CN108012004B - Electronic device - Google Patents
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- CN108012004B CN108012004BCN201711433082.9ACN201711433082ACN108012004BCN 108012004 BCN108012004 BCN 108012004BCN 201711433082 ACN201711433082 ACN 201711433082ACN 108012004 BCN108012004 BCN 108012004B
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- infrared
- proximity
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Translated fromChinese
Description
Technical Field
The present invention relates to the field of consumer electronics, and more particularly, to an electronic device.
Background
Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a light sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange a plurality of functional devices, the mobile phone occupies too much space.
Disclosure of Invention
The embodiment of the invention provides an electronic device.
An electronic device according to an embodiment of the present invention includes:
a housing;
the input and output module is arranged in the shell and comprises a packaging shell, an infrared light supplementing lamp, a proximity infrared lamp, a proximity sensor and a light sensor, wherein the packaging shell comprises a packaging substrate, the infrared light supplementing lamp, the proximity infrared lamp, the proximity sensor and the light sensor are packaged in the packaging shell and are borne on the packaging substrate, the infrared light supplementing lamp and the proximity infrared lamp can emit infrared light to the outside of the packaging shell at different powers, the proximity sensor is used for receiving the infrared light emitted by the proximity infrared lamp and reflected by an object so as to detect the distance from the object to the electronic device, and the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light;
the vibration module is arranged on the shell; and
the piezoelectric element is combined with the vibration module and is spaced from the input and output module, and the piezoelectric element is used for deforming when an electric signal is applied to the piezoelectric element so as to enable the vibration module to vibrate.
In some embodiments, the vibration module includes a display screen and a transparent cover plate, the display screen is disposed on the housing and forms an accommodating cavity together with the housing, the cover plate is disposed on the housing and located on a side of the display screen away from the accommodating cavity, the display screen is combined with the cover plate, the housing is provided with a housing approach through hole, a housing light supplement through hole, a housing approach sensor through hole, a housing light sensation through hole, and a housing vibration through hole which are spaced from each other, the approach infrared lamp corresponds to the housing approach through hole, the infrared light supplement lamp corresponds to the housing light supplement through hole, the light sensor corresponds to the housing light sensation through hole, and the piezoelectric element is accommodated in the housing vibration through hole and combined with the cover plate.
In some embodiments, the piezoelectric element and the display screen are attached to the cover plate by a joint.
In some embodiments, the input/output module further includes a chip, and the infrared fill-in light, the proximity infrared light, the proximity sensor, and the light sensor are all formed on one chip.
In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a light filling window, a proximity lamp window, a proximity sensor window, and a light sensing window, the light filling window corresponds to the infrared light filling lamp, the proximity lamp window corresponds to the proximity infrared lamp, the proximity sensor window corresponds to the proximity sensor, and the light sensing window corresponds to the light sensor.
In some embodiments, the input/output module further includes a light supplement lamp lens, and the light supplement lamp lens is disposed in the package housing and corresponds to the infrared light supplement lamp; and/or
The input and output module also comprises a proximity lamp lens which is arranged in the packaging shell and corresponds to the proximity infrared lamp; and/or
The input and output module further comprises a proximity sensor lens, and the proximity sensor lens is arranged in the packaging shell and corresponds to the proximity sensor; and/or
The input and output module further comprises a light-sensitive lens, and the light-sensitive lens is arranged in the packaging shell and corresponds to the light sensor.
In some embodiments, the input/output module further includes a light supplement lamp lens, a proximity sensor lens, and a light sensing lens, which are disposed in the package housing, wherein the light supplement lamp lens corresponds to the infrared light supplement lamp, the proximity lamp lens corresponds to the proximity infrared lamp, the proximity sensor lens corresponds to the proximity sensor, the light sensing lens corresponds to the light sensor, and the light supplement lamp lens, the proximity sensor lens, and the light sensing lens are disposed on the same transparent substrate.
In some embodiments, the input/output module further includes a plurality of metal shielding plates, and the plurality of metal shielding plates are respectively located in the package housing and between any two of the infrared fill light, the proximity infrared light, the proximity sensor, and the optical sensor.
In some embodiments, the input/output module further includes an optical enclosure made of a light-transmitting material, the optical enclosure is formed on the package substrate and located in the package housing, and the optical enclosure encloses the infrared fill light, the proximity infrared light, the proximity sensor, and the light sensor.
In some embodiments, the input/output module further includes a plurality of light-emitting partition plates, and the light-emitting partition plates are respectively formed in the optical enclosure and located between any two of the infrared fill light, the proximity infrared light, the proximity sensor, and the optical sensor.
In some embodiments, a ground pin, a fill-in light pin, a proximity sensor pin, and a light sensing pin are formed on the input/output module, and when the ground pin and the fill-in light pin are enabled, the infrared fill-in light emits infrared light; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; when the grounding pin and the proximity sensor pin are enabled, the proximity sensor receives infrared light rays reflected by an object and emitted by the proximity infrared lamp; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.
In some embodiments, an infrared transparent ink which only transmits infrared light is formed on a surface of the cover plate, which is combined with the casing, and the infrared transparent ink blocks at least one of the casing access through hole, the casing light supplement through hole, the casing proximity sensor through hole, and the casing vibration through hole.
In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, centers of the input/output module, the infrared camera, the visible light camera, and the structured light projector are located on a same line segment, and the piezoelectric element is located between the line segment and the top of the housing.
In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, the number of the piezoelectric elements is plural, the number of the casing vibration through holes is plural, the plural piezoelectric elements correspond to the plural casing vibration through holes, each piezoelectric element is accommodated in the corresponding casing vibration through hole, centers of the input/output module, the infrared camera, the visible light camera, the plural piezoelectric elements, and the structured light projector are located on the same line segment, and at least one of the input/output module, the infrared camera, the visible light camera, and the structured light projector is disposed between two adjacent piezoelectric elements.
In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, the piezoelectric element includes a piezoelectric body and a plurality of piezoelectric bumps extending from the piezoelectric body, the number of the casing vibration through holes is multiple, the plurality of piezoelectric bumps correspond to the plurality of casing vibration through holes, each of the piezoelectric bumps is partially received in the corresponding casing vibration through hole and is combined with the cover plate, the input/output module, the infrared camera, the visible light camera, and the structured light projector are located between the cover plate and the piezoelectric body, the centers of the input/output module, the infrared camera, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located on the same line segment, and the input/output module, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located between two adjacent piezoelectric bumps, At least one of the infrared camera, the visible light camera, and the structured light projector.
In the electronic device of the embodiment of the invention, the input/output module integrates the infrared light supplement lamp, the proximity infrared lamp, the proximity sensor and the light sensor into a single packaging body structure, and integrates the functions of transmitting infrared light for infrared distance measurement, infrared light supplement and visible light intensity detection, so that the input/output module has higher integration level and smaller volume, and saves space for realizing the functions of infrared light supplement, infrared distance measurement and visible light intensity detection. In addition, because infrared light filling lamp, the proximity infrared lamp, the proximity sensor and the light sensor are borne on the same packaging substrate, compared with the infrared light filling lamp, the proximity infrared lamp, the proximity sensor and the light sensor in the traditional process, different wafers are required to be manufactured respectively and then combined on the PCB substrate for packaging, and the packaging efficiency is improved. Furthermore, the electronic device adopts the piezoelectric element and the vibration module to realize bone conduction sound transmission, replaces the traditional telephone receiver structure which is used for transmitting sound through air, effectively ensures the privacy of conversation content on the one hand, and on the other hand, because the original telephone receiver is cancelled, the through hole which corresponds to the telephone receiver is avoided being arranged on the cover plate, the process is simpler, and the appearance is more attractive.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;
fig. 2 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;
FIG. 3 is a schematic cross-sectional view illustrating an input/output module of an electronic device according to an embodiment of the invention;
FIG. 4 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;
FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 1 taken along line V-V;
FIG. 6 is a schematic partial cross-sectional view of the electronic device of FIG. 1 taken along line VI-VI;
FIG. 7 is a schematic structural diagram of an electronic device according to some embodiments of the invention;
FIG. 8 is a schematic partial cross-sectional view of the electronic device of FIG. 7 taken along line VIII-VIII;
FIG. 9 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;
fig. 10-13 are schematic partial cross-sectional views of electronic devices according to some embodiments of the invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.
In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, anelectronic device 100 according to an embodiment of the invention includes ahousing 20, acover 30, and electronic components. The electronic component includes an input-output module 10, avibration module 30a, apiezoelectric element 70, an imaging module 60, and astructured light projector 80. Theelectronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking theelectronic device 100 as a mobile phone, it is understood that the specific form of theelectronic device 100 may be other, and is not limited herein.
Referring to fig. 2 and 3, the input/output module 10 is a single package structure, and includes apackage housing 11, an infrared fill-inlight 12, a proximityinfrared light 13, aproximity sensor 50, and alight sensor 1 d.
Thepackaging shell 11 is used for simultaneously packaging the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and thelight sensor 1d, or the infraredlight supplement lamp 12, the proximityinfrared lamp 13, the proximity sensor and thelight sensor 1d are simultaneously packaged in thepackaging shell 11. Thepackage housing 11 includes apackage substrate 111, apackage sidewall 112, and apackage top 113. Thepackage housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the input/output module 10. In the present embodiment, the centers of the infrared fill-inlight 12, the proximityinfrared light 13, theproximity sensor 50, and thephotosensor 1d are located on the same line segment, for example: an infraredlight supplement lamp 12, a proximityinfrared lamp 13, aproximity sensor 50 and alight sensor 1d are sequentially arranged from one end to the other end of the line segment; or, a proximityinfrared lamp 13, aproximity sensor 50, an infraredlight supplement lamp 12 and alight sensor 1d are sequentially arranged from one end to the other end of the line segment; or, the proximityinfrared lamp 13, theproximity sensor 50, thelight sensor 1d and the infraredsupplementary lighting lamp 12 are sequentially arranged from one end to the other end of the line segment. In other embodiments, the connection line between theinfrared fill light 12, the nearinfrared light 13 and thelight sensor 1d is triangular.
Thepackage substrate 111 is used for carrying theinfrared fill light 12, the proximityinfrared light 13, theproximity sensor 50, and theoptical sensor 1 d. When the input/output module 10 is manufactured, the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50, and thephoto sensor 1d may be formed on onechip 14, and then the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50, thephoto sensor 1d, and thechip 14 are together disposed on thepackage substrate 111, and specifically, thechip 14 may be bonded on thepackage substrate 111. Meanwhile, thepackage substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., thehousing 20 and the motherboard of the electronic device 100) to fix the input/output module 10 in theelectronic device 100.
Thepackaging side wall 112 can surround the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and thelight sensor 1d, thepackaging side wall 112 extends from thepackaging substrate 111, thepackaging side wall 112 can be combined with thepackaging substrate 111, and preferably, thepackaging side wall 112 and thepackaging substrate 111 are detachably connected, so that the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and thelight sensor 1d can be conveniently overhauled after thepackaging side wall 112 is taken down. Thepackage sidewall 112 may be made of a material opaque to infrared light to prevent infrared light emitted from theinfrared fill light 12 or the near infrared light 13 from passing through thepackage sidewall 112.
Thepackage top 113 is opposite to thepackage substrate 111, and thepackage top 113 is connected to thepackage sidewall 112. Alight supplement window 1131, aproximity lamp window 1132, aproximity sensor window 1134 and alight sensation window 1133 are formed in thepackage top 113, thelight supplement window 1131 corresponds to the infraredlight supplement lamp 12, and infrared light emitted by the infraredlight supplement lamp 12 passes through thelight supplement window 1131; theproximity lamp window 1132 corresponds to the proximityinfrared lamp 13, and infrared light emitted by the proximityinfrared lamp 13 penetrates out of theproximity window 1132; theproximity sensor window 1134 corresponds to theproximity sensor 50, and infrared light emitted by the proximityinfrared lamp 13 can pass through theproximity sensor window 1134 after being reflected by an object and be incident on theproximity sensor 50; thelight sensing window 1133 corresponds to thelight sensor 1d, and the visible light can pass through thelight sensing window 1133 and be incident on thelight sensor 1 d. Thepackage top 113 and thepackage side wall 112 may be formed integrally or separately. In one example, thefill light window 1131, theproximity lamp window 1132, theproximity sensor window 1134, and thelight sensing window 1133 are all through holes, and thepackage top 113 is made of a material opaque to infrared light and visible light. In another example, thepackage top 113 is fabricated from an infrared opaque material, a visible opaque material, and in particular, theproximity lamp window 1132 and theproximity sensor window 1134 are fabricated from an infrared opaque material, thelight sensing window 1133 is fabricated from a visible opaque material, and the remainder is fabricated from an infrared opaque and visible opaque material. Further, thefill light window 1131 and theproximity lamp window 1132 may be formed with lens structures to improve an emission angle of the infrared light emitted from thefill light window 1131 and theproximity lamp window 1132, for example, thefill light window 1131 is formed with a concave lens structure to diffuse the light passing through thefill light window 1131 to be emitted outward; theproximity window 1132 is formed with a convex lens structure, so that light passing through theproximity window 1132 is gathered and emitted outwards; thelight sensing window 1133 may also be formed with a lens structure to improve the visible light emitting angle incident from thelight sensing window 1133, for example, thelight sensing window 1133 has a convex lens structure to gather and project the light incident from thelight sensing window 1133 onto thelight sensor 1 d.
The infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and thelight sensor 1d can be formed on onechip 14, the size of the integrated infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and thelight sensor 1d is further reduced, and the preparation process is simple. Theinfrared fill light 12 can emit infrared light, the infrared light passes through thefill light window 1131 to project onto the surface of the object, and theinfrared camera 62 of theelectronic device 100 receives the infrared light reflected by the object to obtain image information of the object (at this time, theinfrared fill light 12 is used for infrared fill light). The proximityinfrared lamp 13 may emit infrared light, the infrared light passes through theproximity lamp window 1132 and reaches the surface of the object, and theproximity sensor 50 receives the infrared light reflected by the object to detect the distance from the object to the input-output module 10 (at this time, the proximityinfrared lamp 13 is used for infrared ranging). Thelight sensor 1d receives visible light in the ambient light incident from thelight sensing window 1133, and detects the intensity of the visible light.
The infraredlight supplementing lamp 12 and the nearinfrared lamp 13 can emit infrared light to the outside of thepackaging shell 11 at different powers, specifically, the infraredlight supplementing lamp 12 and the nearinfrared lamp 13 can emit infrared light simultaneously, and the input andoutput module 10 is used for infrared light supplementing and infrared distance measurement simultaneously; the infraredlight supplement lamp 12 can emit light rays and does not emit light rays close to theinfrared lamp 13, and the input andoutput module 10 is only used for infrared light supplement; or the infraredlight supplement lamp 12 does not emit light and is close to theinfrared lamp 13 to emit light, and the input andoutput module 10 is only used for infrared distance measurement.
Referring to fig. 4, in the embodiment of the invention, aground pin 15, a fill-inlight pin 16, aproximity light pin 17, a proximity sensor pin 1g, and a light sensing pin 1f are formed on the input/output module 10. Theground pin 15, the fill-inlight pin 16, theproximity light pin 17, the proximity sensor pin 1g, and the light sensing pin 1f may be formed on thepackage substrate 111, and when theground pin 15 and the fill-inlight pin 16 are enabled (i.e., when the access circuits of theground pin 15 and the fill-inlight pin 16 are turned on), the infrared fill-inlight 12 emits infrared light; when theground pin 15 and theproximity lamp pin 17 are enabled (i.e., when theground pin 15 and theproximity lamp pin 17 access circuit are on), the proximityinfrared lamp 13 emits infrared light; when the ground pin and the proximity sensor pin 1g are enabled, theproximity sensor 50 receives infrared light reflected by the object and emitted by the proximityinfrared lamp 13; when theground pin 15 and the light sensing pin 1f are enabled (i.e., when theground pin 15 and the light sensing pin 1f are connected to the circuit, thelight sensor 1d detects the intensity of the visible light, which is used as a basis for controlling the display brightness of thedisplay screen 90.
Referring to fig. 1 and 5, thehousing 20 may serve as a mounting carrier for the input/output module 10, or the input/output module 10 may be disposed in thehousing 20. Thechassis 20 may be a housing of theelectronic device 100. Specifically, thecasing 20 includes a top 21 and a bottom 22, and at a position corresponding to the electronic component, thecasing 20 is provided with a casing proximity lamp throughhole 23, a casing proximity sensor throughhole 26, a casing light supplement throughhole 24, a casing light sensation throughhole 2f, and a casing vibration throughhole 2a, which are spaced from each other. When the input/output module 10 is disposed in thehousing 20, the proximityinfrared lamp 13 corresponds to the housing proximity throughhole 23, theproximity sensor 50 corresponds to the housing proximity sensor throughhole 26, the infraredlight supplement lamp 12 corresponds to the housing light supplement throughhole 24, and thelight sensor 1d corresponds to the housing light supplement throughhole 2 f. The light emitted by the nearinfrared lamp 13 corresponding to the case near throughhole 23 can pass through the case near throughhole 23, specifically, the nearinfrared lamp 13 is opposite to the case near throughhole 23, or the light emitted by the nearinfrared lamp 13 passes through the case near throughhole 23 after being acted by the light guide element. The infraredlight supplement lamp 12 corresponds to the chassis light supplement throughhole 24, and the description thereof is omitted. Thelight sensor 1d and the case light sensing throughhole 2f correspond to each other, and the visible light can pass through the case light sensing throughhole 2f and be incident on thelight sensor 1d, specifically, thelight sensor 1d is opposite to the case light sensing throughhole 2f, or the incident light of the visible light passes through the case light sensing throughhole 2f and is incident on thelight sensor 1d after the light guide element acts on the light sensor. Theproximity sensor 50 corresponds to the housing proximity sensor throughhole 26 for the same reason, and will not be described in detail. The enclosure proximity throughhole 23, the enclosure proximity sensor throughhole 26, the enclosure light supplement throughhole 24, and the enclosure light sensing throughhole 2f may be spaced from each other, and of course, in other embodiments, the enclosure proximity throughhole 23, the enclosure proximity sensor throughhole 26, the enclosure light supplement throughhole 24, and the enclosure light sensing throughhole 2f may also be communicated with each other.
Thevibration module 30a is mounted on thecabinet 20. Thevibration module 30a may include adisplay screen 90 and acover plate 30, or thedisplay screen 90 and thecover plate 30 are combined to form thevibration module 30a, so as to improve the rigidity of thevibration module 30 a. Thedisplay screen 90 is disposed on thehousing 20 and forms a receivingcavity 91 with thehousing 20, and thecover plate 30 is disposed on thehousing 20 and located on a side of thedisplay screen 90 away from the receivingcavity 91 to protect thedisplay screen 90. Since the input/output module 10 according to the embodiment of the invention can occupy a smaller volume, the volume for disposing thedisplay screen 90 in thehousing 20 can be correspondingly increased, so as to increase the screen occupation ratio of theelectronic device 100. Specifically, thedisplay screen 90, the input/output module 10 and thepiezoelectric element 70 are disposed between thetop portion 21 and thebottom portion 22, thetop portion 21 is located above thebottom portion 22 in a state where the user normally uses theelectronic device 100, and the input/output module 10 may be disposed between thedisplay screen 90 and thetop portion 21. In other embodiments, thedisplay 90 may be a full screen with a gap, thedisplay 90 surrounds the input/output module 10, and the input/output module 10 is exposed from the gap of thedisplay 90.
Thepiezoelectric element 70 is made of a ceramic or quartz crystal material, and thepiezoelectric element 70 may be a single wafer, a twin wafer, or a laminatedpiezoelectric element 70. Thepiezoelectric element 70 is coupled to thevibration module 30a and spaced apart from the input-output module 10. Specifically, thepiezoelectric element 70 is accommodated in the casing vibration throughhole 2a, is coupled to thecover plate 30, and is spaced apart from thecasing 20, and may be: thepiezoelectric element 70 is partially accommodated in the chassis vibration throughhole 2a, or thepiezoelectric element 70 is entirely accommodated in the chassis vibration throughhole 2 a. When an electric signal (voltage) is applied to both ends of thepiezoelectric element 70, thepiezoelectric element 70 is mechanically deformed, for example, expanded or contracted, due to the inverse piezoelectric effect, thereby causing thevibration module 30a coupled to thepiezoelectric element 70 to vibrate according to the frequency of the electric signal. When the user's body is in contact with thevibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with thevibration module 30a (e.g., cartilage of the outer ear, teeth). In this way, the user can realize the functions of voice call, listening to music, etc. through thepiezoelectric element 70 and thevibration module 30 a. In an embodiment of the present invention, the processor of theelectronic device 100 is configured to acquire a sound signal and apply an electrical signal corresponding to the sound signal to the two ends of thepiezoelectric element 70.
It can be understood that the traditional receiver structure adopts air conduction sound, the local sound pressure of the receiver is usually about 90 dB-100 dB when the receiver works, and the sound is still about 50 dB-60 dB even if the sound is transmitted to the range of 1 meter around in the quiet surrounding environment (such as in the general office environment of about 50 dB), which causes the conversation content among the callers to be perceived around, resulting in privacy leakage. Theelectronic device 100 according to the embodiment of the invention adopts thepiezoelectric element 70 and thevibration module 30a to realize bone conduction sound transmission, and the sound of the call is mainly sensed by the bone conduction of the vibration and can effectively ensure the privacy of the call content.
Referring again to fig. 5 and 6, thepiezoelectric element 70 and thedisplay screen 90 are attached to thecover plate 30 by the joint 30 b. Thebonding member 30b is an adhesive, a double-sided tape, an adhesive tape, or the like having a thermosetting property and an ultraviolet curing property. For example, the joiningmember 30b may be an optically elastic resin (a colorless and transparent ultraviolet-curing acrylic adhesive). The area of thecover 30 bonded to thepiezoelectric element 70 is spaced apart from the area of thecover 30 bonded to thedisplay screen 90 to prevent the display of thedisplay screen 90 from being interfered with by thepiezoelectric element 70. Of course, thecover 30 can also be coupled to thehousing 20 by thecoupling member 30b, so that compared with the case where thecover 30 is directly disposed on thehousing 20, the vibration of thevibration module 30a can be prevented from being directly transmitted to thehousing 20, thereby reducing the possibility that the user may drop theelectronic device 100 due to the excessive vibration amplitude of thehousing 20.
Thecover plate 30 may be light-transmissive, and the material of thecover plate 30 may be light-transmissive glass, resin, plastic, or the like. Thecover plate 30 is disposed on thechassis 20, thecover plate 30 includes aninner surface 32 combined with thechassis 20, and anouter surface 31 opposite to theinner surface 32, and the light emitted by the input/output module 10 sequentially passes through theinner surface 32 and theouter surface 31 and then passes through thecover plate 30. Thecover plate 30 covers the chassis light filling throughhole 24, the chassis approach throughhole 23, the chassis light sensing throughhole 2f, and the chassis vibration throughhole 2a, theinner surface 32 of thecover plate 30 is coated with theinfrared transmission ink 40, and theinfrared transmission ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area covered by theinfrared transmission ink 40 on theelectronic device 100 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas ofinner surface 32 that do not correspond to display 90.
Theinfrared transmission ink 40 can further shield at least one of the case access throughhole 23, the case access sensor throughhole 26, the case light supplement throughhole 24 and the case vibration throughhole 2a, that is, theinfrared transmission ink 40 can simultaneously cover the case access lamp throughhole 23, the case access sensor throughhole 26, the case light supplement throughhole 24 and the case vibration throughhole 2a, a user cannot easily see the internal structure of theelectronic device 100 through the case access lamp throughhole 23, the case access sensor throughhole 26, the case light supplement throughhole 24 and the case vibration throughhole 2a, and theelectronic device 100 is attractive in appearance; the ir pass-throughink 40 may also cover one or more of the chassis access through-hole 23, the chassis fill light through-hole 24, the chassis proximity sensor through-hole 26, or the chassis vibration through-hole 2a, while leaving one or more through-holes uncovered.
Referring to fig. 1, the structuredlight projector 80 is configured to emit structured light to the outside, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by theinfrared camera 62, and the processor of theelectronic device 100 further analyzes the structured light received by theinfrared camera 62 to obtain the depth information of the object to be measured.
The imaging module 60 comprises avisible light camera 61 and an infraredlight camera 62, and the centers of the input andoutput module 10, the infraredlight camera 62, thevisible light camera 61, thepiezoelectric element 70 and the structuredlight projector 80 are located on the same line segment. Specifically, the input/output module 10, the structuredlight projector 80, thepiezoelectric element 70, theinfrared camera 62 and thevisible light camera 61 are sequentially arranged from one end to the other end of the line segment, and at this time, thevisible light camera 61 and theinfrared camera 62 can form a double camera; or the input/output module 10, theinfrared camera 62, thepiezoelectric element 70, thevisible light camera 61 and the structuredlight projector 80 are arranged in sequence from one end to the other end of the line segment; or theinfrared camera 62, the input/output module 10, thepiezoelectric element 70, thevisible light camera 61 and the structuredlight projector 80 are arranged in sequence from one end to the other end of the line segment; or theinfrared camera 62, thevisible light camera 61, thepiezoelectric element 70, the input/output module 10 and the structuredlight projector 80 are sequentially arranged from one end to the other end of the line segment, and at the moment, thevisible light camera 61 and theinfrared camera 62 can form a double-camera. Of course, the arrangement of the input/output module 10, theinfrared camera 62, thepiezoelectric element 70, thevisible light camera 61, and the structuredlight projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.
Referring to fig. 9, the imaging module 60 includes avisible light camera 61 and aninfrared camera 62. The centers of the input-output module 10, theinfrared camera 62, thevisible light camera 61 and the structuredlight projector 80 are located on the same line segment, and thepiezoelectric element 70 is located between the line segment and the top 21 of thehousing 20. Specifically, the input/output module 10, the structuredlight projector 80, theinfrared camera 62 and thevisible light camera 61 are sequentially arranged from one end to the other end of the line segment; or the input/output module 10, theinfrared camera 62, thevisible light camera 61 and the structuredlight projector 80 are arranged from one end to the other end of the line segment in sequence; or theinfrared camera 62, the input andoutput module 10, thevisible light camera 61 and the structuredlight projector 80 are arranged in sequence from one end to the other end of the line segment; or theinfrared camera 62, thevisible light camera 61, the input/output module 10 and the structuredlight projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of the input/output module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 is not limited to the above example. In the embodiment of the present invention, the center of thepiezoelectric element 70 is not located on the line segment, so that the lateral space occupied by the electronic components (the input/output module 10, theinfrared camera 62, thevisible light camera 61, the structuredlight projector 80, etc.) on thecover plate 30 is saved.
In summary, in theelectronic device 100 according to the embodiment of the invention, the input/output module 10 integrates the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and theoptical sensor 1d into a single package structure, and integrates the infrared distance measurement function of emitting infrared light, the infrared light supplement function and the visible light intensity detection function, so that the input/output module 10 has a higher integration level and a smaller volume, and the input/output module 10 saves space for realizing the infrared light supplement, the infrared distance measurement and the visible light intensity detection functions. In addition, since the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and thelight sensor 1d are supported on thesame package substrate 111, compared with the conventional process that the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and thelight sensor 1d need to be manufactured by different wafers respectively and then packaged on a PCB substrate, the packaging efficiency is improved. Moreover, theelectronic device 100 adopts thepiezoelectric element 70 and thevibration module 30a to realize bone conduction sound transmission, and replaces the traditional receiver structure which conducts sound through air, so that on one hand, the privacy of the conversation content can be effectively ensured; on the other hand, the original telephone receiver is eliminated, so that a through hole corresponding to the telephone receiver is not formed in thecover plate 30, the process is simpler, the appearance is more attractive, and dust or moisture can be prevented from entering theelectronic device 100.
Referring to fig. 6 and 10, in some embodiments, the imaging module 60 includes avisible light camera 61 and aninfrared camera 62. Thecasing 20 is provided with a casing approach throughhole 23, a casing approach sensor throughhole 26, a casing light supplement throughhole 24, a casing light sensation throughhole 2f, and a casing vibration throughhole 2a, which are spaced from each other. The proximityinfrared lamp 13 corresponds to the case proximity throughhole 23, theproximity sensor 50 corresponds to the case proximity sensor throughhole 26, the infraredlight supplement lamp 12 corresponds to the case light supplement throughhole 24, and thelight sensor 1d corresponds to the case light sense throughhole 2 f. The number of thepiezoelectric elements 70 is plural, the number of the chassis vibration throughholes 2a is plural, the pluralpiezoelectric elements 70 correspond to the plural chassis vibration throughholes 2a, and eachpiezoelectric element 70 is accommodated in the corresponding chassis vibration throughhole 2 a. The centers of the input andoutput module 10, theinfrared camera 62, thevisible light camera 61, the plurality ofpiezoelectric elements 70 and the structuredlight projector 80 are located on the same line segment, and at least one of the input andoutput module 10, theinfrared camera 62, thevisible light camera 61 and the structuredlight projector 80 is arranged between two adjacentpiezoelectric elements 70. For example, the number of thepiezoelectric elements 70 is two, and thepiezoelectric elements 70, the input/output module 10, the structuredlight projector 80, theinfrared camera 62, thevisible light camera 61, and thepiezoelectric elements 70 are arranged in sequence from one end to the other end of the line segment; or thepiezoelectric element 70, the input/output module 10, theinfrared camera 62, thevisible light camera 61, thepiezoelectric element 70, the structuredlight projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of thepiezoelectric elements 70 is three, and thepiezoelectric elements 70, the input/output module 10, the structuredlight projector 80, thepiezoelectric elements 70, theinfrared camera 62, thevisible light camera 61, and thepiezoelectric elements 70 are arranged in this order from one end to the other end of the line segment; or thepiezoelectric element 70, the input/output module 10, thepiezoelectric element 70, theinfrared camera 62, thevisible light camera 61, thepiezoelectric element 70, the structuredlight projector 80, and the like are arranged in sequence from one end to the other end of the line segment. Of course, the number of thepiezoelectric elements 70 and the arrangement of thepiezoelectric elements 70, the input/output module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality ofpiezoelectric elements 70 are combined with thecover plate 30, and specifically, the plurality ofpiezoelectric elements 70 are respectively attached to thecover plate 30 by the joiningmembers 30 b. The processor of theelectronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to two ends of thepiezoelectric elements 70, and thepiezoelectric elements 70 are mechanically deformed, so that thepiezoelectric elements 70 drive thevibration module 30a to vibrate according to the frequency of the electrical signal from different positions combined with thecover plate 30. When the user's body is in contact with thevibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with thevibration module 30a (e.g., cartilage of the outer ear, teeth).
In the embodiment of the present invention, the plurality ofpiezoelectric elements 70 simultaneously drive thevibration module 30a to vibrate from a plurality of different positions combined with thecover plate 30, and the vibration of thevibration module 30a is uniform and has higher intensity, which is beneficial to stably transmitting the bone conduction sound to the auditory nerve of the user.
Referring to fig. 6-8, in some embodiments, the imaging module 60 includes avisible light camera 61 and aninfrared camera 62. Thecasing 20 is provided with a casing approach throughhole 23, a casing light supplement throughhole 24, a casing approach sensor throughhole 26, a casing light sensation throughhole 2f, and a casing vibration throughhole 2a, which are spaced from each other. The proximityinfrared lamp 13 corresponds to the case proximity throughhole 23, theproximity sensor 50 corresponds to the case proximity sensor throughhole 26, the infraredlight supplement lamp 12 corresponds to the case light supplement throughhole 24, and thelight sensor 1d corresponds to the case light sense throughhole 2 f. Thepiezoelectric element 70 includes apiezoelectric body 71 and a plurality ofpiezoelectric bumps 72 extending from thepiezoelectric body 71, the number of thepiezoelectric bumps 72 is plural, the number of the chassis vibration throughholes 2a is plural, the plurality ofpiezoelectric bumps 72 correspond to the plurality of chassis vibration throughholes 2a, and eachpiezoelectric bump 72 is partially received in the corresponding chassis vibration throughhole 2a and is coupled to thecover plate 30. The input/output module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 are located between thecover plate 30 and thepiezoelectric body 71. The centers of the input andoutput module 10, theinfrared camera 62, thevisible light camera 61, the plurality ofpiezoelectric bumps 72 and the structuredlight projector 80 are located on the same line segment, and at least one of the input andoutput module 10, theinfrared camera 62, thevisible light camera 61 and the structuredlight projector 80 is arranged between two adjacent piezoelectric bumps 72. For example, the number of thepiezoelectric bumps 72 is two, and thepiezoelectric bumps 72, the input/output module 10, the structuredlight projector 80, theinfrared camera 62, thevisible light camera 61, and thepiezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or thepiezoelectric bump 72, the input-output module 10, theinfrared camera 62, thevisible light camera 61, thepiezoelectric bump 72, the structuredlight projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of thepiezoelectric bumps 72 is three, and thepiezoelectric bumps 72, the input/output module 10, the structuredlight projector 80, the piezoelectric bumps 72, theinfrared camera 62, thevisible light camera 61, and thepiezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or thepiezoelectric bump 72, the input-output module 10, thepiezoelectric bump 72, theinfrared camera 62, thevisible light camera 61, thepiezoelectric bump 72, the structuredlight projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of thepiezoelectric bumps 72 is five, and thepiezoelectric bumps 72, the input/output module 10, the piezoelectric bumps 72, the structuredlight projector 80, the piezoelectric bumps 72, theinfrared camera 62, the piezoelectric bumps 72, thevisible light camera 61, and thepiezoelectric bumps 72 are arranged in sequence from one end of the line segment to the other end. Of course, the number of thepiezoelectric bumps 72 and the arrangement of thepiezoelectric bumps 72, the input/output module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality ofpiezoelectric bumps 72 are combined with thecap plate 30, and more specifically, the plurality ofpiezoelectric bumps 72 are respectively attached to thecap plate 30 by thebonding members 30 b. The processor of theelectronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to thepiezoelectric element 70, and thepiezoelectric element 70 including thepiezoelectric body 71 and the piezoelectric bumps 72 is mechanically deformed, so that thepiezoelectric bumps 72 drive thevibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with thecover plate 30. When the user's body is in contact with thevibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with thevibration module 30a (e.g., cartilage of the outer ear, teeth).
Thecasing 20 is provided with a casing vibration throughhole 2a, an input/output throughhole 25, a structured light throughhole 26, an infrared light through hole 27, and a visible light throughhole 28 which are spaced from each other. The case vibration throughhole 2a corresponds to thepiezoelectric bump 72, the input/output throughhole 25 corresponds to the input/output module 10, the structured light throughhole 26 corresponds to the structuredlight projector 80, the infrared light through hole 27 corresponds to the infraredlight camera 62, and the visible light throughhole 28 corresponds to thevisible light camera 61. The input/output throughhole 25 may be replaced by the enclosure approach throughhole 23, the enclosure light supplement throughhole 24, and the enclosure light sensing throughhole 2f, or the input/output throughhole 25 is formed by communicating the enclosure approach throughhole 23, the enclosure light supplement throughhole 24, and the enclosure light sensing throughhole 2 f. In addition, the structured light throughhole 26 corresponds to the structuredlight projector 80, that is, the structured light emitted by the structuredlight projector 80 can pass through the structured light throughhole 26, the infrared light through hole 27 corresponds to theinfrared camera 62, that is, theinfrared camera 62 can receive the infrared light reflected by the object from the infrared light through hole 27, and the visible light throughhole 28 corresponds to thevisible light camera 61, that is, thevisible light camera 61 can receive the visible light reflected by the object from the visible light throughhole 28.
In the embodiment of the present invention, the plurality ofpiezoelectric bumps 72 drive thevibration module 30a to vibrate from a plurality of different positions combined with thecover plate 30, and the vibration of thevibration module 30a is more uniform and stronger, which is beneficial to stably transmitting bone conduction sound to the auditory nerve of the user; in addition, the plurality ofpiezoelectric bumps 72 extend from the samepiezoelectric body 71, so that an electrical signal can be simultaneously applied to the plurality ofpiezoelectric bumps 72, and thevibration module 30a can be driven to vibrate synchronously from a plurality of different positions; furthermore, the input/output module 10, theinfrared camera 62, thevisible light camera 61, and the structuredlight projector 80 are located between thecover plate 30 and thepiezoelectric body 71, and thepiezoelectric bumps 72 are inserted, so that theelectronic device 100 has a small overall size and saves space.
Referring to fig. 3, in some embodiments, the input/output module 10 further includes a fill-in lamp lens 18, aproximity lamp lens 19, a proximity light sensor lens 1h, and a photo-sensing lens 1 e. The fill light lens 18 is disposed in thepackage housing 11 and corresponds to theinfrared fill light 12. Theproximity lamp lens 19 is provided inside thepackage case 11 and corresponds to the proximityinfrared lamp 13. The proximity light sensor lens 1h is provided inside thepackage case 11 and corresponds to theproximity sensor 50. The light sensor lens 1e is disposed in thepackage case 11 and corresponds to thelight sensor 1 d. The infrared light emitted by theinfrared fill light 12 is focused into thefill light window 1131 under the action of the fill light lens 18 to be emitted, so as to reduce the amount of light emitted to other areas of thepackage sidewall 112 and thepackage top 113. Similarly, when infrared light emitted from the proximityinfrared lamp 13 reflected by an object entering from theproximity sensor window 1134 is incident on the proximity sensor lens 1h, the proximity sensor lens 1h reduces the amount of light of the reflected infrared light transmitted to the outside of theproximity sensor 50. Similarly, the infrared light emitted from the proximityinfrared lamp 13 is focused by theproximity lamp lens 19 into theproximity window 1132 and emitted, reducing the amount of light emitted to other areas of thepackage sidewall 112 andpackage top 113. Similarly, when the visible light entering from thelight sensing window 1133 is incident on the light sensing lens 1e, the light sensing lens 1e converges the visible light on thelight sensor 1d, so as to reduce the amount of the visible light transmitted to the area outside thelight sensor 1 d. Specifically, the light supplement lamp lens 18, theproximity lamp lens 19, the proximity sensor lens 1h and the light sensing lens 1e may all be located on the same transparent substrate, and more specifically, the light supplement lamp lens 18, theproximity lamp lens 19, the proximity sensor lens 1h and the light sensing lens 1e may all be integrally formed with the transparent substrate. Of course, the input/output module 10 may be provided with only one or more of the light supplement lamp lens 18, theproximity lamp lens 19, the proximity sensor lens 1h, and the light sensing lens 1e, or may not be provided with the light supplement lamp lens 18, theproximity lamp lens 19, the proximity sensor lens 1h, and the light sensing lens 1 e.
Referring to fig. 3, in some embodiments, the input/output module 10 further includes a plurality of metal shielding plates 1a, the plurality of metal shielding plates 1a are all located in thepackage housing 11, and the plurality of metal shielding plates 1a are respectively located between any two of theinfrared fill light 12, the proximityinfrared light 13, theproximity sensor 50, and theoptical sensor 1 d. For example, when the centers of theinfrared fill light 12, the proximityinfrared light 13, theproximity sensor 50, and thelight sensor 1d are located on the same line segment, the number of the metal shielding plates 1a is three; if the infraredlight supplement lamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and thelight sensor 1d are sequentially arranged from one end to the other end of the line segment, the three metal shielding plates 1a are respectively positioned between the infraredlight supplement lamp 12 and the proximityinfrared lamp 13, between the proximityinfrared lamp 13 and theproximity sensor 50 and between theproximity sensor 50 and thelight sensor 1 d. Metal shielding plate 1a is located infraredlight filling lamp 12 and is close betweeninfrared lamp 13, metal shielding plate 1a can shield infraredlight filling lamp 12 and is closeinfrared lamp 13 electromagnetic interference each other on the one hand, infraredlight filling lamp 12 can not influence each other with the luminous intensity and the chronogenesis that are closeinfrared lamp 13, on the other hand metal shielding plate 1a can be used for isolated infraredlight filling lamp 12 place cavity and the cavity that is closeinfrared lamp 13 place, light can not get into another cavity from a cavity.
Referring to fig. 9, in some embodiments, the input/output module 10 further includes anoptical enclosure 1 b. Theoptical enclosure 1b is made of a light-transmissive material, and theoptical enclosure 1b is formed on thepackage substrate 111 and located inside thepackage case 11. Theoptical enclosure 1b encloses theinfrared fill light 12, the proximityinfrared light 13, theproximity sensor 50 and thelight sensor 1 d. Specifically,optics sealing cover 1b can form through encapsulating injection molding process, andoptics sealing cover 1b can adopt transparent thermosetting epoxy to make, in order that in use is difficult for softening, andoptics sealing cover 1b can fix infraredlight filling lamp 12, be closeinfrared lamp 13,proximity sensor 50 andlight sense ware 1d relative position between four, and make infraredlight filling lamp 12, be closeinfrared lamp 13,proximity sensor 50 andlight sense ware 1d difficult rocking inencapsulation casing 11.
In addition, referring to fig. 9, the input/output module 10 further includes a plurality of light-emittingpartition plates 1c, and the light-emittingpartition plates 1c are formed in theoptical enclosure 1b and located between theinfrared fill light 12, the proximityinfrared light 13, theproximity sensor 50, and theoptical sensor 1 d. When the centers of theinfrared fill light 12, the proximityinfrared light 13, theproximity sensor 50, and thelight sensor 1d are located on the same line segment, the number of the light-emittingpartition plates 1c is three. For example, if the infrared fill-inlamp 12, the proximityinfrared lamp 13, theproximity sensor 50 and theoptical sensor 1d are sequentially arranged from one end to the other end of the line segment, the three light-emittingpartition plates 1c are respectively located between the infrared fill-inlamp 12 and the proximityinfrared lamp 13, between the proximityinfrared lamp 13 and theproximity sensor 50, and between theproximity sensor 50 and theoptical sensor 1 d. Light-emittingpartition 1c can be used to infraredlight filling lamp 12 of interval and be closeinfrared lamp 13, and light that infraredlight filling lamp 12 sent can not wear out from beingclose lamp window 1132, and light that is closeinfrared lamp 13 and sends can not wear out fromlight filling window 1131. The light-emittingpartition board 1c can block infrared light initially emitted by the infraredlight supplement lamp 12 and the proximityinfrared lamp 13 from being incident on theproximity sensor 50 and thelight sensor 1d, and simultaneously block visible light entering from thelight sensor window 1133 and emitted to thelight sensor 1d from affecting the light emission of the infraredlight supplement lamp 12 and the proximityinfrared lamp 13 and infrared light reflected by theproximity sensor 50 from being received.
Referring to fig. 10 to 13, in some embodiments, thecover plate 30 may further have a cover plate light supplement throughhole 34, the cover plate light supplement throughhole 34 corresponds to the chassis light supplement throughhole 24, and the infrared light emitted by the infraredlight supplement lamp 12 passes through the chassis light supplement throughhole 24 and then passes through theelectronic device 100 from the cover plate light supplement throughhole 34. In this case, theinfrared transmitting ink 40 may be provided on thecover 30 at a position corresponding to the chassis approach throughhole 23, so that the user cannot easily see the approachinfrared lamp 13 inside theelectronic device 100 through the chassis approach throughhole 23, and theelectronic device 100 has a good appearance.
Referring to fig. 11, in some embodiments, thecover 30 may further include a cover approaching through hole 33, the cover approaching through hole 33 corresponds to the chassis approaching throughhole 23, and the infrared light emitted by the approachinginfrared lamp 13 passes through the chassis approaching throughhole 23 and then passes through the cover approaching through hole 33 to theelectronic device 100. At this time, theinfrared transmissive ink 40 may be disposed at a position on thecover plate 30 corresponding to the chassis light supplement throughhole 24, so that the user is difficult to see the infraredlight supplement lamp 12 inside theelectronic device 100 through the chassis light supplement throughhole 24, and theelectronic device 100 has a beautiful appearance.
In some embodiments, thecover 30 may further have a cover proximity sensor throughhole 37, the cover proximity sensor throughhole 37 corresponds to the chassis proximity sensor throughhole 26, and infrared light emitted by the proximityinfrared lamp 13 after being reflected by an object passes through the chassis proximity sensor throughhole 26 may be incident on theproximity sensor 50 from the cover proximity sensor throughhole 37. In this case, theinfrared transmissive ink 40 may be provided at a position of thecover 30 corresponding to the chassis proximity sensor throughhole 26, so that it is difficult for a user to see theproximity sensor 50 inside theelectronic device 100 through the chassis proximity sensor throughhole 26, and the appearance of theelectronic device 100 is beautiful.
Referring to fig. 13, in some embodiments, thecover plate 30 may further have a cover plate light sensing throughhole 36, the cover plate light sensing throughhole 36 corresponds to the case light sensing throughhole 2f and thelight sensor 1d, and visible light outside theelectronic device 100 may pass through the cover plate light sensing throughhole 36 and the case light sensing throughhole 2f and then be incident on thelight sensor 1 d. At this time, the infraredtransparent ink 40 may be disposed on thecover 30 at a position corresponding to the chassis approach throughhole 23, so that the user is difficult to see the approachinfrared lamp 13 inside theelectronic device 100 through the chassis approach throughhole 23; thecover plate 30 may also be provided with infraredtransparent ink 40 at a position corresponding to the casing light supplement throughhole 24, so that a user is difficult to see the infraredlight supplement lamp 12 inside theelectronic device 100 through the casing light supplement throughhole 24, and theelectronic device 100 has a beautiful appearance.
In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.
Claims (14)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433082.9ACN108012004B (en) | 2017-12-26 | 2017-12-26 | Electronic device |
| PCT/CN2018/118716WO2019128628A1 (en) | 2017-12-26 | 2018-11-30 | Output module, input and output module and electronic device |
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| CN201711433082.9ACN108012004B (en) | 2017-12-26 | 2017-12-26 | Electronic device |
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| CN108012004A CN108012004A (en) | 2018-05-08 |
| CN108012004Btrue CN108012004B (en) | 2020-05-08 |
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| WO2019128628A1 (en)* | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic device |
| CN108667968B (en)* | 2018-05-16 | 2020-06-02 | 维沃移动通信有限公司 | A display module and mobile terminal |
| CN108495014A (en)* | 2018-05-31 | 2018-09-04 | 维沃移动通信有限公司 | A camera module, mobile terminal and control method |
| CN112970239B (en)* | 2018-11-13 | 2022-06-14 | 华为技术有限公司 | Screen assembly and terminal equipment |
| CN111726431B (en)* | 2019-03-19 | 2022-06-03 | 北京小米移动软件有限公司 | Electronic device |
| CN110267181B (en)* | 2019-06-04 | 2021-01-01 | 武汉华星光电技术有限公司 | Cover plate and display device |
| CN110675837A (en)* | 2019-09-23 | 2020-01-10 | Oppo广东移动通信有限公司 | Display screen assembly and electronic equipment |
| CN113596223B (en)* | 2020-04-30 | 2024-06-11 | 维沃移动通信有限公司 | Electronic apparatus and control method thereof |
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| CN103515371B (en)* | 2012-06-27 | 2016-09-21 | 格科微电子（上海）有限公司 | Integrated-type optical sensor package |
| CN204145746U (en)* | 2014-07-29 | 2015-02-04 | 东莞劲胜精密组件股份有限公司 | A kind of electroacoustic sensing device and there is the mobile phone of this device |
| CN106550228B (en)* | 2015-09-16 | 2019-10-15 | 上海图檬信息科技有限公司 | The equipment for obtaining the depth map of three-dimensional scenic |
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