (polypyrrole), polycarbazole (polycarbazole), polyfuran (polyfuran), polybenzazole (polyindole), and derivatives thereof.
In some embodiments, an earphone hole, a charging interface, a card slot, or the like may be provided at thefirst opening 11 or thesecond opening 13.
In some embodiments, theelectronic device 100 may be an electronic device having functions of wireless earphone, wireless charging, and the like, and there is no need to provide any through hole on an external surface of theelectronic device 100, so that the entire housing of theelectronic device 100 is a fully sealed device, for example, a card slot may be provided in thefunctional component 20, thefirst opening 11 of theglass housing 10 is sealed by a sealing member, the sealing performance of the electronic device is improved, and the waterproof effect is better.
In some embodiments, a functional coating, such as an ink or a color paint, may be sprayed on the inner wall of the accommodating space of theglass housing 10 according to the product requirements of theelectronic device 100.
In some embodiments, as shown in fig. 7, theside walls 15 of the two opposite sides of theaccommodating space 12 are formed withslide rails 16, and thefunctional component 20 can slide into theglass housing 10 from thefirst opening 11 or thesecond opening 13 along the slide rails 16, or thefunctional component 20 can slide out of theglass housing 10 along the slide rails 16.
In some embodiments, the width of theslide rail 16 may be slightly larger than the width of the side edge of thefunctional module 20, and both sides of thefunctional module 20 respectively overlap into theslide rail 16. When installed, thefunctional assembly 20 can slide into theglass housing 10 along theslide rail 16 from thefirst opening 11 or thesecond opening 13. When disassembled, thefunctional assembly 20 can slide out of theglass housing 10 along the slide rails 16.
In some embodiments, mating elements for mating with theslide rail 16 are respectively disposed on both sides of thefunctional assembly 20, and the mating elements on both sides of thefunctional assembly 20 are overlapped into the slide rail. When being installed, thefunctional component 20 can slide into theglass housing 10 from thefirst opening 11 or thesecond opening 13 along theslide rail 16. When disassembled, thefunctional assembly 20 can slide out of theglass housing 10 along the slide rails 16.
In some embodiments, as shown in fig. 7, either of the first andsecond seals 30, 40 is provided integrally with thefunctional assembly 20. For example, thefirst seal 30 may be provided integrally with thefunctional assembly 20. Thefirst sealing member 30 is integrally designed with thefunctional assembly 20 to facilitate the mounting or dismounting of theelectronic device 100. For example, during installation, the integrated first sealingelement 30 is slid into the glass housing together with thefunctional assembly 20, which simplifies the installation process. When thefirst sealing element 30 is detached, thefirst sealing element 30 and thefunctional assembly 20 can be detached simultaneously by dragging thefirst sealing element 30, and the detaching process is simplified.
Through set upfirst opening 11 andsecond opening 13 inglass housing 10 relative both sides, can make functional unit push inglass housing 10'saccommodating space 12 from arbitrary opening in, convenient assembling, and easy maintenance, in case one of them opening damages, then can directly change the corresponding sealing member can, adopt the sealing member fixed seal after changing to the opening that has damaged, then realize normal installation or dismantlement through another opening that does not damage, avoided having had single open-ended electronic equipment to lead to the condition that whole glass housing is useless because of the opening damages.
Theelectronic device 100 provided by the embodiment of the application includes aglass housing 10, afunctional component 20, asecond sealing member 40 and anantenna structure 50, where theglass housing 10 has afirst opening 11 and asecond opening 13 that are oppositely disposed, and anaccommodating space 12 that extends from thefirst opening 11 to thesecond opening 13, thefunctional component 20 is accommodated in theaccommodating space 12, thefunctional component 20 at least includes adisplay module 21 and acontrol circuit 22 connected to thedisplay module 21, the first sealingmember 30 and the second sealingmember 40 are respectively disposed at thefirst opening 11 and thesecond opening 13 to seal thefunctional component 20 in theglass housing 10, and theantenna structure 50 is disposed on the first sealingmember 30 and the second sealingmember 40, where theantenna structure 50 is provided with a feeding point and a grounding point, the feeding point is electrically connected to thecontrol circuit 22, and the grounding point is connected to awhole machine ground 60. Theantenna structures 50 are arranged on thefirst sealing element 30 and thesecond sealing element 40 at the openings at the two sides of theglass shell 10, the clearance area can be increased under the condition that the size of theelectronic device 100 is not changed, and when theantenna structures 50 on any sealing element are damaged, only the corresponding sealing element needs to be replaced, so that the whole glass shell is prevented from being replaced, and the equipment maintenance cost is reduced. And thefunctional component 20 is sent into theaccommodating space 12 of theglass shell 10 through any opening, and then the corresponding opening is sealed by using a sealing member, so that the waterproof performance of theelectronic device 100 can be effectively improved, the full-screen effect can be realized, and the screen occupation ratio can be improved.
Referring to fig. 8 to 11, fig. 8 to 11 are schematic structural diagrams of an antenna element according to an embodiment of the present application. The present embodiment provides afurther antenna assembly 200, wherein theantenna assembly 200 includes aglass housing 10, a first sealingmember 30, asecond sealing member 40, and anantenna structure 50.
Theglass housing 10 includes afirst opening 11 and asecond opening 13 disposed opposite to each other, and a receivingspace 12 extending from thefirst opening 11 to thesecond opening 13.
The first andsecond seals 30 and 40 are disposed at the first andsecond openings 11 and 13, respectively.
In some embodiments, both thefirst seal 40 and thesecond seal 40 may be made of a glass material.
In some embodiments, thefirst seal 40 and/or thesecond seal 40 may be made of a transparent material, which may include plastic, glass, plexiglass, composite materials, and the like.
In some embodiments, as shown in fig. 8 or 10, a seal may be disposed over the corresponding opening, e.g., a first seal may be disposed over thefirst opening 11 and a second seal may be disposed over thesecond opening 13.
In some embodiments, as shown in fig. 9 or 11, the seals may be received in corresponding openings, such as thefirst seal 30 received in thefirst opening 11 and thesecond seal 40 received in thesecond opening 13.
And anantenna structure 50 disposed on the first sealingmember 30 and the second sealingmember 40, wherein theantenna structure 50 is provided with a feeding point and a grounding point.
In some embodiments, theantenna structure 50 may have one, two, three, or more. Here, two antenna structures are taken as an example for explanation, and the number of theantenna structures 50 is not limited thereto.
As shown in fig. 8 or 9, theantenna structures 50 may be disposed on the outer surface of the seal, respectively. Theantenna structure 50 includes afirst antenna structure 51 and asecond antenna structure 52, wherein thefirst antenna structure 51 is formed on theouter surface 301 of the first sealingmember 30, and thesecond antenna structure 52 is formed on theouter surface 401 of the second sealingmember 40.
Theouter surface 301 of the first sealingmember 30 is provided with afirst groove 31, thefirst groove 31 is provided with a first throughhole 311 and a second throughhole 312, the first throughhole 311 and the second throughhole 312 penetrate from theouter surface 301 of the first sealingmember 30 to theinner surface 302 of the first sealingmember 30, thefirst groove 31, the first throughhole 311 and the second throughhole 312 are filled with aconductive material 70 to form afirst antenna structure 51, and a part of the conductive material filled in the first throughhole 311 and the second throughhole 312 forms afirst feeding point 511 and afirst grounding point 512.
Theouter surface 401 of the second sealingmember 40 is provided with asecond groove 41, thesecond groove 41 is provided with a third throughhole 411 and a fourth throughhole 412, the third throughhole 411 and the fourth throughhole 412 penetrate from theouter surface 401 of the second sealingmember 40 to theinner surface 402 of the second sealingmember 40, thesecond groove 41, the third throughhole 411 and the fourth throughhole 412 are filled with theconductive material 70 to form thesecond antenna structure 52, and the portions of the conductive material filled in the third throughhole 411 and the fourth throughhole 412 form asecond feeding point 521 and a second grounding point 522.
In some embodiments, as shown in fig. 10 or 11, theantenna structure 50 may be disposed inside the seal, respectively. Theantenna structure 50 includes afirst antenna structure 51 and asecond antenna structure 52, thefirst antenna structure 51 being formed inside the first sealingmember 30, and thesecond antenna structure 52 being formed inside the second sealingmember 40.
Thefirst cavity 32 is disposed inside thefirst sealing element 30, thefirst cavity 32 is disposed with afirst opening 321 and asecond opening 322, the openings of thefirst opening 321 and thesecond opening 322 face theinner surface 302 of thefirst sealing element 30, thefirst cavity 32, thefirst opening 321, and thesecond opening 322 are filled with theconductive material 70 to form thefirst antenna structure 51, and a portion of the conductive material filled in thefirst opening 321 and thesecond opening 322 forms thefirst feeding point 511 and thefirst grounding point 512.
Thesecond cavity 42 is disposed inside the second sealingmember 40, thesecond cavity 42 is disposed with athird opening 421 and afourth opening 422, the openings of thethird opening 421 and thefourth opening 422 face theinner surface 402 of the second sealingmember 40, thesecond cavity 42, thethird opening 421 and thefourth opening 422 are filled with theconductive material 70 to form thesecond antenna structure 52, and a portion of the conductive material filled in thethird opening 421 and thefourth opening 422 forms thesecond feeding point 521 and the second grounding point 522.
Theantenna assembly 200 provided by the embodiment of the application comprises aglass shell 10, a first sealingmember 30, asecond sealing member 40 and anantenna structure 50, wherein theglass shell 10 is provided with afirst opening 11 and asecond opening 13 which are oppositely arranged, and a containingspace 12 extending from thefirst opening 11 to thesecond opening 13, the first sealingmember 30 and the second sealingmember 40 are respectively arranged at thefirst opening 11 and thesecond opening 13, and a feeding point and a grounding point are arranged on theantenna structure 50. Theantenna structure 50 is arranged on thefirst sealing element 30 and thesecond sealing element 40 which are used for sealing openings at two sides of theglass shell 10, the clearance area can be increased under the condition that the size of the electronic equipment is not changed, and when a certain sealing element provided with the antenna structure is damaged, only the corresponding sealing element needs to be replaced, so that the equipment maintenance cost can be reduced.
Referring to fig. 12 to 15, fig. 12 to 15 are schematic structural views of the housing assembly according to the embodiment of the present disclosure. The embodiment of the present application provides ahousing assembly 300, wherein thehousing assembly 300 includes aglass housing 10, a first sealingmember 30, asecond sealing member 40, and anantenna structure 50.
Theglass housing 10 includes afirst opening 11 and asecond opening 13 disposed opposite to each other, and a receivingspace 12 extending from thefirst opening 11 to thesecond opening 13.
The first andsecond seals 30 and 40 are disposed at the first andsecond openings 11 and 13, respectively.
In some embodiments, both thefirst seal 40 and thesecond seal 40 may be made of a glass material.
In some embodiments, thefirst seal 40 and/or thesecond seal 40 may be made of a transparent material, which may include plastic, glass, plexiglass, composite materials, and the like.
In some embodiments, as shown in fig. 12 or 14, a seal may be disposed over the corresponding opening, e.g., a first seal may be disposed over thefirst opening 11 and a second seal may be disposed over thesecond opening 13.
In some embodiments, as shown in fig. 13 or 15, the seals may be received in corresponding openings, such as thefirst seal 30 received in thefirst opening 11 and thesecond seal 40 received in thesecond opening 13.
And anantenna structure 50 disposed on the first sealingmember 30 and the second sealingmember 40, wherein theantenna structure 50 is provided with a feeding point and a grounding point.
In some embodiments, theantenna structure 50 may have one, two, three, or more. Here, two antenna structures are taken as an example for explanation, and the number of theantenna structures 50 is not limited thereto.
As shown in fig. 12 or 13, theantenna structures 50 may be disposed on the outer surface of the sealing member, respectively. Theantenna structure 50 includes afirst antenna structure 51 and asecond antenna structure 52, wherein thefirst antenna structure 51 is formed on theouter surface 301 of the first sealingmember 30, and thesecond antenna structure 52 is formed on theouter surface 401 of the second sealingmember 40.
Theouter surface 301 of the first sealingmember 30 is provided with afirst groove 31, thefirst groove 31 is provided with a first throughhole 311 and a second throughhole 312, the first throughhole 311 and the second throughhole 312 penetrate from theouter surface 301 of the first sealingmember 30 to theinner surface 302 of the first sealingmember 30, thefirst groove 31, the first throughhole 311 and the second throughhole 312 are filled with aconductive material 70 to form afirst antenna structure 51, and a part of the conductive material filled in the first throughhole 311 and the second throughhole 312 forms afirst feeding point 511 and afirst grounding point 512.
Theouter surface 401 of the second sealingmember 40 is provided with asecond groove 41, thesecond groove 41 is provided with a third throughhole 411 and a fourth throughhole 412, the third throughhole 411 and the fourth throughhole 412 penetrate from theouter surface 401 of the second sealingmember 40 to theinner surface 402 of the second sealingmember 40, thesecond groove 41, the third throughhole 411 and the fourth throughhole 412 are filled with theconductive material 70 to form thesecond antenna structure 52, and the portions of the conductive material filled in the third throughhole 411 and the fourth throughhole 412 form asecond feeding point 521 and a second grounding point 522.
In some embodiments, as shown in fig. 14 or 15, theantenna structure 50 may be disposed inside the seal, respectively. Theantenna structure 50 includes afirst antenna structure 51 and asecond antenna structure 52, thefirst antenna structure 51 being formed inside the first sealingmember 30, and thesecond antenna structure 52 being formed inside the second sealingmember 40.
Thefirst cavity 32 is disposed inside thefirst sealing element 30, thefirst cavity 32 is disposed with afirst opening 321 and asecond opening 322, the openings of thefirst opening 321 and thesecond opening 322 face theinner surface 302 of thefirst sealing element 30, thefirst cavity 32, thefirst opening 321, and thesecond opening 322 are filled with theconductive material 70 to form thefirst antenna structure 51, and a portion of the conductive material filled in thefirst opening 321 and thesecond opening 322 forms thefirst feeding point 511 and thefirst grounding point 512.
Thesecond cavity 42 is disposed inside the second sealingmember 40, thesecond cavity 42 is disposed with athird opening 421 and afourth opening 422, the openings of thethird opening 421 and thefourth opening 422 face theinner surface 402 of the second sealingmember 40, thesecond cavity 42, thethird opening 421 and thefourth opening 422 are filled with theconductive material 70 to form thesecond antenna structure 52, and a portion of the conductive material filled in thethird opening 421 and thefourth opening 422 forms thesecond feeding point 521 and the second grounding point 522.
Thehousing assembly 300 provided by the embodiment of the present application includes aglass housing 10, a first sealingmember 30, asecond sealing member 40, and anantenna structure 50, where theglass housing 10 has afirst opening 11 and asecond opening 13 disposed opposite to each other, and anaccommodating space 12 extending from thefirst opening 11 to thesecond opening 13, the first sealingmember 30 and the second sealingmember 40 are disposed at thefirst opening 11 and thesecond opening 13, respectively, and a feeding point and a grounding point are disposed on theantenna structure 50. Theantenna structure 50 is arranged on thefirst sealing element 30 and thesecond sealing element 40 which are used for sealing openings at two sides of theglass shell 10, the clearance area can be increased under the condition that the size of the electronic equipment is not changed, and when a certain sealing element provided with the antenna structure is damaged, only the corresponding sealing element needs to be replaced, so that the equipment maintenance cost can be reduced.
Referring to fig. 16, fig. 16 is a block diagram of an electronic device according to an embodiment of the present disclosure. Thecontrol circuitry 22 of theelectronic device 100 may include storage andprocessing circuitry 221. The storage andprocessing circuit 221 may include a memory, such as a hard disk drive memory, a non-volatile memory (e.g., a flash memory or other electronically programmable read-only memory used to form a solid state drive, etc.), a volatile memory (e.g., a static or dynamic random access memory, etc.), and so on, and embodiments of the present application are not limited thereto. Processing circuitry in the storage andprocessing circuitry 221 may be used to control the operation of theelectronic device 100. The processing circuitry may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.
The storage andprocessing circuit 221 may be used to run software in theelectronic device 100, such as an Internet browsing application, a Voice Over Internet Protocol (VOIP) telephone call application, an email application, a media playing application, operating system functions, and so forth. Such software may be used to perform control operations such as, for example, camera-based image capture, ambient light measurement based on an ambient light sensor, proximity sensor measurement based on a proximity sensor, information display functionality based on status indicators such as status indicator lights of light emitting diodes, touch event detection based on a touch sensor, functionality associated with displaying information on multiple (e.g., layered) displays, operations associated with performing wireless communication functions, operations associated with collecting and generating audio signals, control operations associated with collecting and processing button press event data, and other functions in theelectronic device 100, and the like, without limitation of embodiments of the present application.
Theelectronic device 100 may also include input-output circuitry 222. The input-output circuitry 222 may be used to enable theelectronic device 100 to enable input and output of data, i.e., to allow theelectronic device 100 to receive data from external devices and also to allow theelectronic device 100 to output data from theelectronic device 100 to external devices. The input-output circuit 222 may further include asensor 2221. Thesensors 2221 may include ambient light sensors, proximity sensors based on light and capacitance, touch sensors (e.g., based on optical touch sensors and/or capacitive touch sensors, where the touch sensors may be part of a touch display screen or used independently as a touch sensor structure), acceleration sensors, and other sensors, among others.
The input-output circuit 222 may further include one or more displays, such as thedisplay 2222, and thedisplay 2222 may refer to thedisplay module 21 above.Display 2222 may include one or a combination of liquid crystal displays, organic light emitting diode displays, electronic ink displays, plasma displays, displays using other display technologies.Display 2222 may include an array of touch sensors (i.e.,display 2222 may be a touch display screen). The touch sensor may be a capacitive touch sensor formed by a transparent touch sensor electrode (e.g., an Indium Tin Oxide (ITO) electrode) array, or may be a touch sensor formed using other touch technologies, such as acoustic wave touch, pressure sensitive touch, resistive touch, optical touch, and the like, and the embodiments of the present application are not limited thereto.
Theelectronic device 100 may also include anaudio component 2223. Theaudio component 2223 may be used to provide audio input and output functionality for theelectronic device 100. Theaudio components 2223 in theelectronic device 100 may include a speaker, a microphone, a buzzer, a tone generator, and other components for generating and detecting sound.
Theelectronic device 100 may also includecommunications circuitry 2224. Thecommunications circuit 2224 may be used to provide theelectronic device 100 with the ability to communicate with external devices. Thecommunications circuitry 2224 may include analog and digital input-output interface circuitry, as well as wireless communications circuitry based on radio frequency signals and/or optical signals. The wireless communications circuitry incommunications circuitry 2224 may include radio-frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, andantenna structures 50. For example, the wireless Communication circuitry incommunications circuitry 2224 may include circuitry to support Near Field Communication (NFC) by transmitting and receiving Near Field coupled electromagnetic signals. For example, the communication circuit 124 may include a near field communication antenna and a near field communication transceiver. Thecommunications circuitry 2224 can also include cellular telephone transceiver circuitry, wireless local area network transceiver circuitry, and the like.
Theelectronic device 100 may further include a power management circuit and other input-output units 2225. The input-output unit 2225 may include buttons, a joystick, a click wheel, a scroll wheel, a touch pad, a keypad, a keyboard, a camera, light emitting diodes and other status indicators, etc.
A user may enter commands through input-output circuitry 222 to control operation ofelectronic device 100, and may use output data of input-output circuitry 222 to enable receipt of status information and other outputs fromelectronic device 100.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The antenna assembly, the housing assembly and the electronic device provided in the embodiments of the present application are described in detail above, and specific examples are applied in the description to explain the principles and embodiments of the present application, and the description of the embodiments above is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.