技术领域technical field
本发明属于研磨抛光装置技术领域，具体涉及一种新型晶片研磨抛光机。The invention belongs to the technical field of grinding and polishing devices, and in particular relates to a novel wafer grinding and polishing machine.
背景技术Background technique
晶片材料在制备成光电子器件之前通常需要经过切割、研磨、抛光和镀膜等工序加工成需要的形状并达到应用所要求的表面光学均匀性。其中，研磨的作用是要消除厚度和平整度的偏差，而抛光的目的则是要达到所要求的表面光洁度。Before the wafer material is prepared into an optoelectronic device, it usually needs to be processed into the required shape and achieve the surface optical uniformity required by the application through processes such as cutting, grinding, polishing and coating. Among them, the role of grinding is to eliminate the deviation of thickness and flatness, while the purpose of polishing is to achieve the required surface finish.
为了使晶片达到应用要求的光学均匀性，一般需对晶片进行多次研磨抛光操作。在晶片研磨抛光的过程中，需要根据晶片光洁度要求配置不同粒度的研磨粉。现有常规做法通过采用不同粒度的研磨粉（如白刚玉微粉）配置的研磨液，实现晶片不同程度的研磨抛光。利用现有装置实现晶片不同程度的研磨抛光时，需对晶片进行分批重复研磨抛光操作，耗时费力。In order for the wafer to achieve the optical uniformity required by the application, it is generally necessary to perform multiple lapping and polishing operations on the wafer. In the process of wafer grinding and polishing, it is necessary to configure abrasive powders of different particle sizes according to the requirements of wafer smoothness. The conventional practice is to achieve different degrees of grinding and polishing of wafers by using grinding liquids prepared with grinding powders of different particle sizes (such as white corundum powder). When using existing devices to achieve different degrees of grinding and polishing of wafers, it is necessary to perform repeated grinding and polishing operations on the wafers in batches, which is time-consuming and laborious.
综上所述，设计一种可同步实现晶片不同研磨抛光程度的抛光机是非常有必要的。To sum up, it is very necessary to design a polishing machine that can simultaneously realize different grinding and polishing degrees of wafers.
发明内容Contents of the invention
本发明提供了一种新型晶片研磨抛光机，可同步实现晶片不同程度的研磨抛光，省时省力。The invention provides a novel wafer grinding and polishing machine, which can simultaneously realize different degrees of grinding and polishing of wafers, saving time and effort.
为了实现上述目的，本发明采用的技术方案为：In order to achieve the above object, the technical scheme adopted in the present invention is:
一种晶片研磨抛光机，包括机座和转盘，所述的机座包括操作面板和操作台；所述的操作台上设置有用于放置转盘的转盘基座；所述的转盘基座的一侧设置有废液流出孔，转盘基座周边设置有止液台，用于防止研磨液外流；所述的转盘基座轴心设置有轴套；所述的转盘由同轴心设置的小圆盘和大圆盘上下叠加而成，大圆盘底部轴心设置有与轴套旋转连接的转轴，使转盘在外置电机的驱动下旋转，小圆盘轴心处贯穿有用于粗研磨液流通的导流管，且导流管上端口不低于小圆盘顶部平面，保证小圆盘顶部的细研磨液不会流入导流管；所述的小圆盘的底部分布有多条由导流管向小圆盘外沿贯穿的转盘导液槽，用于将粗研磨液导流至大圆盘顶部；所述的转盘上可放置与其相配合的载样盘；所述的载样盘包括内盘和外盘，其中内盘底面与小圆盘顶面接触，外盘底面与大圆盘顶面接触；所述的内盘轴心贯穿有用于细研磨液流通的2#进液管，2#进液管内部同轴嵌套有用于粗研磨液流通的1#进液管，且1#进液管下端口不低于导流管上端口，1#进液管下端口直径小于导流管上端口直径，可使1#进液管嵌套于导流管内，保证粗研磨液不会流入转盘的小圆盘顶部平面，1#进液管与2#进液管通过连接块连接；所述的1#进液管和2#进液管上端口均不低于载样盘的顶部平面，且1#进液管上端口不低于2#进液管上端口，保证向1#进液管注入粗研磨液时不会渐入2#进液管，1#进液管和2#进液管上端口均外张，便于研磨液顺利注入进液管；所述的内盘沿其轴心呈环形阵列贯穿设置有多个用于安插粘样盘的1#载样孔；所述的内盘底部相邻两1#载样孔之间连接有1#旋流槽；所述的内盘底部设置有沿1#载样孔切向的1#导液槽；所述的内盘底部设置有连接1#载样孔与2#进液管的1#流通槽；所述的外盘沿其轴心呈环形阵列贯穿设置有多个用于安插粘样盘的2#载样孔；所述的外盘底部相邻两2#载样孔之间连接有2#旋流槽；所述的外盘底部设置有沿2#载样孔切向的2#导液槽；所述的外盘底部设置有连接2#载样孔与外盘内沿的2#流通槽；所述的载样盘的外立面上设置有支撑柄；所述的支撑柄上设置有固定孔；所述的操作台的一侧设置有支撑杆；所述的支撑杆上滑动连接有固定杆，固定杆端部设置有与固定孔相配合的固定针，将固定针插入固定孔中可用于保持载样盘固定；所述的操作台上设置有分别向1#进液管和2#进液管注入粗研磨液和细研磨液的液管。A wafer grinding and polishing machine, comprising a base and a turntable, the base includes an operation panel and an operation table; the operation table is provided with a turntable base for placing the turntable; one side of the turntable base A waste liquid outflow hole is provided, and a liquid stopper is provided around the base of the turntable to prevent the outflow of grinding liquid; the axis of the base of the turntable is provided with a sleeve; the turntable is composed of a small disc coaxial It is stacked up and down with the large disc. The axis at the bottom of the large disc is provided with a rotating shaft connected to the shaft sleeve so that the turntable rotates under the drive of an external motor. The axis of the small disc runs through a guide for the circulation of coarse grinding flow tube, and the upper port of the guide tube is not lower than the top plane of the small disc, so as to ensure that the fine grinding liquid on the top of the small disc will not flow into the guide tube; the bottom of the small disc is distributed with a plurality of guide tubes The liquid guide groove of the turntable penetrating to the outer edge of the small disk is used to guide the coarse grinding liquid to the top of the large disk; the sample loading disk matched with it can be placed on the rotating disk; the sample loading disk includes an inner disk and the outer disk, wherein the bottom surface of the inner disk is in contact with the top surface of the small disk, and the bottom surface of the outer disk is in contact with the top surface of the large disk; the axis of the inner disk runs through the 2# liquid inlet pipe for the circulation of fine abrasive liquid, and the inside of the 2# liquid inlet pipe The 1# inlet pipe is coaxially nested for the circulation of the coarse grinding liquid, and the lower port of the 1# inlet pipe is not lower than the upper port of the draft tube, and the diameter of the lower port of the 1# liquid inlet pipe is smaller than the diameter of the upper port of the draft tube. The 1# liquid inlet pipe can be nested in the diversion pipe to ensure that the coarse grinding liquid will not flow into the top plane of the small disc of the turntable. The 1# liquid inlet pipe and the 2# liquid inlet pipe are connected through the connecting block; the 1# Both the upper port of the liquid inlet pipe and the 2# liquid inlet pipe are not lower than the top plane of the sample loading tray, and the upper port of the 1# liquid inlet pipe is not lower than the upper port of the 2# liquid inlet pipe, so as to ensure that the crude oil is injected into the 1# liquid inlet pipe. The grinding liquid will not gradually enter the 2# liquid inlet pipe, and the upper ports of the 1# liquid inlet pipe and the 2# liquid inlet pipe are both flared, so that the grinding liquid can be smoothly injected into the liquid inlet pipe; the inner disk is arranged in a ring along its axis There are a plurality of 1# sample loading holes for inserting the sticky sample tray; a 1# swirl tank is connected between two adjacent 1# sample loading holes at the bottom of the inner tray; the bottom of the inner tray is provided with a 1# 1# liquid guide groove tangential to the #loading hole; the bottom of the inner plate is provided with a 1# circulation groove connecting the 1# sample loading hole and the 2# liquid inlet pipe; the outer plate runs through in a circular array along its axis There are a plurality of 2# sample loading holes for inserting the sticky sample tray; a 2# swirl tank is connected between the two adjacent 2# sample loading holes at the bottom of the outer tray; the bottom of the outer tray is provided with a 2# The 2# liquid guide groove tangential to the sample loading hole; the bottom of the outer disk is provided with a 2# circulation groove connecting the 2# sample loading hole and the inner edge of the outer disk; the outer facade of the sample loading disk is provided with a support handle ; The support handle is provided with a fixing hole; one side of the console is provided with a support rod; the support rod is slidably connected with a fixing rod, and the end of the fixing rod is provided with a fixing rod that matches the fixing hole. Needle, inserting the fixing needle into the fixing hole can be used to keep the sample tray fixed; the operating table is provided with liquid pipes for injecting coarse grinding liquid and fine grinding liquid into the 1# liquid inlet pipe and the 2# liquid inlet pipe respectively.
所述的粘样盘为现有技术，粘样盘的底部平面用于粘接待研磨或者待抛光的晶片，粘样盘可根据需要分别安插于1#载样孔和2#载样孔中，粘样盘与1#载样孔和2#载样孔之间可形成公差极小的间隙配合，粘样盘可在其中转动，又可沿轴向上下滑动。The sample sticking disc is the prior art, the bottom plane of the sticking disc is used to stick the wafer to be ground or polished, and the sticking disc can be respectively inserted in the 1# sample loading hole and the 2# sample loading hole as required, The gap between the sticky sample plate and the 1# sample loading hole and the 2# sample loading hole can form a gap fit with extremely small tolerances. The sample sticky plate can rotate in it and slide up and down along the axial direction.
所述的废液流出孔外接有用于排出研磨或者抛光产生的碎屑或者废液的废液管，该废液管为现有技术；The waste liquid outflow hole is externally connected with a waste liquid pipe for discharging debris or waste liquid generated by grinding or polishing, and the waste liquid pipe belongs to the prior art;
所述的两个液管分别外接有用于提供粗、细研磨液的进液通道，该进液通道为现有技术；The two liquid pipes are respectively externally connected with a liquid inlet channel for providing coarse and fine grinding liquid, and the liquid inlet channel is the prior art;
所述的操作面板均为现有技术，操作面板上设置有开关、转速调节按钮以及研磨时间按钮、急停按钮。The operation panel described above is the prior art, and the operation panel is provided with a switch, a speed adjustment button, a grinding time button, and an emergency stop button.
晶片研磨前的准备工作：Preparations before wafer grinding:
（1）将转盘置于转盘基座上，且使转轴嵌套于轴套内，载样盘放置于转盘上，且使1#进液管下端口嵌套于导流管上端口内，将固定针插入固定孔中，保证载样盘固定，使转盘旋转时，转盘对载样盘产生相对运动，从而对粘样盘底部粘接的晶片进行有效研磨。(1) Place the turntable on the turntable base, and nest the rotating shaft in the shaft sleeve, place the sample loading plate on the turntable, and nest the lower port of the 1# inlet tube into the upper port of the draft tube, and insert the The fixing pin is inserted into the fixing hole to ensure that the sample loading plate is fixed, so that when the turntable rotates, the turntable will move relative to the sample loading plate, so as to effectively grind the wafer bonded at the bottom of the sticking plate.
（2）通过不同粒度的研磨粉（如白刚玉微粉）配置研磨液，本发明中即为粗研磨液和细研磨液。(2) The grinding liquid is prepared by grinding powders of different particle sizes (such as white corundum powder), which are coarse grinding liquid and fine grinding liquid in the present invention.
（3）本研磨抛光机一次可对两种不同研磨需求的晶片同时进行研磨，即为晶片A和晶片B（晶片A的粗糙度大于晶片B），将晶片A和晶片B利用松香或者其他粘接剂分别粘接在粘样盘底部，在本发明中同一粘样盘底部可粘接多片厚度一致，粗糙度相近的晶片。(3) This grinding and polishing machine can grind two wafers with different grinding requirements at the same time, that is, wafer A and wafer B (the roughness of wafer A is greater than that of wafer B). The adhesives are respectively bonded to the bottom of the sample sticking plate, and in the present invention, multiple wafers with the same thickness and similar roughness can be bonded to the bottom of the same sample sticking plate.
将粘好晶片A的粘样盘安插入外盘的2#载样孔内，将粘好晶片B的粘样盘安插入内盘的1#载样孔内，打开开关，设置好转速以及研磨时间，粗研磨液和细研磨液通过液管分别注入1#进液管和2#进液管，外置电机驱动转盘旋转，转盘对载样盘产生相对运动，转盘旋转过程中，注入2#进液管中的细研磨液通过1#流通槽缓慢释放到转盘的小圆盘顶部平台，并通过1#载样孔之间的1#旋流槽均匀的分布到各1#载样孔处，通过晶片B与转盘上研磨液的摩擦实现研磨或者抛光的目的，研磨或抛光产生的碎屑或者废液可在离心力的作用下通过1#导液槽排出，该废液会沿着载样盘外盘的内壁流入转盘的大圆盘顶部平台，该废液或随着载样盘的外盘继续进行研磨或通过2#导液槽甩离载样盘；在对晶片B进行研磨的同时晶片A也在进行研磨，注入1#进液管中的粗研磨液通过导流管、转盘导液槽及2#流通槽均匀的分布到各2#载样孔处，通过晶片A与转盘上研磨液的摩擦实现研磨或者抛光的目的，研磨或抛光产生的碎屑或者废液可在离心力的作用下通过2#导液槽甩离载样盘，最终碎屑或者废液集中于止液台内并通过废液流出孔排除。Insert the sticky plate with wafer A glued into the 2# sample loading hole of the outer plate, insert the sticky sample plate with wafer B into the 1# sample loading hole of the inner plate, turn on the switch, set the rotation speed and grinding time, The coarse grinding liquid and the fine grinding liquid are respectively injected into the 1# liquid inlet pipe and the 2# liquid inlet pipe through the liquid pipe. The external motor drives the turntable to rotate, and the turntable generates relative motion to the sample loading plate. During the rotation of the turntable, the 2# liquid inlet is injected. The fine grinding liquid in the tube is slowly released to the top platform of the small disc of the turntable through the 1# circulation groove, and is evenly distributed to each 1# sample loading hole through the 1# swirl groove between the 1# sample loading holes. The friction between wafer B and the grinding liquid on the turntable achieves the purpose of grinding or polishing. The debris or waste liquid generated by grinding or polishing can be discharged through the 1# liquid guide groove under the action of centrifugal force, and the waste liquid will flow along the outer plate of the sample loading plate. The inner wall of the inner wall flows into the top platform of the large disk of the turntable, and the waste liquid either continues to grind along with the outer disk of the sample loading disk or is thrown away from the sample loading disk through the 2# liquid guide groove; while the wafer B is being ground, the wafer A is also Grinding, the coarse grinding liquid injected into the 1# liquid inlet pipe is evenly distributed to each 2# sample loading hole through the guide tube, the liquid guide groove of the turntable and the 2# circulation groove, and the friction between the wafer A and the grinding liquid on the turntable To achieve the purpose of grinding or polishing, the debris or waste liquid generated by grinding or polishing can be thrown away from the sample tray through the 2# liquid guide groove under the action of centrifugal force, and finally the debris or waste liquid is collected in the liquid stop table and passed through the waste The liquid outflow hole is excluded.
本发明的优点：Advantages of the present invention:
本发明提供了一种新型晶片研磨抛光机，可同步实现晶片不同研磨抛光程度的抛光，省时省力，其具体优点如下：The present invention provides a new type of wafer grinding and polishing machine, which can simultaneously realize the polishing of different grinding and polishing degrees of the wafer, saving time and effort, and its specific advantages are as follows:
（1）本发明采用双进液管，可将粗、细研磨液做到源头分离，可同时实现晶片不同程度的研磨抛光，省时省力；(1) The present invention adopts double liquid inlet pipes, which can separate the coarse and fine grinding fluids at the source, and can realize different degrees of grinding and polishing of wafers at the same time, saving time and effort;
（2）1#旋流槽和2#旋流槽的设置，使得研磨液可更迅速均匀分布，大大提高了晶片的研磨效率；(2) The setting of the 1# swirl tank and the 2# swirl tank enables the grinding liquid to be distributed more quickly and evenly, which greatly improves the grinding efficiency of the wafer;
（3）止液台的设置可防止研磨液外流，同时可大大提高操作人员的安全性，防止载样盘飞落对人体造成伤害；(3) The setting of the liquid stop table can prevent the grinding liquid from flowing out, and at the same time, it can greatly improve the safety of the operator, and prevent the sample tray from flying down and causing harm to the human body;
（4）固定杆插入固定孔中，保证载样盘的稳固性，防止研磨过(4) The fixing rod is inserted into the fixing hole to ensure the stability of the sample tray and prevent excessive grinding.
程中载样盘的飞出，进一步保证操作人员的安全。The flying out of the sample tray during the process further ensures the safety of the operator.
附图说明Description of drawings
附图1为本发明所述的研磨抛光机的立体示意图；附图2为本发明所述的未放置载样盘的研磨抛光机的立体示意图；附图3为本发明所述的载样盘的立体示意图；附图4为本发明所述的载样盘的俯视图；附图5为本发明所述的载样盘的仰视图；附图6为本发明所述的载样盘的立体示意图；附图7为本发明所述的转盘的立体结构示意图；附图8为本发明所述的转盘的俯视图；附图9为本发明所述的转盘的主视图；附图10为本发明所述的粘样盘的结构示意图；Accompanying drawing 1 is the three-dimensional schematic view of the grinding and polishing machine of the present invention; Accompanying drawing 2 is the three-dimensional schematic view of the grinding and polishing machine of the present invention without placing the sample-carrying disc; Accompanying drawing 3 is the sample-carrying disc of the present invention Figure 4 is a top view of the sample tray of the present invention; accompanying drawing 5 is a bottom view of the sample tray of the present invention; accompanying drawing 6 is a perspective view of the sample tray of the present invention Accompanying drawing 7 is the three-dimensional structure schematic diagram of the turntable of the present invention; Accompanying drawing 8 is the top view of the turntable of the present invention; Accompanying drawing 9 is the front view of the turntable of the present invention; The structural representation of the sticky sample tray described above;
其中，1为2#导液槽，2为操作台，3为转盘基座，4为支撑柄，5为支撑杆，6为固定杆，7为液管，8为1#进液管，9为2#进液管，10为1#载样孔，11为2#载样孔，12为载样盘，13为废液流出孔，14为止液台，15为机座，16为操作面板，17为固定孔，18为连接块，19为内盘，20为外盘，21为1#导液槽，22为1#流通槽，23为2#旋流槽，24为1#旋流槽，25为轴套，26为转盘导液槽，27为转盘，28为转轴，29为2#流通槽，30为导流管，31为固定针，32为粘样盘，33为小圆盘，34为大圆盘。Among them, 1 is the 2# liquid guide tank, 2 is the operation table, 3 is the turntable base, 4 is the support handle, 5 is the support rod, 6 is the fixed rod, 7 is the liquid pipe, 8 is the 1# liquid inlet pipe, 9 2# liquid inlet pipe, 10 is 1# sample loading hole, 11 is 2# sample loading hole, 12 is sample loading tray, 13 is waste liquid outflow hole, 14 is liquid stop table, 15 is machine base, 16 is operation panel , 17 is the fixing hole, 18 is the connection block, 19 is the inner plate, 20 is the outer plate, 21 is the 1# liquid guide tank, 22 is the 1# flow tank, 23 is the 2# swirl tank, 24 is the 1# swirl tank, 25 is a shaft sleeve, 26 is a turntable liquid guide groove, 27 is a turntable, 28 is a rotating shaft, 29 is a 2# circulation groove, 30 is a guide tube, 31 is a fixed needle, 32 is a sticky sample plate, 33 is a small disc, 34 is a large disc.
具体实施方式Detailed ways
一种晶片研磨抛光机，包括机座15和转盘27，所述的机座15包括操作面板16和操作台2；所述的操作台2上设置有用于放置转盘27的转盘基座3；所述的转盘基座3的一侧设置有废液流出孔13，转盘基座3周边设置有止液台14；所述的转盘基座3轴心设置有轴套25；所述的转盘27由同轴心设置的小圆盘33和大圆盘34上下叠加而成，大圆盘34底部轴心设置有与轴套25旋转连接的转轴28，小圆盘33轴心处贯穿有用于粗研磨液流通的导流管30，且导流管30上端口不低于小圆盘33顶部平面；所述的小圆盘33的底部分布有多条由导流管30向小圆盘33外沿贯穿的转盘导液槽26；所述的转盘27上可放置与其相配合的载样盘12；所述的载样盘12包括内盘19和外盘20，其中内盘19底面与小圆盘33顶面接触，外盘20底面与大圆盘34顶面接触；所述的内盘19轴心贯穿有用于细研磨液流通的2#进液管9，2#进液管9内部同轴嵌套有用于粗研磨液流通的1#进液管8，且1#进液管8下端口不低于导流管30上端口，1#进液管8下端口直径小于导流管30上端口直径，1#进液管8与2#进液管9通过连接块18连接；所述的1#进液管8和2#进液管9上端口均不低于载样盘12的顶部平面，且1#进液管8上端口不低于2#进液管9上端口，1#进液管8和2#进液管9上端口均外张；所述的内盘19沿其轴心呈环形阵列贯穿设置有多个用于安插粘样盘31的1#载样孔10；所述的内盘19底部相邻两1#载样孔10之间连接有1#旋流槽24；所述的内盘19底部设置有沿1#载样孔10切向的1#导液槽21；所述的内盘19底部设置有连接1#载样孔10与2#进液管9的1#流通槽22；所述的外盘20沿其轴心呈环形阵列贯穿设置有多个用于安插粘样盘31的2#载样孔11；所述的外盘20底部相邻两2#载样孔11之间连接有2#旋流槽23；所述的外盘20底部设置有沿2#载样孔11切向的2#导液槽1；所述的外盘20底部设置有连接2#载样孔11与外盘20内沿的2#流通槽29；所述的载样盘12的外立面上设置有支撑柄4；所述的支撑柄4上设置有固定孔17；所述的操作台2的一侧设置有支撑杆5；所述的支撑杆5上滑动连接有固定杆6，固定杆6端部设置有与固定孔17相配合的固定针31，将固定针31插入固定孔17中可用于保持载样盘12固定；所述的操作台2上设置有分别向1#进液管8和2#进液管9注入粗研磨液和细研磨液的液管7。A wafer grinding and polishing machine, comprising a base 15 and a turntable 27, the base 15 includes an operation panel 16 and an operation table 2; the operation table 2 is provided with a turntable base 3 for placing the turntable 27; One side of the turntable base 3 is provided with a waste liquid outflow hole 13, and the periphery of the turntable base 3 is provided with a stopper 14; the axis of the turntable base 3 is provided with a shaft sleeve 25; the turntable 27 is formed by The small disc 33 and the large disc 34 arranged on the same axis are stacked up and down. The bottom axis of the large disc 34 is provided with a rotating shaft 28 that is rotatably connected to the sleeve 25. The guide tube 30 for liquid circulation, and the upper port of the guide tube 30 is not lower than the top plane of the small disc 33; The penetrating turntable liquid guide groove 26; the sample loading tray 12 matched with it can be placed on the turntable 27; the sample loading tray 12 includes an inner tray 19 and an outer tray 20, wherein the bottom surface of the inner tray 19 and the top surface of the small disc 33 Contact, the bottom surface of the outer disc 20 is in contact with the top surface of the large disc 34; the axis of the inner disc 19 runs through the 2# liquid inlet pipe 9 for the circulation of the fine abrasive liquid, and the inside of the 2# liquid inlet pipe 9 is coaxially nested for the coarse grinding liquid. The 1# liquid inlet pipe 8 through which the grinding liquid circulates, and the lower port of the 1# liquid inlet pipe 8 is not lower than the upper port of the draft tube 30, the diameter of the lower port of the 1# liquid inlet pipe 8 is smaller than the diameter of the upper port of the draft pipe 30, and the diameter of the 1# The liquid inlet pipe 8 and the 2# liquid inlet pipe 9 are connected through the connection block 18; the upper ports of the 1# liquid inlet pipe 8 and the 2# liquid inlet pipe 9 are not lower than the top plane of the sample tray 12, and the 1# The upper port of the liquid inlet pipe 8 is not lower than the upper port of the 2# liquid inlet pipe 9, and the upper ports of the 1# liquid inlet pipe 8 and the 2# liquid inlet pipe 9 are both flared; the inner disk 19 runs through in a circular array along its axis There are a plurality of 1# sample loading holes 10 for inserting the sticky sample tray 31; a 1# swirl tank 24 is connected between two adjacent 1# sample loading holes 10 at the bottom of the inner tray 19; the inner tray 19 The bottom is provided with a 1# liquid guide groove 21 tangentially along the 1# sample loading hole 10; the bottom of the inner plate 19 is provided with a 1# flow tank 22 connecting the 1# sample loading hole 10 and the 2# liquid inlet pipe 9; The outer disk 20 is provided with a plurality of 2# sample loading holes 11 for inserting the sticky sample disk 31 in an annular array along its axis; the bottom of the outer disk 20 is connected between two adjacent 2# sample loading holes 11. 2# swirl tank 23; the bottom of the outer disk 20 is provided with a 2# liquid guide groove 1 along the tangential direction of the 2# sample loading hole 11; the bottom of the outer disk 20 is provided with a connection between the 2# sample loading hole 11 and the outer disk 20 2# circulation groove 29 along the inner edge; a support handle 4 is provided on the outer facade of the sample loading tray 12; a fixing hole 17 is provided on the support handle 4; a side of the operation table 2 is provided There is a support rod 5; the support rod 5 is slidably connected with a fixed rod 6, and the end of the fixed rod 6 is provided with a fixed pin 31 matched with the fixed hole 17, and the fixed pin 31 can be inserted into the fixed hole 17 and can be used to keep the load. The sample plate 12 is fixed; the operating table 2 is provided with a device for injecting coarse grinding fluid and fine grinding fluid into the 1# liquid inlet pipe 8 and the 2# liquid inlet pipe 9 respectively. The liquid pipe 7.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711158536.6ACN107650009B (en) | 2017-11-20 | 2017-11-20 | A New Wafer Grinding and Polishing Machine |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711158536.6ACN107650009B (en) | 2017-11-20 | 2017-11-20 | A New Wafer Grinding and Polishing Machine |
| Publication Number | Publication Date |
|---|---|
| CN107650009Atrue CN107650009A (en) | 2018-02-02 |
| CN107650009B CN107650009B (en) | 2023-08-25 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711158536.6AActiveCN107650009B (en) | 2017-11-20 | 2017-11-20 | A New Wafer Grinding and Polishing Machine |
| Country | Link |
|---|---|
| CN (1) | CN107650009B (en) |
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| CN109176046A (en)* | 2018-09-06 | 2019-01-11 | 重庆三峡学院 | Machining rotary table |
| CN110842755A (en)* | 2019-11-26 | 2020-02-28 | 湖南大合新材料有限公司 | Tellurium-zinc-cadmium wafer surface grinding device |
| CN111152084A (en)* | 2019-12-28 | 2020-05-15 | 天长市正牧铝业科技有限公司 | Rotary type baseball bat grinding processing equipment |
| CN117322343A (en)* | 2023-11-22 | 2024-01-02 | 山东安然纳米实业发展有限公司 | Cutting structure with kuppe and plant tissue culture jar thereof |
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| CN107650009B (en) | 2023-08-25 |
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| CN107650009B (en) | A New Wafer Grinding and Polishing Machine | |
| CN203817964U (en) | Combined sample carrying plate for wafer grinding and polishing | |
| CN207480368U (en) | A kind of novel wafer polisher lapper | |
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