The content of the invention
The technical problems to be solved by the invention are to provide a kind of circuit structure preparation method and circuit structure, without usingMetallic compound or metallic media, yield is high, and link performance is good.
To solve the above problems, the present invention proposes a kind of circuit structure preparation method, comprise the following steps：
S1：One inorganic material substrate is provided；
S2：An at least surface for the inorganic material substrate is polished；
S3：Electromagnetic irradiation is carried out to the polished surface of the inorganic material substrate according to circuit shape to be formed, is formed and shoneFigure after penetrating；
S4：Activate the polished surface for comprising at least the figure after irradiating of the inorganic material substrate；
S5：Electroplated on figure after the irradiation of activation or change the plating coat of metal, form circuit.
According to one embodiment of present invention, step S21 is also included between the step S2 and step S3：
The inorganic material substrate is cleaned by washing process, to remove the metal ion of polished surface.Its benefit is to keep awayExempt from plating of being overflow caused by metal ion.
According to one embodiment of present invention, step S22 is also included between the step S2 and step S3：
Organic film or hydrophobic film layer are formed in the polished surface of the inorganic material substrate；Or in the inorganic materialExpect that the polished surface of substrate forms inorganic film more smooth than inorganic material substrate and finer and close；
In step s3, the organic film of the figure after irradiation or hydrophobic film layer or inorganic film are removed, rather thanThe organic film or hydrophobic film layer or inorganic film in electromagnetic irradiation region retain.Its benefit is further to avoid plating of overflowing, and can be withWidening plates window, and due to being not concerned about plating of overflowing, liquid medicine field of activity can suitably relax.
According to one embodiment of present invention, step S6 is also included after the step S5：
The metal coating surface is polished.
According to one embodiment of present invention, before the step S3 or after the step S5, in addition to stepRapid S7：
Macromolecule membranous layer or enhancing harden structure are formed on one or more surfaces of the inorganic material substrate.
According to one embodiment of present invention, the inorganic material substrate is glass material plate, or ceramic material plate, orThe substrate that person is formed in metal plate or high polymer material plate body surface enamel or low firing enamel.
According to one embodiment of present invention, the glass material plate includes chalcogenide glass, halide glass, glassy silicateGlass, borate glass, phosphate glass, quartz glass, vagcor, soda-lime glass, lead silicate glass, alumino-silicate glassGlass, borosilicate glass, phosphate glass.
According to one embodiment of present invention, the saw lumber of the ceramic material plate is zirconium oxide, aluminum oxide, silicon nitride, carbonA kind of material or several mixing materials in SiClx, boron nitride, tin oxide, silica, magnesia.
According to one embodiment of present invention, the saw lumber of the ceramic material plate is nano ceramics or ceramic base composite woodMaterial.
According to one embodiment of present invention, the dielectric constant of the inorganic material substrate is under 1MHz to 10GHz frequency rangesFor 3.6~100.
According to one embodiment of present invention, the coat of metal is layers of copper, or, the layers of copper and silver successively plated successivelyLayer, or, the layers of copper and nickel dam successively plated successively, or, layers of copper, nickel dam and the layer gold successively plated successively, or, successively successivelyNickel dam, layers of copper and the nickel dam of plating, or, nickel dam, layers of copper and the silver layer successively plated successively, or, nickel dam, the copper successively plated successivelyLayer and nickel dam, or, nickel dam, layers of copper, nickel dam and the layer gold successively plated successively.
According to one embodiment of present invention, the energy range that polished surface carries out electromagnetic irradiation is 10W~500W, electromagnetismVelocity interval 50mm/ seconds~6000mm/ seconds are irradiated, frequency range is 10KHz~100KHz；Figure after irradiation is shone by electromagnetismOnce or more is penetrated to be formed.
According to one embodiment of present invention, the inorganic material substrate is connected as one with an at least sheet of metallic materialPlate.
The present invention also provides a kind of circuit structure, including：Inorganic material substrate with an at least polished surface；The nothingPass through radium-shine formation formed with line pattern, the line pattern on the polished surface of machine material substrate；And formed describedThe coat of metal on line pattern.
According to one embodiment of present invention, the inorganic material substrate polished surface logicalnot circuit graphics field shapeInto organic film or hydrophobic film layer；Or the logicalnot circuit graphics field of the polished surface in the inorganic material substrate forms ratioThe more smooth and finer and close inorganic film of inorganic material substrate.
According to one embodiment of present invention, in the one or more of the inorganic material substrate formed with the coat of metalMacromolecule membranous layer or enhancing harden structure are formed on individual surface.
According to one embodiment of present invention, the inorganic material substrate is glass material plate, or ceramic material plate, orThe substrate that person is formed in metal plate or high polymer material plate body surface enamel or low firing enamel.
According to one embodiment of present invention, the glass material plate includes chalcogenide glass, halide glass, glassy silicateGlass, borate glass, phosphate glass, quartz glass, vagcor, soda-lime glass, lead silicate glass, alumino-silicate glassGlass, borosilicate glass, phosphate glass.
According to one embodiment of present invention, the saw lumber of the ceramic material plate is zirconium oxide, aluminum oxide, silicon nitride, carbonA kind of material or several mixing materials in SiClx, boron nitride, tin oxide, silica, magnesia.
According to one embodiment of present invention, the saw lumber of the ceramic material plate is nano ceramics or ceramic base composite woodMaterial.
According to one embodiment of present invention, the dielectric constant of the inorganic material substrate is under 1MHz to 10GHz frequency rangesFor 3.6~100.
According to one embodiment of present invention, the coat of metal is layers of copper, or, the layers of copper and silver successively plated successivelyLayer, or, the layers of copper and nickel dam successively plated successively, or, layers of copper, nickel dam and the layer gold successively plated successively, or, successively successivelyNickel dam, layers of copper and the nickel dam of plating, or, nickel dam, layers of copper and the silver layer successively plated successively, or, nickel dam, the copper successively plated successivelyLayer and nickel dam, or, nickel dam, layers of copper, nickel dam and the layer gold successively plated successively.
According to one embodiment of present invention, the inorganic material substrate and it is connected to become one with an at least sheet of metallic materialBody plate.
After adopting the above technical scheme, the present invention has the advantages that compared with prior art：
The present invention makes circuit thereon using inorganic material as substrate, by being polished place to inorganic material substrateReason, its surface roughness is set to be reduced to 1 micron or less than 1 micron, the surface after polishing is not easy deposition or adsorbing metal ions,And when subsequently electromagnetic irradiation performs, the graphics field after irradiation can be modified, and surface roughness greatly increases, therefore non-electromagnetism shinesThe roughness for penetrating region and the graphics field after laser irradiation forms very big difference so that activation and change plating operation afterwardsWindow is bigger, thus yield is high, cost-effective without frequently detection replacing liquid medicine, also, the non-electromagnetism irradiation area of polished surfaceIt can only be plated due to not depositing substantially or adsorbing metal ions, during upper plating in figure after irradiation, be not in the asking of plating of overflowingTopic, and by activation, activated metal layer can be formed on figure pointedly after irradiation, electroplate thereon or changing plating metalExtremely it is liable to stick to the patterned surface after irradiation and forms the coat of metal, without sets metallic compound in inorganic material substrateOr metallic media helps to plate, impurity is reduced to the crystal structure of product and the influence of outward appearance, is particularly suitable as electronicsThe shell of equipment so that be furnished with circuit simultaneously on shell, while ensure the radio-frequency performance of circuit.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present inventionEmbodiment be described in detail.
Many details are elaborated in the following description in order to fully understand the present invention.But the present invention can be withMuch it is different from other manner described here to implement, those skilled in the art can be in the situation without prejudice to intension of the present inventionUnder do similar popularization, therefore the present invention is not limited to the specific embodiments disclosed below.
Referring to Fig. 1, in one embodiment, circuit structure preparation method comprises the following steps：
S1：One inorganic material substrate is provided；
S2：An at least surface for the inorganic material substrate is polished；Because inorganic material is hard with respect to organic materialDegree is high, and easily polishing forms the face of low roughness, and so as to improve the difference of surface and burnishing surface after electromagnetic radiation, it is difficult to reduce activationDegree, reduce plating of overflowing.
S3：Electromagnetic irradiation is carried out to the polished surface of the inorganic material substrate according to circuit shape to be formed, is formed and shoneFigure after penetrating；
S4：Activate the polished surface for comprising at least the figure after irradiating of the inorganic material substrate；
S5：Electroplated on figure after the irradiation of activation or change the plating coat of metal, form circuit.
The circuit structure preparation method of the embodiment of the present invention is carried out with reference to Fig. 1,4,5a, 5b, 6a and 6b more specificDescription, but should not be as limit.
Step S1 is first carried out, referring to Fig. 1 and Fig. 4, there is provided an inorganic material substrate 1, the inorganic material substrate 1 have oneFixed stereochemical structure, thus gas, liquid inorganic material are clearly to be not suitable for that substrate is made, in other words the present embodiment is inorganicMaterial substrate 1 is made up of solid inorganic material.
Then step S2 is performed, an at least surface for inorganic material substrate 1 is polished, such as the nothing shown in Fig. 4Machine material substrate 1, it is processed by shot blasting in the upper surface of inorganic material substrate, naturally it is also possible to also together polish other surfacesProcessing.Polishing can be physics polishing or chemical polishing, and specific glossing is unlimited, as long as can be by the inorganic material of cooperationExpect substrate surface polishing, reduce surface roughness.The surface roughness of polished surface preferably can be at 1 micron or 1 micronHereinafter, the polished surface under the surface roughness is not easy deposition or adsorbing metal ions.
Then step S3 is performed, referring to Fig. 1,5a and 5b, after polishing, according to circuit shape to be formed to inorganic materialThe polished surface of substrate 1 carries out electromagnetic irradiation, and the figure formed after irradiation, the figure after irradiation can be with the shape of line pattern 11Formula is present.Electromagnetic irradiation can be realized using existing electromagnetic irradiation device, the figure after irradiation is according to circuit shape to be formedDepending on, depend on the needs, it is specific unlimited.Polished surface is corrupted such that electromagnetic irradiation region and non-electromagnetism after electromagnetic irradiationThe roughness of irradiation area forms very big difference, and in other words, the roughness in electromagnetic irradiation region is compared to polished surface meetingGreatly increase.
Then step S4, the polished surface for comprising at least the figure after irradiating of activation inorganic material substrate 1, purpose are performedIt is that the figure after irradiation is activated.Whole inorganic material substrate activating process can be subjected to, only table can also be will polishedFace carries out activating process, provided of course that being activated for radiating pattern, thus is not necessarily required to carry out whole polished surfaceActivating process.Activating process can be the technique that chemical activation is carried out using activator, for example with palladium activator to inorganic materialExpect that substrate 1 carries out palladium activation so that in the figure of Metal Palladium attachment after irradiation, form a palladium metal layer, be also not necessarily limited to certainlyThis, if can it is activated after irradiate after figure in formed one layer of activated metal layer.Although the area that activation process is directed toThe region that the figure after penetrating is contrasted in domain is big, still, because the surface roughness of polished surface is significantly smaller than the figure after irradiationSurface roughness, thus substantially only have the figure after irradiating to be activated, activated metal layer is formed in the figure after only irradiating,Do not deposited substantially on the non-electromagnetism irradiation area of polished surface or adsorbing metal ions.
Preferably, the energy range that polished surface carries out electromagnetic irradiation is 10W~500W, electromagnetic irradiation velocity interval50mm/ seconds~6000mm/ seconds, frequency range are 10KHz~100KHz；Figure after irradiation by electromagnetic irradiation once or onceIt is formed above.It can make it that the line pattern structure that electromagnetic irradiation is formed is more regular, ensure that circuit is more regular smooth, lift circuitRadio-frequency performance.
Then step S5 is performed, is electroplated referring to Fig. 1,6a and 6b, on the figure after the irradiation of activation or changes plating metal-platedLayer 2, circuit is formed, that is, electroplated on line pattern or change plating metal and form the coat of metal 2.Due to the activation gold after activationCategory layer can be only deposited in figure after irradiation, and then can thereon electroplated based on activated metal layer or changed plating metalExtremely it is liable to stick to the patterned surface after irradiation and forms the coat of metal, upper plating is very easy to, without in inorganic material substrate 1Metallic compound or metallic media is set to help to plate.
Preferably, the coat of metal 2 is layers of copper, or, the layers of copper and silver layer successively plated successively, or, successively plate successivelyLayers of copper and nickel dam, or, layers of copper, nickel dam and the layer gold successively plated successively, or, nickel dam, layers of copper and the nickel dam successively plated successively,Or nickel dam, layers of copper and the silver layer successively plated successively, or, nickel dam, layers of copper and the nickel dam successively plated successively, or, successively firstNickel dam, layers of copper, nickel dam and the layer gold plated afterwards.Metal coating surface need not carry out ink for screen printing layer and carry out protective coating, by layers of copper,Nickel dam etc. is played a protective role, and structure and technique are simplified.
The present invention makes circuit thereon using inorganic material as substrate, by being polished to inorganic material substrate 1Processing, its surface roughness is reduced to 1 micron or less than 1 micron, the surface after polishing be not easy to deposit or adsorbing metal fromSon, and during follow-up electromagnetic irradiation execution, the graphics field after irradiation can be modified, and surface roughness greatly increases, therefore non-electricalMagnetic irradiation area and the roughness of the graphics field after laser irradiation form very big difference so that activation and change plating afterwardsAction pane is bigger, thus yield is high, cost-effective without frequently detection replacing liquid medicine, also, the non-electromagnetic irradiation of polished surfaceRegion can be only plated due to not depositing substantially or adsorbing metal ions, during upper plating in figure after irradiation, be not in excessive platingThe problem of, and by activation, activated metal layer can be formed on figure pointedly after irradiation, electroplate thereon or changing platingMetal is extremely liable to stick to the patterned surface after irradiation and forms the coat of metal, without setting metal in inorganic material substrate 1Compound or metallic media help to plate, and reduce impurity to the crystal structure of product and the influence of outward appearance, are especially suitable for makingFor the shell of electronic equipment so that be furnished with circuit simultaneously on shell, while ensure the radio-frequency performance of circuit.
In another embodiment, referring to Fig. 2, step S6 is also included after step s 5：The surface of the coat of metal 2 is carried outPolishing.The surface of the coat of metal 2 reduces surface roughness by chemical polishing or physics polishing, removes metallic bur power and surface is residualMetallic dust is stayed, lifts radio-frequency performance.The other guide of the present embodiment may refer to the description in previous embodiment, herein no longerRepeat.
In yet another embodiment, before the step S3 or after the step S5, in addition to step S7：Macromolecule membranous layer or enhancing harden structure are formed on one or more surfaces of the inorganic material substrate 1.Referring to Fig. 3, stepPerform, can also perform after step s 5 after the step 6 that S7 can be in the aforementioned embodiment.In the table of inorganic material substrate 1Face sets macromolecule membranous layer or enhancing harden structure, can increase the impact strength of inorganic material substrate 1 so that it is as electronicsThe housing of equipment or other when, impact resistance is higher, and mechanical performance is stronger.The other guide of the present embodiment may refer to foregoingDescription in embodiment, will not be repeated here.The macromolecule membranous layer or enhancing harden structure of formation can avoid the figure after irradiationRegion.The macromolecule membranous layer such as protective paint sprayed, enhancing plate can be the high polymer material or fiberboard being glued.
In one embodiment, step S21 is also included between step S2 and step S3：Cleaned by washing process inorganicMaterial substrate 1, to remove the metal ion of polished surface.Avoid the generation of later stage excessive plating.Inorganic material substrate 1 after polishingSurface roughness is low, and remaining superincumbent metal ion can be easy to remove totally by washing, and avoids to follow-up upper platingInfluence.The technique such as can be ultrasonic wave water washing is washed, it is specific unlimited.
In one embodiment, step S22 is also included between the step S2 and step S3：In the inorganic materialThe polished surface of substrate 1 forms organic film or hydrophobic film layer；Or form ratio in the polished surface of the inorganic material substrateThe more smooth and finer and close inorganic film of inorganic material substrate 1.In the present embodiment, in then step S3 is performed, after irradiationFigure the organic film or hydrophobic film layer or inorganic film be removed, rather than the organic film in electromagnetic irradiation region or dredgeWater film or inorganic film retain.During being irradiated in laser and electromagnetic, electromagnetic irradiation region organic film or hydrophobic membraneLayer or inorganic film will be removed clean, and not influence the figure subsequently absorption to metal ion after irradiation, rather than electromagnetism shinesPenetrate organic film or hydrophobic film layer or the inorganic film reservation in region, it is possible to reduce or avoid adsorption of metal ions from being shone in non-electromagnetismPenetrate region.Hydrophobic film layer material can use poly- fluorocarbons and organic siliconresin.
Preferably, inorganic material substrate 1 can be glass material plate, either ceramic material plate or in metal plate orThe substrate that high polymer material plate body surface enamel or low firing enamel are formed.Ceramics and glass product, due to ceramics and glass productSurface higher molecular compound is hard, and is adapted to polishing, is more suitable for making the terminal enclosure for having circuit.
The saw lumber of glass material plate can be nonoxide glass or oxide glass.Specifically, nonoxide glass productKind and negligible amounts, chalcogenide glass, halide glass can be included.Oxide glass can include silicate glass, borateGlass, phosphate glass, quartz glass, vagcor, soda-lime glass, lead silicate glass, alumina silicate glass, borosilicic acidSalt glass, phosphate glass.It is certainly not limited to this.
Preferably, the saw lumber of ceramic material plate is zirconium oxide, aluminum oxide, silicon nitride, carborundum, boron nitride, tin oxide, oxygenA kind of material or several mixing materials in SiClx, magnesia.
Preferably, the saw lumber of ceramic material plate is nano ceramics or ceramic matric composite.Material is more careful, is more easy to throwLight, more solid, appearance consistency is higher.Ceramic matric composite can be several formation of the saw lumber of above-mentioned ceramic material plateComposite construction, but it is also not necessarily limited to this.
Preferably, the dielectric constant of inorganic material substrate 1 is 3.6~100 under 1MHz to 10GHz frequency ranges.
In one embodiment, inorganic material substrate 1 and it is connected as one plate with an at least sheet of metallic material.With nothingMachine material substrate 1 is exemplified by ceramic material, sheet of metallic material and ceramic material substrate can be sintered together, and can also use glueWater can also make metal by together with sheet of metallic material and ceramic material substrate bonding in four corners of ceramic material substrateMaterial structure (size is unlimited), improve impact resistance.Integral plate is more suitable for antenna traces being made in terminal thereonDevice housings, space and parts can be saved.
Referring to Fig. 4,5a, 5b, 6a and 6b, in one embodiment, circuit structure includes：With an at least polished surfaceInorganic material substrate；Pass through electromagnetism formed with line pattern, the line pattern on the polished surface of the inorganic material substrateIrradiation is formed；And form the coat of metal on the line pattern.Circuit of the coat of metal as circuit structure.
The inorganic material substrate 1 has certain stereochemical structure, thus gas, liquid inorganic material are clearly to be not suitable for systemInto substrate, in other words the inorganic material substrate 1 of the present embodiment is made up of solid inorganic material.
The polished surface of inorganic material substrate 1 can be formed by glossing.Such as the inorganic material base shown in Fig. 4Plate 1, it is processed by shot blasting in the upper surface of inorganic material substrate 1, naturally it is also possible to by other surfaces also together polishing.ThrowLight processing can be physics polishing or chemical polishing, and specific glossing is unlimited, as long as can be by the inorganic material substrate 1 of cooperationSurface polishes, and reduces surface roughness.The surface roughness of polished surface preferably can be at 1 micron or less than 1 micron, shouldPolished surface under surface roughness is not easy deposition or adsorbing metal ions.
Electromagnetic irradiation technique is existing process, electromagnetic irradiation can be realized using existing electromagnetic irradiation device, after irradiationFigure depending on circuit shape to be formed, depend on the needs, it is specific unlimited.
Polished surface is corrupted such that the roughness shape of electromagnetic irradiation region and non-electromagnetism irradiation area after electromagnetic irradiationInto very big difference, in other words, the roughness in electromagnetic irradiation region can greatly increase compared to polished surface, be advantageous to circuitThe upper plating of the coat of metal 2 in figure 11, the impurity that plates is reduced on helping to the crystal structure of product and the influence of outward appearance, especiallyIt is suitable as the shell of electronic equipment so that be furnished with circuit simultaneously on shell, while ensure the radio-frequency performance of circuit；And polishingDo not deposited substantially on the non-electromagnetism irradiation area on surface or adsorbing metal ions, avoid plating problem of overflowing, yield is improved, without frequentIt is cost-effective that liquid medicine is changed in detection.
Organic film or hydrophobic film layer are formed in the logicalnot circuit graphics field of the polished surface of the inorganic material substrate 1；Or the inorganic material substrate 1 polished surface logicalnot circuit graphics field formed it is more smooth than inorganic material substrate 1 andFiner and close inorganic film.During being irradiated in laser and electromagnetic, electromagnetic irradiation region organic film or hydrophobic film layer orInorganic film will be removed clean, and not influence the figure subsequently absorption to metal ion after irradiation, rather than electromagnetic irradiation areaThe organic film or hydrophobic film layer or inorganic film in domain retain, it is possible to reduce or adsorption of metal ions is avoided in non-electromagnetism irradiated regionDomain.
In one embodiment, on one or more surfaces of the inorganic material substrate 1 formed with the coat of metal 2Upper formation macromolecule membranous layer or enhancing harden structure (not shown).The surface of inorganic material substrate 1 set macromolecule membranous layer orStrengthen harden structure, the impact strength of inorganic material substrate can be increased so that it is as the housing of electronic equipment or other knotsDuring structure, impact resistance is higher, and mechanical performance is stronger.Macromolecule membranous layer or enhancing harden structure can be formed in organic film or dredgedOn water film or inorganic film and the coat of metal, it can also be formed on polished surface and the coat of metal.
Preferably, inorganic material substrate 1 can be glass material plate, either ceramic material plate or in metal plate orThe substrate that high polymer material plate body surface enamel or low firing enamel are formed.Ceramics and glass product, due to ceramics and glass productSurface higher molecular compound is hard, and is adapted to polishing, is more suitable for making the terminal enclosure for having circuit.
The saw lumber of glass material plate can be nonoxide glass or oxide glass.Specifically, nonoxide glass productKind and negligible amounts, chalcogenide glass, halide glass can be included.Oxide glass can include silicate glass, borateGlass, phosphate glass, quartz glass, vagcor, soda-lime glass, lead silicate glass, alumina silicate glass, borosilicic acidSalt glass, phosphate glass.It is certainly not limited to this.
Preferably, the saw lumber of ceramic material plate is zirconium oxide, aluminum oxide, silicon nitride, carborundum, boron nitride, tin oxide, oxygenA kind of material or several mixing materials in SiClx, magnesia.
Preferably, the saw lumber of ceramic material plate is nano ceramics or ceramic matric composite.Material is more careful, is more easy to throwLight, more solid, appearance consistency is higher.Ceramic matric composite can be several formation of the saw lumber of above-mentioned ceramic material plateComposite construction, but it is also not necessarily limited to this.
Preferably, the dielectric constant of inorganic material substrate 1 is 3.6~100.
Preferably, the coat of metal is layers of copper, or, the layers of copper and silver layer successively plated successively, or, the copper successively plated successivelyLayer and nickel dam, or, layers of copper, nickel dam and the layer gold successively plated successively, or, nickel dam, layers of copper and the nickel dam successively plated successively, orPerson, nickel dam, layers of copper and the silver layer successively plated successively, or, nickel dam, layers of copper and the nickel dam successively plated successively, or, successively successivelyNickel dam, layers of copper, nickel dam and the layer gold of plating.Metal coating surface need not carry out ink for screen printing layer and carry out protective coating, pass through layers of copper, nickelLayer etc. is played a protective role, and structure and technique are simplified.
In one embodiment, inorganic material substrate 1 and it is connected as one plate with an at least sheet of metallic material.With nothingMachine material substrate is exemplified by ceramic material, sheet of metallic material and ceramic material substrate can be sintered together, and can also use glueWater can also make metal by together with sheet of metallic material and ceramic material substrate bonding in four corners of ceramic material substrateMaterial structure (size is unlimited), improve impact resistance.Integral plate is more suitable for antenna traces being made in terminal thereonDevice housings, space and parts can be saved.
Particular content on the circuit structure of the embodiment of the present invention may refer to aforementioned circuit construction manufacturing method partDetailed description, circuit structure can be fabricated by the circuit structure preparation method of previous embodiment, herein no longerRepeat.
Although the present invention is disclosed as above with preferred embodiment, it is not for limiting claim, any this areaTechnical staff without departing from the spirit and scope of the present invention, can make possible variation and modification, therefore the present inventionProtection domain should be defined by the scope that the claims in the present invention are defined.