电子装置electronic device技术领域technical field
本发明涉及消费性电子技术领域，更具体而言，涉及一种电子装置。The present invention relates to the technical field of consumer electronics, and more particularly, to an electronic device.
背景技术Background technique
随着手机支持的功能越来越丰富多样，手机需要设置的功能器件的种类和数量也越来越多，为了实现距离检测、环境光检测与用户的面部3D特征识别等功能，需要在电子设备中配置接近传感器、环境光传感器、红外光摄像头、结构光投射器等功能器件，而为了布置众多的功能器件，会占用手机过多的空间。As the functions supported by mobile phones become more and more diverse, the types and numbers of functional devices that need to be set on mobile phones are also increasing. Proximity sensors, ambient light sensors, infrared light cameras, structured light projectors and other functional devices are configured in the middle of the mobile phone, and in order to arrange many functional devices, it will take up too much space on the mobile phone.
发明内容SUMMARY OF THE INVENTION
本发明实施方式提供一种电子装置。Embodiments of the present invention provide an electronic device.
本发明实施方式的电子装置包括：The electronic device of the embodiment of the present invention includes:
机壳；chassis;
输出模组，所述输出模组设置在所述机壳内，所述输出模组包括封装壳体、结构光投射器、及接近红外灯，所述封装壳体包括封装基板，所述结构光投射器与所述接近红外灯封装在所述封装壳体内并承载在所述封装基板上，所述结构光投射器与所述接近红外灯能够以不同的功率向所述封装壳体外发射红外光线；an output module, the output module is arranged in the casing, the output module includes a package shell, a structured light projector, and a near-infrared lamp, the package shell includes a package substrate, the structured light The projector and the proximity infrared lamp are encapsulated in the encapsulation casing and carried on the encapsulation substrate, and the structured light projector and the proximity infrared lamp can emit infrared light to the outside of the encapsulation casing with different powers ;
振动模组，所述振动模组安装在所述机壳上；和a vibration module mounted on the casing; and
压电元件，所述压电元件与所述振动模组结合并与所述输出模组间隔，所述压电元件用于在被施加电信号时发生形变以使所述振动模组振动。A piezoelectric element, which is combined with the vibration module and is spaced from the output module, and is used for deforming when an electrical signal is applied to make the vibration module vibrate.
在某些实施方式中，所述振动模组包括显示屏及透光的盖板，所述显示屏设置在所述机壳上并与所述机壳共同形成收容腔，所述盖板设置在所述机壳上并位于所述显示屏的远离所述收容腔的一侧，所述显示屏与所述盖板结合，所述机壳开设有相互间隔的机壳接近通孔、机壳结构光通孔、及机壳振动通孔，所述接近红外灯与所述机壳接近通孔对应，所述结构光投射器与所述机壳结构光通孔对应，所述压电元件收容在所述机壳振动通孔内并与所述盖板结合。In some embodiments, the vibration module includes a display screen and a light-transmitting cover plate, the display screen is disposed on the casing and forms a receiving cavity together with the casing, and the cover plate is disposed on the casing. The casing is located on the side of the display screen away from the receiving cavity. The display screen is combined with the cover plate. A light through hole and a casing vibration through hole, the proximity infrared lamp corresponds to the casing proximity through hole, the structured light projector corresponds to the casing structural light through hole, and the piezoelectric element is accommodated in the casing. The casing vibrates in the through hole and is combined with the cover plate.
在某些实施方式中，所述压电元件和所述显示屏通过接合件附接至所述盖板上。In certain embodiments, the piezoelectric element and the display screen are attached to the cover plate by a joint.
在某些实施方式中，所述输出模组还包括芯片，所述结构光投射器与所述接近红外灯形成在一片所述芯片上。In some embodiments, the output module further includes a chip, and the structured light projector and the near-infrared lamp are formed on a piece of the chip.
在某些实施方式中，所述封装壳体还包括封装侧壁及封装顶部，所述封装侧壁自所述封装基板延伸并连接在所述封装顶部与所述封装基板之间，所述封装顶部形成有结构光窗口及接近窗口，所述结构光窗口与所述结构光投射器对应，所述接近窗口与所述接近红外灯对应。In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewalls extend from the package substrate and are connected between the package top and the package substrate, the package A structured light window and a proximity window are formed on the top, the structured light window corresponds to the structured light projector, and the proximity window corresponds to the proximity infrared lamp.
在某些实施方式中，所述输出模组还包括接近灯透镜，所述接近灯透镜设置在所述封装壳体内并与所述接近红外灯对应。In some embodiments, the output module further includes a proximity lamp lens, and the proximity lamp lens is disposed in the package housing and corresponds to the proximity infrared lamp.
在某些实施方式中，所述输出模组还包括金属遮挡板，所述金属遮挡板位于所述封装壳体内并位于所述结构光投射器与所述接近红外灯之间。In some embodiments, the output module further includes a metal shielding plate, and the metal shielding plate is located in the package housing and between the structured light projector and the proximity infrared lamp.
在某些实施方式中，所述输出模组上形成有接地引脚、结构光引脚和接近灯引脚，所述接地引脚和所述结构光引脚被使能时，所述结构光投射器发射红外光线；所述接地引脚和所述接近灯引脚被使能时，所述接近红外灯发射红外光线。In some embodiments, a ground pin, a structured light pin and a proximity lamp pin are formed on the output module. When the ground pin and the structured light pin are enabled, the structured light The projector emits infrared light; when the ground pin and the proximity light pin are enabled, the proximity infrared light emits infrared light.
在某些实施方式中，所述盖板与所述机壳结合的表面形成有仅透过红外光的红外透过油墨，所述红外透过油墨遮挡所述机壳接近通孔、所述机壳结构光通孔、及所述机壳振动通孔中的至少一个。In some embodiments, an infrared-transmitting ink that only transmits infrared light is formed on a surface where the cover plate is combined with the casing, and the infrared-transmitting ink shields the casing from approaching the through hole and the casing. At least one of the light through hole of the casing structure and the vibration through hole of the casing.
在某些实施方式中，所述电子装置还包括接收模组及成像模组，所述接收模组集成有接近传感器和光感器，所述成像模组包括镜座、安装在所述镜座上的镜筒、及收容在所述镜座内的图像传感器，所述镜座包括位于所述镜筒与所述图像传感器之间的安装面，所述接收模组设置在所述安装面。In some embodiments, the electronic device further includes a receiving module and an imaging module, the receiving module integrates a proximity sensor and a light sensor, and the imaging module includes a mirror base and is mounted on the mirror base The lens barrel and the image sensor accommodated in the lens seat, the lens seat includes a mounting surface between the lens barrel and the image sensor, and the receiving module is arranged on the mounting surface.
在某些实施方式中，所述电子装置还包括接近传感器、光感器和成像模组，所述成像模组包括镜座、安装在所述镜座上的镜筒、及收容在所述镜座内的图像传感器，所述镜座包括位于所述镜筒与所述图像传感器之间的安装面，所述接近传感器与所述光感器中的至少一个设置在所述安装面。In some embodiments, the electronic device further includes a proximity sensor, a light sensor, and an imaging module, the imaging module includes a mirror base, a lens barrel mounted on the mirror base, and a lens mounted on the mirror An image sensor in a seat, the lens seat includes a mounting surface between the lens barrel and the image sensor, and at least one of the proximity sensor and the light sensor is arranged on the mounting surface.
在某些实施方式中，所述电子装置还包括红外光摄像头、可见光摄像头和红外补光灯，所述输出模组、所述红外光摄像头、所述可见光摄像头和所述红外补光灯的中心位于同一线段上，所述压电元件位于所述线段与所述机壳的顶部之间。In some embodiments, the electronic device further includes an infrared light camera, a visible light camera and an infrared fill light, and the center of the output module, the infrared light camera, the visible light camera and the infrared fill light On the same line segment, the piezoelectric element is located between the line segment and the top of the enclosure.
在某些实施方式中，所述电子装置还包括红外光摄像头、可见光摄像头、及红外补光灯，所述压电元件的数量为多个，所述机壳振动通孔的数量为多个，多个所述压电元件与多个所述机壳振动通孔对应，每个所述压电元件收容在对应的所述机壳振动通孔内，所述输出模组、所述红外光摄像头、所述可见光摄像头、所述红外补光灯和多个所述压电元件的中心位于同一线段上，相邻两个所述压电元件之间设置有所述输出模组、所述红外光摄像头、所述可见光摄像头、及所述红外补光灯中的至少一个。In some embodiments, the electronic device further includes an infrared light camera, a visible light camera, and an infrared fill light, the number of the piezoelectric elements is multiple, and the number of the vibration through holes of the casing is multiple, A plurality of the piezoelectric elements correspond to a plurality of the vibration through holes of the casing, each of the piezoelectric elements is accommodated in the corresponding vibration through holes of the casing, the output module, the infrared light camera , The center of the visible light camera, the infrared fill light and the piezoelectric elements are located on the same line segment, and the output module, the infrared light are arranged between two adjacent piezoelectric elements at least one of a camera, the visible light camera, and the infrared fill light.
在某些实施方式中，所述电子装置还包括红外光摄像头、可见光摄像头、及红外补光灯，所述压电元件包括压电本体及自所述压电本体伸出的压电凸块，所述机壳振动通孔的数量为多个，多个所述压电凸块与多个所述机壳振动通孔对应，每个所述压电凸块部分收容在对应的所述机壳振动通孔内并与所述盖板结合，所述输出模组、所述红外光摄像头、所述可见光摄像头、及所述红外补光灯位于所述盖板与所述压电本体之间，所述输出模组、所述红外光摄像头、所述可见光摄像头、所述红外补光灯和多个所述压电凸块的中心位于同一线段上，相邻两个所述压电凸块之间设置有所述输出模组、所述红外光摄像头、所述可见光摄像头、及所述红外补光灯中的至少一个。In some embodiments, the electronic device further includes an infrared light camera, a visible light camera, and an infrared fill light, and the piezoelectric element includes a piezoelectric body and a piezoelectric bump protruding from the piezoelectric body, The number of the vibration through holes of the casing is multiple, the piezoelectric bumps correspond to the vibration through holes of the casing, and each piezoelectric bump is partially accommodated in the corresponding casing. The vibration through hole is combined with the cover plate, and the output module, the infrared light camera, the visible light camera, and the infrared fill light are located between the cover plate and the piezoelectric body, The centers of the output module, the infrared light camera, the visible light camera, the infrared fill light and the plurality of piezoelectric bumps are located on the same line segment, and the center of two adjacent piezoelectric bumps is located on the same line segment. At least one of the output module, the infrared light camera, the visible light camera, and the infrared fill light is disposed between.
本发明实施方式的电子装置中，输出模组将结构光投射器与接近红外灯集成为一个单封装体结构，集合了发射红外光以红外测距及立体成像的功能，因此，输出模组的集成度较高，体积较小，输出模组节约了实现立体成像和红外测距的功能的空间。另外，由于结构光投射器与接近红外灯承载在同一个封装基板上，相较于传统工艺的结构光投射器与接近红外灯需要分别采用不同晶圆制造再组合到PCB基板上封装，提高了封装效率。再有，电子装置采用压电元件和振动模组实现骨传导传声，代替了传统的由空气传导声的受话器结构，一方面有效保证通话内容的私密性，另一方面，由于取消了原本的受话器，避免了在盖板上开设与受话器对应的通孔，工艺上更简单，外观上也更为美观。In the electronic device of the embodiment of the present invention, the output module integrates the structured light projector and the near-infrared lamp into a single-package structure, which integrates the functions of emitting infrared light for infrared ranging and stereo imaging. The integration is high, the volume is small, and the output module saves the space for the functions of stereo imaging and infrared ranging. In addition, since the structured light projector and the near-infrared lamp are carried on the same package substrate, compared with the traditional process of the structured light projector and the near-infrared lamp, they need to be fabricated from different wafers and then assembled on the PCB substrate for packaging, which improves the performance. packaging efficiency. Furthermore, the electronic device uses piezoelectric elements and vibration modules to realize bone conduction sound transmission, instead of the traditional air-conducted sound receiver structure. On the one hand, it effectively ensures the privacy of the call content. The receiver avoids opening a through hole corresponding to the receiver on the cover plate, and the process is simpler and the appearance is more beautiful.
本发明的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实施方式的实践了解到。Additional aspects and advantages of embodiments of the present invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or learned by practice of embodiments of the invention.
附图说明Description of drawings
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:
图1是本发明实施方式的电子装置的结构示意图；1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
图2是本发明实施方式的电子装置的输出模组的立体示意图；2 is a schematic perspective view of an output module of an electronic device according to an embodiment of the present invention;
图3是本发明实施方式的电子装置的输出模组的截面示意图；3 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the present invention;
图4是本发明实施方式的电子装置的输出模组的立体示意图；4 is a schematic perspective view of an output module of an electronic device according to an embodiment of the present invention;
图5是图1中的电子装置沿V-V线的截面示意图；5 is a schematic cross-sectional view of the electronic device in FIG. 1 along line V-V;
图6是图1中的电子装置沿VI-VI线的截得的部分截面示意图；6 is a partial cross-sectional schematic view of the electronic device in FIG. 1 taken along line VI-VI;
图7是本发明实施方式的电子装置的接收模组与成像模组的立体示意图；7 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;
图8是本发明实施方式的电子装置的电子元器件和压电元件的排列示意图；8 is a schematic diagram of the arrangement of electronic components and piezoelectric elements of the electronic device according to an embodiment of the present invention;
图9是本发明实施方式的电子装置的结构示意图；9 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
图10至图11是本发明实施方式的电子装置的电子元器件和压电元件的排列示意图；10 to 11 are schematic diagrams of arrangement of electronic components and piezoelectric elements of an electronic device according to an embodiment of the present invention;
图12是本发明实施方式的电子装置的结构示意图；12 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
图13是图12中的电子装置沿XIII-XIII线的截面示意图；13 is a schematic cross-sectional view of the electronic device in FIG. 12 along line XIII-XIII;
图14是本发明实施方式的电子装置的输出模组的截面示意图；14 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the present invention;
图15是本发明实施方式的电子装置的接收模组与成像模组的立体示意图；15 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;
图16和图17是本发明实施方式的电子装置沿与图1中XVI-XVI线对应位置截得的部分截面示意图；16 and 17 are partial cross-sectional schematic diagrams of the electronic device according to the embodiment of the present invention taken along the position corresponding to the line XVI-XVI in FIG. 1;
图18是本发明实施方式的电子装置的接收模组与输出模组的立体示意图；18 is a schematic perspective view of a receiving module and an output module of an electronic device according to an embodiment of the present invention;
图19至图27是本发明实施方式的电子装置的接收模组与成像模组的立体示意图。19 to 27 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention.
具体实施方式Detailed ways
以下结合附图对本发明的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。The embodiments of the present invention will be further described below with reference to the accompanying drawings. The same or similar reference numbers refer to the same or similar elements or elements having the same or similar functions throughout the drawings.
另外，下面结合附图描述的本发明的实施方式是示例性的，仅用于解释本发明的实施方式，而不能理解为对本发明的限制。In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may be in direct contact between the first and second features, or the first and second features indirectly through an intermediary touch. Also, the first feature being "above", "over" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
请参阅图1，本发明实施方式的电子装置100包括机壳20、电子元器件、振动模组30a和压电元件70。电子元器件包括输出模组10、接收模组50(如图7)、成像模组60(如图7)和红外补光灯80。电子装置100可以是手机、平板电脑、笔记本电脑、智能手表、智能手环、柜员机等，本发明实施例以电子装置100是手机为例进行说明，可以理解，电子装置100的具体形式可以是其他，在此不作限制。Referring to FIG. 1 , anelectronic device 100 according to an embodiment of the present invention includes acasing 20 , electronic components, avibration module 30 a and apiezoelectric element 70 . The electronic components include anoutput module 10 , a receiving module 50 (as shown in FIG. 7 ), an imaging module 60 (as shown in FIG. 7 ), and aninfrared fill light 80 . Theelectronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an ATM, etc. The embodiment of the present invention is described by taking theelectronic device 100 as a mobile phone as an example, and it can be understood that the specific form of theelectronic device 100 can be other , which is not limited here.
请参阅图2和图3，输出模组10为单封装体结构，包括封装壳体11、结构光投射器12和接近红外灯13。Please refer to FIG. 2 and FIG. 3 , theoutput module 10 is a single package structure, including apackage housing 11 , a structuredlight projector 12 and a proximityinfrared lamp 13 .
封装壳体11用于同时封装结构光投射器12和接近红外灯13，或者说，结构光投射器12和接近红外灯13同时封装在封装壳体11内。封装壳体11包括封装基板111、封装侧壁112和封装顶部113。封装壳体11可以是由电磁干扰(Electromagnetic Interference,EMI)屏蔽材料制成，以避免外界的电磁干扰对输出模组10产生影响。Thepackaging casing 11 is used to encapsulate the structuredlight projector 12 and the proximityinfrared lamp 13 at the same time, or in other words, the structuredlight projector 12 and the proximityinfrared lamp 13 are simultaneously encapsulated in thepackaging casing 11 . Thepackage housing 11 includes apackage substrate 111 , apackage sidewall 112 and apackage top 113 . Thepackage casing 11 may be made of an electromagnetic interference (Electromagnetic Interference, EMI) shielding material to prevent external electromagnetic interference from affecting theoutput module 10 .
封装基板111用于承载结构光投射器12和接近红外灯13。在制造输出模组10时，结构光投射器12和接近红外灯13可以形成在一片芯片14上，再将结构光投射器12、接近红外灯13和芯片14一同设置在封装基板111上，具体地，可以将芯片14粘结在封装基板111上。同时，封装基板111也可以用于与电子装置100的其他零部件(例如电子装置100的机壳20、主板等)连接，以将输出模组10固定在电子装置100内。Thepackage substrate 111 is used to carry the structuredlight projector 12 and the proximityinfrared lamp 13 . When manufacturing theoutput module 10, the structuredlight projector 12 and the proximityinfrared lamp 13 can be formed on achip 14, and then the structuredlight projector 12, the proximityinfrared lamp 13 and thechip 14 are arranged on thepackage substrate 111 together. Ground, thechip 14 may be bonded on thepackage substrate 111 . Meanwhile, thepackage substrate 111 can also be used to connect with other components of the electronic device 100 (eg, thechassis 20 of theelectronic device 100 , the main board, etc.) to fix theoutput module 10 in theelectronic device 100 .
封装侧壁112可以环绕结构光投射器12和接近红外灯13设置，封装侧壁112自封装基板111延伸，封装侧壁112可与封装基板111结合，较佳地，封装侧壁112与封装基板111为可拆卸地连接，以便于取下封装侧壁112后对结构光投射器12和接近红外灯13进行检修。封装侧壁112的制作材料可以是不透红外光的材料，以避免结构光投射器12或接近红外灯13发出的红外光穿过封装侧壁112。Thepackage sidewall 112 can be arranged around the structuredlight projector 12 and the proximityinfrared lamp 13 . Thepackage sidewall 112 extends from thepackage substrate 111 , and thepackage sidewall 112 can be combined with thepackage substrate 111 . Preferably, thepackage sidewall 112 is connected to thepackage substrate 111 . 111 is detachably connected, so that the structuredlight projector 12 and the proximityinfrared lamp 13 can be repaired after theside wall 112 of the package is removed. The material for making thepackage side wall 112 may be a material that does not transmit infrared light, so as to prevent the infrared light emitted by the structuredlight projector 12 or the near-infrared lamp 13 from passing through thepackage side wall 112 .
封装顶部113与封装基板111相对，封装顶部113与封装侧壁112连接。封装顶部113形成有结构光窗口1131及接近窗口1132，结构光窗口1131与结构光投射器12对应，结构光投射器12发射的结构光(红外光)从结构光窗口1131穿出；接近窗口1132与接近红外灯13对应，接近红外灯13发射的红外光从接近窗口1132穿出。封装顶部113与封装侧壁112可以一体成形得到，也可以分体成形得到。在一个例子中，结构光窗口1131和接近窗口1132为通孔，封装顶部113的制作材料为不透红外光的材料。在另一例子中，封装顶部113由不透红外光的材料和透红外光的材料共同制造而成，具体地，结构光窗口1131和接近窗口1132由透红外光的材料制成，其余部位由不透红外光的材料制成，进一步地，结构光窗口1131和接近窗口1132可以形成有透镜结构，以改善从结构光窗口1131和接近窗口1132射出的红外光发射角度，例如结构光窗口1131形成有凹透镜结构，以使穿过结构光窗口1131的光线发散向外射出；接近窗口1132形成有凸透镜结构，以使穿过接近窗口1132的光线聚拢向外射出。Thepackage top 113 is opposite to thepackage substrate 111 , and thepackage top 113 is connected to thepackage sidewall 112 . Thepackage top 113 is formed with astructured light window 1131 and aproximity window 1132. The structuredlight window 1131 corresponds to the structuredlight projector 12, and the structured light (infrared light) emitted by the structuredlight projector 12 passes through the structuredlight window 1131; theproximity window 1132 Corresponding to the proximityinfrared lamp 13 , the infrared light emitted by the proximityinfrared lamp 13 passes through theproximity window 1132 . Thepackage top 113 and thepackage side wall 112 can be formed integrally or separately. In one example, the structuredlight window 1131 and theproximity window 1132 are through holes, and the material for making thepackage top 113 is a material that does not transmit infrared light. In another example, thepackage top 113 is made of a material that does not transmit infrared light and a material that transmits infrared light. Specifically, the structuredlight window 1131 and theproximity window 1132 are made of a material that transmits infrared light. It is made of materials that do not transmit infrared light. Further, the structuredlight window 1131 and theproximity window 1132 can be formed with a lens structure to improve the emission angle of infrared light emitted from the structuredlight window 1131 and theproximity window 1132. For example, the structuredlight window 1131 is formed by There is a concave lens structure, so that the light passing through the structuredlight window 1131 is diffused and emitted outward; theproximity window 1132 is formed with a convex lens structure, so that the light passing through theproximity window 1132 is concentrated and emitted outward.
结构光投射器12与接近红外灯13可以形成在一片芯片14上，进一步减小结构光投射器12与接近红外灯13集成后的体积，且制备工艺较简单。结构光投射器12可向外发射结构光，结构光可形成红外激光散斑图案，结构光投射到目标物体表面，由红外光摄像头62(如图1所示)采集被目标物体调制后的结构光图案，通过对被调制的结构光图案进行分析计算获取目标物体的深度图像(此时，结构光投射器12用于立体成像)。在本发明实施例中，结构光投射器12包括光源121、镜架122、透镜123和衍射光学元件(diffractive opticalelements,DOE)124。光源121发出的光束经透镜123准直或汇聚后由衍射光学元件124扩束并以一定的光束图案向外发射。具体地，光源121可以形成在芯片14上，透镜123和衍射光学元件124可以固定在镜架122上，例如通过胶粘的方式固定在镜架122上。接近红外灯13可发射红外光，红外光穿过接近窗口1132并到达物体表面，电子装置100的接近传感器51(如图7所示)接收被物体反射的红外光以检测物体到电子装置100的距离(此时，接近红外灯13用于红外测距)。The structuredlight projector 12 and the near-infrared lamp 13 can be formed on achip 14 , which further reduces the volume of the structuredlight projector 12 and the near-infrared lamp 13 after integration, and the manufacturing process is relatively simple. The structuredlight projector 12 can emit structured light outward, the structured light can form an infrared laser speckle pattern, the structured light is projected onto the surface of the target object, and the structure modulated by the target object is collected by the infrared light camera 62 (as shown in FIG. 1 ). For the light pattern, a depth image of the target object is obtained by analyzing and calculating the modulated structured light pattern (in this case, the structuredlight projector 12 is used for stereo imaging). In the embodiment of the present invention, the structuredlight projector 12 includes alight source 121 , amirror frame 122 , alens 123 and diffractive optical elements (DOE) 124 . The light beam emitted by thelight source 121 is collimated or converged by thelens 123 and then expanded by the diffractiveoptical element 124 and emitted outward in a certain beam pattern. Specifically, thelight source 121 may be formed on thechip 14, and thelens 123 and the diffractiveoptical element 124 may be fixed on themirror frame 122, for example, by means of gluing. The proximityinfrared lamp 13 can emit infrared light, the infrared light passes through theproximity window 1132 and reaches the surface of the object, and theproximity sensor 51 of the electronic device 100 (as shown in FIG. Distance (at this time, the proximityinfrared lamp 13 is used for infrared distance measurement).
结构光投射器12与接近红外灯13能够以不同的功率向封装壳体11外发射红外光线，具体地，结构光投射器12与接近红外灯13可以同时发射红外光线，输出模组10同时用于立体成像和红外测距；也可以结构光投射器12发射光线而接近红外灯13不发射光线，输出模组10仅用于立体成像；也可以结构光投射器12不发射光线而接近红外灯13发射光线，输出模组10仅用于红外测距。请结合图4，在本发明实施例中，输出模组10上形成有接地引脚15、结构光引脚16和接近灯引脚17。接地引脚15、结构光引脚16和接近灯引脚17可以形成在封装基板111上，当接地引脚15和结构光引脚16被使能时(即，接地引脚15和结构光引脚16接入电路导通时)，结构光投射器12发射红外光线；当接地引脚15和接近灯引脚17被使能时(即，接地引脚15和接近灯引脚17接入电路导通时)，接近红外灯13发射红外光线；当接地引脚15、结构光引脚16和接近灯引脚17被使能时(即，接地引脚15、结构光引脚16和接近灯引脚17接入电路导通时)，结构光投射器12发射红外光线，且接近红外灯13发射红外光线。The structuredlight projector 12 and the proximityinfrared lamp 13 can emit infrared light to the outside of thepackage housing 11 with different powers. Specifically, the structuredlight projector 12 and the proximityinfrared lamp 13 can simultaneously emit infrared light, and theoutput module 10 uses For stereo imaging and infrared ranging; it is also possible that the structuredlight projector 12 emits light and the proximityinfrared lamp 13 does not emit light, and theoutput module 10 is only used for stereo imaging; it is also possible that the structuredlight projector 12 does not emit light but is close to theinfrared lamp 13 emits light, and theoutput module 10 is only used for infrared ranging. Please refer to FIG. 4 , in the embodiment of the present invention, theoutput module 10 is formed with aground pin 15 , a structuredlight pin 16 and aproximity lamp pin 17 . The ground pins 15, the structured light pins 16, and the proximity light pins 17 may be formed on thepackage substrate 111, and when the ground pins 15 and the structured light pins 16 are enabled (ie, the ground pins 15 and the structured light pins 17) When thepin 16 is connected to the circuit and is turned on), the structuredlight projector 12 emits infrared light; when theground pin 15 and theproximity lamp pin 17 are enabled (that is, theground pin 15 and theproximity lamp pin 17 are connected to the circuit When turned on), the proximityinfrared light 13 emits infrared light; when theground pin 15, the structuredlight pin 16 and theproximity light pin 17 are enabled (ie, theground pin 15, the structuredlight pin 16 and the proximity light When thepin 17 is connected to the circuit and is turned on), the structuredlight projector 12 emits infrared light, and the proximityinfrared lamp 13 emits infrared light.
请参阅图1和图6，机壳20包括顶部21和底部22，在与电子元器件和压电元件70对应的位置，机壳20开设有机壳接近通孔23、机壳结构光通孔24和机壳振动通孔2a。输出模组10设置在机壳20内时，接近红外灯13与机壳接近通孔23对应，结构光投射器12与机壳结构光通孔24对应。其中接近红外灯13与机壳接近通孔23对应指接近红外灯13发出的光线可从机壳接近通孔23穿过，具体地，可以是接近红外灯13与机壳接近通孔23正对，也可以是接近红外灯13发射的光线经导光元件作用后穿过机壳接近通孔23。结构光投射器12与机壳结构光通孔24对应同理，在此不作赘述。在如图6所示的实施例中，机壳接近通孔23与机壳结构光通孔24可以是相互间隔的，当然，在其他实施例中，机壳接近通孔23与机壳结构光通孔24可以是互相连通的。Please refer to FIG. 1 and FIG. 6 , thecasing 20 includes atop portion 21 and abottom portion 22 . At positions corresponding to the electronic components and thepiezoelectric element 70 , thecasing 20 is provided with a casing proximity throughhole 23 and a casing structure light throughhole 23 . 24 and the casing vibration throughhole 2a. When theoutput module 10 is disposed in thecasing 20 , the proximityinfrared lamp 13 corresponds to the proximity throughhole 23 of the casing, and the structuredlight projector 12 corresponds to the structured light throughhole 24 of the casing. The proximityinfrared lamp 13 corresponds to the casing proximity throughhole 23, which means that the light emitted by the proximityinfrared lamp 13 can pass through the casing proximity throughhole 23. Specifically, the proximityinfrared lamp 13 and the casing proximity throughhole 23 can be directly opposite. , it can also be that the light emitted by the proximityinfrared lamp 13 passes through the casing and approaches the throughhole 23 after being acted by the light guide element. Thestructure light projector 12 corresponds to the casing structure light throughhole 24 in the same way, and will not be repeated here. In the embodiment shown in FIG. 6 , the casing proximity throughholes 23 and the casing structural light throughholes 24 may be spaced apart from each other. Of course, in other embodiments, the casing proximity throughholes 23 and the casing structured light The through holes 24 may be interconnected.
请参阅图5和图6，振动模组30a安装在机壳20上。振动模组30a可包括显示屏90和盖板30，或者说显示屏90与盖板30结合形成振动模组30a，以提升振动模组30a的刚性。显示屏90设置在机壳20上并与机壳20形成收容腔91，盖板30设置在机壳20上并位于显示屏90的远离收容腔91的一侧，以保护显示屏90。由于本发明实施方式的输出模组10可以占用较小的体积，因此，机壳20内用于设置显示屏90的体积将可以对应增大，以提高电子装置100的屏占比。具体地，显示屏90、输出模组10及压电元件70设置在顶部21和底部22之间，在用户正常使用电子装置100的状态下，顶部21位于底部22的上方，如图1所示，输出模组10可以设置在显示屏90与顶部21之间。在其他实施方式中，显示屏90可以为全面屏开设有缺口，显示屏90包围住输出模组10，而输出模组10从显示屏90的缺口露出。Please refer to FIG. 5 and FIG. 6 , thevibration module 30 a is installed on thecasing 20 . Thevibration module 30a may include adisplay screen 90 and acover plate 30, or thedisplay screen 90 and thecover plate 30 are combined to form thevibration module 30a, so as to improve the rigidity of thevibration module 30a. Thedisplay screen 90 is arranged on thecasing 20 and forms a receivingcavity 91 with thecasing 20 . Since theoutput module 10 according to the embodiment of the present invention can occupy a small volume, the volume of thecasing 20 for disposing thedisplay screen 90 can be correspondingly increased, so as to increase the screen ratio of theelectronic device 100 . Specifically, thedisplay screen 90 , theoutput module 10 and thepiezoelectric element 70 are arranged between the top 21 and the bottom 22 . When the user is using theelectronic device 100 normally, the top 21 is located above the bottom 22 , as shown in FIG. 1 , theoutput module 10 can be arranged between thedisplay screen 90 and the top 21 . In other embodiments, thedisplay screen 90 may be provided with a notch for the full screen, thedisplay screen 90 surrounds theoutput module 10 , and theoutput module 10 is exposed from the notch of thedisplay screen 90 .
压电元件70由陶瓷或石英晶体材料制成，压电元件70可以是单晶片、双晶片或层压的压电元件70。压电元件70与振动模组30a结合并与输出模组10间隔。具体地，压电元件70收容在机壳振动通孔2a内并与盖板30结合，且与机壳20间隔，可以是：压电元件70部分收容在机壳振动通孔2a内，或压电元件70完全收容在机壳振动通2a孔内。当压电元件70的两端施加有电信号(电压)时，由于逆压电效应，压电元件70发生机械形变，例如膨胀或收缩，由此，带动与压电元件70结合的振动模组30a根据该电信号的频率振动。当用户的身体与振动模组30a接触时，骨传导声通过用户的身体与振动模组30a接触的部分(例如，外耳的软骨、牙齿)传送至用户的听觉神经。如此，用户可以通过压电元件70和振动模组30a实现语音通话、听音乐等功能。在本发明实施例中，电子装置100的处理器用于获取声音信号，并在压电元件70的两端施加与该声音信号对应的电信号。Thepiezoelectric element 70 is made of ceramic or quartz crystal material, and thepiezoelectric element 70 may be a monomorph, bimorph or laminatedpiezoelectric element 70 . Thepiezoelectric element 70 is combined with thevibration module 30 a and is spaced apart from theoutput module 10 . Specifically, thepiezoelectric element 70 is accommodated in the vibration throughhole 2a of the casing, combined with thecover plate 30, and is spaced from thecasing 20. Thepiezoelectric element 70 may be partially accommodated in the vibration throughhole 2a of the casing, or thepiezoelectric element 70 may be partially accommodated in the vibration throughhole 2a of the casing, or the pressure Theelectrical element 70 is completely accommodated in the vibration throughhole 2a of the casing. When an electrical signal (voltage) is applied to both ends of thepiezoelectric element 70, due to the inverse piezoelectric effect, thepiezoelectric element 70 undergoes mechanical deformation, such as expansion or contraction, thereby driving the vibration module combined with thepiezoelectric element 70. 30a vibrates according to the frequency of the electrical signal. When the user's body is in contact with thevibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through the part of the user's body in contact with thevibration module 30a (eg, cartilage of the outer ear, teeth). In this way, the user can implement functions such as voice calls and listening to music through thepiezoelectric element 70 and thevibration module 30a. In this embodiment of the present invention, the processor of theelectronic device 100 is configured to acquire a sound signal, and apply an electrical signal corresponding to the sound signal to both ends of thepiezoelectric element 70 .
可以理解，传统的受话器结构采用空气传导声，受话器工作时局部声压通常在90dB～100dB左右，在周围环境较安静(如50dB左右的一般办公环境下)声音即使传递到周围1米范围也仍保留有50dB～60dB左右，导致通话者间的交谈内容被周围感知，导致私密泄露。本发明实施方式的电子装置100采用压电元件70和振动模组30a实现骨传导传声，通话的声音主要由振动的骨传导被用户感知，能够有效保证通话内容的私密性。It can be understood that the traditional receiver structure adopts air conduction sound, and the local sound pressure of the receiver is usually about 90dB to 100dB when the receiver is working. In a quiet surrounding environment (such as a general office environment of about 50dB), the sound is still transmitted to the surrounding 1 meter range. The reserve is about 50dB to 60dB, which causes the conversation content between the callers to be perceived by the surrounding, resulting in privacy leakage. Theelectronic device 100 according to the embodiment of the present invention adopts thepiezoelectric element 70 and thevibration module 30a to realize bone conduction sound transmission, and the voice of the call is mainly perceived by the user through the vibration bone conduction, which can effectively ensure the privacy of the call content.
请再次参阅图5及图6，压电元件70和显示屏90均通过接合件30b附接至盖板30上。接合件30b为具有热固化特性、紫外固化特性的粘合剂、双面胶、黏胶等。例如，接合件30b可以是光学弹性树脂(无色且透明的紫外固化丙烯酸类粘合剂)。盖板30的与压电元件70结合的区域和盖板30的与显示屏90结合的区域间隔，以防止显示屏90的显示受到压电元件70的干扰。当然，盖板30也可通过接合件30b接合至机壳20，相较于盖板30直接设置在机壳20上，可以防止振动模组30a的振动被直接传送至机壳20，以减小了用户因为机壳20的振动幅度过大而掉落电子装置100的可能性。Referring to FIGS. 5 and 6 again, thepiezoelectric element 70 and thedisplay screen 90 are both attached to thecover plate 30 through thejoint member 30b. Thebonding member 30b is an adhesive, double-sided tape, adhesive, etc. with thermal curing properties and ultraviolet curing properties. For example, thejoint member 30b may be an optical elastic resin (colorless and transparent UV-curable acrylic adhesive). The area of thecover plate 30 combined with thepiezoelectric element 70 is spaced apart from the area of thecover plate 30 combined with thedisplay screen 90 to prevent the display of thedisplay screen 90 from being disturbed by thepiezoelectric element 70 . Of course, thecover plate 30 can also be joined to thecasing 20 through thejoint member 30b. Compared with thecover plate 30 being directly disposed on thecasing 20, the vibration of thevibration module 30a can be prevented from being directly transmitted to thecasing 20, so as to reduce the The possibility of the user dropping theelectronic device 100 due to the excessive vibration of thecasing 20 is avoided.
盖板30可以是透光的，盖板30的材料可以是透光的玻璃、树脂、塑料等。盖板30设置在机壳20上，盖板30包括与机壳20结合的内表面32，以及与内表面32相背的外表面31，输出模组10发出的光线依次穿过内表面32和外表面31后穿出盖板30。在如图5所示的实施例中，盖板30覆盖机壳结构光通孔24和机壳接近通孔23，盖板30的内表面32上涂覆有红外透过油墨40，红外透过油墨40对红外光有较高的透过率，例如可达到85％或以上，且对可见光有较高的衰减率，例如可达到70％以上，使得用户在正常使用中，肉眼难以看到电子装置100上被红外透过油墨40覆盖的区域。具体地，红外透过油墨40可以覆盖内表面32上不与显示屏90对应的区域。Thecover plate 30 may be transparent, and the material of thecover plate 30 may be transparent glass, resin, plastic, or the like. Thecover plate 30 is arranged on thecasing 20. Thecover plate 30 includes aninner surface 32 combined with thecasing 20 and anouter surface 31 opposite to theinner surface 32. The light emitted by theoutput module 10 passes through theinner surface 32 and theinner surface 32 in turn. Theouter surface 31 passes through thecover plate 30 afterward. In the embodiment shown in FIG. 5 , thecover plate 30 covers the light throughhole 24 of the casing structure and the throughhole 23 near the casing. Theink 40 has a high transmittance to infrared light, for example, can reach 85% or more, and has a high attenuation rate to visible light, for example, can reach more than 70%, which makes it difficult for users to see the electrons with the naked eye during normal use. The area on thedevice 100 covered by theinfrared transmissive ink 40 . Specifically, theinfrared transmissive ink 40 may cover areas on theinner surface 32 that do not correspond to thedisplay screen 90 .
红外透过油墨40还可以遮挡机壳接近通孔23、机壳结构光通孔24及机壳振动通孔2a中的至少一个，即，红外透过油墨40可以同时遮盖机壳接近通孔23、机壳结构光通孔24和机壳振动通孔2a(如图6所示)，用户难以通过机壳接近通孔23、机壳结构光通孔24和机壳振动通孔2a看到电子装置100的内部结构，电子装置100的外形较美观；红外透过油墨40也可以遮盖机壳接近通孔23，且未遮盖机壳结构光通孔24和机壳振动通孔2a；或者红外透过油墨40也可以遮盖机壳结构光通孔24，且未遮盖机壳接近通孔23和机壳振动通孔2a；红外透过油墨40也可以遮盖机壳振动通孔2a，且未遮盖机壳接近通孔23和机壳结构光通孔24；红外透过油墨40也可以遮盖机壳接近通孔23和遮盖机壳结构光通孔24，且未遮盖机壳振动通孔2a；红外透过油墨40也可以遮盖机壳结构光通孔24和机壳振动通孔2a，且未遮盖机壳接近通孔23；红外透过油墨40也可以遮盖机壳接近通孔23和机壳振动通孔2a，且未遮盖机壳结构光通孔24。Theinfrared transmission ink 40 can also block at least one of the casing approach throughhole 23, the casing structure light throughhole 24 and the casing vibration throughhole 2a, that is, theinfrared transmission ink 40 can simultaneously cover the casing approach throughhole 23 , the casing structure light throughhole 24 and the casing vibration throughhole 2a (as shown in Figure 6), it is difficult for users to see the electronic The internal structure of thedevice 100, the appearance of theelectronic device 100 is more beautiful; the infraredtransparent ink 40 can also cover the casing close to the throughhole 23, and does not cover the casing structure light throughhole 24 and the casing vibration throughhole 2a; The light throughhole 24 of the casing structure can also be covered by theink 40, and the casing proximity throughhole 23 and the casing vibration throughhole 2a can also be covered; theinfrared transmission ink 40 can also cover the casing vibration throughhole 2a, and the machine casing is not covered. The casing is close to the throughhole 23 and the casing structure light throughhole 24; theinfrared transmission ink 40 can also cover the casing close to the throughhole 23 and cover the casing structure light throughhole 24, and does not cover the casing vibration throughhole 2a; Theink 40 can also cover the casing structure light throughhole 24 and the casing vibration throughhole 2a, and does not cover the casing close to the throughhole 23; theinfrared transmission ink 40 can also cover the casing close to the throughhole 23 and the casing vibration throughhole 23. Thehole 2a is not covered, and the light throughhole 24 of the casing structure is not covered.
请参阅图7，接收模组50集成有接近传感器51和光感器52，接近传感器51与光感器52共同形成单封装体结构。接近红外灯13向外发出的红外光，被外界物体反射后，由接近传感器51接收，接近传感器51依据接收到的被反射的红外光判断外界物体与电子装置100之间的距离。光感器52接收环境光中的可见光，并检测可见光的强度，以作为控制显示屏90的显示亮度的依据。接近传感器51和光感器52共同封装成接收模组50，减小二者单独装配时的间隙，节约电子装置100内的安装空间。Referring to FIG. 7 , the receivingmodule 50 integrates aproximity sensor 51 and aphoto sensor 52 , and theproximity sensor 51 and thephoto sensor 52 together form a single package structure. The infrared light emitted by the proximityinfrared lamp 13 is received by theproximity sensor 51 after being reflected by the external object. Theproximity sensor 51 determines the distance between the external object and theelectronic device 100 according to the received reflected infrared light. Thelight sensor 52 receives the visible light in the ambient light, and detects the intensity of the visible light as a basis for controlling the display brightness of thedisplay screen 90 . Theproximity sensor 51 and thelight sensor 52 are packaged together to form the receivingmodule 50 , which reduces the gap when the two are assembled separately and saves the installation space in theelectronic device 100 .
请参阅图1和图7，成像模组60可以是可见光摄像头61与红外光摄像头62中的一个或两个。成像模组60包括镜座63、镜筒64和图像传感器65。镜筒64安装在镜座63上，图像传感器65收容在镜座63内。镜座63包括安装面631，安装面631位于镜筒64与图像传感器65之间。在如图7所示的实施例中，接收模组50设置在安装面631上，具体地，接收模组50在安装面631所在的平面正投影至少部分落入到安装面631上，如此，接收模组50与成像模组60设置得较紧凑，二者共同占用的横向空间较小。Please refer to FIG. 1 and FIG. 7 , theimaging module 60 may be one or both of thevisible light camera 61 and the infraredlight camera 62 . Theimaging module 60 includes alens holder 63 , alens barrel 64 and animage sensor 65 . Thelens barrel 64 is mounted on thelens holder 63 , and theimage sensor 65 is accommodated in thelens holder 63 . Thelens mount 63 includes a mountingsurface 631 located between thelens barrel 64 and theimage sensor 65 . In the embodiment shown in FIG. 7 , the receivingmodule 50 is arranged on theinstallation surface 631 , specifically, the orthographic projection of the receivingmodule 50 on the plane where theinstallation surface 631 is located falls at least partially onto theinstallation surface 631 , so, The receivingmodule 50 and theimaging module 60 are set relatively compactly, and the lateral space occupied by the two is relatively small.
请参阅图1，红外补光灯80用于向外发射红外光，红外光被外界物体表面反射后，电子装置100的红外光摄像头62接收被物体反射的红外光以获取物体的影像信息。Referring to FIG. 1 , theinfrared fill light 80 is used for emitting infrared light outward. After the infrared light is reflected by the surface of an external object, the infraredlight camera 62 of theelectronic device 100 receives the infrared light reflected by the object to obtain image information of the object.
在如图1所示的实施例中，成像模组60包括可见光摄像头61和红外光摄像头62，输出模组10、可见光摄像头61、红外光摄像头62、压电元件70和红外补光灯80的中心位于同一线段上。具体地，从线段的一端到另一端依次为输出模组10、红外补光灯80、压电元件70、红外光摄像头62、可见光摄像头61(如图8所示)；或者从线段的一端到另一端依次为输出模组10、可见光摄像头61、压电元件70、红外光摄像头62、红外补光灯80(如图1所示)；或者从线段的一端到另一端依次为红外光摄像头62、红外补光灯80、压电元件70、可见光摄像头61、输出模组10；或者从线段的一端到另一端依次为红外光摄像头62、可见光摄像头61、压电元件70、输出模组10、红外补光灯80。当然，输出模组10、红外光摄像头62、压电元件70、可见光摄像头61、红外补光灯80的排列方式不限于上述的举例，还可以有其他，例如各电子元器件和压电元件70的中心排列成圆弧形、中心排列成矩形等形状。In the embodiment shown in FIG. 1 , theimaging module 60 includes avisible light camera 61 and an infraredlight camera 62 , and theoutput module 10 , thevisible light camera 61 , the infraredlight camera 62 , thepiezoelectric element 70 and theinfrared fill light 80 The centers lie on the same line segment. Specifically, from one end of the line segment to the other end are theoutput module 10, theinfrared fill light 80, thepiezoelectric element 70, the infraredlight camera 62, and the visible light camera 61 (as shown in FIG. 8); or from one end of the line segment to the The other end is theoutput module 10, thevisible light camera 61, thepiezoelectric element 70, the infraredlight camera 62, and the infrared fill light 80 (as shown in Figure 1); or from one end of the line segment to the other end is the infraredlight camera 62. ,Infrared fill light 80,piezoelectric element 70,visible light camera 61,output module 10;Infrared fill light 80. Of course, the arrangement of theoutput module 10 , the infraredlight camera 62 , thepiezoelectric element 70 , thevisible light camera 61 , and theinfrared fill light 80 is not limited to the above examples, and there may be others, such as various electronic components andpiezoelectric elements 70 The center is arranged in an arc shape, the center is arranged in a rectangle and other shapes.
请参阅图9，在某些实施方式中，输出模组10、红外光摄像头62、可见光摄像头61和红外补光灯80的中心位于同一线段上，压电元件70位于该线段与机壳20的顶部21之间。具体地，从该线段的一端到另一端依次为输出模组10、红外补光灯80、红外光摄像头62、可见光摄像头61；或者从该线段的一端到另一端依次为输出模组10、可见光摄像头61、红外光摄像头62、红外补光灯80(如图9所示)；或者从线段的一端到另一端依次为红外光摄像头62、可见光摄像头61、输出模组10、红外补光灯80。当然，输出模组10、红外光摄像头62、可见光摄像头61、红外补光灯80的排列方式不限于上述的举例。在本发明实施例中，压电元件70的中心不位于该线段上，节约了压电元件70和各电子元器件(输出模组10、红外光摄像头62、可见光摄像头61、红外补光灯80等)占用的横向空间。Referring to FIG. 9 , in some embodiments, the centers of theoutput module 10 , the infraredlight camera 62 , thevisible light camera 61 and theinfrared fill light 80 are located on the same line segment, and thepiezoelectric element 70 is located between the line segment and thecasing 20 Between the top 21. Specifically, from one end to the other end of the line segment are theoutput module 10, theinfrared fill light 80, the infraredlight camera 62, and thevisible light camera 61; or from one end to the other end of the line segment are theoutput module 10, thevisible light Camera 61, infraredlight camera 62, infrared fill light 80 (as shown in Figure 9); or from one end of the line segment to the other end are infraredlight camera 62,visible light camera 61,output module 10,infrared fill light 80 . Of course, the arrangement of theoutput module 10 , theinfrared camera 62 , thevisible camera 61 , and theinfrared fill light 80 is not limited to the above examples. In the embodiment of the present invention, the center of thepiezoelectric element 70 is not located on the line segment, which saves thepiezoelectric element 70 and various electronic components (theoutput module 10 , the infraredlight camera 62 , thevisible light camera 61 , and the infrared fill light 80 ). etc) the horizontal space occupied.
进一步地，请结合图7，接收模组50可以设置在红外光摄像头62的安装面631上，也可以设置在可见光摄像头61的安装面631上，当然，接收模组50也可以不设置在安装面631上，接收模组50可以与输出模组10相邻设置，接近传感器51容易接收到由接近红外灯13发射，且由外界物体反射回的红外光；接收模组50也可以与压电元件70相邻设置，在此不作限制。Further, please refer to FIG. 7, the receivingmodule 50 can be arranged on theinstallation surface 631 of theinfrared camera 62, and can also be arranged on theinstallation surface 631 of thevisible light camera 61. Of course, the receivingmodule 50 can also not be arranged on theinstallation surface 631. On thesurface 631, the receivingmodule 50 can be arranged adjacent to theoutput module 10, and theproximity sensor 51 can easily receive the infrared light emitted by the proximityinfrared lamp 13 and reflected by external objects; the receivingmodule 50 can also be connected with the piezoelectric Theelements 70 are arranged adjacent to each other, which is not limited here.
综上，本发明实施方式的电子装置100中，输出模组10将结构光投射器12与接近红外灯13集成为一个单封装体结构，集合了发射红外光以红外测距及立体成像的功能，因此，输出模组10的集成度较高，体积较小，输出模组10节约了实现立体成像和红外测距的功能的空间。另外，由于结构光投射器12与接近红外灯13承载在同一个封装基板111上，相较于传统工艺的结构光投射器12与接近红外灯13需要分别采用不同晶圆制造再组合到PCB基板上封装，提高了封装效率。再有，电子装置100采用压电元件70和振动模组30a实现骨传导传声，代替了传统的由空气传导声的受话器结构，一方面，能够有效保证通话内容的私密性；另一方面，由于取消了原本的受话器，避免了在盖板30上开设与受话器对应的通孔，工艺上更简单，外观上也更为美观，且能够防止灰尘或水分进入电子装置100内。To sum up, in theelectronic device 100 according to the embodiment of the present invention, theoutput module 10 integrates the structuredlight projector 12 and the proximityinfrared lamp 13 into a single package structure, which integrates the functions of emitting infrared light for infrared ranging and stereo imaging. Therefore, theoutput module 10 has a high integration degree and a small volume, and theoutput module 10 saves the space for realizing the functions of stereo imaging and infrared ranging. In addition, since the structuredlight projector 12 and the proximityinfrared lamp 13 are carried on thesame package substrate 111 , compared with the conventional process, the structuredlight projector 12 and the proximityinfrared lamp 13 need to be fabricated from different wafers respectively and then assembled to the PCB substrate The upper package improves the packaging efficiency. Furthermore, theelectronic device 100 adopts thepiezoelectric element 70 and thevibration module 30a to realize bone conduction sound transmission, instead of the traditional receiver structure of air conduction sound, on the one hand, it can effectively ensure the privacy of the call content; on the other hand, Since the original receiver is eliminated, the through hole corresponding to the receiver is avoided on thecover plate 30 , the process is simpler, the appearance is more beautiful, and dust or moisture can be prevented from entering theelectronic device 100 .
请参阅图6和图10，在某些实施方式中，成像模组60包括可见光摄像头61和红外光摄像头62。机壳20开设有相互间隔的机壳接近通孔23、机壳结构光通孔24、及机壳振动通孔2a。接近红外灯13与机壳接近通孔23对应，结构光投射器12与机壳结构光通孔24对应。压电元件70的数量为多个，机壳振动通孔2a的数量为多个，多个压电元件70与多个机壳振动通孔2a对应，每个压电元件70收容在对应的机壳振动通孔2a内。输出模组10、红外光摄像头62、可见光摄像头61、红外补光灯80和多个压电元件70的中心位于同一线段上，相邻两个压电元件70之间设置有输出模组10、红外光摄像头62、可见光摄像头61、及红外补光灯80中的至少一个。例如，压电元件70的数量为两个，从线段的一端到另一端依次为压电元件70、输出模组10、红外补光灯80、可见光摄像头61、红外光摄像头62、压电元件70(如图10所示)；或者从线段的一端到另一端依次为压电元件70、输出模组10、可见光摄像头61、红外光摄像头62、压电元件70、红外补光灯80等。又例如，压电元件70的数量为三个，从线段的一端到另一端依次为压电元件70、输出模组10、红外补光灯80、压电元件70、见光摄像头61、红外光摄像头62、可压电元件70(如图11所示)；或者从线段的一端到另一端依次为压电元件70、输出模组10、压电元件70、可见光摄像头61、红外光摄像头62、压电元件70、红外补光灯80等。当然，压电元件70的数量以及压电元件70、输出模组10、红外光摄像头62、可见光摄像头61、红外补光灯80的排列方式不限于上述的举例。在本发明实施例中，多个压电元件70与盖板30结合，具体地为多个压电元件70分别通过接合件30b附接至盖板30上。电子装置100的处理器用于获取声音信号，并同时在多个压电元件70的两端施加与该声音信号对应的电信号，多个压电元件70均发生机械形变，由此，多个压电元件70从与盖板30结合的多个不同位置带动振动模组30a根据该电信号的频率振动。当用户的身体与振动模组30a接触时，骨传导声通过用户的身体与振动模组30a接触的部分(例如，外耳的软骨、牙齿)传送至用户的听觉神经。Referring to FIG. 6 and FIG. 10 , in some embodiments, theimaging module 60 includes avisible light camera 61 and an infraredlight camera 62 . Thecasing 20 is provided with a casing approaching throughhole 23 , a casing structure light throughhole 24 , and a casing vibration throughhole 2 a which are spaced apart from each other. The proximityinfrared lamp 13 corresponds to the proximity throughhole 23 of the casing, and the structuredlight projector 12 corresponds to the structured light throughhole 24 of the casing. The number ofpiezoelectric elements 70 is multiple, and the number of casing vibration throughholes 2a is multiple, the multiplepiezoelectric elements 70 correspond to the multiple casing vibration throughholes 2a, and eachpiezoelectric element 70 is accommodated in a corresponding machine shell vibration throughhole 2a. The centers of theoutput module 10 , the infraredlight camera 62 , thevisible light camera 61 , theinfrared fill light 80 and the plurality ofpiezoelectric elements 70 are located on the same line segment, and theoutput module 10 , At least one of the infraredlight camera 62 , thevisible light camera 61 , and theinfrared fill light 80 . For example, the number ofpiezoelectric elements 70 is two, and from one end of the line segment to the other end, thepiezoelectric elements 70 , theoutput module 10 , theinfrared fill light 80 , thevisible light camera 61 , the infraredlight camera 62 , thepiezoelectric element 70 . (As shown in FIG. 10 ); or from one end of the line segment to the other end arepiezoelectric element 70,output module 10,visible light camera 61, infraredlight camera 62,piezoelectric element 70,infrared fill light 80, etc. For another example, the number ofpiezoelectric elements 70 is three, and from one end of the line segment to the other end are thepiezoelectric element 70, theoutput module 10, theinfrared fill light 80, thepiezoelectric element 70, thevisible light camera 61, and the infrared light. Thecamera 62, the piezoelectric element 70 (as shown in FIG. 11); or from one end of the line segment to the other end, thepiezoelectric element 70, theoutput module 10, thepiezoelectric element 70, thevisible light camera 61, the infraredlight camera 62,Piezoelectric element 70,infrared fill light 80, etc. Of course, the number of thepiezoelectric elements 70 and the arrangement of thepiezoelectric elements 70 , theoutput module 10 , theinfrared camera 62 , thevisible camera 61 , and theinfrared fill light 80 are not limited to the above examples. In the embodiment of the present invention, the plurality ofpiezoelectric elements 70 are combined with thecover plate 30 , specifically, the plurality ofpiezoelectric elements 70 are respectively attached to thecover plate 30 through thejoint member 30b. The processor of theelectronic device 100 is used to acquire the sound signal, and simultaneously apply an electrical signal corresponding to the sound signal to the two ends of the plurality ofpiezoelectric elements 70, and the plurality ofpiezoelectric elements 70 are all mechanically deformed. Theelectrical element 70 drives thevibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with thecover plate 30 . When the user's body is in contact with thevibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through the part of the user's body in contact with thevibration module 30a (eg, cartilage of the outer ear, teeth).
在本发明实施方式中，多个压电元件70同时从与盖板30结合的多个不同位置带动振动模组30a振动，振动模组30a的振动较为均匀且强度更大，有利于骨传导声稳定地传导至用户的听觉神经。In the embodiment of the present invention, a plurality ofpiezoelectric elements 70 drive thevibration module 30a to vibrate from a plurality of different positions combined with thecover plate 30 at the same time, and the vibration of thevibration module 30a is more uniform and stronger, which is beneficial to bone conduction sound Steady conduction to the user's auditory nerve.
请参阅图6、图12和图13，在某些实施方式中，成像模组60包括可见光摄像头61和红外光摄像头62。机壳20开设有相互间隔的机壳接近通孔23、机壳结构光通孔24、及机壳振动通孔2a。接近红外灯13与机壳接近通孔23对应，结构光投射器12与机壳结构光通孔24对应。压电元件70包括压电本体71及自压电本体71伸出的压电凸块72，压电凸块72的数量为多个，机壳振动通孔2a的数量为多个，多个压电凸块72与多个机壳振动通孔2a对应，每个压电凸块72部分收容在对应的机壳振动通孔2a内并与盖板30结合。输出模组10、红外光摄像头62、可见光摄像头61、及红外补光灯80位于盖板30与压电本体71之间。输出模组10、红外光摄像头62、可见光摄像头61、多个压电凸块72和红外补光灯80的中心位于同一线段上，相邻两个压电凸块72之间设置有输出模组10、红外光摄像头62、可见光摄像头61、及红外补光灯80中的至少一个。例如，压电凸块72的数量为两个，从线段的一端到另一端依次为压电凸块72、输出模组10、红外补光灯80、红外光摄像头62、可见光摄像头61、压电凸块72；或者从线段的一端到另一端依次为压电凸块72、输出模组10、可见光摄像头61、红外光摄像头62、压电凸块72、红外补光灯80等。又例如，压电凸块72的数量为三个，从线段的一端到另一端依次为压电凸块72、输出模组10、红外补光灯80、压电凸块72、红外光摄像头62、可见光摄像头61、压电凸块72；或者从线段的一端到另一端依次为压电凸块72、输出模组10、压电凸块72、可见光摄像头61、红外光摄像头62、压电凸块72、红外补光灯80等。再例如，压电凸块72的数量为五个，从线段的一端到另一端依次为压电凸块72、输出模组10、压电凸块72、红外补光灯80、压电凸块72、红外光摄像头62、压电凸块72、可见光摄像头61、压电凸块72(如图13所示)。当然，压电凸块72的数量以及压电凸块72、输出模组10、红外光摄像头62、可见光摄像头61、红外补光灯80的排列方式不限于上述的举例。在本发明实施例中，多个压电凸块72与盖板30结合，更具体地为多个压电凸块72分别通过接合件30b附接至盖板30上。电子装置100的处理器用于获取声音信号，并对压电元件70施加与该声音信号对应的电信号，包括压电本体71及压电凸块72在内的压电元件70发生机械形变，由此，多个压电凸块72从与盖板30结合的多个不同位置带动振动模组30a根据该电信号的频率振动。当用户的身体与振动模组30a接触时，骨传导声通过用户的身体与振动模组30a接触的部分(例如，外耳的软骨、牙齿)传送至用户的听觉神经。Referring to FIG. 6 , FIG. 12 and FIG. 13 , in some embodiments, theimaging module 60 includes avisible light camera 61 and an infraredlight camera 62 . Thecasing 20 is provided with a casing approaching throughhole 23 , a casing structure light throughhole 24 , and a casing vibration throughhole 2 a which are spaced apart from each other. The proximityinfrared lamp 13 corresponds to the proximity throughhole 23 of the casing, and the structuredlight projector 12 corresponds to the structured light throughhole 24 of the casing. Thepiezoelectric element 70 includes apiezoelectric body 71 and apiezoelectric bump 72 extending from thepiezoelectric body 71 . The electric bumps 72 correspond to the plurality of casing vibration throughholes 2 a , and eachpiezoelectric bump 72 is partially accommodated in the corresponding casing vibration throughholes 2 a and combined with thecover plate 30 . Theoutput module 10 , the infraredlight camera 62 , thevisible light camera 61 , and theinfrared fill light 80 are located between thecover plate 30 and thepiezoelectric body 71 . The center of theoutput module 10 , the infraredlight camera 62 , thevisible light camera 61 , the plurality ofpiezoelectric bumps 72 and theinfrared fill light 80 are located on the same line segment, and an output module is arranged between the two adjacentpiezoelectric bumps 72 10. At least one of the infraredlight camera 62 , thevisible light camera 61 , and theinfrared fill light 80 . For example, the number ofpiezoelectric bumps 72 is two, and from one end of the line segment to the other end, the piezoelectric bumps 72, theoutput module 10, theinfrared fill light 80, the infraredlight camera 62, thevisible light camera 61, thepiezoelectric Bump 72; orpiezoelectric bump 72,output module 10,visible light camera 61, infraredlight camera 62,piezoelectric bump 72,infrared fill light 80, etc. from one end to the other end of the line segment. For another example, the number of thepiezoelectric bumps 72 is three, and from one end of the line segment to the other end are thepiezoelectric bumps 72 , theoutput module 10 , theinfrared fill light 80 , the piezoelectric bumps 72 , and theinfrared camera 62 . ,visible light camera 61,piezoelectric bump 72; or from one end to the other end of the line segment arepiezoelectric bump 72,output module 10,piezoelectric bump 72,visible light camera 61, infraredlight camera 62,piezoelectric bump Block 72,infrared fill light 80, etc. For another example, the number ofpiezoelectric bumps 72 is five, and from one end of the line segment to the other end, the piezoelectric bumps 72 , theoutput module 10 , the piezoelectric bumps 72 , theinfrared fill light 80 , and the piezoelectric bumps are in sequence. 72.Infrared camera 62,piezoelectric bump 72,visible light camera 61, piezoelectric bump 72 (as shown in FIG. 13). Of course, the number of thepiezoelectric bumps 72 and the arrangement of thepiezoelectric bumps 72 , theoutput module 10 , theinfrared camera 62 , thevisible camera 61 , and theinfrared fill light 80 are not limited to the above examples. In the embodiment of the present invention, the plurality ofpiezoelectric bumps 72 are combined with thecover plate 30 , and more specifically, the plurality ofpiezoelectric bumps 72 are respectively attached to thecover plate 30 through thejoint members 30 b. The processor of theelectronic device 100 is used to obtain the sound signal, and apply an electrical signal corresponding to the sound signal to thepiezoelectric element 70, and thepiezoelectric element 70 including thepiezoelectric body 71 and thepiezoelectric bump 72 is mechanically deformed by Therefore, the plurality ofpiezoelectric bumps 72 drive thevibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with thecover plate 30 . When the user's body is in contact with thevibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through the part of the user's body in contact with thevibration module 30a (eg, cartilage of the outer ear, teeth).
在如图13所示的实施例中，机壳20开设有相互间隔的机壳振动通孔2a、输出通孔25、补光通孔26、红外光通孔27、可见光通孔28。机壳振动通孔2a与压电凸块72对应，输出通孔25与输出模组10对应，补光通孔26与红外补光灯80对应，红外光通孔27与红外光摄像头62对应，可见光通孔28与可见光摄像头61对应。其中，输出通孔25可替换成上述相互间隔的机壳接近通孔23和机壳结构光通孔24，或者输出通孔25由上述机壳接近通孔23和机壳结构光通孔24连通形成。另外，补光通孔26与红外补光灯80对应指红外补光灯80发出的红外光可从补光通孔26穿过，红外光通孔27与红外光摄像头62对应指红外光摄像头62可从红外光通孔27接收被物体反射的红外光，可见光通孔28与可见光摄像头61对应指可见光摄像头61可从可见光通孔28接收被物体反射的可见光。In the embodiment shown in FIG. 13 , thecasing 20 is provided with casing vibration throughholes 2 a , output throughholes 25 , fill light throughholes 26 , infrared light through holes 27 , and visible light throughholes 28 spaced apart from each other. The vibration throughhole 2a of the casing corresponds to thepiezoelectric bump 72, the output throughhole 25 corresponds to theoutput module 10, the fill light throughhole 26 corresponds to theinfrared fill light 80, and the infrared light through hole 27 corresponds to the infraredlight camera 62. The visible light throughhole 28 corresponds to thevisible light camera 61 . Wherein, the output throughhole 25 can be replaced with the above-mentioned casing proximity throughhole 23 and the casing structure light throughhole 24, or the output throughhole 25 is communicated with the above casing close throughhole 23 and the casing structure light throughhole 24 form. In addition, the correspondence between the fill light throughhole 26 and theinfrared fill light 80 means that the infrared light emitted by theinfrared fill light 80 can pass through the fill light throughhole 26, and the infrared light through hole 27 corresponds to the infraredlight camera 62 and refers to the infraredlight camera 62 The infrared light reflected by the object can be received from the infrared light through hole 27 , and the visible light throughhole 28 corresponds to thevisible light camera 61 , which means that thevisible light camera 61 can receive the visible light reflected by the object from the visible light throughhole 28 .
在本发明实施方式中，多个压电凸块72从与盖板30结合的多个不同位置带动振动模组30a振动，振动模组30a的振动较为均匀且强度更大，有利于骨传导声稳定地传导至用户的听觉神经；另外，多个压电凸块72自同一压电本体71伸出，便于对多个压电凸块72同时施加电信号，以从多个不同位置同步带动振动模组30a振动；再有，输出模组10、可见光摄像头61、红外光摄像头62、及红外补光灯80位于盖板30与压电本体71之间，并穿插设置有压电凸块72，电子装置100整体体积较小，节省了空间。In the embodiment of the present invention, the plurality ofpiezoelectric bumps 72 drive thevibration module 30a to vibrate from a plurality of different positions combined with thecover plate 30, and the vibration of thevibration module 30a is more uniform and stronger, which is beneficial to bone conduction sound It is stably conducted to the auditory nerve of the user; in addition, a plurality ofpiezoelectric bumps 72 protrude from the samepiezoelectric body 71, which facilitates the simultaneous application of electrical signals to the plurality ofpiezoelectric bumps 72 to synchronously drive vibration from multiple different positions Themodule 30a vibrates; furthermore, theoutput module 10, thevisible light camera 61, the infraredlight camera 62, and theinfrared fill light 80 are located between thecover plate 30 and thepiezoelectric body 71, and are interspersed withpiezoelectric bumps 72, The overall volume of theelectronic device 100 is small, which saves space.
请参阅图3，在某些实施方式中，输出模组10还包括接近灯透镜19。接近灯透镜19设置在封装壳体11内并与接近红外灯13对应。接近红外灯13发射的红外光在接近灯透镜19的作用下汇聚到接近窗口1132中射出，减少发射到封装侧壁112和封装顶部113的其他区域的光量。Referring to FIG. 3 , in some embodiments, theoutput module 10 further includes aproximity lamp lens 19 . Theproximity lamp lens 19 is disposed in thepackage housing 11 and corresponds to the proximityinfrared lamp 13 . The infrared light emitted by the proximityinfrared lamp 13 is concentrated into theproximity window 1132 under the action of theproximity lamp lens 19 to be emitted, thereby reducing the amount of light emitted to other areas of thepackage sidewall 112 and thepackage top 113 .
请参阅图3，在某些实施方式中，输出模组10还包括金属遮挡板18，金属遮挡板18位于封装壳体11内，且金属遮挡板18位于结构光投射器12与接近红外灯13之间。金属遮挡板18位于结构光投射器12与接近红外灯13之间，金属遮挡板18一方面可以屏蔽结构光投射器12与接近红外灯13相互之间的电磁干扰，结构光投射器12与接近红外灯13的发光强度和时序不会互相影响，另一方面金属遮挡板18可以用于隔绝结构光投射器12所在腔体与接近红外灯13所在的腔体，光线不会从一个腔体中进入另一个腔体。Referring to FIG. 3 , in some embodiments, theoutput module 10 further includes ametal shielding plate 18 , themetal shielding plate 18 is located in thepackage casing 11 , and themetal shielding plate 18 is located between the structuredlight projector 12 and the proximityinfrared lamp 13 between. Themetal shielding plate 18 is located between the structuredlight projector 12 and the proximityinfrared lamp 13. On the one hand, themetal shielding plate 18 can shield the electromagnetic interference between the structuredlight projector 12 and the proximityinfrared lamp 13. The luminous intensity and timing of theinfrared lamp 13 will not affect each other. On the other hand, themetal shielding plate 18 can be used to isolate the cavity where the structuredlight projector 12 is located and the cavity where theinfrared lamp 13 is located, so that light will not pass from one cavity. into another cavity.
请参阅图14，在某些实施方式中，输出模组10还包括光学封罩1a。光学封罩1a由透光材料制成，光学封罩1a形成在封装基板111上并位于封装壳体11内。光学封罩1a包裹住接近红外灯13。具体地，光学封罩1a可以通过灌胶注模成型工艺形成，光学封罩1a可以采用透明的热固性环氧树脂制成，以在使用中不易软化，光学封罩1a可以固定接近红外灯13的位置，且使得接近红外灯13在封装壳体11内不易晃动。Referring to FIG. 14, in some embodiments, theoutput module 10 further includes an optical cover 1a. The optical cover 1 a is made of a light-transmitting material, and the optical cover 1 a is formed on thepackage substrate 111 and located in thepackage case 11 . The optical envelope 1a encloses the proximityinfrared lamp 13 . Specifically, the optical cover 1a can be formed by a glue injection molding process, and the optical cover 1a can be made of a transparent thermosetting epoxy resin so as not to be easily softened in use, and the optical cover 1a can be fixed close to theinfrared lamp 13. position, and make the proximityinfrared lamp 13 not easy to shake in thepackage housing 11 .
请参阅图15，在某些实施方式中，接近传感器51与光感器52可以未集成在接收模组50中，或者说，接近传感器51与光感器52分体设置。此时，接近传感器51可以设置在镜座63的安装面631上；光感器52也可以设置在镜座63的安装面631上；或者接近传感器51与光感器52同时设置在镜座63的安装面631上。镜座63可以是红外光摄像头62的镜座63，也可以是可见光摄像头61的镜座63。Referring to FIG. 15 , in some embodiments, theproximity sensor 51 and thelight sensor 52 may not be integrated in the receivingmodule 50 , or in other words, theproximity sensor 51 and thelight sensor 52 are provided separately. At this time, theproximity sensor 51 can be arranged on the mountingsurface 631 of themirror base 63 ; theoptical sensor 52 can also be arranged on theinstallation surface 631 of themirror holder 63 ; or theproximity sensor 51 and theoptical sensor 52 can be arranged on themirror holder 63 at the same time on the mountingsurface 631. The lens mount 63 may be the lens mount 63 of the infraredlight camera 62 or the lens mount 63 of thevisible light camera 61 .
请参阅图16，在某些实施方式中，盖板30上还可以开设有盖板结构光通孔34，盖板结构光通孔34与机壳结构光通孔24对应，结构光投射器12发射的红外光穿过机壳结构光通孔24后可以从盖板结构光通孔34中穿出电子装置100。此时，盖板30上与机壳接近通孔23对应的位置可以设置红外透过油墨40，用户难以通过机壳接近通孔23看到电子装置100的内部的接近红外灯13，电子装置100的外形较美观。Referring to FIG. 16 , in some embodiments, thecover plate 30 may also be provided with a cover plate structure light throughhole 34 , the cover plate structure light throughhole 34 corresponds to the casing structure light throughhole 24 , and the structuredlight projector 12 After the emitted infrared light passes through the light throughhole 24 of the casing structure, it can pass through theelectronic device 100 through the light throughhole 34 of the cover plate structure. At this time, the infraredtransparent ink 40 can be provided on thecover plate 30 at the position corresponding to the throughhole 23 of the casing, and it is difficult for the user to see the proximityinfrared lamp 13 inside theelectronic device 100 through the throughhole 23 of the casing, and theelectronic device 100 The appearance is more beautiful.
请参阅图17，在某些实施方式中，盖板30上还可以开设盖板接近通孔33，盖板接近通孔33与机壳接近通孔23对应，接近红外灯13发射的红外光穿过机壳接近通孔23后可以从盖板接近通孔33中穿出电子装置100。此时，盖板30上与机壳结构光通孔24对应的位置可以设置红外透过油墨40，用户难以通过机壳结构光通孔24看到电子装置100的内部的结构光投射器12，电子装置100的外形较美观。Referring to FIG. 17 , in some embodiments, thecover plate 30 can also be provided with a cover plate proximity throughhole 33 , the cover plate proximity throughhole 33 corresponds to the casing proximity throughhole 23 , and the infrared light emitted by the proximityinfrared lamp 13 passes through After approaching the throughhole 23 through the casing, theelectronic device 100 can be passed through the cover plate approaching the throughhole 33 . At this time, theinfrared transmissive ink 40 can be provided on thecover 30 at the position corresponding to the light throughhole 24 of the casing structure, and it is difficult for the user to see the structuredlight projector 12 inside theelectronic device 100 through the light throughhole 24 of the casing structure. The appearance of theelectronic device 100 is beautiful.
请参阅图18，在某些实施方式中，接收模组50可以设置在封装基板111上。具体地，封装基板111的一部分用于承载结构光投射器12和接近红外灯13，或者说与封装侧壁112围成的空间对应；封装基板111的另一部分向外伸出，接收模组50可以固定在封装基板111上且位于封装壳体11外。封装基板111上可铺设线路，线路可以是结构光投射器12和接近红外灯13的控制和驱动线路，在一个例子中，线路为FPC的形式，FPC可以同时与接收模组50连接，以用于同时传输接收模组50的控制和驱动信号。Referring to FIG. 18 , in some embodiments, the receivingmodule 50 may be disposed on thepackaging substrate 111 . Specifically, a part of thepackage substrate 111 is used to carry the structuredlight projector 12 and the proximityinfrared lamp 13 , or corresponds to the space enclosed by thepackage side wall 112 ; another part of thepackage substrate 111 protrudes outward to receive themodule 50 It can be fixed on thepackage substrate 111 and located outside thepackage case 11 . Lines can be laid on thepackage substrate 111, and the lines can be the control and driving lines of the structuredlight projector 12 and the proximityinfrared lamp 13. In an example, the lines are in the form of FPC, and the FPC can be connected to the receivingmodule 50 at the same time to use At the same time, the control and driving signals of the receivingmodule 50 are transmitted.
此时，接收模组50可以集成有接近传感器51和光感器52，接近传感器51与光感器52共同形成单封装体结构，减小二者单独装配时的间隙；接收模组50也可以只包括接近传感器51，光感器52可以另行设置在其他位置；接收模组50也可以只包括光感器52，接近传感器51可以另行设置在其他位置。At this time, the receivingmodule 50 can be integrated with aproximity sensor 51 and alight sensor 52, and theproximity sensor 51 and thelight sensor 52 together form a single package structure to reduce the gap between the two when they are assembled separately; the receivingmodule 50 can also only be Theproximity sensor 51 is included, and thephoto sensor 52 may be provided at other positions; the receivingmodule 50 may also only include thephoto sensor 52, and theproximity sensor 51 may be provided at other positions.
请参阅图19，在某些实施方式中，成像模组60还包括基板66，图像传感器65设置在基板66上，接收模组50还可以固定在基板66上。具体地，基板66上设置有FPC，基板66的一部分位于镜座63内，另一部分从镜座63内伸出，FPC的一端位于镜座63内且用于承载图像传感器65，另一端可以与电子装置100的主板连接。接收模组50设置在基板66上时，接收模组50设置在镜座63外，接收模组50也可以与FPC连接。Referring to FIG. 19 , in some embodiments, theimaging module 60 further includes asubstrate 66 , theimage sensor 65 is disposed on thesubstrate 66 , and the receivingmodule 50 can also be fixed on thesubstrate 66 . Specifically, an FPC is provided on thebase plate 66, a part of thebase plate 66 is located in themirror base 63, and the other part protrudes from themirror base 63. One end of the FPC is located in themirror base 63 and is used to carry theimage sensor 65, and the other end can be connected to themirror base 63. The main board of theelectronic device 100 is connected. When the receivingmodule 50 is arranged on thebase plate 66, the receivingmodule 50 is arranged outside thelens holder 63, and the receivingmodule 50 can also be connected to the FPC.
进一步的，设置在基板66的接收模组50包括接近传感器51与光感器52，接近传感器51与光感器52共同形成单封装体结构，减小二者单独装配时的间隙，节约电子装置100内的安装空间。在其他实施方式中，设置在基板66的接收模组50包括接近传感器51或/和光感器52，接近传感器51和光感器52各自为单封装体结构。即，设置在基板66的接收模组50为单封装体结构的接近传感器51；或者，设置在基板66的接收模组50为单封装体结构的光感器52；或者，设置在基板66的接收模组50为单封装体结构的接近传感器51及单封装体结构的光感器52。Further, the receivingmodule 50 disposed on thesubstrate 66 includes aproximity sensor 51 and aphotoreceptor 52. Theproximity sensor 51 and thephotoreceptor 52 together form a single-package structure, which reduces the gap between the two when they are assembled separately and saves electronic devices. Installation space within 100. In other embodiments, the receivingmodule 50 disposed on thesubstrate 66 includes aproximity sensor 51 or/and alight sensor 52, and theproximity sensor 51 and thelight sensor 52 are each a single package structure. That is, the receivingmodule 50 provided on thesubstrate 66 is theproximity sensor 51 with a single package structure; or, the receivingmodule 50 provided on thesubstrate 66 is thephoto sensor 52 with a single package structure; The receivingmodule 50 is aproximity sensor 51 with a single package structure and aphoto sensor 52 with a single package structure.
成像模组60可以是可见光摄像头61与红外光摄像头62中的一个或两个。具体地，接收模组50可以固定在可见光摄像头61的基板66上；接收模组50可以固定在红外光摄像头62的基板66上。当接近传感器51与光感器52为分体封装时，接近传感器51可以固定在可见光摄像头61的基板66上，光感器52可以固定在红外光摄像头62的基板66上；或者，光感器52可以固定在可见光摄像头61的基板66上，接近传感器51可以固定在红外光摄像头62的基板66上；或者，接近传感器51与光感器52均固定在可见光摄像头61的基板66上；或者，接近传感器51与光感器52均固定在红外光摄像头62的基板66上。Theimaging module 60 may be one or both of thevisible light camera 61 and the infraredlight camera 62 . Specifically, the receivingmodule 50 can be fixed on thesubstrate 66 of thevisible light camera 61 ; the receivingmodule 50 can be fixed on thesubstrate 66 of theinfrared camera 62 . When theproximity sensor 51 and thelight sensor 52 are packaged separately, theproximity sensor 51 can be fixed on thesubstrate 66 of thevisible light camera 61, and thelight sensor 52 can be fixed on thesubstrate 66 of the infraredlight camera 62; 52 can be fixed on thesubstrate 66 of thevisible light camera 61, and theproximity sensor 51 can be fixed on thesubstrate 66 of theinfrared camera 62; alternatively, both theproximity sensor 51 and thelight sensor 52 are fixed on thesubstrate 66 of thevisible light camera 61; or, Both theproximity sensor 51 and thelight sensor 52 are fixed on thesubstrate 66 of theinfrared camera 62 .
进一步的，基板66还包括补强板，补强板设置在与接收模组50相背的一侧，以增加基板66的整体强度，使得FPC不易发生绕折，同时接收模组50(或接近传感器51或光感器52)设置在基板66上时不易发生晃动。在一个例子中，接收模组50(或接近传感器51或光感器52)还可以固定在镜座63的外侧壁上，例如通过粘结的方式固定在镜座63的外侧壁上。Further, thebase plate 66 also includes a reinforcing plate, and the reinforcing plate is arranged on the side opposite to the receivingmodule 50 to increase the overall strength of thebase plate 66, so that the FPC is not easily folded, and the receiving module 50 (or close to When thesensor 51 or the photoreceptor 52) is installed on thesubstrate 66, the shaking is less likely to occur. In one example, the receiving module 50 (or theproximity sensor 51 or the light sensor 52 ) may also be fixed on the outer side wall of themirror base 63 , for example, by bonding.
请参阅图20，在某些实施方式中，上述实施方式的电子装置100及成像模组60可替换为以下结构：成像模组60包括图像传感器65、相机壳体67及镜头模组68。相机壳体67的顶面670为阶梯面，顶面670包括第一子顶面671、第二子顶面672、及第三子顶面673，第二子顶面672与第一子顶面671倾斜连接并与第一子顶面671形成切口675，第三子顶面673与第二子顶面672倾斜连接，第二子顶面672位于第一子顶面671与第三子顶面673之间以连接第一子顶面671与第三子顶面673。第二子顶面672与第一子顶面671之间的夹角可以为钝角或直角，第二子顶面672与第三子顶面673之间的夹角可以为钝角或直角。切口675开设在相机壳体67的一个端部上，也就是说，切口675位于顶面670的边缘位置。第三子顶面673开设有出光通孔674，镜头模组68收容在相机壳体67内并与出光通孔674对应。图像传感器65收容在相机壳体67内并与镜头模组68对应，电子装置100外的光线能够穿过出光通孔674及镜头模组68并传递到图像传感器65上，图像传感器65将光信号转换为电信号。接收模组50设置在第一子顶面671处，接收模组50包括接近传感器51和光感器52。本实施方式中，成像模组60可以是可见光摄像头61，接收模组50为接近传感器51与光感器52共同形成的单封装体结构。接近传感器51与光感器52的中心连线方向可以与切口675的延伸方向一致(如图15所示)；或者，接近传感器51与光感器52的中心连线方向可以与切口675的延伸方向垂直或呈二者形成的夹角为锐角或钝角。在其他实施方式中，成像模组60可以是红外光摄像头62。Referring to FIG. 20 , in some embodiments, theelectronic device 100 and theimaging module 60 in the above-mentioned embodiments can be replaced with the following structures: theimaging module 60 includes animage sensor 65 , acamera housing 67 and alens module 68 . Thetop surface 670 of thecamera housing 67 is a stepped surface. Thetop surface 670 includes a firstsub-top surface 671, a secondsub-top surface 672, and a thirdsub-top surface 673. The secondsub-top surface 672 and the firstsub-top surface 671 is connected obliquely and forms acutout 675 with the firstsub-top surface 671, the thirdsub-top surface 673 is connected obliquely with the secondsub-top surface 672, and the secondsub-top surface 672 is located on the firstsub-top surface 671 and the third sub-top surface. 673 to connect the firstsub-top surface 671 and the thirdsub-top surface 673 . The angle between the secondsub-top surface 672 and the firstsub-top surface 671 may be an obtuse angle or a right angle, and the angle between the secondsub-top surface 672 and the thirdsub-top surface 673 may be an obtuse angle or a right angle. Thecutout 675 is opened on one end of thecamera housing 67 , that is, thecutout 675 is located at the edge of thetop surface 670 . The thirdsub-top surface 673 defines alight exit hole 674 , and thelens module 68 is accommodated in thecamera housing 67 and corresponds to thelight exit hole 674 . Theimage sensor 65 is accommodated in thecamera housing 67 and corresponds to thelens module 68. The light outside theelectronic device 100 can pass through thelight exit hole 674 and thelens module 68 and be transmitted to theimage sensor 65. Theimage sensor 65 transmits the light signal. converted to electrical signals. The receivingmodule 50 is disposed at the firstsub-top surface 671 , and the receivingmodule 50 includes aproximity sensor 51 and alight sensor 52 . In this embodiment, theimaging module 60 may be avisible light camera 61 , and the receivingmodule 50 is a single-package structure formed by theproximity sensor 51 and thephotosensor 52 . The direction of the line connecting the center of theproximity sensor 51 and thelight sensor 52 may be consistent with the extending direction of the cutout 675 (as shown in FIG. 15 ); The angle formed by the vertical direction or the two is an acute angle or an obtuse angle. In other embodiments, theimaging module 60 may be aninfrared camera 62 .
本实施方式的成像模组60开设有切口675，并且将接收模组50设置在第一子顶面671上，使接收模组50与成像模组60设置得较紧凑，二者共同占用的横向空间较小，节约了电子装置100内的安装空间；同时，接近传感器51和光感器52共同封装成接收模组50，减小二者单独装配时的间隙，节约电子装置100内的安装空间。Theimaging module 60 of the present embodiment is provided with acutout 675, and the receivingmodule 50 is disposed on the firstsub-top surface 671, so that the receivingmodule 50 and theimaging module 60 are set more compactly, and the transverse The space is small, which saves the installation space in theelectronic device 100 ; at the same time, theproximity sensor 51 and thelight sensor 52 are jointly packaged into the receivingmodule 50 , which reduces the gap when the two are assembled separately and saves the installation space in theelectronic device 100 .
请继续参阅图20，在某些实施方式中，上述实施方式的接收模组50设置在第一子顶面671上并位于相机壳体67的外部，具体地，整个接收模组50沿垂直于第一子顶面671的投影均可以位于第一子顶面671内(如图20所示)；或者，部分接收模组50沿垂直于第一子顶面671的投影位于第一子顶面671内。也就是说，接收模组50至少有一部分位于第一子顶面671的正上方，如此，接收模组50与成像模组60设置得较紧凑，二者共同占用的横向空间较小，进一步节约了电子装置100内的安装空间。在其他实施方式中，接收模组50包括接近传感器51和光感器52，但接近传感器51和光感器52为两个单独的单封装体结构，此时，各自为单封装体结构的接近传感器51和光感器52也可以都设置在第一子顶面671上。Please continue to refer to FIG. 20. In some embodiments, the receivingmodule 50 of the above-mentioned embodiments is disposed on the firstsub-top surface 671 and is located outside thecamera housing 67. Specifically, theentire receiving module 50 is perpendicular to The projections of the firstsub-top surface 671 may all be located in the first sub-top surface 671 (as shown in FIG. 20 ); or, part of the receivingmodule 50 is located on the first sub-top surface along the projection perpendicular to the firstsub-top surface 671Inside 671. That is to say, at least a part of the receivingmodule 50 is located directly above the firstsub-top surface 671. In this way, the receivingmodule 50 and theimaging module 60 are set more compactly, and the lateral space occupied by the two is small, which further saves The installation space in theelectronic device 100 is reduced. In other embodiments, the receivingmodule 50 includes aproximity sensor 51 and alight sensor 52, but theproximity sensor 51 and thelight sensor 52 are two separate single-package structures, in this case, each is a single-package structure of theproximity sensor 51 And thephotoreceptor 52 may also be disposed on the firstsub-top surface 671 .
请参阅图21，在某些实施方式中，上述实施方式的接收模组50仅包含接近传感器51，不包含光感器52，此时，接近传感器51(或接收模组50)与光感器52各自为单体封装结构，接近传感器51设置在第一子顶面671上，光感器52设置在除第一子顶面671的其他任意位置。Referring to FIG. 21 , in some embodiments, the receivingmodule 50 of the above-mentioned embodiment only includes theproximity sensor 51 and does not include thephoto sensor 52 . In this case, the proximity sensor 51 (or the receiving module 50 ) and thephoto sensor 52 are each a single package structure, theproximity sensor 51 is arranged on the firstsub-top surface 671 , and thephoto sensor 52 is arranged at any position other than the firstsub-top surface 671 .
请继续参阅图21，在某些实施方式中，上述实施方式的接收模组50仅包含光感器52，而不包含接近传感器51，此时，光感器52(或接收模组50)与接近传感器51各自为单体封装结构，光感器52设置在第一子顶面671上，接近传感器51设置在除第一子顶面671的其他任意位置。Please continue to refer to FIG. 21 , in some embodiments, the receivingmodule 50 of the above-mentioned embodiments only includes thelight sensor 52 , but does not include theproximity sensor 51 . In this case, the light sensor 52 (or the receiving module 50 ) and the Each of theproximity sensors 51 is a single package structure, thephoto sensor 52 is arranged on the firstsub-top surface 671 , and theproximity sensor 51 is arranged at any position other than the firstsub-top surface 671 .
请参阅图22，上述实施方式的第一子顶面671开设有透光孔676，接收模组50位于相机壳体67内并与透光孔676对应。具体地，当接收模组50仅包括接近传感器51而没有光感器52，并且光感器52设置在相机壳体67外时，透光孔676的数量可以为一个，电子装置100外部的光线能够穿过透光孔676并传递到接近传感器51上。本实施方式的接收模组50设置在相机壳体67内，使接收模组50与相机壳体67的结构更加稳定并便于将接收模组50与成像模组60安装到机壳20上。Referring to FIG. 22 , the firstsub-top surface 671 of the above embodiment is provided with a light-transmittinghole 676 , and the receivingmodule 50 is located in thecamera housing 67 and corresponds to the light-transmittinghole 676 . Specifically, when the receivingmodule 50 only includes theproximity sensor 51 without thelight sensor 52, and thelight sensor 52 is disposed outside thecamera housing 67, the number of light-transmittingholes 676 can be one, and the light outside theelectronic device 100 It can pass through the light-transmittinghole 676 and be transmitted to theproximity sensor 51 . The receivingmodule 50 in this embodiment is disposed in thecamera casing 67 , which makes the structures of the receivingmodule 50 and thecamera casing 67 more stable and facilitates the installation of the receivingmodule 50 and theimaging module 60 on thecasing 20 .
请继续参阅22，上述实施方式的第一子顶面671开设有透光孔676，接收模组50位于相机壳体67内并与透光孔676对应。具体地，当接收模组50仅包括有光感器52而没有接近传感器51，并且接近传感器51设置在相机壳体67外时，透光孔676的数量可以为一个，电子装置100外部的光线能够穿过透光孔676并传递到光感器52上。本实施方式的接收模组50设置在相机壳体67内，使接收模组50与相机壳体67的结构更加稳定并便于将接收模组50与成像模组60安装到机壳20上。Please continue to refer to 22, the firstsub-top surface 671 of the above embodiment is provided with a light-transmittinghole 676 , and the receivingmodule 50 is located in thecamera housing 67 and corresponds to the light-transmittinghole 676 . Specifically, when the receivingmodule 50 only includes thelight sensor 52 without theproximity sensor 51, and theproximity sensor 51 is disposed outside thecamera housing 67, the number of light-transmittingholes 676 can be one, and the light outside theelectronic device 100 Can pass through the light-transmittinghole 676 and pass to thephotoreceptor 52 . The receivingmodule 50 in this embodiment is disposed in thecamera casing 67 , which makes the structures of the receivingmodule 50 and thecamera casing 67 more stable and facilitates the installation of the receivingmodule 50 and theimaging module 60 on thecasing 20 .
请参阅图23，在某些实施方式中，上述实施方式的第一子顶面671开设有透光孔676，接收模组50位于相机壳体67内并与透光孔676对应。具体地，当接收模组50集成有接近传感器51与光感器52时，透光孔676可以为一个与接近传感器51及光感器52均对应的透光孔或两个相互间隔并分别与接近传感器51及光感器52对应的透光孔，电子装置100外部的光线能够穿过透光孔676并传递到接收模组50中的接近传感器51和光感器52上。在其他实施方式中，接收模组50包括接近传感器51和光感器52，但接近传感器51和光感器52为两个单独的单封装体结构，此时，各自为单封装体结构的接近传感器51和光感器52也可以都设置在相机壳体67内并与透光孔676对应。本实施方式的接收模组50设置在相机壳体67内，使接收模组50与相机壳体67的结构更加稳定并便于将接收模组50与成像模组60安装到机壳20上。Referring to FIG. 23 , in some embodiments, the firstsub-top surface 671 of the above-mentioned embodiment is provided with a light-transmittinghole 676 , and the receivingmodule 50 is located in thecamera housing 67 and corresponds to the light-transmittinghole 676 . Specifically, when the receivingmodule 50 is integrated with theproximity sensor 51 and thelight sensor 52, the light-transmittinghole 676 may be a light-transmitting hole corresponding to both theproximity sensor 51 and thelight sensor 52 or two spaced apart from each other and corresponding to each other. Proximity to the light-transmitting holes corresponding to thesensor 51 and thelight sensor 52 , the light outside theelectronic device 100 can pass through the light-transmittinghole 676 and be transmitted to theproximity sensor 51 and thelight sensor 52 in the receivingmodule 50 . In other embodiments, the receivingmodule 50 includes aproximity sensor 51 and alight sensor 52, but theproximity sensor 51 and thelight sensor 52 are two separate single-package structures, in this case, each is a single-package structure of theproximity sensor 51 Thelight sensor 52 and thelight sensor 52 can also be arranged in thecamera housing 67 and correspond to the light-transmittinghole 676 . The receivingmodule 50 in this embodiment is disposed in thecamera casing 67 , which makes the structures of the receivingmodule 50 and thecamera casing 67 more stable and facilitates the installation of the receivingmodule 50 and theimaging module 60 on thecasing 20 .
请参阅图23，在某些实施方式中，上述实施方式的第一子顶面671开设有透光孔676，接收模组50位于相机壳体67内并与透光孔676对应。成像模组60还包括基板66，图像传感器65设置在基板66上，接收模组50还可以固定在基板66上并收容在相机壳体67内。具体地，基板66上设置有FPC，FPC的一端位于相机壳体67内且用于承载图像传感器65，另一端可以与电子装置100的主板连接。在其他实施方式中，接收模组50也可以与FPC连接。本实施方式中，设置在基板66上的接收模组50包括接近传感器51与光感器52，接近传感器51与光感器52共同形成单封装体结构，减小二者单独装配时的间隙，节约电子装置100内的安装空间。Referring to FIG. 23 , in some embodiments, the firstsub-top surface 671 of the above-mentioned embodiment is provided with a light-transmittinghole 676 , and the receivingmodule 50 is located in thecamera housing 67 and corresponds to the light-transmittinghole 676 . Theimaging module 60 further includes asubstrate 66 on which theimage sensor 65 is disposed. The receivingmodule 50 can also be fixed on thesubstrate 66 and accommodated in thecamera housing 67 . Specifically, thesubstrate 66 is provided with an FPC, one end of the FPC is located in thecamera housing 67 and is used to carry theimage sensor 65 , and the other end can be connected to the main board of theelectronic device 100 . In other embodiments, the receivingmodule 50 may also be connected to the FPC. In this embodiment, the receivingmodule 50 disposed on thesubstrate 66 includes aproximity sensor 51 and aphotoreceptor 52. Theproximity sensor 51 and thephotoreceptor 52 together form a single package structure, reducing the gap between the two when they are assembled separately. The installation space in theelectronic device 100 is saved.
在其他实施方式中，接收模组50仅包含有接近传感器51，光感器52不集成在接收模组50中，也就是说，接收模组50为接近传感器51的单体封装结构，光感器52也为单体封装结构，接近传感器51可以固定在基板66上并收容在相机壳体67内；或者，当基板66的一部分位于相机壳体67内，另一部分从相机壳体67内伸出时，光感器52也可以固定在基板66上并位于相机壳体67外。In other embodiments, the receivingmodule 50 only includes theproximity sensor 51, and thelight sensor 52 is not integrated in the receivingmodule 50, that is to say, the receivingmodule 50 is a single package structure of theproximity sensor 51, and the light sensor Thedevice 52 is also a single package structure, and theproximity sensor 51 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67; When out, thelight sensor 52 can also be fixed on thebase plate 66 and located outside thecamera housing 67 .
在又一实施方式中，接收模组50上仅包含有光感器52，接近传感器51不集成在接收模组50中，也就是说，接收模组50为光感器52的单体封装结构，接近传感器51也为单体封装结构，接近传感器51可以固定在基板66上并收容在相机壳体67内；或者，当基板66的一部分位于相机壳体67内，另一部分从相机壳体67内伸出时，接近传感器51也可以固定在基板66上并位于相机壳体67外。In yet another embodiment, the receivingmodule 50 only includes thelight sensor 52 , and theproximity sensor 51 is not integrated in the receivingmodule 50 , that is, the receivingmodule 50 is a single package structure of thelight sensor 52 . , theproximity sensor 51 is also a single package structure, theproximity sensor 51 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67; or, when a part of thesubstrate 66 is located in thecamera housing 67, the other part Theproximity sensor 51 may also be fixed on thebase plate 66 and located outside thecamera housing 67 when extended inward.
本实施方式的接收模组50设置在相机壳体67内，使接收模组50与相机壳体67的结构更加稳定并便于将接收模组50与成像模组60安装到机壳20上；同时，成像模组60设置基板66并将接收模组50设置在基板66上，使接收模组50能够稳固地安装在相机壳体67内。The receivingmodule 50 of this embodiment is disposed in thecamera casing 67, which makes the structures of the receivingmodule 50 and thecamera casing 67 more stable and facilitates the installation of the receivingmodule 50 and theimaging module 60 on thecasing 20; , theimaging module 60 is provided with abase plate 66 and the receivingmodule 50 is set on thebase plate 66 , so that the receivingmodule 50 can be stably installed in thecamera housing 67 .
请参阅图24，在某些实施方式中，上述实施方式的电子装置100及成像模组60可替换为以下结构：成像模组60为双摄模组，包括两个图像传感器65、相机壳体67及两个镜头模组68。相机壳体67的顶面670为阶梯面，顶面670包括第一梯面677、低于第一梯面677的第二梯面678、及第一连接面679a。第一连接面679a与第二梯面678倾斜连接并与第二梯面678形成切口675，第一连接面679a与第一梯面677倾斜连接，第一连接面679a位于第一梯面677与第二梯面678之间以连接第一梯面677与第二梯面678。第一连接面679a与第一梯面677之间的夹角可以为钝角或直角，第一连接面679a与第二梯面678之间的夹角可以为钝角或直角。切口675开设在相机壳体67的一个端部上，也就是说，切口675位于顶面670的边缘位置。两个出光通孔674均开设在第一梯面677上并均位于切口675的同一侧，两个出光通孔674的中心连线与切口675的延伸方向垂直。两个镜头模组68均收容在相机壳体67内并与两个出光通孔674分别对应，两个图像传感器65收容在相机壳体67内并与两个镜头模组68分别对应，电子装置100外的光线能够穿过出光通孔674及镜头模组68并传递到图像传感器65上。本实施方式中，成像模组60可以是可见光摄像头61，此时两个镜头模组68均为可见光摄像头61对应的镜头模组。接收模组50设置在第二梯面678上并位于相机壳体67外。接收模组50为接近传感器51与光感器52共同形成的单封装体结构。接近传感器51与光感器52的中心连线方向可以与切口675的延伸方向一致；或者，接近传感器51与光感器52的中心连线方向可以与切口675的延伸方向垂直(如图24所示)或二者形成的夹角为锐角或钝角。在其他实施方式中，成像模组60可以是红外光摄像头62，此时两个镜头模组68均为红外光摄像头62对应的镜头模组。在又一实施方式中，成像模组60包括可见光摄像头61及红外光摄像头62，此时其中镜头模组68为红外光摄像头62对应的镜头模组，另一个镜头模组68为可见光摄像头61对应的镜头模组。Referring to FIG. 24, in some embodiments, theelectronic device 100 and theimaging module 60 of the above-mentioned embodiments can be replaced with the following structures: theimaging module 60 is a dual-camera module, including twoimage sensors 65, acamera housing 67 and twolens modules 68. Thetop surface 670 of thecamera housing 67 is a stepped surface, and thetop surface 670 includes a first steppedsurface 677 , a second steppedsurface 678 lower than the first steppedsurface 677 , and a first connectingsurface 679 a. The first connectingsurface 679a is connected obliquely with the second steppedsurface 678 and forms acutout 675 with the second steppedsurface 678. The first connectingsurface 679a is connected with the first steppedsurface 677 obliquely. Between the second steppedsurfaces 678 , the first steppedsurface 677 and the second steppedsurface 678 are connected. The included angle between the first connectingsurface 679a and the first steppedsurface 677 may be an obtuse angle or a right angle, and the included angle between the first connectingsurface 679a and the second steppedsurface 678 may be an obtuse angle or a right angle. Thecutout 675 is opened on one end of thecamera housing 67 , that is, thecutout 675 is located at the edge of thetop surface 670 . The two light-exit throughholes 674 are both opened on thefirst step surface 677 and located on the same side of thecutout 675 . The twolens modules 68 are accommodated in thecamera housing 67 and correspond to the two light exit holes 674 respectively. The twoimage sensors 65 are accommodated in thecamera housing 67 and correspond to the twolens modules 68 respectively. The electronic device The light outside 100 can pass through thelight exit hole 674 and thelens module 68 and be transmitted to theimage sensor 65 . In this embodiment, theimaging module 60 may be avisible light camera 61 , and in this case, the twolens modules 68 are both lens modules corresponding to thevisible light camera 61 . The receivingmodule 50 is disposed on thesecond step surface 678 and is located outside thecamera housing 67 . The receivingmodule 50 is a single package structure formed by theproximity sensor 51 and thephoto sensor 52 together. The direction of the center line connecting theproximity sensor 51 and thephotoreceptor 52 may be consistent with the extending direction of thecutout 675; shown) or the angle formed by the two is an acute angle or an obtuse angle. In other embodiments, theimaging module 60 may be an infraredlight camera 62 , and in this case, the twolens modules 68 are lens modules corresponding to the infraredlight camera 62 . In yet another embodiment, theimaging module 60 includes avisible light camera 61 and an infraredlight camera 62 , wherein thelens module 68 is a lens module corresponding to the infraredlight camera 62 , and theother lens module 68 is corresponding to thevisible light camera 61 lens module.
本实施方式的成像模组60开设有切口675，并且将接收模组50设置在第二梯面678上，使接收模组50与成像模组60设置得较紧凑，二者共同占用的横向空间较小，节约了电子装置100内的安装空间；同时，接近传感器51和光感器52共同封装成接收模组50，减小二者单独装配时的间隙，节约电子装置100内的安装空间。Theimaging module 60 of this embodiment is provided with acutout 675, and the receivingmodule 50 is disposed on the second steppedsurface 678, so that the receivingmodule 50 and theimaging module 60 are set more compactly, and the lateral space occupied by the two together At the same time, theproximity sensor 51 and thelight sensor 52 are packaged together to form the receivingmodule 50, which reduces the gap when the two are assembled separately and saves the installation space in theelectronic device 100.
请参阅图25，在某些实施方式中，上述实施方式的切口675开设在顶面670的中间位置上，第一梯面677被切口675分隔成第一子梯面677a与第二子梯面677b，第一子梯面677a与第二子梯面677b分别位于切口675的相对两侧，两个出光通孔674分别开设在第一子梯面677a及第二子梯面677b上，安装在相机壳体67内的镜头模组68也位于切口675的相对两侧。此时，切口675由第二梯面678、第一连接面679a及第二连接面679b围成，第一连接面679a倾斜连接第一子顶面677a与第二梯面678并位于第一子顶面677a与第二梯面678之间，第二连接面679b倾斜连接第二子顶面677b与第二梯面678并位于第二子顶面677b与第二梯面678之间。本实施方式中，第一梯面677与第二梯面678平行，第一连接面679a与第一子梯面677a的夹角为钝角，第二连接面679b与第二子梯面677b的夹角为钝角。在其他实施方式中，第一连接面679a与第一子梯面677a的夹角为直角，第二连接面679b与第二子梯面677b的夹角为直角。相对于将切口675开设在顶面670的边缘位置，本实施方式的切口675开设在顶面670的中间位置能够使切口675的宽度更宽，从而便于将接收模组50设置在第二梯面678上。Referring to FIG. 25 , in some embodiments, thecutout 675 of the above embodiment is opened at the middle position of thetop surface 670 , and thefirst step surface 677 is divided into a firstsub-step surface 677 a and a second sub-step surface by thecutout 675 . 677b, the firstsub-ladder surface 677a and the secondsub-ladder surface 677b are located on opposite sides of thecutout 675, respectively, and the two light-emitting throughholes 674 are respectively opened on the firstsub-ladder surface 677a and the secondsub-ladder surface 677b, and are installed on theThe lens modules 68 in thecamera housing 67 are also located on opposite sides of thecutout 675 . At this time, thecutout 675 is surrounded by the second steppedsurface 678, the first connectingsurface 679a and the second connectingsurface 679b, and the first connectingsurface 679a is connected obliquely to the firstsub-top surface 677a and the second steppedsurface 678 and is located in thefirst sub-surface 679a. Between thetop surface 677 a and the second steppedsurface 678 , the second connectingsurface 679 b connects the secondsub top surface 677 b and the second steppedsurface 678 obliquely and is located between the secondsub top surface 677 b and the second steppedsurface 678 . In this embodiment, the first steppedsurface 677 and the second steppedsurface 678 are parallel, the included angle between the first connectingsurface 679a and the firstsub-stepped surface 677a is an obtuse angle, and the included angle between the second connectingsurface 679b and the secondsub-stepped surface 677b is an obtuse angle. The angle is obtuse. In other embodiments, the included angle between the first connectingsurface 679a and the first sub-step 677a is a right angle, and the included angle between the second connectingsurface 679b and the second sub-step 677b is a right angle. Compared with opening thecutout 675 at the edge position of thetop surface 670 , the opening of thecutout 675 in the middle position of thetop surface 670 in this embodiment can make the width of thecutout 675 wider, thereby facilitating the setting of the receivingmodule 50 on the second stepped surface. 678 on.
请参阅图24及图25，在某些实施方式中，上述实施方式的接收模组50设置在第二梯面678上并位于相机壳体67的外部。具体地，当切口675开设在顶面670的边缘位置时，整个接收模组50沿垂直于第二梯面678的投影均可以位于第二梯面678内；或者，部分接收模组50沿垂直于第二梯面678的投影位于第二梯面678内(如图24所示)。也就是说，接收模组50至少有一部分位于第二梯面678的正上方。当切口675开设在顶面670的中间位置上时，整个接收模组50沿垂直于第二梯面678的投影均可以位于第二梯面678内(如图25所示)。如此，接收模组50与成像模组60设置得较紧凑，二者共同占用的横向空间较小，进一步节约了电子装置100内的安装空间。在其他实施方式中，接收模组50包括接近传感器51和光感器52，但接近传感器51和光感器52为两个单独的单封装体结构，此时，各自为单封装体结构的接近传感器51和光感器52也可以都设置在第二梯面678上。Referring to FIGS. 24 and 25 , in some embodiments, the receivingmodule 50 of the above-mentioned embodiments is disposed on the second steppedsurface 678 and is located outside thecamera housing 67 . Specifically, when thecutout 675 is opened at the edge of thetop surface 670, theentire receiving module 50 can be located in the second steppedsurface 678 along the projection perpendicular to the second steppedsurface 678; The projection on the second steppedsurface 678 is located within the second stepped surface 678 (as shown in FIG. 24 ). That is, at least a part of the receivingmodule 50 is located directly above the second steppedsurface 678 . When thecutout 675 is opened at the middle position of thetop surface 670 , theentire receiving module 50 can be located in the second steppedsurface 678 along the projection perpendicular to the second stepped surface 678 (as shown in FIG. 25 ). In this way, the receivingmodule 50 and theimaging module 60 are set more compactly, and the lateral space occupied by the two is small, which further saves the installation space in theelectronic device 100 . In other embodiments, the receivingmodule 50 includes aproximity sensor 51 and alight sensor 52, but theproximity sensor 51 and thelight sensor 52 are two separate single-package structures, in this case, each is a single-package structure of theproximity sensor 51 And thephotoreceptor 52 may also be disposed on thesecond step surface 678 .
请参阅图25，在某些实施方式中，上述实施方式的接收模组50仅包含有接近传感器51，接收模组50不包含光感器52，此时，接近传感器51(或接收模组50)与光感器52各自为单体封装结构，接近传感器51设置在第二梯面678上，光感器52设置在成像模组60外的机壳20上。Referring to FIG. 25 , in some embodiments, the receivingmodule 50 of the above-mentioned embodiments only includes theproximity sensor 51 , and the receivingmodule 50 does not include thephoto sensor 52 . In this case, the proximity sensor 51 (or the receiving module 50 ) and thelight sensor 52 are each a single package structure, theproximity sensor 51 is arranged on thesecond step surface 678 , and thelight sensor 52 is arranged on thecasing 20 outside theimaging module 60 .
请参阅图25，在某些实施方式中，上述实施方式的接收模组50仅包含有光感器52，接收模组50不包含接近传感器51，此时，光感器52(或接收模组50)与接近传感器51各自为单体封装结构，光感器52设置在第二梯面678上，接近传感器51设置在成像模组60外的机壳20上。Please refer to FIG. 25 , in some embodiments, the receivingmodule 50 of the above-mentioned embodiments only includes thephoto sensor 52 , and the receivingmodule 50 does not include theproximity sensor 51 . In this case, the photo sensor 52 (or the receiving module 50) Theproximity sensor 51 and theproximity sensor 51 are each in a single package structure, thephoto sensor 52 is arranged on thesecond step surface 678 , and theproximity sensor 51 is arranged on thecasing 20 outside theimaging module 60 .
请参阅图26，上述实施方式的第二梯面678开设有透光孔676，接收模组50位于相机壳体67内并与透光孔676对应。具体地，当接收模组50仅包括接近传感器51而没有光感器52，并且光感器52设置在相机壳体67外时，透光孔676的数量可以为一个，电子装置100外部的光线能够穿过透光孔676并传递到接近传感器51上。本实施方式的接收模组50设置在相机壳体67内，使接收模组50与相机壳体67的结构更加稳定并便于将接收模组50与成像模组60安装到机壳20上。Referring to FIG. 26 , the second steppedsurface 678 of the above-mentioned embodiment is provided with a light-transmittinghole 676 , and the receivingmodule 50 is located in thecamera housing 67 and corresponds to the light-transmittinghole 676 . Specifically, when the receivingmodule 50 only includes theproximity sensor 51 without thelight sensor 52, and thelight sensor 52 is disposed outside thecamera housing 67, the number of light-transmittingholes 676 can be one, and the light outside theelectronic device 100 It can pass through the light-transmittinghole 676 and be transmitted to theproximity sensor 51 . The receivingmodule 50 in this embodiment is disposed in thecamera casing 67 , which makes the structures of the receivingmodule 50 and thecamera casing 67 more stable and facilitates the installation of the receivingmodule 50 and theimaging module 60 on thecasing 20 .
请继续参阅图26，上述实施方式的第二梯面678开设有透光孔676，接收模组50位于相机壳体67内并与透光孔676对应。具体地，当接收模组50仅包括有光感器52而没有接近传感器51，并且接近传感器51设置在相机壳体67外时，透光孔676的数量可以为一个，电子装置100外部的光线能够穿过透光孔676并传递到光感器52上。本实施方式的接收模组50设置在相机壳体67内，使接收模组50与相机壳体67的结构更加稳定并便于将接收模组50与成像模组60安装到机壳20上。Please continue to refer to FIG. 26 , thesecond step surface 678 of the above-mentioned embodiment has a light-transmittinghole 676 , and the receivingmodule 50 is located in thecamera housing 67 and corresponds to the light-transmittinghole 676 . Specifically, when the receivingmodule 50 only includes thelight sensor 52 without theproximity sensor 51, and theproximity sensor 51 is disposed outside thecamera housing 67, the number of light-transmittingholes 676 can be one, and the light outside theelectronic device 100 Can pass through the light-transmittinghole 676 and pass to thephotoreceptor 52 . The receivingmodule 50 in this embodiment is disposed in thecamera casing 67 , which makes the structures of the receivingmodule 50 and thecamera casing 67 more stable and facilitates the installation of the receivingmodule 50 and theimaging module 60 on thecasing 20 .
请参阅图27，在某些实施方式中，上述实施方式的第二梯面678开设有透光孔676，接收模组50位于相机壳体67内并与透光孔676对应。具体地，当接收模组50集成有接近传感器51与光感器52时，透光孔676可以为一个与接近传感器51及光感器52均对应的透光孔或两个相互间隔并分别与接近传感器51及光感器52对应的透光孔，电子装置100外部的光线能够穿过透光孔676并传递到接收模组50中的接近传感器51和光感器52上。在其他实施方式中，接收模组50包括接近传感器51和光感器52，但接近传感器51和光感器52为两个单独的单封装体结构，此时，各自为单封装体结构的接近传感器51和光感器52也可以都设置在相机壳体67内并与透光孔676对应。本实施方式的接收模组50设置在相机壳体67内，使接收模组50与相机壳体67的结构更加稳定并便于将接收模组50与成像模组60安装到机壳20上。Referring to FIG. 27 , in some embodiments, the light-transmittingholes 676 are formed on the second steppedsurface 678 of the above-mentioned embodiments, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to the light-transmittingholes 676 . Specifically, when the receivingmodule 50 is integrated with theproximity sensor 51 and thelight sensor 52, the light-transmittinghole 676 may be a light-transmitting hole corresponding to both theproximity sensor 51 and thelight sensor 52 or two spaced apart from each other and corresponding to each other. Proximity to the light-transmitting holes corresponding to thesensor 51 and thelight sensor 52 , the light outside theelectronic device 100 can pass through the light-transmittinghole 676 and be transmitted to theproximity sensor 51 and thelight sensor 52 in the receivingmodule 50 . In other embodiments, the receivingmodule 50 includes aproximity sensor 51 and alight sensor 52, but theproximity sensor 51 and thelight sensor 52 are two separate single-package structures, in this case, each is a single-package structure of theproximity sensor 51 Thelight sensor 52 and thelight sensor 52 can also be arranged in thecamera housing 67 and correspond to the light-transmittinghole 676 . The receivingmodule 50 in this embodiment is disposed in thecamera casing 67 , which makes the structures of the receivingmodule 50 and thecamera casing 67 more stable and facilitates the installation of the receivingmodule 50 and theimaging module 60 on thecasing 20 .
请继续参阅图27，在某些实施方式中，上述实施方式的第二梯面678开设有透光孔676，接收模组50位于相机壳体67内并与透光孔676对应。成像模组60还包括基板66，图像传感器65设置在基板66上，接收模组50还可以固定在基板66上并收容在相机壳体67内。具体地，基板66上设置有FPC，FPC的一端位于相机壳体67内且用于承载图像传感器65，另一端可以与电子装置100的主板连接。在其他实施方式中，接收模组50也可以与FPC连接。本实施方式中，设置在基板66上的接收模组50包括接近传感器51与光感器52，接近传感器51与光感器52共同形成单封装体结构，减小二者单独装配时的间隙，节约电子装置100内的安装空间。Please continue to refer to FIG. 27 , in some embodiments, the second steppedsurface 678 of the above-mentioned embodiment is provided with a light-transmittinghole 676 , and the receivingmodule 50 is located in thecamera housing 67 and corresponds to the light-transmittinghole 676 . Theimaging module 60 further includes asubstrate 66 on which theimage sensor 65 is disposed. The receivingmodule 50 can also be fixed on thesubstrate 66 and accommodated in thecamera housing 67 . Specifically, thesubstrate 66 is provided with an FPC, one end of the FPC is located in thecamera housing 67 and is used to carry theimage sensor 65 , and the other end can be connected to the main board of theelectronic device 100 . In other embodiments, the receivingmodule 50 may also be connected to the FPC. In this embodiment, the receivingmodule 50 disposed on thesubstrate 66 includes aproximity sensor 51 and aphotoreceptor 52. Theproximity sensor 51 and thephotoreceptor 52 together form a single package structure, reducing the gap between the two when they are assembled separately. The installation space in theelectronic device 100 is saved.
在其他实施方式中，接收模组50仅包含有接近传感器51，光感器52不集成在接收模组50中，也就是说，接收模组50为接近传感器51的单体封装结构，光感器52也为单体封装结构，光感器52可以固定在基板66上并收容在相机壳体67内；或者，当基板66的一部分位于相机壳体67内，另一部分从相机壳体67内伸出时，光感器52也可以固定在基板66上并位于相机壳体67外。In other embodiments, the receivingmodule 50 only includes theproximity sensor 51, and thelight sensor 52 is not integrated in the receivingmodule 50, that is to say, the receivingmodule 50 is a single package structure of theproximity sensor 51, and the light sensor Thesensor 52 is also a single package structure, thelight sensor 52 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67; When extended, thelight sensor 52 may also be fixed to thebase plate 66 and located outside thecamera housing 67 .
在又一实施方式中，接收模组50仅包含有光感器52，接近传感器51不集成在接收模组50中，也就是说，接收模组50为光感器52的单体封装结构，接近传感器51也为单体封装结构，光感器52可以固定在基板66上并收容在相机壳体67内；或者，当基板66的一部分位于相机壳体67内，另一部分从相机壳体67内伸出时，接近传感器51也可以固定在基板66上并位于相机壳体67外。In yet another embodiment, the receivingmodule 50 only includes thelight sensor 52, and theproximity sensor 51 is not integrated in the receivingmodule 50, that is, the receivingmodule 50 is a single package structure of thelight sensor 52, Theproximity sensor 51 is also a single package structure, and thelight sensor 52 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67; Theproximity sensor 51 may also be fixed on thebase plate 66 and located outside thecamera housing 67 when extended inward.
本实施方式的接收模组50设置在相机壳体67内，使接收模组50与相机壳体67的结构更加稳定并便于将接收模组50与成像模组60安装到机壳20上；同时，成像模组60设置基板66并将接收模组50设置在基板66上，使接收模组50能够稳固地安装在相机壳体67内。The receivingmodule 50 of this embodiment is disposed in thecamera casing 67, which makes the structures of the receivingmodule 50 and thecamera casing 67 more stable and facilitates the installation of the receivingmodule 50 and theimaging module 60 on thecasing 20; , theimaging module 60 is provided with abase plate 66 and the receivingmodule 50 is set on thebase plate 66 , so that the receivingmodule 50 can be stably installed in thecamera housing 67 .
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of this specification, reference is made to the terms "some embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples." Described means that a particular feature, structure, material, or characteristic described in connection with the described embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features delimited with "first", "second" may expressly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, unless expressly and specifically defined otherwise.
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described above, it should be understood that the above-mentioned embodiments are exemplary and should not be construed as limiting the present invention. Embodiments are subject to changes, modifications, substitutions and alterations, and the scope of the present invention is defined by the claims and their equivalents.
