A kind of chip temperature measuring equipmentTechnical field
The present invention relates to test correlative technology field more particularly to a kind of chip temperature measuring equipments.
Background technology
IC chip after a series of manufacturing process, is usually also needing to carry out a variety of tests, chip temperatureTest is one such.Existing chip temperature test device is usually to insert temperature measuring device from the instrument connection above deviceEnter and is contacted with the upper surface of chip, the temperature for the mainly chip upper surface that temperature measuring device is tested.On the one hand, due to chipPyrotoxin generally proximate to its lower surface, so there are larger mistakes for the chip temperature measured by existing chip temperature measuring equipmentDifference, measurement result are inaccurate；On the other hand, existing chip temperature measuring equipment is using plug-in type temperature measuring device, and when measurement graspsIt is inconvenient to make, and since to be easy to cause temperature measuring device different from the exposure level of chip upper surface for the difference of insertion depth, fromAnd the job stability of temperature measuring equipment and accuracy is caused to decline, temperature measuring device is easily damaged in swapping process in addition, is causedThe service life of chip temperature measuring equipment declines.
Invention content
Based on the above, the purpose of the present invention is to provide a kind of chip temperature measuring equipments, to solve existing chip thermometricAbove-mentioned technical problem existing for device.
In order to achieve the above object, the present invention uses following technical scheme：
A kind of chip temperature measuring equipment, including test bench and be installed in the test bench temperature measuring device, at least one theOne conduction element and at least one second conduction element, the temperature measuring device with the lower surface of chip to be measured for being in contact, and described theOne conduction element for the temperature measuring device to be conducted with external test circuitry, second conduction element be used for chip to be measured andExternal test circuitry is conducted.
Further, first conduction element and second conduction element are probe.
Further, further include fixed block, the fixed block is installed in the test bench, and is located at the temperature measuring deviceLower section, for fixing first conduction element.
Further, at least one first conduction element open-work is provided on the fixed block, first conduction element is wornIn in the first conduction element open-work, and one end of first conduction element is conducted with the temperature measuring device.
Further, at least one second conduction element open-work is provided on the test bench, second conduction element is wornIn in the second conduction element open-work, and one end of second conduction element is conducted with chip to be measured.
Further, it is provided with temperature measuring device mounting hole on the test bench, for installing the temperature measuring device.
Further, it is provided with guide groove on the test bench, guide plate, the guide plate are provided in the guide grooveFor being positioned to chip to be measured.
Further, chip hole is provided on the guide plate, the chip hole is for placing chip to be measured.
Further, further include bottom plate, the bottom plate is installed on the lower section of the test bench.
Further, it is provided with multiple via holes on the bottom plate, first conduction element and second conduction elementOne end is conducted across the via hole with external test circuitry.
Beneficial effects of the present invention are：
The present invention makes the lower surface of temperature measuring device and chip to be measured by being arranged temperature measuring device in the lower section of chip to be measuredBe in contact, it is ensured that temperature measuring device can be measured that the temperature close to chip lower surface pyrotoxin, to make measured temperature withThe actual temperature of chip is closer, reduces measurement error, improves the accuracy of measurement result.And by thermometric in the present inventionDevice is fixed in temperature measuring equipment, and temperature measuring device and the external circuit board are conducted by the first conduction element, make temperature measuring equipmentStructure is simpler, and operation is more convenient, without by temperature measuring device insertion apparatus, avoiding due to temperature measuring device when thermometricTemperature measuring device caused by the insertion depth difference situation different from chip exposure level, to improve the operation is stable of deviceProperty and accuracy, while avoiding in temperature measuring device swapping process to the damage caused by temperature measuring device, improve chip thermometricThe service life of device.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, institute in being described below to the embodiment of the present inventionAttached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present inventionExample without creative efforts, can also be implemented for those of ordinary skill in the art according to the present inventionThe content of example and these attached drawings obtain other attached drawings.
Fig. 1 is the structural schematic diagram of chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 2 is the explosive view of chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 3 is the partial sectional view of chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of test bench in chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the first conduction element in chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of fixed block in chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 7 is the structural schematic diagram of the second conduction element in chip temperature measuring equipment provided in an embodiment of the present invention；
Fig. 8 is the structural schematic diagram of chip temperature measuring equipment bottom plate provided in an embodiment of the present invention.
In figure：
100- chips to be measured；
1- test benches；11- the second conduction element open-works；12- temperature measuring device mounting holes；13- guide grooves；
2- temperature measuring devices；
The first conduction elements of 3-；First shaft shoulders of 31-；Second shaft shoulders of 32-；
The second conduction elements of 4-；The upper shaft shoulders of 41-；The shaft shoulder under 42-；
5- fixed blocks；51- the first conduction element open-works；
6- guide plates；61- chip holes；
7- bottom plates；71- via holes.
Specific implementation mode
For make present invention solves the technical problem that, the technical solution that uses and the technique effect that reaches it is clearer, belowThe technical solution of the embodiment of the present invention will be described in further detail in conjunction with attached drawing, it is clear that described embodiment is onlyIt is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art existThe every other embodiment obtained under the premise of creative work is not made, shall fall within the protection scope of the present invention.
As shown in Figure 1-Figure 3, the present embodiment provides a kind of chip temperature measuring equipment, including test bench 1 and it is installed on test bench 1In temperature measuring device 2, at least one first conduction element 3 and at least one second conduction element 4, temperature measuring device 2 be used for and core to be measuredThe lower surface of piece 100 is in contact, and the first conduction element 3 is for temperature measuring device 2 to be conducted with external test circuitry, the second conduction element4 for chip 100 to be measured to be conducted with external test circuitry.The preferred structure of first conduction element 3 and the second conduction element 4 is to visitNeedle.
When measuring chip temperature, chip 100 to be measured is put in device first, makes 100 and second conduction element 4 of chip to be measuredIt is in contact, and the lower surface of chip 100 to be measured is made to be in contact with temperature measuring device 2, chip 100 to be measured in this way will be led by secondParts 4 are connected with external test circuitry, so that chip 100 to be measured is maintained in normal operating circuit, while temperature measuring device 2 can be surveyedThe temperature of 100 lower surface of chip to be measured is measured, and the temperature data of measurement is fed back to and external testing electricity by the first conduction element 3In the temperature readout device of road connection, and then realize the test to 100 temperature of chip to be measured.
Temperature measuring device 2 is arranged in the lower section of chip 100 to be measured in the present embodiment, makes temperature measuring device 2 and chip 100 to be measuredLower surface be in contact, it is ensured that temperature measuring device 2 can be measured that the temperature of chip lower surface, to make measured temperature and coreThe actual temperature of piece is closer, reduces measurement error, improves the accuracy of measurement result.And by thermometric in the present embodimentDevice 2 is installed in test bench 1, and temperature measuring device 2 is conducted with external test circuitry by the first conduction element 3, thermometric is made to fillThe structure set is simpler, and operation is more convenient, without by 2 insertion apparatus of temperature measuring device, avoiding due to thermometric when testTemperature measuring device 2 caused by the insertion depth difference of device 2 situation different from chip exposure level, to improve deviceJob stability and accuracy, while avoiding in 2 swapping process of temperature measuring device to the damage caused by temperature measuring device 2, it is promotedThe service life of chip temperature measuring equipment.In addition, the quantity of the first conduction element 3 and the second conduction element 4 can root in the present embodimentIt is adjusted according to the demand of chip 100 to be measured.
Specifically, as shown in figure 4, in order to provide certain installation space to temperature measuring device 2, survey is provided on test bench 1Warm device mounting hole 12, for installing temperature measuring device 2.As shown in figure 5, being provided with first shaft shoulder 31 and on the first conduction element 3Two shaft shoulders 32.In order to which the first conduction element 3 is fixed, fixed block 5 is additionally provided in chip temperature measuring equipment, fixed block 5 is installedIn in test bench 1, and positioned at the lower section of temperature measuring device 2.As shown in fig. 6, being provided at least one first conduction element on fixed block 5Open-work 51, the first conduction element open-work 51 are the stepped hole that upper end diameter is less than lower end diameter, and the first conduction element 3 is arranged in first and leadsIn parts open-work 51, the upper end of the first conduction element 3 is pierced by the first conduction element open-work 51 and is conducted with temperature measuring device 2.Such as Fig. 7 institutesShow, the shaft shoulder 41 and the lower shaft shoulder 42 are provided on the second conduction element 4.In order to realize the fixation to the second conduction element 4, test bench 1On be additionally provided at least one second conduction element open-work 11, the second conduction element 4 is arranged in the second conduction element open-work 11, and secondThe upper end of conduction element 4 is conducted with chip 100 to be measured, and the second conduction element open-work 11 is the platform that upper end diameter is less than lower end diameterRank.
Temperature measuring device 2 is set in temperature measuring device mounting hole 12 in the present embodiment, on the one hand may be implemented to thermal detectorThe positioning of part 2 ensures accuracy and stability that temperature measuring device 2 is contacted with the first conduction element 3；On the other hand, temperature measuring device is pacifiedDress hole 12 can play the protective effect to temperature measuring device 2, prevent extraneous factor from being damaged to temperature measuring device 2, extend thermometricThe service life of device 2.
First conduction element 3 is fixed using fixed block 5 in the present embodiment, the first conduction element 3 when device being made to workSteady contact between upper end and temperature measuring device 2, the accuracy that stability and data to ensure that device work acquire.AndAnd set the first conduction element open-work 51 to the smaller stepped hole of upper end diameter in the present embodiment, pass through stepped hole and first shaft shoulder31 match the limit realized to 3 upper end of the first conduction element, avoid since the upper end of the first conduction element 3 is pierced by the first conductingThe length of part open-work 51 is long and the case where cause the upper end of the first conduction element 3 and temperature measuring device 2 to damage, be conducive to lead to firstThe upper end of parts 3 and temperature measuring device 2 are protected.In addition, the second conduction element open-work 11 is also configured as upper end in the present embodimentThe smaller stepped hole of diameter realizes the limit to 4 upper end of the second conduction element using stepped hole, it is therefore prevented that the second conduction element 4The length that upper end is pierced by the second conduction element open-work 11 is long, is conducive to carry out the upper end of the second conduction element 4 and chip lower surfaceProtection.
In order to provide certain placement space to chip 100 to be measured, guide groove 13, guide groove are additionally provided on test bench 1It is provided with guide plate 6 in 13, chip hole 61 is provided on guide plate 6, chip 100 to be measured is positioned in chip hole 61.This implementationGuide plate 6 is installed in the guide groove 13 of test bench 1 in example, ensure that and opposite move does not occur between guide plate 6 and test bench 1It is dynamic, steady contact when to ensure that test between chip lower surface and temperature measuring device 2.Chip 100 to be measured is positioned over and is ledInto the chip hole 61 of plate 6, contact when not only further ensuring test between chip lower surface and temperature measuring device 2 is stablizedProperty, and the positioning to chip 100 to be measured is realized, ensure that between 100 and second conduction element 4 of chip to be measured accurate connectsIt touches.
In order to which the lower end to the first conduction element 3 and the second conduction element 4 is fixed and limits, temperature measuring equipment further includes bottom plate7, bottom plate 7 is installed on the lower section of test bench 1, and positioned at the top of external test circuitry.As shown in figure 8, being provided on bottom plate 7 moreUnder a via hole 71, via hole 71 are matched with the first conduction element open-work 51 and the second conduction element open-work 11, and via hole 71 isDiameter is held to be less than the stepped hole of upper end diameter, the lower end of the first conduction element 3 and the second conduction element 4 passes through via hole 71 to be surveyed with externalExamination circuit is conducted.7 one side of bottom plate in the present embodiment ensure that the lower end of the first conduction element 3 always with external test circuitryIt is connected, to be conducive to the stability of temperature data transmission；On the other hand, it ensure that the second conduction element 4 during thermometricLower end is connected with external test circuitry always, and chip is made to be in normal operating circuit always.In addition, will in the present embodimentVia hole 71 is set as the smaller stepped hole of lower end diameter, and realization is matched with second shaft shoulder 32 and the lower shaft shoulder 42 by stepped holeLimit to 4 lower end of the first conduction element 3 and the second conduction element, is conducive to 4 lower end of the first conduction element 3 and the second conduction elementProtection.
Chip to be measured ensure that by being used cooperatively for test bench 1, fixed block 5, guide plate 6 and bottom plate 7 in the present embodiment100 and device in each device stablize and be accurately positioned, to improve the stability of device work, improve measurement resultAccuracy.
Note that above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art thatThe present invention is not limited to specific embodiments described here, can carry out for a person skilled in the art it is various it is apparent variation,It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out to the present invention by above exampleIt is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, alsoMay include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.