CN107870225B - Flexible three-dimensional packaging gas sensor - Google Patents
Flexible three-dimensional packaging gas sensorDownload PDFInfo
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- CN107870225B CN107870225BCN201711079776.7ACN201711079776ACN107870225BCN 107870225 BCN107870225 BCN 107870225BCN 201711079776 ACN201711079776 ACN 201711079776ACN 107870225 BCN107870225 BCN 107870225B
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- 238000001514detection methodMethods0.000abstractdescription10
- 239000000463materialSubstances0.000abstractdescription5
- 238000005452bendingMethods0.000abstractdescription4
- 238000012795verificationMethods0.000abstractdescription4
- 239000007789gasSubstances0.000description71
- 238000011161developmentMethods0.000description4
- 238000010586diagramMethods0.000description4
- 238000004519manufacturing processMethods0.000description4
- 230000006872improvementEffects0.000description3
- 238000011160researchMethods0.000description3
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- 230000017525heat dissipationEffects0.000description1
- 238000010438heat treatmentMethods0.000description1
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- 230000003993interactionEffects0.000description1
- 238000005259measurementMethods0.000description1
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- 238000012545processingMethods0.000description1
- 238000003908quality control methodMethods0.000description1
- 239000013076target substanceSubstances0.000description1
- 239000010409thin filmSubstances0.000description1
- 231100000331toxicToxicity0.000description1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
- B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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Abstract
Description
Technical Field
The invention belongs to the technical field of gas sensors, and particularly relates to a flexible three-dimensional packaging gas sensor.
Background
With the continuous improvement of living standard and the increasing attention on environmental protection, the rapid and accurate detection and monitoring of toxic and harmful gases by using the gas sensor becomes the current and future development trend. Resistance-type gas sensors for detecting purposes are most widely applied by utilizing resistance value change of gas to be detected when the gas to be detected is adsorbed on the surface of a gas sensitive material. However, this type of sensor is a polycrystalline thin film or a polycrystalline sintered body composed of a large number of crystal grains, and has a disadvantage of a small contact area with gas, and the sensor itself has a large volume and has serious problems in thermal insulation, thermal distribution, packaging, and the like.
Sensors include a wide variety of technologies, and sensor systems generally include two aspects, the first being the chip of the sensor, which essentially comprises the sensing layer. On the other hand, the signal measurement system is a system for providing a basis for interpretation after the magnitude of the interaction between the sensing layer of the sensor chip and the target substance is given by measuring a certain physical quantity such as resistance, current, voltage, refractive index, and the like. With the improvement of living standard and the scientific development of people, the connection between the sensor and our life is more and more tight. As the number of samples increases, the cost of the chip becomes a significant factor to be considered when using the sensor. In the production process of the traditional gas sensor chip, manual addition is often needed, so that the production efficiency and the cost of the sensor are difficult to meet the requirements. For example, quality control of food and pharmaceutical products requires monitoring of each package. Such sensors need to be small, simple to manufacture, mass-scalable and inexpensive, and are preferably fabricated on flexible substrates.
However, the current gas sensor application field is still narrow, for example, smart phones are developed very rapidly, and various manufacturers do not release any mobile phone with gas sensing function, and the next development direction of mobile phones is to be flexible, in addition, the research on flexible smart wearable devices is also very hot, wearable devices are typically used outdoors, although the detection of human body data is mature at present, little attention is paid to a flexible gas sensor which can be used for wearable equipment, and with the development of micro-nano processing technology, certain achievements have been made on the miniaturization of the gas sensor and the integration of the gas sensor in a mobile phone or other small-sized equipment, so that the requirement for flexibility is brought forward, if flexible gas sensing can be achieved, it can provide a non-negligible function for wearable smart devices.
Gas sensors have high sensing reliability requirements and are expected to detect multiple gases simultaneously, and no more complete solution is available in the current research situation, so further research is needed.
Disclosure of Invention
In order to solve the problem that the existing gas sensor is not suitable for bending, the gas sensor can realize flexibility, a three-dimensional array type detection structure is adopted, a plurality of sensing sites are integrated in a three-dimensional space, mutual verification and multiple gas detection can be realized through material selection, the invention provides a flexible three-dimensional packaging gas sensor, which comprises a plurality of layers of gas sensing layers, a fixing part and spacing bulges, wherein: the substrate of the gas sensing layer is a flexible substrate, the gas sensing layer comprises a flexible substrate layer, a flexible transparent conducting layer formed on the flexible substrate layer and a flexible middle layer formed on the flexible transparent conducting layer, and array sensing sites are formed in the flexible middle layer and are provided with leads connected to the sensing sites respectively;
the fixing part penetrates through each gas sensing layer, and the parts of the plurality of gas sensing layers, which are in contact with the fixing part, form a fixing area;
the spacing bulges are arranged among the gas sensing layers and used for keeping the same distance among the gas sensing layers of each layer.
Further, the fixing portion is disposed at a central position of the gas sensing layer.
Further, the fixing portion is made of a metal material, and the flexible transparent conductive layer in the gas sensing layer is connected to the fixing portion serving as a common electrode for each sensing site.
Furthermore, the spacing bulges are arranged on the periphery of the gas sensing layer, and the spacing bulges and the flexible substrate layer are integrally arranged.
Further, the size of the spacing protrusion in height is larger than the sum of the thicknesses of the flexible substrate layer, the flexible transparent conductive layer and the flexible intermediate layer.
Further, one end of the lead is connected to the sensing site, and the other end is connected to a side of the flexible intermediate layer.
Further, the planar shape of the flexible intermediate layer is a rectangle, and the leads extend to two opposite sides of the rectangle of the flexible intermediate layer.
Further, flexible redistribution layers are formed at both side edges to which the leads extend, the leads are connected to pads formed at the bottom through the redistribution layers, and the fixing portions also form common electrode pads.
The invention has the beneficial effects that: the invention provides a flexible three-dimensional packaging gas sensor which comprises a plurality of gas sensing layers, a fixing part and spacing bulges, wherein the base of each gas sensing layer is a flexible substrate, each gas sensing layer comprises a flexible substrate layer, a flexible transparent conducting layer formed on the flexible substrate layer and a flexible middle layer formed on the flexible transparent conducting layer, array sensing sites are formed in the flexible middle layer and are provided with leads respectively connected to the sensing sites, the problem that the existing gas sensor is not suitable for bending is solved, the flexibility of the gas sensor can be realized, meanwhile, a three-dimensional array type detection structure is adopted, a plurality of sensing sites are integrated in a three-dimensional space, and mutual verification and multiple gas detection can be realized through material selection.
Drawings
FIG. 1 is a schematic structural diagram of a flexible three-dimensional encapsulated gas sensor of the present invention;
FIG. 2 is a schematic structural diagram of a gas sensing layer in the flexible three-dimensional encapsulated gas sensor of the present invention;
FIG. 3 is a schematic top view of a gas sensing layer in a flexible volumetric encapsulated gas sensor of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The invention will be described in further detail with reference to the following drawings and specific embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a flexible three-dimensional packaged gas sensor of the present invention, fig. 2 is a schematic structural diagram of a gas sensing layer in the flexible three-dimensional packaged gas sensor of the present invention, fig. 3 is a schematic top view of the gas sensing layer in the flexible three-dimensional packaged gas sensor of the present invention, a flexible three-dimensional packaged gas sensor of the present invention comprises a plurality ofgas sensing layers 1, afixing portion 2 and aspacing bump 3, wherein: the base of thegas sensing layer 1 is a flexible substrate, thegas sensing layer 1 comprises aflexible substrate layer 11, a flexible transparentconductive layer 12 formed on theflexible substrate layer 11, and a flexibleintermediate layer 13 formed on the flexible transparentconductive layer 12, anarray sensing site 14 is formed in the flexibleintermediate layer 13, and leads 15 connected to thesensing sites 14 respectively are provided;
thefixing part 2 penetrates through eachgas sensing layer 1, and the parts of the plurality ofgas sensing layers 1, which are in contact with thefixing part 2, form a fixing area;
thespacing protrusions 3 are arranged between the gas sensinglayers 1 for keeping the same distance between the gas sensinglayers 1 of each layer.
Further, thefixing portion 2 is disposed at a central position of thegas sensing layer 1, and thefixing portion 2 is used for being mounted at other positions, such as a mobile phone, a wearable device, and the like, wherein due to the flexible layer in the sensing layer, other layers can be bent relative to thefixing portion 2, so that the whole gas sensor can be bent, and thefixing portion 2 is not integrally fixed due to the arrangement.
Further, thefixing part 2 is made of a metal material, the flexible transparentconductive layer 12 in thegas sensing layer 1 is connected to thefixing part 2, and thefixing part 2 serves as a common electrode for eachsensing site 14.
Further, thespacing protrusions 3 are arranged on the periphery of thegas sensing layer 1, a distance is reserved between thespacing protrusions 3, thespacing protrusions 3 and theflexible substrate layer 11 are integrally arranged, and no additional spacing step is needed, so that the preferred scheme is provided, of course, thespacing protrusions 3 can play the same role, and the position of thespacing protrusions 3 needs to be fixed during manufacturing.
Further, the size of thespacing protrusions 3 in height is larger than the sum of the thicknesses of theflexible substrate layer 11, the flexible transparentconductive layer 12 and the flexibleintermediate layer 13, and by limiting the height, the distance between thegas sensing layers 1 can ensure the circulation of gas.
Further, one end of thelead 15 is connected to thesensing site 14, and the other end is connected to a side of the flexibleintermediate layer 13.
Further, the planar shape of the flexibleintermediate layer 13 is a rectangle, and theleads 15 extend to two opposite sides of the rectangle of the flexibleintermediate layer 13.
Further, two sides thatlead wire 15 extends to form flexible redistribution layer, connectlead wire 15 through the redistribution layer and form the pad in the bottom, fixedpart 2 also forms the common electrode pad simultaneously, through the redistribution layer of flexibleintermediate layer 13 and side, finally realize forming the electrode pad that is used for connecting in the bottom (certainly also can be whole face), can carry out seamless connection through plane electrode array like this when whole assembly, also can combine heat dissipation, zone of heating etc. to regulate and control the temperature simultaneously.
The invention provides a flexible three-dimensional packaging gas sensor which comprises a plurality of gas sensing layers, a fixing part and spacing bulges, wherein the base of each gas sensing layer is a flexible substrate, each gas sensing layer comprises a flexible substrate layer, a flexible transparent conducting layer formed on the flexible substrate layer and a flexible middle layer formed on the flexible transparent conducting layer, array sensing sites are formed in the flexible middle layer and are provided with leads respectively connected to the sensing sites, the problem that the existing gas sensor is not suitable for bending is solved, the flexibility of the gas sensor can be realized, meanwhile, a three-dimensional array type detection structure is adopted, a plurality of sensing sites are integrated in a three-dimensional space, and mutual verification and multiple gas detection can be realized through material selection.
The relationships depicted in the drawings are for purposes of illustration only and are not to be construed as limitations of the present patent, and it should be understood that the above-described embodiments of the present invention are merely illustrative for clearly illustrating the present invention and are not limitations of the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. The utility model provides a flexible three-dimensional encapsulation gas sensor, includes that multilayer gas sensing layer, fixed part and interval are protruding, its characterized in that, wherein:
the substrate of the gas sensing layer is a flexible substrate, the gas sensing layer comprises a flexible substrate layer, a flexible transparent conducting layer formed on the flexible substrate layer and a flexible middle layer formed on the flexible transparent conducting layer, and array sensing sites are formed in the flexible middle layer and are provided with leads connected to the sensing sites respectively;
the fixing part penetrates through each gas sensing layer, and the parts of the plurality of gas sensing layers, which are in contact with the fixing part, form a fixing area;
the spacing bulges are arranged among the plurality of gas sensing layers and used for keeping the same distance among the gas sensing layers;
the fixing part is made of a metal material, the flexible transparent conductive layer in the gas sensing layer is connected to the fixing part, and the fixing part is used as a common electrode of each sensing site.
2. The flexible volumetric encapsulated gas sensor according to claim 1, wherein said fixing portion is disposed at a central position of said gas sensing layer.
3. The flexible volumetric encapsulated gas sensor of claim 2, wherein said spacer bumps are disposed about said gas sensing layer, said spacer bumps being integral with said flexible substrate layer.
4. The flexible volumetric encapsulated gas sensor of claim 3, wherein the spacing protrusion has a dimension in height that is greater than the sum of the thicknesses of the flexible substrate layer, the flexible transparent conductive layer, and the flexible intermediate layer.
5. The flexible volumetric encapsulated gas sensor of claim 1, wherein said leads are connected at one end to said sensing site and at the other end to a side of said flexible intermediate layer.
6. The flexible volumetric encapsulated gas sensor according to claim 5, wherein said flexible intermediate layer has a rectangular planar shape, and said leads extend to two opposite sides of said flexible intermediate layer rectangle.
7. The flexible solid encapsulated gas sensor according to claim 6, wherein flexible redistribution layers are formed at both side edges to which the leads extend, the leads are connected to pads formed at the bottom through the redistribution layers, and the fixing portions also form common electrode pads.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711079776.7ACN107870225B (en) | 2017-11-06 | 2017-11-06 | Flexible three-dimensional packaging gas sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711079776.7ACN107870225B (en) | 2017-11-06 | 2017-11-06 | Flexible three-dimensional packaging gas sensor |
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| CN107870225A CN107870225A (en) | 2018-04-03 |
| CN107870225Btrue CN107870225B (en) | 2020-05-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109030575A (en)* | 2018-06-12 | 2018-12-18 | 佛山市灏金赢科技有限公司 | A kind of multiple-level stack flexible gas sensor |
| CN108663487A (en)* | 2018-06-13 | 2018-10-16 | 佛山市澄澜点寸科技有限公司 | A kind of gas sensor |
| CN109001374A (en)* | 2018-06-13 | 2018-12-14 | 佛山市澄澜点寸科技有限公司 | A kind of anti-error reporting system based on stacking gas sensor |
| CN108896238A (en)* | 2018-07-17 | 2018-11-27 | 佛山市灏金赢科技有限公司 | A kind of array pressure sensor |
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| CN100409419C (en)* | 2006-09-01 | 2008-08-06 | 中国航天时代电子公司第七七一研究所 | Method for interconnecting and packaging 3-D multi-chip module |
| US20080142941A1 (en)* | 2006-12-19 | 2008-06-19 | Advanced Chip Engineering Technology Inc. | 3d electronic packaging structure with enhanced grounding performance and embedded antenna |
| CN201266123Y (en)* | 2008-08-19 | 2009-07-01 | 海尔集团公司 | Lattice type temperature collection device |
| KR101169394B1 (en)* | 2008-12-08 | 2012-07-30 | 한국전자통신연구원 | Large Area Gas Sensor and Method for Fabricating the Same |
| SE536322C2 (en)* | 2011-11-18 | 2013-08-20 | Molecular transition platform and method for manufacturing such a platform | |
| CN103258954B (en)* | 2012-02-17 | 2016-06-01 | 中国科学院微电子研究所 | gas sensor based on flexible substrate and preparation method thereof |
| EP3227730A4 (en)* | 2014-12-03 | 2018-08-01 | University Of British Columbia | Flexible transparent sensor with ionically-conductive material |
| CN104865293A (en)* | 2015-05-19 | 2015-08-26 | 清华大学 | Flexible gas sensor based on three-dimensional net structured sensitive film and preparation method of flexible gas sensor |
| CN107879310A (en)* | 2017-11-06 | 2018-04-06 | 余帝乾 | A kind of multifunctional unit lamination sensor |
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