The content of the invention
In view of this, it is necessary to provide it is a kind of new without conductive line surfaces electro-plating method, to solve the above problems.
In addition, it there is a need to circuit board made from a kind of above-mentioned no conductive line surfaces electro-plating method of application of offer.
Without conductive line surfaces electro-plating method, it comprises the following steps one kind：
Step S1：An initial circuit plate is provided, the initial circuit plate includes base material and is incorporated into the two of opposite two surface of the base materialIndividual conductive circuit layer, there is via hole on the initial circuit plate, described two conductive circuit layers are electrically connected by the via hole, oftenOne conductive circuit layer is mainly formed by conducting wire, has an at least gap between the conducting wire of each conductive circuit layer, shouldThe bottom surface in gap is the surface of the base material；
Step S2：Conducting polymer film is formed on the bottom surface in the gap, the conducting wire of the gap both sides passes through the conductionPolymeric membrane is electrically connected with；
Step S3：Photoresist layer is formed in the remote substrate surface of the conductive circuit layer and conducting polymer film；
Step S4：An at least electroplating bath is formed on the photoresist layer；
Step S5：The electro-cladding in the electroplating bath；
Step S6：The photoresist layer is removed, the surface for the conductive circuit layer for making to be covered by photoresist layer, the table of conducting polymer filmFace and the surface exposure of coat of metal；
Step S7：The conducting polymer film is removed, the surface for the base material for making to be covered by conducting polymer film, conductive circuit layerThe side in gap and the surface exposure of coat of metal.
A kind of circuit board, it includes base material and is incorporated into two conductive circuit layers on opposite two surface of the base material, eachConductive circuit layer is mainly formed by conducting wire, has an at least gap between the conducting wire of each conductive circuit layer, between being somebody's turn to doGap has a bottom surface and at least two sides being connected with the bottom surface, and the bottom surface is the surface of base material, and the circuit board is also included extremelyA few coat of metal, the coat of metal include a Part I and extend the Part II formed by the Part I, shouldPart I is incorporated on the surface of remote base material of the conductive circuit layer, and the Part II is incorporated in the neighbouring of the gapOn the side of the Part I, there is a certain distance between the end of the adjacent base material of the Part II and base material.
The no conductive line surfaces electro-plating method is used by being formed on the base material exposed by gap of conductive circuit layerConducting polymer film, plating conducting is realized using the conducting polymer film, again leads this after plating forms coat of metalElectric polymeric membrane removes.It is required when realizing that plating turns on using electroplate lead wire compared to routine that electroplate lead wire is rushedThe processing procedure and electroplate lead wire cut are ultimately remained on circuit board, and conducting polymer film of the invention need not be punched processing procedure and simplifyMaking programme, and conducting polymer film eventually removes from circuit board and improves the space availability ratio of circuit board.In addition, compareIn realizing circuit turn-on using electroplate lead wire, conducting polymer film of the invention does not need the metal material of use electroplate lead wireMaterial and it is cost-effective.
Embodiment
Please refer to Fig. 1 ~ 7, better embodiment of the present invention provide a kind of circuit board without conductive line surfaces electro-plating method,It comprises the following steps：
Step S1, referring to Fig. 1, providing an initial circuit plate 10.The initial circuit plate 10 includes base material 11 and is incorporated into the baseTwo conductive circuit layers 12 on opposite two surface of material 11.There is via hole on the initial circuit plate 10（It is not shown）, it is described twoConductive circuit layer 12 is electrically connected by the via hole.Each conductive circuit layer 12 is mainly formed by conducting wire 120.Each conductionThere is an at least gap 13 between the conducting wire 120 of line layer 12.
The gap 13 has a bottom surface 131 and at least two sides 132 being connected with the bottom surface 131.The bottom in the gap 13Face 131 is the surface of base material 11, and in other words, base material 11 is exposed by the gap 13.
The material of the base material 11 can be the material for the base material that polyimides etc. is conventionally applied to circuit board.
Each conductive circuit layer 12 includes one or more layers.In the present embodiment, the conductive circuit layer 12 includes knotFirst layer 121 together in the surface of base material 11 and be incorporated into the first layer 121 remote base material 11 surface the second layer 122.The first layer 121 is formed on the surface of base material 11 by the method for chemical plating.The second layer 122 is formed by electric plating methodOn the surface of first layer 121.
Step S2, further referring to Fig. 2, conducting polymer film 14 is formed on the bottom surface 131 in the gap 13.This is ledThe whole bottom surface 131 of the electric coverage gap 13 of polymeric membrane 14.The conducting polymer film 14 and the conducting wire 120 of the both sides of gap 13Directly contact and be electrically connected with, in other words, the conducting wire 120 of the both sides of gap 13 is electrically connected by the conducting polymer film 14Connect.
The material of the conducting polymer film 14 can be polyaniline, polypyrrole, polythiophene, the derivative of aniline, pyrrolesThe polymer of derivative or thiophene derivant.Such as poly- 3,4-ethylene dioxythiophene or poly- 2,5- dimethoxies aniline etc..
The thickness of the conducting polymer film 14 is less than the thickness of conductive circuit layer 12.Preferably, the conducting polymerThe thickness of film 14 is 1 ~ 1000nm.
The forming step of the conducting polymer film 14 includes：
Step S21, one layer of fine and close MnO is formed on the surface of base material 112（Manganese dioxide）Film（It is not shown）.
Specifically, using containing MnO4（MnO4-）Oxidizing solution oxygen is carried out to exposed base material 11 in gap 13Change, to form the MnO on the surface of base material 112Film.
The oxidizing solution containing MnO4 can be permanganate and boric acid（HBO3）Mixture.Wherein,The permanganate can be potassium permanganate（KMn4）, sodium permanganate（NaMn4）, high manganese lithium（LiMn4）Etc. soluble permanganic acidSalt.It should be understood that the boric acid can use hydrochloric acid, nitric acid etc. to replace.
The reaction mechanism that the oxidizing solution containing MnO4 is aoxidized to base material 11 exposed in gap 13For：3（CH）+5 MnO4-+5H+→3CO2+5MnO2+4HO2.Wherein,（CH）From base material 11.
Step S22, there is provided the mixed liquor of electroconductive polymer monomer and acid solution, by the mixed liquor coated in describedMnO2The surface of film.Under the catalytic action of manganese dioxide, the electroconductive polymer monomer polymerize, so as in base material 11Surface forms conducting polymer film 14.
The electroconductive polymer monomer is the conductive monomer of the macromolecule formed after polymerizeing.Electroconductive polymerMonomer is usually liquid.The electroconductive polymer monomer is specifically as follows aniline, pyrroles or thiophene etc., or anilineDerivative, azole derivatives or thiophene derivant etc., such as 3,4- ethylenedioxy thiophenes, 2,5- dimethoxy aniline etc..Preferably3,4- ethylenedioxy thiophenes.
The acid solution can be the conventional use of acid solutions such as sulfuric acid, nitric acid, hydrochloric acid.
It should be understood that can also be by spraying, printing or the method for chemical deposition conducting polymer composite is in base material 11Surface form the conducting polymer film 14.The conducting polymer composite can be polyaniline, polypyrrole, polythiophene, anilineDerivative, the polymer of azole derivatives or thiophene derivant.Such as poly- 3,4-ethylene dioxythiophene or poly- 2,5- diformazansOxygen aniline etc..
Step S3, further referring to Fig. 3, light is formed on the surface of the conductive circuit layer 12 and conducting polymer film 14Resistance layer 15.The photoresist layer 15 is incorporated in the surface of the remote base material 11 of conductive circuit layer 12 and conducting polymer film 14 and filled in instituteState in gap 13.
The material of the photoresist layer 15 is photosensitive dry film or photosensitive-ink.
Step S4, further referring to Fig. 4, exposure imaging, to form an at least electroplating bath on the photoresist layer 15151。
The electroplating bath 151 is stepped ramp type groove.The electroplating bath 151 includes the first plating recess 1511 and second and electroplates recess1512.The bottom surface of the first plating recess 1511 is the surface of the remote base material 11 of conductive circuit layer 12.The second plating recess1512 bottom surface for conducting polymer film 14 remote base material 11 surface, this second plating recess 1512 wherein one side andThe side 132 of the neighbouring first plating recess 1511 in gap 13 overlaps, and the another side of the second plating recess 1512 is located atBetween the relative side 132 in 13 two, gap.
Step S5, further referring to Fig. 5, the electro-cladding 16 in the electroplating bath 151 is now, conductive highMolecular film 14 is used to electric current required when electroplating being passed in circuit board.
The substantially L-type of coat of metal 16.The coat of metal 16 includes being incorporated in the bottom of the first plating recess 1511The Part I 161 in face and the Part II 162 formed in the described second plating recess 1512.The Part II 162 and instituteConducting polymer film 14 is stated to be in contact.
The thickness of the Part II 162 of the coat of metal 16 is less than or equal to the width of the described second plating recess 1512The half of degree.
The material of the coat of metal 16 can be to be conventionally applied to the metals such as gold, the nickel of circuit board.The metal is protectedThe material of sheath 16 can be to be conventionally applied to the metal alloys such as the nickel billon of circuit board.
Step S6, further referring to Fig. 6, the photoresist layer 15 is removed, so that the conductor wire covered by photoresist layer 15The surface exposure on the surface of road floor 12, the surface of conducting polymer film 14 and coat of metal 16.
The method for removing photoresist layer 15 is to be conventionally applied to the method that circuit board removes photoresist layer.
Step S7, further referring to Fig. 7, the conducting polymer film 14 is removed, makes to be covered by conducting polymer film 14The surface exposure on the surface of the base material 11 of lid, the side in the gap 13 of conductive circuit layer 12 and coat of metal 16, circuit is madePlate 100.
Because the conducting polymer film 14 is eventually removed, therefore the end of the adjacent base material 11 of the Part II 162There is a certain distance between base material 11.The distance preferably 1 ~ 1000nm.
The method of the removal conducting polymer film 14 is the method for the surface decontamination for being conventionally applied to circuit board.
It is conductive removing when the surface of base material 11 is formed with manganese dioxide film before conducting polymer film 14 is formedDuring polymeric membrane 14, the manganese dioxide film is also removed simultaneously.
It should be understood that after the conducting polymer film 14 and manganese dioxide film is removed, can also continue to lead describedIncreasing layer, and repeating said steps S1 ~ S7 are carried out on electric line layer 12, so that the circuit board of more layers is made.
A kind of circuit board 100, it is used for the electronic installations such as computer, mobile phone, intelligent watch, electronic reader（It is not shown）In.The circuit board 100 includes base material 11 and is incorporated into two conductive circuit layers 12 on opposite two surface of the base material 11.It is each to leadElectric line layer 12 is mainly formed by conducting wire 120, is had between the conducting wire 120 of each conductive circuit layer 12 between at least oneGap 13.The gap 13 has a bottom surface 131 and at least two sides 132 being connected with the bottom surface 131.The bottom surface 131 is base material11 surface.
The circuit board 100 also includes an at least coat of metal 16.The substantially L-type of coat of metal 16.The metalProtective layer 16 includes Part I 161 and extends the Part II 162 formed by the Part I 161.The knot of Part I 161Close on the surface of the remote base material 11 of the conductive circuit layer 12, the Part II 162 is incorporated in the neighbouring of the gap 13On the side 132 of the Part I 161.Have one between the end of the adjacent base material 11 of the Part II 162 and base material 11Fixed distance.The distance preferably 1 ~ 1000nm.
Do not include electroplate lead wire in the circuit board 100, can effectively save the space of circuit board 100, improve circuitThe space availability ratio of plate 100.
It should be understood that the circuit board 100 can be flexible PCB, high density interconnecting circuit board（HDI）, rigid-flexible knotPlywood（Rigid-Flex）Or IC support plates.
The present invention's passes through the base material 11 exposed by gap 13 in conductive circuit layer 12 without conductive line surfaces electro-plating methodUpper formation conducting polymer film 14, plating conducting is realized using the conducting polymer film 14, coat of metal 16 is formed in platingThe conducting polymer film 14 is removed again afterwards.Compared to pair required when realizing that plating turns on using electroplate lead wire of routineThe processing procedure and electroplate lead wire that electroplate lead wire is punched out are ultimately remained on circuit board, and conducting polymer film 14 of the invention is not required toCommunications centre cutting journey and simplify Making programme, and conducting polymer film 14 eventually removes from circuit board and improves the sky of circuit boardBetween utilization rate.In addition, realizing circuit turn-on compared to using electroplate lead wire, conducting polymer film 14 of the invention need not useMake the metal material of electroplate lead wire and cost-effective.
In addition, for the person of ordinary skill of the art, it can be made with technique according to the invention design other eachIt is kind corresponding to change and deformation, and all these changes and deformation should all belong to the protection domain of the claims in the present invention.