技术领域technical field
本申请涉及显示技术领域，具体涉及一种背光模组及显示装置。The present application relates to the field of display technology, in particular to a backlight module and a display device.
背景技术Background technique
目前，客户往往要求背光源具有高亮度、低功耗的特点。然而，现有常规的背光源往往不能满足客户要求。特别是，窄边框机种等背光源在经过模组老化(Aging Mode)后，也就是在出货前发生较为严重的变形。这一变形将直接导致导光板(Light Guide Plate,LGP)与发光二极管(Light Emitting Diode,LED)的发光面之间出现0.1mm左右的间隙。上述0.1mm左右的间隙将使得发光二极管的出光亮度降低10％左右，最终背光源的亮度也将无法满足客户的要求。At present, customers often require the backlight to have the characteristics of high brightness and low power consumption. However, existing conventional backlight sources often cannot meet customer requirements. In particular, backlights such as narrow bezel models undergo serious deformation after module aging (Aging Mode), that is, before shipment. This deformation will directly lead to a gap of about 0.1 mm between the light guide plate (Light Guide Plate, LGP) and the light emitting surface of the light emitting diode (Light Emitting Diode, LED). The aforementioned gap of about 0.1 mm will reduce the brightness of the light emitting diode by about 10%, and finally the brightness of the backlight source will not be able to meet the requirements of customers.
发明内容Contents of the invention
本申请解决的技术问题是提供一种背光模组及显示装置，能够有效克服现有背光模组的亮度不足的缺陷。The technical problem solved by the present application is to provide a backlight module and a display device, which can effectively overcome the defect of insufficient brightness of the existing backlight module.
为解决上述技术问题，本申请提供了一种背光模组，包括导光板和位于导光板入光侧的光源；In order to solve the above technical problems, the present application provides a backlight module, including a light guide plate and a light source located on the light incident side of the light guide plate;
所述光源具有发光面，所述导光板具有匹配所述发光面的侧壁，所述光源的发光面与所述导光板的侧壁接触；The light source has a light-emitting surface, the light guide plate has a sidewall matching the light-emitting surface, and the light-emitting surface of the light source is in contact with the sidewall of the light guide plate;
所述光源平行于所述导光板的出光方向的剖切面的面积为a，所述发光面的面积为b，b＞a。The area of the sectional surface of the light source parallel to the light emitting direction of the light guide plate is a, the area of the light emitting surface is b, b>a.
上述背光模组，还可具有如下特点：The above-mentioned backlight module can also have the following characteristics:
所述光源包括LED发光芯片和LED封装结构，所述LED发光芯片位于所述LED封装结构内，所述LED封装结构具有所述发光面，所述LED发光芯片的出光方向指向所述发光面。The light source includes an LED light-emitting chip and an LED package structure, the LED light-emitting chip is located in the LED package structure, the LED package structure has the light-emitting surface, and the light-emitting direction of the LED light-emitting chip points to the light-emitting surface.
上述背光模组，还可具有如下特点：The above-mentioned backlight module can also have the following characteristics:
所述发光面包括凸面，或斜面，所述斜面与所述导光板的出光面的相对面之间的角度为锐角。The light-emitting surface includes a convex surface, or an inclined surface, and an angle between the inclined surface and the surface opposite to the light-emitting surface of the light guide plate is an acute angle.
上述背光模组，还可具有如下特点：The above-mentioned backlight module can also have the following characteristics:
所述斜面与所述导光板的出光面的相对面之间的夹角为θ，75°≤θ≤85°。The included angle between the inclined surface and the opposite surface of the light-emitting surface of the light guide plate is θ, and 75°≤θ≤85°.
上述背光模组，还可具有如下特点：The above-mentioned backlight module can also have the following characteristics:
所述LED发光芯片倾斜设置所述LED封装结构内，所述LED发光芯片的发射头垂直于所述斜面。The LED light-emitting chip is arranged obliquely in the LED packaging structure, and the emitting head of the LED light-emitting chip is perpendicular to the slope.
上述背光模组，还可具有如下特点：The above-mentioned backlight module can also have the following characteristics:
所述凸面设置为弧面，所述弧面的半径为r，10mm≤r≤100mm。The convex surface is set as an arc surface, and the radius of the arc surface is r, 10mm≤r≤100mm.
上述背光模组，还可具有如下特点：The above-mentioned backlight module can also have the following characteristics:
所述凸面设置为拱形面，所述拱形面的拱高为h，2mm≤h≤5mm。The convex surface is configured as an arched surface, and the arch height of the arched surface is h, 2mm≤h≤5mm.
上述背光模组，还可具有如下特点：The above-mentioned backlight module can also have the following characteristics:
所述发光面包括球形面，或者倾斜设置的凸面。The light-emitting surface includes a spherical surface, or a convex surface arranged obliquely.
上述背光模组，还可具有如下特点：The above-mentioned backlight module can also have the following characteristics:
所述发光面为射出成型的发光面。The light-emitting surface is an injection-molded light-emitting surface.
为解决上述技术问题，本申请还提供了一种显示装置，包括前述的背光模组。In order to solve the above technical problems, the present application also provides a display device, including the aforementioned backlight module.
本申请上述技术方案具有如下有益效果：The above-mentioned technical scheme of the present application has the following beneficial effects:
相比于现有技术，本申请通过增大发光面面积，能够有效提升出光亮度，从而解决背光源的亮度不足的缺陷。Compared with the prior art, the present application can effectively improve the brightness of the emitted light by increasing the area of the light-emitting surface, thereby solving the defect of insufficient brightness of the backlight source.
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明实施例而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。Additional features and advantages of the application will be set forth in the description which follows, and in part will be apparent from the description, or can be learned by practice of the invention. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
附图说明Description of drawings
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。The accompanying drawings are used to provide a further understanding of the technical solution of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical solution of the present application, and do not constitute a limitation to the technical solution of the present application.
图1为现有技术中的背光模组的结构示意图；FIG. 1 is a schematic structural view of a backlight module in the prior art;
图2为本发明实施例一的结构示意图；FIG. 2 is a schematic structural view of Embodiment 1 of the present invention;
图3为本发明实施例二的结构示意图；FIG. 3 is a schematic structural diagram of Embodiment 2 of the present invention;
图4为本发明实施例三的结构示意图；FIG. 4 is a schematic structural diagram of Embodiment 3 of the present invention;
图5为本发明实施例四的结构示意图；Fig. 5 is a schematic structural diagram of Embodiment 4 of the present invention;
图示说明：Graphical description:
1-LED封装结构，2-LED发光芯片，3-发光面，4-导光板，5-柔性电路板。1-LED packaging structure, 2-LED light-emitting chip, 3-light-emitting surface, 4-light guide plate, 5-flexible circuit board.
具体实施方式Detailed ways
下文中将结合附图对本申请的实施例进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。Embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other.
如图1所示，现有技术中的背光模组的发光面3为竖直平面，光源包括LED封装结构1和设置在LED封装结构1内的LED发光芯片2，LED封装结构1的下方设置有柔性电路板5。现有的背光模组在经过模组老化后，极易发生较为严重的变形，这将导致导光板4和LED封装结构1的发光面3之间出现0.1mm左右的缝隙。基于该缝隙的存在，背光模组的出光亮度降低10％左右。As shown in Figure 1, the light-emitting surface 3 of the backlight module in the prior art is a vertical plane, the light source includes an LED package structure 1 and an LED light-emitting chip 2 arranged in the LED package structure 1, and the LED package structure 1 is arranged below There is a flexible circuit board 5 . Existing backlight modules are prone to severe deformation after module aging, which will result in a gap of about 0.1 mm between the light guide plate 4 and the light emitting surface 3 of the LED package structure 1 . Based on the existence of the gap, the light output brightness of the backlight module is reduced by about 10%.
为了解决上述背光模组出光亮度不足的缺陷，本发明提供有如下多个实施例。In order to solve the defect of insufficient light output brightness of the above-mentioned backlight module, the present invention provides the following multiple embodiments.
实施例一：Embodiment one:
如图2所示，本发明实施例一提供了一种背光模组，包括导光板4和位于导光板4入光侧的光源，光源具有发光面3，导光板4具有匹配发光面3的侧壁，光源的发光面3与导光板4的侧壁接触；光源平行于导光板4的出光方向的剖切面的面积为a，发光面3的面积为b，b＞a。As shown in FIG. 2 , Embodiment 1 of the present invention provides a backlight module, including a light guide plate 4 and a light source located on the light incident side of the light guide plate 4 , the light source has a light-emitting surface 3 , and the light guide plate 4 has a side matching the light-emitting surface 3 wall, the light-emitting surface 3 of the light source is in contact with the side wall of the light guide plate 4; the area of the cut surface of the light source parallel to the light-emitting direction of the light guide plate 4 is a, and the area of the light-emitting surface 3 is b, where b>a.
现有技术中的光源的发光面3平行于导光板4的出光方向，即发光面3呈图1所示出的竖直状态，发光面3的面积等于光源平行于导光板4的出光方向的剖切面的面积。The light-emitting surface 3 of the light source in the prior art is parallel to the light-emitting direction of the light guide plate 4, that is, the light-emitting surface 3 is in a vertical state as shown in FIG. The area of the cut plane.
相比之下，本实施例中的发光面3的面积大于光源平行于导光板4的出光方向的剖切面的面积，通过增大发光面3的面积，能够在相同背光模组功耗下提升背光模组的出光亮度；上述发光面3的出光角度一般为120°，基于上述发光面3的整体向下倾斜的特性，能够使得之前发光面3呈竖直状态时的漏出光线进入到导光板4的内部，能够有效降低因导光板4与发光面3之间缝隙造成的光损失，以保证背光模组的出光亮度。In contrast, the area of the light-emitting surface 3 in this embodiment is larger than the area of the cut surface of the light source parallel to the light-emitting direction of the light guide plate 4. By increasing the area of the light-emitting surface 3, the power consumption of the backlight module can be improved. The light output brightness of the backlight module; the light output angle of the above-mentioned light-emitting surface 3 is generally 120°. Based on the overall downward slope of the above-mentioned light-emitting surface 3, the leaked light when the previous light-emitting surface 3 is in a vertical state can enter the light guide plate 4, can effectively reduce the light loss caused by the gap between the light guide plate 4 and the light emitting surface 3, so as to ensure the light output brightness of the backlight module.
本实施例中，光源包括LED发光芯片和LED封装结构1，LED发光芯片2位于LED封装结构1内，LED封装结构1具有所述发光面3，LED发光芯片2的出光方向指向发光面3。In this embodiment, the light source includes an LED light-emitting chip and an LED package structure 1, the LED light-emitting chip 2 is located in the LED package structure 1, the LED package structure 1 has the light-emitting surface 3, and the light emitting direction of the LED light-emitting chip 2 points to the light-emitting surface 3.
具体操作中，可将LED发光芯片2设置在独立的胶杯中，然后在进行相应的封装操作，进而构成内部包含有LED发光芯片2的LED封装结构1，LED封装结构1的下方设置有与LED发光芯片2连接的柔性电路板5；上述胶杯和LED封装结构1的设置，能够有效保证LED发光芯片2的结构稳定性；上述LED封装结构1与导光板4的接触面构成发光面3，上述LED发光芯片2的发射头指向发光面3，即LED发光芯片2的出光方向指向发光面3，进而能够有效保证最多的光线射入导光板4内部。In the specific operation, the LED light-emitting chip 2 can be arranged in an independent plastic cup, and then the corresponding packaging operation is performed to form an LED package structure 1 containing the LED light-emitting chip 2 inside. The flexible circuit board 5 connected to the LED light-emitting chip 2; the arrangement of the above-mentioned plastic cup and the LED package structure 1 can effectively ensure the structural stability of the LED light-emitting chip 2; the contact surface of the above-mentioned LED package structure 1 and the light guide plate 4 forms a light-emitting surface 3 The emitting head of the above-mentioned LED light-emitting chip 2 points to the light-emitting surface 3 , that is, the light-emitting direction of the LED light-emitting chip 2 points to the light-emitting surface 3 , thereby effectively ensuring that the most light enters the interior of the light guide plate 4 .
本实施例中，上述光源的发光面3包括斜面，斜面与导光板4的出光面的相对面之间的角度为锐角。In this embodiment, the light-emitting surface 3 of the above-mentioned light source includes a slope, and the angle between the slope and the surface opposite to the light-emitting surface of the light guide plate 4 is an acute angle.
具体操作中，上述倾斜设置的发光面3的面积能够有效大于竖直设置状态下的面积，能够通过增大发光面3的面积提升整体的出光亮度；同时，上述发光面3与导光板4的出光面的相对面之间的角度为锐角，上述锐角的设置，表明上述发光面3的整体向导光板4的出光面的相对面倾斜，能够有效保证大部分的光直接射入导光板4内部，能够进一步的提高背光模组的整体出光亮度。In the specific operation, the area of the above-mentioned inclined light-emitting surface 3 can be effectively larger than the area in the vertically-set state, and the overall light-emitting brightness can be improved by increasing the area of the light-emitting surface 3; at the same time, the above-mentioned light-emitting surface 3 and the light guide plate 4 The angle between the opposite surfaces of the light-emitting surface is an acute angle, and the setting of the above-mentioned acute angle indicates that the whole of the above-mentioned light-emitting surface 3 is inclined to the opposite surface of the light-emitting surface of the light guide plate 4, which can effectively ensure that most of the light directly enters the inside of the light guide plate 4, The overall light emitting brightness of the backlight module can be further improved.
本实施例中，斜面与导光板4的出光面的相对面之间的夹角为θ，75°≤θ≤85°。In this embodiment, the angle between the inclined surface and the surface opposite to the light-emitting surface of the light guide plate 4 is θ, and 75°≤θ≤85°.
具体操作中，斜面与导光板4的出光面的相对面之间夹角θ优选为80°；上述优选的夹角设置，能够保证LED封装结构1具有最佳的发光面3，能够避免斜面角度过大或过小所造成的发光亮度不足的缺陷。In the specific operation, the angle θ between the inclined surface and the opposite surface of the light-emitting surface of the light guide plate 4 is preferably 80°; the above-mentioned preferred angle setting can ensure that the LED package structure 1 has the best light-emitting surface 3, and can avoid the angle of the inclined surface. The defect of insufficient luminous brightness caused by too large or too small.
本实施例中，LED发光芯片2倾斜设置LED封装结构1内，LED发光芯片2的发射头垂直于斜面。In this embodiment, the LED light-emitting chip 2 is arranged obliquely in the LED package structure 1, and the emitting head of the LED light-emitting chip 2 is perpendicular to the slope.
具体操作中，LED发光芯片2与竖直方向之间的夹角为θ’，即上述LED发光芯片2的倾斜角度为θ’，5°≤θ’≤15°，θ’优选为10°；上述优选倾斜角度的设置，旨在能够保证LED发光芯片2的发射头垂直于前述倾斜设置的发光面3，能够保证发光面3射出最多的光线，进而能够有效保证背光模组整体的出光亮度。In specific operations, the angle between the LED light-emitting chip 2 and the vertical direction is θ', that is, the inclination angle of the above-mentioned LED light-emitting chip 2 is θ', 5°≤θ'≤15°, and θ' is preferably 10°; The setting of the preferred inclination angle above is aimed at ensuring that the emitting head of the LED light-emitting chip 2 is perpendicular to the above-mentioned obliquely arranged light-emitting surface 3, and can ensure that the light-emitting surface 3 emits the most light, thereby effectively ensuring the overall light output brightness of the backlight module.
本实施例中，发光面3为射出成型或滚压成型的发光面。In this embodiment, the light-emitting surface 3 is a light-emitting surface formed by injection molding or rolling molding.
具体操作中，上述发光面3可采用射出成型工艺或者热滚压成型工艺，最终均能够实现倾斜设置的发光面3的制备，能够有效满足实际生产需求。In a specific operation, the above-mentioned light-emitting surface 3 may adopt an injection molding process or a hot-rolling forming process, and finally both can realize the preparation of an inclined light-emitting surface 3, which can effectively meet actual production needs.
实施例二：Embodiment two:
本发明实施例二提供了一种背光模组，主体结构与实施例一类似，关于主体结构的具体设置请参见实施例一中的详细记载，此次旨在阐述两者之间的区别。Embodiment 2 of the present invention provides a backlight module, the main structure of which is similar to that of Embodiment 1. Please refer to the detailed records in Embodiment 1 for the specific configuration of the main structure. This time, the purpose is to explain the differences between the two.
如图3所示，本实施例中的发光面3包括凸面，导光板4的侧壁相应设置为凹面。As shown in FIG. 3 , the light emitting surface 3 in this embodiment includes a convex surface, and the sidewall of the light guide plate 4 is correspondingly configured as a concave surface.
具体操作中，上述呈凸面设置的发光面3的面积大于光源平行于导光板4的出光方向的剖切面的面积，通过增大发光面3的面积，能够在相同背光模组功耗下提升背光模组的出光亮度，也能够有效降低因导光板4与发光面3之间缝隙造成的光损失；同时，上述导光板4的入光侧呈凹面设置，能够有效避让相互连接的LED封装结构1；导光板4在组装时，能够有效避免施加在导光板4上的外力对LED封装结构1的发光面3造成的压迫，能够有效保证发光面3的结构稳定性。In specific operations, the area of the above-mentioned light-emitting surface 3 arranged in a convex shape is larger than the area of the cut surface of the light source parallel to the light-emitting direction of the light guide plate 4. By increasing the area of the light-emitting surface 3, the backlight can be improved under the same power consumption of the backlight module. The light output brightness of the module can also effectively reduce the light loss caused by the gap between the light guide plate 4 and the light emitting surface 3; at the same time, the light incident side of the light guide plate 4 is set on a concave surface, which can effectively avoid the interconnected LED packaging structure 1 ; When the light guide plate 4 is assembled, the external force applied to the light guide plate 4 can effectively avoid the oppression caused by the light-emitting surface 3 of the LED package structure 1, and the structural stability of the light-emitting surface 3 can be effectively guaranteed.
本实施例中，上述凸面设置为弧面，弧面的半径为r，10mm≤r≤100mm。In this embodiment, the above-mentioned convex surface is set as an arc surface, and the radius of the arc surface is r, and 10mm≤r≤100mm.
具体操作中，上述凸面沿中心线呈上下对称的结构，LED封装结构1内的LED发光芯片2呈竖直设置，即上述LED发光芯片2的发射头正对上述呈凸面的发光面3，能够保证发光面3射出最多的光线，进而能够有效保证背光模组整体的出光亮度；上述弧面的半径r优选为50mm，上述优选半径的弧面设置，能够保证LED封装结构1具有最佳的发光面3，能够避免弧面的半径过大或过小所造成的发光亮度不足的缺陷。In the specific operation, the above-mentioned convex surface has a symmetrical structure up and down along the center line, and the LED light-emitting chip 2 in the LED packaging structure 1 is vertically arranged, that is, the emitting head of the above-mentioned LED light-emitting chip 2 is facing the above-mentioned convex light-emitting surface 3, which can Ensure that the light-emitting surface 3 emits the most light, thereby effectively ensuring the overall light output brightness of the backlight module; the radius r of the above-mentioned arc surface is preferably 50mm, and the above-mentioned arc surface setting with the preferred radius can ensure that the LED package structure 1 has the best light emission The surface 3 can avoid the defect of insufficient luminous brightness caused by the radius of the arc surface being too large or too small.
本实施例中，发光面3为射出成型的发光面。In this embodiment, the light-emitting surface 3 is an injection-molded light-emitting surface.
具体操作中，上述发光面3采用射出成型工艺制备，能够实现呈凸面的发光面3的便捷制备操作，能够有效克服热滚压工艺的局限性，能够有效满足实际生产需求。In specific operations, the above-mentioned light-emitting surface 3 is prepared by injection molding technology, which can realize the convenient preparation operation of the convex light-emitting surface 3, can effectively overcome the limitations of the hot rolling process, and can effectively meet actual production needs.
实施例三：Embodiment three:
本发明实施例三提供了一种背光模组，主体结构与实施例二类似，关于主体结构的具体设置请参见实施例二中的详细记载，此次旨在阐述两者之间的区别。Embodiment 3 of the present invention provides a backlight module, the main structure of which is similar to that of Embodiment 2. For the specific configuration of the main structure, please refer to the detailed records in Embodiment 2. This time, the purpose is to explain the differences between the two.
如图4所示，本实施例中的发光面3包括凸面，凸面具体设置为拱形面，拱形面的拱高为h，2mm≤h≤5mm。As shown in FIG. 4 , the light-emitting surface 3 in this embodiment includes a convex surface, and the convex surface is specifically configured as an arched surface, and the arch height of the arched surface is h, where 2mm≤h≤5mm.
具体操作中，上述呈拱形面的凸面，具有与实施例二中记载的呈弧面的凸面能够实现的类似技术效果，通过增大发光面3的面积，也能够在相同背光模组功耗下提升背光模组的出光亮度，也能够有效降低因导光板4与发光面3之间缝隙造成的光损失，也能够通过导光板4的凹面侧壁有效保证发光面3的结构稳定性；上述拱高h优选为3mm，上述优选拱高的尺寸设置，能够保证LED封装结构1具有最佳的发光面3，能够避免拱高过大或过小所造成的发光亮度不足的缺陷。In specific operations, the above-mentioned arched convex surface has a similar technical effect to that of the curved convex surface described in Embodiment 2, and by increasing the area of the light-emitting surface 3, the power consumption of the same backlight module can also be reduced. Improving the light output brightness of the backlight module can also effectively reduce the light loss caused by the gap between the light guide plate 4 and the light emitting surface 3, and can also effectively ensure the structural stability of the light emitting surface 3 through the concave side wall of the light guide plate 4; the above The arch height h is preferably 3 mm. The above-mentioned preferred arch height setting can ensure that the LED package structure 1 has the best light-emitting surface 3 and can avoid the defect of insufficient luminous brightness caused by too large or too small arch height.
实施例四：Embodiment four:
本发明实施例四提供了一种背光模组，主体结构与实施例一类似，关于主体结构的具体设置请参见实施例一中的详细记载，此次旨在阐述两者之间的区别。Embodiment 4 of the present invention provides a backlight module, the main structure of which is similar to that of Embodiment 1. For the specific configuration of the main structure, please refer to the detailed records in Embodiment 1. This time, the purpose is to explain the differences between the two.
如图5所示，本实施例中的发光面3包括倾斜设置的凸面。As shown in FIG. 5 , the light emitting surface 3 in this embodiment includes a convex surface arranged obliquely.
具体操作中，上述倾斜设置的凸面，为实施例一与实施例二的复合结构，即在倾斜设置的发光面3的基础上，将发光面3设置为弧面；也能够实现发光面3的面积增大的技术效果，能够有效提升背光模组的出光亮度，同时还能够通过导光板4的凹面侧壁有效保证LED封装结构1的发光面3的结构稳定性；LED发光芯片2的倾斜角度类似于实施例一中的设置角度；上述优选设置的倾斜角度，旨在能够保证LED发光芯片2能够正对发光面3，能够使得发光面3射出最多的光线。In the specific operation, the above-mentioned inclined convex surface is a composite structure of the first embodiment and the second embodiment, that is, on the basis of the inclined light-emitting surface 3, the light-emitting surface 3 is set as an arc surface; the light-emitting surface 3 can also be realized. The technical effect of increasing the area can effectively improve the light output brightness of the backlight module, and at the same time can effectively ensure the structural stability of the light emitting surface 3 of the LED package structure 1 through the concave side wall of the light guide plate 4; the inclination angle of the LED light emitting chip 2 Similar to the installation angle in Embodiment 1; the above preferred inclination angle is designed to ensure that the LED light-emitting chip 2 can face the light-emitting surface 3 so that the light-emitting surface 3 can emit the most light.
本实施例中，上述凸面具体可设置为弧面，弧面的圆心位于LED封装结构1的上部区域，即弧面的圆心所在的平面为a平面，LED封装结构1的中间平面为b平面，a平面位于b平面的上方；上述优选设置的弧面圆心位置，旨在保证更多的光线射入导光板4内部；LED发光芯片2的倾斜角度优选等于实施例一中的LED发光芯片2的倾斜角度θ’，使得LED发光芯片2能够正对发光面3，进而能够有效保证背光模组的整体出光亮度。In this embodiment, the above-mentioned convex surface can be specifically set as an arc surface, and the center of the arc surface is located in the upper area of the LED package structure 1, that is, the plane where the center of the arc surface is located is the a plane, and the middle plane of the LED package structure 1 is the b plane. The a plane is located above the b plane; the above-mentioned preferably set arc center position is designed to ensure that more light enters the inside of the light guide plate 4; the inclination angle of the LED light emitting chip 2 is preferably equal to that of the LED light emitting chip 2 in the first embodiment The inclination angle θ' enables the LED light-emitting chip 2 to face the light-emitting surface 3, thereby effectively ensuring the overall light-emitting brightness of the backlight module.
实施例五：Embodiment five:
本发明实施例五提供了一种背光模组，主体结构与实施例四类似，关于主体结构的具体设置请参见实施例四中的详细记载，此次旨在阐述两者之间的区别。Embodiment 5 of the present invention provides a backlight module, the main structure of which is similar to that of Embodiment 4. For the specific configuration of the main structure, please refer to the detailed records in Embodiment 4. This time, the purpose is to explain the differences between the two.
本实施例中的发光面包括球形面，球形半径优选为50mm；上述呈球形面的发光面，能够在实施例四的基础上，能够进一步增大发光面的面积，进而能够实现更多的光线射入操作，能够有效提升背光模组的出光亮度；其中，上述球形面的球心位于LED封装结构的上部区域，类似于实施例四中弧面的圆心位置；相应LED发光芯片的倾斜角度类似于实施例四中的倾斜角度，上述优选设置的倾斜角度能够使得更多的光线射向导光板内部，进而能够有效提升背光模组的出光亮度。The light-emitting surface in this embodiment includes a spherical surface, and the spherical radius is preferably 50 mm; the above-mentioned light-emitting surface with a spherical surface can further increase the area of the light-emitting surface on the basis of Embodiment 4, and then can realize more light rays. The injection operation can effectively improve the light output brightness of the backlight module; wherein, the spherical center of the spherical surface is located in the upper area of the LED packaging structure, which is similar to the center of the arc surface in Embodiment 4; the inclination angle of the corresponding LED light-emitting chip is similar to Regarding the inclination angle in the fourth embodiment, the above-mentioned preferred inclination angle can make more light enter the inside of the light guide plate, thereby effectively improving the light output brightness of the backlight module.
实施例六：Embodiment six:
本发明实施例六提供了一种显示装置，包括实施例一、实施例二、实施例三、实施例四或实施例五中记载的背光模组。Embodiment 6 of the present invention provides a display device, including the backlight module described in Embodiment 1, Embodiment 2, Embodiment 3, Embodiment 4 or Embodiment 5.
在本申请的描述中，术语“设置”、“相连”、“连接”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, the terms "set", "connected", "connected", "fixed" and so on should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integrated Connection; can be direct or indirect through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
在本说明书的描述中，术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, descriptions of the terms "one embodiment", "some embodiments", "specific embodiments" and the like mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in this application In at least one embodiment or example of . In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
本领域的技术人员应该明白，虽然本发明实施例所揭露的实施方式如上，但所述的内容仅为便于理解本发明实施例而采用的实施方式，并非用以限定本发明实施例。任何本发明实施例所属领域内的技术人员，在不脱离本发明实施例所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本发明实施例的专利保护范围，仍须以所附的权利要求书所界定的范围为准。Those skilled in the art should understand that although the implementation manners disclosed in the embodiments of the present invention are as above, the content described is only the implementation manners adopted to facilitate understanding of the embodiments of the present invention, and is not intended to limit the embodiments of the present invention. Any person skilled in the field of the embodiments of the present invention can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed by the embodiments of the present invention, but the embodiments of the present invention The scope of patent protection must still be subject to the scope defined in the appended claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810157450.XACN108287389A (en) | 2018-02-24 | 2018-02-24 | Backlight module and display device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810157450.XACN108287389A (en) | 2018-02-24 | 2018-02-24 | Backlight module and display device |
| Publication Number | Publication Date |
|---|---|
| CN108287389Atrue CN108287389A (en) | 2018-07-17 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810157450.XAPendingCN108287389A (en) | 2018-02-24 | 2018-02-24 | Backlight module and display device |
| Country | Link |
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| CN (1) | CN108287389A (en) |
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