The application is a divisional application of a Chinese patent application with the application date of 2013, 08 and 06 months, the application number of 201310339740.3 and the name of 'a touch display device and an alignment method thereof'.
Background
With the development of technology, the touch module is gradually integrated into a personal mobile device, such as a Personal Digital Assistant (PDA), a Smart Phone (Smart Phone), a satellite navigation device, etc., so that a user can operate the device by touching a screen of the mobile device, which is convenient.
Fig. 1 is a schematic cross-sectional view of a conventional package alignment device of a Touch Display Panel (Touch Display Panel). The conventionalpackage alignment device 10 includes a Thin Film Transistor Array (TFT Array)110, a Color Filter (CF) 120, a Touch Electrode Layer (Touch Electrode Layer)130, and a Flexible Printed Circuit (FPC) 140. Thecolor filter 120 is disposed on thetft array 110 and has ablack matrix 122. Thetouch electrode layer 130 is disposed on thecolor filter 120 and has afirst alignment pattern 132, and thefirst alignment pattern 132 is disposed on theblack matrix 122. Theflexible circuit board 140 is disposed on thetouch electrode layer 130 and has asecond alignment pattern 142, and thesecond alignment pattern 142 is disposed on thefirst alignment pattern 132.
When the package alignment is to be performed, since thefirst alignment pattern 132 of thetouch electrode layer 130 is usually a transparent conductive material and is distributed on theblack matrix 122, a reflective image sensor (CCD) must be used and located on the same plane as thetouch electrode layer 130 to capture the alignment information of thefirst alignment pattern 132 and thesecond alignment pattern 142, so that theflexible circuit board 140 and thetouch electrode layer 130 achieve a package alignment.
However, the conventionalpackage alignment device 10 is not suitable for use when the image sensor is located on another plane of thetft array 110 without thetouch electrode layer 130, and the conventionalpackage alignment device 10 cannot provide the image sensor to capture the alignment information of thefirst alignment pattern 132 and thesecond alignment pattern 142.
Disclosure of Invention
The present invention is directed to a touch display device, which can precisely complete a package alignment process without increasing the number of calibration machines.
In an embodiment, the present invention provides a touch display device, which includes a first substrate, a second substrate, a touch electrode layer, a second alignment pattern, and a flexible printed circuit. The first substrate has a first alignment pattern. The second substrate is arranged opposite to the first substrate. The touch electrode layer is arranged on the second substrate, and the second substrate is arranged between the touch electrode layer and the first substrate. The second alignment pattern is disposed on the second substrate. The flexible circuit board is electrically connected with the touch electrode layer, wherein the flexible circuit board is provided with a third alignment pattern and a fourth alignment pattern, the third alignment pattern is arranged on the second alignment pattern, and the fourth alignment pattern is not overlapped with the second substrate and is spaced from the second substrate by a distance.
Preferably, the first substrate is a thin film transistor array substrate.
Preferably, the second substrate is a color filter substrate.
Preferably, at least one of the first alignment pattern, the second alignment pattern and the third alignment pattern is made of a metal material.
Preferably, the second alignment pattern is formed of ito.
Preferably, the second alignment pattern and the third alignment pattern are a trace electrode.
Preferably, the second substrate has a light-shielding region, and the second alignment pattern is disposed on the light-shielding region.
Preferably, the light-shielding region is a black matrix.
Preferably, the distance is between 0mm and 5 mm.
Preferably, the distance is between 0mm and 3.5 mm.
Detailed Description
Fig. 2 is a cross-sectional view of atouch display device 20 according to a first embodiment of the invention, which includes afirst substrate 210, asecond substrate 220, atouch electrode layer 230 and a flexible printedcircuit 240, in which thefirst substrate 210 is a thin film transistor array, thesecond substrate 220 is a color filter, and thetouch electrode layer 230 is a touch substrate, but not limited thereto. Thesecond substrate 220 is disposed on thefirst substrate 210, wherein thesecond substrate 220 has a light-shielding region 222 and a light-transmittingregion 224, and the light-transmittingregion 224 further has afirst alignment pattern 226. Thetouch electrode layer 230 is disposed on and in contact with thesecond substrate 220. Theflexible circuit board 240 is disposed on thetouch electrode layer 230, wherein theflexible circuit board 240 has asecond alignment pattern 242. In an embodiment, the light-shielding region 222 may be a black matrix, the light-transmittingregion 224 may be formed by an etching process or a screen printing process, and thefirst alignment pattern 226 may be directly formed. In another embodiment, thesecond alignment pattern 242 may be a trace electrode of the flexible printedcircuit 240, but is not limited thereto.
When the package alignment is to be performed, a transmission image sensor is used to emit analignment light source 250 to pass through thefirst substrate 210, thefirst alignment pattern 226 and thesecond alignment pattern 242 sequentially at a side of thefirst substrate 210 without thesecond substrate 220, and a first alignment pattern signal of thefirst alignment pattern 226 and a second alignment pattern signal of thesecond alignment pattern 242 are captured at a side of thefirst substrate 210 with thesecond substrate 220, and a pattern signal alignment is performed on the first alignment pattern signal and the second alignment pattern signal simultaneously, so that theflexible circuit board 240 and thetouch electrode layer 230 can achieve a package alignment.
Compared to the conventionalpackage alignment device 10, the conventionalpackage alignment device 10 cannot be applied to theimage sensor array 110 when the image sensor is located on a plane without thetouch electrode layer 130, and the conventionalpackage alignment device 10 cannot provide the image sensor with alignment information for capturing thefirst alignment pattern 132 and thesecond alignment pattern 142. In thetouch display device 20 of the first embodiment, thesecond substrate 220 is designed to have thetransparent area 224, so that the limitation that the transmission image sensor is not located on one side of thefirst substrate 210 without thesecond substrate 220 is eliminated, and the package alignment process can be accurately completed without increasing the number of additional calibration machines, thereby reducing the manufacturing cost.
Fig. 3 is a schematic cross-sectional view of atouch display device 30 according to a second embodiment of the invention, which includes afirst substrate 310, asecond substrate 320, atouch electrode layer 330 and a flexible printedcircuit 340, in which thefirst substrate 310 is a thin film transistor array, thesecond substrate 320 is a color filter, and thetouch electrode layer 330 is a touch substrate, but not limited thereto. Thefirst substrate 310 has afirst alignment pattern 312. Thesecond substrate 320 is disposed on thefirst substrate 310, wherein thesecond substrate 320 has a light-shielding region 322 and a light-transmittingregion 324, and the light-transmittingregion 324 is disposed on thefirst alignment pattern 312. Thetouch electrode layer 330 is disposed on and in contact with thesecond substrate 320. Theflexible circuit board 340 is disposed on thetouch electrode layer 330, wherein theflexible circuit board 340 has asecond alignment pattern 342. In an embodiment, thelight shielding region 322 may be a black matrix, and thelight transmitting region 324 may be formed by an etching process or a screen printing process, and in the embodiment, thefirst alignment pattern 312 and thesecond alignment pattern 342 may be a metal material, but not limited thereto. In another embodiment, thesecond alignment pattern 342 can be a trace electrode of theflexible circuit board 340, but not limited thereto.
When the package alignment is to be performed, analignment light source 350 is incident to a side of thefirst substrate 310 without thesecond substrate 320 through a transmission image sensor to sequentially pass through thefirst alignment pattern 312, thetransparent region 324 and thesecond alignment pattern 342, and a first alignment pattern signal of thefirst alignment pattern 312 and a second alignment pattern signal of thesecond alignment pattern 342 are captured by a side of thefirst substrate 310 with thesecond substrate 320, and a pattern signal alignment is performed on the first alignment pattern signal and the second alignment pattern signal at the same time, so that theflexible circuit board 340 and thetouch electrode layer 330 can achieve a package alignment.
Fig. 4 is a schematic cross-sectional view of atouch display device 40 according to a third embodiment of the invention, which includes afirst substrate 410, asecond substrate 420, atouch electrode layer 430 and aflexible circuit board 440. In the present embodiment, thefirst substrate 410 is a thin film transistor array and thesecond substrate 420 is a color filter, but not limited thereto. Thefirst substrate 410 has afirst alignment pattern 412. Thesecond substrate 420 is disposed opposite to thefirst substrate 410, wherein thesecond substrate 420 has a light-shielding region 422. Thetouch electrode layer 430 is disposed on and in contact with thesecond substrate 420, wherein thetouch electrode layer 430 has asecond alignment pattern 432, thesecond alignment pattern 432 is disposed on thelight shielding region 422, and thesecond substrate 420 is disposed between thetouch electrode layer 430 and thefirst substrate 410. Theflexible circuit board 440 is disposed on thetouch electrode layer 430, wherein theflexible circuit board 440 has athird alignment pattern 442 and afourth alignment pattern 444, thethird alignment pattern 442 is disposed on thesecond alignment pattern 432, and thefourth alignment pattern 444 is not overlapped with thesecond substrate 420 and thetouch electrode layer 430 and is spaced apart from thesecond substrate 420 by a distance d, the distance d is between 0mm and 5mm, and an alignment is achieved when theflexible circuit board 440 and thetouch electrode layer 430 are bonded. In one embodiment, the light-shielding region 422 may be a black matrix, and thefirst alignment pattern 412, thesecond alignment pattern 432 and thethird alignment pattern 442 may be a metal material, and in this embodiment, thesecond alignment pattern 432 is ito, but not limited thereto. In another embodiment, thesecond alignment pattern 432 may be a trace electrode of thetouch electrode layer 430, and thethird alignment pattern 442 may be a trace electrode of theflexible circuit board 440, but not limited thereto.
Fig. 5 is a flowchart illustrating analignment method 50 of a touch display device according to a third embodiment of the present invention, which includes providing afirst substrate 410 having afirst alignment pattern 412 in step S51. In step S52, asecond substrate 420 is provided, which is disposed opposite to thefirst substrate 410, wherein thesecond substrate 420 has a light-shielding region 422. In step S53, atouch electrode layer 430 is provided and disposed on and in contact with thesecond substrate 420, wherein thetouch electrode layer 430 has asecond alignment pattern 432 disposed on the light-shieldingregion 422. In step S54, aflexible circuit board 440 is provided and disposed on thetouch electrode layer 430, wherein theflexible circuit board 440 has athird alignment pattern 442 and afourth alignment pattern 444, thethird alignment pattern 442 is disposed on thesecond alignment pattern 432, and thefourth alignment pattern 442 does not overlap with thesecond substrate 420 and thetouch electrode layer 430 and is spaced apart from the second substrate by a distance d, and the distance d is between 0mm and 5 mm. In step S55, an incidentlight source 450 sequentially passes through thefirst alignment pattern 412 and thefourth alignment pattern 444 on the side of thefirst substrate 410 without thesecond substrate 420, and a pattern signal alignment is performed on the first alignment pattern signal and the fourth alignment pattern signal by capturing a first alignment pattern signal of thefirst alignment pattern 412 and a fourth alignment pattern signal of thefourth alignment pattern 444, so as to achieve an alignment when theflexible circuit board 440 and thetouch electrode layer 430 are bonded.
It should be noted that thefourth alignment pattern 444 is not overlapped with thesecond substrate 420 and thetouch electrode layer 430 and is spaced apart by a distance d, so as to reduce the package alignment error caused by the bending characteristic of theflexible circuit board 440 itself, in the embodiment, when the distance d is 3.5mm, the package alignment effect with the best precision is obtained.
In comparison with the conventionalpackage alignment device 10, the conventionalpackage alignment device 10 cannot be applied to theimage sensor array 110 when the image sensor is located on a plane without thetouch electrode layer 130, and the conventionalpackage alignment device 10 cannot provide the image sensor with the alignment information of thefirst alignment pattern 132 and thesecond alignment pattern 142. In thetouch display device 40 of the present embodiment, thefirst substrate 410 is further designed to have thefirst alignment pattern 412, and the flexible printedcircuit 440 is further designed to have thefourth alignment pattern 444, so that the limitation that the transmissive image sensor is located on a side of thefirst substrate 410 not having thesecond substrate 420 is not limited, and thefirst alignment pattern 412 and thefourth alignment pattern 444 can be directly used for a package alignment process, so that the package alignment process can be precisely completed, and the manufacturing cost can be reduced.
In summary, the touch display device and the alignment method thereof of the present invention achieve the package alignment process by designing the second substrate with the transparent region and using the transmissive image sensor in combination with the alignment electrodes of different modules, and the package alignment process can be accurately completed without increasing the number of calibration machines, thereby reducing the manufacturing cost. Or only in a specific distance outside the shading area, the transmission image sensor is respectively matched with the alignment patterns of different substrates to achieve the packaging alignment process, and the packaging alignment process can be accurately completed without additionally increasing the number of calibration machines, so that the manufacturing cost can be reduced.
The foregoing description of the invention is illustrative rather than limiting and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made thereto without departing from the spirit and scope of the invention as defined in the claims and which fall within the true scope of the invention.