技术领域technical field
本发明涉及PCB(Printed Circuit Board，印制线路板)技术领域，尤其涉及一种PCB的加工方法及PCB。The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a PCB processing method and the PCB.
背景技术Background technique
随着高密度集成电路技术和微电子技术的发展，电子产品的体积变得更轻、更薄、更小。目前，在高多层PCB制作布线设计中，不同层间网络连接都是利用过孔，且一个过孔通常只设计一个网络连接层。由于每个过孔在PCB板面上占据一定面积，PCB容量越大设计网络越多，过孔的数量就越多，这样PCB板面的设计面积就越大，这就无法满足电子产品更薄更小的要求。With the development of high-density integrated circuit technology and microelectronics technology, the volume of electronic products has become lighter, thinner and smaller. At present, in the wiring design of high-layer PCB production, the network connection between different layers is through the use of via holes, and usually only one network connection layer is designed for one via hole. Since each via hole occupies a certain area on the PCB board, the larger the PCB capacity, the more design networks, the more the number of via holes, and the larger the design area of the PCB board, which cannot meet the requirements of thinner electronic products. Smaller requirements.
发明内容Contents of the invention
本发明的目的在于提供一种PCB的加工方法及PCB，克服现有技术中存在的产品布线密度低的缺陷。The object of the present invention is to provide a PCB processing method and PCB, which overcome the defect of low product wiring density in the prior art.
为达此目的，本发明采用以下技术方案：For reaching this purpose, the present invention adopts following technical scheme:
一种PCB的加工方法，包括：A method for processing a PCB, comprising:
将多张芯板压合形成多层板；Press multiple core boards to form a multi-layer board;
在所述多层板的预定位置制作N个阶梯状通孔并金属化，所述N为整数且N＞1；每个阶梯状通孔沿其轴向包括第一通孔部和第二通孔部，所述第一通孔部的孔径大于第二通孔部的孔径，所述第一通孔部与第二通孔部之间形成第一台阶面；Manufacture and metallize N stepped through holes at predetermined positions of the multilayer board, where N is an integer and N>1; each stepped through hole includes a first through hole portion and a second through hole along its axial direction A hole portion, the aperture of the first through hole is larger than the aperture of the second through hole, and a first stepped surface is formed between the first through hole and the second through hole;
对于其中的M个阶梯状通孔，所述M为整数且1≤M≤N，分别去除其第一台阶面的全部或部分铜层，和/或去除其第二通孔部侧壁的至少一部分铜层，使得其内壁的铜层断开形成互不导通的至少两部分；For the M stepped through holes, where M is an integer and 1≤M≤N, remove all or part of the copper layer on the first step surface, and/or remove at least part of the sidewall of the second through hole A portion of the copper layer, such that the copper layer on its inner wall is disconnected to form at least two parts that are not electrically connected to each other;
对N个阶梯状通孔进行扩孔操作，去除每个阶梯状通孔的部分孔壁铜层，使得所有阶梯状通孔连通成一体，且所有阶梯状通孔的剩余孔壁铜层沿横向划分为互不导通的至少两部分，互不导通的每部分作为一网络连接层。Reaming is performed on N stepped through-holes, and part of the copper layer on the hole wall of each stepped through-hole is removed, so that all the stepped through-holes are connected into one body, and the remaining copper layer of the hole wall of all the stepped through-holes is along the lateral direction It is divided into at least two parts that are not connected to each other, and each part that is not connected to each other serves as a network connection layer.
可选的，所述加工方法中，采用单面控深钻、化学蚀刻或者激光烧蚀方式，去除第一台阶面的全部或部分铜层，或者去除第二通孔部侧壁的部分铜层。Optionally, in the processing method, single-sided controlled deep drilling, chemical etching or laser ablation are used to remove all or part of the copper layer on the first step surface, or to remove part of the copper layer on the side wall of the second through hole .
可选的，至少一个所述阶梯状通孔沿其轴向还包括第三通孔部，且第二通孔部位于第一通孔部和第三通孔部之间；所述第三通孔部的孔径大于第二通孔部的孔径，所述第三通孔部与第二通孔部之间形成第二台阶面。Optionally, at least one of the stepped through holes further includes a third through hole portion along its axial direction, and the second through hole portion is located between the first through hole portion and the third through hole portion; The diameter of the hole is larger than the diameter of the second through hole, and a second stepped surface is formed between the third through hole and the second through hole.
可选的，所述加工方法还包括：在所述M个阶梯状通孔中，对于其中至少一个包括第三通孔部的阶梯状通孔，Optionally, the processing method further includes: among the M stepped through holes, for at least one of the stepped through holes including the third through hole portion,
在去除其第一台阶面的全部或部分铜层的同时，去除其第二台阶面的全部或者部分铜层，使得其内壁的铜层断开形成相互不导通的三部分；While removing all or part of the copper layer on the first step surface, remove all or part of the copper layer on the second step surface, so that the copper layer on the inner wall is disconnected to form three mutually non-conductive parts;
或者，在去除其第二通孔部侧壁的至少一部分铜层的同时，去除其第二通孔部侧壁的剩余部分铜层，使得其内壁的铜层断开形成相互不导通的两部分。Or, while removing at least a part of the copper layer on the side wall of the second through hole, remove the remaining part of the copper layer on the side wall of the second through hole, so that the copper layer on the inner wall is disconnected to form two mutually non-conductive part.
可选的，所述扩孔操作的方法包括钻孔或者铣孔。Optionally, the hole reaming operation method includes drilling or milling.
可选的，所述N个阶梯状通孔中，相邻的两个阶梯状通孔相离、相切或者相交。Optionally, among the N stepped through holes, two adjacent stepped through holes are separated, tangent or intersected.
可选的，所述N个阶梯状通孔的孔心位于同一圆周上，所述扩孔操作的次数为至少一次。Optionally, the centers of the N stepped through-holes are located on the same circumference, and the number of times of the hole-enlargement operation is at least one.
可选的，所述N个阶梯状通孔的孔心位于不同圆周上，所述扩孔操作的次数为至少两次。Optionally, the centers of the N stepped through-holes are located on different circumferences, and the number of times of the hole-enlargement operation is at least two.
可选的，在所述N为大于2的整数时，所述N个阶梯状通孔按照预设的排列形状排列；所述预设的排列形状包括：三角形、正方形、长方形或圆形。Optionally, when the N is an integer greater than 2, the N stepped through holes are arranged in a preset arrangement shape; the preset arrangement shape includes: triangle, square, rectangle or circle.
一种PCB，所述PCB根据如上任一所述加工方法制成。A PCB, which is manufactured according to any one of the above processing methods.
本发明的有益效果：Beneficial effects of the present invention:
本发明实施例中，预钻多个阶梯状通孔，并将至少一个阶梯状通孔内壁的铜层断开为上下两部分或者上中下三部分，然后再进行扩孔，将所有阶梯状通孔连通成一体的同时钻除了每个阶梯状通孔的部分内壁铜层，从而将所有剩余内壁铜层在横向上进一步划分为互不导通的多个部分，最终使得同一孔位可实现至少四个网络连接层，大大提高了布线密度，且操作方法简单快速。In the embodiment of the present invention, a plurality of stepped through holes are pre-drilled, and the copper layer on the inner wall of at least one stepped through hole is divided into upper and lower parts or upper, middle and lower parts. While the through holes are connected into one, part of the inner wall copper layer of each stepped through hole is drilled, so that all remaining inner wall copper layers are further divided into multiple parts that are not connected to each other in the lateral direction, and finally the same hole position can be realized. At least four network connection layers greatly increase the wiring density, and the operation method is simple and fast.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings on the premise of not paying creative efforts.
图1为本发明实施例提供的PCB的加工方法流程图；Fig. 1 is the flow chart of the processing method of PCB that the embodiment of the present invention provides;
图2为本发明实施例提供的PCB在钻柱状通孔后的剖面图；Fig. 2 is the cross-sectional view of the PCB provided by the embodiment of the present invention after the columnar through hole is drilled;
图3为图2所示PCB在形成阶梯状通孔后的剖面图；FIG. 3 is a cross-sectional view of the PCB shown in FIG. 2 after forming stepped through holes;
图4为图3所示PCB在阶梯状通孔金属化后的剖面图；FIG. 4 is a cross-sectional view of the PCB shown in FIG. 3 after metallization of stepped through holes;
图5为本发明实施例提供的位置相离的阶梯状通孔的排列示意图；Fig. 5 is a schematic diagram of the arrangement of step-shaped through-holes with separated positions provided by an embodiment of the present invention;
图6为本发明实施例提供的位置相切的阶梯状通孔的排列示意图；Fig. 6 is a schematic diagram of the arrangement of stepped through holes with tangent positions provided by the embodiment of the present invention;
图7为本发明实施例提供的位置相交的阶梯状通孔的排列示意图；Fig. 7 is a schematic diagram of arrangement of intersecting stepped through holes provided by an embodiment of the present invention;
图8为图4所示PCB在采用双面深孔钻方式去除阶梯状通孔内两个台阶面铜层之后的剖面图；Fig. 8 is a cross-sectional view of the PCB shown in Fig. 4 after the copper layer on the two step surfaces in the stepped through hole is removed by double-sided deep hole drilling;
图9为图4所示PCB在采用钻通孔方式去除阶梯状通孔内第二通孔部侧壁铜层后的剖视图；9 is a cross-sectional view of the PCB shown in FIG. 4 after removing the copper layer on the side wall of the second through hole in the stepped through hole by drilling through holes;
图10为图9所示PCB在扩孔操作后的剖面图；Fig. 10 is a cross-sectional view of the PCB shown in Fig. 9 after the hole reaming operation;
图11为图9所示PCB在扩孔操作后的表面视图；Fig. 11 is a surface view of the PCB shown in Fig. 9 after the hole reaming operation;
图12为图11所示PCB在树脂塞孔填平后的剖面图。FIG. 12 is a cross-sectional view of the PCB shown in FIG. 11 after the resin plug holes are filled.
具体实施方式detailed description
为使得本发明的发明目的、特征、优点能够更加的明显和易懂，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，下面所描述的实施例仅仅是本发明一部分实施例，而非全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
请参阅图1，图1示出了PCB的加工方法流程。Please refer to FIG. 1 . FIG. 1 shows the process flow of the PCB processing method.
本实施例中，PCB的加工方法包括以下步骤：In the present embodiment, the processing method of PCB comprises the following steps:
S101、将多张芯板压合形成多层板。S101, pressing multiple core boards together to form a multi-layer board.
S102、在多层板的预定位置进行钻孔及金属化操作，制成按照预设排列方式排列的N个金属化的阶梯状通孔，N为大于1的整数。S102 , performing drilling and metallization operations on predetermined positions of the multilayer board to form N metallized stepped through holes arranged in a preset arrangement, where N is an integer greater than 1.
本步骤中，金属化的阶梯状通孔的制作工艺为：In this step, the manufacturing process of the metallized stepped through hole is as follows:
1)在PCB的预设位置钻柱状通孔，如图2所示，该柱状通孔由PCB的第一面贯穿至与第一面相对的第二面，柱状通孔孔径为A。1) Drill a columnar through hole at a preset position of the PCB. As shown in FIG. 2 , the columnar through hole penetrates from the first surface of the PCB to the second surface opposite to the first surface, and the diameter of the columnar through hole is A.
2)在PCB的第一面的柱状通孔处进行第一次控深钻，在第二面的柱状通孔处进行第二次控深钻，形成其顶部和底部为大孔径、中部为小孔径的阶梯状通孔，如图3所示。2) Perform the first controlled depth drilling at the columnar through hole on the first side of the PCB, and perform the second controlled depth drilling at the columnar through hole on the second side to form a large aperture at the top and bottom and a small diameter at the middle. The stepped through hole of the aperture is shown in Figure 3.
其中，第一次控深钻的钻孔孔深与第二次控深钻的钻孔孔深之和小于整个柱状通孔的孔深；同时，第一次控深钻的钻孔孔径与第二次控深钻的钻孔孔径可以相同，也可以不同，但均大于孔径A，从而形成阶梯状通孔。Wherein, the sum of the drilling hole depth of the first depth control drilling and the drilling depth of the second control depth drilling is less than the hole depth of the entire columnar through hole; at the same time, the drilling diameter of the first control depth drilling and the second The hole diameters of the secondary deep-controlled drilling can be the same or different, but they are all larger than the hole diameter A, thereby forming stepped through holes.
为方便描述，本实施例中，下文将阶梯状通孔的顶部的大孔径部分称为第一通孔部、中部的小孔径部分称为第二通孔部、底部的大孔径部分称为第三通孔部；由于相邻的两个通孔部的孔径不同，因此第一通孔部与第二通孔部之间形成第一台阶面，第三通孔部与第二通孔部之间形成第二台阶面。For the convenience of description, in this embodiment, the large-diameter part at the top of the stepped through-hole is called the first through-hole part, the small-diameter part in the middle part is called the second through-hole part, and the large-diameter part at the bottom is called the second through-hole part. Three through-holes; since the diameters of the adjacent two through-holes are different, a first stepped surface is formed between the first through-hole and the second through-hole, and a step surface is formed between the third through-hole and the second through-hole. A second step surface is formed between them.
3)对阶梯状通孔进行沉铜电镀，形成金属化的阶梯状通孔，如图4所示。阶梯状通孔内金属化后，使得所有层之间线路导通。3) Perform copper plating on the stepped through hole to form a metallized stepped through hole, as shown in FIG. 4 . After metallization in the stepped through hole, the lines between all layers are conducted.
本步骤中，阶梯状通孔的具体数量不限定，但是在同一预定位置上阶梯状通孔的数量越多，该预定位置上可实现的网络连接层的数量就越多，在实际应用中可根据布线网络数量的实际需求来确定第一通孔的数量。In this step, the specific number of stepped through holes is not limited, but the more the number of stepped through holes at the same predetermined position, the more the number of network connection layers that can be realized at the predetermined position, which can be achieved in practical applications. The quantity of the first through holes is determined according to the actual requirement of the quantity of the wiring network.
各个阶梯状通孔的孔径大小可以相同，也可以不同，具体不限制。The diameters of the stepped through holes may be the same or different, which is not specifically limited.
各个阶梯状通孔的排列方式有多种，可呈正方形、三角形、圆形等各种形状，而相邻的两个阶梯状通孔之间可相离(如图5所示)、相切(如图6所示)或者相交(如图7所示)。还需说明的是，相邻阶梯状通孔的间距可相同，也可以不同。There are many ways to arrange the stepped through holes, which can be in various shapes such as squares, triangles, and circles, and two adjacent stepped through holes can be separated (as shown in Figure 5) or tangent to each other. (as shown in Figure 6) or intersect (as shown in Figure 7). It should also be noted that the distance between adjacent stepped through holes may be the same or different.
S103、对于N个阶梯状通孔中的M个阶梯状通孔(M为整数且1≤M≤N)，分别进行以下两种操作中的至少一种操作：S103. For M stepped through holes in the N stepped through holes (M is an integer and 1≤M≤N), respectively perform at least one of the following two operations:
第一种操作：去除其第一台阶面或/和第二台阶面的全部或部分铜层，使得其内壁的铜层断开形成互不导通的上下两部分或者上中下三部分；The first operation: remove all or part of the copper layer on the first step surface or/and the second step surface, so that the copper layer on the inner wall is disconnected to form the upper and lower parts or the upper, middle and lower parts that are not connected to each other;
第二种操作：去除其第二通孔部侧壁的全部或至少一部分铜层，使得其内壁的铜层断开形成互不导通的至少两部分。The second operation: removing all or at least a part of the copper layer on the side wall of the second through hole, so that the copper layer on the inner wall is disconnected to form at least two parts that are not connected to each other.
在第一种操作中，具体可采用双面控深钻的方式，去除第一台阶面及第二台阶面的全部或者部分铜层，如图8所示。也可采用单面控深钻的方式，仅去除第一台阶面或者第二台阶面的全部或者部分铜层。除了控深钻方式之外，还可采用化学蚀刻、激光烧蚀等其他不同方式，去除台阶面的全部或部分铜层，使得阶梯状通孔内壁的铜层断开。In the first operation, the method of double-sided controlled depth drilling can be used to remove all or part of the copper layer on the first step surface and the second step surface, as shown in FIG. 8 . It is also possible to use single-side controlled deep drilling to remove all or part of the copper layer on only the first step surface or the second step surface. In addition to controlled depth drilling, other methods such as chemical etching and laser ablation can also be used to remove all or part of the copper layer on the step surface, so that the copper layer on the inner wall of the stepped through hole is disconnected.
在第二种操作中，具体可采用钻通孔的方式，以去除第二通孔部侧壁的全部或部分铜层，如图9所示。当然，除了钻通孔方式之外，也可采用化学蚀刻、激光烧蚀等其他不同方式，去除第二通孔部侧壁的全部或部分铜层，使得阶梯状通孔内壁的铜层断开。In the second operation, a through-hole drilling method may be used to remove all or part of the copper layer on the sidewall of the second through-hole portion, as shown in FIG. 9 . Of course, in addition to drilling through holes, other methods such as chemical etching and laser ablation can also be used to remove all or part of the copper layer on the side wall of the second through hole, so that the copper layer on the inner wall of the stepped through hole is disconnected. .
本步骤中，可以对部分阶梯状通孔进行上述第一种操作和/或第二种操作，也可对所有阶梯状通孔进行上述第一种操作和/或第二种操作，两者不同之处在于：最终形成的互不导通的铜层数量不相同。In this step, the above-mentioned first operation and/or the second operation can be performed on some of the stepped through holes, and the above-mentioned first operation and/or the second operation can be performed on all the stepped through holes, the two are different The difference is that the number of copper layers that are finally formed and are not connected to each other is different.
需要说明的是：在第二种操作中，当第二通孔部贯穿单层或者多层时，均可以通过去除第二通孔部侧壁的全部或一部分铜层的方式，使得阶梯状通孔内壁的铜层断开形成互不导通的两部分；此外，当第二通孔部贯穿多层时，可以去除第二通孔部侧壁的多部分相互分离的铜层，使得阶梯状通孔内壁的铜层断开形成互不导通的三部分或者更多部分。It should be noted that: in the second operation, when the second via hole penetrates through a single layer or multiple layers, all or part of the copper layer on the side wall of the second via hole can be removed to make the stepped via The copper layer on the inner wall of the hole is disconnected to form two parts that are not connected to each other; in addition, when the second through hole penetrates through multiple layers, multiple parts of the separated copper layer on the side wall of the second through hole can be removed, so that the stepped The copper layer on the inner wall of the through hole is disconnected to form three or more parts that are not connected to each other.
S104、对N个阶梯状通孔进行扩孔操作，去除每个阶梯状通孔的部分孔壁铜层，使得所有阶梯状通孔连通成一体，且所有阶梯状通孔的剩余孔壁铜层进一步呈横向断开形成为互不导通的至少两部分，每部分作为一网络连接层。S104. Reaming the N stepped through-holes, removing part of the hole wall copper layer of each stepped through-hole, so that all the stepped through-holes are connected into one, and the remaining hole wall copper layer of all the stepped through-holes Further, the transverse disconnection is formed into at least two parts that are not connected to each other, and each part is used as a network connection layer.
其中，扩孔操作方式可以为钻孔或者铣孔方式。例如，在图9所示PCB的基础上，对2个阶梯状通孔进行扩孔后，PCB的剖面图如图10所示，PCB的表面如图11所示。Wherein, the reaming operation mode may be a drilling or milling mode. For example, on the basis of the PCB shown in Figure 9, after reaming the two stepped through holes, the cross-sectional view of the PCB is shown in Figure 10, and the surface of the PCB is shown in Figure 11.
为实现将所有阶梯状通孔的剩余孔壁铜层呈横向断开形成为互不导通的至少两部分的扩孔目的，整个过程中，扩孔操作的次数可以为一次，也可以为多次。In order to achieve the purpose of reaming the remaining copper layer of the hole wall of all stepped through-holes to be horizontally disconnected and formed into at least two parts that are not connected to each other, the number of reaming operations can be one time or multiple in the whole process. Second-rate.
通常，若所有阶梯状通孔的孔心位于同一圆周上，则可通过至少一次扩孔操作实现上述扩孔目的。若阶梯状通孔的数量较少，所需形成的扩孔区域较小，则采用大小相匹配的钻刀进行一次扩孔操作即可；若阶梯状通孔的数量较多，所形成的扩孔区域较大，无相应大孔径钻刀可使用的情况下，需要进行至少两次的扩孔操作才能实现上述扩孔目的。Usually, if the centers of all the stepped through-holes are located on the same circumference, the above hole-enlarging purpose can be achieved by at least one hole-enlarging operation. If the number of stepped through-holes is small and the area to be expanded is small, it is enough to use a drill with a matching size to perform one-time reaming operation; if the number of stepped through-holes is large, the formed expanded If the hole area is large and there is no corresponding large-aperture drill available, at least two reaming operations are required to achieve the above-mentioned purpose of reaming.
若所有阶梯状通孔的孔心位于不同圆周上，则可能需要通过两次或者更多次的扩孔操作实现上述扩孔目的。If the centers of all the stepped through-holes are located on different circumferences, it may be necessary to perform two or more hole-enlarging operations to achieve the above-mentioned hole-enlarging purpose.
在实际应用时可以根据所需布线网络数量和阶梯状通孔的数量、孔径、排列方式等情况来选择较为合适的扩孔操作参数，扩孔操作参数包括扩孔操作次数、每次扩孔操作的具体位置和孔径等。In actual application, the more appropriate reaming operation parameters can be selected according to the number of wiring networks required and the number, aperture, and arrangement of stepped through holes. The reaming operation parameters include the number of reaming operations, each reaming operation The specific location and aperture, etc.
在扩孔操作之后，如图12所示，采用真空树脂塞孔填平，然后完成外层芯板的图形制作，实现不同网络线路。After the hole expansion operation, as shown in Figure 12, vacuum resin is used to fill the holes, and then the graphics of the outer core board are completed to realize different network lines.
在本实施例中，至少一个阶梯状通孔内壁的铜层在一个或者两个位置断开，形成互不导通的上下两部分或者上中下三个部分，在扩孔后，所有阶梯状通孔的剩余内壁铜层在横向上又被断开形成互不导通的至少两部分，因而在同一预定位置可以形成至少四个网络连接层，与现有的一个过孔位置仅实现一个网络连接层的方案相比，在同一面积的PCB上，可大大减少过孔数量，提高PCB的布线密度。In this embodiment, the copper layer on the inner wall of at least one stepped through-hole is disconnected at one or two positions to form two upper and lower parts or three upper, middle and lower parts that are not connected to each other. After the hole is expanded, all the stepped The remaining copper layer on the inner wall of the through hole is disconnected in the lateral direction to form at least two parts that are not connected to each other, so at least four network connection layers can be formed at the same predetermined position, and only one network can be realized with the existing one via hole position. Compared with the solution of the connection layer, the number of via holes can be greatly reduced on the PCB of the same area, and the wiring density of the PCB can be improved.
此外，上述N个阶梯状通孔中，部分或者全部阶梯状通孔也可制成其他结构，如仅包括大孔径的第一通孔部和小孔径的第二通孔部。对于仅包括第一通孔部和第二通孔部的阶梯状通孔，可先去除两个通孔部形成的台阶面的全部/部分铜层，使得阶梯状通孔内壁的铜层沿通孔的轴向断开形成互不导通的两部分；也可通过去除第二通孔部侧壁的部分铜层的方式，使得阶梯状通孔内壁的铜层断开形成为互不导通的两部分；然后，再进行扩孔操作，扩孔方式与上述相同，不再赘述。In addition, among the above N stepped through holes, some or all of the stepped through holes can also be made into other structures, such as only including a first through hole portion with a large diameter and a second through hole portion with a small diameter. For a stepped through hole that only includes the first through hole and the second through hole, all/part of the copper layer on the stepped surface formed by the two through holes can be removed first, so that the copper layer on the inner wall of the stepped through hole along the through hole The axial disconnection of the hole forms two parts that are not connected to each other; it is also possible to remove part of the copper layer on the side wall of the second through hole so that the copper layer on the inner wall of the stepped through hole is disconnected and formed to be non-conductive The two parts; then, carry out the reaming operation, the reaming method is the same as above, and will not be repeated.
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still understand the foregoing The technical solutions recorded in each embodiment are modified, or some of the technical features are replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892682.5ACN107613673A (en) | 2017-09-27 | 2017-09-27 | A kind of processing method of PCB and PCB |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892682.5ACN107613673A (en) | 2017-09-27 | 2017-09-27 | A kind of processing method of PCB and PCB |
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| CN107613673Atrue CN107613673A (en) | 2018-01-19 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201710892682.5APendingCN107613673A (en) | 2017-09-27 | 2017-09-27 | A kind of processing method of PCB and PCB |
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| CN (1) | CN107613673A (en) |
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|---|---|---|---|---|
| CN108770200A (en)* | 2018-06-14 | 2018-11-06 | 生益电子股份有限公司 | PCB (printed circuit board) |
| CN114206000A (en)* | 2021-12-24 | 2022-03-18 | 维沃移动通信有限公司 | Circuit Board Assemblies and Electronics |
| CN116321805A (en)* | 2022-12-28 | 2023-06-23 | 沪士电子股份有限公司 | Preparation method of PCB with stepped groove |
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| US20050130480A1 (en)* | 2002-12-12 | 2005-06-16 | Broadcom Corporation | Via providing multiple electrically conductive paths |
| CN102946695A (en)* | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN105792545A (en)* | 2016-03-25 | 2016-07-20 | 柏承科技(昆山)股份有限公司 | PCB half hole forming process |
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20050130480A1 (en)* | 2002-12-12 | 2005-06-16 | Broadcom Corporation | Via providing multiple electrically conductive paths |
| CN102946695A (en)* | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN105792545A (en)* | 2016-03-25 | 2016-07-20 | 柏承科技(昆山)股份有限公司 | PCB half hole forming process |
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108770200A (en)* | 2018-06-14 | 2018-11-06 | 生益电子股份有限公司 | PCB (printed circuit board) |
| CN114206000A (en)* | 2021-12-24 | 2022-03-18 | 维沃移动通信有限公司 | Circuit Board Assemblies and Electronics |
| CN116321805A (en)* | 2022-12-28 | 2023-06-23 | 沪士电子股份有限公司 | Preparation method of PCB with stepped groove |
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