Movatterモバイル変換


[0]ホーム

URL:


CN107765168A - A kind of test point adding method of high-speed-differential cabling - Google Patents

A kind of test point adding method of high-speed-differential cabling
Download PDF

Info

Publication number
CN107765168A
CN107765168ACN201710967042.6ACN201710967042ACN107765168ACN 107765168 ACN107765168 ACN 107765168ACN 201710967042 ACN201710967042 ACN 201710967042ACN 107765168 ACN107765168 ACN 107765168A
Authority
CN
China
Prior art keywords
test point
pad
speed
circular pad
differential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710967042.6A
Other languages
Chinese (zh)
Inventor
武宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhengzhou Yunhai Information Technology Co Ltd
Original Assignee
Zhengzhou Yunhai Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhengzhou Yunhai Information Technology Co LtdfiledCriticalZhengzhou Yunhai Information Technology Co Ltd
Priority to CN201710967042.6ApriorityCriticalpatent/CN107765168A/en
Publication of CN107765168ApublicationCriticalpatent/CN107765168A/en
Pendinglegal-statusCriticalCurrent

Links

Landscapes

Abstract

Translated fromChinese

本发明提供一种高速差分走线的测试点添加方法,包括如下步骤:1.在每根高速差分走线上添加圆形焊盘pad作为测试点;2.在圆形焊盘pad测试点的相邻地层GND上挖铜箔,挖铜箔的尺寸为沿着圆形焊盘pad边沿向外延伸设定距离后形成的圆形的尺寸;3.模拟仿真验证添加圆形焊盘pad测试点及在圆形焊盘pad测试点的相邻地层GND上挖铜箔对高速差分走线传输损耗的影响。本发明采用圆形焊盘pad测试点,增大了测试探针与高速差分信号线的接触面积,降低了生产测试的难度和费用,提高了后期板卡生产测试的时效性;在圆形焊盘pad测试点的相邻地层上挖铜箔,缩小了单纯增大测试点对高速差分走线传输损耗的影响。

The present invention provides a kind of test point adding method of high-speed differential routing, comprising the following steps: 1. Adding a circular pad as a test point on each high-speed differential routing; 2. Adding a circular pad to the test point Dig the copper foil on the GND of the adjacent stratum, and the size of the copper foil is the size of the circle formed by extending the set distance along the edge of the circular pad; 3. Simulation verification to add a circular pad test point And the impact of digging copper foil on the adjacent ground layer GND of the circular pad pad test point on the transmission loss of high-speed differential wiring. The present invention adopts the circular pad test point, which increases the contact area between the test probe and the high-speed differential signal line, reduces the difficulty and cost of production test, and improves the timeliness of the later board production test; The copper foil is dug on the adjacent ground of the pad test point, which reduces the influence of simply increasing the test point on the transmission loss of the high-speed differential line.

Description

A kind of test point adding method of high-speed-differential cabling
Technical field
The invention belongs to server board testing field, and in particular to a kind of test point addition side of high-speed-differential cablingMethod.
Background technology
ICT, is in circuit tester abbreviation, In-circiut tester.
Pad, pad.
With the high speed development of electronics technology, I/O interface function is intended to the high densification direction hair of high speed on server master boardExhibition, the lifting of signal rate, the diminution of pcb board card structure area and the complexity lifting of plate level signal interconnection etc. all can be to heightFast signal transmission quality has an impact.Thus, the personnel of designing and developing will utilize signal integrity theoretical, select electrical property betterSheet material reduce signal transmission attenuation, or designed using homogeneous stack to reduce between each high speed cabling of same interlayer wiringCoupling crosstalk, or by reducing the resistance between PCB and connector and bga chip to pcb board impedance value optimum choiceIt is anti-discontinuous, it is used for lifting signal quality of the high speed signal in complicated link transmission with upper type.
Then, when board PCB is produced, each short open circuit production abnormal problem of board is controllable when being produced in batches for guaranteeProperty, the fraction defective of board is reduced, generally in the board design phase, ICT test designs is imported, i.e., increase on pcb board card and surveyPilot, usually require that it tests dot coverage more than 90%, thus, it can all increase survey on nearly all high speed cabling on mainboardPilot.
Influence of the geomery of test point to high speed cabling is considered in increase test point, typically with low speed cablingIncrease a diameter of 30mil circular Pad as test point, and high speed cabling is increased as routing line width, length is20mil test rectangle pad is as test point, so test spot size is similar with high speed cabling on high speed cabling, such as Fig. 1 institutesShow.The rectangular pads pad similar to high speed cabling is relatively small as transmission loss influence of the test point on high speed cabling, soIn the exploitation of high speed board, when especially requiring stricter to high-speed transmission line loss, such a test point addition manner is often extensiveUse.
But when carrying out test point addition using prior art, the test spot size on high speed cabling is smaller, surveysProbe header is not easy to contact with test point, increases difficulty of test, when pcb board card volume production is tested, brings testing time increaseAnd the risk of testing expense lifting.
This is the deficiencies in the prior art, therefore, for drawbacks described above of the prior art, there is provided a kind of high-speed-differential cablingTest point adding method, be necessary.
The content of the invention
It is an object of the present invention to for test point adding method on above-mentioned existing high speed cabling test probe is not easyThe defects of being contacted with test point, there is provided a kind of test point adding method of high-speed-differential cabling, to solve above-mentioned technical problem.
To achieve the above object, the present invention provides following technical scheme:
A kind of test point adding method of high-speed-differential cabling, comprises the following steps:
Step 1. adds circular pad pad as test point on every high-speed-differential cabling;
Step 2. digs copper foil on the adjacent earth formations GND of circular pad pad test points, and the size for digging copper foil is along circular padPad edges stretch out the circular size formed after setpoint distance.
Further, also comprise the following steps after step 2:
Step 3. analog simulation checking addition circular pad pad test points and the adjacent earth formations GND in circular pad pad test pointsThe upper influence for digging copper foil to high-speed-differential cabling transmission loss.
Specifically, before and after contrast addition circular pad pad test points, the transmission loss on high-speed-differential cabling;
Contrast is dug before and after copper foil on the adjacent earth formations GND of circular pad pad test points, the transmission damage on high-speed-differential cablingConsumption;
It is circular with being added on high-speed-differential cabling after contrast digs copper foil on the adjacent earth formations GND of circular pad pad test pointsBefore pad pad test points, the transmission loss on high-speed-differential cabling.
Further, 30mil circular pads pad is added in step 1 on every high-speed-differential cabling as test point.
Further, the setpoint distance in step 2 is 3mil.
Further, circular pad pad test points are symmetrically added in step 1 on every high-speed-differential cabling.
Further, two difference cablings are parallel to each other in step 1, and circular pad pad test points are centrally disposed in differenceDivide on the outside of cabling.
Further, two difference cablings are provided with the reserved location of circular pad pad test points, circle weldering in step 1Disk pad test points are arranged on reserved location.
Further, the reserved location on two difference cablings is oppositely arranged, circular pad pad test points it is centrally disposedOn difference cabling.
Further, the reserved location on two difference cablings is staggered, circular pad pad test points it is centrally disposedOn difference cabling.
Further, circular pad pad test points are centrally disposed in that to leave the difference cabling of reserved location for it relativeDifference cabling on.
The beneficial effects of the present invention are:
The present invention uses circular pad pad test points, increases the contact area of test probe and high-speed-differential cabling, not only dropsThe low difficulty of production test, also reduces the expense of production test, improves the ageing of later stage board production test;TogetherWhen, copper foil is dug on the adjacent earth formations GND of circular pad pad test points, simple increase test point is reduced and high-speed-differential is walkedThe influence of line transmission loss.
In addition, design principle of the present invention is reliable, and it is simple in construction, there is very extensive application prospect.
As can be seen here, the present invention is compared with prior art, with prominent substantive distinguishing features and significantly progressive, its implementationBeneficial effect be also obvious.
Brief description of the drawings
Fig. 1 is the schematic diagram of test point of the increase as feature sizes on high-speed-differential cabling in the prior art;
Fig. 2 is flow chart of the method for the present invention;
Fig. 3 is that circular pad pad test point schematic diagrames are added in embodiment 1;
Fig. 4 is that circular pad pad test points schematic diagram 1 is added in embodiment 2;
Fig. 5 is that circular pad pad test points schematic diagram 2 is added in embodiment 2;
Fig. 6 is that circular pad pad test point schematic diagrames are added in embodiment 3;
Fig. 7 is the schematic diagram 1 that copper foil is dug on the adjacent earth formations GND of circular pad pad test points;
Fig. 8 is the schematic diagram 2 that copper foil is dug on the adjacent earth formations GND of circular pad pad test points;
Fig. 9 is before and after embodiment 1, embodiment 2 and embodiment 3 add circular pad pad test points, is believed in the high speed of different frequencyUnder number, the transmission loss on high-speed-differential cabling;
Figure 10 be embodiment 1 add before circular pad pad test points with the adjacent earth formations GND in circular pad pad test pointsIt is upper dig different size copper foils after, the transmission loss schematic diagram on high-speed-differential cabling;
Figure 11 be embodiment 1 under 10GHZ high speed signal frequency, dug on the adjacent earth formations GND of circular pad pad test pointsAfter different size copper foils, the transmission loss schematic diagram on high-speed-differential cabling;
Figure 12 be embodiment 2 add before circular pad pad test points with the adjacent earth formations GND in circular pad pad test pointsIt is upper dig different size copper foils after, the transmission loss schematic diagram on high-speed-differential cabling;
Figure 13 be embodiment 2 under 10GHZ high speed signal frequency, dug on the adjacent earth formations GND of circular pad pad test pointsAfter different size copper foils, the transmission loss schematic diagram on high-speed-differential cabling;
Figure 14 be embodiment 3 add before circular pad pad test points with the adjacent earth formations GND in circular pad pad test pointsIt is upper dig different size copper foils after, the transmission loss schematic diagram on high-speed-differential cabling;
Figure 15 be embodiment 3 under 10GHZ high speed signal frequency, dug on the adjacent earth formations GND of circular pad pad test pointsAfter different size copper foils, the transmission loss schematic diagram on high-speed-differential cabling.
Embodiment:
To enable the purpose of the present invention, feature, advantage more obvious and understandable, it is embodied below in conjunction with the present inventionAccompanying drawing in example, the technical scheme in the present invention is clearly and completely described.
As shown in Fig. 2 the present invention provides a kind of test point adding method of high-speed-differential cabling, comprise the following steps:
Step 1. adds circular pad pad as test point on every high-speed-differential cabling;On every high-speed-differential cabling30mil circular pad pad is added as test point;
Step 2. digs copper foil on the adjacent earth formations GND of circular pad pad test points, as shown in Figure 7 and Figure 8, digs the chi of copper foilVery little is the circular size formed after stretching out setpoint distance along circular pad pad edges;Setpoint distance is 3mil;
Step 3. analog simulation checking addition circular pad pad test points and the adjacent earth formations GND in circular pad pad test pointsThe upper influence for digging copper foil to high-speed-differential cabling transmission loss;
Specifically, before and after contrast addition circular pad pad test points, the transmission loss on high-speed-differential cabling;
Contrast is dug before and after copper foil on the adjacent earth formations GND of circular pad pad test points, the transmission damage on high-speed-differential cablingConsumption;
Contrast is dug after copper foil on the adjacent earth formations GND of circular pad pad test points with adding circle on high-speed-differential cablingBefore pad pad test points, the transmission loss on high-speed-differential cabling.
In above-described embodiment, 30mil circular pad pad test points are symmetrically added on every high-speed-differential cabling;
Embodiment 1 as shown in figure 3, two difference cablings are parallel to each other, walk by the difference that is centrally disposed in of circular pad pad test pointsOn the outside of line;
As shown in Figure 4 and Figure 5, two difference cablings are provided with the reserved location of circular pad pad test points to embodiment 2, circularPad pad test points are arranged on reserved location;Reserved location on two difference cablings is oppositely arranged, circular pad pad testsPoint is centrally disposed on difference cabling;
Embodiment 3 is as shown in fig. 6, two difference cablings are provided with the reserved location of circular pad pad test points, circular padPad test points are arranged on reserved location;Reserved location on two difference cablings is staggered, circular pad pad test pointsIt is centrally disposed in and is left for it on the relative difference cabling of the difference cabling of reserved location;
Analog simulation checking adds circular pad pad test points and digs copper on the adjacent earth formations GND of circular pad pad test pointsInfluence of the paper tinsel to high-speed-differential cabling transmission loss;
Specifically, as shown in figure 9, before and after contrast addition circular pad pad test points, the transmission loss on high-speed-differential cabling;Under 10GHZ high speed signal frequency, transmission line loss is before addition test point on high-speed-differential cabling in embodiment 11.06dB, transmission line loss is 2.23dB after 30mil circular pad pad test points are added on high-speed-differential cabling;Under 10GHZ high speed signal frequency, transmission line loss is before addition test point on high-speed-differential cabling in embodiment 20.97dB, transmission line loss is 1.97dB after 30mil circular pad pad test points are added on high-speed-differential cabling;Under 10GHZ high speed signal frequency, transmission line loss is before addition test point on high-speed-differential cabling in embodiment 30.95dB, transmission line loss is 1.76dB after 30mil circular pad pad test points are added on high-speed-differential cabling;
Contrast is dug before and after copper foil on the adjacent earth formations GND of circular pad pad test points, the transmission damage on high-speed-differential cablingConsumption;
It is circular with being added on high-speed-differential cabling after contrast digs copper foil on the adjacent earth formations GND of circular pad pad test pointsBefore pad pad test points, the transmission loss on high-speed-differential cabling;
As shown in Figure 10 and Figure 11, add and survey on high-speed-differential cabling under 10GHZ high speed signal frequency, in embodiment 1Transmission loss before pilot is 1.06dB, after adding 30mil circular pads on high-speed-differential cabling, in circular pad padThe transmission loss dug on the adjacent earth formations GND of test point after different size copper foils, the size for digging copper foil is circular pad pad chiWhen very little, the transmission loss on high-speed-differential cabling is 1.51dB;The size for digging copper foil is inwardly to prolong along circular pad pad edgesStretch the circular size formed after 3mil, the transmission loss on high-speed-differential cabling is 1.65dB, the size for digging copper foil be alongCircular pad pad edges stretch out the circular size formed after 1.5mil, and the transmission loss on high-speed-differential cabling isAfter 1.29dB, the 2.5mil that stretches out, transmission loss is 1.25 dB, and stretch out 3mil, 3.5mil, 4mil, 5mil, 6mil,When 6.5mil, 7mil, 8mil, 9mil, respectively corresponding to transmission loss be 1.22dB, 1.25dB, 1.26dB, 1.26dB,1.43dB, 4.77dB, 4.87dB, 5.16dB, 5.58dB;
As shown in Figure 12 and Figure 13, add and survey on high-speed-differential cabling under 10GHZ high speed signal frequency, in embodiment 2Transmission loss before pilot is 0.97dB, after adding 30mil circular pads on high-speed-differential cabling, in circular pad padThe transmission loss dug on the adjacent earth formations GND of test point after different size copper foils, the size for digging copper foil is circular pad pad chiWhen very little, the transmission loss on high-speed-differential cabling is 1.20 dB;The size for digging copper foil is inside along circular pad pad edgesThe circular size that is formed after extension 3mil, the transmission loss on high-speed-differential cabling is 1.47dB, and the size for digging copper foil is edgeCircular pad pad edges to stretch out the circular size formed after 1.5mil, the transmission loss on high-speed-differential cabling isAfter 1.10 dB, the 2.5mil that stretches out, transmission loss 1.07dB, stretch out 3mil, 3.5mil, 4mil, 5mil, 6mil,When 6.5mil, 7mil, 8mil, 9mil, respectively corresponding to transmission loss be 1.06dB, 1.06 dB, 1.12dB, 1.13dB,1.21dB, 3.49dB, 3.54dB, 3.99dB, 4.12dB;
As shown in Figure 14 and Figure 15, add and survey on high-speed-differential cabling under 10GHZ high speed signal frequency, in embodiment 3Transmission loss before pilot is 0.95dB, after adding 30mil circular pads on high-speed-differential cabling, in circular pad padThe transmission loss dug on the adjacent earth formations GND of test point after different size copper foils, the size for digging copper foil is circular pad pad chiWhen very little, the transmission loss on high-speed-differential cabling is 1.11dB;The size for digging copper foil is inwardly to prolong along circular pad pad edgesStretch the circular size formed after 3mil, the transmission loss on high-speed-differential cabling is 1.34dB, the size for digging copper foil be alongCircular pad pad edges stretch out the circular size formed after 1.5mil, and the transmission loss on high-speed-differential cabling isAfter 1.05dB, the 2.5mil that stretches out, transmission loss 1.03dB, stretch out 3mil, 3.5mil, 4mil, 5mil, 6mil,When 6.5mil, 7mil, 8mil, 9mil, respectively corresponding to transmission loss be 1.02dB, 1.04dB, 1.05dB, 1.06dB,1.12dB, 1.13dB, 1.17dB, 1.24dB, 1.29dB.
To sum up, the reserved location of circular pad pad test points is set using mode in embodiment 3 on high-speed-differential cablingTransmission loss influence it is smaller than embodiment 1 and embodiment 3;Copper foil chi is dug on the adjacent earth formations GND of circular pad pad test pointsIt is very little be along circular pad pad edges stretch out 3mil when, the transmission loss rejection ability of high-speed-differential cabling is best.
Embodiments of the invention are illustrative and not restrictive, and above-described embodiment is only to aid in understanding the present invention, becauseThis is every by those skilled in the art's technique according to the invention the invention is not restricted to the embodiment described in embodimentOther embodiments that scheme is drawn, also belong to the scope of protection of the invention.

Claims (10)

Translated fromChinese
1.一种高速差分走线的测试点添加方法,其特征在于,包括如下步骤:1. A test point adding method for high-speed differential routing, characterized in that, comprises the steps:步骤1.在每根高速差分走线上添加圆形焊盘pad作为测试点;Step 1. Add a circular pad as a test point on each high-speed differential trace;步骤2.在圆形焊盘pad测试点的相邻地层GND上挖铜箔,挖铜箔的尺寸为沿着圆形焊盘pad边沿向外延伸设定距离后形成的圆形的尺寸。Step 2. Dig copper foil on the adjacent ground layer GND of the circular pad test point. The size of the copper foil is the size of the circle formed by extending outward along the edge of the circular pad for a set distance.2.如权利要求1所述的一种高速差分走线的测试点添加方法,其特征在于,步骤2之后还包括如下步骤:2. the test point adding method of a kind of high-speed differential routing as claimed in claim 1, is characterized in that, also comprises the following steps after step 2:步骤3.模拟仿真验证添加圆形焊盘pad测试点及在圆形焊盘pad测试点的相邻地层GND上挖铜箔对高速差分走线传输损耗的影响。Step 3. Simulation and verification of the impact of adding a circular pad test point and digging copper foil on the adjacent ground layer GND of the circular pad test point on the transmission loss of the high-speed differential line.3.如权利要求1所述的一种高速差分走线的测试点添加方法,其特征在于,步骤1中在每根高速差分走线上添加30mil圆形焊盘pad作为测试点。3. The test point addition method of a kind of high-speed differential routing as claimed in claim 1, characterized in that, in step 1, a 30mil circular pad is added as a test point on each high-speed differential routing.4.如权利要求1所述的一种高速差分走线的测试点添加方法,其特征在于,步骤2中的设定距离为3mil。4. A method for adding test points for high-speed differential wiring as claimed in claim 1, wherein the set distance in step 2 is 3mil.5.如权利要求1所述的一种高速差分走线的测试点添加方法,其特征在于,步骤1中在每根高速差分走线上对称地添加圆形焊盘pad测试点。5. A method for adding test points for high-speed differential wiring as claimed in claim 1, wherein in step 1, circular pad test points are added symmetrically on each high-speed differential wiring.6.如权利要求5所述的一种高速差分走线的测试点添加方法,其特征在于,步骤1中两根差分走线相互平行,圆形焊盘pad测试点的中心设置在差分走线外侧。6. the test point adding method of a kind of high-speed differential routing as claimed in claim 5 is characterized in that, in step 1, two differential routings are parallel to each other, and the center of the circular pad test point is arranged on the differential routing outside.7.如权利要求5所述的一种高速差分走线的测试点添加方法,其特征在于,步骤1中两根差分走线上设有圆形焊盘pad测试点的预留位置,圆形焊盘pad测试点设置在预留位置。7. the test point adding method of a kind of high-speed differential routing as claimed in claim 5, it is characterized in that, in step 1, two differential routings are provided with the reserved position of circular pad test point, circular The pad test point is set at the reserved position.8.如权利要求7所述的一种高速差分走线的测试点添加方法,其特征在于,两根差分走线上的预留位置相对设置,圆形焊盘pad测试点的中心设置在差分走线上。8. The test point adding method of a kind of high-speed differential routing as claimed in claim 7, is characterized in that, the reserved position on two differential routings is relatively set, and the center of the circular pad test point is set on the differential Go online.9.如权利要求7所述的一种高速差分走线的测试点添加方法,其特征在于,两根差分走线上的预留位置交错设置,圆形焊盘pad测试点的中心设置在差分走线上。9. The test point addition method of a kind of high-speed differential routing as claimed in claim 7, characterized in that, the reserved positions on the two differential routings are arranged alternately, and the center of the circular pad test point is set at the differential Go online.10.如权利要求9所述的一种高速差分走线的测试点添加方法,其特征在于,圆形焊盘pad测试点的中心设置在为其留有预留位置的差分走线相对的差分走线上。10. The test point adding method of a kind of high-speed differential trace as claimed in claim 9, it is characterized in that, the center of the circular pad test point is set at the differential trace relative to the differential trace with a reserved position for it. Go online.
CN201710967042.6A2017-10-172017-10-17A kind of test point adding method of high-speed-differential cablingPendingCN107765168A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN201710967042.6ACN107765168A (en)2017-10-172017-10-17A kind of test point adding method of high-speed-differential cabling

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN201710967042.6ACN107765168A (en)2017-10-172017-10-17A kind of test point adding method of high-speed-differential cabling

Publications (1)

Publication NumberPublication Date
CN107765168Atrue CN107765168A (en)2018-03-06

Family

ID=61269500

Family Applications (1)

Application NumberTitlePriority DateFiling Date
CN201710967042.6APendingCN107765168A (en)2017-10-172017-10-17A kind of test point adding method of high-speed-differential cabling

Country Status (1)

CountryLink
CN (1)CN107765168A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN109270438A (en)*2018-11-012019-01-25郑州云海信息技术有限公司A kind of method and device for testing circuit board
CN112399701A (en)*2020-09-272021-02-23苏州浪潮智能科技有限公司 A signal line for improving return loss characteristics caused by equal length of differential line signals

Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN102196662A (en)*2010-02-232011-09-21弗莱克斯电子有限责任公司Test point design for a high speed bus
CN203015284U (en)*2012-12-212013-06-19广州兴森快捷电路科技有限公司High-speed PCB differential via-hole structure
CN104345189A (en)*2013-08-052015-02-11深圳市共进电子股份有限公司Jig manufacturing method and jig
CN206020613U (en)*2016-08-252017-03-15北京小米移动软件有限公司High speed signal measures pinboard
CN106658953A (en)*2017-03-132017-05-10深圳天珑无线科技有限公司PCB of mobile terminal, and mobile terminal

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN102196662A (en)*2010-02-232011-09-21弗莱克斯电子有限责任公司Test point design for a high speed bus
CN203015284U (en)*2012-12-212013-06-19广州兴森快捷电路科技有限公司High-speed PCB differential via-hole structure
CN104345189A (en)*2013-08-052015-02-11深圳市共进电子股份有限公司Jig manufacturing method and jig
CN206020613U (en)*2016-08-252017-03-15北京小米移动软件有限公司High speed signal measures pinboard
CN106658953A (en)*2017-03-132017-05-10深圳天珑无线科技有限公司PCB of mobile terminal, and mobile terminal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN109270438A (en)*2018-11-012019-01-25郑州云海信息技术有限公司A kind of method and device for testing circuit board
CN112399701A (en)*2020-09-272021-02-23苏州浪潮智能科技有限公司 A signal line for improving return loss characteristics caused by equal length of differential line signals

Similar Documents

PublicationPublication DateTitle
CN101562939B (en)Flexible circuit board
US8013685B2 (en)Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate
US7492146B2 (en)Impedance controlled via structure
CN101406114B (en) Displaced Segment Layout of Differential Signal Traces to Mitigate Beam Weave Effects
KR101602084B1 (en)Concept for extracting a signal being exchanged between a device under test and an automatic test equipment
US20130175077A1 (en)Printed circuit board with reduced cross-talk
US20100282503A1 (en)Multi-layer substrate
WO2015068225A1 (en)Signal transmission circuit and printed circuit board
CN107765168A (en)A kind of test point adding method of high-speed-differential cabling
CN101662882B (en) Transmission hole for high frequency broadband impedance matching
CN103913641A (en)Method for obtaining dielectric constant of PCB materials
CN101861051A (en) flexible circuit board
CN104871654A (en) The structure of the electronic substrate and its joint connection
CN206807859U (en) Printed circuit boards for high-speed transmission
US20090260859A1 (en)Flexible printed circuit board
TWI605736B (en) Loss-resistance structure of a high-frequency signal connection pad of a plug-in assembly
CN101909402A (en) A printed circuit board
CN101557683A (en)Multilayer circuit board
CN104638463A (en)High-speed board-to-board electronic connector and multilayer circuit board assembly
CN103594453B (en)Integrated circuit medium punctures test structure and the method for testing thereof of fail-safe analysis
KR100712169B1 (en)A circuit that taps a differential signal
CN107222970B (en)Multilayer circuit structure
US10129974B2 (en)Multi-layer circuit structure
CN108445299A (en)Insertion loss test strip
CN206759799U (en) A PCB Structure for Improving High-Speed Signal Integrity

Legal Events

DateCodeTitleDescription
PB01Publication
PB01Publication
SE01Entry into force of request for substantive examination
SE01Entry into force of request for substantive examination
RJ01Rejection of invention patent application after publication
RJ01Rejection of invention patent application after publication

Application publication date:20180306


[8]ページ先頭

©2009-2025 Movatter.jp