A99 microwave hybrid integrated circuit ceramic substrates and preparation method thereofTechnical field
The invention belongs to electronic component preparation field, and in particular to A99 microwave hybrid integrated circuits ceramic substrate and itsPreparation method.
Background technology
Ceramic substrate, dielectric layer or protective layer ceramic membrane are typically to be prepared using the tape casting, aqueous tape casting forming techniqueIt is a kind of manufacture craft of now widely used ceramic substrate, aqueous tape casting forming technique is substituted organic molten using water-based solventAgent, because hydrone is polar molecule, and binding agent, plastic agent and dispersant etc. are organic additives, are deposited between hydroneIn consistency problem, therefore in the selection of additive, water solubility need to be selected or stabilized emulsion can be formed in waterOrganic matter should also make dispersant to ensure to obtain the slurry of stable homogeneous on the premise of slurry stable suspersion is ensuredDosage is as far as possible few, at the same ensure biscuit intensity and it is flexible under the premise of use up the dosage of the organic matters such as binding agent, plastic agentIt may lack, it is although cheap using aqueous tape casting forming technique, but it in the selection of raw material, Consideration is more, sortingTroublesome, required agglomerant concentration is high, evaporation rate is low, hydrogen bond causes ceramic powders to be reunited causes flocculation, slurry to join techniqueChange sensitivity is counted, is not easy the fine and close smooth ceramic membrane of molded surface, base substrate combines insufficient, dry easy bubble cracking, fragilityGreatly, flexible deformation, is further improved.
The content of the invention
The purpose of the present invention is the shortcomings that overcoming prior art, there is provided a kind of dielectric loss is small, easy bubble removing, easily driesA99 microwave hybrid integrated circuit ceramic substrates, another object are to provide one kind and prepare above-mentioned A99 microwave hybrid integrated circuits ceramicsThe preparation method of substrate.
The present invention adopts the following technical scheme that：
A99 microwave hybrid integrated circuit ceramic substrates, are prepared by compound and solvent through casting method, the mixingMaterial includes the raw material of following parts by weight：Superfine alumina powder 99.6-99.7 parts of purity more than 99.9%, grain inhibitor0.1-0.3 parts, dispersant 2-3 parts, adhesive 8-10 parts, plasticizer 8-10 parts, wherein grain inhibitor are samarium oxide, oxidationOne or more in yttrium, lanthana.
Further, the dispersant is the one or more in olein, oleic acid, castor oil.
Further, the solvent is the one or more in ethanol or butanone.
Further, described adhesive is polyvinyl butyral resin.
Further, the plasticizer is dibutyl ester.
Further, the granularity of the superfine alumina powder is 0.3-0.5 microns.
Further, the granularity of the samarium oxide and samarium oxide is 0.5-1.0 microns.
The preparation method of A99 microwave hybrid integrated circuit ceramic substrates, comprises the following steps：
(1) it is mixed into after, superfine alumina powder, grain inhibitor, dispersant and plasticizer are weighed by its parts by weightMaterial, by material：Weight of solvent ratio is 100:38-45 is mixed, ball milling 24 hours；
(2), toward addition adhesive in step (1), ball milling 24 hours, slurry is obtained；
(3), the slurry for obtaining step (2) carries out froth in vacuum, and viscosity is adjusted to 10000-30000 Where and moored；
(4), the slurry after step (3) processing is cast, dries ceramic substrate green compact is made；
(5), ceramic substrate green compact made from step (4) are formed by a firing.
Further, the step (3) includes：It is small that slurry after step (2) ball milling is stirred into 0.5-1 in vacuum environmentWhen, bubble is removed, viscosity is adjusted to 10000-30000 Where and moored.
Further, the step (4) includes：Slurry after step (3) processing is delivered to the casting device of casting machineUpper carry out casting film-forming, is then fed into drying chamber, and 2-3 hours are dried at 25-75 DEG C of temperature, ventilation condition, thickness is madeThe ceramic substrate green compact of 0.3-1.5 millimeters.
From the above-mentioned description of this invention, compared with prior art, the beneficial effects of the invention are as follows：
The ceramic substrate prepared using the above method, dielectric loss is small, can effectively improve product quality；
Compound mixes with organic solvent, obtained product, and its drying time is few compared with short and caused bubble, is effectively ensuredProduct purity, surface Ra are enough to general microwave circuit requirement in 0.06um, Full；
In above-mentioned steps, step (1) is that powder is pre-processed, to be effectively reduced powder specific surface area, so as to dropThe viscosity of low slurry, while samarium oxide and yittrium oxide are added, as grain inhibitor, suppress grain growth, so as to improve ceramicsThe rupture strength of piece.Improve unit for electrical property parameters.Reduce dielectric loss.
Embodiment
Below by way of embodiment, the invention will be further described.
Embodiment 1
A99 microwave hybrid integrated circuit ceramic substrates, are prepared by compound and butanone through casting method, the mixingMaterial includes the raw material of following parts by weight：0.1 part of 99.6 parts of superfine alumina powder, the yittrium oxide of purity more than 99.9%, three oil2 parts of acid glyceride, 1 part of castor oil, 8 parts of polyvinyl butyral resin, 10 parts of dibutyl ester；
Wherein, the granularity of superfine alumina powder is 0.3-0.5mm, and the granularity of samarium oxide is 0.5-1.0mm, oxidationThe granularity of yttrium is 0.5-1.0mm；
The preparation method of A99 microwave hybrid integrated circuit ceramic substrates, comprises the following steps：
(1) mixed after, superfine alumina powder, grain inhibitor, olein, castor oil are weighed by its parts by weightSynthesis material, by material：Butanone weight ratio is 100:38 mixing, ball milling 24 hours；
(2), toward addition polyvinyl butyral resin and dibutyl ester in step (1), ball milling 24 hours, slurry is obtained；
(3), the slurry after step (2) ball milling is stirred 1 hour in vacuum environment, remove bubble, viscosity adjust to10000-30000 Where are moored；
(4), the slurry after step (3) processing is delivered to casting film-forming is carried out on the casting device of casting machine, then sentEnter in drying chamber, in 25 DEG C of temperature, dried 3 hours under ventilation condition, the ceramic substrate green compact of thickness 0.3-1.5 millimeters are made；
(5), ceramic substrate green compact made from step (4) are folded up in ceramic substrate same material between haftplatte, foldedIt is placed on load bearing board and is sent into kiln, be warming up to 650 DEG C with 40 DEG C/h speed and kept for 2 hours, excludes organic in green compactThing, then heat to 1600 DEG C and fire 2 hours, be cooled to 200 DEG C, taking out and remove every haftplatte, and diaphragm is carried out to calm down placeReason, thickness 100um or so ceramic substrate is made；
By ceramic substrate obtained above, following performance parameter is obtained by experiment test：
Product purity：≤ 99.63%；
Dielectric loss：2*10-4；
Dielectric constant：9.8±0.2；
By above-mentioned test data, A99 microwave hybrid integrated circuit ceramic substrates, purity are made by the above methodHeight, dielectric loss is small, diaphragm quality is good, and Ra is small, and the matter that ensures product consistency is stable.
Embodiment 2
A99 microwave hybrid integrated circuit ceramic substrates, are prepared by compound and butanone through casting method, the mixingMaterial includes the raw material of following parts by weight：0.1 part of 99.7 parts of superfine alumina powder, the samarium oxide of purity more than 99.9%, oxidation0.2 part of yttrium, 1 part of oleic acid, 1 part of castor oil, 10 parts of polyvinyl butyral resin, 8 parts of dibutyl ester；
Wherein, the granularity of superfine alumina powder is 0.3-0.5mm, and the granularity of samarium oxide is 0.5-1.0mm, oxidationThe granularity of yttrium is 0.5-1.0mm；
The preparation method of A99 microwave hybrid integrated circuit ceramic substrates, comprises the following steps：
(1) mixed after, superfine alumina powder, grain inhibitor, olein, castor oil are weighed by its parts by weightSynthesis material, by material：Butanone weight ratio is 100:45 mixing, ball milling 24 hours；
(2), toward addition polyvinyl butyral resin and dibutyl ester in step (1), ball milling 24 hours, slurry is obtained；
(3), the slurry after step (2) ball milling is stirred 0.5 hour in vacuum environment, remove bubble, viscosity adjust to10000-30000 Where are moored；
(4), the slurry after step (3) processing is delivered to casting film-forming is carried out on the casting device of casting machine, then sentEnter in drying chamber, in 75 DEG C of temperature, dried 2 hours under ventilation condition, the ceramic substrate green compact of thickness 0.3-1.5 millimeters are made；
(5), ceramic substrate green compact made from step (4) are folded up in ceramic substrate same material between haftplatte, foldedIt is placed on load bearing board and is sent into kiln, is warming up to 650 DEG C with 70 DEG C/h speed and is kept for 1.5 hours, exclude having in green compactMachine thing, then heat to 1700 DEG C and fire 1.5 hours, be cooled to 200 DEG C, take out to remove and put down every haftplatte, and to diaphragmMultiple processing, thickness 100um or so ceramic substrate is made
By ceramic substrate obtained above, following performance parameter is obtained by experiment test：
Product purity：≤ 99.65%；
Dielectric loss：2*10-4；
Dielectric constant：9.8±0.2；
By above-mentioned test data, A99 microwave hybrid integrated circuit ceramic substrates, purity are made by the above methodHeight, dielectric loss is small, diaphragm quality is good, and Ra is small, and the matter that ensures product consistency is stable.
Embodiment 3
A99 microwave hybrid integrated circuit ceramic substrates, are prepared by compound and butanone through casting method, the mixingMaterial includes the raw material of following parts by weight：0.1 part of 99.65 parts of superfine alumina powder, the samarium oxide of purity more than 99.9%, oxidation0.08 part of yttrium, 0.06 part of lanthana, 1 part of olein, 0.5 part of oleic acid, 1 part of castor oil, polyvinyl butyral resin 9.2Part, 9 parts of dibutyl ester；
Wherein, the granularity of superfine alumina powder is 0.3-0.5mm, and the granularity of samarium oxide is 0.5-1.0mm, oxidationThe granularity of yttrium is 0.5-1.0mm；
The preparation method of A99 microwave hybrid integrated circuit ceramic substrates, comprises the following steps：
(1) mixed after, superfine alumina powder, grain inhibitor, olein, castor oil are weighed by its parts by weightSynthesis material, by material：Butanone weight ratio is 100:40 mixing, ball milling 24 hours；
(2), toward addition polyvinyl butyral resin and dibutyl ester in step (1), ball milling 24 hours, slurry is obtained；
(3), the slurry after step (2) ball milling is stirred 0.8 hour in vacuum environment, remove bubble, viscosity adjust to10000-30000 Where are moored；
(4), the slurry after step (3) processing is delivered to casting film-forming is carried out on the casting device of casting machine, then sentEnter in drying chamber, in 55 DEG C of temperature, dried 2 hours under ventilation condition, the ceramic substrate green compact of thickness 0.3-1.5 millimeters are made；
(5), ceramic substrate green compact made from step (4) are folded up in ceramic substrate same material between haftplatte, foldedIt is placed on load bearing board and is sent into kiln, is warming up to 650 DEG C with 60 DEG C/h speed and is kept for 1.8 hours, exclude having in green compactMachine thing, then heat to 1650 DEG C and fire 1.8 hours, be cooled to 200 DEG C, take out to remove and put down every haftplatte, and to diaphragmMultiple processing, thickness 100um or so ceramic substrate is made.
By ceramic substrate obtained above, following performance parameter is obtained by experiment test：
Product purity：≤ 99.7%；
Dielectric loss：2*10-4；
Dielectric constant：9.8±0.2；
By above-mentioned test data, A99 microwave hybrid integrated circuit ceramic substrates, purity are made by the above methodHeight, dielectric loss is small, diaphragm quality is good, and Ra is small, and the matter that ensures product consistency is stable.
The foregoing is only a preferred embodiment of the present invention, therefore the scope that the present invention is implemented can not be limited with this, i.e.,The equivalent changes and modifications made according to scope of the present invention patent and description, it all should still belong to what patent of the present invention coveredIn the range of.