Invention content
Based on this, it is high that chip, chip fraction defective height, manufacturing cost are easy to damage when being ground for traditional burr removing methodThe problem of, providing one kind can avoid excessively removing flash, reduce fraction defective generate, improve production efficiency unhairing edge system andBurr removing method.
A kind of unhairing edge system, including：
For place wafer to bit platform, the edge of the wafer has flash；And
Laser machine, the laser machine are arranged in the side to bit platform, and the laser machine is swashed with crevice projection angle projectionLight, the laser machine project the laser rays to remove the flash.
It is described in one of the embodiments, to there is rotational structure, the rotational structure drive the crystalline substance bit platformCircle rotation.
The laser machine is rotated relative to the bit platform in one of the embodiments,.
The present invention also has alignment device, the alignment device setting flat in the contraposition in one of the embodiments,Side of the platform far from the laser machine, the alignment device is confirming the offset of the wafer.
The offset is the outer diameter spacing of the outer diameter to bit platform and the wafer in one of the embodiments,Deviation, the outer diameter to bit platform are less than the outer diameter of the wafer.
The present invention also has mechanical arm in one of the embodiments, and the mechanical arm is to the movement waferOr the adjustment offset.
The alignment device is camera or 2D measuring equipments in one of the embodiments,.
The present invention also has fan housing in one of the embodiments, and the fan housing is relative to the top surface to bit platformSetting, the fan housing with it is described to bit platform interval activity distance, the fan housing can be relative to the axial direction to bit platformOperating range described in lift adjustment, the wafer are equipped with multiple chips, ranging from each core of cover of the fan housing at equal intervalsPiece setting area.
The crevice projection angle and the axial angle to bit platform are 45 degree in one of the embodiments,.
For the purpose for reaching above-mentioned, the present invention also provides a kind of burr removing methods, include the following steps：
Wafer is placed on to bit platform, it is described to there is rotational structure, the wafer to have flash bit platform；The rotationRotation structure drives the wafer rotation, confirms whether the offset of the crystal round fringes is equal by alignment device；And it is describedWhen offset is equal, laser machine projects laser rays with crevice projection angle and removes the flash.
In one of the embodiments, when the offset is unequal, the rotational structure stops rotating, and passes through machineryArm moves the wafer, adjusts the offset.
In one of the embodiments, by the wafer be placed on it is described to bit platform before, it is flat that fan housing lifts away from the contrapositionPlatform adjusts the fan housing and the operating range between bit platform, provides the space that the mechanical arm places the wafer.
In one of the embodiments, when the wafer be placed on it is described to bit platform after, the fan housing downgrades the workDynamic distance, and the multiple chip ranges being equipped in the wafer are covered, the fan housing generates the air-flow toward the wafer direction.
The alignment device is camera or 2D measuring equipments in one of the embodiments,.
The present invention has the following effects that：After wafer is moved to by mechanical arm to be placed to bit platform, laser machine is to projectAngle projects laser rays to remove flash, removes flash with crevice projection angle projection laser rays, can avoid excessively removing flash, damageTo wafer itself, to reduce fraction defective generation；Meanwhile with laser burr removing mode, the process time of manufacturing method can be reduced, is carriedThe efficiency of high manufacturing method.
In addition, the offset of wafer is confirmed by alignment device, to determine that the center of wafer is with the center to bit platformIt is no identical, if when unequal, can be corrected, the wafer generated when processing damage is being manufactured due to position error to reduceWound, to improve the processing precision of manufacturing method.
Specific implementation mode
In order to make the purpose of the present invention, technical solution and technique effect be more clearly understood, below in conjunction with attached drawing to this hairBright specific embodiment is described.It should be appreciated that described herein, specific examples are only used to explain the present invention, and does not have toIt is of the invention in limiting.
It please referring to Fig.1 to shown in Fig. 5, the present invention provides a kind of unhairing edge system, it includes：
To bit platform 10, with table top 11 and rotational structure 12, rotational structure 12 can drive wafer 1 to rotate, wherein rotationRotation structure 12 can be driven rotary shaft or power source to drive rotary shaft rotation by motor, in embodiments of the present invention, table top 11 and rotationRotation structure 12 links, and rotational structure 12 can drive table top 11 to rotate, and table top 11 has oppositely arranged top 111 and bottom 112,The top 111 of table top 11 is placed with for wafer 1, and wafer 1 can be driven to rotate bit platform 10, wherein the edge of wafer 1 hasThe multiple chips 3 for having flash 2 and being arranged at equal intervals.In addition, in an alternative embodiment of the invention, rotational structure 12 and 1 chain of waferIt connects, rotational structure 12 drives wafer 1 to be rotated relative to table top 11.
Specifically, having offset D between the outer diameter and the outer diameter of wafer 1 of table top 11, in the present invention, table top 11 is circleShape, wafer 1 are round, if the center of table top 11 and the center of wafer 1 are concentric circles, offset D is equal；If table top11 center and the center of wafer 1 are not concentric circles, then offset D is unequal, wherein offset D has according to 1 size of different wafersInstitute is different.
Laser machine 20 is set to the side to bit platform 10, and in embodiments of the present invention, laser machine 20 is relative to table top 11Top 111 be arranged, and be separated by a setting height with the top of table top 11 111, laser machine 20 projects laser rays with crevice projection angle A21, after wafer 1 is moved to table top 11 by mechanical arm 30 to be placed, drive wafer 1 to rotate bit platform 10, while laser machine 20Laser rays 21 is projected to remove flash 2, wherein different type of machines can be arranged in mechanical arm 30 according to demand.Wherein, setting height canIt is adjusted according to use demand, laser machine 20 can be enabled to project the laser rays 21 of crevice projection angle A to the flash 2 of wafer 1, moved2 program of Burr removal, and the axial angle of crevice projection angle A and rotational structure 12 is in 45 degree, with crevice projection angle A by the flash 2 of wafer 1It removes, only removes extra flash 2, can excessively injure wafer 1 itself to avoid being processed in manufacturing method, promote manufacturing methodMachining accuracy, reduce fraction defective generate, please refer to shown in Fig. 3 and Fig. 4.
In another embodiment of the invention, after wafer 1 is moved to table top 11 by mechanical arm 30 to be placed, laser machine 20It is rotated relative to bit platform 10, and in rotary course, laser machine 20 projects laser rays 21 by flash 2 with crevice projection angle AIt removes.
Alignment device 40 is arranged to side of the bit platform 10 far from laser machine 20, alignment device 40 be camera orOne kind in 2D measuring equipments, and 2D measuring equipments can be infrared equipment, Photoinduction device etc., alignment device 40 is to trueThe offset for recognizing wafer 1 measures the marginal position of wafer 1 by alignment device 40, to calculate the offset of wafer 1.Wherein,When alignment device 40 is photographed on the top 111 of table top 11,11 outer diameter of table top is more than the outer diameter of wafer 1, to confirm twoOffset D between person's outer diameter；When alignment device 40 is photographed on the side of table top 11, it can be confirmed wafer 1 apart from 11 depth of table topOffset D；When alignment device 40 is photographed on the bottom 112 of table top 11, crystalline substance is less than to 11 outer diameter of table top of bit platform 10The outer diameter of circle 1, to confirm the offset D between the two outer diameter.
In embodiments of the present invention, alignment device 40 is camera, and alignment device 40 has phtographic lens 41 and displayScreen (not shown), in the present invention, phtographic lens 41 are located at the bottom 112 of table top 11, and phtographic lens 41 is shooting pairOffset D between the outer diameter and the outer diameter of wafer 1 of bit platform 10, and picture is shown on the display screen, when table top 11 and crystalline substanceWhen offset D between circle 1 is unequal, indicates that the two is not concentric circles, then offset D is adjusted by mechanical arm 30, make table topOffset D between 11 and wafer 1 is equal, avoids causing because of eccentricity issues the processing of follow-up manufacturing method from damaging wafer 1, to carryRise the machining accuracy of manufacturing method.
Fan housing 50, relative to the top surface setting to bit platform 10, in the present invention, top of the fan housing 50 relative to table top 11111 settings, and fan housing 50 is spaced an operating range with the table top 11 to bit platform 10, fan housing 50 can be relative to rotational structure 12Axial lift adjustment operating range, ranging from each 3 setting area of chip of cover of fan housing 50.
Possess operating range L between fan housing 50 and table top 11, mechanical arm 30 moves the top that wafer 1 moves to table top 11111 or wafer 1 is moved away from by top 111；When fan housing 50 is fallen close to table top 11, operating range L is adjusted to operating range L ',Wherein, injection dried and clean air or nitrogen in fan housing 50, make fan housing 50 generate toward one of 1 direction of wafer air-flow, and air-flowThe smog generated when can be by dust particale or laser between each chip 3 is blown away, and keeps opposite positive pressure by air-flow, and then is keptWafer 1 cleans.In addition, in the present invention, operating range L between table top 11 at a distance from can be made according to the processing program of manufacturing methodAdjustment, and it is separated by 1mm to 10mm between operating range L ' and each chip 3.
It please refers to Fig.1 to shown in Fig. 5, the embodiment of the present invention provides a kind of burr removing method, and it includes following steps：
Refering to Figure 1, fan housing 50 keeps operating range L with to the table top 11 of bit platform 10, when do not keep activity away fromWhen from L, then fan housing 50 is lifted away from and bit platform 10 is adjusted to enough operating range L, wafer is placed to provide mechanical arm 301 space.
It please refers to shown in Fig. 2, after wafer 1 is placed on the table top 11 to bit platform 10 by mechanical arm 30, fan housing 50Operating range L ' is downgraded from operating range L, and is covered in 3 range of each chip.
Please refer to Fig.1 and Fig. 5 shown in, to bit platform 10 drive wafer 1 rotate, pass through the phtographic lens 41 of alignment device 40Shooting confirms whether offset D is equal.When showing that screen shows that offset D is unequal, it is illustrated in figure 5 the wafer of dotted line1 ', it indicates that wafer 1 ' and table top 11 are not concentric circles, then stops rotating to bit platform 10, wafer is moved by mechanical arm 301 ', offset D is adjusted, until wafer 1 ' is adjusted to the wafer 1 for being illustrated in figure 5 solid line presentation, expression wafer 1 is in table top 11Concentric circles.
It please refers to shown in Fig. 3 and Fig. 4, after confirming that offset D is equal, wafer 1 is driven to rotate again to bit platform 10, andFan housing 50 persistently sends out air-flow toward 3 direction of each chip, rotates simultaneously in wafer 1, is swashed with crevice projection angle A projections by laser machine 20Light 21 and the flash 2 for removing wafer 1.
In an alternative embodiment of the invention, after confirming that offset D is equal, fan housing 50 persistently sends out air-flow toward each chip 3Direction, and laser machine 20 is rotating simultaneously relative to being rotated to bit platform 10, is swashed with crevice projection angle A projections by laser machine 20Light 21 and the flash 2 for removing wafer 1.
By to bit platform 10, alignment device 40 and mechanical arm 30, before laser processing, first confirming or adjusting offsetD indicates that bit platform 10 and wafer 1 ' be not concentric circles if offset D is unequal, then can be by mechanical arm 30 to wafer1 ' positioning and offset D correction, until wafer 1 ' adjust to wafer 1 with to bit platform 10 be concentric circles, remake follow-up manufactureProcessing to reduce because of position error, and is damaged manufacturing the wafer 1 that the when of processing generates, accurate with the processing for improving manufacturing methodDegree.
In addition, projecting laser rays 21 by laser machine 20 with crevice projection angle A, the flash 2 of wafer 1 is removed, wafer 1 is made to makeIt makes in the processing of method, avoids injuring wafer 1 itself, to possess 1 range of script wafer, by this operation, promote manufacturerThe machining accuracy of method, and processing program and the time of manufacturing method can be shortened, promote the efficiency of manufacturing method.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned realityIt applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not depositedIn contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneouslyIt cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the artIt says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present inventionRange.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.