A kind of uncovering method of Rigid FlexTechnical field
The present invention relates to a kind of uncovering method of Rigid Flex, the invention belongs to the production method technology of printed substrateField.
Background technology
In line with current product is lightening, the principle of lightweight and miniaturization, present client gets over for printed substrate requirementCome higher, further optimize Rigid Flex to reduce the connector between soft board and hardboard, present Rigid Flex soft board is longDegree is less and less, at this stage industry FPCB（I.e. soft or hard combination printed substrate）Soft board is uncapped after production typically using UV after shaping（Laser cutting machine）After the soft or hard handing-over line of cutting, made in the mode for peeling off its soft board upper cover plate manually.Due to market productionProduct are lightening and densification, and such a mode has the problem of less soft board width can not divest cover plate manually.
Uncapped after the radium-shine cuttings of UV production method, be to need the protective layer that will remain in soft board surface manually to peel off, so thatExpose the required soft board region of client, reach the effect of finished product, if the less FPCB of soft board width（I.e. soft or hard combination printBrush wiring board）, because being accumulated small by soft board leptoprosopy, cover plate is very easy to fracture in manual peel off and remained on soft board, then thisThe mode of kind will influence production time and product quality.
The content of the invention
The purpose of the present invention be overcome the deficiencies in the prior art there is provided one kind it is easy to operate, product can be liftedConvenience in process of production and a kind of uncovering method of Rigid Flex of production quality.
A kind of technical scheme provided according to the present invention, uncovering method of Rigid Flex comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate, the first flexible plate copper foil, second softPlate copper foil, the first cover layer, the second cover layer, first foundation prepreg, the second basic prepreg, first foundation hardboard copperPaper tinsel, the second basic hardboard copper foil, the first additional prepreg, the second additional prepreg, the first additional hardboard copper foil and secondAdditional hardboard copper foil, the first additional hardboard copper foil is identical with the quantity of the second additional hardboard copper foil, in first foundation prepregOn offer first window, the position of the second window, first window and the second window is offered on the second basic prepregIt is corresponding；The first flexible plate copper foil is connected with the upper surface of soft board substrate, the second soft board is connected with the lower surface of soft board substrateCopper foil, the first cover layer is connected with the upper surface of the first flexible plate copper foil, and second is connected with the lower surface of the second flexible plate copper foilCover layer, first foundation prepreg is connected with the upper surface of the first cover layer, is connected with the lower surface of the second cover layerSecond basic prepreg, first foundation hardboard copper foil is connected with the upper surface of first foundation prepreg, on the second basisThe lower surface of prepreg is connected with the second basic hardboard copper foil, be connected with the upper surface of first foundation hardboard copper foil one layer orBetween the first additional hardboard copper foil that more than one layer of person, the additional hardboard copper foil of adjacent two layers first and positioned at the first of bottomIt is connected between additional hardboard copper foil and first foundation hardboard copper foil by the first additional prepreg, in the second basic hardboard copper foilLower surface be connected between one layer or more than one layer of the second additional hardboard copper foil, the additional hardboard copper foil of adjacent two layers secondAnd pass through the second additional prepreg phase between the second additional hardboard copper foil positioned at bottom and the second basic hardboard copper foilEven；
B, the first additional hardboard copper foil positioned at the top in the range of correspondence first window removed by etching, will correspondingly theThe second additional hardboard copper foil positioned at bottom in two window ranges is removed by etching；
C, pass through CO2Laser machine will burn up the first additional prepreg in the range of correspondence first window, pass through CO2Laser machineThe second additional prepreg in the second window ranges of correspondence will be burnt up；
D, repeat step b and step c, step b and step c number of repetition are additional by the first additional hardboard copper foil or secondThe quantity of hardboard copper foil few 1；
E, by correspondence first window in the range of first foundation hardboard copper foil by etch remove, will correspondence the second window ranges inThe second basic hardboard copper foil pass through to etch and remove.
Preferably, the quantity of the first additional hardboard copper foil is one layer, two layers or three layers.
Advantages of the present invention is as follows：
1st, the production efficiency of product is improved, factory's process capability is improved, factory is made the higher product of precision；
When the 2nd, improving the smaller personnel of soft board area and taking off lid, the abnormal problem of cover plate easy fracture or residual.
Brief description of the drawings
Fig. 1 is the structural representation of the Rigid Flex in the step a of the embodiment of the present invention 1.
Fig. 2 is structural representation of the embodiment of the present invention 1 by the obtained Rigid Flexs of step b.
Fig. 3 is structural representation of the embodiment of the present invention 1 by the obtained Rigid Flexs of step c.
Fig. 4 is structural representation of the embodiment of the present invention 1 by the obtained Rigid Flexs of step e.
Embodiment
With reference to specific embodiment, the invention will be further described.
Embodiment 1
A kind of uncovering method of Rigid Flex comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate 1, the first flexible plate copper foil 2.1, theThe basic semi-solid preparation of two flexible plate copper foils 2.2, the first cover layer 3.1, the second cover layer 3.2, first foundation prepreg 4.1, secondThe basic hardboard copper foil 5.2 of piece 4.2, first foundation hardboard copper foil 5.1, second, the first additional prepreg 6.1, second additional halfCured sheets 6.2, the first additional hardboard copper foil 7.2 of additional hardboard copper foil 7.1 and second, the first additional hardboard copper foil 7.1 and secondThe quantity of additional hardboard copper foil 7.2 is identical, and first window is offered on first foundation prepreg 4.1, on the second basis halfThe second window is offered in cured sheets 4.2, first window is corresponding with the position of the second window；In the upper surface of soft board substrate 1The first flexible plate copper foil 2.1 is connected with, the second flexible plate copper foil 2.2 is connected with the lower surface of soft board substrate 1, in the first flexible plate copper foil2.1 upper surface is connected with the first cover layer 3.1, and the second cover layer 3.2 is connected with the lower surface of the second flexible plate copper foil 2.2,First foundation prepreg 4.1 is connected with the upper surface of the first cover layer 3.1, is connected in the lower surface of the second cover layer 3.2There is the second basic prepreg 4.2, first foundation hardboard copper foil 5.1 be connected with the upper surface of first foundation prepreg 4.1,The second basic hardboard copper foil 5.2 is connected with the lower surface of the second basic prepreg 4.2, in first foundation hardboard copper foil 5.1Upper surface be connected with one layer of first additional hardboard copper foil 7.1, the first additional hardboard copper foil 7.1 and first foundation hardboard copper foilIt is connected between 5.1 by the first additional prepreg 6.1, one layer the is connected with the lower surface of the second basic hardboard copper foil 5.2Pass through second additional half between two additional hardboard copper foils 2.2, the second additional basic hardboard copper foil 5.2 of hardboard copper foil 7.2 and secondCured sheets 6.2 are connected；
B, by correspondence first window in the range of the first additional hardboard copper foil 7.1 positioned at the top by etching removal, will be rightThe second additional hardboard copper foil 7.2 positioned at bottom in the second window ranges is answered to be removed by etching；
C, pass through CO2Laser machine will burn up the first additional prepreg 6.1 in the range of correspondence first window, pass through CO2RadiumThe second additional prepreg 6.2 in the second window ranges of correspondence will be burnt up by penetrating machine；
E, by correspondence first window in the range of first foundation hardboard copper foil 5.1 by etch remove, will correspondence the second window modelThe second basic hardboard copper foil 5.2 in enclosing is removed by etching.
Embodiment 2
A kind of uncovering method of Rigid Flex comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate 1, the first flexible plate copper foil 2.1, theThe basic semi-solid preparation of two flexible plate copper foils 2.2, the first cover layer 3.1, the second cover layer 3.2, first foundation prepreg 4.1, secondThe basic hardboard copper foil 5.2 of piece 4.2, first foundation hardboard copper foil 5.1, second, the first additional prepreg 6.1, second additional halfCured sheets 6.2, the first additional hardboard copper foil 7.2 of additional hardboard copper foil 7.1 and second, the first additional hardboard copper foil 7.1 and secondThe quantity of additional hardboard copper foil 7.2 is identical, and first window is offered on first foundation prepreg 4.1, on the second basis halfThe second window is offered in cured sheets 4.2, first window is corresponding with the position of the second window；In the upper surface of soft board substrate 1The first flexible plate copper foil 2.1 is connected with, the second flexible plate copper foil 2.2 is connected with the lower surface of soft board substrate 1, in the first flexible plate copper foil2.1 upper surface is connected with the first cover layer 3.1, and the second cover layer 3.2 is connected with the lower surface of the second flexible plate copper foil 2.2,First foundation prepreg 4.1 is connected with the upper surface of the first cover layer 3.1, is connected in the lower surface of the second cover layer 3.2There is the second basic prepreg 4.2, first foundation hardboard copper foil 5.1 be connected with the upper surface of first foundation prepreg 4.1,The second basic hardboard copper foil 5.2 is connected with the lower surface of the second basic prepreg 4.2, in first foundation hardboard copper foil 5.1Upper surface be connected between two layer of first additional hardboard copper foil 7.1, the additional hardboard copper foil 7.1 of adjacent two layers first and be located atPass through the phase of the first additional prepreg 6.1 between the first additional hardboard copper foil 7.1 and first foundation hardboard copper foil 5.1 of bottomEven, two layer of second additional hardboard copper foil 2.2 is connected with the lower surface of the second basic hardboard copper foil 5.2, adjacent two layers second are attachedBetween stiffened plate copper foil 7.2 and between the second additional basic hardboard copper foil 5.2 of hardboard copper foil 7.2 and second of bottomIt is connected by the second additional prepreg 6.2；
B, by correspondence first window in the range of the first additional hardboard copper foil 7.1 positioned at the top by etching removal, will be rightThe second additional hardboard copper foil 7.2 positioned at bottom in the second window ranges is answered to be removed by etching；
C, pass through CO2Laser machine will burn up the first additional prepreg 6.1 in the range of correspondence first window, pass through CO2RadiumThe second additional prepreg 6.2 in the second window ranges of correspondence will be burnt up by penetrating machine；
D, repeat step b and step c are once；
E, by correspondence first window in the range of first foundation hardboard copper foil 5.1 by etch remove, will correspondence the second window modelThe second basic hardboard copper foil 5.2 in enclosing is removed by etching.
Embodiment 3
A kind of uncovering method of Rigid Flex comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate 1, the first flexible plate copper foil 2.1, theThe basic semi-solid preparation of two flexible plate copper foils 2.2, the first cover layer 3.1, the second cover layer 3.2, first foundation prepreg 4.1, secondThe basic hardboard copper foil 5.2 of piece 4.2, first foundation hardboard copper foil 5.1, second, the first additional prepreg 6.1, second additional halfCured sheets 6.2, the first additional hardboard copper foil 7.2 of additional hardboard copper foil 7.1 and second, the first additional hardboard copper foil 7.1 and secondThe quantity of additional hardboard copper foil 7.2 is identical, and first window is offered on first foundation prepreg 4.1, on the second basis halfThe second window is offered in cured sheets 4.2, first window is corresponding with the position of the second window；In the upper surface of soft board substrate 1The first flexible plate copper foil 2.1 is connected with, the second flexible plate copper foil 2.2 is connected with the lower surface of soft board substrate 1, in the first flexible plate copper foil2.1 upper surface is connected with the first cover layer 3.1, and the second cover layer 3.2 is connected with the lower surface of the second flexible plate copper foil 2.2,First foundation prepreg 4.1 is connected with the upper surface of the first cover layer 3.1, is connected in the lower surface of the second cover layer 3.2There is the second basic prepreg 4.2, first foundation hardboard copper foil 5.1 be connected with the upper surface of first foundation prepreg 4.1,The second basic hardboard copper foil 5.2 is connected with the lower surface of the second basic prepreg 4.2, in first foundation hardboard copper foil 5.1Upper surface be connected between three layer of first additional hardboard copper foil 7.1, the additional hardboard copper foil 7.1 of adjacent two layers first and be located atPass through the phase of the first additional prepreg 6.1 between the first additional hardboard copper foil 7.1 and first foundation hardboard copper foil 5.1 of bottomEven, three layer of second additional hardboard copper foil 2.2 is connected with the lower surface of the second basic hardboard copper foil 5.2, adjacent two layers second are attachedBetween stiffened plate copper foil 7.2 and between the second additional basic hardboard copper foil 5.2 of hardboard copper foil 7.2 and second of bottomIt is connected by the second additional prepreg 6.2；
B, by correspondence first window in the range of the first additional hardboard copper foil 7.1 positioned at the top by etching removal, will be rightThe second additional hardboard copper foil 7.2 positioned at bottom in the second window ranges is answered to be removed by etching；
C, pass through CO2Laser machine will burn up the first additional prepreg 6.1 in the range of correspondence first window, pass through CO2RadiumThe second additional prepreg 6.2 in the second window ranges of correspondence will be burnt up by penetrating machine；
D, repeat step b and step c are once；
E, by correspondence first window in the range of first foundation hardboard copper foil 5.1 by etch remove, will correspondence the second window modelThe second basic hardboard copper foil 5.2 in enclosing is removed by etching.
The present invention is removed the first additional hardboard copper foil 7.1 in Panel area and used successively from top to bottom using engraving methodEngraving method removes the second additional hardboard copper foil 7.2 successively from the bottom up, then using CO2Laser machine is removed successively from top to bottomFirst additional prepreg 6.1 and remove the second additional prepreg 6.2 successively from the bottom up, finally, use engraving methodRemove the basic hardboard copper foil 5.2 of first foundation hardboard copper foil 5.1 and second so that by soft board substrate 1, the first flexible plate copper foil 2.1,The soft board layer that second flexible plate copper foil 2.2, the first cover layer 3.1 are constituted with the second cover layer 3.2 exposes, and will not thus occurEasily broken, the soft board layer surface of lid is taken off in the case of Panel area is smaller the unusual conditions such as cover plate residual, improves the product of productMatter and production efficiency.