CN108156285B - electronic device - Google Patents

Abstract

Translated fromChinese

本发明公开的电子装置包括机壳、输出模组、振动模组、压电元件、成像模组和接收模组。输出模组包括封装壳体、红外补光灯、及接近红外灯。封装壳体包括封装基板，红外补光灯与接近红外灯封装在封装壳体内并承载在封装基板上。压电元件与振动模组结合并与输出模组间隔。压电元件用于在被施加电信号时发生形变以使振动模组振动。成像模组包括相机壳体及两个镜头模组。相机壳体的顶面上开设有切口以形成阶梯形的顶面。接收模组设置在顶面的第二梯面处并包括接近传感器和/或光感器。输出模组的集成度较高且接收模组与成像模组设置得较紧凑，节约了电子装置的安装空间；电子装置采用压电元件和振动模组实现骨传导传声，有效保证了通话内容的私密性。

The electronic device disclosed by the invention includes a casing, an output module, a vibration module, a piezoelectric element, an imaging module and a receiving module. The output module includes a package casing, an infrared fill light, and a near-infrared light. The package housing includes a package substrate, and the infrared supplementary light and the near-infrared lamp are packaged in the package housing and carried on the package substrate. The piezoelectric element is combined with the vibration module and spaced from the output module. The piezoelectric element is used to deform when an electrical signal is applied to make the vibration module vibrate. The imaging module includes a camera housing and two lens modules. A cutout is formed on the top surface of the camera housing to form a stepped top surface. The receiving module is arranged at the second step surface of the top surface and includes a proximity sensor and/or a light sensor. The integration of the output module is high, and the receiving module and the imaging module are set more compactly, which saves the installation space of the electronic device; the electronic device adopts piezoelectric elements and vibration modules to realize bone conduction sound transmission, which effectively ensures the content of the call. privacy.

Description

Electronic device

Technical Field

The present invention relates to the field of consumer electronics, and more particularly, to an electronic device.

Background

Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.

Disclosure of Invention

The embodiment of the invention provides an electronic device.

An electronic device according to an embodiment of the present invention includes:

a housing;

the output module is arranged in the shell and comprises a packaging shell, an infrared light supplementing lamp and a near infrared lamp, the packaging shell comprises a packaging substrate, the infrared light supplementing lamp and the near infrared lamp are packaged in the packaging shell and are borne on the packaging substrate, and the infrared light supplementing lamp and the near infrared lamp can emit infrared light rays to the outside of the packaging shell at different powers;

the vibration module is arranged on the shell;

a piezoelectric element coupled to the vibration module and spaced apart from the output module, the piezoelectric element being configured to deform when an electrical signal is applied thereto to vibrate the vibration module;

the imaging module is arranged on the shell and comprises a camera shell and two lens modules, wherein a notch is formed in the top surface of the camera shell to form a stepped top surface, the top surface comprises a first step surface and a second step surface lower than the first step surface, two light-emitting through holes are formed in the first step surface, and each light-emitting through hole corresponds to one lens module; and

a receiving module disposed at the second tread, the receiving module including a proximity sensor and/or a light sensor.

In some embodiments, the vibration module includes a display screen and a transparent cover plate, the display screen is disposed on the housing and forms an accommodating cavity together with the housing, the cover plate is disposed on the housing and located on a side of the display screen away from the accommodating cavity, the display screen is combined with the cover plate, the housing is provided with a housing approaching through hole, a housing light supplement through hole and a housing vibration through hole which are spaced from each other, the approaching infrared lamp corresponds to the housing approaching through hole, the infrared light supplement lamp corresponds to the housing light supplement through hole, and the piezoelectric element is accommodated in the housing vibration through hole and combined with the cover plate.

In some embodiments, the piezoelectric element and the display screen are attached to the cover plate by a joint.

In some embodiments, the output module further includes a chip, and the infrared fill-in light and the near infrared light are formed on one chip.

In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, a light supplement window and an access window are formed at the package top, the light supplement window corresponds to the infrared light supplement lamp, and the access window corresponds to the infrared light approaching lamp.

In some embodiments, the output module further includes a light supplement lamp lens, and the light supplement lamp lens is disposed in the package housing and corresponds to the infrared light supplement lamp; and/or

The output module is characterized by further comprising a proximity lamp lens, wherein the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp.

In some embodiments, the output module further comprises a light supplement lamp lens and a proximity lamp lens, the light supplement lamp lens and the proximity lamp lens are arranged in the packaging shell, the light supplement lamp lens corresponds to the infrared light supplement lamp, the proximity lamp lens corresponds to the proximity infrared lamp, and the light supplement lamp lens and the proximity lamp lens are located on the same transparent base body.

In some embodiments, the output module further includes a metal shielding plate, and the metal shielding plate is located in the package housing and located between the infrared fill light and the near infrared light.

In some embodiments, the output module further includes an optical enclosure made of a light-transmissive material, the optical enclosure is formed on the package substrate and located in the package housing, and the optical enclosure encloses the infrared fill light and the proximity infrared light.

In some embodiments, the output module further comprises a light-emitting partition plate, wherein the light-emitting partition plate is formed in the optical enclosure and is located between the infrared light supplement lamp and the near infrared lamp.

In some embodiments, a ground pin, a fill-in light pin, and a proximity light pin are formed on the output module, and when the ground pin and the fill-in light pin are enabled, the infrared fill-in light emits infrared light; the proximity infrared lamp emits infrared light when the ground pin and the proximity lamp pin are enabled.

In some embodiments, an infrared transparent ink which only transmits infrared light is formed on a surface of the cover plate, which is combined with the casing, and the infrared transparent ink blocks at least one of the casing access through hole, the casing light supplement through hole and the casing vibration through hole.

In some embodiments, the imaging module comprises at least one of a visible light camera and an infrared light camera.

In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a structured light projector, centers of the output module, the infrared camera, the visible light camera, the piezoelectric element, and the structured light projector are located on a same line segment, and the following are sequentially performed from one end to the other end of the line segment:

the output module, the structured light projector, the piezoelectric element, the infrared camera and the visible light camera; or

The infrared camera, the visible light camera, the piezoelectric element, the output module and the structured light projector.

In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a structured light projector, centers of the output module, the infrared camera, the visible light camera, and the structured light projector are located on a same line segment, and the piezoelectric element is located between the line segment and the top of the housing.

In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a structured light projector, the number of the piezoelectric elements is multiple, the number of the casing vibration through holes is multiple, the multiple piezoelectric elements correspond to the multiple casing vibration through holes, each piezoelectric element is accommodated in the corresponding casing vibration through hole, centers of the output module, the infrared camera, the visible light camera, the multiple piezoelectric elements and the structured light projector are located on the same line segment, and at least one of the output module, the infrared camera, the visible light camera and the structured light projector is disposed between two adjacent piezoelectric elements.

In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a structured light projector, the piezoelectric element includes a piezoelectric body and a plurality of piezoelectric bumps extending from the piezoelectric body, the number of the casing vibration through holes is multiple, the plurality of piezoelectric bumps correspond to the plurality of casing vibration through holes, each of the piezoelectric bumps is partially received in the corresponding casing vibration through hole and is combined with the cover plate, the output module, the infrared camera, the visible light camera, and the structured light projector are located between the cover plate and the piezoelectric body, the centers of the output module, the infrared camera, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located on the same line segment, and the output module, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located between two adjacent piezoelectric bumps, At least one of the infrared camera, the visible light camera, and the structured light projector.

In the electronic device of the embodiment of the invention, the output module integrates the infrared light supplement lamp and the near infrared lamp into a single packaging body structure, and integrates the functions of transmitting infrared light for infrared distance measurement and infrared light supplement, so that the output module has higher integration level and smaller volume, and saves the space for realizing the functions of infrared light supplement and infrared distance measurement. In addition, because the infrared light supplement lamp and the near infrared lamp are borne on the same packaging substrate, compared with the infrared light supplement lamp and the near infrared lamp in the traditional process, the infrared light supplement lamp and the near infrared lamp need to be manufactured by different wafers respectively and then are combined on a PCB substrate for packaging, and the packaging efficiency is improved. Furthermore, the electronic device adopts the piezoelectric element and the vibration module to realize bone conduction sound transmission, replaces the traditional telephone receiver structure which is used for transmitting sound through air, effectively ensures the privacy of conversation content on the one hand, and on the other hand, because the original telephone receiver is cancelled, the through hole which corresponds to the telephone receiver is avoided being arranged on the cover plate, the process is simpler, and the appearance is more attractive. Finally, the imaging module is provided with a notch, and the receiving module is arranged on the second trapezoidal surface, so that the receiving module and the imaging module are arranged compactly, the two jointly occupy a smaller transverse space, and the mounting space in the electronic device is saved.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 2 is a schematic perspective view of an output module of an electronic device according to an embodiment of the invention;

FIG. 3 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the invention;

FIG. 4 is a schematic perspective view of an output module of an electronic device according to an embodiment of the invention;

FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 1 taken along line V-V;

FIG. 6 is a schematic partial cross-sectional view of the electronic device of FIG. 1 taken along line VI-VI;

fig. 7 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the invention;

fig. 8 is a schematic arrangement of electronic components of an electronic device according to an embodiment of the invention;

FIG. 9 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 10 to 11 are schematic arrangement diagrams of electronic components of the electronic device according to the embodiment of the present invention;

FIG. 12 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

FIG. 13 is a schematic partial cross-sectional view of the electronic device of FIG. 12 taken along line XIII-XIII;

FIG. 14 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the invention;

fig. 15 is a schematic perspective view of a receiving module and an imaging module according to an embodiment of the invention;

fig. 16 to 17 are schematic partial cross-sectional views of the electronic device according to the embodiment of the present invention taken along positions corresponding to XVI-XVI in fig. 1;

fig. 18 to 26 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the invention.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, anelectronic device 100 according to an embodiment of the invention includes ahousing 20, acover 30, and electronic components. The electronic component includes anoutput module 10, avibration module 30a (see fig. 5), apiezoelectric element 70, a receiving module 50 (see fig. 7), an imaging module 60 (see fig. 7), and a structuredlight projector 80. Theelectronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking theelectronic device 100 as a mobile phone, it is understood that the specific form of theelectronic device 100 may be other, and is not limited herein.

Referring to fig. 2 and 3, theoutput module 10 is a single package structure, and includes apackage housing 11, an infrared fill-inlamp 12, and a proximityinfrared lamp 13.

Thepackaging shell 11 is used for packaging the infraredlight supplement lamp 12 and the proximityinfrared lamp 13 at the same time, or the infraredlight supplement lamp 12 and the proximityinfrared lamp 13 are packaged in thepackaging shell 11 at the same time. Thepackage housing 11 includes apackage substrate 111, apackage sidewall 112, and apackage top 113. Thepackage housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting theoutput module 10.

Thepackage substrate 111 is used for carrying theinfrared fill light 12 and the proximityinfrared light 13. When theoutput module 10 is manufactured, the infrared fill-inlight 12 and the proximity infrared light 13 may be formed on onechip 14, and then the infrared fill-inlight 12, the proximityinfrared light 13, and thechip 14 are disposed on thepackage substrate 111 together, specifically, thechip 14 may be bonded on thepackage substrate 111. Meanwhile, thepackage substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., thehousing 20 and the motherboard of the electronic device 100), so as to fix theoutput module 10 in theelectronic device 100.

Thepackaging sidewall 112 can surround theinfrared fill light 12 and the proximityinfrared light 13, thepackaging sidewall 112 extends from thepackaging substrate 111, thepackaging sidewall 112 can be combined with thepackaging substrate 111, and preferably, thepackaging sidewall 112 and thepackaging substrate 111 are detachably connected, so that theinfrared fill light 12 and the proximity infrared light 13 can be conveniently overhauled after thepackaging sidewall 112 is taken down. Thepackage sidewall 112 may be made of a material opaque to infrared light to prevent infrared light emitted from theinfrared fill light 12 or the near infrared light 13 from passing through thepackage sidewall 112.

Thepackage top 113 is opposite to thepackage substrate 111, and thepackage top 113 is connected to thepackage sidewall 112. Alight supplement window 1131 and aproximity window 1132 are formed in the top 113 of the package, thelight supplement window 1131 corresponds to the infraredlight supplement lamp 12, and infrared light emitted by the infraredlight supplement lamp 12 passes through thelight supplement window 1131; theproximity window 1132 corresponds to the proximityinfrared lamp 13, and infrared light emitted from the proximityinfrared lamp 13 passes out of theproximity window 1132. Thepackage top 113 and thepackage side wall 112 may be formed integrally or separately. In one example, thefill window 1131 and theproximity window 1132 are through holes, and thepackage top 113 is made of an infrared opaque material. In another example, thepackage top 113 is made of an infrared opaque material and an infrared opaque material, specifically, thefill light window 1131 and theproximity window 1132 are made of an infrared opaque material, and the rest of the package top is made of an infrared opaque material, further, thefill light window 1131 and theproximity window 1132 may be formed with a lens structure to improve the emission angle of infrared light emitted from thefill light window 1131 and theproximity window 1132, for example, thefill light window 1131 is formed with a concave lens structure to diffuse light passing through thefill light window 1131 to be emitted outward; theproximity window 1132 is formed with a convex lens structure to focus light passing through theproximity window 1132 to be emitted outward.

The infraredlight supplement lamp 12 and the proximityinfrared lamp 13 can be formed on onechip 14, so that the size of the infraredlight supplement lamp 12 and the proximityinfrared lamp 13 after integration is further reduced, and the preparation process is simple. The infrared fill-inlight 12 can emit infrared light, the infrared light passes through the fill-inlight window 1131 to project onto the surface of the object, and the infrared camera 62 (as shown in fig. 1) of theelectronic device 100 receives the infrared light reflected by the object to obtain image information of the object (at this time, the infrared fill-inlight 12 is used for infrared fill-in light). The proximityinfrared lamp 13 may emit infrared light, which passes through theproximity window 1132 and reaches the surface of the object, and the proximity sensor 51 (shown in fig. 7) of theelectronic device 100 receives the infrared light reflected by the object to detect the distance of the object to the electronic device 100 (at this time, the proximityinfrared lamp 13 is used for infrared ranging).

The infraredlight supplementing lamp 12 and the nearinfrared lamp 13 can emit infrared light to the outside of thepackaging shell 11 at different powers, specifically, the infraredlight supplementing lamp 12 and the nearinfrared lamp 13 can emit infrared light simultaneously, and theoutput module 10 is used for infrared light supplementing and infrared distance measurement simultaneously; or the infraredlight supplement lamp 12 can emit light and does not emit light close to theinfrared lamp 13, and theoutput module 10 is only used for infrared light supplement; also can infraredlight filling lamp 12 not launch light and be closeinfrared lamp 13 launch light,output module 10 is only used for infrared range finding.

Referring to fig. 4, in the embodiment of the invention, aground pin 15, afill light pin 16 and aproximity light pin 17 are formed on theoutput module 10. Theground pin 15, the fill-inlamp pin 16, and theproximity lamp pin 17 may be formed on thepackage substrate 111, and when theground pin 15 and the fill-inlamp pin 16 are enabled (i.e., when theground pin 15 and the fill-inlamp pin 16 are connected to the circuit, the infrared fill-inlamp 12 emits infrared light; when theground pin 15 and theproximity lamp pin 17 are enabled (i.e., when theground pin 15 and theproximity lamp pin 17 access circuit are on), the proximityinfrared lamp 13 emits infrared light.

Referring to fig. 1 and 5, thehousing 20 may serve as a mounting carrier for theoutput module 10, or theoutput module 10 may be disposed in thehousing 20. Thechassis 20 may be a housing of theelectronic device 100.

Referring to fig. 1, 5 and 6, thecasing 20 includes atop portion 21 and abottom portion 22, and at a position corresponding to the electronic component, thecasing 20 is provided with a casing approach throughhole 23, a casing supplementary light throughhole 24 and a casing vibration throughhole 2a which are spaced from each other. When theoutput module 10 is disposed in thehousing 20, the proximityinfrared lamp 13 corresponds to the housing proximity throughhole 23, and the infraredlight supplement lamp 12 corresponds to the housing light supplement throughhole 24. The light emitted by the nearinfrared lamp 13 corresponding to the case near throughhole 23 can pass through the case near throughhole 23, specifically, the nearinfrared lamp 13 is opposite to the case near throughhole 23, or the light emitted by the nearinfrared lamp 13 passes through the case near throughhole 23 after being acted by the light guide element. The infraredlight supplement lamp 12 corresponds to the chassis light supplement throughhole 24, and the description thereof is omitted. In the embodiment shown in fig. 6, the chassis approach throughhole 23 and the chassis fill light throughhole 24 may be spaced apart from each other, and in other embodiments, the chassis approach throughhole 23 and the chassis fill light throughhole 24 may also be communicated with each other.

Thevibration module 30a is mounted on thecabinet 20. Thevibration module 30a may include adisplay screen 90 and acover plate 30, or thedisplay screen 90 and thecover plate 30 are combined to form thevibration module 30a, so as to improve the rigidity of thevibration module 30 a. Thedisplay screen 90 is disposed on thehousing 20 and forms a receivingcavity 91 with thehousing 20, and thecover plate 30 is disposed on thehousing 20 and located on a side of thedisplay screen 90 away from the receivingcavity 91 to protect thedisplay screen 90. Since theoutput module 10 according to the embodiment of the invention can occupy a smaller volume, the volume for disposing thedisplay screen 90 in thehousing 20 can be correspondingly increased, so as to increase the screen occupation ratio of theelectronic device 100. Specifically, thedisplay screen 90, theoutput module 10 and thepiezoelectric element 70 are disposed between thetop portion 21 and thebottom portion 22, and thetop portion 21 is located above thebottom portion 22 in a state that the user normally uses theelectronic device 100, as shown in fig. 1, theoutput module 10 may be disposed between thedisplay screen 90 and thetop portion 21. In other embodiments, thedisplay screen 90 may be a full screen with a gap, thedisplay screen 90 surrounds theoutput module 10, and theoutput module 10 is exposed from the gap of thedisplay screen 90.

Thepiezoelectric element 70 is made of a ceramic or quartz crystal material, and thepiezoelectric element 70 may be a single wafer, a twin wafer, or a laminatedpiezoelectric element 70. Thepiezoelectric element 70 is coupled to thevibration module 30a and spaced apart from theoutput module 10. Specifically, thepiezoelectric element 70 is accommodated in the casing vibration throughhole 2a, is coupled to thecover plate 30, and is spaced apart from thecasing 20, and may be: thepiezoelectric element 70 is partially accommodated in the chassis vibration throughhole 2a, or thepiezoelectric element 70 is entirely accommodated in the chassis vibration throughhole 2 a. When an electric signal (voltage) is applied to both ends of thepiezoelectric element 70, thepiezoelectric element 70 is mechanically deformed, for example, expanded or contracted, due to the inverse piezoelectric effect, thereby causing thevibration module 30a coupled to thepiezoelectric element 70 to vibrate according to the frequency of the electric signal. When the user's body is in contact with thevibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with thevibration module 30a (e.g., cartilage of the outer ear, teeth). In this way, the user can realize the functions of voice call, listening to music, etc. through thepiezoelectric element 70 and thevibration module 30 a. In an embodiment of the present invention, the processor of theelectronic device 100 is configured to acquire a sound signal and apply an electrical signal corresponding to the sound signal to the two ends of thepiezoelectric element 70.

It can be understood that the traditional receiver structure adopts air conduction sound, the local sound pressure of the receiver is usually about 90 dB-100 dB when the receiver works, and the sound is still about 50 dB-60 dB even if the sound is transmitted to the range of 1 meter around in the quiet surrounding environment (such as in the general office environment of about 50 dB), which causes the conversation content among the callers to be perceived around, resulting in privacy leakage. Theelectronic device 100 according to the embodiment of the invention adopts thepiezoelectric element 70 and thevibration module 30a to realize bone conduction sound transmission, and the sound of the call is mainly sensed by the bone conduction of the vibration and can effectively ensure the privacy of the call content.

Referring again to fig. 5 and 6, thepiezoelectric element 70 and thedisplay screen 90 are attached to thecover plate 30 by the joint 30 b. Thebonding member 30b is an adhesive, a double-sided tape, an adhesive tape, or the like having a thermosetting property and an ultraviolet curing property. For example, the joiningmember 30b may be an optically elastic resin (a colorless and transparent ultraviolet-curing acrylic adhesive). The area of thecover 30 bonded to thepiezoelectric element 70 is spaced apart from the area of thecover 30 bonded to thedisplay screen 90 to prevent the display of thedisplay screen 90 from being interfered with by thepiezoelectric element 70. Of course, thecover 30 can also be coupled to thehousing 20 by thecoupling member 30b, so that compared with the case where thecover 30 is directly disposed on thehousing 20, the vibration of thevibration module 30a can be prevented from being directly transmitted to thehousing 20, thereby reducing the possibility that the user may drop theelectronic device 100 due to the excessive vibration amplitude of thehousing 20.

Thecover plate 30 may be light-transmissive, and the material of thecover plate 30 may be light-transmissive glass, resin, plastic, or the like. Thecover plate 30 is disposed on thechassis 20, thecover plate 30 includes aninner surface 32 combined with thechassis 20, and anouter surface 31 opposite to theinner surface 32, and the light emitted from theoutput module 10 sequentially passes through theinner surface 32 and theouter surface 31 and then passes through thecover plate 30. In the embodiment shown in fig. 6, thecover plate 30 covers the chassis fill-in throughhole 24 and the chassis approach throughhole 23, theinner surface 32 of thecover plate 30 is coated with theinfrared transmissive ink 40, and theinfrared transmissive ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area of theelectronic device 100 covered by theinfrared transmissive ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas ofinner surface 32 that do not correspond to display 90.

The infrared transmission ink 40 can further shield at least one of the case access through hole 23, the case light supplement through hole 24 and the case vibration through hole 2a, that is, the infrared transmission ink 40 can simultaneously shield the case access through hole 23, the case light supplement through hole 24 and the case vibration through hole 2a (as shown in fig. 6), so that a user cannot easily see the internal structure of the electronic device 100 through the case access through hole 23, the case light supplement through hole 24 and the case vibration through hole 2a, and the electronic device 100 is attractive in appearance; the infrared transmission ink 40 can also cover the case approach through hole 23, and does not cover the case light supplement through hole 24 and the case vibration through hole 2 a; the infrared transmission ink 40 can also cover the shell light supplement through hole 24, and does not cover the shell approach through hole 23 and the shell vibration through hole 2 a; the infrared transmission ink 40 can also cover the shell vibration through hole 2a, and does not cover the shell approach through hole 23 and the shell light supplement through hole 24; the infrared transmission ink 40 can also cover the case approaching through hole 23 and the case light supplement through hole 24, and does not cover the case vibration through hole 2 a; the infrared transmission ink 40 can also cover the shell light supplement through hole 24 and the shell vibration through hole 2a, and does not cover the shell approach through hole 23; the infrared transparent ink 40 can also cover the chassis approach through hole 23 and the chassis vibration through hole 2a, and does not cover the chassis light supplement through hole 24.

Referring to fig. 7, the receivingmodule 50 is integrated with aproximity sensor 51 and alight sensor 52, and theproximity sensor 51 and thelight sensor 52 form a single package structure. The infrared light emitted from the proximityinfrared lamp 13 is reflected by the external object and then received by theproximity sensor 51, and theproximity sensor 51 determines the distance between the external object and theelectronic device 100 according to the received reflected infrared light. Thelight sensor 52 receives the visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of thedisplay 90. Theproximity sensor 51 and theoptical sensor 52 are packaged together to form the receivingmodule 50, so that the gap between the two modules during independent assembly is reduced, and the installation space in theelectronic device 100 is saved.

Referring to fig. 1 and 7, theimaging module 60 may be one or both of avisible light camera 61 and aninfrared camera 62. Theimaging module 60 includes alens mount 63, alens barrel 64, and animage sensor 65. Thelens barrel 64 is mounted on thelens holder 63, and theimage sensor 65 is housed in thelens holder 63. Themirror base 63 includes a mountingsurface 631, and the mountingsurface 631 is located between thelens barrel 64 and theimage sensor 65. In the embodiment shown in fig. 7, the receivingmodule 50 is disposed on the mountingsurface 631, and specifically, the receivingmodule 50 at least partially falls onto the mountingsurface 631 in the orthogonal projection of the plane where the mountingsurface 631 is located, so that the receivingmodule 50 and theimaging module 60 are disposed compactly, and the lateral space occupied by the two modules is small.

Referring to fig. 1, the structuredlight projector 80 is configured to emit structured light to the outside, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by theinfrared camera 62, and the processor of theelectronic device 100 further analyzes the structured light received by theinfrared camera 62 to obtain the depth information of the object to be measured.

In the embodiment shown in fig. 1, theimaging module 60 includes avisible light camera 61 and an infraredlight camera 62, and the centers of theoutput module 10, the infraredlight camera 62, thevisible light camera 61, thepiezoelectric element 70 and the structuredlight projector 80 are located on the same line segment. Specifically, theoutput module 10, the structuredlight projector 80, thepiezoelectric element 70, theinfrared camera 62, and the visible light camera 61 (as shown in fig. 8) are arranged in sequence from one end to the other end of the line segment; or anoutput module 10, aninfrared camera 62, apiezoelectric element 70, avisible light camera 61 and a structured light projector 80 (as shown in fig. 1) are arranged in sequence from one end to the other end of the line segment; or theinfrared camera 62, theoutput module 10, thepiezoelectric element 70, thevisible light camera 61 and the structuredlight projector 80 are arranged in sequence from one end to the other end of the line segment; or theinfrared camera 62, thevisible light camera 61, thepiezoelectric element 70, theoutput module 10 and the structuredlight projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of theoutput module 10, theinfrared camera 62, thepiezoelectric element 70, thevisible light camera 61, and the structuredlight projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.

Referring to fig. 9, theimaging module 60 includes avisible light camera 61 and aninfrared camera 62. The centers of theoutput module 10, theinfrared camera 62, thevisible light camera 61 and the structuredlight projector 80 are located on the same line segment, and thepiezoelectric element 70 is located between the line segment and the top 21 of thehousing 20. Specifically, theoutput module 10, the structuredlight projector 80, theinfrared camera 62 and thevisible light camera 61 are sequentially arranged from one end to the other end of the line segment; or theoutput module 10, theinfrared camera 62, thevisible light camera 61 and the structuredlight projector 80 are sequentially arranged from one end to the other end of the line segment (as shown in fig. 9); or theinfrared camera 62, theoutput module 10, thevisible light camera 61 and the structuredlight projector 80 are arranged in sequence from one end to the other end of the line segment; or theinfrared camera 62, thevisible light camera 61, theoutput module 10 and the structuredlight projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of theoutput module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 is not limited to the above example. In the embodiment of the present invention, the center of thepiezoelectric element 70 is not located on the line segment, so that the lateral space occupied by the electronic components (theoutput module 10, theinfrared camera 62, thevisible light camera 61, the structuredlight projector 80, etc.) on thecover plate 30 is saved.

Further, referring to fig. 7, the receivingmodule 50 may be disposed on the mountingsurface 631 of theinfrared camera 62, or may be disposed on the mountingsurface 631 of thevisible light camera 61, of course, the receivingmodule 50 may not be disposed on the mountingsurface 631, the receivingmodule 50 may be disposed adjacent to theoutput module 10, and theproximity sensor 51 is easy to receive the infrared light emitted by the proximityinfrared lamp 13 and reflected by the external object; the receivingmodule 50 may also be disposed adjacent to thepiezoelectric element 70, which is not limited herein.

In summary, in theelectronic device 100 according to the embodiment of the invention, theoutput module 10 integrates the infraredlight supplement lamp 12 and the proximityinfrared lamp 13 into a single package structure, and integrates the functions of emitting infrared light for infrared distance measurement and infrared light supplement, so that theoutput module 10 has a higher integration level and a smaller volume, and theoutput module 10 saves space for realizing the functions of infrared light supplement and infrared distance measurement. In addition, because the infraredlight supplement lamp 12 and the proximityinfrared lamp 13 are supported on thesame packaging substrate 111, compared with the infraredlight supplement lamp 12 and the proximityinfrared lamp 13 in the conventional process, which need to be manufactured by different wafers and then packaged on a PCB substrate, the packaging efficiency is improved. Moreover, theelectronic device 100 adopts thepiezoelectric element 70 and thevibration module 30a to realize bone conduction sound transmission, and replaces the traditional receiver structure which conducts sound through air, so that on one hand, the privacy of the conversation content can be effectively ensured; on the other hand, the original telephone receiver is eliminated, so that a through hole corresponding to the telephone receiver is not formed in thecover plate 30, the process is simpler, the appearance is more attractive, and dust or moisture can be prevented from entering theelectronic device 100.

Referring to fig. 6 and 10, in some embodiments, theimaging module 60 includes avisible light camera 61 and aninfrared camera 62. Thecasing 20 is provided with a casing approach throughhole 23, a casing supplementary light throughhole 24, and a casing vibration throughhole 2a, which are spaced apart from each other. The proximityinfrared lamp 13 corresponds to the enclosure proximity throughhole 23, and the infraredlight supplement lamp 12 corresponds to the enclosure light supplement throughhole 24. The number of thepiezoelectric elements 70 is plural, the number of the chassis vibration throughholes 2a is plural, the pluralpiezoelectric elements 70 correspond to the plural chassis vibration throughholes 2a, and eachpiezoelectric element 70 is accommodated in the corresponding chassis vibration throughhole 2 a. The centers of theoutput module 10, theinfrared camera 62, thevisible light camera 61, the plurality ofpiezoelectric elements 70 and the structuredlight projector 80 are located on the same line segment, and at least one of theoutput module 10, theinfrared camera 62, thevisible light camera 61 and the structuredlight projector 80 is arranged between two adjacentpiezoelectric elements 70. For example, the number of thepiezoelectric elements 70 is two, and thepiezoelectric elements 70, theoutput module 10, the structuredlight projector 80, theinfrared camera 62, thevisible light camera 61, and thepiezoelectric elements 70 are arranged in sequence from one end to the other end of the line segment (as shown in fig. 10); or thepiezoelectric element 70, theoutput module 10, theinfrared camera 62, thevisible light camera 61, thepiezoelectric element 70, the structuredlight projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of thepiezoelectric elements 70 is three, and thepiezoelectric elements 70, theoutput module 10, the structuredlight projector 80, thepiezoelectric elements 70, theinfrared camera 62, thevisible light camera 61, and the piezoelectric elements 70 (shown in fig. 11) are arranged in sequence from one end to the other end of the line segment; or thepiezoelectric element 70, theoutput module 10, thepiezoelectric element 70, theinfrared camera 62, thevisible light camera 61, thepiezoelectric element 70, the structuredlight projector 80 and the like are arranged in sequence from one end to the other end of the line segment. Of course, the number of thepiezoelectric elements 70 and the arrangement of thepiezoelectric elements 70, theoutput module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality ofpiezoelectric elements 70 are combined with thecover plate 30, and specifically, the plurality ofpiezoelectric elements 70 are respectively attached to thecover plate 30 by the joiningmembers 30 b. The processor of theelectronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to two ends of thepiezoelectric elements 70, and thepiezoelectric elements 70 are mechanically deformed, so that thepiezoelectric elements 70 drive thevibration module 30a to vibrate according to the frequency of the electrical signal from different positions combined with thecover plate 30. When the user's body is in contact with thevibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with thevibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment of the present invention, the plurality ofpiezoelectric elements 70 simultaneously drive thevibration module 30a to vibrate from a plurality of different positions combined with thecover plate 30, and the vibration of thevibration module 30a is uniform and has higher intensity, which is beneficial to stably transmitting the bone conduction sound to the auditory nerve of the user.

Referring to fig. 6, 12 and 13, in some embodiments, theimaging module 60 includes avisible light camera 61 and aninfrared camera 62. Thecasing 20 is provided with a casing approach throughhole 23, a casing supplementary light throughhole 24, and a casing vibration throughhole 2a, which are spaced apart from each other. The proximityinfrared lamp 13 corresponds to the enclosure proximity throughhole 23, and the infraredlight supplement lamp 12 corresponds to the enclosure light supplement throughhole 24. Thepiezoelectric element 70 includes apiezoelectric body 71 and a plurality ofpiezoelectric bumps 72 extending from thepiezoelectric body 71, the number of thepiezoelectric bumps 72 is plural, the number of the chassis vibration throughholes 2a is plural, the plurality ofpiezoelectric bumps 72 correspond to the plurality of chassis vibration throughholes 2a, and eachpiezoelectric bump 72 is partially received in the corresponding chassis vibration throughhole 2a and is coupled to thecover plate 30. Theoutput module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 are located between thecover plate 30 and thepiezoelectric body 71. The centers of theoutput module 10, theinfrared camera 62, thevisible light camera 61, the plurality ofpiezoelectric bumps 72 and the structuredlight projector 80 are located on the same line segment, and at least one of theoutput module 10, theinfrared camera 62, thevisible light camera 61 and the structuredlight projector 80 is arranged between two adjacent piezoelectric bumps 72. For example, the number of thepiezoelectric bumps 72 is two, and thepiezoelectric bumps 72, theoutput module 10, the structuredlight projector 80, theinfrared camera 62, thevisible light camera 61, and thepiezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or thepiezoelectric bump 72, theoutput module 10, theinfrared camera 62, thevisible light camera 61, thepiezoelectric bump 72, the structuredlight projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of thepiezoelectric bumps 72 is three, and thepiezoelectric bumps 72, theoutput module 10, the structuredlight projector 80, the piezoelectric bumps 72, theinfrared camera 62, thevisible light camera 61, and thepiezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or thepiezoelectric bump 72, theoutput module 10, thepiezoelectric bump 72, theinfrared camera 62, thevisible light camera 61, thepiezoelectric bump 72, the structuredlight projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of thepiezoelectric bumps 72 is five, and thepiezoelectric bumps 72, theoutput module 10, the piezoelectric bumps 72, the structuredlight projector 80, the piezoelectric bumps 72, theinfrared camera 62, the piezoelectric bumps 72, thevisible light camera 61, and thepiezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment (as shown in fig. 13). Of course, the number of thepiezoelectric bumps 72 and the arrangement of thepiezoelectric bumps 72, theoutput module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality ofpiezoelectric bumps 72 are combined with thecap plate 30, and more specifically, the plurality ofpiezoelectric bumps 72 are respectively attached to thecap plate 30 by thebonding members 30 b. The processor of theelectronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to thepiezoelectric element 70, and thepiezoelectric element 70 including thepiezoelectric body 71 and the piezoelectric bumps 72 is mechanically deformed, so that thepiezoelectric bumps 72 drive thevibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with thecover plate 30. When the user's body is in contact with thevibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with thevibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment shown in fig. 13, thehousing 20 is provided with a housing vibration throughhole 2a, an output throughhole 25, a structured light throughhole 26, an infrared light through hole 27, and a visible light throughhole 28 which are spaced from each other. The case vibration throughhole 2a corresponds to thepiezoelectric bump 72, the output throughhole 25 corresponds to theoutput module 10, the structured light throughhole 26 corresponds to the structuredlight projector 80, the infrared light through hole 27 corresponds to the infraredlight camera 62, and the visible light throughhole 28 corresponds to thevisible light camera 61. The output throughhole 25 may be replaced with the above-mentioned enclosure approaching throughhole 23 and the enclosure light supplementing throughhole 24 which are spaced from each other, or the output throughhole 25 is formed by communicating the above-mentioned enclosure approaching throughhole 23 and the enclosure light supplementing throughhole 24. In addition, the structured light throughhole 26 corresponds to the structuredlight projector 80, that is, the structured light emitted by the structuredlight projector 80 can pass through the structured light throughhole 26, the infrared light through hole 27 corresponds to theinfrared camera 62, that is, theinfrared camera 62 can receive the infrared light reflected by the object from the infrared light through hole 27, and the visible light throughhole 28 corresponds to thevisible light camera 61, that is, thevisible light camera 61 can receive the visible light reflected by the object from the visible light throughhole 28.

In the embodiment of the present invention, the plurality ofpiezoelectric bumps 72 drive thevibration module 30a to vibrate from a plurality of different positions combined with thecover plate 30, and the vibration of thevibration module 30a is more uniform and stronger, which is beneficial to stably transmitting bone conduction sound to the auditory nerve of the user; in addition, the plurality ofpiezoelectric bumps 72 extend from the samepiezoelectric body 71, so that an electrical signal can be simultaneously applied to the plurality ofpiezoelectric bumps 72, and thevibration module 30a can be driven to vibrate synchronously from a plurality of different positions; furthermore, theoutput module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 are located between thecover plate 30 and thepiezoelectric body 71, and thepiezoelectric bumps 72 are inserted, so that theelectronic device 100 has a small overall size and saves space.

Referring to fig. 3, in some embodiments, theoutput module 10 further includes a fill-inlamp lens 18 and aproximity lamp lens 19. Thefill light lens 18 is disposed in thepackage housing 11 and corresponds to theinfrared fill light 12. Theproximity lamp lens 19 is provided inside thepackage case 11 and corresponds to the proximityinfrared lamp 13. The infrared light emitted by theinfrared fill light 12 is focused into thefill light window 1131 under the action of thefill light lens 18 to be emitted, so as to reduce the amount of light emitted to other areas of thepackage sidewall 112 and thepackage top 113. Similarly, the infrared light emitted from the proximityinfrared lamp 13 is focused by theproximity lamp lens 19 into theproximity window 1132 and emitted, reducing the amount of light emitted to other areas of thepackage sidewall 112 andpackage top 113. Specifically, the fill-inlamp lens 18 and theproximity lamp lens 19 may be located on the same transparent substrate, and more specifically, the fill-inlamp lens 18 and theproximity lamp lens 19 may be integrally formed with the transparent substrate. Of course, theoutput module 10 may be provided with only one of the lightsupplement lamp lens 18 and theproximity lamp lens 19, or may not be provided with the lightsupplement lamp lens 18 and theproximity lamp lens 19.

Referring to fig. 3, in some embodiments, theoutput module 10 further includes a metal shielding plate 1a, the metal shielding plate 1a is located in thepackage housing 11, and the metal shielding plate 1a is located between the infrared fill-inlight 12 and the nearinfrared light 13. Metal shielding plate 1a is located infraredlight filling lamp 12 and is close betweeninfrared lamp 13, metal shielding plate 1a can shield infraredlight filling lamp 12 and is closeinfrared lamp 13 electromagnetic interference each other on the one hand, infraredlight filling lamp 12 can not influence each other with the luminous intensity and the chronogenesis that are closeinfrared lamp 13, on the other hand metal shielding plate 1a can be used for isolated infraredlight filling lamp 12 place cavity and the cavity that is closeinfrared lamp 13 place, light can not get into another cavity from a cavity.

Referring to fig. 14, in some embodiments, theoutput module 10 further includes anoptical enclosure 1 b. Theoptical enclosure 1b is made of a light-transmissive material, and theoptical enclosure 1b is formed on thepackage substrate 111 and located inside thepackage case 11. Theoptical enclosure 1b encloses theinfrared fill light 12 and the proximityinfrared light 13. Specifically,optics sealing cover 1b can form through encapsulating injection molding process, andoptics sealing cover 1b can adopt transparent thermosetting epoxy to make to in use is difficult for softening, andoptics sealing cover 1b can fix infraredlight filling lamp 12 and be close the relative position betweeninfrared lamp 13, and makes infraredlight filling lamp 12 and be closeinfrared lamp 13 and be difficult for rocking inencapsulation casing 11.

In addition, referring to fig. 14, theoutput module 10 further includes a light-emittingpartition plate 1c, and the light-emittingpartition plate 1c is formed in theoptical enclosure 1b and located between theinfrared fill light 12 and the nearinfrared light 13. The light-emittingpartition board 1c can be used for separating the infraredlight supplement lamp 12 from the nearinfrared lamp 13, light emitted by the infraredlight supplement lamp 12 cannot penetrate out of thenear window 1132, and light emitted by the nearinfrared lamp 13 cannot penetrate out of thelight supplement window 1131.

Referring to fig. 15, in some embodiments, theproximity sensor 51 and theoptical sensor 52 may not be integrated in the receivingmodule 50, or theproximity sensor 51 and theoptical sensor 52 are separately disposed. At this time, theproximity sensor 51 may be provided on the mountingsurface 631 of themirror base 63; thelight sensor 52 may also be disposed on the mountingsurface 631 of themirror base 63; or theproximity sensor 51 is provided on the mountingsurface 631 of themirror base 63 together with theoptical sensor 52. The lens mount 63 can be the lens mount 63 of theinfrared camera 62, and can also be the lens mount 63 of thevisible camera 61.

Referring to fig. 16, in some embodiments, a cover plate light supplement throughhole 34 may be further formed in thecover plate 30, the cover plate light supplement throughhole 34 corresponds to the chassis light supplement throughhole 24, and infrared light emitted by the infraredlight supplement lamp 12 passes through the chassis light supplement throughhole 24 and then passes through theelectronic device 100 from the cover plate light supplement throughhole 34. In this case, theinfrared transmitting ink 40 may be provided on thecover 30 at a position corresponding to the chassis approach throughhole 23, so that the user cannot easily see the approachinfrared lamp 13 inside theelectronic device 100 through the chassis approach throughhole 23, and theelectronic device 100 has a good appearance.

Referring to fig. 17, in some embodiments, thecover 30 may further include a cover approaching through hole 33, the cover approaching through hole 33 corresponds to the chassis approaching throughhole 23, and the infrared light emitted by the approachinginfrared lamp 13 passes through the chassis approaching throughhole 23 and then passes through the cover approaching through hole 33 to theelectronic device 100. At this time, theinfrared transmissive ink 40 may be disposed at a position on thecover plate 30 corresponding to the chassis light supplement throughhole 24, so that the user is difficult to see the infraredlight supplement lamp 12 inside theelectronic device 100 through the chassis light supplement throughhole 24, and theelectronic device 100 has a beautiful appearance.

Referring to fig. 18, in some embodiments, theimaging module 60 further includes asubstrate 66, theimage sensor 65 is disposed on thesubstrate 66, and the receivingmodule 50 can be further fixed on thesubstrate 66. Specifically, thesubstrate 66 is provided with an FPC, a part of thesubstrate 66 is located in themirror base 63, another part of the substrate extends out of themirror base 63, one end of the FPC is located in themirror base 63 and is used for bearing theimage sensor 65, and the other end of the FPC can be connected with a main board of theelectronic device 100. When the receivingmodule 50 is disposed on thesubstrate 66, the receivingmodule 50 is disposed outside thelens holder 63, and the receivingmodule 50 may be connected to an FPC.

Further, the receivingmodule 50 disposed on thesubstrate 66 includes aproximity sensor 51 and alight sensor 52, and theproximity sensor 51 and thelight sensor 52 together form a single package structure, so that a gap between the two when they are separately assembled is reduced, and an installation space in theelectronic device 100 is saved. In other embodiments, the receivingmodule 50 disposed on thesubstrate 66 includes theproximity sensor 51 and/or thelight sensor 52, and each of theproximity sensor 51 and thelight sensor 52 is a single package structure. That is, theproximity sensor 51 in which the receivingmodule 50 provided on thesubstrate 66 has a single package structure; alternatively, thephoto sensor 52 with a single package structure is disposed on the receivingmodule 50 of thesubstrate 66; alternatively, the receivingmodule 50 disposed on thesubstrate 66 is aproximity sensor 51 of a single package structure and aphotosensor 52 of a single package structure.

Theimaging module 60 may be one or two of avisible light camera 61 and an infraredlight camera 62. Specifically, the receivingmodule 50 may be fixed on thesubstrate 66 of thevisible light camera 61; the receivingmodule 50 may be fixed on thesubstrate 66 of theinfrared camera 62. When theproximity sensor 51 and theoptical sensor 52 are separately packaged, theproximity sensor 51 may be fixed on thesubstrate 66 of thevisible light camera 61, and theoptical sensor 52 may be fixed on thesubstrate 66 of the infraredlight camera 62; alternatively, thephotosensor 52 may be fixed on thesubstrate 66 of thevisible light camera 61, and theproximity sensor 51 may be fixed on thesubstrate 66 of the infraredlight camera 62; alternatively, theproximity sensor 51 and theoptical sensor 52 are both fixed on thesubstrate 66 of thevisible light camera 61; alternatively, theproximity sensor 51 and theoptical sensor 52 are both fixed to thesubstrate 66 of theinfrared camera 62.

Further, thesubstrate 66 further includes a reinforcing plate disposed on a side opposite to the receivingmodule 50 to increase the overall strength of thesubstrate 66, so that the FPC is not prone to being folded, and the receiving module 50 (or theproximity sensor 51 or the light sensor 52) is not prone to shaking when disposed on thesubstrate 66. In one example, the receiving module 50 (or theproximity sensor 51 or the optical sensor 52) may also be fixed on the outer sidewall of themirror base 63, for example, by bonding.

Referring to fig. 19, in some embodiments, theelectronic device 100 and theimaging module 60 of the above embodiments may be replaced with the following structures: theimaging module 60 includes animage sensor 65, acamera housing 67 and alens module 68. Thetop surface 670 of thecamera housing 67 is a stepped surface, thetop surface 670 includes a firstsub-top surface 671, a secondsub-top surface 672 and a thirdsub-top surface 673, the secondsub-top surface 672 is connected to the firstsub-top surface 671 in an inclined manner and forms anotch 675 with the firstsub-top surface 671, the thirdsub-top surface 673 is connected to the secondsub-top surface 672 in an inclined manner, and the secondsub-top surface 672 is located between the firstsub-top surface 671 and the thirdsub-top surface 673 to connect the firstsub-top surface 671 and the thirdsub-top surface 673. The angle between the secondsub top surface 672 and the firstsub top surface 671 may be an obtuse angle or a right angle, and the angle between the secondsub top surface 672 and the thirdsub top surface 673 may be an obtuse angle or a right angle. Acutout 675 is opened in one end of thecamera housing 67, that is, thecutout 675 is located at an edge position of thetop surface 670. The thirdsub-top surface 673 is provided with a light-emitting throughhole 674, and thelens module 68 is accommodated in thecamera housing 67 and corresponds to the light-emitting throughhole 674. Theimage sensor 65 is accommodated in thecamera housing 67 and corresponds to thelens module 68, light outside theelectronic device 100 can pass through the light-out hole 674 and thelens module 68 and be transmitted to theimage sensor 65, and theimage sensor 65 converts an optical signal into an electrical signal. The receivingmodule 50 is disposed at the firstsub-top surface 671, and the receivingmodule 50 includes aproximity sensor 51 and aphotosensor 52. In the present embodiment, theimaging module 60 may be avisible light camera 61, and the receivingmodule 50 is a single package structure formed by theproximity sensor 51 and theoptical sensor 52. The direction of the center line connecting theproximity sensor 51 and thelight sensor 52 may coincide with the extending direction of the slit 675 (as shown in fig. 19); alternatively, the direction of the central line connecting theproximity sensor 51 and theoptical sensor 52 may be perpendicular to the extending direction of theslit 675 or an included angle formed by the two may be an acute angle or an obtuse angle. In other embodiments, theimaging module 60 may be aninfrared camera 62.

Theimaging module 60 of the present embodiment has anotch 675, and the receivingmodule 50 is disposed on the firstsub-top surface 671, so that the receivingmodule 50 and theimaging module 60 are disposed compactly, and the two occupy a smaller lateral space, thereby saving the installation space in theelectronic device 100; meanwhile, theproximity sensor 51 and theoptical sensor 52 are packaged together to form the receivingmodule 50, so that the gap between theproximity sensor 51 and the optical sensor when the proximity sensor and the optical sensor are independently assembled is reduced, and the installation space in theelectronic device 100 is saved.

With reference to fig. 19, in some embodiments, the receivingmodule 50 of the above embodiments is disposed on the firstsub-top surface 671 and located outside thecamera housing 67, and specifically, a projection of theentire receiving module 50 along a direction perpendicular to the firstsub-top surface 671 may be located inside the first sub-top surface 671 (as shown in fig. 19); alternatively, a part of the receivingmodule 50 is located in the firstsub-top surface 671 along a projection perpendicular to the firstsub-top surface 671. That is, at least a portion of the receivingmodule 50 is located directly above the firstsub-top surface 671, so that the receivingmodule 50 and theimaging module 60 are disposed compactly, and the occupied lateral space is small, thereby further saving the installation space in theelectronic device 100. In other embodiments, the receivingmodule 50 includes theproximity sensor 51 and theoptical sensor 52, but theproximity sensor 51 and theoptical sensor 52 are two separate single package structures, and in this case, theproximity sensor 51 and theoptical sensor 52, which are each a single package structure, may also be both disposed on the firstsub-top surface 671.

Referring to fig. 20, in some embodiments, the receivingmodule 50 of the above embodiments only includes theproximity sensor 51 and does not include theoptical sensor 52, in this case, the proximity sensor 51 (or the receiving module 50) and theoptical sensor 52 are respectively of a single package structure, theproximity sensor 51 is disposed on the firstsub-top surface 671, and theoptical sensor 52 is disposed at any other position except the firstsub-top surface 671.

Referring to fig. 20, in some embodiments, the receivingmodule 50 of the above embodiments only includes theoptical sensor 52 and does not include theproximity sensor 51, in which case, the optical sensor 52 (or the receiving module 50) and theproximity sensor 51 are each a single package structure, theoptical sensor 52 is disposed on the firstsub-top surface 671, and theproximity sensor 51 is disposed at any other position except the firstsub-top surface 671.

Referring to fig. 21, the firstsub-top surface 671 of the above embodiment is provided with alight hole 676, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to thelight hole 676. Specifically, when the receivingmodule 50 includes only theproximity sensor 51 without thephotosensor 52, and thephotosensor 52 is disposed outside thecamera housing 67, the number of the light-transmittingholes 676 may be one, and light outside theelectronic device 100 can pass through the light-transmittingholes 676 and be transmitted to theproximity sensor 51. The receivingmodule 50 of the present embodiment is disposed in thecamera housing 67, so that the receivingmodule 50 and thecamera housing 67 have more stable structures and the receivingmodule 50 and theimaging module 60 are conveniently mounted on thehousing 20.

Referring to fig. 21, the firstsub-top surface 671 of the above embodiment is formed with alight hole 676, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to thelight hole 676. Specifically, when the receivingmodule 50 includes only thelight sensor 52 without theproximity sensor 51, and theproximity sensor 51 is disposed outside thecamera housing 67, the number of the light holes 676 may be one, and light outside theelectronic device 100 can pass through the light holes 676 and be transmitted to thelight sensor 52. The receivingmodule 50 of the present embodiment is disposed in thecamera housing 67, so that the receivingmodule 50 and thecamera housing 67 have more stable structures and the receivingmodule 50 and theimaging module 60 are conveniently mounted on thehousing 20.

Referring to fig. 22, in some embodiments, the firstsub-top surface 671 of the above embodiments is formed with alight hole 676, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to thelight hole 676. Specifically, when the receivingmodule 50 integrates theproximity sensor 51 and thelight sensor 52, thelight hole 676 can be one light hole corresponding to both theproximity sensor 51 and thelight sensor 52 or two light holes spaced apart from each other and corresponding to theproximity sensor 51 and thelight sensor 52, respectively, and light outside theelectronic device 100 can pass through thelight hole 676 and be transmitted to theproximity sensor 51 and thelight sensor 52 in the receivingmodule 50. In other embodiments, the receivingmodule 50 includes theproximity sensor 51 and thelight sensor 52, but theproximity sensor 51 and thelight sensor 52 are of two separate single-package structures, and in this case, theproximity sensor 51 and thelight sensor 52, which are of the single-package structure, may be both disposed in thecamera housing 67 and correspond to the light-transmittinghole 676. The receivingmodule 50 of the present embodiment is disposed in thecamera housing 67, so that the receivingmodule 50 and thecamera housing 67 have more stable structures and the receivingmodule 50 and theimaging module 60 are conveniently mounted on thehousing 20.

Referring to fig. 22, in some embodiments, the firstsub-top surface 671 of the above embodiments is formed with alight hole 676, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to thelight hole 676. Theimaging module 60 further includes asubstrate 66, theimage sensor 65 is disposed on thesubstrate 66, and the receivingmodule 50 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67. Specifically, thesubstrate 66 is provided with an FPC, one end of which is located in thecamera housing 67 and is used for carrying theimage sensor 65, and the other end of which can be connected to a main board of theelectronic device 100. In other embodiments, the receivingmodule 50 may be connected to an FPC. In this embodiment, the receivingmodule 50 disposed on thesubstrate 66 includes theproximity sensor 51 and thelight sensor 52, and theproximity sensor 51 and thelight sensor 52 together form a single package structure, so as to reduce a gap between the two when they are separately assembled, and save an installation space in theelectronic device 100.

In other embodiments, the receivingmodule 50 only includes theproximity sensor 51, and theoptical sensor 52 is not integrated in the receivingmodule 50, that is, the receivingmodule 50 is a single package structure of theproximity sensor 51, theoptical sensor 52 is also a single package structure, and theoptical sensor 52 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67; alternatively, when a part of thesubstrate 66 is located inside thecamera housing 67 and another part thereof protrudes from thecamera housing 67, thelight sensor 52 may be fixed to thesubstrate 66 and located outside thecamera housing 67.

In another embodiment, the receivingmodule 50 only includes theoptical sensor 52, and theproximity sensor 51 is not integrated in the receivingmodule 50, that is, the receivingmodule 50 is a single package structure of theoptical sensor 52, theproximity sensor 51 is also a single package structure, and theproximity sensor 51 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67; alternatively, when a part of thebase plate 66 is located inside thecamera housing 67 and another part thereof protrudes from thecamera housing 67, theproximity sensor 51 may be fixed to thebase plate 66 and located outside thecamera housing 67.

The receivingmodule 50 of the present embodiment is disposed in thecamera housing 67, so that the receivingmodule 50 and thecamera housing 67 have more stable structures and the receivingmodule 50 and theimaging module 60 are conveniently mounted on thehousing 20; meanwhile, theimaging module 60 sets thesubstrate 66 and sets the receivingmodule 50 on thesubstrate 66, so that the receivingmodule 50 can be stably installed in thecamera housing 67.

Referring to fig. 23, in some embodiments, theelectronic device 100 and theimaging module 60 of the above embodiments may be replaced with the following structures: theimaging module 60 is a dual-camera module, and includes twoimage sensors 65, acamera housing 67, and twolens modules 68. Thetop surface 670 of thecamera housing 67 is a stepped surface, and thetop surface 670 includes afirst step surface 677, asecond step surface 678 lower than thefirst step surface 677, and afirst connection surface 679 a. The first connectingsurface 679a is obliquely connected with thesecond tread 678 and forms anotch 675 with thesecond tread 678, the first connectingsurface 679a is obliquely connected with thefirst tread 677, and the first connectingsurface 679a is positioned between thefirst tread 677 and thesecond tread 678 to connect thefirst tread 677 with thesecond tread 678. The included angle between the first connectingsurface 679a and thefirst tread 677 can be an obtuse angle or a right angle, and the included angle between the first connectingsurface 679a and thesecond tread 678 can be an obtuse angle or a right angle. Acutout 675 is opened in one end of thecamera housing 67, that is, thecutout 675 is located at an edge position of thetop surface 670. The two light-emitting throughholes 674 are arranged on thefirst ladder surface 677 and are located on the same side of thecut 675, and a central connecting line of the two light-emitting throughholes 674 is perpendicular to the extending direction of thecut 675. The twolens modules 68 are accommodated in thecamera housing 67 and respectively correspond to the two light-emitting throughholes 674, the twoimage sensors 65 are accommodated in thecamera housing 67 and respectively correspond to the twolens modules 68, and light outside theelectronic device 100 can pass through the light-emitting throughholes 674 and thelens modules 68 and is transmitted to theimage sensors 65. In the present embodiment, theimaging module 60 can be avisible light camera 61, and at this time, both the twolens modules 68 are lens modules corresponding to thevisible light camera 61. The receivingmodule 50 is disposed on thesecond step face 678 and is located outside thecamera housing 67. The receivingmodule 50 is a single package structure formed by theproximity sensor 51 and theoptical sensor 52. The direction of the central line connecting theproximity sensor 51 and thelight sensor 52 may coincide with the extending direction of theslit 675; alternatively, the direction of the center line connecting theproximity sensor 51 and theoptical sensor 52 may be perpendicular to the extending direction of the slit 675 (as shown in fig. 23) or an acute angle or an obtuse angle. In other embodiments, theimaging module 60 may be aninfrared camera 62, and both of thelens modules 68 correspond to theinfrared camera 62. In another embodiment, theimaging module 60 includes avisible light camera 61 and aninfrared camera 62, and in this case, one of thelens modules 68 is a lens module corresponding to theinfrared camera 62, and theother lens module 68 is a lens module corresponding to thevisible light camera 61.

Theimaging module 60 of the present embodiment has anotch 675, and the receivingmodule 50 is disposed on thesecond step surface 678, so that the receivingmodule 50 and theimaging module 60 are disposed compactly, and the two occupy a smaller lateral space, thereby saving the installation space in theelectronic device 100; meanwhile, theproximity sensor 51 and theoptical sensor 52 are packaged together to form the receivingmodule 50, so that the gap between theproximity sensor 51 and the optical sensor when the proximity sensor and the optical sensor are independently assembled is reduced, and the installation space in theelectronic device 100 is saved.

Referring to fig. 24, in some embodiments, thecut 675 of the above embodiments is formed in the middle of thetop surface 670, thefirst tread 677 is divided into a first sub-tread 677a and a second sub-tread 677b by thecut 675, the first sub-tread 677a and the second sub-tread 677b are respectively located on two opposite sides of thecut 675, two light-exiting throughholes 674 are respectively formed in the first sub-tread 677a and the second sub-tread 677b, and thelens modules 68 mounted in thecamera housing 67 are also located on two opposite sides of thecut 675. At this time, thecutout 675 is defined by thesecond step surface 678, the first connectingsurface 679a and the second connectingsurface 679b, the first connectingsurface 679a connects the firstsub top surface 677a and thesecond step surface 678 obliquely and is located between the firstsub top surface 677a and thesecond step surface 678, and the second connectingsurface 679b connects the secondsub top surface 677b and thesecond step surface 678 obliquely and is located between the secondsub top surface 677b and thesecond step surface 678. In this embodiment, the firstterraced surface 677 is parallel to the secondterraced surface 678, an included angle between thefirst connection surface 679a and the first subterraced surface 677a is an obtuse angle, and an included angle between thesecond connection surface 679b and the second subterraced surface 677b is an obtuse angle. In other embodiments, thefirst connection surface 679a and the firstsub-step surface 677a form a right angle, and thesecond connection surface 679b and the secondsub-step surface 677b form a right angle. Thecutout 675 of the present embodiment is opened at the middle position of thetop surface 670, relative to thecutout 675 opened at the edge position of thetop surface 670, so that the width of thecutout 675 is wider, thereby facilitating the positioning of the receivingmodule 50 on thesecond tread 678.

Referring to fig. 23 and 24, in some embodiments, the receivingmodule 50 of the above embodiments is disposed on thesecond step surface 678 and is located outside thecamera housing 67. Specifically, when thecut 675 is opened at the edge of thetop surface 670, the projection of thewhole receiving module 50 along the direction perpendicular to thesecond step surface 678 can be located in thesecond step surface 678; alternatively, a projection of a portion of the receivingmodule 50 along a direction perpendicular to thesecond tread 678 is located within the second tread 678 (as shown in fig. 23). That is, at least a portion of the receivingmodule 50 is located directly above thesecond step surface 678. When thecutout 675 is opened at the middle position of thetop surface 670, theentire receiving module 50 can be located in thesecond step surface 678 along the projection perpendicular to the second step surface 678 (as shown in fig. 24). Thus, the receivingmodule 50 and theimaging module 60 are arranged compactly, and the horizontal space occupied by the receiving module and the imaging module is small, so that the installation space in theelectronic device 100 is further saved. In other embodiments, the receivingmodule 50 includes theproximity sensor 51 and thelight sensor 52, but theproximity sensor 51 and thelight sensor 52 are of two separate single-package structures, and in this case, theproximity sensor 51 and thelight sensor 52, which are of the single-package structure, may also be both disposed on thesecond step surface 678.

Referring to fig. 24, in some embodiments, the receivingmodule 50 of the above embodiments only includes theproximity sensor 51, and the receivingmodule 50 does not include theoptical sensor 52, in this case, the proximity sensor 51 (or the receiving module 50) and theoptical sensor 52 are respectively a single package structure, theproximity sensor 51 is disposed on thesecond step surface 678, and theoptical sensor 52 is disposed on thehousing 20 outside theimaging module 60.

Referring to fig. 24, in some embodiments, the receivingmodule 50 of the above embodiments only includes theoptical sensor 52, and the receivingmodule 50 does not include theproximity sensor 51, in this case, the optical sensor 52 (or the receiving module 50) and theproximity sensor 51 are respectively a single package structure, theoptical sensor 52 is disposed on thesecond step surface 678, and theproximity sensor 51 is disposed on thehousing 20 outside theimaging module 60.

Referring to fig. 25, thesecond step surface 678 of the above embodiment is provided with alight hole 676, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to thelight hole 676. Specifically, when the receivingmodule 50 includes only theproximity sensor 51 without thephotosensor 52, and thephotosensor 52 is disposed outside thecamera housing 67, the number of the light-transmittingholes 676 may be one, and light outside theelectronic device 100 can pass through the light-transmittingholes 676 and be transmitted to theproximity sensor 51. The receivingmodule 50 of the present embodiment is disposed in thecamera housing 67, so that the receivingmodule 50 and thecamera housing 67 have more stable structures and the receivingmodule 50 and theimaging module 60 are conveniently mounted on thehousing 20.

Referring to fig. 25, thesecond step surface 678 of the above embodiment is provided with alight hole 676, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to thelight hole 676. Specifically, when the receivingmodule 50 includes only thelight sensor 52 without theproximity sensor 51, and theproximity sensor 51 is disposed outside thecamera housing 67, the number of the light holes 676 may be one, and light outside theelectronic device 100 can pass through the light holes 676 and be transmitted to thelight sensor 52. The receivingmodule 50 of the present embodiment is disposed in thecamera housing 67, so that the receivingmodule 50 and thecamera housing 67 have more stable structures and the receivingmodule 50 and theimaging module 60 are conveniently mounted on thehousing 20.

Referring to fig. 26, in some embodiments, thesecond step surface 678 of the above embodiments is provided with alight hole 676, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to thelight hole 676. Specifically, when the receivingmodule 50 integrates theproximity sensor 51 and thelight sensor 52, thelight hole 676 can be one light hole corresponding to both theproximity sensor 51 and thelight sensor 52 or two light holes spaced apart from each other and corresponding to theproximity sensor 51 and thelight sensor 52, respectively, and light outside theelectronic device 100 can pass through thelight hole 676 and be transmitted to theproximity sensor 51 and thelight sensor 52 in the receivingmodule 50. In other embodiments, the receivingmodule 50 includes theproximity sensor 51 and thelight sensor 52, but theproximity sensor 51 and thelight sensor 52 are of two separate single-package structures, and in this case, theproximity sensor 51 and thelight sensor 52, which are of the single-package structure, may be both disposed in thecamera housing 67 and correspond to the light-transmittinghole 676. The receivingmodule 50 of the present embodiment is disposed in thecamera housing 67, so that the receivingmodule 50 and thecamera housing 67 have more stable structures and the receivingmodule 50 and theimaging module 60 are conveniently mounted on thehousing 20.

Referring to fig. 26, in some embodiments, thesecond step surface 678 of the above embodiments is provided with alight hole 676, and the receivingmodule 50 is located in thecamera housing 67 and corresponds to thelight hole 676. Theimaging module 60 further includes asubstrate 66, theimage sensor 65 is disposed on thesubstrate 66, and the receivingmodule 50 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67. Specifically, thesubstrate 66 is provided with an FPC, one end of which is located in thecamera housing 67 and is used for carrying theimage sensor 65, and the other end of which can be connected to a main board of theelectronic device 100. In other embodiments, the receivingmodule 50 may be connected to an FPC. In this embodiment, the receivingmodule 50 disposed on thesubstrate 66 includes theproximity sensor 51 and thelight sensor 52, and theproximity sensor 51 and thelight sensor 52 together form a single package structure, so as to reduce a gap between the two when they are separately assembled, and save an installation space in theelectronic device 100.

In other embodiments, the receivingmodule 50 only includes theproximity sensor 51, and theoptical sensor 52 is not integrated in the receivingmodule 50, that is, the receivingmodule 50 is a single package structure of theproximity sensor 51, theoptical sensor 52 is also a single package structure, and theoptical sensor 52 can be fixed on thesubstrate 66 and accommodated in thecamera housing 67; alternatively, when a part of thesubstrate 66 is located inside thecamera housing 67 and another part thereof protrudes from thecamera housing 67, thelight sensor 52 may be fixed to thesubstrate 66 and located outside thecamera housing 67.

In another embodiment, the receivingmodule 50 only includes theoptical sensor 52, and theproximity sensor 51 is not integrated in the receivingmodule 50, that is, the receivingmodule 50 is a single package structure of theoptical sensor 52, theproximity sensor 51 is also a single package structure, and theproximity sensor 51 can be fixed on thesubstrate 66 and housed in thecamera housing 67; alternatively, when a part of thebase plate 66 is located inside thecamera housing 67 and another part thereof protrudes from thecamera housing 67, theproximity sensor 51 may be fixed to thebase plate 66 and located outside thecamera housing 67.

The receivingmodule 50 of the present embodiment is disposed in thecamera housing 67, so that the receivingmodule 50 and thecamera housing 67 have more stable structures and the receivingmodule 50 and theimaging module 60 are conveniently mounted on thehousing 20; meanwhile, theimaging module 60 sets thesubstrate 66 and sets the receivingmodule 50 on thesubstrate 66, so that the receivingmodule 50 can be stably installed in thecamera housing 67.

In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims (9)

1. An electronic device, comprising:

a housing;

the output module is of a single-packaging body structure and is arranged in the shell, the output module comprises a packaging shell, an infrared light supplementing lamp and a near infrared lamp, the packaging shell comprises a packaging substrate, the infrared light supplementing lamp and the near infrared lamp are packaged in the packaging shell and are borne on the packaging substrate, and the infrared light supplementing lamp and the near infrared lamp can emit infrared light rays to the outside of the packaging shell at different powers;

a grounding pin, a light supplement lamp pin and a proximity lamp pin are formed on the output module; when the grounding pin and the light supplement lamp pin are enabled, the infrared light supplement lamp emits infrared light; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; the shell is provided with a shell approaching through hole, a shell light supplementing through hole and a shell vibration through hole which are mutually spaced, the approaching infrared lamp corresponds to the shell approaching through hole, and the infrared light supplementing lamp corresponds to the shell light supplementing through hole; the vibration module is arranged on the shell;

a piezoelectric element coupled to the vibration module and spaced apart from the output module, the piezoelectric element being configured to deform when an electrical signal is applied thereto to vibrate the vibration module; the vibration module comprises a display screen and a light-transmitting cover plate, the display screen is arranged on the shell and forms an accommodating cavity together with the shell, the cover plate is arranged on the shell and is positioned on one side of the display screen, which is far away from the accommodating cavity, the display screen is combined with the cover plate, and the piezoelectric element is accommodated in the shell vibration through hole and is combined with the cover plate; the piezoelectric element and the display screen are attached to the cover plate by a joint; the imaging module is arranged on the shell and comprises a camera shell and two lens modules, wherein a notch is formed in the top surface of the camera shell to form a stepped top surface, the top surface comprises a first step surface and a second step surface lower than the first step surface, two light-emitting through holes are formed in the first step surface, and each light-emitting through hole corresponds to one lens module; and

the receiving module is arranged at the second ladder surface and comprises a proximity sensor and a light sensor, the proximity sensor and the light sensor form a single packaging body structure together, or the proximity sensor and the light sensor are of single packaging structures respectively; the imaging module comprises an infrared camera and a visible light camera, the electronic device further comprises a structured light projector, the piezoelectric element comprises a piezoelectric body and piezoelectric lugs extending out of the piezoelectric body, the number of the shell vibration through holes is multiple, the piezoelectric lugs correspond to the shell vibration through holes, each piezoelectric lug is partially accommodated in the corresponding shell vibration through hole and combined with the cover plate, the output module, the infrared camera, the visible light camera and the structured light projector are positioned between the cover plate and the piezoelectric body, the centers of the output module, the infrared camera, the visible light camera, the piezoelectric lugs and the structured light projector are positioned on the same line segment, and the output module is arranged between every two adjacent piezoelectric lugs, At least one of the infrared camera, the visible light camera, and the structured light projector.

2. The electronic device of claim 1, wherein the output module further comprises a chip, and the infrared fill-in light and the proximity infrared light are formed on one chip.

3. The electronic device according to claim 1, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a fill light window and an access window, the fill light window corresponds to the infrared fill light, and the access window corresponds to the access infrared light.

4. The electronic device according to claim 1, wherein the output module further comprises a fill-in light lens disposed in the package housing and corresponding to the infrared fill-in light; and/or

The output module is characterized by further comprising a proximity lamp lens, wherein the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp.

5. The electronic device according to claim 1, wherein the output module further comprises a fill-in light lens and a proximity light lens disposed in the package housing, the fill-in light lens corresponds to the infrared fill-in light, the proximity light lens corresponds to the proximity infrared light, and the fill-in light lens and the proximity light lens are located on a same transparent substrate.

6. The electronic device of claim 1, wherein the output module further comprises a metal shielding plate located in the package housing and between the infrared fill light and the near infrared light.

7. The electronic device of claim 1, wherein the output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located within the package housing, the optical enclosure enclosing the infrared fill light and the proximity infrared light.

8. The electronic device of claim 7, wherein the output module further comprises a light-emitting partition formed in the optical enclosure and located between the infrared fill light and the near infrared light.

9. The electronic device of claim 1, wherein a surface of the cover plate combined with the housing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks at least one of the housing access through hole, the housing fill light through hole, and the housing vibration through hole.

Images