技术领域technical field
本发明涉及医疗器械技术领域，特别涉及一种植入物输送系统及其使用方法。The invention relates to the technical field of medical devices, in particular to an implant delivery system and a method for using the same.
背景技术Background technique
动脉瘤是由于疾病、损伤或先天等因素导致局部的薄弱，在长期血流的冲击下，该处动脉壁的薄弱点向外突出，逐渐扩张，形成圆形、椭圆形或棱形的囊状膨出。An aneurysm is a local weakness caused by disease, injury or congenital factors. Under the impact of long-term blood flow, the weak point of the arterial wall protrudes outwards and gradually expands to form a round, oval or prismatic sac bulging.
介入治疗颅内动脉瘤的方法很多，主要有在载瘤动脉上开展的血管重建密网支架术和动脉瘤腔内的栓塞术。而在动脉瘤腔内栓塞植入物(例如弹簧线圈)是目前治疗动脉瘤的主要方法。There are many methods for interventional treatment of intracranial aneurysms, mainly including vascular reconstruction on the parent artery with dense mesh stenting and embolization in the aneurysm cavity. Embolization of implants (such as spring coils) in the aneurysm cavity is currently the main method for treating aneurysms.
1991年Guglielmi等首次报道GDC栓塞治疗颅内动脉瘤。GDC远端的植入物材质为铂金，其与推送杆相连，微导管将植入物导入血管并输送到达迂曲复杂的脑动脉的动脉瘤病变部位，GDC电解脱植入物填塞动脉瘤瘤腔通过经皮血管穿刺，植入物与推送杆相连部分因电解而溶断，植入物解脱并留于动脉瘤瘤腔内，从而阻止血流流入动脉瘤。In 1991, Guglielmi et al first reported GDC embolization for the treatment of intracranial aneurysms. The implant at the distal end of the GDC is made of platinum, which is connected to the push rod. The microcatheter guides the implant into the blood vessel and transports it to the aneurysm lesion of the tortuous and complicated cerebral artery. The GDC electrolysis releases the implant to fill the aneurysm cavity Through percutaneous vascular puncture, the part of the implant connected to the push rod is dissolved by electrolysis, and the implant is released and remains in the aneurysm cavity, thereby preventing blood flow into the aneurysm.
请参考图1，其为现有的植入物与推送杆解脱的结构示意图。如图1所示，解脱器1’的正极与推送杆5’相连，解脱器1’的负极与导电针6’相连，由于植入物3’与推送杆5’之间的电解部件4’在离子溶液7’(如血液或其它体液)存在的情况下带电时易于被电解和分裂，当电解部件4’从微导管(图中未示出)远端离开并暴露于离子溶液中，且导电针6’插入患者皮肤的情况下，开启解脱器1’的电源，推送杆5’与导电针6’形成回路，电解部件4’由于电解而分裂，植入物3’解脱并留于动脉瘤内。Please refer to FIG. 1 , which is a schematic diagram of the structure of the existing implant released from the push rod. As shown in Figure 1, the positive pole of the releaser 1' is connected to the push rod 5', and the negative pole of the releaser 1' is connected to the conductive needle 6', because the electrolytic component 4' between the implant 3' and the push rod 5' When charged in the presence of an ionic solution 7' (such as blood or other body fluids), it is easily electrolyzed and disintegrated, when the electrolytic component 4' leaves the distal end of the microcatheter (not shown) and is exposed to the ionic solution, and When the conductive needle 6' is inserted into the patient's skin, turn on the power supply of the releaser 1', the push rod 5' and the conductive needle 6' form a loop, the electrolysis part 4' is split due to electrolysis, and the implant 3' is released and left in the artery Intratumoral.
但是，基于上述方法实现植入物与推送杆的解脱，导电针需要插入患者皮肤，给病人带来痛苦，用户体验效果差，此外，形成回路所需时间较长且不稳定，增加了医生手术的操作步骤和难度。However, based on the above method to release the implant and the push rod, the conductive needle needs to be inserted into the patient's skin, which brings pain to the patient and poor user experience. In addition, it takes a long time and is unstable to form the circuit, which increases the doctor's operation time. steps and difficulty.
发明内容Contents of the invention
本发明的目的在于提供一种植入物输送系统及其使用方法，以解决实现植入物与推送杆解脱，需将导电针插入患者皮肤，使推送杆与导电针构成回路，存在形成回路所需时间较长且不稳定，用户体验效果不佳，增加了手术操作难度的问题。The purpose of the present invention is to provide an implant delivery system and its use method, in order to solve the problem of releasing the implant from the push rod, it is necessary to insert the conductive needle into the patient's skin, so that the push rod and the conductive needle form a loop, and there is a need to form a loop. The time is long and unstable, and the user experience effect is not good, which increases the difficulty of surgical operation.
为解决上述技术问题，本发明提供一种植入物输送系统，所述植入物输送系统包括：解脱器、电解部件、推送杆、微导管和设置于所述微导管上的导电层，所述植入物、电解部件及推送杆依次连接并容置于所述微导管中，所述解脱器的一电极端与所述推送杆电连接，所述解脱器的另一电极端与所述导电层电连接。In order to solve the above technical problems, the present invention provides an implant delivery system, which includes: a releaser, an electrolytic component, a push rod, a microcatheter, and a conductive layer arranged on the microcatheter. Implants, electrolytic components and push rods are sequentially connected and accommodated in the microcatheter, one electrode end of the releaser is electrically connected to the push rod, and the other electrode end of the releaser is connected to the conductive layer electrical connection.
可选的，在所述的植入物输送系统中，所述导电层设置于所述微导管的外表面或内表面上。Optionally, in the implant delivery system, the conductive layer is disposed on the outer surface or the inner surface of the microcatheter.
可选的，在所述的植入物输送系统中，所述微导管包括至少两层管壁，所述导电层设置于所述至少两层管壁之间的夹层中，所述微导管的外表面或内表面上设置有暴露部分所述导电层的凹槽。Optionally, in the implant delivery system, the microcatheter includes at least two layers of tube walls, the conductive layer is arranged in the interlayer between the at least two layers of tube walls, and the microcatheter A groove exposing part of the conductive layer is provided on the outer surface or the inner surface.
可选的，在所述的植入物输送系统中，所述凹槽设置于所述微导管的远端。Optionally, in the implant delivery system, the groove is arranged at the distal end of the microcatheter.
可选的，在所述的植入物输送系统中，所述凹槽沿所述微导管的轴向长度为0.01mm～2mm。Optionally, in the implant delivery system, the axial length of the groove along the microcatheter is 0.01mm-2mm.
可选的，在所述的植入物输送系统中，所述凹槽中填充有导电的显影材料。Optionally, in the implant delivery system, the groove is filled with a conductive developing material.
可选的，在所述的植入物输送系统中，所述导电的显影材料为铂族金属、铼、钨、钽、金或银中的一种或几种的合金。Optionally, in the implant delivery system, the conductive imaging material is one or an alloy of platinum group metals, rhenium, tungsten, tantalum, gold or silver.
可选的，在所述的植入物输送系统中，所述导电层包含导电芯和包裹部分所述导电芯的绝缘材料。Optionally, in the implant delivery system, the conductive layer includes a conductive core and an insulating material wrapping part of the conductive core.
可选的，在所述的植入物输送系统中，所述导电芯为导电丝、导电管或导电网，所述导电管或导电网由导电丝缠绕或编制而成。Optionally, in the implant delivery system, the conductive core is a conductive wire, a conductive tube or a conductive mesh, and the conductive tube or conductive mesh is wound or braided by a conductive thread.
可选的，在所述的植入物输送系统中，所述导电芯的材质为不锈钢、钨、金或银中的一种或多种的合金。Optionally, in the implant delivery system, the material of the conductive core is an alloy of one or more of stainless steel, tungsten, gold or silver.
可选的，在所述的植入物输送系统中，所述植入物为弹簧线圈。Optionally, in the implant delivery system, the implant is a spring coil.
可选的，在所述的植入物输送系统中，所述推送杆的材质为304V不锈钢、316LVM不锈钢或镍钛合金。Optionally, in the implant delivery system, the push rod is made of 304V stainless steel, 316LVM stainless steel or nickel-titanium alloy.
本发明还提供一种植入物输送系统的使用方法，包括：The present invention also provides a method for using the implant delivery system, comprising:
将所述微导管的远端输送至预定位置，所述预定位置处于离子溶液中；delivering the distal end of the microcatheter to a predetermined location, the predetermined location being in an ionic solution;
控制所述推送杆推动所述电解部件和所述植入物穿过所述微导管，直至所述电解部件和所述植入物从所述微导管的远端穿出并暴露于所述离子溶液中；controlling the push rod to push the electrolytic component and the implant through the microcatheter until the electrolytic component and the implant pass through the distal end of the microcatheter and are exposed to the ion in solution;
启动所述解脱器，所述导电层与所述推送杆之间形成回路；Start the releaser, and form a loop between the conductive layer and the push rod;
所述电解部件在所述离子溶液中电解，使得所述植入物与所述推送杆解脱。The electrolytic component is electrolyzed in the ionic solution, so that the implant is released from the push rod.
可选的，在所述的植入物输送系统的使用方法中，所述解脱器的工作电流为0.5mA～4.0mA。Optionally, in the method of using the implant delivery system, the working current of the releaser is 0.5mA-4.0mA.
在本发明所提供的植入物输送系统及其使用方法中，所述植入物输送系统包括解脱器、电解部件、推送杆和微导管，以及设置于所述微导管上的导电层，所述微导管用于容置依次连接的植入物、电解部件及推送杆；所述解脱器的一电极端与所述推送杆电连接，所述解脱器的另一电极端与所述导电层电连接。通过在微导管上增设导电层作为植入物解脱所需的一个电极端，在微导管输送植入物的同时也将作为电极端的导电层输送至离子溶液中，当电解部件与离子溶液接触且解脱器通电时，导电层与推送杆之间构成回路，电解部件在离子溶液中电解，使得植入物与推送杆解脱。本发明避免采用导电针作为电极端对患者造成的伤害，减少手术病痛；而且构成回路耗时短且稳定，提高了植入物的解脱效率；同时不需要额外使用导电针，也使操作更简化。In the implant delivery system and its use method provided by the present invention, the implant delivery system includes a releaser, an electrolytic component, a push rod and a micro-catheter, and a conductive layer arranged on the micro-catheter, so The micro-catheter is used to accommodate implants, electrolytic components and push rods connected in sequence; one electrode end of the releaser is electrically connected to the push rod, and the other electrode end of the releaser is connected to the conductive layer electrical connection. By adding a conductive layer on the microcatheter as an electrode terminal required for implant release, the conductive layer as the electrode terminal is also delivered to the ionic solution while the microcatheter is transporting the implant. When the electrolytic component is in contact with the ionic solution And when the release device is energized, a loop is formed between the conductive layer and the push rod, and the electrolytic component is electrolyzed in the ionic solution, so that the implant and the push rod are released. The present invention avoids the harm caused to the patient by using the conductive needle as the electrode terminal, reduces the pain of the operation; and the time-consuming and stable circuit is formed, which improves the release efficiency of the implant; at the same time, no additional conductive needle is needed, and the operation is simplified .
附图说明Description of drawings
图1是现有的植入物与推送杆解脱的结构示意图；Fig. 1 is the structural schematic diagram of existing implant and push rod release;
图2是本发明实施例一中导电层为导电丝时植入物输送系统的结构示意图；2 is a schematic structural view of the implant delivery system when the conductive layer is a conductive wire in Embodiment 1 of the present invention;
图3是本发明实施例一中导电层为导电管时植入物输送系统的结构示意图；3 is a schematic structural view of the implant delivery system when the conductive layer is a conductive tube in Embodiment 1 of the present invention;
图4是本发明实施例一中导电层为导电网时植入物输送系统的结构示意图；4 is a schematic structural view of the implant delivery system when the conductive layer is a conductive mesh in Embodiment 1 of the present invention;
图5是本发明实施例一中植入物的一级线圈结构示意图；Fig. 5 is a schematic diagram of the primary coil structure of the implant in Embodiment 1 of the present invention;
图6是本发明实施例二中植入物输送系统的使用方法的流程图。Fig. 6 is a flow chart of the method of using the implant delivery system in the second embodiment of the present invention.
图1中：解脱器1’；植入物3’；电解部件4’；推送杆5’；导电针6’；离子溶液(例如血液)7’；Among Fig. 1: releaser 1'; Implant 3'; Electrolytic component 4'; Push rod 5'; Conductive needle 6'; Ionic solution (such as blood) 7';
图2-图6中：解脱器1；微导管2；导电层20；凹槽21；植入物3；弹簧线圈30；电解部件4；推送杆5。In Fig. 2-Fig. 6: releaser 1; microcatheter 2; conductive layer 20; groove 21; implant 3; spring coil 30;
具体实施方式Detailed ways
以下结合附图和具体实施例对本发明提出的植入物输送系统及其使用方法作进一步详细说明。根据下面说明和权利要求书，本发明的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。The implant delivery system and its usage method proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
实施例一Embodiment one
请参考图2-图4，其为关于本发明的植入物输送系统的结构示意图，如图2-图4所示，所述植入物输送系统包括：解脱器1、电解部件4、推送杆5和微导管2，所述植入物3、电解部件4及推送杆5依次连接并容置于所述微导管1中，所述植入物3输送系统还包括设置于所述微导管2上的导电层20，所述解脱器1的一电极端与所述推送杆5电连接，所述解脱器1的另一电极端与所述导电层20电连接。Please refer to FIG. 2-FIG. 4, which are structural schematic diagrams of the implant delivery system of the present invention. As shown in FIG. 2-FIG. The rod 5 and the microcatheter 2, the implant 3, the electrolytic component 4 and the push rod 5 are sequentially connected and accommodated in the microcatheter 1, and the delivery system of the implant 3 also includes 2, one electrode end of the releaser 1 is electrically connected to the push rod 5, and the other electrode end of the releaser 1 is electrically connected to the conductive layer 20.
本实施例中，如图2-图4所示，所述微导管2包括至少两层管壁，所述导电层20设置于所述至少两层管壁之间的夹层中，所述微导管2的外表面或内表面上设置有暴露部分所述导电层20的凹槽，以便解脱器1通电时，导电层20与离子溶液7’(请参考图1)接触传递电荷。优选的，所述凹槽设置于所述微导管2的远端。In this embodiment, as shown in FIGS. 2-4 , the microcatheter 2 includes at least two layers of pipe walls, and the conductive layer 20 is arranged in the interlayer between the at least two layers of pipe walls. The outer surface or the inner surface of 2 is provided with a groove that exposes part of the conductive layer 20, so that when the releaser 1 is energized, the conductive layer 20 contacts with the ionic solution 7' (please refer to FIG. 1 ) to transfer charges. Preferably, the groove is arranged at the distal end of the microcatheter 2 .
所述导电层20与微导管2的位置关系不局限于如图2-图4所示的导电层在所述微导管2的至少两层管壁之间的夹层中，还可以设置于所述微导管2的外表面或内表面上，其原理在于以微导管2作为承载导电层的载体，以便在微导管2输送植入物的同时也将导电层输送至离子溶液中，为植入物解脱提供一电极端。如此，避免手术过程中医生需要使用导电针插入患者皮肤，减轻病痛，提高了植入物的解脱效率。The positional relationship between the conductive layer 20 and the microcatheter 2 is not limited to the conductive layer shown in Figures 2-4 in the interlayer between at least two layers of the tube wall of the microcatheter 2, and can also be arranged in the On the outer surface or the inner surface of the microcatheter 2, the principle is to use the microcatheter 2 as a carrier for carrying the conductive layer, so that the conductive layer is also transported into the ionic solution when the microcatheter 2 transports the implant. Liberation provides an electrode terminal. In this way, it is avoided that the doctor needs to use the conductive needle to insert the patient's skin during the operation, which reduces the pain and improves the release efficiency of the implant.
本实施例中，以所述微导管具有两层管壁，导电层在所述微导管的两层管壁之间的夹层中为例做详细的阐述。具体的，为了满足植入物输送系统植入过程显影的需求，所述微导管的外表面的远端设置有显影环或显影点；优选的，为同时满足显影的需求以及对于凹槽暴露导电层以构成电极端的需求，所述凹槽设置于所述微导管的外表面的远端，所述显影环或显影点通过在凹槽中填充有导电的显影材料形成，所述显影材料选择导电材料，例如铂族金属、铼、钨、钽、金或银中的一种或几种的合金。其中，凹槽沿微导管的轴向长度为0.01mm～2mm，更优选为1mm。In this embodiment, the microcatheter has two walls and the conductive layer is in the interlayer between the two walls of the microcatheter as an example for detailed elaboration. Specifically, in order to meet the needs of imaging during the implantation process of the implant delivery system, the distal end of the outer surface of the microcatheter is provided with a development ring or a development point; layer to form the electrode end, the groove is arranged at the distal end of the outer surface of the micro-catheter, the developing ring or developing point is formed by filling the groove with a conductive developing material, and the developing material is selected Conductive materials, such as one or more alloys of platinum group metals, rhenium, tungsten, tantalum, gold or silver. Wherein, the axial length of the groove along the microcatheter is 0.01mm-2mm, more preferably 1mm.
本实施例中，所述导电层包含导电芯和包裹部分导电芯的绝缘材料。其中，所述导电芯可以为导电丝(如图2所示)、由导电丝缠绕而成的导电管(如图3所示)或导电丝编织而成的导电网(如图4所示)，所述导电芯的材质为不锈钢、钨、金或银中的一种或多种的合金。In this embodiment, the conductive layer includes a conductive core and an insulating material wrapping part of the conductive core. Wherein, the conductive core can be a conductive thread (as shown in Figure 2), a conductive tube (as shown in Figure 3) wound by a conductive thread, or a conductive mesh (as shown in Figure 4) woven by a conductive thread , The material of the conductive core is an alloy of one or more of stainless steel, tungsten, gold or silver.
本实施例中，所述电解部件可以电解分离，以实现植入物与推送杆的解脱，所述植入物通过绝缘的高分子胶与电解部件连接，典型的高分子胶如：UV胶，环氧胶。其中，电解部件上预留电解分离区域，所述电解分离区域的长度为0.01mm～1mm，优选为0.02mm～0.4mm，更为优选的是0.05mm～0.1mm。所述推送杆由外径尺寸为0.008英寸～0.016英寸的丝链制成，更为优选的是0.010英寸～0.014英寸的丝链制成。所述推送杆的材质为304V不锈钢、316LVM不锈钢或者镍钛合金，优选为304V不锈钢。推送杆的表面覆盖有绝缘材料，例如聚四氟乙烯(PTFE)、聚对苯二甲酸乙二醇酯(PET)、聚醚酰胺(PEBAX)和聚酰亚胺(Polyimide)，优选为聚四氟乙烯(PTFE)。In this embodiment, the electrolytic component can be electrolytically separated to realize the release of the implant from the push rod, and the implant is connected to the electrolytic component through an insulating polymer glue, a typical polymer glue such as: UV glue, Epoxy glue. Wherein, an electrolytic separation area is reserved on the electrolytic component, and the length of the electrolytic separation area is 0.01 mm to 1 mm, preferably 0.02 mm to 0.4 mm, more preferably 0.05 mm to 0.1 mm. The push rod is made of a wire chain with an outer diameter of 0.008 inches to 0.016 inches, more preferably a wire chain of 0.010 inches to 0.014 inches. The material of the push rod is 304V stainless steel, 316LVM stainless steel or nickel-titanium alloy, preferably 304V stainless steel. The surface of the push rod is covered with an insulating material such as polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyetheramide (PEBAX) and polyimide (Polyimide), preferably polytetrafluoroethylene Vinyl fluoride (PTFE).
在一个优选实施例中，将外径尺寸为0.012英寸，材料为304V不锈钢，外表面覆盖有绝缘材料为聚四氟乙烯(PTFE)的推送杆，通过电解部件与植入物相连结，其中，电解部件上预留的电解分离区域的长度为0.1mm。In a preferred embodiment, the outer diameter is 0.012 inches, the material is 304V stainless steel, and the outer surface is covered with an insulating material of polytetrafluoroethylene (PTFE), the push rod is connected to the implant through electrolytic components, wherein, The length of the electrolytic separation area reserved on the electrolytic component is 0.1 mm.
在另一优选实施例中，将外径尺寸为0.010英寸，材料为304V不锈钢，外表面覆盖绝缘材料为聚四氟乙烯(PTFE)的推送杆，通过电解部件与植入物相连结，其中，电解部件上预留电解分离区域的长度为0.06mm。In another preferred embodiment, a push rod with an outer diameter of 0.010 inches, a material of 304V stainless steel, and an outer surface covered with an insulating material of polytetrafluoroethylene (PTFE) is connected to the implant through an electrolytic component, wherein, The length of the electrolytic separation area reserved on the electrolytic component is 0.06mm.
本实施例中，所述植入物为弹簧线圈30。为了使得植入物在便于输送植入的同时还满足栓塞不同尺寸的动脉瘤的需求，这里将一级线圈在模具上定型处理制成弹簧线圈30，所述弹簧线圈30还可以包括多个依次首尾顺次连接的子线圈。其中，所述弹簧线圈30的原始形貌(自然状态下的形貌)为一级线圈经定型处理后的形状，所述一级线圈的结构可参考图5，一级线圈与弹簧线圈30的区别在于一级线圈原始的形貌为杆状，而弹簧线圈30是由一级线圈经过定型处理后形成的形状，通常弹簧线圈30的原始形貌为“团状”，在弹簧线圈30脱离推送杆后自动恢复原始形貌。In this embodiment, the implant is a spring coil 30 . In order to make the implant convenient for delivery and implantation while meeting the needs of embolizing aneurysms of different sizes, here the primary coil is molded on a mold to form a spring coil 30, which may also include a plurality of coils in sequence. Subcoils connected end to end. Wherein, the original shape of the spring coil 30 (the shape in the natural state) is the shape of the primary coil after the finalization process, and the structure of the primary coil can refer to FIG. 5, the primary coil and the spring coil 30 The difference is that the original shape of the primary coil is rod-shaped, while the spring coil 30 is a shape formed after the primary coil has been shaped. Usually, the original shape of the spring coil 30 is "globose". Automatically restore the original shape after the rod.
实施例二Embodiment two
相应的，本实施例还提供了一种植入物输送系统的使用方法。下面参考图6及图1-4详细说明本实施例所述植入物输送系统的使用方法。Correspondingly, this embodiment also provides a method for using the implant delivery system. The method of using the implant delivery system in this embodiment will be described in detail below with reference to FIG. 6 and FIGS. 1-4 .
首先，执行步骤S1，将所述微导管2的远端输送至预定位置(例如动脉瘤病变位置)，所述预定位置处于离子溶液7’(例如血液或其他体液)中。Firstly, step S1 is performed to transport the distal end of the microcatheter 2 to a predetermined location (such as an aneurysm lesion location), and the predetermined location is in an ionic solution 7' (such as blood or other body fluids).
接着，执行步骤S2，控制所述推送杆5推动所述电解部件4和所述植入物3穿过所述微导管2，直至所述电解部件4和所述植入物3从所述微导管2的远端穿出并暴露于所述离子溶液7’中。Next, step S2 is executed, controlling the push rod 5 to push the electrolytic component 4 and the implant 3 through the microcatheter 2 until the electrolytic component 4 and the implant 3 pass through the microcatheter 2 The distal end of the catheter 2 passes out and is exposed to the ionic solution 7'.
接着，执行步骤S3，启动所述解脱器1，所述导电层20与所述推送杆5之间形成回路。Next, step S3 is executed to start the releaser 1 , and a loop is formed between the conductive layer 20 and the push rod 5 .
接着，执行步骤S4，所述电解部件4在所述离子溶液7’中电解，使得所述植入物3与所述推送杆5解脱。Next, step S4 is executed, the electrolysis component 4 is electrolyzed in the ionic solution 7', so that the implant 3 is released from the push rod 5.
启动解脱器的过程即通电的过程，微导管上的导电层与推送杆之间形成回路，电解部件暴露于离子溶液7’(如血液或其它体液)中的部分被电解和分裂，实现植入物与推送杆解脱，植入物填充动脉瘤的瘤腔。所述解脱器的工作电流为0.5mA～4.0mA，优选为1.0mA～2.0mA。The process of starting the release device is the process of energizing. A loop is formed between the conductive layer on the microcatheter and the push rod, and the part of the electrolytic component exposed to the ionic solution 7' (such as blood or other body fluids) is electrolyzed and split to achieve implantation. The implant is released from the push rod, and the implant fills the cavity of the aneurysm. The operating current of the releaser is 0.5mA-4.0mA, preferably 1.0mA-2.0mA.
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other.
综上，在本发明所提供的植入物输送系统及其使用方法中，所述植入物输送系统包括解脱器、电解部件、推送杆和微导管，以及设置于所述微导管上的导电层，所述微导管用于容置依次连接的植入物、电解部件及推送杆；所述解脱器的一电极端与所述推送杆电连接，所述解脱器的另一电极端与所述导电层电连接。通过在微导管上增设导电层作为植入物解脱所需的一个电极端，在微导管输送植入物的同时也将作为电极端的导电层输送至离子溶液中，当电解部件与离子溶液接触且解脱器通电时，导电层与推送杆之间构成回路，电解部件在离子溶液中电解，使得植入物与推送杆解脱。本发明避免采用导电针作为电极端对患者造成的伤害，减少手术病痛；而且构成回路耗时短且稳定，提高了植入物的解脱效率；同时不需要额外使用导电针，也使操作更简化。To sum up, in the implant delivery system and its use method provided by the present invention, the implant delivery system includes a releaser, an electrolytic component, a push rod and a microcatheter, and a conductive Layer, the micro-catheter is used to accommodate implants, electrolytic components and push rods connected in sequence; one electrode end of the release device is electrically connected to the push rod, and the other electrode end of the release device is connected to the push rod. The conductive layer is electrically connected. By adding a conductive layer on the microcatheter as an electrode terminal required for implant release, the conductive layer as the electrode terminal is also delivered to the ionic solution while the microcatheter is transporting the implant. When the electrolytic component is in contact with the ionic solution And when the release device is energized, a loop is formed between the conductive layer and the push rod, and the electrolytic component is electrolyzed in the ionic solution, so that the implant and the push rod are released. The present invention avoids the harm caused to the patient by using the conductive needle as the electrode terminal, reduces the pain of the operation; and the time-consuming and stable circuit is formed, which improves the release efficiency of the implant; at the same time, no additional conductive needle is needed, and the operation is simplified .
上述描述仅是对本发明较佳实施例的描述，并非对本发明范围的任何限定，本发明领域的普通技术人员根据上述揭示内容做的任何变更、修饰，均属于权利要求书的保护范围。The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention. Any changes and modifications made by those of ordinary skill in the field of the present invention based on the above disclosures shall fall within the protection scope of the claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610916700.4ACN107961053A (en) | 2016-10-20 | 2016-10-20 | Implant transport system and its application method |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610916700.4ACN107961053A (en) | 2016-10-20 | 2016-10-20 | Implant transport system and its application method |
| Publication Number | Publication Date |
|---|---|
| CN107961053Atrue CN107961053A (en) | 2018-04-27 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610916700.4APendingCN107961053A (en) | 2016-10-20 | 2016-10-20 | Implant transport system and its application method |
| Country | Link |
|---|---|
| CN (1) | CN107961053A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113749718A (en)* | 2020-06-05 | 2021-12-07 | 微创神通医疗科技（上海）有限公司 | Release device, release system, release method, and treatment device |
| CN114246711A (en)* | 2021-12-02 | 2022-03-29 | 微创神通医疗科技（上海）有限公司 | Push rod, releasing device and medical device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6059779A (en)* | 1995-04-28 | 2000-05-09 | Target Therapeutics, Inc. | Delivery catheter for electrolytically detachable implant |
| US6077260A (en)* | 1998-02-19 | 2000-06-20 | Target Therapeutics, Inc. | Assembly containing an electrolytically severable joint for endovascular embolic devices |
| CN206355094U (en)* | 2016-10-20 | 2017-07-28 | 微创神通医疗科技（上海）有限公司 | Implant induction system |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6059779A (en)* | 1995-04-28 | 2000-05-09 | Target Therapeutics, Inc. | Delivery catheter for electrolytically detachable implant |
| US6077260A (en)* | 1998-02-19 | 2000-06-20 | Target Therapeutics, Inc. | Assembly containing an electrolytically severable joint for endovascular embolic devices |
| CN206355094U (en)* | 2016-10-20 | 2017-07-28 | 微创神通医疗科技（上海）有限公司 | Implant induction system |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113749718A (en)* | 2020-06-05 | 2021-12-07 | 微创神通医疗科技（上海）有限公司 | Release device, release system, release method, and treatment device |
| WO2021244670A1 (en)* | 2020-06-05 | 2021-12-09 | 微创神通医疗科技（上海）有限公司 | Release apparatus, release system, release method, and treatment apparatus |
| CN113749718B (en)* | 2020-06-05 | 2024-01-26 | 微创神通医疗科技（上海）有限公司 | Release device, release system, release method and treatment device |
| CN114246711A (en)* | 2021-12-02 | 2022-03-29 | 微创神通医疗科技（上海）有限公司 | Push rod, releasing device and medical device |
| WO2023098380A1 (en)* | 2021-12-02 | 2023-06-08 | 微创神通医疗科技（上海）有限公司 | Push rod, release device and medical device |
| Publication | Publication Date | Title |
|---|---|---|
| US8221483B2 (en) | Medical implant detachment systems and methods | |
| EP3092957A1 (en) | Electrolytic detachment with flush system for implant delivery | |
| CN206355094U (en) | Implant induction system | |
| US20120209310A1 (en) | Vaso-occlusive device delivery system | |
| CN211460357U (en) | Conveying and releasing system for embolic coil | |
| US20210052277A1 (en) | Electrolytic and mechanical detachment for implant delivery systems | |
| EP2984996B1 (en) | Electrolytic detachment elements for implant delivery systems | |
| US9855050B2 (en) | Vasculature occlusion device detachment system with tapered corewire and single loop fuse detachment | |
| EP3474755B1 (en) | Electrolytic detachment for implantable devices | |
| US10639043B2 (en) | Vasculature occlusion device detachment system with tapered corewire and heater activated fiber detachment | |
| CN108697425A (en) | Vascular implantation system and process with flexible Disengagement zone | |
| JP2022511996A (en) | Electrolytic separation mechanism and electrical separation device | |
| CN112274206B (en) | Conveying system of turbulent flow device | |
| CN107961053A (en) | Implant transport system and its application method | |
| CN106725697B (en) | Multi-point electrolytic stripping system for stripping embolic material | |
| CN113116444B (en) | Embolization system | |
| US20250268602A1 (en) | Vaso-occlusive electrolytic detachment detection | |
| AU2015227527A1 (en) | A vasculature occlusion device detachment system with tapered corewire and heater activated fiber detachment | |
| WO2025049211A1 (en) | Electrolytic vaso-occlusive device with improved deliverability and enhanced mri follow-up |
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | Application publication date:20180427 | |
| RJ01 | Rejection of invention patent application after publication |