Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a moving coil, a manufacturing method thereof and a loudspeaker, which simplify the process and improve the reliability of the product.
The aim of the invention is achieved by the following technical measures:
the moving coil comprises an FPC (flexible printed circuit), wherein the FPC comprises an FPC substrate and conductors, the FPC comprises a main body part and a plurality of bending parts, the bending parts bend towards one side of the main body part, the conductors are arranged on the bending parts, the conductors on two adjacent bending parts are mutually communicated, the communicated conductors form a coil, one end of the coil is communicated with a second bonding pad, and the other end of the coil is communicated with a first bonding pad.
As an improvement: the FPC substrate further comprises a plurality of connecting portions, the second bonding pads are arranged on the connecting portions, and the first metalized holes and the first bonding pads are arranged on the connecting portions.
As an improvement: the connecting part is arranged between two adjacent bending parts.
As an improvement: the connecting portion comprises a buffer section, and the section of the buffer section is in a sawtooth shape or a wave shape or an arc shape.
As an improvement: the shape of the main body part is polygonal, and the edges of the main body part are arranged in one-to-one correspondence with the bending parts.
As an improvement: the conductor end portion extends to a side close to the main body portion, and a portion of the conductor extending to the side close to the main body portion is used for communicating with a conductor or a second bonding pad or a first bonding pad on an adjacent bending portion.
As an improvement: the conductor is a metal foil.
As an improvement: the first welding pad is communicated with a first metallization hole, the first metallization hole is communicated with a second metallization hole, and the other end of the coil is connected with the second metallization hole.
As an improvement: the number of layers of conductors on each bending part is at least two, and the FPC substrate is positioned between two adjacent layers of conductors.
The manufacturing method of the moving coil comprises the following steps:
s1, manufacturing a flexible circuit board with the main body part, the bending part, the conductor, the first metalized hole and the second metalized hole;
s2, bending the bending part towards one side of the main body part.
The loudspeaker comprises a basin frame and a magnetic circuit system, wherein the magnetic circuit system comprises a magnetic gap and further comprises the moving coil, and the bending part is positioned in the magnetic gap.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the advantages that: the FPC is used for replacing the voice coil and the dome, the manufacturing process is simpler, the production efficiency is high, and the condition of broken voice coil connection wire can not occur under high power.
The invention is further described below with reference to the drawings and the detailed description.
Detailed Description
A loudspeaker in the background art, as shown in figure 9, comprises a basin frame 11 and a magnetic circuit system, wherein the magnetic circuit system comprises a magnetic gap 13, a voice coil 15 is arranged in the magnetic gap 13, a diaphragm 12 is bonded on the voice coil 15, the other end of the diaphragm 12 is bonded on the basin frame 11, and a rigid dome 14 is bonded on the voice coil 15.
Example 1: as shown in fig. 1 and 2, the moving coil comprises an FPC, wherein the FPC comprises three layers of FPC substrates 9 and two layers of conductors 8, and the FPC substrates 9 are made of polyimide or polyester films.
The FPC includes a main body portion 1, four bent portions 3 and four connection portions 2,
specifically, the main body 1 is rectangular in shape, and the main body 1 is provided with a second metalized hole 7. The bending part 3 is arranged at the edge of the main body part 1, the shape of the bending part 3 is rectangular, and four bending parts 3 are arranged in one-to-one correspondence with four sides of the main body part 1. The bending part 3 is bent to one side of the main body part 1, and the bending part 3 is arranged perpendicular to the main body part 1.
As shown in fig. 3, the connecting portion 2 is in a strip shape, and the connecting portion 2 is disposed between two adjacent bending portions 3. The connecting portions 2 are alternately arranged with the bending portions 3. The connecting part 2 comprises a buffer section 10, and the section shape of the buffer section 10 is saw-tooth. The connecting portion 2 supports the main body portion 1 and the bent portion 3.
The end part of one connecting part 2 is provided with a second bonding pad 6, the end part of the other connecting part 2 is provided with a first bonding pad 4, the first bonding pad 4 is provided with a first metallization hole 5, and the first metallization hole 5 is communicated with a second metallization hole 7.
As shown in fig. 4, the conductor 8 is disposed on the bending portion 3, the conductor 8 is disposed parallel to the edge of the main body portion 1, the conductor 8 is copper foil, and the conductor 8 is located between two adjacent FPC substrates 9. The conductors 8 on the adjacent two bending parts 3 are mutually communicated, and the communicated conductors 8 form a coil.
Specifically, the end of the conductor 8 extends to the side close to the main body 1.
The portion of the conductor 8 constituting the coil middle section extending to the side close to the main body portion 1 is used for communicating with the conductor 8 on the adjacent bent portion 3; a conductor 8 constituting one end of the coil communicates with the second pad 6; the conductor 8 constituting the other end of the coil communicates with the second metallized hole 7.
Example 2: the moving coil comprises an FPC, wherein the FPC comprises a layer of FPC substrate 9 and two layers of conductors 8, and the FPC substrate 9 is made of polyimide or polyester film.
The FPC base material 9 includes a main body portion 1, three bending portions 3, and three connecting portions 2.
Specifically, the main body 1 is triangular, and the main body 1 is provided with a second metalized hole 7. The bending part 3 is arranged at the edge of the main body part 1, the shape of the bending part 3 is rectangular, and three bending parts 3 are arranged in one-to-one correspondence with three sides of the main body part 1. The bending part 3 is bent to one side of the main body part 1, and the bending part 3 is arranged perpendicular to the main body part 1.
As shown in fig. 5, the connecting portion 2 is in a strip shape, and the connecting portion 2 is disposed between two adjacent bending portions 3. The connecting portions 2 are alternately arranged with the bending portions 3. The connecting part 2 comprises a buffer section 10, and the section shape of the buffer section 10 is wavy.
The end part of one connecting part 2 is provided with a second bonding pad 6, the end part of the other connecting part 2 is provided with a first bonding pad 4, the first bonding pad 4 is provided with a first metallization hole 5, and the first metallization hole 5 is communicated with a second metallization hole 7.
The conductor 8 is disposed on the bending portion 3, the conductor 8 is disposed parallel to the edge of the main body portion 1, and the conductor 8 is copper foil. One layer of conductor 8 is positioned on the inner side of the FPC substrate 9, and the other layer of conductor 8 is positioned on the outer side of the FPC substrate 9. The conductors 8 on the adjacent two bending parts 3 are mutually communicated, and the communicated conductors 8 form a coil. One end of the coil is communicated with the second bonding pad 6; the other end of the coil communicates with a second metallized hole 7.
The remaining features of this embodiment are the same as those of embodiment 1.
Example 3: the moving coil comprises an FPC, wherein the FPC comprises four layers of FPC base materials 9 and three layers of conductors 8, and the FPC base materials 9 are made of polyimide or polyester films.
The FPC base material 9 includes a main body portion 1, five bending portions 3 and five connecting portions 2,
specifically, the main body 1 is pentagonal, and the main body 1 is provided with a second metalized hole 7. The bending part 3 is arranged at the edge of the main body part 1, the shape of the bending part 3 is rectangular, and five bending parts 3 are arranged in one-to-one correspondence with five sides of the main body part 1. The bending part 3 is bent to one side of the main body part 1, and the bending part 3 is arranged perpendicular to the main body part 1.
As shown in fig. 6, the connecting portion 2 is in a strip shape, and the connecting portion 2 is disposed between two adjacent bending portions 3. The connecting portions 2 are alternately arranged with the bending portions 3. The connecting part 2 comprises a buffer section 10, and the section shape of the buffer section 10 is arc-shaped.
The end part of one connecting part 2 is provided with a second bonding pad 6, the end part of the other connecting part 2 is provided with a first bonding pad 4, the first bonding pad 4 is provided with a first metallization hole 5, and the first metallization hole 5 is communicated with a second metallization hole 7.
The conductor 8 is disposed on the bending portion 3, the conductor 8 is disposed parallel to the edge of the main body portion 1, and the conductor 8 is copper foil. The conductors 8 are located between two adjacent pieces of FPC substrate 9. The conductors 8 on the adjacent two bending parts 3 are mutually communicated, and the communicated conductors 8 form a coil. One end of the coil is communicated with the second bonding pad 6; the other end of the coil communicates with a second metallized hole 7.
The remaining features of this embodiment are the same as those of embodiment 1.
Example 4: a loudspeaker comprising a moving coil as described in one of embodiments 1 to 3, which is described here by way of example as comprising a moving coil as described in embodiment 1.
As shown in fig. 7 and 8, the basin frame 11 and the magnetic circuit system are further included, the basin frame 11 is rectangular in shape, the magnetic circuit system includes a magnetic gap 13, the bending part 3 is located in the magnetic gap 13, and the four connecting parts 2 are respectively bonded with the basin frame 11. The first pad 4 and the second pad 6 are connected to a speaker control circuit. The body 1 is adhered with a membrane 12, and the other end of the membrane 12 is adhered to the basin frame 11.
The four connecting parts 2 are adhered to the basin frame 11, so that the structure is symmetrical, the support is strong, unbalanced vibration of the diaphragm 12 can not occur any more, and the performance and reliability allowance of the product are increased.
Example 5: the moving coil manufacturing method, taking the moving coil described in the embodiment 1 as an example, includes the following steps:
s1, manufacturing a flexible circuit board, wherein the flexible circuit board is provided with a main body part 1, a connecting part 2, a bending part 3, a conductor 8, a first metallization hole 5 and a second metallization hole 7, and when the flexible circuit board is manufactured, a first bonding pad 4 and a second bonding pad 6 are manufactured together;
s2, bending the bending part 3 towards one side of the main body part 1, so that the bending part 3 is perpendicular to the main body part 1;
s3, bending the connecting part 2, and manufacturing a zigzag buffer section 10 on the connecting part 2.
It should be noted that other materials, such as silver, gold, etc., may be used for the conductor 8. The shape of the main body 1 may be hexagonal or other polygonal. The number of the conductors 8 in the bending part 3 can be increased by three layers or four layers.
The foregoing describes several embodiments of the present invention in detail, but the description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.