A kind of improved golden finger gold plating methodTechnical field
Field, more particularly to a kind of improved golden finger gold plating method are made the present invention relates to wiring board.
Background technology
In PCB production processes, because of the specific demand of client, connector plug plate often designs plate face PAD turmerics, plugThe thick gold of position golden finger plating, strengthens its electric conductivity, wearability and corrosion resistance, in traditional handicraft, after general elder generation's plate face turmeric,It is gold-plated in golden finger position again, i.e., preceding process → outer-layer circuit → etching → AOI inspections → choosing dry film → turmeric → striping →Making programme length after process after welding resistance → word → gold-plated →..., the method turmeric, easily pollute, quality abnormal is more, material by face for goldCost is high.
The content of the invention
In view of the above-mentioned problems, the present invention provides a kind of improved golden finger gold plating method, including step：
Process makes before being carried out to pcb board；
Outer-layer circuit makes；
Etching, AOI are examined；
Welding resistance and word production；The ink of resistance to turmeric is used when welding resistance and word production；Expose turmeric region and golden finger during welding resistanceRegion；
Turmeric technique making is carried out to the turmeric region on pcb board and golden finger area；
The gold-plated blue glue of preceding pressure is carried out to pcb board, then puts in a skylight, outputs golden finger area；To golden finger area after the completion of putting in a skylightDomain carries out blasting treatment, then golden finger area is carried out gold-plated；
Process makes afterwards.
It is preferred that, nickel bath is closed when carrying out gold-plated to golden finger area, nickel plating again is not required to.
It is preferred that, when turmeric technique makes, heavy nickel thickness 2.54-5.08um, Thickness on Immersion Gold is more than 0.0254um.
It is preferred that, gold-plated thickness is 0.076-1.27um.
Process flow before the present invention is gold-plated to circuit board golden finger is adjusted, and is not required to choosingization dry film to cover golden fingerWith the part for being not required to turmeric, and welding resistance and word production are directly carried out using the ink of resistance to turmeric, dry film is substituted by solder maskThe part for being not required to turmeric is override, turmeric is also carried out during turmeric to golden finger area, and the turmeric region on golden finger is carried outBlasting treatment, adhesion during increasing follow-up gold-plated between Gold plated Layer and turmeric layer then in the gold-plated preceding blue glue of pressure, and is outputedGolden finger area, golden finger is covered with exterior domain with blue glue, then golden finger area is carried out gold-plated；It is bright compared to traditional process processAobvious to shorten, welding resistance and word are placed on before turmeric, and striping is not required to after turmeric, can be prevented effectively from the dirt of dry film and ink to golden faceDye, improves Product processing quality；And nickel bath is closed when carrying out gold-plated to golden finger area, nickel plating again is not required to, because of turmeric processIn sunk nickel, be not required to nickel plating again, it is to avoid two layers of nickel occur and cause layering bad.
Embodiment
For convenience of those skilled in the art understand the present invention technology contents, with reference to embodiment the present invention is done intoThe detailed description of one step.
When improved golden finger gold plating method is embodied, step progress is clicked：
Process makes before being carried out to pcb board；
Outer-layer circuit makes；
Etching, AOI are examined；
Welding resistance and word production；The ink of resistance to turmeric is used when welding resistance and word production；Expose turmeric region and golden finger during welding resistanceRegion；
Turmeric technique making is carried out to the turmeric region on pcb board and golden finger area；Turmeric technique, which makes, includes heavy nickel and heavyGold, heavy nickel thickness 3.81um, Thickness on Immersion Gold 0.051um；
The gold-plated blue glue of preceding pressure is carried out to pcb board, then puts in a skylight, outputs golden finger area；To golden finger area after the completion of putting in a skylightDomain carries out blasting treatment, can increase the adhesion of turmeric layer and Gold plated Layer, then gold-plated, gold-plated thickness is carried out to golden finger areaFor 1um；Nickel bath is closed when carrying out gold-plated to golden finger area, nickel plating again is not required to, because having sunk nickel in turmeric process, is not required to againNickel plating, it is to avoid two layers of nickel occur and cause layering bad；
Process makes afterwards.
It is the specific implementation of the present invention above, it describes more specific and detailed, but can not therefore be interpreted asLimitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, not departing from this hairOn the premise of bright design, various modifications and improvements can be made, these obvious alternative forms belong to the present invention'sProtection domain.