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CN108493586B - Housing assembly, antenna assembly and electronic equipment - Google Patents

Housing assembly, antenna assembly and electronic equipment
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Publication number
CN108493586B
CN108493586BCN201810411026.3ACN201810411026ACN108493586BCN 108493586 BCN108493586 BCN 108493586BCN 201810411026 ACN201810411026 ACN 201810411026ACN 108493586 BCN108493586 BCN 108493586B
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China
Prior art keywords
antenna structure
substrate
antenna
frame
metal sheet
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Expired - Fee Related
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CN201810411026.3A
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Chinese (zh)
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CN108493586A (en
Inventor
李飞飞
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201810411026.3ApriorityCriticalpatent/CN108493586B/en
Publication of CN108493586ApublicationCriticalpatent/CN108493586A/en
Application grantedgrantedCritical
Publication of CN108493586BpublicationCriticalpatent/CN108493586B/en
Expired - Fee Relatedlegal-statusCriticalCurrent
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Abstract

The embodiment of the application provides a casing subassembly, antenna module and electronic equipment. The antenna assembly comprises a first substrate, a second substrate and a first antenna structure; the first substrate is fixedly connected with the second substrate, the second substrate comprises a frame, the frame surrounds the periphery of the first substrate, and the frame comprises a top edge, a bottom edge, a first side edge, a second side edge and a plurality of corner parts positioned between the two adjacent sides; providing a first antenna structure on an outer surface of the top and/or bottom edge, the first antenna structure being located between two adjacent corner portions; the first antenna structure includes a feed structure extending from the frame position toward the second substrate inner direction, and a ground structure extending from the frame position toward the second substrate inner direction and connected to the first substrate. The embodiment of the application can increase the clearance area of the antenna structure in the electronic equipment, improve the radiation signal strength of the antenna structure and simultaneously avoid the possibility of bulging and splitting of the antenna structure.

Description

Shell assembly, antenna assembly and electronic equipment
Technical Field
The present application relates to the field of electronic technologies, and in particular, to a housing assembly, an antenna assembly, and an electronic device.
Background
With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. During the use of the electronic device, for example, the electronic device is used for conversation. To improve the call quality, the headroom of the antenna structure can be increased inside the electronic device.
However, as the electronic device has more and more functions and the space of the electronic device is more and more limited, increasing the clearance area of the antenna structure inside the electronic device occupies the space of other devices, and if the size of the electronic device is not changed, the function of the electronic device is affected, and the size of the electronic device is increased without affecting the function of the electronic device.
Disclosure of Invention
The embodiment of the application provides a casing subassembly, antenna module and electronic equipment, can improve electronic equipment signal intensity.
An embodiment of the present application provides a housing assembly, including:
a first substrate;
the second substrate is fixedly connected with the first substrate and made of a non-metal material, and comprises a frame which surrounds the periphery of the first substrate;
the frame comprises a top edge, a bottom edge, a first side edge, a second side edge and a plurality of corner parts positioned between two adjacent sides, wherein a first metal sheet is arranged on the outer surface of the top edge and/or the bottom edge, and the first metal sheet is positioned between two adjacent corner parts.
An embodiment of the present application provides an antenna assembly, includes:
a first substrate;
the second substrate is fixedly connected with the first substrate and is made of non-metal materials, the second substrate comprises a frame, the frame surrounds the periphery of the first substrate, and the frame comprises a top edge, a bottom edge, a first side edge, a second side edge and a plurality of corner parts positioned between the two adjacent edges;
and the first antenna structure is arranged on the outer surface of the top edge and/or the bottom edge and is positioned between two adjacent corner parts, wherein the first antenna structure comprises a feeding structure and a grounding structure, the feeding structure extends from the frame position to the inner direction of the second substrate, the grounding structure extends from the frame position to the inner direction of the second substrate, and the grounding structure is connected with the first substrate.
An embodiment of the present application provides an electronic device, including an antenna assembly and a control circuit, where the antenna assembly is the above antenna assembly, and the control circuit is coupled with a feed structure of an antenna structure.
According to the shell assembly, the antenna assembly and the electronic equipment, the antenna structure is arranged in the flat area on the frame, under the condition that the size of the electronic equipment is not changed, the clearance area of the antenna structure in the electronic equipment can be increased, and the radiation signal intensity of the antenna structure is improved; the antenna is not arranged on the corner part, so that the possibility of the antenna bulging and cracking can be avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a block diagram of an electronic device provided in an embodiment of the present application.
Fig. 3 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 4 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 5 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of an antenna assembly provided in an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a second substrate according to an embodiment of the present disclosure.
Fig. 8 is a schematic structural diagram of a protection member according to an embodiment of the present application.
Fig. 9 is a schematic structural diagram of an antenna structure according to an embodiment of the present application.
Fig. 10 is a schematic structural diagram of a housing assembly according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The embodiment of the application provides a casing subassembly, antenna module and electronic equipment, and this casing subassembly and antenna module can be integrated in electronic equipment, and this electronic equipment can be equipment such as smart mobile phone, panel computer.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. Theelectronic device 10 may include acover 11, adisplay 12, acontrol circuit 13, abattery 14, ahousing 15, a front-facingcamera 161, a rear-facingcamera 162, afingerprint unlock module 163, and anantenna structure 19. Note that theelectronic device 10 shown in fig. 1 is not limited to the above.
Wherein thecover plate 11 is mounted to thedisplay screen 12 to cover thedisplay screen 12. The cover 1 may be a transparent glass cover so that the display screen transmits light through thecover 11 to display. In some embodiments, thecover plate 11 may be a glass cover plate made of a material such as sapphire.
Wherein thedisplay screen 12 is mounted in ahousing 15. Thedisplay 12 is electrically connected to thecontrol circuit 13 to form a display surface of theelectronic device 10. Thedisplay 12 is in a regular shape, such as a rectangular parallelepiped, the top end and/or the bottom end of theelectronic device 10 form a non-display area, that is, theelectronic device 10 forms a non-display area on the upper portion and/or the lower portion of thedisplay 12, and theelectronic device 10 may mount afront camera 161, arear camera 162, and the like on the non-display area.
Thecontrol circuit 13 is installed in thehousing 15, thecontrol circuit 13 may be a motherboard of theelectronic device 10, and one, two or more of the functional components such as a motor, a microphone, a speaker, an earphone interface, a universal serial bus interface, afront camera 161, arear camera 162, a distance sensor, an ambient light sensor, a receiver, and a processor may be integrated on thecontrol circuit 13.
In some embodiments, thecontrol circuit 13 may be fixed within thehousing 15. Specifically, thecontrol circuit 13 may be screwed to themiddle frame 151 by a screw, or may be snap-fitted to themiddle frame 151. It should be noted that the way that thecontrol circuit 13 is specifically fixed to themiddle frame 151 in the embodiment of the present application is not limited to this, and other ways, such as a way of fixing by a snap and a screw together, may also be used.
Wherein thebattery 14 is mounted in thehousing 15, and thebattery 14 is electrically connected to thecontrol circuit 13 to supply power to theelectronic device 10. Thehousing 15 may serve as a battery cover for thebattery 14. Thecase 15 covers thebattery 14 to protect thebattery 14, reducing damage to thebattery 14 due to collision, dropping, and the like of theelectronic apparatus 10.
Wherein thehousing 15 may form an outer contour of theelectronic device 10. In some embodiments, thehousing 15 may include amiddle frame 151 and arear cover 152, themiddle frame 151 and therear cover 152 may be combined with each other to form thehousing 15, and themiddle frame 151 and therear cover 152 may form a receiving space to receive thedisplay 12, thecontrol circuit 13, thebattery 14, and the like. Thecover plate 11 may be fixed to thehousing 15, thecover plate 11 is covered on themiddle frame 151, therear cover 152 is covered on themiddle frame 151, thecover plate 11 and therear cover 152 are located on opposite sides of themiddle frame 151, and thecover plate 11 and therear cover 152 are located opposite.
In some embodiments, thehousing 15 may be a metal housing, such as a metal such as magnesium alloy, stainless steel, and the like. It should be noted that the material of thehousing 15 in the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: thehousing 15 may be a plastic housing. Also for example: thehousing 15 is a ceramic housing. For another example: thehousing 15 may include a plastic part and a metal part, and thehousing 15 may be a housing structure in which metal and plastic are matched with each other, specifically, the metal part may be formed first, for example, a magnesium alloy substrate is formed by injection molding, and then plastic is injected on the magnesium alloy substrate to form a plastic substrate, so as to form a complete housing structure. The material and process of thecase 15 are not limited to this, and a glass case may be used.
It should be noted that, the structure of the housing in the embodiment of the present application is not limited to this, for example: the rear cover and the middle frame are integrally formed to form a completedhousing 15 structure, which directly has a receiving space for receiving thedisplay 12, thecontrol circuit 13, thebattery 14, and the like.
Wherein theantenna structure 19 is arranged on an outer surface of thehousing 15. In some embodiments, theantenna structure 19 is disposed on the outer surface of thebezel 151, which may increase the headroom of theantenna structure 19 inside theelectronic device 10 without changing the size of theelectronic device 10.
Referring to fig. 2, fig. 2 is a block diagram of an electronic device according to an embodiment of the present disclosure. Thecontrol circuitry 13 of theelectronic device 10 may include storage andprocessing circuitry 131. The storage andprocessing circuit 131 may include a memory, such as a hard disk drive memory, a non-volatile memory (e.g., a flash memory or other electronically programmable read-only memory used to form a solid state drive, etc.), a volatile memory (e.g., a static or dynamic random access memory, etc.), and the like, and the embodiments of the present application are not limited thereto. Processing circuitry in the storage andprocessing circuitry 131 may be used to control the operation of theelectronic device 10. The processing circuitry may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.
The storage andprocessing circuit 131 may be used to run software in theelectronic device 10 such as an Internet browsing application, a Voice Over Internet Protocol (VOIP) phone call application, an email application, a media playing application, operating system functions, etc. Such software may be used to perform control operations such as, for example, camera-based image capture, ambient light measurement based on an ambient light sensor, proximity sensor measurement based on a proximity sensor, information display functionality based on status indicators such as status indicator lights of light emitting diodes, touch event detection based on a touch sensor, functionality associated with displaying information on multiple (e.g., layered) displays, operations associated with performing wireless communication functions, operations associated with collecting and generating audio signals, control operations associated with collecting and processing button press event data, and other functions in theelectronic device 10, and the like, without limitation of the embodiments of the present application.
Theelectronic device 10 may also include input-output circuitry 132. The input-output circuitry 132 may be used to enable theelectronic device 10 to enable the input and output of data, i.e., to allow theelectronic device 10 to receive data from external devices and also to allow theelectronic device 10 to output data from theelectronic device 10 to external devices. The input-output circuit 132 may further include asensor 1321. Thesensors 1321 can include ambient light sensors, optical and capacitive based proximity sensors, touch sensors (e.g., optical based touch sensors and/or capacitive touch sensors, where the touch sensors can be part of a touch display screen or used independently as a touch sensor structure), acceleration sensors, and other sensors, among others.
The input-output circuitry 132 may also include one or more displays, such asdisplay 1322, thedisplay 1322 may be referred to above with respect to display 12. Thedisplay 1322 may include one or a combination of liquid crystal displays, organic light emitting diode displays, electronic ink displays, plasma displays, displays using other display technologies.Display 1322 may include an array of touch sensors (i.e.,display 1322 may be a touch display screen). The touch sensor may be a capacitive touch sensor formed by a transparent touch sensor electrode (e.g., an Indium Tin Oxide (ITO) electrode) array, or may be a touch sensor formed using other touch technologies, such as acoustic wave touch, pressure sensitive touch, resistive touch, optical touch, and the like, and the embodiments of the present application are not limited thereto.
Electronic device 10 may also include anaudio component 1323.Audio component 1323 may be used to provide audio input and output functionality forelectronic device 10.Audio components 1323 inelectronic device 10 may include speakers, microphones, buzzers, tone generators, and other components for generating and detecting sound.
Theelectronic device 10 may also includecommunications circuitry 1324. Thecommunications circuitry 1324 may be used to provide theelectronic device 10 with the ability to communicate with external devices. Thecommunication circuitry 1324 may include analog and digital input-output interface circuitry, and wireless communication circuitry based on radio frequency signals and/or optical signals. The wireless communication circuitry incommunication circuitry 1324 may include radio-frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, andantenna structures 19. For example, the wireless Communication circuitry incommunications circuitry 1324 may include circuitry to support Near Field Communication (NFC) by transmitting and receiving Near Field coupled electromagnetic signals. For example, the communication circuit 124 may include a near field communication antenna and a near field communication transceiver.Communications circuitry 1324 may also include cellular telephone transceiver, wireless local area network transceiver circuitry, and the like.
Theelectronic device 10 may further include power management circuitry and other input-output units 1325. The input-output unit 1325 may include buttons, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, cameras, light emitting diodes and other status indicators, etc.
A user may enter commands through the input-output circuitry 132 to control the operation of theelectronic device 10, and may use the output data of the input-output circuitry 132 to enable receipt of status information and other outputs from theelectronic device 10.
Note that the structure of thedisplay screen 12 is not limited to this.
Referring to fig. 3, fig. 3 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure. Theelectronic device 20 includes acover 21, adisplay 22,control circuitry 23, abattery 24, ahousing 25, and anantenna structure 29. Theelectronic device 20 differs from theelectronic device 10 in that: thedisplay screen 22 has a lightpermeable area 28 formed directly thereon. Such as: thedisplay screen 22 is provided with a through hole penetrating thedisplay screen 22 in the thickness direction, the lightpermeable region 28 may include the through hole, and the through hole may be provided with functional components such as afront camera 161, an earpiece, a sensor, and the like. For another example: the lightpermeable region 28 may include a non-display region, which is not displayed, through which light signals may pass.
Referring to fig. 4, fig. 4 is a schematic structural diagram of another electronic device according to an embodiment of the present disclosure, and theelectronic device 30 may include acover plate 31, adisplay screen 32, acontrol circuit 33, abattery 34, and ahousing 35. Thiselectronic device 30 differs from the above electronic devices in that: thedisplay screen 32 is provided with a notch 321 at its periphery, and the notch 321 can be used for placing functional components such as thefront camera 161, the receiver, and the sensor. Thecover plate 31 may have a notch 321 with an equal size, and thecover plate 31 may cover the notch 321.
Referring to fig. 5, fig. 5 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure. Theelectronic device 40 may include acover plate 41, adisplay 42,control circuitry 43, abattery 44, and ahousing 45. Wherein thedisplay screen 42 covers thehousing 45, thedisplay screen 42 is suitable for the size of thehousing 45, the top end or the bottom end of the electronic device 50 does not have a non-display area, that is, thedisplay screen 42 may extend to the top edge of theelectronic device 40 and the bottom edge of theelectronic device 40, and thedisplay screen 42 may be displayed on theelectronic device 40 in a full screen. Functional components such as a distance sensor, an ambient light sensor, etc. may be disposed below thedisplay screen 42 or elsewhere.
It can be understood that, along with the function of the electronic device is more and more, the devices installed inside the electronic device are more and more, and the extra devices installed inside the electronic device can additionally occupy the internal space of the electronic device under the condition that the size of the electronic device is not changed, and can occupy the clearance area of the antenna structure in the electronic device in the actual production process, thereby affecting the radiation signal of the antenna structure. In order to keep the antenna structure with good radiation signals under the condition of not additionally increasing the size of the electronic equipment, the antenna structure is installed on the outer surface of the middle frame to form the antenna component. The following description will be made in detail by taking an antenna assembly as an example.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an antenna assembly according to an embodiment of the present application. Theantenna assembly 500 may include afirst substrate 510, asecond substrate 520, and anantenna structure 530. Theantenna assembly 500 may be applied to the above respective electronic devices.
Thefirst substrate 510 may be a plate-shaped structure. Thefirst substrate 510 may be made of a metal material, such as magnesium alloy, formed by a die forming process, a die casting process, a machining process, or the like. It should be noted that the specific structure and material of thefirst substrate 510 can be adjusted according to actual needs.
Thesecond substrate 520 may be made of a plastic material, and may be formed on thefirst substrate 510 by injection molding, for example, to form a complete insert structure, or a middle frame structure. Thesecond substrate 520 includes abezel 521 and a connection structure formed on an inner surface of thebezel 521.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a second substrate according to an embodiment of the present disclosure. Theframe 521 is located at an edge of thesecond substrate 520, and the frame 511 surrounds the periphery of thefirst substrate 510. Theframe 521 is fixedly connected to the periphery of thefirst substrate 510 during the injection molding process. Wherein the connecting structure may comprise an earphone seat, a camera head seat, etc. The connection structure is formed by extending from the inner surface of theside frame 521 toward the inner direction of themiddle frame 521, and the connection structure may be formed on thefirst substrate 510 to achieve a fixed connection. Wherein the inner surface of theframe 521 is a surface adjacent to thefirst substrate 510.
In the present embodiment, thesecond substrate 520 has a top 5201, a bottom 5202, afirst side 5203 and asecond side 5204. Wherein thetop portion 5201 and thebottom portion 5202 are disposed opposite each other and thefirst side portion 5203 and thesecond side portion 5204 are disposed opposite each other. Thetop portion 5201 is connected to thefirst side portion 5203 and thesecond side portion 5204, respectively, and thetop portion 5201 and thefirst side portion 5203 form afirst corner 5205 therebetween and thetop portion 5201 and thesecond side portion 5204 form asecond corner 5206 therebetween. Thebottom portion 5202 is connected to thefirst side portion 5203 and thesecond side portion 5204, respectively, and athird corner 5207 is formed between thebottom portion 5201 and thefirst side portion 5203 and afourth corner 5208 is formed between thebottom portion 5202 and thesecond side portion 5204.
In the present embodiment, theframe 521 includes a top edge, a bottom edge, a first side edge, a second side edge, and a plurality of corner portions between the two adjacent sides. The top edge of theframe 521 is thetop portion 5201 of thesecond substrate 520, the bottom edge is thebottom portion 5202 of thesecond substrate 520, the first side edge is thefirst side portion 5203 of thesecond substrate 520, and the second side edge is the second side portion of thesecond substrate 520. The corners of thebezel 521 are afirst corner 5205, asecond corner 5206, a third corner 5307 and afourth corner 5208 of thesecond substrate 520, respectively.
In some embodiments, theantenna structure 530 may have one, two, three, or more.
For example, theantenna structure 530 may specifically include afirst antenna structure 531. Thefirst antenna structure 531 is disposed on the outer surface of the top and/or bottom edges (i.e., thetop portions 5201 and/or 5202) such that thefirst antenna structure 531 is located between two adjacent corner portions (i.e., between thecorner portions 5205 and 5206 and/or between thecorner portion 5207 and the corner portion 208). Thefirst antenna structure 531 may be used as a diversity antenna or a main diversity antenna.
In some embodiments, thefirst antenna structure 531 may extend along the outer surface of the top and/or bottom edge to a corner location, with thefirst antenna structure 531 terminating at the corner location.
In the embodiment of the present application, thefirst antenna structure 531 may be coupled to the control circuit, and theframe 521 may realize the coupling between thefirst antenna structure 531 and the control circuit by using a hole or a slot. Therebyfirst antenna structure 531 is located the periphery surface ofsecond base plate 520,antenna structure 531 outside does not have and shelters from, under the inconvenient condition of center structure, compare and set up antenna structure at the frame internal surface ofsecond base plate 520, thisapplication antenna structure 531's headroom region has increasedframe 521 shared space on its thickness direction in other words, this application is under the inconvenient condition of electronic equipment size promptly, can increase headroom region, promote antenna structure radiation signal's intensity, reduce the influence that other devices caused antenna structure. Meanwhile, the antenna structure is prevented from being arranged at the corner part, and the possibility of bulging and cracking of the antenna structure is reduced.
In some embodiments, theantenna structure 530 may further include asecond antenna structure 532, thesecond antenna structure 532 being disposed on an outer surface of the first and/or second side of the bezel 521 (i.e., thefirst side 5203 and/or the second side 5204) such that thesecond antenna structure 532 is located between two adjacent corners (i.e., between thecorners 5205 and 5207 and/or between thecorner 5206 and the corner 208).
For example, thesecond antenna structure 532 may be disposed only on thefirst side 5203. Specifically, thesecond antenna structure 532 may be disposed on a portion of the outer surface of thefirst side portion 5203. In addition, thesecond antenna structure 532 may also extend from one end of thefirst side portion 5203 to the other end to cover the outer surface of thefirst side portion 5203, so as to enhance the radiation intensity of the antenna, so that thesecond antenna structure 532 may be used as a Global Positioning System (GPS) antenna, thereby enhancing the accuracy of Positioning.
In addition, asecond antenna structure 532 may also be provided on thesecond side 5203 for use as an additional functional antenna. For example, thesecond antenna structure 532 may have two feeding structures, and may form two radiators to receive and transmit signals in different frequency bands, where the two radiators formed by thesecond antenna structure 532 are both used as diversity antennas, or both used as main set antennas, or one used as main set antennas and one used as diversity antennas. It should be noted that thesecond antenna structure 532 may have only one radiator, and may be used as a diversity antenna or a main set antenna.
In some embodiments, the first side and/or the second side are provided with function keys, such as a volume key, a screen locking key, a mute key and the like. Thesecond antenna structure 532 may further be arranged directly on the function keys. Short-range communication signals can be transmitted and received.
As described above, by disposing theantenna structure 530 on the side of theframe 521, the length of theantenna structure 530 can be increased, so as to improve the radiation intensity of theantenna structure 530; in addition, theantenna structure 530 is not disposed at the corner portion, so that the possibility of theantenna structure 530 being bulged or cracked can be reduced.
It can be appreciated that theantenna structure 530 is disposed on the outer surface of theframe 521, and may be easily touched, and when being hit or collided by a large force, the antenna structure may be swelled, which may affect the performance of the antenna. To achieve protection of theantenna structure 530, one, two, or more layers of paint may be sprayed on the outer surface of theantenna structure 530. Of course, one, two or more layers of paint may be sprayed on the outer surface of the perimeter of theframe 521 after theantenna structure 530 is mounted thereon.
It should be noted that the protection scheme implemented for theantenna structure 530 is not limited thereto. Such as: a groove is formed on theframe 521. Specifically, with continued reference to fig. 7, theframe 521 is recessed from the outer periphery toward the outer surface toward the inner surface of theframe 521 to form a platform structure, and theantenna structure 530 is disposed in the platform structure. For example, taking the bottom side of theframe 521 as an example, the top side is recessed from the outer surface of theframe 521 toward the inner surface of theframe 521 to form a platform structure as thefirst groove 5211, and theantenna structure 531 is disposed on the platform structure. In addition, a platform structure may be disposed on the bottom side, the first side, and the second side for placing theantenna structure 530.
In some embodiments, each of the docking structures may be shaped and sized to fit the antenna structure such that the antenna structure is mounted to the docking structure with a surface of the antenna structure flush with a surface of thebezel 521.
As can be seen from the above, theantenna structure 530 is mounted on the platform structure of theframe 521 to prevent theantenna structure 530 from protruding out of the peripheral outer surface of theframe 521, so that the outer surface of theantenna structure 530 and the outer surface of theframe 521 can be flush with each other, thereby reducing the possibility of damage to theantenna structure 530.
To further enhance protection of theantenna structure 530. In some other embodiments, theantenna assembly 500 may further include aprotection member 540 made of a non-metal material, and theprotection member 540 may be made of a plastic material. Theprotection member 540 may be disposed on the outer surface of theframe 521 and the outer surface of theantenna structure 530 to cover theantenna structure 530. Such that theantenna structure 530 is located between theprotection member 540 and thebezel 521. The number of theprotection members 540 may be set according to the number of theantenna structures 530.
Referring to fig. 8, fig. 8 is a schematic structural diagram of a protection member according to an embodiment of the present disclosure. For example, theprotection member 540 may be covered on thefirst antenna structure 531 to cover thefirst antenna structure 531 on therim 521.
In some embodiments, theprotection member 540 may protrude from the outer surface of therim 521, or may be installed in the platform structure together with theantenna structure 530, so that the periphery of theprotection member 540 is flush with the periphery of therim 521. Further, theframe 521 has two side walls and a bottom wall connecting the two side walls at the position of the platform structure, the side walls are in a step structure at the position of the groove, and theframe 521 has a step surface at the position of the side wall, which can bear theprotection member 540, i.e. theprotection member 540 is disposed on the step surface.
In some embodiments, the thickness of theprotection member 540 may be 0.01mm to 0.4mm, such as 0.25mm to 0.3 mm.
In some embodiments, a positioning structure may be further disposed on theprotection member 540 to position the positioning structure on theframe 521.
In some embodiments, theantenna structure 530 may include a steel sheet, i.e., theantenna structure 530 is configured by the steel sheet to transmit and receive signals. It should be noted that the thickness of the steel sheet is relatively thin, for example, the thickness of the steel sheet is 0.1-0.3mm, and further the thickness of the steel sheet is 0.15mm-0.2mm, so that the steel sheet is easy to deform during installation and affects signals. In some embodiments, plastic may be bonded to the steel sheet to form an antenna structure in which the steel sheet and plastic are bonded together. Specifically, please refer to fig. 9, fig. 9 is a schematic structural diagram of thefirst antenna structure 531 according to an embodiment of the present disclosure.
Thefirst antenna structure 531 is formed by fixedly connecting asteel sheet 5311 and aplastic part 5312, for example, theplastic part 5312 is formed on thesteel sheet 5311 by injection molding. Theplastic part 5312 may be formed on the surface of thesteel sheet 5311 to wrap thesteel sheet 5311. Plastic 5312 may also be formed aroundsteel sheet 5311 to expose an outer surface or/and an inner surface ofsteel sheet 5311. The plastic part 5322 may also be formed on the outer or inner surface of thesteel sheet 5311.
In some embodiments, theframe 521 is provided with a plurality of spaced positioning holes, and the end of thefirst antenna structure 531 has aprotrusion 5313, and theprotrusion 5313 is received in the positioning hole of theframe 521.
In some embodiments, thefirst antenna structure 531 includes afeed structure 5314 and aground structure 5315. Thefeeding structure 5314 extends from the position of theframe 521 toward the inner direction of thesecond substrate 520 to couple with thecontrol circuit 13 of theelectronic device 10 for electrical connection. Thegrounding structure 5315 extends from the position of theframe 521 toward the inner direction of thesecond substrate 520, and is connected to a ground of theelectronic device 10, which can be connected to thefirst substrate 510, that is, thegrounding structure 5315 is connected to thefirst substrate 510.
Therefore, the antenna structure is wrapped on the surface of the steel sheet or on the periphery of the steel sheet through the plastic part, so that the steel sheet is protected, and the possibility of damage of the steel sheet is reduced; but also can increase the steel sheet intensity, reduce the possibility of steel sheet deformation, promote the signal intensity of antenna structure.
Therefore, the antenna structure is installed in the sinking platform structure of the frame, the antenna structure is prevented from protruding out of the peripheral outer surface of the frame, the outer surface of the antenna structure and the outer surface of the frame can be arranged in a flush mode, and the possibility of damage of the antenna structure is reduced. Meanwhile, the antenna structure can be positioned on the outer surface of the periphery of the frame or inside the frame, namely on the outer surface or inside the middle frame structure, the outside of the antenna structure is not shielded, and under the condition that the middle frame structure is inconvenient, compared with the case that the antenna structure is arranged on the inner surface of the frame of the middle frame structure, the clearance area of the antenna structure is equivalent to the space occupied by the frame in the thickness direction, namely under the condition that the size of the electronic equipment is inconvenient, the clearance area can be increased, the intensity of a radiation signal of the antenna structure is improved, and the influence of other devices on the antenna structure is reduced; in addition, the antenna is not arranged at the corner part, so that the possibility of bulging and cracking of the antenna structure can be avoided.
In some embodiments, please refer to fig. 10, and fig. 10 is a schematic structural diagram of a housing assembly according to an embodiment of the present disclosure. Thecase assembly 600 may include afirst substrate 610, asecond substrate 620, and ametal sheet 630.
Thefirst substrate 610 may be made of a metal material, and refer to thefirst substrate 510 specifically.
Thesecond substrate 620 is made of a non-metal material. Thesecond substrate 620 includes arim 621, therim 621 surrounds the periphery of thefirst substrate 610, and therim 621 includes atop edge 6211, abottom edge 6212, afirst side edge 6213, asecond side edge 6214, and a plurality of corner portions between the adjacent edges. Wherein the plurality of corner segments specifically include: acorner portion 6215 located between thetop edge 6211 and thefirst side edge 6213, acorner portion 6216 located between thetop edge 6211 and thesecond side edge 6214, acorner portion 6217 located between thebottom edge 6212 and thefirst side edge 6213, and acorner portion 6218 located between thebottom edge 6212 and thesecond side edge 6214.
Wherein ametal sheet 630 is provided at an outer surface of thetop edge 6211 and/or thebottom edge 6212, such that themetal sheet 630 is located between two adjacent corner portions.
In some embodiments, themetallic sheet 630 may extend along the outer surface of thetop edge 6211 and/or thebottom edge 6212 to corner locations, with themetallic sheet 630 terminating at the corner locations.
It should be noted that thesecond substrate 620 can refer to thesecond substrate 520, and theframe 621 can refer to theframe 521.
Wherein themetal sheet 630 has conductive properties. In the process of installing themetal sheet 630 in thegroove 6211, a sinking platform structure may be provided on theframe 621 in advance, then themetal sheet 630 is installed on the sinking platform structure, and then themetal sheet 630 is covered and wrapped by a protection member, or themetal sheet 630 is wrapped by plastic in the injection molding process.
In some embodiments, themetallic sheet 630 can also be disposed to an outer surface of thefirst side edge 6213 and/or thesecond side edge 6214.
In some embodiments, the functional keys are disposed on thefirst side 6213 and/or thesecond side 6214, and themetal sheet 630 can be disposed on the functional keys. Also, themetal sheet 630 may be covered and protected by a protector or plastic.
Note that, themetal plate 630 may refer to the above steel plate.
The housing assembly, the antenna assembly, and the electronic device provided in the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are described herein using specific examples, which are provided only to help understand the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (13)

CN201810411026.3A2018-05-022018-05-02 Housing assembly, antenna assembly and electronic equipmentExpired - Fee RelatedCN108493586B (en)

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CN201810411026.3ACN108493586B (en)2018-05-022018-05-02 Housing assembly, antenna assembly and electronic equipment

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CN113745806B (en)*2021-08-182024-09-13深圳市信维通信股份有限公司Antenna system and mobile terminal based on metal frame

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