技术领域technical field
本发明涉及成像技术领域，特别涉及一种激光投射模组、激光投射模组破裂的检测方法、深度相机和电子装置。The invention relates to the field of imaging technology, in particular to a laser projection module, a method for detecting the rupture of the laser projection module, a depth camera and an electronic device.
背景技术Background technique
现有的一些激光发射器(例如垂直腔体激光发射器VCSEL等)会发射出聚焦信号较强的激光，这些激光经过准直元件、衍射光学元件后能量会衰减，以便满足信号强度低于对人体的伤害门限。这些激光发射器通常由玻璃或其他容易破碎的部件组成，一旦遇到摔落等情况，镜头破裂，则激光将直接发射出来，照射使用者的身体或眼睛，造成严重的安全问题。Some existing laser emitters (such as vertical cavity laser emitters VCSEL, etc.) emit lasers with strong focused signals, and the energy of these lasers will attenuate after passing through collimation elements and diffractive optical elements, so as to satisfy the signal intensity lower than the pair Human body injury threshold. These laser emitters are usually composed of glass or other easily broken parts. Once the lens is broken in case of falling, the laser will be emitted directly to irradiate the user's body or eyes, causing serious safety problems.
发明内容Contents of the invention
本发明的实施例提供了一种激光投射模组、激光投射模组破裂的检测方法、深度相机和电子装置。Embodiments of the present invention provide a laser projection module, a method for detecting a rupture of the laser projection module, a depth camera, and an electronic device.
本发明提供了一种激光投射模组，所述激光投射模组包括激光发射器、准直元件、衍射光学元件及处理器。所述激光发射器用于发射激光。所述准直元件用于准直所述激光。所述衍射光学元件用于衍射经所述准直元件准直后的激光以形成激光图案，所述准直元件和/或所述衍射光学元件上形成有透光导电膜，所述透光导电膜上设有导电电极，所述导电电极通电后用于输出电信号。所述处理器用于获取所述电信号、判断所述电信号是否处于预设范围内、以及在所述电信号不处于所述预设范围内时确定所述准直元件和/或所述衍射光学元件破裂。The invention provides a laser projection module, which includes a laser emitter, a collimation element, a diffractive optical element and a processor. The laser emitter is used for emitting laser light. The collimating element is used to collimate the laser light. The diffractive optical element is used to diffract the laser collimated by the collimating element to form a laser pattern, and a light-transmitting conductive film is formed on the collimating element and/or the diffractive optical element, and the light-transmitting conductive film is formed on the collimating element and/or the diffractive optical element. Conductive electrodes are arranged on the film, and the conductive electrodes are used to output electrical signals after being energized. The processor is used for acquiring the electrical signal, judging whether the electrical signal is within a preset range, and determining whether the collimation element and/or the diffraction Optics are cracked.
本发明提供了一种激光投射模组破裂的检测方法，所述激光投射模组包括激光发射器、准直元件和衍射光学元件，所述激光发射器用于发射激光，所述准直元件用于准直所述激光，所述衍射光学元件用于衍射经所述准直元件准直后的激光以形成激光图案，所述准直元件和/或所述衍射光学元件上形成有透光导电膜，所述透光导电膜上设有导电电极，所述导电电极通电后用于输出电信号；所述检测方法包括：The invention provides a method for detecting the rupture of a laser projection module, the laser projection module includes a laser emitter, a collimation element and a diffractive optical element, the laser emitter is used for emitting laser light, and the collimation element is used for Collimating the laser light, the diffractive optical element is used to diffract the laser light collimated by the collimating element to form a laser pattern, and a light-transmitting conductive film is formed on the collimating element and/or the diffractive optical element , the light-transmitting conductive film is provided with a conductive electrode, and the conductive electrode is used to output an electrical signal after being energized; the detection method includes:
获取所述导电电极通电后输出的电信号；Obtaining an electrical signal output after the conductive electrode is electrified;
判断所述电信号是否处于预设范围内；和determining whether the electrical signal is within a preset range; and
在所述电信号不处于所述预设范围内时确定所述准直元件和/或所述衍射光学元件破裂。Determining that the collimation element and/or the diffractive optical element is broken when the electrical signal is not within the preset range.
本发明提供了一种深度相机。所述深度相机包括上述的激光投射模组、图像采集和处理器。所述图像采集器用于采集由所述激光投射模组向目标空间中投射的激光图案。所述处理器用于处理所述激光图案以获得深度图像。The invention provides a depth camera. The depth camera includes the above-mentioned laser projection module, image acquisition and processor. The image collector is used to collect the laser pattern projected by the laser projection module into the target space. The processor is configured to process the laser pattern to obtain a depth image.
本发明提供了一种电子装置。电子装置包括壳体和上述的深度相机，所述深度相机设置在所述壳体上并从所述壳体上暴露以获取所述深度图像。The invention provides an electronic device. The electronic device includes a casing and the above-mentioned depth camera, the depth camera is arranged on the casing and exposed from the casing to acquire the depth image.
本发明实施方式的激光投射模组、激光投射模组破裂的检测方法、深度相机和电子装置通过在准直元件上设置透光导电膜和导电电极、和/或在衍射光学元件上设置透光导电膜和导电电极，再根据导电电极、和/或导电电极输出的电信号判断准直元件和/或衍射光学元件是否破裂。如此，可检测出激光投射模组是否完好，并在检测到激光投射模组破裂时，可选择不开启激光投射模组、或者及时关闭激光投射模组投射的激光、或者减小激光投射模组的发光功率，以避免激光投射模组破裂后，激光投射模组投射出的激光的能量过高，对用户的眼睛产生危害的问题，提升用户使用的安全性。The laser projection module, the detection method for the rupture of the laser projection module, the depth camera and the electronic device according to the embodiments of the present invention are provided with a light-transmitting conductive film and a conductive electrode on the collimation element, and/or a light-transmitting optical element on the diffractive optical element. The conductive film and the conductive electrode, and then judge whether the collimation element and/or the diffractive optical element are broken according to the electrical signal output by the conductive electrode and/or the conductive electrode. In this way, it can be detected whether the laser projection module is intact, and when the laser projection module is detected to be broken, you can choose not to open the laser projection module, or turn off the laser projected by the laser projection module in time, or reduce the laser projection module. The luminous power is high to avoid the problem that after the laser projection module is broken, the energy of the laser projected by the laser projection module is too high, which will cause harm to the user's eyes, and improve the safety of the user.
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
附图说明Description of drawings
本发明上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解，其中：The above and/or additional aspects and advantages of the present invention will become apparent and easy to understand from the following description of the embodiments in conjunction with the accompanying drawings, wherein:
图1是本发明某些实施方式的激光投射模组破裂的检测方法的流程示意图。FIG. 1 is a schematic flowchart of a method for detecting a crack in a laser projection module according to some embodiments of the present invention.
图2是本发明某些实施方式的激光投射模组的结构示意图。Fig. 2 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.
图3和图4是本发明某些实施方式的衍射光学元件的剖面图。3 and 4 are cross-sectional views of diffractive optical elements according to some embodiments of the present invention.
图5至图8是本发明某些实施方式的衍射光学元件的导电电极的线路示意图。5 to 8 are schematic circuit diagrams of conductive electrodes of a diffractive optical element according to some embodiments of the present invention.
图9至图12是本发明某些实施方式的衍射光学元件的导电电极的线路示意图。9 to 12 are schematic circuit diagrams of conductive electrodes of a diffractive optical element according to some embodiments of the present invention.
图13是本发明某些实施方式的衍射光学元件的结构示意图。Fig. 13 is a schematic structural diagram of a diffractive optical element according to some embodiments of the present invention.
图14是本发明某些实施方式的衍射光学元件的导电电极的线路示意图。Fig. 14 is a schematic circuit diagram of a conductive electrode of a diffractive optical element according to some embodiments of the present invention.
图15是本发明某些实施方式的衍射光学元件的结构示意图。Fig. 15 is a schematic structural diagram of a diffractive optical element according to some embodiments of the present invention.
图16和图17是本发明某些实施方式的准直元件的结构示意图。Fig. 16 and Fig. 17 are schematic structural diagrams of collimating elements in some embodiments of the present invention.
图18至图21是本发明某些实施方式的准直元件的导电电极的线路示意图。18 to 21 are schematic circuit diagrams of the conductive electrodes of the collimation element according to some embodiments of the present invention.
图22至图25是本发明某些实施方式的准直元件的导电电极的线路示意图。22 to 25 are schematic circuit diagrams of the conductive electrodes of the collimation element according to some embodiments of the present invention.
图26是本发明某些实施方式的准直元件的结构示意图。Fig. 26 is a schematic structural diagram of a collimating element in some embodiments of the present invention.
图27是本发明某些实施方式的准直元件的导电电极的线路示意图。Figure 27 is a schematic diagram of the wiring of the conductive electrodes of the collimating element according to some embodiments of the present invention.
图28是本发明某些实施方式的准直元件的结构示意图。Fig. 28 is a schematic structural diagram of a collimating element in some embodiments of the present invention.
图29是本发明某些实施方式的激光投射模组破裂的检测方法的流程示意图。FIG. 29 is a schematic flowchart of a method for detecting a crack in a laser projection module according to some embodiments of the present invention.
图30是本发明某些实施方式的激光投射模组的结构示意图。Fig. 30 is a schematic structural diagram of a laser projection module in some embodiments of the present invention.
图31至图33是本发明某些实施方式的激光投射模组的部分结构示意图。31 to 33 are partial structural schematic diagrams of the laser projection module in some embodiments of the present invention.
图34是本发明某些实施方式的深度相机的结构示意图。Fig. 34 is a schematic structural diagram of a depth camera in some embodiments of the present invention.
图35是本发明某些实施方式的电子装置的结构示意图。Fig. 35 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.
具体实施方式Detailed ways
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通信；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or indirectly connected through an intermediary, may be internal communication between two components or interaction between two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
请一并参阅图1和图2，本发明提供一种激光投射模组100破裂的检测方法。激光投射模组100包括激光发射器10、准直元件20、衍射光学元件30和处理器40。激光发射器10用于发射激光。准直元件20用于准直激光发射器10发射的激光。衍射光学元件30用于衍射经准直元件20准直后的激光以形成激光图案。其中，准直元件20和/或衍射光学元件30上形成有透光导电膜21/31(图3和图16所示)，其中，可以是仅准直元件20上形成有透光导电膜21(图16所示)；或者，仅衍射光学元件30上形成有透光导电膜31(如图3所示)，或者，准直元件20上形成有透光导电膜21，同时衍射光学元件30上形成有透光导电膜31。透光导电膜上21上设有导电电极22(图16所示)，透光导电膜31上设有导电电极32(图3所示)，导电电极22及导电电极32通电后可输出电信号。Please refer to FIG. 1 and FIG. 2 together. The present invention provides a method for detecting the rupture of the laser projection module 100 . The laser projection module 100 includes a laser emitter 10 , a collimator 20 , a diffractive optical element 30 and a processor 40 . The laser emitter 10 is used to emit laser light. The collimation element 20 is used to collimate the laser light emitted by the laser emitter 10 . The diffractive optical element 30 is used to diffract the laser collimated by the collimating element 20 to form a laser pattern. Wherein, a light-transmitting conductive film 21/31 (shown in FIG. 3 and FIG. 16 ) is formed on the collimation element 20 and/or the diffractive optical element 30, wherein, only the light-transmitting conductive film 21 is formed on the collimation element 20 (shown in FIG. 16 ); or, only the diffractive optical element 30 is formed with a light-transmitting conductive film 31 (as shown in FIG. 3 ), or, the collimating element 20 is formed with a light-transmitting conductive film 21, and the diffractive optical element 30 A light-transmitting conductive film 31 is formed thereon. A conductive electrode 22 (as shown in FIG. 16 ) is provided on the light-transmitting conductive film 21, and a conductive electrode 32 (shown in FIG. 3 ) is provided on the light-transmitting conductive film 31. The conductive electrode 22 and the conductive electrode 32 can output electrical signals after being energized. .
激光投射模组100破裂的检测方法包括：The detection method for the rupture of the laser projection module 100 includes:
02：获取导电电极22、和/或导电电极32通电后输出的电信号；02: Obtain the electrical signal output by the conductive electrode 22 and/or the conductive electrode 32 after being energized;
04：判断电信号是否处于预设范围内；和04: Judging whether the electrical signal is within a preset range; and
06：在电信号不处于预设范围内时确定准直元件20和/或衍射光学元件30破裂。06: Determine that the collimation element 20 and/or the diffractive optical element 30 are broken when the electrical signal is not within the preset range.
本发明还提供一种激光投射模组100。步骤02、步骤04和步骤06均可以由激光投射模组100中的处理器40执行。也即是说，处理器40可用于获取导电电极22、和/或导电电极32通电后输出的电信号、判断电信号是否处于预设范围内、以及在电信号不处于预设范围内时确定准直元件20和/或衍射光学元件30破裂。The present invention also provides a laser projection module 100 . Step 02 , step 04 and step 06 can all be executed by the processor 40 in the laser projection module 100 . That is to say, the processor 40 can be used to obtain the electrical signal output by the conductive electrode 22 and/or the conductive electrode 32 after being energized, determine whether the electrical signal is within a preset range, and determine whether the electrical signal is not within a preset range. The collimating element 20 and/or the diffractive optical element 30 breaks.
具体地，准直元件20上形成有透光导电膜21，当准直元件20处于完好状态时，透光导电膜21的电阻较小，在此状态下给透光导电膜21上的导电电极22通电，即施加一定大小的电压，则此时处理器40获取到的导电电极22输出的电流较大。而当准直元件20破裂时，形成在准直元件20上的透光导电膜21也会碎裂，此时碎裂位置处的透光导电膜21的电阻阻值接近无穷大，在此状态下给透光导电膜21上的导电电极22通电，处理器40获取到的导电电极22输出的电流较小。因此，第一种方式：可以根据电信号(即电流)与准直元件20未破裂状态下检测到的电信号(即电流)之间差异大小来判断透光导电膜21是否破裂，进一步地，可根据透光导电膜21的状态来判断准直元件20是否破裂，即，若透光导电膜21破裂，则表明准直元件20也破裂；若透光导电膜21未破裂，则表明准直元件20也未破裂。第二种方式：可根据准直元件20上导电电极22通电后输出的电信号直接判断准直元件20是否破裂，具体地，准直元件20未破裂时，导电电极22输出的电信号不在预设范围内时就确定透光导电膜21破裂，进而判断准直元件20也破裂；若导电电极22输出的电信号在预设范围内时就确定透光导电膜21未破裂，进而判断准直元件20也未破裂。Specifically, a light-transmitting conductive film 21 is formed on the collimating element 20. When the collimating element 20 is in a good state, the resistance of the light-transmitting conductive film 21 is small, and in this state, the conductive electrode on the light-transmitting conductive film 21 22 is energized, that is, a certain voltage is applied, and the current output by the conductive electrode 22 obtained by the processor 40 at this time is relatively large. And when the collimation element 20 is broken, the light-transmitting conductive film 21 formed on the collimation element 20 will also be fragmented, and the resistance value of the light-transmitting conductive film 21 at the fragmentation position is close to infinity at this moment, in this state When the conductive electrode 22 on the light-transmitting conductive film 21 is energized, the output current of the conductive electrode 22 obtained by the processor 40 is relatively small. Therefore, the first way: whether the light-transmitting conductive film 21 is broken can be judged according to the difference between the electrical signal (ie, the current) and the electrical signal (ie, the current) detected in the unbroken state of the collimation element 20, and further, Whether the collimation element 20 is broken can be judged according to the state of the light-transmitting conductive film 21, that is, if the light-transmitting conductive film 21 is broken, it indicates that the collimation element 20 is also broken; if the light-transmitting conductive film 21 is not broken, it indicates that the collimation Element 20 was also not broken. The second way: according to the electrical signal output by the conductive electrode 22 on the collimation element 20, it can be directly judged whether the collimation element 20 is broken. When it is within the preset range, it is determined that the light-transmitting conductive film 21 is broken, and then it is judged that the collimation element 20 is also broken; Element 20 was also not broken.
同样地，衍射光学元件30上也形成有透光导电膜31，当衍射光学元件30处于完好状态时，透光导电膜31的电阻较小，在此状态下给透光导电膜31上的导电电极32通电，即施加一定大小的电压，则此时处理器40获取到的导电电极32输出的电流较大。而当衍射光学元件30破裂时，形成在衍射光学元件30上的透光导电膜31也会碎裂，此时碎裂位置处的透光导电膜31的电阻阻值接近无穷大，在此状态下给透光导电膜31上的导电电极32通电，处理器40获取到的导电电极32输出的电流较小。因此，第一种方式：可以根据电信号(即电流)与衍射光学元件30未破裂状态下检测到的电信号(即电流)之间差异大小来判断透光导电膜31是否破裂，进一步地，可根据透光导电膜31的状态来判衍射光学元件30是否破裂，即，若透光导电膜31破裂，则表明衍射光学元件30也破裂；若透光导电膜31未破裂，则表明衍射光学元件30也未破裂。第二种方式：可根据衍射光学元件30上导电电极32通电后输出的电信号直接判断衍射光学元件30是否破裂，具体地，衍射光学元件30未破裂时，导电电极32输出的电信号不在预设范围内时就确定透光导电膜31破裂，进而判断衍射光学元件30也破裂；若导电电极32输出的电信号在预设范围内时就确定透光导电膜31未破裂，进而判断衍射光学元件30也未破裂。Similarly, a light-transmitting conductive film 31 is also formed on the diffractive optical element 30. When the diffractive optical element 30 is in a good state, the resistance of the light-transmitting conductive film 31 is relatively small. When the electrode 32 is energized, that is, a voltage of a certain magnitude is applied, the current output by the conductive electrode 32 acquired by the processor 40 at this time is relatively large. And when the diffractive optical element 30 breaks, the light-transmitting conductive film 31 formed on the diffractive optical element 30 will also break, and at this time the resistance value of the light-transmitting conductive film 31 at the cracked position is close to infinity, in this state When the conductive electrode 32 on the light-transmitting conductive film 31 is energized, the output current of the conductive electrode 32 obtained by the processor 40 is relatively small. Therefore, the first way: whether the light-transmitting conductive film 31 is broken can be judged according to the difference between the electrical signal (ie, current) and the electrical signal (ie, current) detected in the unbroken state of the diffractive optical element 30, and further, Whether the diffractive optical element 30 is broken can be judged according to the state of the light-transmitting conductive film 31, that is, if the light-transmitting conductive film 31 is broken, it indicates that the diffractive optical element 30 is also broken; Element 30 was also not broken. The second method: according to the electrical signal output by the conductive electrode 32 on the diffractive optical element 30, it can be directly judged whether the diffractive optical element 30 is broken. When it is within the preset range, it is determined that the light-transmitting conductive film 31 is broken, and then it is judged that the diffractive optical element 30 is also broken; Element 30 was also not broken.
当准直元件20上形成有透光导电膜21，同时衍射光学元件30上形成有透光导电膜31时，处理器40能够区分出透光导电膜21与透光导电膜31，由此能够分辨出是准直元件20破裂、或者是衍射光学元件30破裂、或者是准直元件20与衍射光学元件30均破裂。When the light-transmitting conductive film 21 is formed on the collimating element 20 and the light-transmitting conductive film 31 is formed on the diffractive optical element 30, the processor 40 can distinguish the light-transmitting conductive film 21 from the light-transmitting conductive film 31, thereby being able to It is determined whether the collimation element 20 is broken, or the diffractive optical element 30 is broken, or both the collimator element 20 and the diffractive optical element 30 are broken.
另外，透光导电膜21可以通过电镀等方式形成在准直元件20的表面，透光导电膜31也可以通过电镀等方式形成在衍射光学元件30的表面。透光导电膜21、透光导电膜31的材质可以是氧化铟锡(Indium tin oxide，ITO)、纳米银丝、金属银线中的任意一种。氧化铟锡、纳米银丝、金属银线均具有良好的透光率及导电性能，可实现通电后的电信号输出，同时不会对准直元件20和衍射光学元件30的出光光路产生遮挡。In addition, the light-transmitting conductive film 21 can be formed on the surface of the collimating element 20 by electroplating or the like, and the light-transmitting conductive film 31 can also be formed on the surface of the diffractive optical element 30 by electroplating or the like. The material of the light-transmitting conductive film 21 and the light-transmitting conductive film 31 may be any one of indium tin oxide (Indium tin oxide, ITO), nano-silver wire, and metallic silver wire. Indium tin oxide, nano-silver wire, and metal silver wire all have good light transmittance and electrical conductivity, and can realize electrical signal output after electrification, and will not block the light output path of the collimating element 20 and the diffractive optical element 30 at the same time.
本发明实施方式的激光投射模组100和激光投射模组100破裂的检测方法通过在准直元件20上设置透光导电膜21和导电电极22、和/或在衍射光学元件30上设置透光导电膜31和导电电极32，再根据导电电极22、和/或导电电极32输出的电信号判断准直元件20和/或衍射光学元件30是否破裂。如此，可检测出激光投射模组100是否完好，并在检测到激光投射模组100破裂时，可选择不开启激光投射模组100、或者及时关闭激光投射模组100投射的激光、或者减小激光投射模组100的发光功率，以避免激光投射模组100破裂后，激光投射模组100投射出的激光的能量过高，对用户的眼睛产生危害的问题，提升用户使用的安全性。The laser projection module 100 and the laser projection module 100 crack detection method according to the embodiment of the present invention are provided by disposing a light-transmitting conductive film 21 and a conductive electrode 22 on the collimating element 20, and/or setting a light-transmitting film 21 on the diffractive optical element 30. The conductive film 31 and the conductive electrode 32 determine whether the collimation element 20 and/or the diffractive optical element 30 are broken according to the electrical signal output by the conductive electrode 22 and/or the conductive electrode 32 . In this way, it can be detected whether the laser projection module 100 is intact, and when the laser projection module 100 is detected to be broken, you can choose not to open the laser projection module 100, or turn off the laser projected by the laser projection module 100 in time, or reduce the The luminous power of the laser projection module 100 is to avoid the problem that the energy of the laser projected by the laser projection module 100 is too high after the laser projection module 100 breaks, causing harm to the user's eyes, and to improve the safety of the user.
请一并参阅图3和图4，在某些实施方式中，衍射光学元件30包括相背的衍射入射面301和衍射出射面302。当衍射光学元件30上形成有透光导电膜31时，透光导电膜31为单层，透光导电膜31可以设置在衍射入射面301(如图3所示)上，也可以设置在衍射出射面302上(如图4所示)。由于衍射光学元件30的衍射入射面301是凹凸不平的，因此，将透光导电膜31设置在衍射出射面302上的制作工艺较为简单。另外，衍射光学元件30的衍射入射面301为衍射光栅，衍射光栅破裂时可能导致出射的激光能量过强而危害用户的眼睛，但也存在出射的激光能量较低的情况，而由于衍射光栅的破裂，衍射光学元件30衍射的激光图案已发生变化，此时激光投射模组100已无法正常使用。因此，也可将透光导电膜31设置在衍射入射面301上，使透光导电膜31直接接触衍射光栅，从而提升衍射光学元件30破裂检测的准确性。Please refer to FIG. 3 and FIG. 4 together. In some embodiments, the diffractive optical element 30 includes a diffractive incident surface 301 and a diffractive output surface 302 opposite to each other. When a light-transmitting conductive film 31 is formed on the diffractive optical element 30, the light-transmitting conductive film 31 is a single layer, and the light-transmitting conductive film 31 can be arranged on the diffractive incident surface 301 (as shown in FIG. on the exit surface 302 (as shown in FIG. 4 ). Since the diffractive incident surface 301 of the diffractive optical element 30 is uneven, the manufacturing process of disposing the light-transmitting conductive film 31 on the diffractive outgoing surface 302 is relatively simple. In addition, the diffractive incident surface 301 of the diffractive optical element 30 is a diffractive grating. When the diffractive grating breaks, the emitted laser energy may be too strong and endanger the user's eyes. If it breaks, the laser pattern diffracted by the diffractive optical element 30 has changed, and at this time the laser projection module 100 cannot be used normally. Therefore, the light-transmitting conductive film 31 may also be disposed on the diffractive incident surface 301 , so that the light-transmitting conductive film 31 directly contacts the diffraction grating, thereby improving the accuracy of crack detection of the diffractive optical element 30 .
进一步地，请一并参阅图5至图8，透光导电膜31为单层，设置在衍射光学元件30的衍射入射面301或衍射出射面302上。透光导电膜31上设置的导电电极32为单条，导电电极32包括衍射输入端321和衍射输出端322，衍射输入端321和衍射输出端322与处理器40连接并形成导电回路。其中，导电电极32的排布方式有多种：例如，衍射输入端321和衍射输出端322的连线方向(即为导电电极32的延伸方向)为透光导电膜31的长度方向(如图5所示)，或者衍射输入端321和衍射输出端322的连线方向为透光导电膜31的宽度方向(如图6所示)，或者衍射输入端321和衍射输出端322的连线方向为透光导电膜31的对角线方向(如图7和图8所示)。无论导电电极32的排布方式是上述的哪种方式，导电电极32都能跨越整个透光导电膜31，可以较为准确地检测透光导电膜31是否破裂。Further, please refer to FIG. 5 to FIG. 8 together. The light-transmitting conductive film 31 is a single layer and is disposed on the diffractive incident surface 301 or the diffractive outgoing surface 302 of the diffractive optical element 30 . The conductive electrode 32 provided on the light-transmitting conductive film 31 is a single strip. The conductive electrode 32 includes a diffraction input terminal 321 and a diffraction output terminal 322. The diffraction input terminal 321 and the diffraction output terminal 322 are connected to the processor 40 and form a conductive circuit. Wherein, there are many ways to arrange the conductive electrodes 32: for example, the connection direction of the diffraction input end 321 and the diffraction output end 322 (that is, the extension direction of the conductive electrode 32) is the length direction of the light-transmitting conductive film 31 (as shown in FIG. 5), or the connection direction of the diffraction input end 321 and the diffraction output end 322 is the width direction of the light-transmitting conductive film 31 (as shown in Figure 6), or the connection direction of the diffraction input end 321 and the diffraction output end 322 is the diagonal direction of the light-transmitting conductive film 31 (as shown in FIG. 7 and FIG. 8 ). No matter which way the conductive electrodes 32 are arranged, the conductive electrodes 32 can span the entire light-transmitting conductive film 31 , and it is possible to more accurately detect whether the light-transmissive conductive film 31 is broken.
或者，请一并参阅图9至图12，透光导电膜31为单层，设置在衍射光学元件30的衍射入射面301或衍射出射面302上。透光导电膜31上设置的导电电极32为多条，多条导电电极32互不相交，每条导电电极32包括衍射输入端321和衍射输出端322。每个衍射输入端321及每个衍射输出端322与处理器40连接以形成一条导电回路，由此，多条导电电极32的衍射输入端321及衍射输出端322分别与处理器40连接以形成多条导电回路。其中，多条导电电极32的排布方式有多种：例如，每个衍射输入端321和每个衍射输出端322的连线方向(即为导电电极32的延伸方向)为透光导电膜31的长度方向，多条导电电极32沿透光导电膜31的长度方向平行间隔设置(如图9所示)；或者，每个衍射输入端321和每个衍射输出端322的连线方向为透光导电膜31的宽度方向，多条导电电极32沿透光导电膜31的宽度方向平行间隔设置(如图10所示)；或者，每个衍射输入端321和每个衍射输出端322的连线方向为透光导电膜31的对角线方向，多条导电电极32沿透光导电膜31的对角线方向平行间隔设置(如图11和图12所示)。无论导电电极32的排布方式是上述的哪种形式，相较于设置单条导电电极32而言，多条导电电极32能够占据透光导电膜31较多的面积，相对应地可以输出更多的电信号。由于仅设置单条导电电极32时，有可能存在衍射光学元件30破裂的位置与单条导电电极32的位置相隔甚远，而对单条导电电极32影响不大，该单条导电电极32输出的电信号仍在预设范围内的情况，检测准确度不高。而本实施方式中，多条导电电极32占据透光导电膜31较多的面积，相对应地可以输出更多的电信号，处理器40可根据较多的电信号更为精确地判断透光导电膜31是否破裂，进一步地判断衍射光学元件30是否破裂，提升衍射光学元件30破裂检测的准确性。Alternatively, please refer to FIGS. 9 to 12 together. The light-transmitting conductive film 31 is a single layer, and is disposed on the diffractive incident surface 301 or the diffractive outgoing surface 302 of the diffractive optical element 30 . There are multiple conductive electrodes 32 disposed on the light-transmitting conductive film 31 , and the multiple conductive electrodes 32 do not intersect each other. Each conductive electrode 32 includes a diffraction input terminal 321 and a diffraction output terminal 322 . Each diffraction input end 321 and each diffraction output end 322 are connected to the processor 40 to form a conductive loop, thus, the diffraction input ends 321 and the diffraction output ends 322 of a plurality of conductive electrodes 32 are respectively connected to the processor 40 to form Multiple conductive loops. Among them, there are many ways to arrange the conductive electrodes 32: for example, the connection direction of each diffraction input end 321 and each diffraction output end 322 (that is, the extension direction of the conductive electrodes 32) is the light-transmitting conductive film 31 In the length direction of the light-transmitting conductive film 31, a plurality of conductive electrodes 32 are arranged in parallel and at intervals along the length direction of the light-transmitting conductive film 31 (as shown in FIG. 9 ); In the width direction of the photoconductive film 31, a plurality of conductive electrodes 32 are arranged in parallel and at intervals along the width direction of the light-transmitting conductive film 31 (as shown in FIG. 10 ); The line direction is the diagonal direction of the light-transmitting conductive film 31 , and a plurality of conductive electrodes 32 are arranged in parallel and spaced along the diagonal direction of the light-transmitting conductive film 31 (as shown in FIG. 11 and FIG. 12 ). Regardless of the above-mentioned arrangement of the conductive electrodes 32, compared with a single conductive electrode 32, multiple conductive electrodes 32 can occupy more area of the light-transmitting conductive film 31, and correspondingly can output more electrical signal. When only a single conductive electrode 32 is provided, there may be a very large distance between the cracked position of the diffractive optical element 30 and the position of the single conductive electrode 32, which has little influence on the single conductive electrode 32, and the electrical signal output by the single conductive electrode 32 remains the same. In the case of the preset range, the detection accuracy is not high. However, in this embodiment, the plurality of conductive electrodes 32 occupy more areas of the light-transmitting conductive film 31, correspondingly, more electrical signals can be output, and the processor 40 can more accurately determine the light-transmitting area based on more electrical signals. Whether the conductive film 31 is broken, further determines whether the diffractive optical element 30 is broken, and improves the accuracy of crack detection of the diffractive optical element 30 .
或者，请一并参阅图13和图14，透光导电膜31为单层的架桥结构，设置在衍射光学元件30的衍射入射面301(图未示)或衍射出射面302(如图13所示)上。具体地，导电电极32包括多条平行设置的第一衍射导电电极323、多条平行设置的第二衍射导电电极324和多条架桥衍射导电电极325。多条第一衍射导电电极323与多条第二衍射导电电极324纵横交错，每条第一衍射导电电极323连续不间断，每条所述第二衍射导电电极324在与对应的多条第一衍射导电电极323的交错处断开并与多条第一衍射导电电极323不导通。每条架桥衍射导电电极325将对应的第二衍射导电电极324的断开处导通。架桥衍射导电电极325与第一衍射导电电极323的交错位置设有衍射绝缘体326。每条第一衍射导电电极323的两端与处理器40连接以形成一条导电回路，每条第二衍射导电电极324的两端与处理器40连接以形成一条导电回路，由此，多条第一衍射导电电极323的两端与处理器40均分别连接以形成多条导电回路，多条第二衍射导电电极324的两端与处理器40均分别连接以形成多条导电回路。其中，衍射绝缘体326的材料可为具有良好的透光性和绝缘性的有机材料，衍射绝缘体326可采用丝印或黄光制程等方式进行制作。此处的透光导电膜31可为多条，多条透光导电膜31构成单层，且分别与导电电极32对应，透光导电膜31为多条，多条透光导电膜31平行间隔设置，导电电极32贯穿设置在透光导电膜31内，形成第一衍射导电电极323和第二衍射导电电极324。多条第一衍射导电电极323与多条第二衍射导电电极324纵横交错指的是多条第一衍射导电电极323与多条第二衍射导电电极324相互垂直交错，即第一衍射导电电极323与第二衍射导电电极324的夹角为90度。当然，在其他实施方式中，多条第一衍射导电电极323与多条第二衍射导电电极324纵横交错还可以是多条第一衍射导电电极323与多条第二衍射导电电极324相互倾斜交错。使用时，处理器40可以同时对多条第一衍射导电电极323和多条第二衍射导电电极324通电以得到多个电信号，或者，处理器40可依次对多条第一衍射导电电极323和多条第二衍射导电电极324通电以得到多个电信号，随后，处理器40再根据电信号来判断透光导电膜31是否破裂。请结合图13，当检测到编号为①的第一衍射导电电极323输出的电信号不在预设范围内，编号为③的第二衍射导电电极324输出的电信号不在预设范围内时，说明透光导电膜31在编号为①的第一衍射导电电极323与编号为③的第二衍射导电电极324交错处破裂，则衍射光学元件30与透光导电膜31破裂位置对应的位置也破裂。如此，通过架桥结构的单层的透光导电膜31可以更为精确地检测衍射光学元件30是否破裂以及破裂的具体位置。Or, please refer to Fig. 13 and Fig. 14 together, the light-transmitting conductive film 31 is a single-layer bridging structure, and is arranged on the diffractive incident surface 301 (not shown) or the diffractive outgoing surface 302 (as shown in Fig. 13 ) of the diffractive optical element 30. shown) above. Specifically, the conductive electrodes 32 include a plurality of first diffractive conductive electrodes 323 arranged in parallel, a plurality of second diffractive conductive electrodes 324 arranged in parallel, and a plurality of bridging diffractive conductive electrodes 325 . A plurality of first diffractive conductive electrodes 323 and a plurality of second diffractive conductive electrodes 324 criss-cross, each first diffractive conductive electrode 323 is continuous and uninterrupted, and each second diffractive conductive electrode 324 is connected to the corresponding plurality of first diffractive conductive electrodes. Intersections of the diffractive conductive electrodes 323 are disconnected and are not connected to the plurality of first diffractive conductive electrodes 323 . Each bridging diffractive conductive electrode 325 conducts the disconnection of the corresponding second diffractive conductive electrode 324 . Diffractive insulators 326 are provided at alternate positions between the bridging diffractive conductive electrodes 325 and the first diffractive conductive electrodes 323 . Both ends of each first diffractive conductive electrode 323 are connected to the processor 40 to form a conductive loop, and both ends of each second diffractive conductive electrode 324 are connected to the processor 40 to form a conductive loop. Both ends of a diffractive conductive electrode 323 are respectively connected to the processor 40 to form multiple conductive loops, and both ends of the multiple second diffractive conductive electrodes 324 are respectively connected to the processor 40 to form multiple conductive loops. Wherein, the material of the diffractive insulator 326 may be an organic material with good light transmittance and insulation properties, and the diffractive insulator 326 may be manufactured by silk screen or yellow light process. The light-transmitting conductive film 31 here can be multiple, and the multiple light-transmitting conductive films 31 form a single layer, and correspond to the conductive electrodes 32 respectively. The conductive electrode 32 is arranged through the transparent conductive film 31 to form a first diffractive conductive electrode 323 and a second diffractive conductive electrode 324 . A plurality of first diffractive conductive electrodes 323 and a plurality of second diffractive conductive electrodes 324 criss-cross means that a plurality of first diffractive conductive electrodes 323 and a plurality of second diffractive conductive electrodes 324 are perpendicular to each other, that is, the first diffractive conductive electrodes 323 The included angle with the second diffractive conductive electrode 324 is 90 degrees. Of course, in other embodiments, the plurality of first diffractive conductive electrodes 323 and the plurality of second diffractive conductive electrodes 324 crisscross, or the plurality of first diffractive conductive electrodes 323 and the plurality of second diffractive conductive electrodes 324 are obliquely interlaced. . When in use, the processor 40 can energize multiple first diffractive conductive electrodes 323 and multiple second diffractive conductive electrodes 324 at the same time to obtain multiple electrical signals, or the processor 40 can sequentially energize multiple first diffractive conductive electrodes 323 The plurality of second diffractive conductive electrodes 324 are energized to obtain a plurality of electrical signals, and then the processor 40 judges whether the light-transmitting conductive film 31 is broken according to the electrical signals. Please refer to Fig. 13, when it is detected that the electrical signal output by the first diffractive conductive electrode 323 numbered ① is not within the preset range, and the electrical signal output by the second diffractive conductive electrode 324 numbered ③ is not within the preset range, explain The light-transmitting conductive film 31 breaks at the intersection of the first diffractive conductive electrode 323 numbered ① and the second diffractive conductive electrode 324 numbered ③, and the diffractive optical element 30 also breaks at the position corresponding to the cracked light-transmitting conductive film 31. In this way, through the single-layer light-transmitting conductive film 31 of the bridging structure, it is possible to more accurately detect whether the diffractive optical element 30 is cracked and the specific location of the crack.
请一并参阅图14及图15，在某些实施方式中，衍射光学元件30包括相背的衍射入射面301和衍射出射面302。衍射光学元件30上形成有透光导电膜31时，透光导电膜31包括设置在衍射入射面301上的第一衍射导电膜311和设置在衍射出射面302上的第二衍射导电膜312。第一衍射导电膜311上设置有多条平行设置的第一衍射导电电极323，第二衍射导电膜312上设置有多条平行设置的第二衍射导电电极324。第一衍射导电电极323在衍射出射面302上的投影与第二衍射导电电极324纵横交错，每条第一衍射导电电极323的两端与处理器40连接以形成一条导电回路，每条第二衍射导电电极324的两端与处理器40连接以形成一条导电回路，由此，多条第一衍射导电电极323的两端与处理器40均分别连接以形成多条导电回路，多条第二衍射导电电极324的两端与处理器40均分别连接以形成多条导电回路。其中，第一衍射导电电极323在衍射出射面302上的投影与第二衍射导电电极324纵横交错指的是多条第一衍射导电电极323与多条第二衍射导电电极324在空间上相互垂直交错，即第一衍射导电电极323在衍射出射面302上的投影与第二衍射导电电极324的夹角为90度。当然，在其他实施方式中，多条第一衍射导电电极323在衍射出射面302上的投影与多条第二衍射导电电极324纵横交错还可以是多条第一衍射导电电极323与多条第二衍射导电电极324在空间上相互倾斜交错。使用时，处理器40可以同时对多条第一衍射导电电极323和多条第二衍射导电电极324通电以得到多个电信号，或者，处理器40可依次对多条第一衍射导电电极323和多条第二衍射导电电极324通电以得到多个电信号，随后，处理器40再根据电信号来判断透光导电膜31是否破裂，进一步判断衍射光学元件30是否破裂。同上，根据多条第一衍射导电电极323及多条第二衍射导电电极324输出的电信号即可精确地检测衍射光学元件30是否破裂以及破裂的具体位置。Please refer to FIG. 14 and FIG. 15 together. In some embodiments, the diffractive optical element 30 includes a diffractive incident surface 301 and a diffractive outgoing surface 302 . When the light-transmitting conductive film 31 is formed on the diffractive optical element 30 , the light-transmitting conductive film 31 includes a first diffractive conductive film 311 disposed on the diffractive incident surface 301 and a second diffractive conductive film 312 disposed on the diffractive exit surface 302 . The first diffractive conductive film 311 is provided with a plurality of first diffractive conductive electrodes 323 arranged in parallel, and the second diffractive conductive film 312 is provided with a plurality of second diffractive conductive electrodes 324 arranged in parallel. The projections of the first diffractive conductive electrodes 323 on the diffractive exit surface 302 are criss-crossed with the second diffractive conductive electrodes 324, and the two ends of each first diffractive conductive electrode 323 are connected with the processor 40 to form a conductive circuit, and each second diffractive conductive electrode 323 Both ends of the diffractive conductive electrodes 324 are connected to the processor 40 to form a conductive loop, thus, both ends of the plurality of first diffractive conductive electrodes 323 are respectively connected to the processor 40 to form multiple conductive loops, and the plurality of second Both ends of the diffractive conductive electrode 324 are respectively connected to the processor 40 to form multiple conductive loops. Wherein, the projection of the first diffractive conductive electrodes 323 on the diffractive exit surface 302 and the second diffractive conductive electrodes 324 criss-cross means that the plurality of first diffractive conductive electrodes 323 and the plurality of second diffractive conductive electrodes 324 are perpendicular to each other in space. Staggered, that is, the angle between the projection of the first diffractive conductive electrode 323 on the diffractive exit surface 302 and the second diffractive conductive electrode 324 is 90 degrees. Of course, in other embodiments, the projections of the plurality of first diffractive conductive electrodes 323 on the diffractive exit surface 302 and the plurality of second diffractive conductive electrodes 324 may also be the plurality of first diffractive conductive electrodes 323 and the plurality of second diffractive conductive electrodes 323 . The two diffractive conductive electrodes 324 are obliquely interlaced with each other in space. When in use, the processor 40 can energize multiple first diffractive conductive electrodes 323 and multiple second diffractive conductive electrodes 324 at the same time to obtain multiple electrical signals, or the processor 40 can sequentially energize multiple first diffractive conductive electrodes 323 The second diffractive conductive electrodes 324 are energized to obtain multiple electrical signals, and then the processor 40 judges whether the light-transmitting conductive film 31 is broken according to the electrical signals, and further determines whether the diffractive optical element 30 is broken. As above, according to the electrical signals output by the multiple first diffractive conductive electrodes 323 and the multiple second diffractive conductive electrodes 324 , it is possible to accurately detect whether the diffractive optical element 30 is cracked and the specific location of the crack.
请一并参阅图16和图17，在某些实施方式中，准直元件20包括相背的准直入射面201和准直出射面202。当准直元件20上形成有透光导电膜21时，透光导电膜21为单层，透光导电膜21可以设置在准直入射面201(如图16所示)上，也可以设置在准直出射面202上(如图17所示)。Please refer to FIG. 16 and FIG. 17 together. In some embodiments, the collimating element 20 includes a collimated incident surface 201 and a collimated outgoing surface 202 opposite to each other. When a light-transmitting conductive film 21 is formed on the collimation element 20, the light-transmitting conductive film 21 is a single layer, and the light-transmitting conductive film 21 can be arranged on the collimating incident surface 201 (as shown in Figure 16 ), or can be arranged on on the collimated exit surface 202 (as shown in FIG. 17 ).
进一步地，请一并参阅图18至图21，透光导电膜21为单层，设置在准直元件20的准直入射面201或准直出射面202上。透光导电膜21上设置的导电电极22为单条，导电电极22包括准直输入端221和准直输出端222，准直输入端221和准直输出端222与处理器40连接并形成导电回路。其中，导电电极22的排布方式有多种：例如，准直输入端221和准直输出端222的连线方向(即为导电电极22的延伸方向)为透光导电膜21的长度方向(如图18所示)，或者准直输入端221和准直输出端222的连线方向为透光导电膜21的宽度方向(如图19所示)，或者准直输入端221和准直输出端222的连线方向为透光导电膜21的对角线方向(如图20和图21所示)。无论导电电极22的排布方式是上述的哪种方式，导电电极22都能跨越整个透光导电膜21，可以较为准确地检测透光导电膜21是否破裂。Further, please refer to FIG. 18 to FIG. 21 , the light-transmitting conductive film 21 is a single layer, and is disposed on the collimated incident surface 201 or the collimated outgoing surface 202 of the collimating element 20 . The conductive electrode 22 provided on the light-transmitting conductive film 21 is a single strip. The conductive electrode 22 includes a collimation input terminal 221 and a collimation output terminal 222. The collimation input terminal 221 and the collimation output terminal 222 are connected to the processor 40 and form a conductive circuit. . Wherein, there are many ways to arrange the conductive electrodes 22: for example, the connection direction of the collimation input terminal 221 and the collimation output terminal 222 (that is, the extending direction of the conductive electrodes 22) is the length direction of the light-transmitting conductive film 21 ( As shown in Figure 18), or the connection direction of the collimation input end 221 and the collimation output end 222 is the width direction of the light-transmitting conductive film 21 (as shown in Figure 19), or the collimation input end 221 and the collimation output end The connection direction of the end 222 is the diagonal direction of the light-transmitting conductive film 21 (as shown in FIG. 20 and FIG. 21 ). No matter which way the conductive electrodes 22 are arranged, the conductive electrodes 22 can span the entire light-transmitting conductive film 21 , and it is possible to more accurately detect whether the light-transmissive conductive film 21 is broken.
或者，请一并参阅图22至图25，透光导电膜21为单层，设置在准直元件20的准直入射面201或准直出射面202上。透光导电膜21上设置的导电电极22为多条，多条导电电极22互不相交，每条导电电极22包括准直输入端221和准直输出端222。每个准直输入端221及每个准直输出端222与处理器40连接以形成一条导电回路，由此，多条导电电极22的准直输入端221及准直输出端222分别与处理器40连接以形成多条导电回路。其中，多条导电电极22的排布方式有多种：例如，每个准直输入端221和每个准直输出端222的连线方向(即为导电电极22的延伸方向)为透光导电膜21的长度方向，多条导电电极22沿透光导电膜21的长度方向平行间隔设置(如图22所示)；或者，每个准直输入端221和每个准直输出端222的连线方向为透光导电膜21的宽度方向，多条导电电极22沿透光导电膜21的宽度方向平行间隔设置(如图23所示)；或者，每个准直输入端221和每个准直输出端222的连线方向为透光导电膜21的对角线方向，多条导电电极22沿透光导电膜21的对角线方向平行间隔设置(如图24和图25所示)。无论导电电极22的排布方式是上述的那种方式，相较于设置单条导电电极22而言，多条导电电极22能够占据透光导电膜21较多的面积，相应地可以输出更多的电信号。由于仅设置单条导电电极22时，有可能存在准直元件20破裂的位置与单条导电电极22的位置相隔甚远，而对单条导电电极22影响不大，该单条导电电极22输出的电信号仍在预设范围内的情况，检测准确度不高。而本实施方式中，多条导电电极22占据透光导电膜21较多的面积，相对应地可以输出更多的电信号，处理器40可根据较多的电信号更为精确地判断透光导电膜21是否破裂，进一步地判断准直元件20是否破裂，提升准直元件20破裂检测的准确性。Alternatively, please refer to FIG. 22 to FIG. 25 together. The light-transmitting conductive film 21 is a single layer and is disposed on the collimated incident surface 201 or the collimated outgoing surface 202 of the collimating element 20 . There are multiple conductive electrodes 22 arranged on the light-transmitting conductive film 21 , and the multiple conductive electrodes 22 do not intersect each other. Each conductive electrode 22 includes a collimation input terminal 221 and a collimation output terminal 222 . Each collimation input terminal 221 and each collimation output terminal 222 are connected to the processor 40 to form a conductive loop, thus, the collimation input terminals 221 and the collimation output terminals 222 of the plurality of conductive electrodes 22 are respectively connected to the processor 40 connections to form multiple conductive loops. Among them, there are many ways to arrange the conductive electrodes 22: for example, the connection direction of each collimation input terminal 221 and each collimation output terminal 222 (that is, the extending direction of the conductive electrodes 22) is light-transmitting and conductive In the length direction of the film 21, a plurality of conductive electrodes 22 are arranged in parallel and spaced along the length direction of the light-transmitting conductive film 21 (as shown in FIG. 22 ); The line direction is the width direction of the light-transmitting conductive film 21, and a plurality of conductive electrodes 22 are arranged in parallel and spaced along the width direction of the light-transmitting conductive film 21 (as shown in FIG. 23 ); or, each collimating input terminal 221 and each collimating The connection direction of the straight output terminal 222 is the diagonal direction of the transparent conductive film 21, and a plurality of conductive electrodes 22 are arranged in parallel and spaced along the diagonal direction of the transparent conductive film 21 (as shown in FIG. 24 and FIG. 25 ). Regardless of the arrangement of the conductive electrodes 22 in the above-mentioned manner, compared with the arrangement of a single conductive electrode 22, multiple conductive electrodes 22 can occupy more area of the light-transmitting conductive film 21, and correspondingly can output more electric signal. When only a single conductive electrode 22 is provided, the position where the collimation element 20 is broken may be far away from the position of the single conductive electrode 22, but the single conductive electrode 22 has little influence, and the electrical signal output by the single conductive electrode 22 is still In the case of the preset range, the detection accuracy is not high. However, in this embodiment, the plurality of conductive electrodes 22 occupy more areas of the light-transmitting conductive film 21, correspondingly, more electrical signals can be output, and the processor 40 can more accurately judge the light-transmitting area based on more electrical signals. Whether the conductive film 21 is broken, further determines whether the collimation element 20 is broken, and improves the accuracy of the detection of the collimation element 20 breakage.
或者，请一并参阅图26和图27，透光导电膜21为单层的架桥结构，设置在准直元件20的准直入射面201(图未示)或准直出射面202(如图26所示)上。具体地，导电电极22包括多条平行设置的第一准直导电电极223、多条平行设置的第二准直导电电极224和多条架桥准直导电电极225。多条第一准直导电电极223与多条第二准直导电电极224纵横交错，每条第一准直导电电极223连续不间断，每条所述第二准直导电电极224在与对应的多条第一准直导电电极223的交错处断开并与多条第一准直导电电极223不导通。每条架桥准直导电电极225将对应的第二准直导电电极224的断开处导通。架桥准直导电电极225与第一准直导电电极223的交错位置设有准直绝缘体226。每条第一准直导电电极223的两端与处理器40连接以形成一条导电回路，每条第二准直导电电极224的两端处理器40连接以形成一条导电回路，由此，多条第一准直导电电极223的两端与处理器40均分别连接以形成多条导电回路，多条第二准直导电电极224的两端与处理器均分别40连接以形成多条导电回路。其中，准直绝缘体226的材料可为具有良好的透光性和绝缘性的有机材料，准直绝缘体226可采用丝印或黄光制程等方式进行制作。此处的透光导电膜21可为多条，多条透光导电膜21构成单层，且分别与导电电极22对应，透光导电膜21为多条，多条透光导电膜21平行间隔设置，导电电极22贯穿设置在透光导电膜内，形成第一准直导电电极223和第二准直导电电极224。多条第一准直导电电极223与多条第二准直导电电极224纵横交错指的是多条第一准直导电电极223与多条第二准直导电电极224相互垂直交错，即第一准直导电电极223与第二准直导电电极224的夹角为90度。当然，在其他实施方式中，多条第一准直导电电极223与多条第二准直导电电极224纵横交错还可以是多条第一准直导电电极223与多条第二准直导电电极224相互倾斜交错。使用时，处理器40可以同时对多条第一准直导电电极223和多条第二准直导电电极224通电以得到多个电信号，或者，处理器40可依次对多条第一准直导电电极223和多条第二准直导电电极224通电以得到多个电信号，随后，处理器40再根据电信号来判断透光导电膜21是否破裂。请结合图26，当检测到编号为①的第一准直导电电极223输出的电信号不在预设范围内，编号为③的第二准直导电电极224输出的电信号不在预设范围内时，说明透光导电膜21在编号为①的第一准直导电电极223与编号为③的第二准直导电电极224交错处破裂，则准直元件20与透光导电膜21破裂位置对应的位置也破裂。如此，通过架桥结构的单层的透光导电膜可以更为精确地检测准直元件20是否破裂以及破裂的具体位置。Or, please refer to FIG. 26 and FIG. 27 together. The light-transmitting conductive film 21 is a single-layer bridging structure, which is arranged on the collimated incident surface 201 (not shown) or the collimated outgoing surface 202 of the collimating element 20 (such as As shown in Figure 26). Specifically, the conductive electrodes 22 include a plurality of first alignment conductive electrodes 223 arranged in parallel, a plurality of second alignment conductive electrodes 224 arranged in parallel, and a plurality of bridging alignment conductive electrodes 225 . A plurality of first collimating conductive electrodes 223 and a plurality of second collimating conductive electrodes 224 criss-cross, each of the first collimating conductive electrodes 223 is continuous and uninterrupted, and each of the second collimating conductive electrodes 224 is connected to the corresponding Intersections of the multiple first collimating conductive electrodes 223 are disconnected and are not connected to the multiple first collimating conductive electrodes 223 . Each bridging collimating conductive electrode 225 conducts the disconnection of the corresponding second collimating conductive electrode 224 . Alignment insulators 226 are provided at alternate positions between the bridging collimating conductive electrodes 225 and the first collimating conductive electrodes 223 . Both ends of each first collimating conductive electrode 223 are connected to the processor 40 to form a conductive loop, and the two ends of each second collimating conductive electrode 224 are connected to the processor 40 to form a conductive loop, thus, multiple Both ends of the first collimating conductive electrodes 223 are respectively connected to the processor 40 to form multiple conductive loops, and both ends of the multiple second collimating conductive electrodes 224 are respectively connected to the processor 40 to form multiple conductive loops. Wherein, the material of the collimation insulator 226 can be an organic material with good light transmission and insulation properties, and the collimation insulator 226 can be made by silk screen printing or yellow light process. The light-transmitting conductive film 21 here can be multiple, and the multiple light-transmitting conductive films 21 form a single layer, and correspond to the conductive electrodes 22 respectively. The conductive electrode 22 is arranged through the light-transmitting conductive film to form a first alignment conductive electrode 223 and a second alignment conductive electrode 224 . A plurality of first collimating conductive electrodes 223 and a plurality of second collimating conductive electrodes 224 crisscross means that a plurality of first collimating conductive electrodes 223 and a plurality of second collimating conductive electrodes 224 are vertically interlaced, that is, the first The included angle between the collimating conductive electrode 223 and the second collimating conductive electrode 224 is 90 degrees. Certainly, in other implementation manners, multiple first collimating conductive electrodes 223 and multiple second collimating conductive electrodes 224 criss-cross can also be multiple first collimating conductive electrodes 223 and multiple second collimating conductive electrodes 224 obliquely interlaced with each other. When in use, the processor 40 can simultaneously energize multiple first collimating conductive electrodes 223 and multiple second collimating conductive electrodes 224 to obtain multiple electrical signals, or the processor 40 can sequentially energize multiple first collimating conductive electrodes 224. The conductive electrodes 223 and the plurality of second alignment conductive electrodes 224 are energized to obtain a plurality of electrical signals, and then the processor 40 judges whether the light-transmitting conductive film 21 is broken according to the electrical signals. Please refer to Figure 26, when it is detected that the electrical signal output by the first collimated conductive electrode 223 numbered ① is not within the preset range, and the electrical signal output by the second collimated conductive electrode 224 numbered ③ is not within the preset range , indicating that the light-transmitting conductive film 21 breaks at the intersection of the first collimating conductive electrode 223 numbered ① and the second collimating conductive electrode 224 numbered ③, then the alignment element 20 corresponds to the cracking position of the light-transmitting conductive film 21 The location is also broken. In this way, through the single-layer light-transmitting conductive film of the bridging structure, it is possible to more accurately detect whether the collimation element 20 is broken and the specific location of the break.
请一并参阅图27及图28，在某些实施方式中，准直元件20包括相背的准直入射面201和准直出射面202。准直光学元件上形成有透光导电膜21时，透光导电膜21包括设置在准直入射面201上的第一准直导电膜211和设置在准直出射面202上的第二准直导电膜212。第一准直导电膜211上设置有多条平行设置的第一准直导电电极223，第二准直导电膜212上设置有多条平行设置的第二准直导电电极224。第一准直导电电极223在准直出射面202上的投影与第二准直导电电极224纵横交错，每条第一准直导电电极223的两端与处理器40连接以形成一条导电回路，每条第二准直导电电极224的两端与处理器40连接以形成一条导电回路，由此，多条第一准直导电电极223的两端与处理器40均分别连接以形成多条导电回路，多条第二准直导电电极224的两端与处理器40均分别连接以形成多条回路。其中，第一准直导电电极223在准直出射面202上的投影与第二准直导电电极224纵横交错指的是多条第一准直导电电极223与多条第二准直导电电极224在空间上相互垂直交错，即第一准直导电电极223在准直出射面202上的投影与第二准直导电电极224的夹角为90度。当然，在其他实施方式中，多条第一准直导电电极223在准直出射面202上的投影与多条第二准直导电电极224纵横交错还可以是多条第一准直导电电极223与多条第二准直导电电极224在空间上相互倾斜交错。使用时，处理器40可以同时对多条第一准直导电电极223和多条第二准直导电电极224通电以得到多个电信号，或者，处理器40可依次对多条第一准直导电电极223和多条第二准直导电电极224通电以得到多个电信号，随后，处理器40再根据电信号来判断透光导电膜21是否破裂，进一步地判断准直元件20是否破裂。同上，根据多条第一准直导电电极223及多条第二准直导电电极224输出的电信号即可精确地检测准直元件20是否破裂以及破裂的具体位置。Please refer to FIG. 27 and FIG. 28 together. In some embodiments, the collimating element 20 includes a collimated incident surface 201 and a collimated outgoing surface 202 opposite to each other. When the light-transmitting conductive film 21 is formed on the collimating optical element, the light-transmitting conductive film 21 includes a first collimating conductive film 211 arranged on the collimating incident surface 201 and a second collimating conductive film 211 arranged on the collimating outgoing surface 202. Conductive film 212. The first collimating conductive film 211 is provided with a plurality of first collimating conductive electrodes 223 arranged in parallel, and the second collimating conductive film 212 is provided with a plurality of second collimating conductive electrodes 224 arranged in parallel. The projection of the first collimating conductive electrode 223 on the collimating exit surface 202 is criss-crossed with the second collimating conductive electrode 224, and the two ends of each first collimating conductive electrode 223 are connected to the processor 40 to form a conductive loop, Both ends of each second collimating conductive electrode 224 are connected to the processor 40 to form a conductive loop, thus, both ends of multiple first collimating conductive electrodes 223 are respectively connected to the processor 40 to form multiple conductive loops. Loops, both ends of the plurality of second collimating conductive electrodes 224 are respectively connected to the processor 40 to form a plurality of loops. Wherein, the projections of the first collimating conductive electrodes 223 on the collimating emission surface 202 and the second collimating conductive electrodes 224 intersect with each other refer to multiple first collimating conductive electrodes 223 and multiple second collimating conductive electrodes 224 They are vertically interlaced with each other in space, that is, the included angle between the projection of the first collimating conductive electrode 223 on the collimating emitting surface 202 and the second collimating conductive electrode 224 is 90 degrees. Of course, in other embodiments, the projections of the multiple first collimating conductive electrodes 223 on the collimating exit surface 202 and the multiple second collimating conductive electrodes 224 may also be multiple first collimating conductive electrodes 223 The plurality of second collimating conductive electrodes 224 are obliquely interlaced with each other in space. When in use, the processor 40 can simultaneously energize multiple first collimating conductive electrodes 223 and multiple second collimating conductive electrodes 224 to obtain multiple electrical signals, or the processor 40 can sequentially energize multiple first collimating conductive electrodes 224. The conductive electrodes 223 and multiple second collimating conductive electrodes 224 are energized to obtain multiple electrical signals, and then the processor 40 judges whether the transparent conductive film 21 is broken according to the electrical signals, and further determines whether the collimation element 20 is broken. As above, according to the electrical signals output by the multiple first collimating conductive electrodes 223 and the multiple second collimating conductive electrodes 224 , it is possible to accurately detect whether the collimating element 20 is broken and the specific location of the crack.
在某些实施方式中，步骤02获取导电电极22、和/或导电电极32通电后输出的电信号的步骤是在激光投射模组100开启前进行的。具体地，每次激光投射模组100开启前，处理器40均会依次或同时对衍射光学元件30上的导电电极32以及准直元件20上的导电电极22进行通电，并获取导电电极22和导电电极32输出的电信号，再根据电信号判断衍射光学元件30和准直元件20是否破裂。在检测到衍射光学元件30和准直元件20中的任意一者破裂时，均不开启激光投射模组100，从而避免激光投射模组100投射的激光的能量过高，危害用户眼睛的问题。In some embodiments, the step 02 of obtaining the electrical signal output by the conductive electrode 22 and/or the conductive electrode 32 after being energized is performed before the laser projection module 100 is turned on. Specifically, each time before the laser projection module 100 is turned on, the processor 40 will sequentially or simultaneously energize the conductive electrodes 32 on the diffractive optical element 30 and the conductive electrodes 22 on the collimation element 20, and obtain the conductive electrodes 22 and The electrical signal output by the conductive electrode 32 is used to judge whether the diffractive optical element 30 and the collimating element 20 are broken according to the electrical signal. When any one of the diffractive optical element 30 and the collimating element 20 is detected to be broken, the laser projection module 100 is not turned on, so as to avoid the problem that the energy of the laser projected by the laser projection module 100 is too high and endangers the user's eyes.
请参阅图29，在某些实施方式中，本发明实施方式的激光投射模组100破裂的检测方法还包括：Please refer to FIG. 29 , in some embodiments, the method for detecting the rupture of the laser projection module 100 according to the embodiment of the present invention further includes:
011：检测激光投射模组100的运动速度；和011: detecting the movement speed of the laser projection module 100; and
012：判断运动速度是否大于预定速度，在激光投射模组100的运动速度大于预定速度时，执行获取导电电极22、和/或导电电极32通电后输出的电信号的步骤。012: Determine whether the moving speed is greater than the predetermined speed, and when the moving speed of the laser projection module 100 is greater than the predetermined speed, perform the step of obtaining the electrical signal output by the conductive electrode 22 and/or the conductive electrode 32 after being powered on.
请再参阅图2，在某些实施方式中，步骤011和步骤012均可以由处理器40实现。也即是说，处理器40还可用于检测激光投射模组100的运动速度，判断运动速度是否大于预定速度，以及在激光投射模组100的运动速度大于预定速度时，执行获取导电电极22、和/或导电电极32通电后输出的电信号的步骤。Please refer to FIG. 2 again. In some implementation manners, both step 011 and step 012 can be implemented by the processor 40 . That is to say, the processor 40 can also be used to detect the moving speed of the laser projection module 100, determine whether the moving speed is greater than a predetermined speed, and perform acquisition of the conductive electrode 22, And/or the step of outputting the electrical signal after the conductive electrode 32 is energized.
其中可以采用速度传感器检测激光投射模组100的运动速度，速度传感器可以装在激光投射模组100中，也可以是与激光投射模组100一起安装在电子装置3000(图35所示)中，速度传感器检测电子装置3000的运动速度，进一步可得到激光投射模组100的运动速度。当激光投射模组100的运动速度较大时，表明此时激光投射模组100可能出现摔落的情况，此时，处理器40依次或同时对衍射光学元件30上的导电电极32以及准直元件20上的导电电极22进行通电，并获取导电电极22和导电电极32输出的电信号，再根据电信号判断衍射光学元件30和准直元件20是否破裂。在检测到衍射光学元件30和准直元件20中的任意一者破裂时，就确定激光投射模组100破裂。如此，无需在每一次使用激光投射模组100时均进行激光投射模组100破裂的检测，可以减小激光投射模组100的功耗。Wherein, a speed sensor can be used to detect the moving speed of the laser projection module 100, and the speed sensor can be installed in the laser projection module 100, or can be installed together with the laser projection module 100 in the electronic device 3000 (shown in FIG. 35 ), The speed sensor detects the moving speed of the electronic device 3000 , and further obtains the moving speed of the laser projection module 100 . When the movement speed of the laser projection module 100 is relatively high, it indicates that the laser projection module 100 may fall at this time. The conductive electrode 22 on the element 20 is energized, and the electrical signals output by the conductive electrode 22 and the conductive electrode 32 are obtained, and then it is judged whether the diffractive optical element 30 and the collimating element 20 are broken according to the electrical signal. When any one of the diffractive optical element 30 and the collimation element 20 is detected to be broken, it is determined that the laser projection module 100 is broken. In this way, it is not necessary to detect the crack of the laser projection module 100 every time the laser projection module 100 is used, and the power consumption of the laser projection module 100 can be reduced.
请再参阅图2，在某些实施方式中，本发明实施方式的激光投射模组100还包括镜筒组件50和基板组件60，镜筒组件50设置在基板组件60上并与基板组件60共同组成收容腔54。基板组件60包括基板61及承载在基板61上的电路板62。镜筒组件50包括镜筒51及保护罩52。镜筒51包括顶壁511及自顶壁511延伸的环形的周壁512，周壁512设置在基板组件60上，顶壁511开设有与收容腔54连通的通光孔513。保护罩52设置在顶壁511上。保护罩52包括开设有出光通孔523的挡板521及自挡板521延伸的环形侧壁522。衍射光学元件30承载在顶壁511上并收容在保护罩52内。衍射光学元件30的相背两侧分别与保护罩52及顶壁511抵触，挡板521包括靠近通光孔513的抵触面53，衍射光学元件30与抵触面53抵触。Please refer to FIG. 2 again. In some embodiments, the laser projection module 100 of the embodiment of the present invention further includes a lens barrel assembly 50 and a substrate assembly 60. The lens barrel assembly 50 is arranged on the substrate assembly 60 and is in common with the substrate assembly 60 A housing chamber 54 is formed. The substrate assembly 60 includes a substrate 61 and a circuit board 62 carried on the substrate 61 . The lens barrel assembly 50 includes a lens barrel 51 and a protective cover 52 . The lens barrel 51 includes a top wall 511 and an annular peripheral wall 512 extending from the top wall 511 . The peripheral wall 512 is disposed on the substrate assembly 60 . The top wall 511 defines a light hole 513 communicating with the receiving cavity 54 . The protective cover 52 is disposed on the top wall 511 . The protection cover 52 includes a baffle 521 having a light exit hole 523 and an annular sidewall 522 extending from the baffle 521 . The diffractive optical element 30 is carried on the top wall 511 and accommodated in the protective cover 52 . Two opposite sides of the diffractive optical element 30 are in contact with the protective cover 52 and the top wall 511 respectively. The baffle 521 includes an opposing surface 53 close to the light hole 513 , and the diffractive optical element 30 is in contact with the opposing surface 53 .
具体地，衍射光学元件30包括相背的衍射入射面301和衍射出射面302。衍射光学元件30承载在顶壁511上，衍射出射面302与挡板521的靠近通光孔513的表面(抵触面53)抵触，衍射入射面301与顶壁511抵触。通光孔513与收容腔54对准，出光通孔523与通光孔513对准。顶壁511、侧壁522及挡板521与衍射光学元件30抵触，从而防止衍射光学元件30沿出光方向从保护罩52内脱落。在某些实施方式中，保护罩52通过胶水70粘贴在顶壁511上。Specifically, the diffractive optical element 30 includes a diffractive incident surface 301 and a diffractive output surface 302 opposite to each other. The diffractive optical element 30 is carried on the top wall 511 , the diffractive exit surface 302 collides with the surface of the baffle plate 521 near the light hole 513 (contradictory surface 53 ), and the diffractive incident surface 301 collides with the top wall 511 . The light through hole 513 is aligned with the receiving cavity 54 , and the light output through hole 523 is aligned with the light through hole 513 . The top wall 511 , the side wall 522 and the baffle 521 interfere with the diffractive optical element 30 , thereby preventing the diffractive optical element 30 from falling out of the protective cover 52 along the light emitting direction. In some embodiments, the protective cover 52 is attached to the top wall 511 by glue 70 .
请继续参阅图2，在某些实施方式中，准直元件20包括光学部26及环绕光学部26设置的安装部25，准直元件20包括位于准直元件20相背两侧的准直入射面201和准直出射面202，光学部26包括两个位于准直元件20相背两侧的曲面，安装部25与顶壁511抵触，光学部26的其中一个曲面伸入通光孔513内。Please continue to refer to FIG. 2. In some embodiments, the collimating element 20 includes an optical part 26 and a mounting part 25 arranged around the optical part 26. surface 201 and collimating exit surface 202, the optical part 26 includes two curved surfaces located on the opposite sides of the collimation element 20, the installation part 25 is in conflict with the top wall 511, and one of the curved surfaces of the optical part 26 extends into the light hole 513 .
在组装上述的激光投射模组100时，沿着光路从镜筒组件50的周壁512的底端依次向收容腔54内放入准直元件20、及安装好激光发射器10的基板组件60。激光发射器10可以先安装在基板组件60上，然后再将安装有激光发射器10的基板组件60一起与镜筒组件50结合。逆着光路的方向将衍射光学元件30承载在顶壁511上，然后将保护罩52安装在顶壁511上，从而使衍射光学元件30收容在保护罩52内。如此，激光投射模组100安装简单。在其他实施方式中，也可以先将衍射光学元件30倒转设置在保护罩52内，然后再将衍射光学元件30及保护罩52一起安装在顶壁511上。此时，衍射光学元件30的衍射出射面302与抵触面53抵触，衍射入射面301与顶壁511抵触并与光学部26的准直出射面202相对，光学部26的准直入射面201与激光发射器10相对。如此，激光投射模组100的安装更加简单。When assembling the above-mentioned laser projection module 100, put the collimation element 20 and the substrate assembly 60 with the laser emitter 10 installed into the housing cavity 54 sequentially from the bottom end of the peripheral wall 512 of the lens barrel assembly 50 along the optical path. The laser emitter 10 can be installed on the substrate assembly 60 first, and then the substrate assembly 60 on which the laser emitter 10 is installed is combined with the lens barrel assembly 50 . The diffractive optical element 30 is carried on the top wall 511 against the direction of the optical path, and then the protective cover 52 is installed on the top wall 511 , so that the diffractive optical element 30 is accommodated in the protective cover 52 . In this way, the laser projection module 100 is easy to install. In other implementation manners, the diffractive optical element 30 may also be installed upside down in the protective cover 52 first, and then the diffractive optical element 30 and the protective cover 52 are installed on the top wall 511 together. At this time, the diffractive outgoing surface 302 of the diffractive optical element 30 is in contact with the collision surface 53, the diffractive incident surface 301 is in contact with the top wall 511 and is opposite to the collimated outgoing surface 202 of the optical part 26, and the collimated incident surface 201 of the optical part 26 is in contact with the collimated incident surface 202 of the optical part 26. The laser emitters 10 face each other. In this way, the installation of the laser projection module 100 is simpler.
在某些实施方式中，激光发射器10可以是垂直腔面发射激光器(Vertical CavitySurface Emitting Laser,VCSEL)或者边发射激光器(edge-emitting laser，EEL)。其中，边发射激光器可为分布反馈式激光器(Distributed Feedback Laser，DFB)。In some embodiments, the laser emitter 10 may be a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL) or an edge-emitting laser (edge-emitting laser, EEL). Wherein, the edge-emitting laser may be a distributed feedback laser (Distributed Feedback Laser, DFB).
请结合图30，当激光发射器10为边发射激光器时，激光发射器10整体呈柱状，激光发射器10远离基板组件60的一个端面形成发光面11，激光从发光面11发出，发光面朝向准直元件20。激光发射器10固定在基板组件60上。具体地，请结合图31，激光发射器10可以通过封胶15粘结在基板组件60上，例如激光发射器10的与发光面11相背的一面粘结在基板组件60上。请结合图32，激光发射器10的连接面12也可以粘接在基板组件60上，封胶15包裹住四周的连接面12。此时，封胶15可以为导热胶。以将激光发射器10工作产生的热量传导致基板组件60上。激光投射模组100采用边发射激光器时，一方面边发射激光器较VCSEL阵列的温飘较小，另一方面，由于边发射激光器为单点发光结构，无需设计阵列结构，制作简单，激光投射模组100的光源的成本较低。Please refer to Fig. 30, when the laser emitter 10 is a side-emitting laser, the laser emitter 10 is in the shape of a column as a whole, and one end surface of the laser emitter 10 away from the substrate assembly 60 forms a light-emitting surface 11, and the laser light is emitted from the light-emitting surface 11, and the light-emitting surface faces Collimation element 20. The laser emitter 10 is fixed on the substrate assembly 60 . Specifically, referring to FIG. 31 , the laser emitter 10 can be bonded to the substrate assembly 60 through the sealant 15 , for example, the side of the laser emitter 10 opposite to the light-emitting surface 11 is bonded to the substrate assembly 60 . Please refer to FIG. 32 , the connecting surface 12 of the laser emitter 10 can also be glued on the substrate assembly 60 , and the sealing glue 15 wraps the surrounding connecting surface 12 . At this time, the sealing glue 15 may be a heat-conducting glue. The heat generated by the operation of the laser emitter 10 is transferred to the substrate assembly 60 . When the laser projection module 100 adopts an edge-emitting laser, on the one hand, the temperature drift of the edge-emitting laser is smaller than that of the VCSEL array; The cost of the light sources of group 100 is low.
分布反馈式激光器的激光在传播时，经过光栅结构的反馈获得功率的增益，要提高分布反馈式激光器的功率，需要通过增大注入电流和/或增加分布反馈式激光器的长度，由于增大注入式电流会使得分布式反馈激光器的功耗增大并且出现发热严重的问题，因此，为了保证分布反馈式激光器能够正常工作，需要增加分布反馈式激光器的长度，导致分布反馈式激光器一般呈细长条结果。当边发射激光器的发光面11朝向准直元件20时，边发射激光器呈竖直放置，由于边发射激光器的细长条结构，边发射激光器容易出现跌落、移位或晃动等意外。When the laser of the distributed feedback laser is propagating, the power gain is obtained through the feedback of the grating structure. To increase the power of the distributed feedback laser, it is necessary to increase the injection current and/or increase the length of the distributed feedback laser. Due to the increased injection The current will increase the power consumption of the distributed feedback laser and cause serious heating problems. Therefore, in order to ensure the normal operation of the distributed feedback laser, it is necessary to increase the length of the distributed feedback laser, resulting in the distributed feedback laser generally being slender. results. When the light-emitting surface 11 of the side-emitting laser faces the collimation element 20, the side-emitting laser is placed vertically. Due to the slender structure of the side-emitting laser, the side-emitting laser is prone to accidents such as falling, shifting or shaking.
请结合图30和图33，激光发射器10也可以采用如图33所示的固定方式固定在基板组件60上。具体地，激光投射模组100包括多个弹性的支撑件16，支撑件16可以固定在基板组件60上，多个支撑件16共同围成收容空间160，激光发射器10收容在收容空间160内并被多个支撑件16支撑住，在安装时可以将激光发射器10直接安装在多个支撑件16之间。在一个例子中，多个支撑件16共同夹持激光发射器10以进一步防止激光发射器10发生晃动。Please refer to FIG. 30 and FIG. 33 , the laser emitter 10 can also be fixed on the substrate assembly 60 in a fixing manner as shown in FIG. 33 . Specifically, the laser projection module 100 includes a plurality of elastic supports 16, the supports 16 can be fixed on the substrate assembly 60, and the plurality of supports 16 together form a storage space 160, and the laser emitter 10 is accommodated in the storage space 160 And it is supported by a plurality of supports 16 , and the laser emitter 10 can be directly installed between the plurality of supports 16 during installation. In one example, multiple supports 16 clamp the laser emitter 10 together to further prevent the laser emitter 10 from shaking.
在某些实施方式中，基板61也可以省去，激光发射器10可以直接固定在电路板62上以减小激光投射模组100的厚度。In some embodiments, the substrate 61 can also be omitted, and the laser emitter 10 can be directly fixed on the circuit board 62 to reduce the thickness of the laser projection module 100 .
请参阅图34，本发明还提供一种深度相机1000。本发明实施方式的深度相机1000包括上述任意一项实施方式所述的激光投射模组100、图像采集器200和处理器40。其中，图像采集器200用于采集经衍射光学元件30衍射后向目标空间中投射的激光图案。处理器40分别与激光投射模组100及图像采集器200连接。处理器40用于处理激光图案以获取深度图像。此处的处理器40可以为激光投射模组100中的处理器40。Please refer to FIG. 34 , the present invention also provides a depth camera 1000 . The depth camera 1000 in the embodiment of the present invention includes the laser projection module 100 , the image collector 200 and the processor 40 described in any one of the above embodiments. Wherein, the image collector 200 is used for collecting the laser pattern projected into the target space after being diffracted by the diffractive optical element 30 . The processor 40 is connected to the laser projection module 100 and the image collector 200 respectively. The processor 40 is used to process the laser pattern to obtain a depth image. The processor 40 here may be the processor 40 in the laser projection module 100 .
具体地，激光投射模组100通过投射窗口801向目标空间中投射激光图案，图像采集器200通过采集窗口802采集被目标物体调制后的激光图案。图像采集器200可为红外相机，处理器40采用图像匹配算法计算出该激光图案中各像素点与参考图案中的对应各个像素点的偏离值，再根据偏离值进一步获得该激光图案的深度图像。其中，图像匹配算法可为数字图像相关(Digital Image Correlation，DIC)算法。当然，也可以采用其它图像匹配算法代替DIC算法。Specifically, the laser projection module 100 projects a laser pattern into the target space through the projection window 801 , and the image collector 200 collects the laser pattern modulated by the target object through the collection window 802 . The image collector 200 can be an infrared camera, and the processor 40 uses an image matching algorithm to calculate the deviation value between each pixel point in the laser pattern and the corresponding pixel point in the reference pattern, and then further obtain the depth image of the laser pattern according to the deviation value . Wherein, the image matching algorithm may be a digital image correlation (Digital Image Correlation, DIC) algorithm. Of course, other image matching algorithms can also be used instead of the DIC algorithm.
本发明实施方式的深度相机1000中的激光投射模组100和通过在准直元件20上设置透光导电膜21和导电电极22、和/或在衍射光学元件30上设置透光导电膜31和导电电极32，再根据导电电极22、和/或导电电极32输出的电信号判断准直元件20和/或衍射光学元件30是否破裂。如此，可检测出激光投射模组100是否完好，并在检测到激光投射模组100破裂时，可选择不开启激光投射模组100、或者及时关闭激光投射模组100投射的激光、或者减小激光投射模组100的发光功率，以避免激光投射模组100破裂后，激光投射模组100投射出的激光的能量过高，对用户的眼睛产生危害的问题，提升用户使用的安全性。The laser projection module 100 in the depth camera 1000 according to the embodiment of the present invention and the light-transmitting conductive film 21 and the conductive electrode 22 are arranged on the collimation element 20, and/or the light-transmitting conductive film 31 and the light-transmitting conductive film 31 are arranged on the diffractive optical element 30 The conductive electrode 32 judges whether the collimation element 20 and/or the diffractive optical element 30 is broken according to the electrical signal output by the conductive electrode 22 and/or the conductive electrode 32 . In this way, it can be detected whether the laser projection module 100 is intact, and when the laser projection module 100 is detected to be broken, you can choose not to open the laser projection module 100, or turn off the laser projected by the laser projection module 100 in time, or reduce the The luminous power of the laser projection module 100 is to avoid the problem that the energy of the laser projected by the laser projection module 100 is too high after the laser projection module 100 breaks, causing harm to the user's eyes, and to improve the safety of the user.
请参阅图35，本发明实施方式的电子装置3000包括壳体2000及上述实施方式的深度相机1000。深度相机1000设置在壳体2000内并从壳体2000暴露以获取深度图像。Referring to FIG. 35 , an electronic device 3000 according to an embodiment of the present invention includes a casing 2000 and the depth camera 1000 according to the above embodiment. The depth camera 1000 is disposed inside the housing 2000 and exposed from the housing 2000 to acquire a depth image.
本发明实施方式的电子装置3000中的激光投射模组100通过在准直元件20上设置透光导电膜21和导电电极22、和/或在衍射光学元件30上设置透光导电膜31和导电电极32，再根据导电电极22、和/或导电电极32输出的电信号判断准直元件20和/或衍射光学元件30是否破裂。如此，可检测出激光投射模组100是否完好，并在检测到激光投射模组100破裂时，可选择不开启激光投射模组100、或者及时关闭激光投射模组100投射的激光、或者减小激光投射模组100的发光功率，以避免激光投射模组100破裂后，激光投射模组100投射出的激光的能量过高，对用户的眼睛产生危害的问题，提升用户使用的安全性。The laser projection module 100 in the electronic device 3000 according to the embodiment of the present invention sets the light-transmitting conductive film 21 and the conductive electrode 22 on the collimation element 20, and/or sets the light-transmitting conductive film 31 and the conductive electrode 22 on the diffractive optical element 30. The electrode 32 is used to determine whether the collimation element 20 and/or the diffractive optical element 30 are broken according to the electrical signal output by the conductive electrode 22 and/or the conductive electrode 32 . In this way, it can be detected whether the laser projection module 100 is intact, and when the laser projection module 100 is detected to be broken, you can choose not to open the laser projection module 100, or turn off the laser projected by the laser projection module 100 in time, or reduce the The luminous power of the laser projection module 100 is to avoid the problem that the energy of the laser projected by the laser projection module 100 is too high after the laser projection module 100 breaks, causing harm to the user's eyes, and to improve the safety of the user.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
流程图中或在此以其他方式描述的任何过程或方法描述可以被理解为，表示包括一个或更多个用于实现特定逻辑功能或过程的步骤的可执行指令的代码的模块、片段或部分，并且本发明的优选实施方式的范围包括另外的实现，其中可以不按所示出或讨论的顺序，包括根据所涉及的功能按基本同时的方式或按相反的顺序，来执行功能，这应被本发明的实施例所属技术领域的技术人员所理解。Any process or method descriptions in flowcharts or otherwise described herein may be understood to represent modules, segments or portions of code comprising one or more executable instructions for implementing specific logical functions or steps of the process , and the scope of preferred embodiments of the invention includes alternative implementations in which functions may be performed out of the order shown or discussed, including substantially concurrently or in reverse order depending on the functions involved, which shall It is understood by those skilled in the art to which the embodiments of the present invention pertain.
在流程图中表示或在此以其他方式描述的逻辑和/或步骤，例如，可以被认为是用于实现逻辑功能的可执行指令的定序列表，可以具体实现在任何计算机可读介质中，以供指令执行系统、装置或设备(如基于计算机的系统、包括处理器的系统或其他可以从指令执行系统、装置或设备取指令并执行指令的系统)使用，或结合这些指令执行系统、装置或设备而使用。就本说明书而言，"计算机可读介质"可以是任何可以包含、存储、通信、传播或传输程序以供指令执行系统、装置或设备或结合这些指令执行系统、装置或设备而使用的装置。计算机可读介质的更具体的示例(非穷尽性列表)包括以下：具有一个或多个布线的电连接部(电子装置)，便携式计算机盘盒(磁装置)，随机存取存储器(RAM)，只读存储器(ROM)，可擦除可编辑只读存储器(EPROM或闪速存储器)，光纤装置，以及便携式光盘只读存储器(CDROM)。另外，计算机可读介质甚至可以是可在其上打印所述程序的纸或其他合适的介质，因为可以例如通过对纸或其他介质进行光学扫描，接着进行编辑、解译或必要时以其他合适方式进行处理来以电子方式获得所述程序，然后将其存储在计算机存储器中。The logic and/or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced listing of executable instructions for implementing logical functions, can be embodied in any computer-readable medium, For use with instruction execution systems, devices, or devices (such as computer-based systems, systems including processors, or other systems that can fetch instructions from instruction execution systems, devices, or devices and execute instructions), or in conjunction with these instruction execution systems, devices or equipment used. For the purposes of this specification, a "computer-readable medium" may be any device that can contain, store, communicate, propagate or transmit a program for use in or in conjunction with an instruction execution system, device or device. More specific examples (non-exhaustive list) of computer-readable media include the following: electrical connection with one or more wires (electronic device), portable computer disk case (magnetic device), random access memory (RAM), Read Only Memory (ROM), Erasable and Editable Read Only Memory (EPROM or Flash Memory), Fiber Optic Devices, and Portable Compact Disc Read Only Memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program can be printed, since the program can be read, for example, by optically scanning the paper or other medium, followed by editing, interpretation or other suitable processing if necessary. The program is processed electronically and stored in computer memory.
应当理解，本发明的各部分可以用硬件、软件、固件或它们的组合来实现。在上述实施方式中，多个步骤或方法可以用存储在存储器中且由合适的指令执行系统执行的软件或固件来实现。例如，如果用硬件来实现，和在另一实施方式中一样，可用本领域公知的下列技术中的任一项或他们的组合来实现：具有用于对数据信号实现逻辑功能的逻辑门电路的离散逻辑电路，具有合适的组合逻辑门电路的专用集成电路，可编程门阵列(PGA)，现场可编程门阵列(FPGA)等。It should be understood that various parts of the present invention can be realized by hardware, software, firmware or their combination. In the embodiments described above, various steps or methods may be implemented by software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented by any one or combination of the following techniques known in the art: Discrete logic circuits, ASICs with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.
本技术领域的普通技术人员可以理解实现上述实施例方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，该程序在执行时，包括方法实施例的步骤之一或其组合。Those of ordinary skill in the art can understand that all or part of the steps carried by the methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium. During execution, one or a combination of the steps of the method embodiments is included.
此外，在本发明各个实施例中的各功能单元可以集成在一个处理模块中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个模块中。上述集成的模块既可以采用硬件的形式实现，也可以采用软件功能模块的形式实现。所述集成的模块如果以软件功能模块的形式实现并作为独立的产品销售或使用时，也可以存储在一个计算机可读取存储介质中。In addition, each functional unit in each embodiment of the present invention may be integrated into one processing module, each unit may exist separately physically, or two or more units may be integrated into one module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software function modules. If the integrated modules are realized in the form of software function modules and sold or used as independent products, they can also be stored in a computer-readable storage medium.
上述提到的存储介质可以是只读存储器，磁盘或光盘等。尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。The storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk, and the like. Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.
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