CN108100990A - A kind of preparation method of sandwich type photoetching glue victim layer - Google Patents

Abstract

The invention discloses a kind of preparation method of sandwich type photoetching glue victim layer of RF MEMS device manufacturing fields, 5 the main preparation including lower floor's photoresist, growth barrier layer, the preparation of upper strata photoresist, Cu layers of etching and heat treatment steps.The method avoids the problem of dissolving each other between two layers of photoresist by the introducing on Cu barrier layers, the sacrificial layer of preparation have the characteristics that release is simple, bump height control precisely, equipment dependency degree is low, can make complex figure.

Description

Translated fromChinese

一种三明治夹心型光刻胶牺牲层的制备方法A kind of preparation method of sandwich type photoresist sacrificial layer

技术领域technical field

本发明涉及RFMEMS器件制造领域，特别涉及一种RFMEMS器件光刻胶牺牲层的制备方法。The invention relates to the field of RFMEMS device manufacturing, in particular to a method for preparing a photoresist sacrificial layer of an RFMEMS device.

技术背景technical background

RFMEMS器件具有体积小、功耗低、隔离度高、损耗低等优点，在通讯、航天、生物医学领域有广泛的应用前景。在MEMS制造中，常会用到牺牲层技术，即在下层电路生长一层填充层，再在填充层上加工上层电路，最后通过化学刻蚀等手段将这部分填充层腐蚀掉从而得到悬空的上层结构。由于被去掉的填充层只起到分离层的作用，故称之为牺牲层。已有的牺牲层材料包括Si、SiO2、PI、光刻胶以及Al、Ti等材料。RFMEMS devices have the advantages of small size, low power consumption, high isolation, and low loss, and have broad application prospects in the fields of communication, aerospace, and biomedicine. In MEMS manufacturing, sacrificial layer technology is often used, that is, a filling layer is grown on the lower circuit, and the upper circuit is processed on the filling layer, and finally this part of the filling layer is etched away by means of chemical etching to obtain a suspended upper layer. structure. Since the removed filling layer only acts as a separation layer, it is called a sacrificial layer. Existing sacrificial layer materials include Si, SiO2, PI, photoresist, Al, Ti and other materials.

其中正性光刻胶(后简称正胶)具有分辨率高、易加工图形、应力小、流平性好、易于释放等优点，但正胶由于自身的特性，也存在一定的局限性：单层正胶牺牲层难以精准实现台阶结构，如凸点等结构的精确制备；在已经图形化的正胶上再匀正胶则普遍存在溶胶的问题；双层光刻胶牺牲层需要选用特定的负性光刻胶作为底层，难以实现高精度图形制备，且必须使用干法释放，对设备要求较高。Among them, the positive photoresist (hereinafter referred to as the positive photoresist) has the advantages of high resolution, easy processing of graphics, small stress, good leveling, and easy release. However, due to its own characteristics, the positive photoresist also has certain limitations: It is difficult to accurately realize the step structure of the sacrificial layer of positive resist, such as the precise preparation of structures such as bumps; the problem of sol is common when the positive resist is evenly distributed on the patterned positive resist; the double-layer photoresist sacrificial layer needs to select a specific Negative photoresist is used as the bottom layer, it is difficult to achieve high-precision pattern preparation, and it must be released by dry method, which requires high equipment.

本发明提出了“光刻胶-Cu层-光刻胶”的三明治夹心型光刻胶牺牲层的制备方法，即在下层光刻胶上通过溅射的方式生长一层Cu层作为阻挡层和限高层，且Cu层也可作为内埋的导电层使用。这种牺牲层具有制备简单、可加工复杂图形、易于释放、凸点高度控制精准等特点，并且这种复合牺牲层可以使用去膜剂进行一次性去除，工艺简单。The present invention proposes the preparation method of the sandwich type photoresist sacrificial layer of "photoresist-Cu layer-photoresist", that is, a layer of Cu layer is grown on the lower photoresist by sputtering as a barrier layer and The upper layer is limited, and the Cu layer can also be used as a buried conductive layer. This sacrificial layer has the characteristics of simple preparation, complex pattern processing, easy release, and precise bump height control, and this composite sacrificial layer can be removed with a film remover at one time, and the process is simple.

发明内容Contents of the invention

本发明所要解决的技术问题是在两层正胶中夹入Cu层作为隔离层和限高层，实现了一种线条精度高、工艺简单、可精准控制凸点高度的RFMEMS器件的三明治夹心型光刻胶牺牲层的制备。The technical problem to be solved by the present invention is to insert a Cu layer between two layers of positive glue as the isolation layer and the upper limit layer, and realize a sandwich type photonics of RFMEMS devices with high line precision, simple process, and precise control of bump height. Preparation of resist sacrificial layer.

本发明采用的技术方案为：The technical scheme adopted in the present invention is:

一种三明治夹心型光刻胶牺牲层的制备方法，工艺步骤如下：A preparation method of a sandwich type photoresist sacrificial layer, the process steps are as follows:

①下层正胶制备：在下层电路上旋涂第一层正性光刻胶，并通过曝光、显影的方式完成图形化，图形化后，对本层光刻胶进行热处理；①Preparation of lower layer positive resist: spin-coat the first layer of positive photoresist on the lower circuit, and complete the patterning by exposure and development. After patterning, heat-treat the photoresist of this layer;

②溅射阻挡层：在第一层正性光刻胶上通过常温溅射的手段生长Cu层作为阻挡层；② Sputtering barrier layer: grow a Cu layer on the first layer of positive photoresist by sputtering at room temperature as a barrier layer;

③上层正胶制备：在Cu层上旋涂第二层正性光刻胶，并通过曝光、显影的方式完成图形化，图形化后，对整个产品进行热处理；③Preparation of upper layer positive photoresist: Spin-coat the second layer of positive photoresist on the Cu layer, and complete patterning by exposure and development. After patterning, heat treat the entire product;

④腐蚀Cu层：以第二层正性光刻胶为保护层进行Cu层的腐蚀，将悬浮结构及凸点结构根部的Cu层去掉；④ Corrosion of the Cu layer: use the second layer of positive photoresist as a protective layer to etch the Cu layer, and remove the Cu layer at the root of the suspension structure and the bump structure;

⑤热处理：对整个产品进行热处理；⑤Heat treatment: heat treatment for the whole product;

完成三明治夹心型光刻胶牺牲层的制备。The preparation of the sandwich-type photoresist sacrificial layer is completed.

其中，步骤⑤中热处理的温度低于步骤①中的热处理温度。Wherein, the heat treatment temperature in step ⑤ is lower than the heat treatment temperature in step ①.

其中，步骤③中的光刻胶图形中含有凸点结构图形，且最终凸点结构距离下层电路的高度等于步骤①中第一层正性光刻胶层的厚度。Wherein, the photoresist pattern in step ③ contains a bump structure pattern, and the height of the final bump structure from the lower circuit is equal to the thickness of the first layer of positive photoresist layer in step ①.

本发明与背景技术相比优点为：Compared with the background technology, the present invention has the following advantages:

1、相对于PI(聚酰亚胺)等介质材料，光刻胶牺牲层制备简单，不需要高温固化，热处理温度低、设备依赖度低；1. Compared with dielectric materials such as PI (polyimide), the preparation of photoresist sacrificial layer is simple, does not require high temperature curing, low heat treatment temperature, and low equipment dependence;

2、相对于单层光刻胶来说，三明治夹心型光刻胶牺牲层能够精准的控制凸点高度，并且凸点底部十分平整；2. Compared with the single-layer photoresist, the sandwich-type photoresist sacrificial layer can accurately control the height of the bump, and the bottom of the bump is very flat;

3、相对于Al、Ti等金属牺牲层，避免了金属膜层应力导致的底部介质层损坏以及悬浮结构翘曲等问题；3. Compared with metal sacrificial layers such as Al and Ti, it avoids the damage of the bottom dielectric layer and the warping of the suspension structure caused by the stress of the metal film layer;

4、相对于负、正光刻胶的双牺牲层，双层正胶的图形分辨率更高，并且可以直接使用正胶去膜剂湿法释放，不依赖昂贵的干法设备，工艺相对简单；4. Compared with the double sacrificial layer of negative and positive photoresist, the pattern resolution of double-layer positive resist is higher, and it can be directly released by wet method using positive resist remover, without relying on expensive dry equipment, and the process is relatively simple ;

5、挑选Cu作为阻挡层与限高层，即避免了两层正性光刻胶之间存在的溶胶问题，也实现了凸点高度、均匀性、一致性等重要指标的精准控制，且Cu层后续能够溶于去膜剂，没有引入额外的释放步骤；5. Select Cu as the barrier layer and limit the upper layer, which avoids the problem of sol between the two layers of positive photoresist, and also realizes the precise control of important indicators such as bump height, uniformity, and consistency, and the Cu layer Subsequent dissolution in film removers without introducing additional release steps;

6、Cu层可以作为内埋的导电层使用，可与后续设计需求结合制备出更复杂的悬浮结构。6. The Cu layer can be used as a buried conductive layer, and can be combined with subsequent design requirements to prepare more complex suspension structures.

附图说明Description of drawings

图1是一种带触点RFMEMS开关的示意图；Fig. 1 is a schematic diagram of a RFMEMS switch with contacts;

图2是制作牺牲层前下层电路示意图；Fig. 2 is a schematic diagram of the lower layer circuit before making the sacrificial layer;

图3是第一层正胶制备完成后的示意图；Fig. 3 is a schematic diagram after the first layer of positive glue is prepared;

图4是生长Cu层阻挡层后的示意图；Fig. 4 is the schematic diagram after growing Cu layer barrier layer;

图5是第二层正胶制备完成后的示意图；Fig. 5 is a schematic diagram after the second layer of positive resist is prepared;

图6是制作完成的三明治夹心型光刻胶牺牲层的示意图。FIG. 6 is a schematic diagram of a fabricated sandwich-type photoresist sacrificial layer.

具体实施方式：Detailed ways:

下面结合具体实施例及附图1-6对本发明作进一步解释说明。The present invention will be further explained below in combination with specific embodiments and accompanying drawings 1-6.

图1是一种带触点RFMEMS开关的示意图，包括下层电路结构以及悬浮结构，悬浮结构中有凸点结构；要形成如图1中所示的悬浮结构，本发明设计了一种三明治夹心型光刻胶牺牲层的制备方法，包括以下步骤：Fig. 1 is a schematic diagram of a RFMEMS switch with contacts, including a lower layer circuit structure and a suspension structure, and a bump structure is arranged in the suspension structure; to form a suspension structure as shown in Fig. 1, the present invention designs a sandwich type The preparation method of photoresist sacrificial layer comprises the following steps:

1、下层正胶制备：图2是制作牺牲层前下层电路示意图，下层电路结构包括基底和通过电镀等方式加工的电路结构；在下层电路上旋涂第一层正胶，通过曝光、显影的方式完成图形化。图形化后，对本层光刻胶进行热处理，形成如图3所示的结构；1. Preparation of the lower layer positive resist: Figure 2 is a schematic diagram of the lower layer circuit before making the sacrificial layer. The lower layer circuit structure includes the substrate and the circuit structure processed by electroplating; the first layer of positive resist is spin-coated on the lower layer circuit and exposed and developed. way to complete the graphics. After patterning, the photoresist of this layer is heat-treated to form the structure shown in Figure 3;

实施例中，下层正胶使用AZ1500，旋涂厚度为0.5～1.5μm，前烘温度90～120℃，时间为2～4min。然后使用掩膜版进行对位曝光，本部分曝光图形为悬浮结构根部图形。之后显影完成图形化。最后对图形化后的AZ1500光刻胶进行100℃～130℃，20min～50min的热处理，从而完成第一层正胶的制备。In the embodiment, AZ1500 is used for the positive resist of the lower layer, the spin coating thickness is 0.5-1.5 μm, the pre-baking temperature is 90-120° C., and the time is 2-4 minutes. Then use the mask plate to perform alignment exposure, and the exposure pattern of this part is the root pattern of the suspended structure. Afterwards, the development completes the patterning. Finally, the patterned AZ1500 photoresist is heat-treated at 100° C. to 130° C. for 20 minutes to 50 minutes, so as to complete the preparation of the first layer of positive resist.

2、溅射阻挡层：在步骤1处理完的产品上通过常温溅射的手段生长Cu层作为阻挡层，形成如图4所示的结构；2. Sputtering barrier layer: On the product processed in step 1, a Cu layer is grown as a barrier layer by means of room temperature sputtering to form a structure as shown in Figure 4;

实施例中，使用溅射台通过直流(DC)磁控溅射的方法在产品表面生长了一层50～100nm的Cu层。In the embodiment, a Cu layer of 50-100 nm is grown on the surface of the product by direct current (DC) magnetron sputtering using a sputtering station.

3、上层正胶制备：在Cu层上旋涂第二层正胶，通过曝光、显影的方式完成图形化。图形化后，对产品进行热处理，形成如图5所示的结构；3. Preparation of the upper layer of positive resist: Spin-coat the second layer of positive resist on the Cu layer, and complete the patterning by exposure and development. After patterning, the product is heat-treated to form the structure shown in Figure 5;

实施例中，上层正胶使用AZ1500，旋涂厚度为0.5～1μm，前烘温度90～120℃，时间为2～4min。然后使用掩膜版进行对位曝光，本部分曝光图形包括凸点图形以及悬浮结构根部图形。显影完成图形化后，对产品进行60℃～80℃、10min～20min的热处理。In the embodiment, AZ1500 is used as the positive resist for the upper layer, the spin coating thickness is 0.5-1 μm, the pre-baking temperature is 90-120° C., and the time is 2-4 minutes. Then use the mask plate for alignment exposure. The exposure pattern of this part includes the bump pattern and the root pattern of the suspension structure. After developing and patterning, the product is subjected to heat treatment at 60°C to 80°C for 10min to 20min.

4、腐蚀Cu层：以上层胶为保护层进行Cu层的腐蚀，将悬浮结构以及凸点结构根部的Cu层去掉，提高器件可靠性。4. Corrosion of the Cu layer: The above layer of glue is used as a protective layer to corrode the Cu layer, and the Cu layer at the root of the suspension structure and the bump structure is removed to improve the reliability of the device.

实施例中，使用Cu腐蚀溶液，将悬浮结构根部的Cu层除去。最终凸点距离下层电路的高度等于步骤1中旋涂的光刻胶层的厚度。In an embodiment, a Cu etching solution is used to remove the Cu layer at the root of the suspended structure. The height of the final bump from the underlying circuit is equal to the thickness of the photoresist layer spin-coated in step 1.

5、热处理：对产品进行热处理，本步骤的热处理温度必须低于步骤1的热处理温度。5. Heat treatment: Carry out heat treatment to the product, the heat treatment temperature of this step must be lower than the heat treatment temperature of step 1.

实施例中，将Cu层腐蚀完毕后再进行90℃～120℃、20min～50min的热处理。In the embodiment, after the Cu layer is corroded, heat treatment is performed at 90° C. to 120° C. for 20 minutes to 50 minutes.

完成RFMEMS器件三明治夹心型光刻胶牺牲层的制备。制作完成的三明治夹心型光刻胶牺牲层的示意图如图6所示。The preparation of the sandwich photoresist sacrificial layer of the RFMEMS device is completed. A schematic diagram of the fabricated sandwich-type photoresist sacrificial layer is shown in FIG. 6 .

Claims (3)

1. a kind of preparation method of sandwich type photoetching glue victim layer, it is characterised in that comprise the following steps：

1. prepared by lower floor's positive photoresist：The spin coating first layer positive photoresist on lower circuit, and completed by way of exposing, developingGraphically, after graphical, this layer of photoresist is heat-treated；

2. sputter barrier layer：The means sputtered on first layer positive photoresist by room temperature grow Cu layers and are used as barrier layer；

3. prepared by upper strata positive photoresist：The spin coating second layer positive photoresist on Cu layers, and complete figure by way of exposing, developingChange, after graphical, entire product is heat-treated；

4. Cu layers of corrosion：Cu layers of corrosion is carried out using second layer positive photoresist as protective layer, by suspension structure and bump structureThe Cu layers of root remove；

5. it is heat-treated：Entire product is heat-treated；

Complete the preparation of sandwich type photoetching glue victim layer.

2. a kind of preparation method of sandwich type photoetching glue victim layer according to claim 1, it is characterised in that：StepSuddenly the heat treatment temperature during 1. the temperature of 5. middle heat treatment is less than step.

3. a kind of preparation method of sandwich type photoetching glue victim layer according to claim 1, it is characterised in that：StepSuddenly 3. in photoetching offset plate figure in containing bump structure figure, and height of the final bump structure apart from lower circuit is equal to step1. the thickness of middle first layer positive photoresist layer.