Background technology
The most popular method that the mankind are checked body surface and accessible tissue is palpation.Utilize array of pressure sensorsThe meisner corpusculum tactus that simulation is arranged in human skin carries out bionical palpation, you can realizes and the exception of tissue to be checked is enteredRow screens the process of detection.
The static characteristics such as the long-term reliability of pressure sensor, humiture stability, repeatability, null offset, sensorThe mechanical property of thickness and its force-sensitive material, all it is an important factor for influenceing pressure sensor performance.Detect elastic pressure pointCloth just needs the array that identical single pressure sensor is formed to complete, and the homogenieity and sensor of each pressure sensorThe factors such as the homogeneity of spacing, the laminate structures pretension of array can all influence the application effect of array of pressure sensors.For treatingExamine the profile of thing and the difference of modulus of elasticity, it is also necessary to handling flexibly is carried out to array of pressure sensors, and to realize pressure and passThe flexibility of sensor array, the homogenieity of each pressure sensor, the homogeneity of sensor spacing, the laminate structures pretension of arrayEtc. factor on conventional flex array of pressure sensors embody the problem of it is a lot.
Based on MEMS technology, proposed earliest by Stanford Univ USA Haller and Khuri Yakub research groupsCMUT（Capacitive micro-machined ultrasound transducer/ capacitive micromachined ultrasonic sensors）,Mems thin film is prepared using micro fabrication, the transmitting and reception of ultrasonic wave are realized using meagre vibration of membrane and oar song.WithTraditional PZT ultrasonic probes are compared, and CMUT eliminates necessary matching layer and backing in structure, is more suitable for array；In work(Can on can improve frequency bandwidth, FREQUENCY CONTROL are more flexible, sensitivity is higher, transmission power can be higher.But in actual clinical work,For the lesion of accessible tissue, it is most convenient and effective method to carry out palpation.Using ultrasound to accessible lesion tissue, especiallyIt is entity tumor, and carrying out detection, to occur susceptibility bad, the problem of local ultrasound heat production.The lesion that pair can touch tissue is carried outDiagnosis, ideal method is first to carry out palpation, wait to lay one's hand on and lump and needing further appreciate that its capsule, real property orDuring the information such as the depth in tissue, then combined echocardiography is detected, and can obtain more diagnostic messages.Once it is determined that swollen in tissueThe information such as the hardness of block, size, profile, depth, then HIFU Treatment is carried out in time, can more efficiently solve effects of clinic diagnosis.By breastLesion lump is shown in three dimensions in room, for patient, can more directly perceived, clearly understand the healthy shape of diagnosis and treatment personCondition, can also assist personnel progress condition assessment.
Fusion prepared by the present invention presses the capacitive MEMS sensor array of detection and ultrasound functions, and traditional pole span is becomeChange type capacitance pressure transducer, replaces with CMUT/ capacitive micromachined ultrasonic sensors, can improve a pressure sensorThe laminate structures pretension of the homogeneity and display of homogeneity and sensor spacing.Using this sensor array, biasing is integratedVoltage and driving voltage circuit, the warm MEMS sensor array for pressing detection function and ultrasound detection function can be built into.ThisArray is in conjunction with the detection module and display module for pressing detection function and ultrasound detection function, you can is configured to integral type spyHead, for detecting and treating the exception of accessible tissue.Fusion prepared by the present invention presses detection function and ultrasound detection functionCapacitive MEMS sensor array, the hardness of tumour in tissue, size, outer can only be detected by solving single pressure sensorShape, and the problems such as be difficult to judge the global shape of depth of the tumour in tissue, the capsule of tumour or entity property, tumour, alsoHigh frequency ultrasound treatment function can be realized by the effect of focus lamp.
The array structure of preferably silicone base capacitance MEMS single axial flexibilities of the invention, it is secondary to select PDMS flexibility low frequencies CMUTArray.The array can apply the detecting head surface, finger end surfaces, hand in any shape with backing formula, inserted, finger cot type methodOn art apparatus, for detecting the lesion for the treatment of local organization.
The content of the invention
It is an object of the invention to provide a kind of capacitive MEMS sensor array, including at least three longitudinal arrangement to be multiplied byThe transversely arranged capacitive MEMS sensor of at least three, the capacitive MEMS sensor include focus layer, Top electrode, upper electricityPole lead-out wire, Top electrode end tab, the compound lead-in plate of Top electrode data, vibrations film, clearance cavity, supporting layer, insulating barrier, underElectrode, bottom electrode lead-out wire, bottom electrode end tab, the compound lead-in plate of bottom electrode data, array substrate layer, the focus layer are located atTop electrode upper strata, overall outer surface are in open and flat shape, and the Top electrode is vertical corresponding with bottom electrode, and the vibrations film is selectedSi/Si3N4/SiO2Composite membrane, ensure its spreading, the bottom electrode is brought into close contact with array substrate layer, the array substrate layerLateral surface is in integrally open and flat shape, and array substrate layer medial surface removes pinnacle Pyramid or ground in the inversion of discontinuous ruleBowl shape.The capacitive MEMS sensor array also includes automatic switch unit and imaging signal integral unit, described automaticSwitch unit controls capacitive MEMS sensor to switch between functional status and ultrasound functions state pressing, and controls condenser typeMEMS sensor collection presses signal or ultrasonic signal；The imaging signal integral unit receives each capacitive MEMS sensingDevice output presses signal and/or ultrasonic signal, and cross section size, shape data signal and the ultrasound that will press signal acquisitionBeing integrated apart from skin depth, capsule reality data-signal for signal acquisition, exports the three-dimensional configuration data-signal of solid.
For the thickness of the vibrations film between 0.5 micron to 5 microns, the bottom electrode is fitted tightly over array substrateLayer, the bottom electrode are in different shape because array substrate layer shape is different, such as open and flat shape, mortar shape, are inverted and remove pointPush up Pyramid.The preferred flexible printed circuit board of array substrate layer, it is secondary to select the hard materials such as silicon, resin.The focusingLayer can be built by synthetic resin and is made.The close docile of capacitive MEMS sensor array is in single axial hardness sizing backingOn, because sizing backing shape is different, upper surface is prepared into as plane, curved surface, the different arrays of annular.
The capacitive MEMS sensor array also includes ultrasound functions IC chip and presses detection ic corePiece, electrode data composite cable, the electrode data composite cable includes Top electrode data composite cable and bottom electrode data are answeredZygonema cable, the compound lead-in plate of the Top electrode data and the compound lead-in plate of bottom electrode data pass through automatic switch unit and ultrasonic work(Energy IC chip connects with detection IC chip is pressed.The compound lead-in plate of Top electrode data and bottom electrode data are compoundLead-in plate mainly by Top electrode data composite cable and bottom electrode data composite cable and ultrasound functions IC chip andDetection IC chip connection is pressed, completes data signal transmission.
The capacitive MEMS sensor array can also set FPGA timing controllers, the FPGA SECO corePiece controls ultrasound functions IC chip or presses detection IC chip respectively, realizes that capacitive MEMS senses respectivelyThe ultrasound functions detection of device array presses Function detection.The achievable diagnoses and treatment of ultrasound functions IC chipPattern includes mode A, M-mode, B-mode, 3D patterns, doppler mode, high frequency focusing therapy pattern.
The automatic switch unit is analyzed and condenser type is calculated according to the detection signal that presses of capacitive MEMS sensorNeed to switch to the part of ultrasound functions in MEMS sensor, and then open the partition capacitance formula MEMS sensor and realize ultrasonic work(Can, after the completion of detection, the automatic switch unit makes capacitive MEMS sensor recover to pressing function.Above-mentioned automatic switchover listThe signal that presses that member gathers when being according to capacitive MEMS sensor and press functional status automatically selects partition capacitance formula MEMSSensor, the capacitive MEMS sensor of selection is then switched into ultrasound functions state, collection ultrasound from functional status is pressedSignal.Because what capacitive MEMS sensor gathered when pressing functional status presses signal and can determine the horizontal stroke in lump region substantiallyCross-sectional sizes, but need the depth and lump depth direction of ultrasound functions state acquisition lump region located subcutaneously tissueLength.Above-mentioned imaging signal integral unit obtains lump in breast according to the palpation signal data and ultrasonic signal data of acquisitionThree-dimensional configuration data message, specific practice are in for capacitive MEMS sensor array and pressed under mode of operation, will obtain breastMiddle lump corresponds to the data messages such as the size of array force direction cross section, shape.Array is under the super mode of operations of A, willObtain lump in breast and correspond to array force direction apart from data messages such as skin depth, capsule realities, as needed to breastSurface is marked, more accurately to point out the position of lump.
The detection IC chip that presses includes small capacitance detection unit and analog-to-digital conversion control unit, described micro-Small capacitances detection unit and analog-to-digital conversion control unit are by electrode data composite cable, by automatic switch unit, then viaThe compound lead-in plate of Top electrode data and the compound lead-in plate of bottom electrode data are connected with the Top electrode and bottom electrode of array respectively.
The focus layer is provided with focus lamp.The focus lamp is in integrally reverse pyramid, and the focus lamp is according to FresnelLens principle, thin sheet lens are formed by polyolefine material injection pressure, realize focusing function.The preferred PDMS of the focus lamp（Poly dimethylSiloxanes）、RTV（Room temperature vulcanized silicone rubber）, polyethylene, one or more solid polymers composition in polyimides, secondary choosingThe liquid polymerses such as glycerine, gel form.The focus layer outer layer is plane, and internal layer is the focus lamp of inverted pyramid shape, goldenThe length and height of word bottom of towe are respectively 1/4 and 1/10 and its integer multiple of ultrasonic wavelength, by taking 15MHz ultrasound as an example,The pyramid bottom length and pyramidal height of focus lamp are respectively 25 microns and 10 microns, and the focal length of formation is very short.It is although electricAppearance formula MEMS pressure sensor, because of acoustic impedance 1.5 MRayls of its acoustic impedance and water and tissue, it is similar withoutWith layer, but the matching layer of conventional piezoelectric ultrasonic probe is substituted for the focus layer of CMUT arrays and realizes focusing function, binding numberThe focusing of individual CMUT arrays, available for nearly burnt HIFU Treatment.
The capacitive MEMS sensor also includes pressure distribution diaphragm, and the pressure distribution diaphragm is located at focus layerUpper strata or lower floor, the focus layer and pressure distribution diaphragm combine together, common docile is in array surface.The pressureDistribute diaphragm and select the material similar to being detected organism acoustic impedance, such as Parylene, TPU, polyimides, polyurethane, ringOne or more compounds composition in oxygen tree fat.
Top electrode lead-out wire, the bottom electrode lead-out wire of the capacitive MEMS sensor outwards lead to adjacent sensorsCentre, and the part along longitudinally, laterally traveling between adjacent rows sensor.Top electrode lead-out wire is in sensor arraySide forms Top electrode end tab, and Top electrode end tab is connected with the compound lead-in plate of Top electrode data.Bottom electrode lead-out wire existsThe side of sensor array forms bottom electrode end tab, and bottom electrode end tab is connected with the compound lead-in plate of bottom electrode data.
The Top electrode, Top electrode lead-out wire, Top electrode end tab, the compound lead-in plate of Top electrode data, bottom electrode, lower electricityPole lead-out wire, bottom electrode end tab, the Graphic Design that the compound lead-in plate of bottom electrode data is deposited or prepared by etching, materialSelect one kind in gold, silver, copper, graphene.
The capacitive MEMS sensor array can be multiplied by the capacitive MEMS that at least three arranges in length and breadth by least three and be passedSensor cluster composition presses detection unit, and wherein any one capacitive MEMS sensor can complete ultrasound functions, describedPress detection unit and ultrasound functions unit is fused to form array together completely.The detection unit that presses is to realize to press inspectionThe base unit of brake, this presses detection unit and can be multiplied by least three by capacitive MEMS sensor with least three arranges in length and breadthThe form cluster of row is into being connected and be integrated in Top electrode lead-out wire, bottom electrode lead-out wire by electrode data composite cableIn one circuit board.When pressing detection, automatic switch unit makes capacitive MEMS sensor be touched in functional status, collection is pressedPress signal；Then, partition capacitance formula MEMS sensor progress ultrasound works are automatically selected according to the signal that presses of collection, it is described superSound function includes transmitting ultrasound and receives ultrasound, and chronologically controls the transmitting of adjacent capacitor formula MEMS sensor and receive journeySequence, it can also launch according to a column capacitance formula MEMS sensor, the program that adjacent capacitor formula MEMS sensor receives is carried out.
Certainly, the capacitive MEMS sensor array can also be divided into two regions, and first area is set in two regionsIt is set to and presses detection unit, realization presses detection, and second area is arranged to ultrasound functions unit, realizes ultrasound functions.It is described to meltConjunction, which presses detection unit and the capacitive MEMS sensor array of ultrasound functions unit, to form full fusion type according to function needsArray and semi-fusion formula array.The physical arrangement of so-called full fusion type array is just the same, each electricity in full fusion type arrayAppearance formula MEMS sensor has identical physical arrangement, shape, centre frequency and bandwidth；Each electric capacity in semi-fusion formula arrayFormula MEMS sensor can have different structures, centre frequency and bandwidth.Certainly, semi-fusion formula array, which may be designed in, pressesArray and supersonic array are integrated on an array, if planar array, press array and supersonic array each Fen Zhanyige areasDomain；If curved array, the mutual back-to-back arrangement on curved surface of array and supersonic array is pressed.This fusion presses detection and ultrasoundThe capacitive MEMS sensor array of function, preferable full fusion type array are secondary to select semi-fusion formula array.
Embodiment：
As shown in Fig. 1,2,8, a kind of capacitive MEMS sensor array, including at least three longitudinal arrangement are multiplied by least three transverse directionThe capacitive MEMS sensor 6 of arrangement, the capacitive MEMS sensor 6 include focus layer 4, Top electrode 1, Top electrode lead-out wire11, Top electrode end tab 12, the compound lead-in plate 14 of Top electrode data, shake film 31, clearance cavity 32, supporting layer 33, insulationLayer 34, bottom electrode 2, bottom electrode lead-out wire 21, bottom electrode end tab 22, the compound lead-in plate 24 of bottom electrode data, array substrate layer35, the focus layer 4 is located at the upper strata of Top electrode 1, and overall outer surface is in open and flat shape, and the Top electrode 1 is vertical with bottom electrode 2 rightShould, the vibrations film 31 selects Si/Si3N4/SiO2Composite membrane, ensures its spreading, and the bottom electrode 2 is fitted tightly over battle arrayRow basalis 35, the lateral surface of array substrate layer 35 are in integrally open and flat shape, and the medial surface of array substrate layer 35 is advised in discontinuousPinnacle Pyramid or mortar shape are removed in the inversion of rule.To ensure, the conversion of function and ultrasound functions, the electric capacity are pressedFormula MEMS sensor array also includes automatic switch unit 71 and imaging signal integral unit 72, and the automatic switch unit 71 is controlledCapacitive MEMS sensor 6 processed switches between functional status and ultrasound functions state pressing, control capacitive MEMS sensor 6Collection presses signal or ultrasonic signal；The imaging signal integral unit 72 receives each capacitive MEMS sensor 6 and exportedPress signal and/or ultrasonic signal, and the cross section size for pressing signal acquisition, shape data signal and ultrasonic signal are adoptedBeing integrated apart from skin depth, capsule reality data-signal for collection, exports the three-dimensional configuration data-signal of solid.
The main fabrication processing of capacitive MEMS sensor array is：
The first step, top crown wafer1 selection thickness is 300um, 4 cun of SOI twin polishing silicon wafer to manufacture top crowns parts.
1st, reverse side gluing, photoetching, develop figure, by deep silicon etching technique, be etched through whole silicon chip, form bondingThe alignment mark that top crown is bonded during technique.
Second step, bottom crown wafer2 selection thickness is 300um, 4 cun of twin polishing silicon wafer to manufacture bottom crown parts.
1st, front is by special gluing, photoetching, development and silicon etching process, formed inversion go pinnacle Pyramid orPerson's mortar shape, to increase bottom electrode plate suqare, A/F 100um.
2nd, deposited metal Al, thickness 0.5um, then by gluing, photoetching, development and Al etching technics, form inversion and remove pointPush up bottom electrode 2, bottom electrode lead 21, the bottom electrode end tab 22 of Pyramid or mortar shape.
3rd, by oxidation technology, SiO is deposited, thickness 1um, this oxide layer is insulating barrier 12, can both play vibrations filmThe effect of 31 isolation can be used as bonding layer again.
4th, reverse side gluing, photoetching, develop figure, by silicon etching process, bottom crown bonding when forming bonding technologyAlignment mark.
5th, reverse side deposited metal Al, thickness 0.5um, then by gluing, photoetching, development and Al etching technics, formed compoundCable.
3rd step, upper bottom crown bonding, using the alignment mark of upper bottom crown, by anode linkage technique, completeWafer1 reverse side and the positive bondings of wafer2.
4th step, remove technique.
1st, the front side silicon layer of wafer1 after bonding is removed using TMAH solution.
2nd, wafer1 oxygen buried layer is removed using BOE solution.
3rd, silica and silicon nitride composite membrane are successively deposited using PECVD device, thickness be respectively 0.2um and0.3um, form compound vibrations film 31.
4th, in front deposited metal Al, the thickness 0.5um of upper and lower bonding pad, then gluing, photoetching, development and Al etching are passed throughTechnique, form Top electrode 1, Top electrode lead 11, the end tab 12 of Top electrode.
5th, using through-silicon-via technology or side electrode process, respectively by Top electrode end tab, bottom electrode end tab withComposite cable establishes electrical connection.
5th step, the making of integrated chip unit
1st, automatic switch unit 71, imaging signal integral unit 72 are respectively completed using ic manufacturing process, press detectionThe making of integrated circuit and ultrasound functions integrated circuit.
6th step, the fitting of integrated unit
1st, using insulating cement by automatic switch unit 71, imaging signal integral unit 72, press detection integrated circuit and ultrasonic work(Energy integrated circuit is attached to the reverse side of upper and lower bonding pad.
2nd, using lead key closing process by automatic switch unit 71, imaging signal integral unit 72, press the integrated electricity of detectionRoad and ultrasound functions integrated circuit are established with composite cable to be electrically connected, as shown in Figure 2.
7th step, docile focus layer 4, cutting, routing.
The Top electrode 1, Top electrode lead-out wire 11, Top electrode end tab 12, the compound lead-in plate 14 of Top electrode data, lower electricityPole 2, bottom electrode lead-out wire 21, bottom electrode end tab 22, the compound lead-in plate 24 of bottom electrode data is deposited or prepared by etchingGraphic Design, material can select one kind in gold, silver, copper, aluminium, graphene.
As shown in figure 1, the focus layer 4 is provided with focus lamp 42, it is in reverse pyramid that the focus lamp 42 is overall, pyramidBottom lengths are 1/4 or the multiple that capacitive MEMS sensor 6 produces ultrasonic wavelength, and pyramidal height is condenser typeMEMS sensor 6 produces 1/10 or multiple of ultrasonic wavelength.The capacitive MEMS sensor 6, which also includes pressure distribution, to be protectedCuticula 41, the pressure distribution diaphragm 41 are located at the lower floor of focus layer 4, and the focus layer 4 is melted with pressure distribution diaphragm 41It is integrated, common docile is in array surface.
Experiment one：Experimental study is carried out to the performance of the capacitive MEMS sensor array, is used for analyzing the structureThe feasibility of palpation.
Experiment method：The probe stress summation being made up of 192 functional units is about 2000 grams, average each function10 grams or so of unit stress, it is contemplated that probe puts on each functional unit during skin and non-stress is just the same, through consideration, takes and appliesForce value is 30 grams（0.3N）.Based on single functional unit, being applicable for palpation is used for by experiment discussion CMUT functional unitsProperty, experimental provision as shown in fig. 7, comprises：Pressure test workbench 8, pressure adjustment knob 81, pressure ball 82, PCap02 are assessedExternal member 83, PC84, testing sample 9.
As shown in fig. 7,0 N is applied to the functional unit of testing sample 9（Light Condition）, 0.06 N, 0.12 N, 0.18 N,0.24 N, external member 83 is assessed to capacitive MEMS sensor array to be measured by PCap02（Size 2mm × 2mm）Basis electricityCapacitance and capacitance variations value are measured and analyzed.
| Apply pressure/N | 0.06 | 0.12 | 0.18 | 0.24 | 0.3 |
| Capacitance change/PF | 0.205 | 0.403 | 0.709 | 1.001 | 1.428 |
Experimental result:When applying the pressure that palpation is adapted, capacitive MEMS sensor array has good sensitivityWith it is linear, while there is good anti-interference and stability.
As shown in Fig. 2 the Top electrode lead-out wire 11 of the capacitive MEMS sensor 6, bottom electrode lead-out wire 21 are laterallyLead to the centre of adjacent sensors, and the part along longitudinally, laterally traveling between adjacent rows sensor.
As shown in figure 3, the array press part by least three be multiplied by 3 capacitive MEMS sensor groups into, it is described fromDynamic switch unit 71 is analyzed and capacitive MEMS sensor 6 is calculated according to the detection signal that presses of capacitive MEMS sensor 6The middle part for needing to switch to ultrasound functions, and then open capacitive MEMS sensor 6 and realize ultrasound functions, after the completion of detection,The automatic switch unit 71 makes capacitive MEMS sensor 6 recover to pressing function.As shown in figure 3, functionally it is used as superSound unit, for launching and receiving ultrasonic signal, available for detection lump depth or identification lump capsule reality and depth directionLength, the ultrasound functions unit can also use ripe PMUT/ piezoelectric supersonics unit to substitute.Ultrasound unit is also used for specific feelingsUltrasonic therapy under condition.What the imaging signal integral unit 72 received that each capacitive MEMS sensor 6 exports presses signalAnd/or ultrasonic signal, and by press the cross section size of signal acquisition, shape data signal and ultrasonic signal acquisition apart from skinSkin depth, capsule reality data-signal are integrated, and export the three-dimensional configuration data-signal of solid.
As shown in figure 4, the capacitive MEMS sensor array also includes ultrasound functions IC chip 51 and pressedIC chip 52, electrode data composite cable 36 are detected, the electrode data composite cable 36 is answered including Top electrode dataZygonema cable 361 and bottom electrode data composite cable 362, the compound lead-in plate 14 of the Top electrode data and bottom electrode data are compound drawsEnter plate 24 by electrode data composite cable 36 respectively with ultrasound functions IC chip 51 and pressing detection ic corePiece 52 connects.The capacitive MEMS sensor array also includes FPGA timing controllers 53, the FPGA SECO corePiece 53 controls ultrasound functions IC chip 51 or presses detection IC chip 52 respectively, realizes ultrasound functions respectivelyOr press detection.
As shown in figure 1, the detection IC chip 52 that presses includes small capacitance detection unit and analog-to-digital conversion controlUnit processed, the small capacitance detection unit and analog-to-digital conversion control unit are by automatic switch unit, then pass through electrode dataComposite cable 36, then it is upper with array respectively via the compound lead-in plate 14 of Top electrode data and the compound lead-in plate 24 of bottom electrode dataElectrode 1 and bottom electrode 2 connect.
As shown in figure 5, the capacitive MEMS sensor array, which shows 6, is multiplied by 6 capacitive MEMSs arranged in length and breadth biographiesThe cluster of sensor 6 composition presses detection unit 61, wherein any one column capacitance formula MEMS sensor 6 is formed ultrasonic work(with longitudinal arrangementCan unit 62, it is described to press detection unit 61 and ultrasound functions unit 62 is fused to form array together completely.As shown in fig. 6,The capacitive MEMS sensor array can also be divided into two regions 63, and first area 631 is arranged to press in two regions 63Detection unit 61, realization press detection, and second area 632 is arranged to ultrasound functions unit 62, realizes ultrasound functions.
The implementation method of automatic switch unit：Common single-chip microcomputer can be selected（IC）As hardware support, it is multiplied by using at least 33 two-dimensional array, the array can be used for storage and press the pressure signal data gathered under pattern.Data are analyzed, countedCalculate, obtain pressure value in array and be more than line number and row number corresponding to the functional unit of certain threshold value, and using line number and row number asThe output of automatic switch unit is used to control the part that will be needed in array from pattern switching is pressed to ultrasound mode.The threshold valueIt can be set according to being actually needed.Other feasible modes can be selected to realize IC making.Of course, will can also cut automaticallyChange unit to be integrated on a silicon chip with array, can be integrated in top crown can also be integrated on bottom crown.Can also rootAccording to needing to be divided into two parts, a part is integrated in top crown and another part is integrated in bottom crown, then passes through lead and establishes letterNumber connection.It can also be placed between bottom crown.
Imaging signal integral unit：Common single-chip microcomputer can be selected（IC）As hardware support, it is multiplied by 3 using at least 3 and is multiplied by 3Three-dimensional array, the array can be used for storage and presses the pressure signal data that are gathered under pattern（Include two dimension）And ultrasound modeThe depth data of lower collection（Comprising one-dimensional）.2-D data is analyzed, calculated, pressure value in array is obtained and is more than certain thresholdLine number and row number corresponding to the functional unit of value, the area corresponding to these functional units is added and can obtain lump cross sectionPreliminary size.Preliminary size corrected by being multiplied by certain coefficient after sectional area size, acquire under ultrasound mode and holdLump is from the length data on the depth data and lump depth direction of skin surface at the functional unit of row ultrasound functions.Will be upperState cross-sectional data, depth data and depth direction length data to integrate, the data after integration can be used for three-dimensional imaging.The thresholdValue can be set according to being actually needed.Other feasible modes can be selected to realize IC making.Of course, will can also be imagedSignal integration unit is integrated on a silicon chip with array, and can be integrated in top crown can also be integrated on bottom crown.Two parts can be divided into as needed, a part is integrated in top crown and another part is integrated in bottom crown, then passes through leadEstablish signal connection.It can also be placed between bottom crown.