Embodiment
The present invention is described in detail by specific embodiment below in conjunction with the accompanying drawings, for a better understanding of this hairIt is bright, but following embodiments are not intended to limit the scope of the invention.In addition, it is necessary to illustrate, the diagram provided in following embodimentsOnly illustrate the basic conception of the present invention in a schematic way, the component relevant with the present invention is only shown in accompanying drawing rather than according to realityComponent count, shape during implementation and size are drawn, it is actual when implementing shape, quantity and the ratio of each component can be one kind withThe change of meaning, and its assembly layout form may also be increasingly complex.
Fig. 1 is a kind of structural representation of optical projection module according to embodiments of the present invention.Optics in the embodimentProject module, including base 10, light source 11, lens barrel 12, lens combination 13, DOE14, pad 121, transparency carrier 15, transparent leadConductive film 16 and control circuit 18.Light source 11 is arranged on base 10, launches light beam towards lens combination 13；Lens combination13 beam modulations for launching light source 11 are collimated light beam, and directive DOE14；Collimated light beam is expanded, is superposed to pattern by DOE14Change in light beam directive space.Further, transparency carrier 15 is arranged on DOE14 top, is supported by pad 121, be fixed；ThoroughlyBright conductive film 16 is attached to the surface of transparency carrier 15, is electrically connected by plain conductor with control circuit 18；Control circuit 18By contrast, analyze transparent conductive film 16 resistance variations or transparent conductive film between capacitance variation, assess, judgeThe integrality of transparency carrier 15, and the integrality according to transparency carrier 15, control the working condition of optical projection module.
Base 10 provides a supporting role, and is generally used for installing light source 11 and carries lens barrel 12.In certain embodiments, bottomSeat 10 is additionally operable to the radiating and/or power supply of light source 11.Base 10 can be by the ceramics with heat conduction and/or conducting function, goldOne or more in category, alloy, plastic or other material are made.Preferably, base 10 by heat conduction function ceramics and printed circuitPlate (PCB) combines.
Light source 11 is bonded, is fixed on the side of base 10, for launching light beam.Light source 11 can be vertical cavity surfaceThe laser of transmitting or the edge-emitting laser on parallel resonance chamber surface, the light of infrared, ultraviolet equiwavelength can be launchedBeam.In certain embodiments, light source 11 can also be that service life is long, the slow infrared or ultraviolet LED light source of optical attenuation.This hairIn bright embodiment, light source 11 preferably comprises the two dimensional VCSEL chip of at least one VCSEL light source, and the chip can outwards be thrownEjected wave a length of 830nm or 940nm infrared beam, and can realize that at least two is different according to relevant control circuitLuminance.VCSEL array chip can be that nude film can also be that nude film is gathered around by the chip after encapsulation, both differencesThere are smaller volume and thickness, and encapsulating chip then has more preferable stability and more easily connects.
Lens barrel 12 is pasted by epoxy glue, is fixed on the side of base 10, for isolating extraneous natural light and placement lensThe optical elements such as system 13, DOE14.Lens barrel 12 can be hollow square/rectangular parallelepiped structure or hollow circular cylinderOr other suitable constructions, typically it is made by the one or more in the ceramics, plastics or alloy material of heat conduction.SpecificallyGround, lens barrel 12 can be integrally formed by Shooting Technique or stamping technique, can also split into several parts, discrete processingCombination forming.For the ease of the thermal conductive ceramic lens barrel of the encapsulation of lens combination 13, preferably separate structure.It is understood thatWhen assembling lens barrel 12, the geometry site of light source 11 and lens combination 13 should be considered, so that light source 11 is located at lensNear the equivalent focal length of system 13.
Lens combination 13 is embedded in inside lens barrel 12, and the contact surface between lens combination 13 and lens barrel 12 can pass through epoxyGlue bond is fixed, and can also be bolted, for receiving and converging the light beam of the transmitting of light source 11, in one embodiment,Outwards projection collimated light beam.The lens combination 13 can only include a piece of lens, can also include that multi-disc is identical and/or different songsThe lens of rate.The material of lens can be clear glass or resin or high molecular polymer.Preferably, lens systemSystem 13 includes the lens of two panels glass material.
DOE14 is process by transparency carrier, and the transparency carrier etches or is embossed with diffraction pattern, is bonded by epoxy glueThe top of lens barrel 12 is fixed on, for receiving, the light beam that beam splitting is emitted after the convergence of lens combination 13, and outwards projects energy pointThe patterned beam that cloth is uniform, contrast is high.When light source 11 includes multiple sub-light sources, DOE14 is used to be arranged sub-light sourcePattern by mirror image be superimposed in a manner of outwards project patterned beam.For manufacturing DOE14 transparency carrier, its material can be withIt is glass or transparent plastic.In an embodiment of the present invention, the transparency carrier of the preferred glass materials of DOE14, which is used as, addsWork raw material, surface etch or relief diffraction pattern in incident beam side.In some equivalent implementations, DOE14 includesTwo pieces or more than two pieces of glass or plastic, transparent substrate, incident and/or outgoing beam the surface of each piece of transparency carrierEtch or be embossed with diffraction pattern.
Pad 121 is arranged on DOE14 top, is adhesively fixed by epoxy glue, for carrying transparency carrier 15 and dividingEvery transparency carrier 15, DOE14.Pad 121 can be hollow ring-type integrative-structure or block separate structure, typicallyIt is process by the one or more in the ceramics with heat conduction function, metal, alloy, plastic or other material.It is to be appreciated thatThe pad 121 of separate structure, the consistent discrete pad fritter of at least two specifications should be included, so that transparency carrier 15 canThe steady top for being fixed on DOE14.For the ease of installing, the pad in the embodiment of the present invention, it is therefore preferable to which there is thermal conductivityIntegral ceramic gasket.In some equivalent embodiments, optical projection module can not also include pad 121.Specifically, can incite somebody to actionDOE14 inlays, is fixed on inside lens barrel, and using lens barrel design itself to support, fixed transparency carrier, with realize separate it is saturatingBright substrate 15, DOE14 effect.
Transparency carrier 15 is arranged on the top of pad 121, is adhesively fixed by epoxy glue, for protecting DOE14 to avoidDOE14 is directly exposed in air.Specifically, the surface of transparency carrier 15 includes beam incident surface, beam exit face, at someIn embodiment, in addition to it is arranged on one or more inclined end faces of the longitudinal terminal surface of transparency carrier 15.In some embodiments, thoroughlyDOE14 is sealed in lens barrel by bright substrate 15, pad 121, further to reduce the interference of extraneous steam, dust to DOE performances.Can be clear glass, transparent plastic or other suitable materials for making the material of transparency carrier 15 similar to DOE14Material.It is understood that because transparency carrier 15 is directly exposed in air, therefore it is required that the material for making transparency carrier 15Matter must have stronger corrosion resistance, impact resistance, and will not cause actual shadow to the DOE14 patterned beams being emittedRing.It should be understood that transparency carrier described herein is actual it can be appreciated that the cover sheet that general module is included.
Transparent conductive film 16 is attached to transparency carrier 15 by the related feasible technique such as be deposited, be vapor-deposited or attachSurface, there is good electric conductivity and/or resistive properties.It is to be appreciated that transparent conductive film 16 is to infrared beam, purpleOuter or other specific bands light beams have higher transmissivity.In an embodiment of the present invention, it is preferable that electrically conducting transparent is thinFilm 16 be preferably brittle transparent conductive film, and the transparent conductive film to infrared beam have be not less than 85% transmissivity,Such as：ITO (tin indium oxide) or CTO (Cd2SnO4Cadmium stannate film) or CIO (CdIn2O4Metaindic acid cadmium film) film etc..EnterOne step, the transparent conductive film 16 on the surface of transparency carrier 15 is attached to, its distribution form can be distributed with random pattern, thanSuch as, the distribution of grizzly bar shape, serpentine shape are distributed or are uniformly distributed, and do not limit specifically.
Control circuit 18 is electrically connected by plain conductor with transparent conductive film 16, light source 11, for measuring electrically conducting transparentThe integrality of film 16, and the working condition of control light source 11 or optical projection module.The control circuit 18, includes CPU/Single-chip microcomputer, register or other feasible logical operation devices, can carry out interrelated logic judgement, the storage of data and controlOperation, referring specifically to Fig. 2.In a kind of implementation, as shown in Figure 2 a, the measurement of control circuit interval (for example surveyed every 1sAmount is once) resistance value or capacitance of transparent conductive film, and by the resistance value measured or capacitance and default safety thresholdValue section is compared, and judges whether its value exceedes secure threshold section, is such as exceeded secure threshold section, is then judged the transparency carrierIntegrality is damaged, and then controls the working condition of optical projection module, i.e., makes relevant control to the luminance of light source, such as：Close light source or reduce the luminous power of light source.In some equivalence enforcement methods, as shown in Figure 2 b, control circuit continuously measuresThe resistance value or capacitance of transparent conductive film, by contrasting the resistance value or capacitance at current time and previous moment, judgeThe integrality of transparent conductive film.Specifically, it is assumed that the resistance value that previous moment measures is R0Or capacitance is C0, when currentThe resistance value that quarter measures is R or capacitance is C, then works as R-R0Or C-C0Value exceed default secure threshold or find R orWhen significantly saltus step occurs suddenly in C, assert that the transparency carrier has damaged, and then control the working condition of optical projection module,Close light source or reduce the luminous power of light source.The benefit so set is that control circuit can in real time, quickly judge transparentThe integrality of substrate, with exclude it is in running order in, there is situation about damaging suddenly in transparency carrier.Control circuit 18 can be sentencedSimple decision logic circuit or integrated circuit in the rigid circuit board of disconnected logic circuit insertion base 10, with independenceModule be arranged at the medial/lateral of lens barrel 12.In a kind of embodiment, control circuit is by continuous or compartment of terrain to described transparentConductive film injects low current, and the change in resistance of monitoring circuit, to judge the integrality of transparent conductive film, so as to inferState the integrality of transparency carrier.In some other embodiments, control circuit continues to inject to the transparent conductive filmConstant or alternation electric current, and voltage/capacitance variations of the transparent conductive film are detected, to judge the complete of transparent conductive filmWhole property, so as to infer the integrality of the transparency carrier.Because transparency carrier 15 carries protection DOE effect, when the ring in the external worldBorder, temperature change, or the artificial damage colliding with, stagger along, being likely to result in transparency carrier 15；Once transparency carrier 15It is damaged, then can not recurs to protection DOE effect, while DOE is there is also impaired possibility, and then cause light source transmittingLight beam cause potential safety hazard.By judging whether transparency carrier 15 is complete, and then judge whether DOE is in by complete preservationState or judge the integrality of whole optical projection module.
In a kind of structural representation of optical projection module 100 shown in Fig. 1, transparent conductive film 16 is evenly affixed toThe upper surface (it should be understood that upper surface here refers to the beam exit face of transparency carrier) of transparency carrier 15 is with tiltingEnd face or breach 151, and pad/electrode 17 is set at inclined plane or breach 151.Transparent conductive film 16 passes through electrode 17In the plain conductor Access Control circuit 18 for locating extraction.
In a kind of embodiment, control circuit 18 can be understood as to the monitoring process of the integrality of transparency carrier 15：When saturatingWhen bright substrate 15 remains intact, the transparent conductive film 16 of transparency carrier upper surface is attached to, its resistive properties can be recognizedSurely it is invariable or is fluctuated in a rational resistance section, i.e., control circuit 18 monitors the resistance stabilization in loopIn rational safe Resistance section.Now, control circuit 18 keeps the normal luminous state of light source 11, and continues to monitor loopIn resistance variations.When transparency carrier 15 occurs rupturing or damaged, the electrically conducting transparent for being attached to the upper surface of transparency carrier 15 is thinThe meeting of film 16 appearance simultaneously is different degrees of to come off, is cracked, obvious so as to cause the resistive properties of transparent conductive film 16 to occurChange, i.e., control circuit 18 monitors that the resistance in loop crosses rational safe Resistance section.Now, the basis of control circuit 18The resistance value monitored deviates the degree in safe Resistance section, and selection reduces the luminous power of light source 11 or closes light source 11.
In similar to the optical projection module 100 shown in Fig. 1, transparent conductive film 16 can divide in another wayCloth, referring particularly to Fig. 3.In a kind of embodiment, the form that transparent conductive film 16a can be distributed by grizzly bar shape is attached toThe upper surface of bright substrate 15.Wherein, transparent conductive film 16a includes at least two grizzly bars 161, and one end of each grizzly bar 161 is mutualConducting.It is understood that the grizzly bar quantity that transparent conductive film 16a is included is more, its resistance value is bigger.It is alternative at someEmbodiment in, transparent conductive film can also increase its resistance value by serpentine shape distribution.The benefit so set is,On the one hand injection circuit value of the control circuit 18 to transparent conductive film 16a can further be reduced；In another aspect loop moreBig monitoring resistor value is advantageous to improve sensitivity of the control circuit 18 to transparent conductive film 16a Integrity Verifications.Specifically,Control circuit 18 by temperature sensor (thermal resistance), can measure the transparent conductive film 16a of grizzly bar shape distribution change, withJudge the integrality of transparency carrier 15 and control the luminance of light source 11.
Similarly, in the optical projection module 100 shown in Fig. 1, transparent conductive film can also be with interspersed grizzly bar shapeMode is distributed, referring particularly to Fig. 4.In a kind of embodiment, the transparent conductive film 16b bags of the upper surface of transparency carrier 15 are attached toInclude the transparent conductive film 16b and 16c of two relatively independent grizzly bar shape distributions.Wherein, transparent conductive film 16b (or 16c)Including at least two grizzly bars 162 (or 163), and one end between each grizzly bar has identical electrode.It is different from Fig. 3 implementationsMode, in the embodiment, the grizzly bar 162 and grizzly bar 163 between transparent conductive film 16b and transparent conductive film 16c are mutualInterspersed distribution, so that transparent conductive film 16c and 16b forms interdigital capacitor.Specifically, transparent conductive film 16b passes through metalIn wire Access Control circuit, driving electrodes are formed；And transparent conductive film 16c is hanging or grounding, induction electrode is formed.Further, monitoring of the control circuit 18 to the integrality of transparency carrier 15, can be by measuring driving electrodes (grizzly bar) 162 and senseThe capacitance variations between the capacitance variations between electrode (grizzly bar) 163 or other grizzly bars are answered to assess, judge lens substrate 15Integrality.
The benefit so set is, on the one hand, transparent need to only be led in the surface attachment of outgoing/incident beam of transparency carrierConductive film；On the other hand, the measurement of the capacitance variations of single capacitance electrode arrangement has higher sensitivity, that is, contributes to be liftedSensitivity of the transparent conductive film to transparency carrier Integrity Verification.
In some alternate embodiments, the lower surface that transparent conductive film can also be attached to transparency carrier is (transparentThe plane of incidence of the light beam of substrate 15), its form being distributed can be uniformly distributed or with random pattern, distribution of shapes.In some other alternate embodiments, the whole surface that transparent conductive film can also be attached to transparency carrier is (including upper and lowerSurface).The capacitance variations that control circuit can be formed according to the resistance variations or transparent conductive film of transparent conductive film, are weighedThe integrality of transparency carrier is judged, to realize the control of light source luminescent state.
Fig. 5 is a kind of structural representation of optical projection module according to embodiments of the present invention.In the embodiment, optics is thrownThe structure of shadow module 200 is substantially similar with Fig. 1 embodiments, and difference is, it is thin that optical projection module 200 includes electrically conducting transparentFilm 16d, 16e.Wherein, transparent conductive film 16d is attached to DOE14 upper surface (it should be understood that surface above hereRefer to DOE14 beam exit face), transparent conductive film 16e be attached to transparency carrier 15 lower surface (transparency carrier 15Beam incident surface), respectively by plain conductor Access Control circuit 18a.
In a kind of embodiment, control circuit 18a injects low current to transparent conductive film 16d, 16e respectively, to obtainTransparent conductive film 16d, 16e resistance value, and transparent conductive film 16d resistance R0 is arranged to canonical reference resistance.ControlCircuit 18a processed is weighed, assessed by analyzing the change of transparent conductive film 16e resistance and reference resistance R0 ratio in real timeThe integrality of transparency carrier 15 and the luminance for controlling light source.The benefit so set is, on the one hand, due to electrically conducting transparentFilm 16e is attached respectively to different optical element surfaces, therefore the optics member accompanying by the two from transparent conductive film 16dThe integrality of part will not cause to interfere；On the other hand, by monitoring both transparent conductive film 16d, 16e resistance ratioValue, influence of the external environment (such as change of temperature) to monitoring result can be reduced (because the two residing environment mechanism isIt is the same, by numeric ratio compared with method can directly offset the changes of outside environmental elements), so as to improve control circuit 18aTo the monitoring accuracy of the integrality of transparency carrier 15.
In another embodiment, transparent conductive film is evenly affixed to the whole upper surfaces of DOE14, and transparent conductive film is thenThe whole lower surface of transparency carrier 15 is evenly affixed to, so that two discrete transparent conductive film planes form capacity plate antenna,And by plain conductor Access Control circuit.Control circuit judges transparency carrier indirectly by monitoring the change of capacity plate antennaIntegrality.
In another interchangeable embodiment, refering to Fig. 6 a and Fig. 6 b, transparent conductive film 16e1It is thin with electrically conducting transparentFilm 16d1Respectively with intert grizzly bar shape distribution form be attached to the lower surface of transparency carrier 15, DOE upper surface, with formTwo mutually corresponding discrete interdigital capacitors.Specifically, discrete interdigital capacitor can be divided into two parts of upper and lower alignment；Wherein, underPart is the first interdigital capacitor, and top is divided into the second interdigital capacitor.First (the second) interdigital capacitor includes driving electrodes 164(166) and induction electrode 165 (167), driving electrodes 164 are corresponding with induction electrode 167, driving electrodes 166 and induced electricityPole 165 is corresponding.Monitorings of the control circuit 18a to discrete interdigital capacitor can specifically pass through：1st, driving electrodes 164 and sense are measuredThe capacitance variations between electrode 167 are answered to realize；2nd, the capacitance variations measured between driving electrodes 166 and induction electrode 165 are realIt is existing；3rd, the electric capacity measured between top or the driving electrodes 164 (166) and induction electrode 165 (167) of bottom interdigital capacitor becomesChange and realize.
The benefit so set is that the change of discrete interdigital capacitor can be monitored by different measurement schemes with time-sharing multiplexChange, further to lift sensitivity and flexibility ratio of the control circuit to transparency carrier Integrity Verification.
Fig. 7 is a kind of structural representation of optical projection module according to embodiments of the present invention.Optics in the embodimentThe structure of projection module 300 is substantially similar with Fig. 3 embodiments, and difference is, the optical projection module 300 includes transparent leadConductive film 16g, 16f and transparent conductive film 16i, 16h.Wherein, transparent conductive film 16g and transparent conductive film 16f dividesIt is not attached to DOE14 upper surface and the lower surface of transparency carrier 15, and by financial wire Access Control circuit, to formThe monitoring electric capacity of one integrality of monitoring transparency carrier 15 is (it is to be appreciated that transparent conductive film 16g, 16f are equivalent to monitoringTwo electrodes of electric capacity)；Wherein, transparent conductive film 16i and transparent conductive film 16h adheres to the upper and lower table of pad 121 respectivelyFace, and by plain conductor Access Control circuit, to form a stable reference capacitance (it is to be appreciated that transparent leadThe electrode of conductive film 16i, 16h equivalent to reference capacitance).Because pad 121 is for transparency carrier 15 and DOE14, it isOne discrete independent component, therefore the reference capacitance that transparent conductive film 16i, 16h are formed, its integrality/stability will notIntegrality/stability influence of electric capacity is monitored by transparent conductive film 16f, 16g composition.In a kind of embodiment, controlCircuit 18b judges the integrality of transparency carrier 15 by the ratio of contrastive detection electric capacity and reference capacitance, and according to transparentThe complete luminance for sexually revising light source 11 of substrate 15.
The benefit so set is：By analyzing the change of ratio of the reference capacitance with monitoring electric capacity, can effectively dropLow extraneous factor (especially temperature) is improved assessment of the control circuit to transparency carrier integrality, sentenced to monitoring the influence of electric capacityDisconnected accuracy rate.
Similarly, in some equivalent embodiments, the transparent conductive film 16g for being attached to the lower surface of transparency carrier 15 can be withThe upper surface of transparency carrier 15 is arranged on, being similarly attached to the transparent conductive film 16f of DOE14 upper surface can also adhere toIn DOE14 diffraction pattern face.
Traditional technological means, optical projection module provided by the invention are different from, its advantage is：Offer is attached withThe transparency carrier of transparent conductive film, transparency carrier are fixed on the DOE light extractions side of optical projection module by pad.There is providedControl circuit, electrically connected by plain conductor with the transparent conductive film, to monitor the change of the resistance of transparent conductive film in real timeThe capacitance variations that change or transparent conductive film are formed, indirect assessment, the integrality for judging transparency carrier.In addition, also set up referenceResistance or reference capacitance, further lift accuracy rate, sensitivity that control circuit is judged transparency carrier integrality.FurtherGround, control circuit can carry out relevant control according to the integrality of transparency carrier to the luminance of optical projection module.
It should be understood that the above-mentioned embodiment referred to, the Integrity Verification of other optical elements can also be extended to, thanSuch as：Applied to refraction optical element, reflective optical devices, diffraction optical element, polarization optical element, phase-shifted optical element it is completeWhole property monitoring, the Integrity Verification of its a variety of optical element combination module can also be applied to.Its mode of texturing, do not do and have hereinBody limits, because being obvious for a person skilled in the art.
As shown in figure 8, it is a kind of structural representation of lens combination.Lens combination, especially image capture moduleImaging lens system, its integrality can directly influence imaging sensor (CCD or CMOS) acquired image quality.Damage orThe lens combination of deformation, different degrees of aberration, distortion are necessarily introduced, so as to cause the image quality of lens combination to decline.ShouldLens combination includes：Lens 19, transparency carrier 15 are arranged on the top of lens 19, are supported and fixed by pad 121, electrically conducting transparentFilm 16 is attached to the lower surface of transparency carrier 15, and is electrically connected by plain conductor with control circuit 18.It is understood thatIts transparent conductive film can also equally be distributed in the lower surface of lens combination.
Similarly, transparent conductive film is also attached to the surface of lens combination, or the surface of lens combination and padThe surface of piece is all attached with transparent conductive film.The structural representation of another lens combination as shown in Figure 9, it is with Fig. 8'sDifference is, includes transparent conductive film 16j and 16k, passes through plain conductor Access Control circuit 18 respectively.
Similarly, transparent conductive film can be attached to the lens element of lens combination uniformly or with certain distribution patternSurface.Control circuit obtains loop resistance or capacitance by injecting low current to transparent conductive film, and by the resistance of acquisitionOr capacitance is compared with default threshold interval, it can be determined that whether transparent conductive film stands intact.Work as transparent conductive filmWhen damaging, it can be understood as different degrees of displacement or damage or deformation occurs in the lens element in lens combination.EnterOne step, when the optical element monitored is specifically integrated in functional module or active device, control circuit can also and work(Can module or active device electrical connection.Control circuit completes optical element indirectly by judging the integrality of transparent conductive filmThe monitoring of integrality, and associated safety operation is made to functional module or active device.Here associated safety operation, can be withWork including stopping functional module or active device；Reduce functional module or the power output of active device etc..
It may be noted that according to the needs of implementation, each step/part described in this application can be split as more multistepSuddenly/part, the part operation of two or more step/parts or step/part can be also combined into new step/part,To realize the purpose of the present invention.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to is assertThe specific implementation of the present invention is confined to these explanations.For those skilled in the art, do not taking offOn the premise of from present inventive concept, some equivalent substitutes or obvious modification can also be made, and performance or purposes are identical, all shouldWhen being considered as belonging to protection scope of the present invention.