技术领域technical field
本发明是有关于一种电子装置、及其控制方法与制造方法,且特别是有关于一种具有指纹辨识模块的电子装置、及其控制方法与制造方法。The present invention relates to an electronic device, its control method and manufacturing method, and in particular to an electronic device with a fingerprint recognition module, its control method and its manufacturing method.
背景技术Background technique
随着科技的进步,各式电子装置不断推陈出新。随着电子装置的功能增加,个人数据被窃取的风险也越来越高。为了避免个人数据遭到窃取,许多电子装置均搭载着指纹辨识模块。使用者可以透过指纹辨识模块将指纹设定为登入密码,以防止他人使用此电子装置。With the advancement of science and technology, various electronic devices are constantly being introduced. As the functionality of electronic devices increases, so does the risk of personal data being stolen. In order to prevent personal data from being stolen, many electronic devices are equipped with fingerprint identification modules. The user can set the fingerprint as a login password through the fingerprint identification module to prevent others from using the electronic device.
发明内容Contents of the invention
本发明有关于一种电子装置、及其控制方法与制造方法,其利用设置于同一基板的触控感应电路及指纹辨识模块,以达成轻、薄、短、小的目标,并且更透过检测电路来管理指纹辨识模块的运作。The invention relates to an electronic device, its control method and manufacturing method, which utilizes a touch sensing circuit and a fingerprint recognition module arranged on the same substrate to achieve light, thin, short and small goals, and is more transparent to detection The circuit is used to manage the operation of the fingerprint identification module.
根据本发明的第一方面,提出一种电子装置。电子装置包括一基板、一触控感应电路、一指纹辨识模块、一检测电路及一处理单元。触控感应电路设置于基板上。指纹辨识模块设置于基板上。检测电路设置于基板上。检测电路位于指纹辨识模块的周围,以检测一手指接触的一感应信号。处理单元依据感应信号控制指纹辨识模块。According to a first aspect of the present invention, an electronic device is provided. The electronic device includes a substrate, a touch sensing circuit, a fingerprint identification module, a detection circuit and a processing unit. The touch sensing circuit is arranged on the substrate. The fingerprint identification module is arranged on the substrate. The detection circuit is arranged on the substrate. The detection circuit is located around the fingerprint identification module to detect an induction signal of a finger contact. The processing unit controls the fingerprint identification module according to the sensing signal.
根据本发明的第二方面,提出一种电子装置的控制方法。电子装置包括一基板、一触控感应电路、一指纹辨识模块、一检测电路及一处理单元。触控感应电路设置于基板上,指纹辨识模块设置于基板上。检测电路设置于基板上且位于指纹辨识模块的周围。控制方法包括以下步骤。以检测电路检测一手指接触的一感应信号。处理单元依据感应信号控制指纹辨识模块。According to a second aspect of the present invention, a method for controlling an electronic device is provided. The electronic device includes a substrate, a touch sensing circuit, a fingerprint identification module, a detection circuit and a processing unit. The touch sensing circuit is arranged on the substrate, and the fingerprint recognition module is arranged on the substrate. The detection circuit is arranged on the substrate and is located around the fingerprint identification module. The control method includes the following steps. A sensing signal of a finger contact is detected by the detection circuit. The processing unit controls the fingerprint identification module according to the sensing signal.
根据本发明的第三方面,提出一种电子装置的制造方法。电子装置的制造方法包括以下步骤。提供一基板。形成一触控感应电路、一检测电路及数个导电接点于基板上。检测电路位于此些导电接点的周围。形成一异方性导电胶(Anisotropic Conductive Film,ACF)于此些导电接点上。设置一指纹辨识模块于异方性导电胶上,以电性连接指纹辨识模块及此些导电接点。According to a third aspect of the present invention, a method for manufacturing an electronic device is provided. A method of manufacturing an electronic device includes the following steps. A substrate is provided. A touch sensing circuit, a detection circuit and several conductive contacts are formed on the substrate. The detection circuit is located around the conductive contacts. An anisotropic conductive film (ACF) is formed on the conductive contacts. A fingerprint identification module is arranged on the anisotropic conductive adhesive to electrically connect the fingerprint identification module and the conductive contacts.
为了对本发明的上述及其他方面有更佳的了解,下文特举较佳实施例,并配合附图,作详细说明如下:In order to have a better understanding of the above-mentioned and other aspects of the present invention, the preferred embodiments are specifically cited below, together with the accompanying drawings, and are described in detail as follows:
附图说明Description of drawings
图1绘示依据一实施例的一电子装置的示意图。FIG. 1 is a schematic diagram of an electronic device according to an embodiment.
图2绘示图1的电子装置沿截面线A-A’的剖面图。FIG. 2 is a cross-sectional view of the electronic device of FIG. 1 along the section line A-A'.
图3绘示根据另一实施例的电子装置的示意图。FIG. 3 is a schematic diagram of an electronic device according to another embodiment.
图4绘示一检测单元的示意图。FIG. 4 is a schematic diagram of a detection unit.
图5绘示根据一实施例的指纹辨识模块与检测电路的示意图。FIG. 5 is a schematic diagram of a fingerprint identification module and a detection circuit according to an embodiment.
图6绘示根据另一实施例的指纹辨识模块与检测电路的示意图。FIG. 6 is a schematic diagram of a fingerprint recognition module and a detection circuit according to another embodiment.
图7绘示根据另一实施例的指纹辨识模块与检测电路的示意图。FIG. 7 is a schematic diagram of a fingerprint recognition module and a detection circuit according to another embodiment.
图8绘示根据另一实施例的指纹辨识模块与检测电路的示意图。FIG. 8 is a schematic diagram of a fingerprint recognition module and a detection circuit according to another embodiment.
图9绘示根据一实施例的电子装置的控制方法的流程图。FIG. 9 is a flowchart of a method for controlling an electronic device according to an embodiment.
图10绘示根据一实施例的图9的步骤S120的细部流程图。FIG. 10 shows a detailed flowchart of step S120 in FIG. 9 according to an embodiment.
图11绘示根据另一实施例的图9的步骤S120的细部流程图。FIG. 11 shows a detailed flowchart of step S120 of FIG. 9 according to another embodiment.
图12绘示根据另一实施例的图9的步骤S120的细部流程图。FIG. 12 shows a detailed flowchart of step S120 of FIG. 9 according to another embodiment.
图13A~13D绘示根据一实施例的电子装置的制造方法的示意图。13A-13D are schematic diagrams illustrating a manufacturing method of an electronic device according to an embodiment.
其中,附图标记:Among them, reference signs:
100、200:电子装置100, 200: electronic devices
110、210:基板110, 210: Substrate
120、220:触控感应电路120, 220: touch sensing circuit
130、230、330、430、530、630:指纹辨识模块130, 230, 330, 430, 530, 630: fingerprint identification module
140、240、340、440、540、640:检测电路140, 240, 340, 440, 540, 640: detection circuit
150、250:处理单元150, 250: processing unit
160:导电接点160: conductive contact
170:异方性导电胶170: Anisotropic conductive adhesive
180:保护板180: Protection board
190、290:壳体190, 290: shell
A、A’:截面线A, A': section line
RX:接收电路RX: receiving circuit
S1:感应信号S1: induction signal
S110、S120、S121、S122、S123、S124、S125、S126:流程步骤S110, S120, S121, S122, S123, S124, S125, S126: process steps
SU、SU4、SU5、SU6:检测单元SU, SU4, SU5, SU6: detection unit
TX:传送电路TX: transmit circuit
具体实施方式detailed description
请参照图1及图2,图1绘示依据一实施例的一电子装置100的示意图,图2绘示图1的电子装置100沿截面线A-A’的剖面图。电子装置100例如是一智能型手机、一平板电脑、一触控荧幕、或一笔记型电脑。图1的电子装置100以智能型手机为例作说明。电子装置100包括一基板110、一触控感应电路120、一指纹辨识模块130、一检测电路140、一处理单元150及一壳体190。基板110、指纹辨识模块130、检测电路140及处理单元150位于壳体190的内部,故以虚线表示。Please refer to FIG. 1 and FIG. 2 , FIG. 1 shows a schematic diagram of an electronic device 100 according to an embodiment, and FIG. 2 shows a cross-sectional view of the electronic device 100 in FIG. 1 along the section line A-A'. The electronic device 100 is, for example, a smart phone, a tablet computer, a touch screen, or a notebook computer. The electronic device 100 in FIG. 1 is illustrated by taking a smart phone as an example. The electronic device 100 includes a substrate 110 , a touch sensing circuit 120 , a fingerprint recognition module 130 , a detection circuit 140 , a processing unit 150 and a casing 190 . The substrate 110 , the fingerprint identification module 130 , the detection circuit 140 and the processing unit 150 are located inside the housing 190 , and are therefore indicated by dotted lines.
指纹辨识模块130用以进行指纹辨识,以提高电子装置100的安全等级。触控感应电路120形成一触控面板(或触控板),以提供使用者直觉地进行触控操作。在本实施例中,触控感应电路120及指纹辨识模块130设置于同一基板110上。如此一来,触控感应电路120及指纹辨识模块130可以共用一个连接器及排线,而减少元件的数量,以达成轻、薄、短、小的目标。The fingerprint recognition module 130 is used for fingerprint recognition to improve the security level of the electronic device 100 . The touch sensing circuit 120 forms a touch panel (or touchpad) to provide users with intuitive touch operations. In this embodiment, the touch sensing circuit 120 and the fingerprint identification module 130 are disposed on the same substrate 110 . In this way, the touch sensing circuit 120 and the fingerprint identification module 130 can share a connector and a cable, thereby reducing the number of components, so as to achieve light, thin, short, and small goals.
检测电路140设置于基板110上。检测电路140位于指纹辨识模块130的周围。由于检测电路140位于指纹辨识模块130的周围,当手指接触指纹辨识模块130时,检测电路140必然会检测到手指而产生一感应信号S1。透过感应信号S1,即可得知指纹辨识模块130是否被操作。The detection circuit 140 is disposed on the substrate 110 . The detection circuit 140 is located around the fingerprint identification module 130 . Since the detection circuit 140 is located around the fingerprint recognition module 130, when a finger touches the fingerprint recognition module 130, the detection circuit 140 will definitely detect the finger and generate a sensing signal S1. Whether the fingerprint identification module 130 is operated can be known through the sensing signal S1.
处理单元150即可依据感应信号S1控制指纹辨识模块130。处理单元150例如是一芯片、一固件电路、或储存多组程序码的一储存装置。举例来说,处理单元150可以依据感应信号S1来管理指纹辨识模块130的电源模式、或者处理单元150可以依据感应信号S1来管理指纹辨识模块130的辨识方式、或者处理单元150可以依据感应信号S1来管理指纹辨识模块130的辨识精细度。The processing unit 150 can control the fingerprint identification module 130 according to the sensing signal S1. The processing unit 150 is, for example, a chip, a firmware circuit, or a storage device storing multiple sets of program codes. For example, the processing unit 150 can manage the power mode of the fingerprint recognition module 130 according to the sensing signal S1, or the processing unit 150 can manage the recognition mode of the fingerprint recognition module 130 according to the sensing signal S1, or the processing unit 150 can manage the recognition mode of the fingerprint recognition module 130 according to the sensing signal S1 To manage the recognition fineness of the fingerprint recognition module 130 .
请参照图3,其绘示根据另一实施例的电子装置200的示意图。图3的电子装置200以一笔记型电脑为例作说明。电子装置200包括一基板210、一触控感应电路220、一指纹辨识模块230、一检测电路240、一处理单元250及一壳体290。指纹辨识模块230、检测电路240及处理单元250均位于壳体290的内部,故以虚线表示。触控感应电路220形成一触控板,以提供使用者移动游标或书写文字。图3的基板210、触控感应电路220、指纹辨识模块230、检测电路240及处理单元250类似于图1的基板110、触控感应电路120、指纹辨识模块130、检测电路140及处理单元150,相同之处不再重复赘述。Please refer to FIG. 3 , which is a schematic diagram of an electronic device 200 according to another embodiment. The electronic device 200 in FIG. 3 is illustrated by taking a notebook computer as an example. The electronic device 200 includes a substrate 210 , a touch sensing circuit 220 , a fingerprint recognition module 230 , a detection circuit 240 , a processing unit 250 and a casing 290 . The fingerprint recognition module 230 , the detection circuit 240 and the processing unit 250 are all located inside the housing 290 , and are therefore indicated by dotted lines. The touch sensing circuit 220 forms a touch panel for the user to move a cursor or write text. The substrate 210, touch sensing circuit 220, fingerprint recognition module 230, detection circuit 240 and processing unit 250 of FIG. 3 are similar to the substrate 110, touch sensing circuit 120, fingerprint recognition module 130, detection circuit 140 and processing unit 150 of FIG. , the similarities will not be repeated.
请参照图4,其绘示一检测单元SU的示意图。上述检测电路140、240可以由一个检测单元所组合、或由多个检测单元所组成。如图4所示,一个检测单元SU可以是由一传送电路TX及一接收电路RX所组成的指插型结构。Please refer to FIG. 4 , which shows a schematic diagram of a detection unit SU. The above-mentioned detection circuits 140, 240 may be combined by one detection unit, or composed of multiple detection units. As shown in FIG. 4 , a detection unit SU may be a finger-plug structure composed of a transmitting circuit TX and a receiving circuit RX.
以下进一步说明检测电路140、240的各种设计。请参照图5,其绘示根据一实施例的指纹辨识模块330与检测电路340的示意图。在图5的实施例中,检测电路340实质上完整环绕于指纹辨识模块330。如此一来,不论手指从那个方向靠近指纹辨识模块330,都能够被检测到。Various designs of the detection circuits 140, 240 are further described below. Please refer to FIG. 5 , which shows a schematic diagram of the fingerprint identification module 330 and the detection circuit 340 according to an embodiment. In the embodiment of FIG. 5 , the detection circuit 340 substantially completely surrounds the fingerprint recognition module 330 . In this way, no matter which direction the finger approaches the fingerprint recognition module 330, it can be detected.
请参照图6,其绘示根据另一实施例的指纹辨识模块430与检测电路440的示意图。在图6的实施例中,检测电路440包括4个检测单元SU4。此些检测单元SU4分别位于指纹辨识模块430的4个侧边。如此一来,可以精准地检测出手指按压于指纹辨识模块430的哪些侧边。Please refer to FIG. 6 , which shows a schematic diagram of a fingerprint identification module 430 and a detection circuit 440 according to another embodiment. In the embodiment of FIG. 6 , the detection circuit 440 includes four detection units SU4. The detection units SU4 are respectively located on four sides of the fingerprint identification module 430 . In this way, which side of the fingerprint recognition module 430 is pressed by the finger can be precisely detected.
请参照图7,其绘示根据另一实施例的指纹辨识模块530与检测电路540的示意图。在图7的实施例中,检测电路540包括数个检测单元SU5。此些检测单元SU5环绕于指纹辨识模块530的四个侧边,且每一侧边设置了两个以上的检测单元SU5。如此一来,可以精准地检测出手指按压于指纹辨识模块530的各个侧边的范围。Please refer to FIG. 7 , which shows a schematic diagram of a fingerprint recognition module 530 and a detection circuit 540 according to another embodiment. In the embodiment of FIG. 7 , the detection circuit 540 includes several detection units SU5. The detection units SU5 surround four sides of the fingerprint recognition module 530 , and each side is provided with more than two detection units SU5 . In this way, it is possible to accurately detect the area where the finger presses on each side of the fingerprint recognition module 530 .
请参照图8,其绘示根据另一实施例的指纹辨识模块630与检测电路640的示意图。在图8的实施例中,检测电路640包括数个检测单元SU6。此些检测单元SU6以两圈的结构环绕指纹辨识模块630。如此一来,可以精准地检测出手指按压于指纹辨识模块530的各个侧边的面积。在另一实施例中,此些检测单元SU6亦可以两圈以上(例如是三圈)的结构环绕指纹辨识模块630。Please refer to FIG. 8 , which shows a schematic diagram of a fingerprint identification module 630 and a detection circuit 640 according to another embodiment. In the embodiment of FIG. 8 , the detection circuit 640 includes several detection units SU6. The detection units SU6 surround the fingerprint identification module 630 in a double-circle structure. In this way, the area of each side of the fingerprint identification module 530 pressed by the finger can be accurately detected. In another embodiment, the detection units SU6 may surround the fingerprint recognition module 630 in a structure of more than two circles (for example, three circles).
上述图5~图8公开指纹辨识模块330~630与检测电路340~640的各种实施例。设计者可根据控制方法的需求,选用不同的设计。请参照图9,其绘示根据一实施例的电子装置的控制方法的流程图。以下以图1的电子装置100为例来说明图9的流程图。首先,在步骤S110中,以检测电路140检测手指接触的感应信号S1。在此步骤中,检测电路140可以一预定扫描频率检测感应信号S1。此扫描频率可以相同于触控感应电路120的扫描频率。The aforementioned FIGS. 5-8 disclose various embodiments of the fingerprint identification modules 330-630 and the detection circuits 340-640. Designers can choose different designs according to the requirements of the control method. Please refer to FIG. 9 , which shows a flowchart of a method for controlling an electronic device according to an embodiment. The flow chart of FIG. 9 will be described below by taking the electronic device 100 of FIG. 1 as an example. First, in step S110 , the detection circuit 140 detects the sensing signal S1 of finger contact. In this step, the detection circuit 140 can detect the sensing signal S1 at a predetermined scanning frequency. The scanning frequency can be the same as the scanning frequency of the touch sensing circuit 120 .
接着,在步骤S120中,处理单元150依据感应信号S1控制指纹辨识模块140。举例来说,处理单元150可以依据感应信号S1来管理指纹辨识模块130的电源模式、或者处理单元150可以依据感应信号S1来管理指纹辨识模块130的辨识方式、或者处理单元150可以依据感应信号S1来管理指纹辨识模块130的辨识精细度。以下更进一步详细说明步骤S120的各种实施例。Next, in step S120, the processing unit 150 controls the fingerprint identification module 140 according to the sensing signal S1. For example, the processing unit 150 can manage the power mode of the fingerprint recognition module 130 according to the sensing signal S1, or the processing unit 150 can manage the recognition mode of the fingerprint recognition module 130 according to the sensing signal S1, or the processing unit 150 can manage the recognition mode of the fingerprint recognition module 130 according to the sensing signal S1 To manage the recognition fineness of the fingerprint recognition module 130 . Various embodiments of step S120 are further described in detail below.
请参照图10,其绘示根据一实施例的图9的步骤S120的细部流程图。在步骤S121中,处理单元150判断检测电路140是否于一预定时间之内未检测到感应信号S1。若检测电路140于预定时间之内未检测到感应信号S1,则进入步骤S122;若检测电路140于预定时间之内检测到感应信号S1,则回至步骤S121。预定时间例如是2、5、或10秒。也就是说,指纹辨识模块130在预定时间都没有被手指靠近时,流程将进入步骤S122。Please refer to FIG. 10 , which shows a detailed flowchart of step S120 in FIG. 9 according to an embodiment. In step S121 , the processing unit 150 determines whether the detection circuit 140 does not detect the sensing signal S1 within a predetermined time. If the detection circuit 140 does not detect the sensing signal S1 within the predetermined time, go to step S122; if the detection circuit 140 detects the sensing signal S1 within the predetermined time, go back to step S121. The predetermined time is, for example, 2, 5, or 10 seconds. That is to say, when the fingerprint identification module 130 is not approached by a finger within a predetermined time, the process will enter step S122.
在步骤S122中,处理单元150控制指纹辨识模块130进入一休眠状态、或控制指纹辨识模块130降低扫描频率。如此一来,指纹辨识模块130可以在不使用时,降低功率的损耗。In step S122, the processing unit 150 controls the fingerprint recognition module 130 to enter a sleep state, or controls the fingerprint recognition module 130 to reduce the scanning frequency. In this way, the fingerprint recognition module 130 can reduce power consumption when not in use.
上述图10的实施例需检测到是否有手指靠近指纹辨识模块130,故上述图5~8的实施例均可适用。The above-mentioned embodiment of FIG. 10 needs to detect whether there is a finger approaching the fingerprint recognition module 130, so the above-mentioned embodiments of FIGS. 5-8 are applicable.
请参照图11,其绘示根据另一实施例的图9的步骤S120的细部流程图。在步骤S123中,处理单元150依据感应信号S1分析出手指的一接触方向。举例来说,以上述图6的实施例为例,当感应信号S1显示左、右两侧的检测单元SU4有被接触,则表示手指的接触方向为水平方向;当感应信号S1显示上、下两侧的检测单元SU4有被接触,则表示手指的接触方向为垂直方向。Please refer to FIG. 11 , which shows a detailed flow chart of step S120 in FIG. 9 according to another embodiment. In step S123 , the processing unit 150 analyzes a contact direction of the finger according to the sensing signal S1 . For example, taking the above-mentioned embodiment of FIG. 6 as an example, when the sensing signal S1 shows that the detection units SU4 on the left and right sides are touched, it means that the contact direction of the finger is horizontal; when the sensing signal S1 shows that the up and down If the detection units SU4 on both sides are touched, it means that the contact direction of the finger is the vertical direction.
在步骤S124中,处理单元150依据接触方向,以一比对方向辨识手指的一指纹。如此一来,处理单元150可以直接以正确的比对方向进行辨识,大幅减少尝试错误的机会,而大幅增进辨识的速度。In step S124, the processing unit 150 identifies a fingerprint of the finger with a comparison direction according to the contact direction. In this way, the processing unit 150 can directly identify the correct comparison direction, greatly reducing the chance of trial and error, and greatly increasing the speed of identification.
上述图11的实施例需检测到手指的接触方向,故上述图6~8的实施例均可适用。The above-mentioned embodiment of FIG. 11 needs to detect the contact direction of the finger, so the above-mentioned embodiments of FIGS. 6-8 are applicable.
请参照图12,其绘示根据另一实施例的图9的步骤S120的细部流程图。在步骤S125中,处理单元150依据感应信号S1分析出手指的一尺寸。举例来说,以上述图7的实施例为例,当感应信号S1显示超过一预定数量的检测单元SU5有被接触,则表示手指的尺寸属于大尺寸;当感应信号S1显示仅有低于预定数量的检测单元SU5有被接触,则表示手指的尺寸属于小尺寸。Please refer to FIG. 12 , which shows a detailed flowchart of step S120 in FIG. 9 according to another embodiment. In step S125 , the processing unit 150 analyzes a size of the finger according to the sensing signal S1 . For example, taking the above-mentioned embodiment of FIG. 7 as an example, when the sensing signal S1 shows that more than a predetermined number of detection units SU5 have been touched, it indicates that the size of the finger belongs to a large size; If the number of detection units SU5 is touched, it indicates that the size of the finger belongs to the small size.
在步骤S126中,处理单元150依据此尺寸,以一精密度辨识手指的一指纹。举例来说,当手指的尺寸为小尺寸时,则表示此手指为小孩的手指。由于小孩的手指的纹路较不明显,故需要以较高精密度来进行辨识。当手指的尺寸为大尺寸时,则表示此手指为成人的手指。由于成人的手指的纹路较明显,故可以较低精密度来进行辨识。如此一来,处理单元150可以针对小孩的手指提高辨识的精密度,以提高辨识的精准度。In step S126, the processing unit 150 identifies a fingerprint of the finger with a precision according to the size. For example, when the size of the finger is small, it means that the finger is a child's finger. Since the lines of children's fingers are relatively inconspicuous, it needs to be identified with higher precision. When the size of a finger is large, it means that the finger is an adult's finger. Since the texture of the adult's finger is more obvious, it can be identified with a lower precision. In this way, the processing unit 150 can improve the recognition precision for the child's finger, so as to improve the recognition precision.
上述图12的实施例需检测到手指的尺寸,故上述图7~8的实施例均可适用。The above-mentioned embodiment in FIG. 12 needs to detect the size of the finger, so the above-mentioned embodiments in FIGS. 7-8 are applicable.
透过上述各种上述检测电路130、230、330、430、530、630的设计,能够辅助指纹辨识模块140、240、340、440、540、640的运作。在一实施例中,检测电路130、230、330、430、530、630可以与触控感应电路120、220于同一制程中形成。请参照图13A~13D,其绘示根据一实施例的电子装置的制造方法的示意图。以下系以图1的电子装置100为例来说明图13A~13D的制造方法。如图13A所示,提供基板110。接着,如图13B所示,形成触控感应电路120、检测电路140及数个导电接点160于基板110上。检测电路140位于此些导电接点160的周围。检测电路140的配置可以采用上述图5~8的设计。The operation of the fingerprint identification modules 140 , 240 , 340 , 440 , 540 , 640 can be assisted by the design of the above-mentioned various detection circuits 130 , 230 , 330 , 430 , 530 , 630 . In one embodiment, the detection circuits 130 , 230 , 330 , 430 , 530 , 630 and the touch sensing circuits 120 , 220 may be formed in the same manufacturing process. Please refer to FIGS. 13A˜13D , which are schematic diagrams illustrating a manufacturing method of an electronic device according to an embodiment. The manufacturing method of FIGS. 13A-13D is described below by taking the electronic device 100 of FIG. 1 as an example. As shown in FIG. 13A, a substrate 110 is provided. Next, as shown in FIG. 13B , a touch sensing circuit 120 , a detection circuit 140 and a plurality of conductive contacts 160 are formed on the substrate 110 . The detection circuit 140 is located around the conductive contacts 160 . The configuration of the detection circuit 140 can adopt the design of the above-mentioned FIGS. 5-8 .
在此步骤中,检测电路140的材质与触控感应电路120的材质相同,并且检测电路140与触控感应电路120位于基板110的同一表面。因此,在制造过程中,可以采用同一光罩与同一机台,在同一制程中同时形成检测电路140及触控感应电路120。In this step, the detection circuit 140 is made of the same material as the touch sensing circuit 120 , and the detection circuit 140 and the touch sensing circuit 120 are located on the same surface of the substrate 110 . Therefore, in the manufacturing process, the detection circuit 140 and the touch sensing circuit 120 can be formed simultaneously in the same manufacturing process by using the same mask and the same machine.
然后,如图13C所示,形成一异方性导电胶(Anisotropic Conductive Film,ACF)170于此些导电接点160上。Then, as shown in FIG. 13C , an anisotropic conductive film (ACF) 170 is formed on the conductive contacts 160 .
接着,如图13D所示,设置指纹辨识模块130于异方性导电胶170上,以电性连接指纹辨识模块130及此些导电接点160。在此步骤中,指纹辨识模块130可以先设置于保护板180上。接着,再以热压制程,使异方性导电胶170在垂直方向形成导电通道,以电性连接指纹辨识模块130及此些导电接点160。如此一来,即可顺利将触控感应电路120、指纹辨识模块130及检测电路140设置于同一基板110。Next, as shown in FIG. 13D , the fingerprint recognition module 130 is disposed on the anisotropic conductive adhesive 170 to electrically connect the fingerprint recognition module 130 and the conductive contacts 160 . In this step, the fingerprint identification module 130 may be firstly disposed on the protection plate 180 . Then, the anisotropic conductive adhesive 170 is used to form conductive channels in the vertical direction by hot pressing process, so as to electrically connect the fingerprint identification module 130 and the conductive contacts 160 . In this way, the touch sensing circuit 120 , the fingerprint recognition module 130 and the detection circuit 140 can be smoothly disposed on the same substrate 110 .
根据上述实施例所提出的电子装置及其控制方法与制造方法,其利用设置于同一基板的触控感应电路及指纹辨识模块,以达成轻、薄、短、小的目标,并且更透过检测电路来管理指纹辨识模块的运作。According to the electronic device and its control method and manufacturing method proposed in the above-mentioned embodiments, it utilizes the touch sensing circuit and the fingerprint recognition module arranged on the same substrate to achieve light, thin, short, small goals, and more transparent detection The circuit is used to manage the operation of the fingerprint identification module.
综上所述,虽然本发明已以较佳实施例公开如上,但其并非用以限定本发明。本发明所属技术领域的技术人员,在不脱离本发明的精神和范围内,当可作各种的更动与修改。因此,本发明的保护范围当视后附的权利要求书保护范围所界定者为准。In summary, although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be defined by the protection scope of the appended claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610230905.7ACN107300993A (en) | 2016-04-14 | 2016-04-14 | Electronic device, control method thereof and manufacturing method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610230905.7ACN107300993A (en) | 2016-04-14 | 2016-04-14 | Electronic device, control method thereof and manufacturing method thereof |
| Publication Number | Publication Date |
|---|---|
| CN107300993Atrue CN107300993A (en) | 2017-10-27 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610230905.7APendingCN107300993A (en) | 2016-04-14 | 2016-04-14 | Electronic device, control method thereof and manufacturing method thereof |
| Country | Link |
|---|---|
| CN (1) | CN107300993A (en) |
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| US6778686B1 (en)* | 1998-02-16 | 2004-08-17 | Fingerprint Cards Ab | Sensing device and a method relating thereto |
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| CN104463082A (en)* | 2013-09-18 | 2015-03-25 | 映智科技股份有限公司 | Finger detection element and detection method of fingerprint sensing integrated circuit |
| TW201608425A (en)* | 2014-08-19 | 2016-03-01 | 原相科技股份有限公司 | Touch display device and operating method thereof |
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| WD01 | Invention patent application deemed withdrawn after publication | Application publication date:20171027 | |
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