Printed circuit board and preparation method thereofTechnical field
The present invention relates to art of printed circuit boards more particularly to a kind of flexible printed circuit board production methods.
Background technology
Flexible printed circuit board (Flexible Printed Circuit, FPC), also known as flexible circuit board, soft circuitPlate, flex circuit application, soft board are a kind of special printed circuit boards, have that light-weight, thickness is thin, the spies such as soft, flexiblePoint.It is widely used in the electronic products such as mobile phone, laptop, PDA, digital camera, liquid crystal display.
With the development of hyundai electronics science and technology, electronic product plays the part of more importantly role, people in people's livesThe demand of electronic product is also continuously increased, each electronic product, is required to printed circuit board and realizes various electronic componentsLayout and logical connection.
The making processing technology of flexible printed circuit board in the prior art, the mode of generally use equipment through-hole conducting, andThe two-sided conductive layer of printed circuit board is made in conductive layer is arranged in the through-hole in insulating substrate setting through-hole using bore processIt realizes and is electrically connected.
However, there are the following problems for the prior art：
First, existing flexible printed circuit board production technology needs to give birth to by kinds of processes such as drilling, plating, etchingsFlexible printed circuit board described in output, production efficiency are low；
Secondly, flexible printed circuit board is susceptible to deformation in prior art technology process, so as to cause wiring boardIt is susceptible to harmomegathus when continuous production, the product rejection rate of production is made to increase；
Therefore, it is necessary to provide a kind of flexible printed circuit board production method to solve the above problems.
Invention content
What the present invention needed to solve is that lowly and in production process product is susceptible to harmomegathus to prior art production efficiencyProblem.The present invention provides that a kind of production efficiency is high, solves the problems, such as the printed circuit board for occurring harmomegathus in production process.
The present invention also provides a kind of production methods of above-mentioned printed circuit board simultaneously.
A kind of printed circuit board, including the first conductive layer, the first pad, insulating layer, the second conductive layer, the second pad and welderingTin, first conductive layer are set to one side surface of the insulating layer, and the multiple first pad is set to the first conductive layer tableFace, second conductive layer are set to another side surface of the insulating layer, scolding tin between first pad and second pad.
Above-mentioned printed circuit board as the present invention is further improved, and first conductive layer edge is recessed in described theTwo conductive layer edges are arranged at random to form step.
As being further improved for above-mentioned printed circuit board of the invention, first conductive layer and second conductive layerIt is adhered to two surface of the insulating layer by organic polymer.
Above-mentioned printed circuit board as the present invention is further improved, the insulating layer be set to first conductive layer withBetween second conductive layer.
As being further improved for above-mentioned printed circuit board of the invention, the first conductive layer surface setting is the multipleFirst pad, the multiple first pad array setting.
As being further improved for above-mentioned printed circuit board of the invention, the second conductive layer surface setting is the multipleSecond pad, the multiple second pad array setting.
As being further improved for above-mentioned printed circuit board of the invention, first pad passes through with second padScolding tin realizes first conductive layer and second conductive layer electrical connection.
Above-mentioned printed circuit board as the present invention is further improved, and first conductive layer is copper foil layer, and described theTwo conductive layers are copper foil layers.
A kind of production method of printed circuit board, includes the following steps：There is provided the first conductive layer, the first pad, insulating layer,Second conductive layer and the second pad, first conductive layer are set to the insulating layer side, are set in first conductive layer surfaceThe multiple first pad is set, second conductive layer is set to the insulating layer other side, is removed using laser processing technologyThe part insulating layer keeps second Conductive layer portions exposed, and multiple arrays are arranged in second Conductive layer portions exposed sectionSecond pad realizes that first conductive layer is conductive with described second in first pad and the second pad scolding tinLayer electrical connection.
Production method as the above-mentioned printed circuit board of the present invention is further improved, and the laser processing technology includes twoCarbon oxide laser technology, YAG laser technologies and ultraviolet laser processing technology.
Production method as the above-mentioned printed circuit board of the present invention is further improved, the partial insulative layer packet of the removingInclude insulating substrate.
Compared with prior art, printed circuit board provided by the invention and preparation method thereof is that insulating layer is bonded bilayerConductive layer is processed, and is increased printed circuit board and is processed thickness, the ability of anti-deformation of printed circuit board is improved, in Continuous maching mistakeCheng Zhong, external force are small to the influence of crust deformation of printed circuit board, overcome the problems, such as that Continuous maching is susceptible to harmomegathus, can be to printed circuit boardContinuous maching improves production efficiency.
Meanwhile printed circuit board provided by the invention is burnt to carve using laser technology and substitutes punching and chemical etching step, is exempted fromDischarging of waste liquid is removed, it is environmentally friendly, it can automatically be processed by equipment, simplify making step, reduce human cost.
Description of the drawings
To become apparent from the technical solution illustrated in the embodiment of the present invention, embodiment will be described below required attachedFigure, which is done, simply to be introduced, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this fieldFor those of ordinary skill, under the premise of without involving an inventive effort, it is attached can also to obtain other according to these following attached drawingsFigure, wherein：
Fig. 1 is the side sectional view of printed circuit board of the present invention；And
Fig. 2 is the floor map of printed circuit board of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and detailed complete description is carried out to this case, it should be apparent that, underIt is only the section Example of the invention described in face, instead of all the embodiments.Based on the embodiment in invention, this field is generalThe every other embodiment that logical technical staff is obtained without making creative work, belongs to protection of the present inventionRange.
Fig. 1 is please referred to, the printed circuit board 10 includes the first conductive layer 11, first the 111, second conduction of padThe 13, second pad 131 of layer, insulating layer 15 and scolding tin 17.
First conductive layer 11 by the adherency setting of organic polymer (not shown) in 15 side of the insulating layer, it is describedSecond conductive layer 13 is arranged by the adherency of organic polymer (not shown) in 15 other side of the insulating layer, while first welderingThe setting of disk 111 is arranged in 11 surface of the first conductive layer, second pad 131 in 13 surface of the second conductive layer, instituteIt states and the scolding tin 17 is set between the first pad 111 and second pad 131.
Referring to Fig. 1, first conductive layer 11 and second conductive layer 13 are arranged in the insulating layer 15, it is describedSecond conductive layer 13 is aligned setting with the insulating layer 15, and 11 edge of the first conductive layer is shunk in second conductive layer 13It is arranged at random to form step.Hollow out, which is arranged, in the insulating layer 15 at the step keeps 13 part of the second conductive layer nakedDew, society's second pad at 13 partial denudation of the second conductive layer；The first pad setting is led described first11 surface of electric layer is arranged described 17 between first pad 111 and second pad 131, realize first conductive layerIt is electrically connected between 11 and second conductive layer 13.
Again referring to Fig. 2, the hollow out on 15 surface of the insulating layer is arranged, make 13 partial denudation of the second conductive layer,Surface is arranged at 13 partial denudation of the second conductive layer in second pad, and the scolding tin 17 passes through the insulating layer 15 realIt is existing to be electrically connected between first conductive layer 11 and the second conductive layer 13.
The multiple first pad, 111 spaced array setting is in 11 surface of the first conductive layer, the multiple second weldering131 spaced array of disk is arranged at 13 step of the second conductive layer, and first pad 111 and second pad 131 are rightIt should be arranged.
In a kind of most preferred embodiment of the present invention, first conductive layer 11 is copper foil layer, and second conductive layer 13 isCopper foil layer.
When being processed to the printed circuit board 10, include the following steps：
Step S1：The insulating layer 15, first conductive layer 11 and second conductive layer 13 are provided；
Step S2：First conductive layer 11 and second conductive layer 13 are arranged by organic polymer adherency describedInsulating layer 15 is with respect to two surfaces；
Step S3：Second conductive layer 13 is aligned setting, 11 side of the first conductive layer with 15 edge of the insulating layerEdge is recessed in 13 edge of the second conductive layer and is arranged at random to form step structure；
Step S4：The part insulating layer 15 removed at the step using carbon dioxide laser technology, is etchedHollow out makes 13 partial denudation of the second conductive layer；
Step S5：The first pad 111 is set on 11 surface of the first conductive layer, described in 15 hollow part of the insulating layerSecond pad 131 is arranged in second conductive layer surface, and first pad 111 is correspondingly arranged with second pad 131.
Step S6：The scolding tin 17 is set between first pad 111 and second pad 131, makes described firstConductive layer 11 is electrically connected with second conductive layer 13 realization.
Compared to the prior art, in printed circuit board 10 provided by the invention, using carbon dioxide laser technology burn offThe insulating layer 15, and first pad 111 and 13 table of the second conductive layer are set on 11 surface of the first conductive layerFace is arranged second pad 131, the scolding tin 17 connects first pad 111 and second pad 131 realize it is describedIt is electrically connected between first conductive layer 11 and second conductive layer 13, substitutes and insulating layer and the first conductive layer are bored in the prior artThe step of hole, simplifies technique, cost-effective, while also improving production reliability, reduces difficulty of processing.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hairEquivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skillsArt field, is included within the scope of the present invention.