The content of the invention
In view of this, in order to solve signal interference and increase communication quality, the invention provides a kind of WLANCommunicator and its method.
To achieve the above object, one embodiment of the present invention uses following technical scheme：A kind of WLANCommunicator, comprising：One first antenna；And a wireless transceiver, the first antenna is coupled to, to produce a non-efficient energyPackage and a high-effect package；Wherein, the non-efficient energy package includes one first Legacy white silk section (L-STF), one firstThe long training section (L-LTF) of tradition, one first traditional signaling message section (L-SIG), one first data segment (DATA)；The non-efficientEnergy package does not repeat the first traditional signaling message section；The high-effect package includes one second Legacy and practices section (L-STF), oneThe long training section (L-LTF) of second tradition, one second traditional signaling message section (L-SIG), the second traditional signaling message area repeatedSection (RL-SIG), a high-effect signaling section (HE-SIG-A), a high-effect Short Training section (HE-STF), a high-effect long instructionPractice section (HE-LTF), one second data segment (DATA)；And the wireless transceiver includes an inductance, and the inductance is arranged atIn one chip.
It is real of the invention one for the usable floor area of chip, and the path of increase chip external connection can be being reducedApply in example, wireless transceiver is to use brilliant encapsulation technology.
For the electromagnetic interference between inductance and arrays of solder balls can be greatly decreased, increase the quality in inductance use, at thisIn one embodiment of invention, do not covered in the vertical direction of inductance by arrays of solder balls.
For the density of arrays of solder balls can be avoided too high, interfere, in an embodiment of the present invention, arrays of solder balls is madeArea is designed at least above the chip 50%.
For that can obtain higher quality inductance, in an embodiment of the present invention, inductance is designed to 8 font inductance.
For that can solve the problems, such as that in LAN network is jammed and is capable of compatible each different communication abilityUser, in one embodiment of this invention, non-efficient energy package are respectively sent to not with high-effect package by different antennaeWith in frequency range simultaneously so that different frequency range is used.
It is in one embodiment of this invention, described high-effect for more data volumes can be sent in same packagePackage is also directly connected in after second data segments comprising a package extension of section.
Use for the resource of frequency spectrum can be increased and reach while send the environment occasion of different modulation schemes, in this hairIn a bright embodiment, there is provided a kind of mechanism of double modulations, the non-efficient energy package is using OFDM(OFDM) modulation scheme and the high-effect package using OFDM (OFDMA) modulation scheme.
On the other hand, to achieve the above object, another embodiment of the present invention uses following technical scheme：It is a kind of wirelessLocal area network communication device, comprising：One first antenna；And
One wireless transceiver, the first antenna is coupled to, to produce an at least package；Wherein, the package includes one and passedWhat system Short Training section (L-STF), the long training section (L-LTF) of a tradition, a traditional signaling message section (L-SIG), one repeated is somebody's turn to doTraditional signaling message section (RL-SIG), a high-effect signaling section (HE-SIG-A), a high-effect Short Training section (HE-STF), oneHigh-effect long training section (HE-LTF) and a data segments (DATA)；And wherein, the wireless transceiver includes an inductance,And the inductance is arranged in a chip；One first side of the chip includes a plurality of soldered balls (Solder Ball) array, the chipOne second side be a substrate (Substrate).
Other advantages of the present invention and it is to be solved the problem of will be carried out in more detail by the following description and schemaExplain.
Embodiment
Illustrate embodiments of the invention below in conjunction with correlative type.In the drawings, identical label represent it is identical orSimilar component or method flow.
Fig. 1 is the schematic diagram of the embodiment of WLAN communication device 100 1 of the present invention.WLAN communication fillsPut 100 to use as an AP in the present embodiment, it includes a first antenna 101, one second antenna 102 and a wireless receiving and dispatchingDevice 103.The antenna 102 of first antenna 101 and second is used for sending package caused by wireless transceiver 103 to the first website STA1With the second website STA2, and package transmitted by the first website STA1 and the second website STA2 is received to wireless transceiver 103.
WLAN communication device 100 in order to support the transmission of multiple websites (STA1, STA2) and must coordinateThe communication capacity of each website, wireless transceiver 103 at least possess the ability for producing at least two different type packages, below willIt is described further.
According to one embodiment of the invention, it is assumed that the first website STA1 communication capacity only reaches to 802.11a/b/g/n/acAbility, and the second website STA2 communication capacity then reaches 802.11ax communication capacity, then the first website STA1 will be usedNon-efficient energy package 110 is by the antenna 102 of first antenna 101 and/or second and the sending and receiving data of wireless transceiver 103, and secondSite STA 2 is then to be received using high-effect package 120 by the antenna 102 of first antenna 101 and/or second with wireless transceiver 103Send data.
According to an embodiment, non-efficient energy package 110 and high-effect package 120 can be respectively by first antennas 101 and secondAntenna 102 is sent to different frequency range, such as；First antenna 101 sends non-efficient energy package 110 to 2.4G frequency ranges, and secondAntenna 102 sends high-effect package 120 to 5G frequency ranges, consequently, it is possible to may be such that different frequency range while used, increase is overallEfficiency.
To enable WLAN communication device 100 smoothly to send non-efficient package 110 or high-effect package 120,Wireless transceiver 103 is realized by a chip, and an inductance 104 is included in the wireless transceiver 103, is met with producingThe oscillator signal of telecommunications metrics.
In addition, although WLAN communication device 100 is illustrated using multiple antennas as embodiment, the present invention not withThis is limited, and WLAN communication device 100 also can send the package of non-efficient energy package 110 or high-effect using single antenna120。
Fig. 2 is the schematic diagram of each section (field) in non-efficient energy package 110.Non-efficient energy package 110 existsPractice section (Legacy Short Training Field, L-STF), tradition length comprising Legacy under 802.11a/g patternTrain section (Legacy Long Training Field, L-LTF), traditional signaling message section (Legacy Signal Field,L-SIG), data segments (DATA).Non-efficient energy package 110, compared to 802.11a/g, also includes under 802.11n patternHigh-throughput signaling section (High Throughput Signal Field, HT-SIG), high-throughput Short Training section (HighThroughput Short Training Field, HT-STF) and high-throughput length training section (High ThroughputLong Training Field, HT-LTF).Non-efficient energy package 110 is under 802.11ac pattern, compared to 802.11a/G, also comprising extra-high handling capacity signaling A sections (Very High Throughput Signal A Field, VHT-SIG-A), spyHigh-throughput Short Training section (Very High Throughput Short Training Field, VHT-STF), extra-high gulp downThe amount of telling length training section (Very High Throughput Long Training Field, VHT-LTF) and extra-high handle upMeasure signaling B sections (Very High Throughput Signal B Field, VHT-SIG-B).
Fig. 3 (A), 3 (B) are the schematic diagram of each section (field) in high-effect package 120.Fig. 3 (A) is high-effect envelope(the High Efficiency-Single User-Presentation Protocol under the pattern of sole user of bag 120Data Unit HE-SU-PPDU) form, include Legacy and practice section (Legacy Short Training Field, L-STF), the long training section (Legacy Long Training Field, L-LTF) of tradition, traditional signaling message section (LegacySignal Field, L-SIG), repeat traditional signaling message section (Repeated Legacy Signal Field, RL-SIG),High-effect signaling A sections (High Efficiency Signal A Field, HE-SIG-A), high-effect Short Training section(High EfficiencyShort Training Field, HE-STF), high-effect long training section (High EfficiencyLong Training Field, HE-LTF), data segments (DATA) and package extension of section (Packet Extension,PE)。
Fig. 3 (B) is high-effect package 120 (High Efficiency-Multi User- under the pattern of multi-userPresentation Protocol Data Unit HE-MU-PPDU) form, include Legacy and practice section (LegacyShort Training Field, L-STF), the long training section (Legacy Long Training Field, L-LTF) of tradition,Traditional signaling message section (Legacy Signal Field, L-SIG), traditional signaling message section (the Repeated Legacy repeatedSignal Field, RL-SIG), high-effect signaling A sections (High Efficiency Signal A Field, HE-SIG-A), high-effect signaling B sections (High Efficiency Signal B Field, HE-SIG-B), high-effect Short Training section(High Efficiency Short Training Field, HE-STF), high-effect long training section (HighEfficiency Long Training Field, HE-LTF), data segments (DATA) and package extension of section (PacketExtension, PE).
Please refer to Fig. 2 and Fig. 3 (A), 3 (B), it can clearly show that, non-efficient energy package 110 and high-effect package120 one of difference is that traditional signaling message section (L-SIG) is repeated once and is directly connected at by high-effect package 120Afterwards, that is, the traditional signaling message section (RL-SIG) repeated is directly connected at after traditional signaling message section (L-SIG)；It is rather than high-effectPackage 110 is not repeat traditional signaling message section (L-SIG).
Non-efficient energy package 110 and high-effect package 120 another difference is that high-effect package 120 in data segments(DATA) continue a package extension of section (PE) after；Rather than high-effect package 110 is not include package extension of section (PE).SoOne, high-effect package 120 can send more data quantities in same package.
In addition, use to increase the resource of frequency spectrum and reach while send the environment occasion of different modulation schemes,One embodiment of invention provides non-efficient energy package 110 and uses OFDM (Orthogonal frequency-Division multiplexing, OFDM) mode send, and high-effect package 120 then uses OFDMThe mode of (Orthogonal Frequency Division Multiple Access, OFDMA) is sent.
To avoid repeating, Fig. 2 only illustrates non-efficient energy package 110 respectively with Fig. 3 (A), 3 (B) can with high-effect package 120Several sending modes of energy, the present invention are not limited merely to sending mode shown in icon.
Fig. 4 is the profile of the embodiment of wireless transceiver 103 1.Comprising chip 400 one by one in wireless transceiver 103, andUsing brilliant encapsulation (Flip-Chip) technology.By icon, it will be clearly understood that, one first side of the chip 400 includes a plurality of welderingsBall (Solder Ball) array 401, and one second side of the chip 400 is a substrate (Substrate) 402, wherein inductance104 are arranged between arrays of solder balls 401 and substrate 402, i.e., in insulating barrier 403.It is using one of brilliant the advantages of encapsulatingReduce the usable floor area of chip 400, and the path of the increase external connection of chip 400.
Fig. 5 is the top view of the embodiment of wireless transceiver 103 1.Chip 400 in wireless transceiver 103, its first sideOn a plurality of arrays of solder balls 401 cover the chip one first part area A (grey parts), do not cover the chip one secondPart area B (white portion), and inductance 104 is arranged under the second part area B.A plurality of welderings designed by the present embodimentThe not substantive overlying lid whole chip 400 of ball array 401, and the vertically oriented portion of inductance 104 is avoided, the design can significantly subtractFew electromagnetic interference between inductance 104 and arrays of solder balls 401, increase inductance 104 use upper quality.In addition, the area of inductance 104Design it is also unsuitable excessive, avoid the density of arrays of solder balls 401 too high, i.e., first part area A is too small, and causes arrays of solder ballsInterference problem on 401 between signal.Therefore in one embodiment, first part area used in arrays of solder balls 401 be byDesign is at least above the chip 50%.Note, in arrays of solder balls 401, the interval D between soldered ball and soldered ball also belongs to firstPart area A, rather than the second part area B.
Fig. 6 is an embodiment schematic diagram of inductor design.In order to obtain higher quality inductance, one embodiment of the inventionUsing 8 font inductance 600.8 font inductance present two circulations, i.e. first circulation 602 and second circulation 604, and firstCirculation 602 differs with the sense of current in second circulation 604.When the sense of current of first circulation 602 is wink clockwise,It is then counterclockwise that the sense of current of second circulation 604, which is,.The advantages of 8 font inductance, is structural symmetry height, can reduceInterference, is more suitable for the design of high-frequency circuit.
Fig. 7 is another embodiment schematic diagram of WLAN communication device of the present invention.WLAN of the present inventionCommunicator is also can serve as STA uses, as WLAN leads in Fig. 7 in addition to being used as shown in Figure 1 as an APShown in T unit 700.There may be products application quite not of the same race as the WLAN communication device 700 that STA is used,Such as：TV, pen electricity, mobile phone, flat board, network camera, set top box ... wait different end products, Fig. 7 only with mobile phone asOne pictorial representation.
WLAN communication device 700 as shown in Figure 7, its internal at least antenna 701 and one that includes wirelessly are receivedDevice 703 is sent out, and the wireless transceiver 703 is coupled to the antenna 701.In the present embodiment, wireless transceiver 703 can produce non-High-effect package 110 or high-effect package 120 are simultaneously transmitted it out by antenna 701.
To enable WLAN communication device 700 smoothly to send non-efficient package 110 or high-effect package 120,Wireless transceiver 703 is realized by a chip, and an inductance 704 is included in the wireless transceiver 703, is met with producingThe oscillator signal of telecommunications metrics.
The chip 400 that the chip and inductor design of wireless transceiver 703 refer to Fig. 4 to Fig. 6 illustrates, does not repeat to go to live in the household of one's in-laws on getting married hereinState.In addition, WLAN communication device 700 also can be by multiple antennas by the package 120 of non-efficient energy package 110 or high-effectSend, the invention is not limited in the application of single antenna.
In summary, the present invention provides a kind of inductor design mode for supporting high-effect package transmission, except using chipIt is further to use the spy such as brilliant encapsulation, the section layout of arrays of solder balls and/or 8 font inductance outside the solution of inductanceDifferent designing technique, to solve signal interference problem in following crowded network environment, increase the quality of communication.
Presently preferred embodiments of the present invention is these are only, all equivalent changes and modifications done according to claims of the present invention, all shouldBelong to the covering scope of the present invention.