技术领域technical field
本发明涉及MEMS(Micro-Electro-Mechanical System)传感器领域中的微电容超声波换能器阵列，具体是一种用于防水智能终端指纹识别的微电容超声波换能器线阵装置，可实现在湿手状态下和水下环境中指纹及其表皮底层结构的三维成像和识别。The invention relates to a microcapacitance ultrasonic transducer array in the field of MEMS (Micro-Electro-Mechanical System) sensors, in particular to a microcapacitance ultrasonic transducer line array device for fingerprint recognition of waterproof intelligent terminals, which can be realized in wet Three-dimensional imaging and recognition of fingerprints and their underlying epidermal structures in the hand state and in underwater environments.
背景技术Background technique
随着互联网通讯和信息化时代的来临，越来越多的高科技智能产品（手机、平板电脑、笔记本等）被广泛应用到日常生活中，移动信息通讯带来的方便快捷使得利用智能终端存储隐私信息和管理电子财产成为普遍现象，与此同时，随之而来的是日益突出的身份验证识别安全隐患，正如传统“账号+密码”和磁卡身份验证识别方法存在着遗忘丢失、复制泄露、破解窃取等问题。生物特征识别技术（指纹、虹膜、DNA、笔迹、步态等）作为一种更加便捷、安全、可靠的识别技术日益成为人们研究的焦点。在众多生物识别技术中，因指纹属性又具备唯一性、不变性、便捷性、十指组合安全性、易采集存储性等特征，使指纹识别技术成为目前应用于移动智能终端最为广泛和成熟的身份识别技术。With the advent of the Internet communication and information age, more and more high-tech smart products (mobile phones, tablet computers, notebooks, etc.) Private information and management of electronic property have become a common phenomenon. At the same time, there are increasingly prominent security risks in identity verification and identification, just as the traditional "account + password" and magnetic card identity verification and identification methods have problems such as forgetting and loss, copy leakage, Crack the problem of stealing and so on. As a more convenient, safe and reliable identification technology, biometric identification technology (fingerprint, iris, DNA, handwriting, gait, etc.) has increasingly become the focus of research. Among many biometric technologies, due to the characteristics of uniqueness, invariance, convenience, ten-finger combination security, and easy collection and storage of fingerprint attributes, fingerprint recognition technology has become the most widely and mature identity applied to mobile smart terminals. recognition technology.
一个指纹识别系统，最关键最首要的任务就是如何高效、便捷、可靠地获取丰富的指纹特征信息。随着近几年指纹识别技术在智能终端中爆发性的态势增长，人们对指纹采集传感单元的要求越来越高，受到智能终端的成本和尺寸限制，光学识别中的大面积指纹采集传感单元难以在移动智能终端使用；电容式识别的集成小面积低成本的半导体指纹采集传感单元成为了当前市场移动智能终端指纹识别的主流技术，然而伴随着人们的使用，新的缺点再次暴露，由于电容信号较弱，通常电容指纹采集技术需要手指与传感单元尽可能接触，采集信息很容易受到手指条件（油腻、汗渍，湿水）干扰，采集环境限制（如防水手机、相机、手表难以在水下识别），给用户带来极大的使用困扰，常常出现识别效率低、识别准确率低的问题，甚至出现不识别的现象。针对以上问题，超声指纹采集技术被提出。超声指纹采集技术利用超声波方向性好、穿透能力强、对人体无害等特点，结合探测区域内指纹嵴与峪甚至汗毛孔对于声波阻抗的差异反馈原理，通过超声指纹传感器发射和接收超声信号来实现指纹特征采集。由于声阻抗相接近，超声指纹传感器发射的超声波可以较好穿透手指上常见的污渍、油脂、液体、以及由玻璃、不锈钢或塑料制成的智能终端外壳，同时结合超声指向性强的优势，可以较好实现对指纹及其底层组织结构三维特征信息的采集，避免了紧密接触式二维指纹特征采集纹路按压变形问题，大幅度提高了指纹匹配率。虽然超声指纹采集技术在智能终端指纹识别应用中具有许多优势，但经过多年研究却依然无法取代现有的接触式指纹识别技术被普及应用，其主要原因在于超声指纹传感器微型化加工技术含量较高、制作多个高一致性且微型化的阵元存在工艺难度大、成本高的问题，难以满足智能终端对指纹采集技术高精度、微型化、低功耗等方面同步发展的需求。For a fingerprint recognition system, the most critical and primary task is how to obtain rich fingerprint feature information efficiently, conveniently and reliably. With the explosive growth of fingerprint identification technology in smart terminals in recent years, people have higher and higher requirements for fingerprint acquisition and sensing units. Limited by the cost and size of smart terminals, large-area fingerprint acquisition sensors in optical identification The sensing unit is difficult to use in mobile smart terminals; the integrated small-area and low-cost semiconductor fingerprint acquisition sensing unit of capacitive recognition has become the mainstream technology of mobile smart terminal fingerprint recognition in the current market, but with people's use, new shortcomings are exposed again , due to the weak capacitive signal, usually the capacitive fingerprint collection technology requires the finger to be in contact with the sensing unit as much as possible, the collected information is easily interfered by finger conditions (greasy, sweat, wet), and the collection environment is limited (such as waterproof mobile phones, cameras, watches, etc.) It is difficult to identify underwater), which brings great troubles to users, and often has the problems of low recognition efficiency, low recognition accuracy, and even non-recognition. In response to the above problems, ultrasonic fingerprint collection technology was proposed. Ultrasonic fingerprint acquisition technology utilizes the characteristics of good directionality, strong penetrating ability, and harmlessness to the human body, combined with the principle of differential feedback of acoustic impedance between fingerprint ridges and valleys and even sweat pores in the detection area, and transmits and receives ultrasonic signals through the ultrasonic fingerprint sensor To achieve fingerprint feature collection. Due to the similar acoustic impedance, the ultrasonic waves emitted by the ultrasonic fingerprint sensor can better penetrate common stains, grease, liquids on fingers, and smart terminal shells made of glass, stainless steel or plastic. At the same time, combined with the advantages of strong ultrasonic directivity, It can better realize the collection of three-dimensional feature information of fingerprints and their underlying organizational structure, avoid the problem of deformation of lines when pressing two-dimensional fingerprint feature collection in close contact, and greatly improve the fingerprint matching rate. Although ultrasonic fingerprint acquisition technology has many advantages in the application of intelligent terminal fingerprint identification, after years of research, it still cannot replace the existing contact fingerprint identification technology and is widely used. The main reason is that the ultrasonic fingerprint sensor miniaturization processing technology content is high. 1. The production of multiple high-consistency and miniaturized array elements has the problems of high process difficulty and high cost, and it is difficult to meet the needs of smart terminals for the simultaneous development of high-precision, miniaturized, and low-power fingerprint acquisition technology.
发明内容Contents of the invention
本发明的目的是基于MEMS技术微型化、低成本、易于批量处理、集成等特点，提供一种利用MEMS电容式超声传感器(Capacitive Micromachined Ultrasonic Transducer，CMUT)的识别装置，可以实现湿手及水下指纹特征信息采集和识别。The purpose of the present invention is to provide a recognition device using a MEMS capacitive ultrasonic sensor (Capacitive Micromachined Ultrasonic Transducer, CMUT) based on the characteristics of MEMS technology miniaturization, low cost, easy batch processing, and integration, which can realize wet hands and underwater Acquisition and identification of fingerprint feature information.
本发明是采用如下技术方案实现的：The present invention is realized by adopting the following technical solutions:
一种用于识别的微电容超声波换能器线性阵列装置，包括外壳，所述外壳内安装阵列芯片PCB引线板，所述阵列芯片PCB引线板上表面电连接CMUT阵列芯片，所述外壳上位于CMUT阵列芯片前方密封安装透声强化玻璃，所述CMUT阵列芯片与透声强化玻璃之间充填硅油透声介质；所述壳体内位于阵列芯片PCB引线板背面封装屏蔽干扰信号的铜箔，所述壳体内为阵列芯片PCB引线板和铜箔的四周封装环氧树脂被衬吸声材料；所述阵列芯片PCB引线装置的引出导线穿出外壳。A linear array device for microcapacitance ultrasonic transducers for identification, including a housing, an array chip PCB lead board is installed in the housing, and the upper surface of the array chip PCB lead board is electrically connected to the CMUT array chip, and the housing is located on the The front of the CMUT array chip is sealed and installed with sound-transmitting strengthened glass, and the space between the CMUT array chip and the sound-transmitting strengthened glass is filled with a silicone oil sound-permeable medium; the copper foil that shields interference signals is packaged in the housing on the back of the PCB lead plate of the array chip, and the Inside the casing are array chip PCB lead boards and copper foils surrounded by encapsulating epoxy resin and lined with sound-absorbing materials; the lead wires of the array chip PCB lead device pass through the shell.
进一步，所述CMUT线性阵列芯片由N个阵元均匀布置排列构成线阵列，每个阵元内部又由2×X个敏感单元分两列整齐排列构成。具体为，包括公共硅衬底，公共硅衬底下表面设一体化下电极，公共硅衬底的上表面为氧化层，氧化层的上表面开设有若干圆柱形空腔，若干圆柱形空腔成排、列对齐布置，氧化层的上表面键合振动薄膜，振动薄膜的上表面设隔离层，围绕隔离层的四周边缘处开设有下沉的隔离槽，隔离槽贯穿隔离层和振动薄膜后，其槽底开设于氧化层上（隔离槽用于隔开各阵元），氧化层上的若干圆柱形空腔都位于隔离槽内；隔离层的上表面上正对每个圆柱形空腔中心的位置处形成图形化上电极，隔离层的上表面位于每个阵元的两端边缘处位置分别设置有一个焊盘；每个阵元内，相邻上电极之间互联金属引线，焊盘与离其最近的一个上电极之间通过金属引线连接。Further, the CMUT linear array chip is composed of N array elements uniformly arranged to form a line array, and each array element is composed of 2×X sensitive units arranged neatly in two columns. Specifically, it includes a common silicon substrate, the lower surface of the common silicon substrate is provided with an integrated lower electrode, the upper surface of the common silicon substrate is an oxide layer, and a number of cylindrical cavities are opened on the upper surface of the oxide layer. Rows and columns are arranged in alignment, the upper surface of the oxide layer is bonded to the vibration film, the upper surface of the vibration film is provided with an isolation layer, and a sinking isolation groove is opened around the edge of the isolation layer, and the isolation groove penetrates through the isolation layer and the vibration film. The bottom of the groove is set on the oxide layer (the isolation groove is used to separate the array elements), and several cylindrical cavities on the oxide layer are located in the isolation groove; the upper surface of the isolation layer is facing the center of each cylindrical cavity The patterned upper electrode is formed at the position, and the upper surface of the isolation layer is located at the two ends of each array element. A pad is respectively provided at the position; in each array element, metal leads are interconnected between adjacent upper electrodes, and the pads are connected to each other. It is connected with the nearest upper electrode through a metal lead.
微电容超声波换能器线性阵列探头装置工作方式如图6a和6b所示，从图中可以看出不论是CMUT工作在发射模式还是接收模式都存在直流偏置电压施加在敏感单元上下电极，直流偏置电压产生的静电力将敏感单元振动薄膜拉向极板下端，但由于薄膜自身存在反向的回复力，使得薄膜很快静止达到平衡状态。若在此刻对薄膜再次施加一定频率的交流激励电压，便会使振动薄膜发生挠曲，辐射相应频率的超声波；若在平衡状态下，薄膜受到声压变化引起挠曲，进而极板间电容变化产生微弱的电流信号，后经跨阻放大等处理电路实现回波电压信号接收。在湿手环境下，手指无需紧密接触，将手指短暂的停放在智能终端屏幕外壳上，感应或者手动启动，便可实现指纹识别；在水下，手指无需接触智能终端（手指表皮至终端屏幕距离保持在5mm内），短暂的停放便可实现手指非接触指纹识别。The working mode of the microcapacitor ultrasonic transducer linear array probe device is shown in Figures 6a and 6b. It can be seen from the figure that no matter whether the CMUT works in the transmitting mode or the receiving mode, there is a DC bias voltage applied to the upper and lower electrodes of the sensitive unit. The electrostatic force generated by the bias voltage pulls the vibrating film of the sensitive unit to the lower end of the plate, but due to the reverse restoring force of the film itself, the film will soon be static and reach an equilibrium state. If an AC excitation voltage of a certain frequency is applied to the membrane again at this moment, the vibrating membrane will be deflected and ultrasonic waves of the corresponding frequency will be radiated; if in a balanced state, the membrane is deflected by the change of sound pressure, and the capacitance between the plates will change. A weak current signal is generated, and then the echo voltage signal is received by a processing circuit such as transimpedance amplification. In a wet hand environment, the fingers do not need to be in close contact, and the finger can be briefly parked on the screen shell of the smart terminal, and the fingerprint recognition can be realized by sensing or manually starting; under water, the finger does not need to touch the smart terminal (the distance between the finger skin and the terminal screen Keep within 5mm), and short-term parking can realize non-contact fingerprint recognition of fingers.
本发明公开的CMUT线性阵列装置包括阵列装置透声密封封装、收发一体高频CMUT线阵芯片以及阵列电极PCB引线封装。利用超声波穿透智能终端外壳材质的优势，可实现智能终端外壳无孔式设计，提高智能终端的防水防尘性能；同时该新型CMUT阵列芯片既具有电容式超声传感器的宽频带和高接收灵敏度的优势，也充分利用了MEMS微加工技术适合制作微型高密度阵列，实现阵元的高一致性批量化生产，有利于传感器与信号处理电路集成等优势，可有效降低超声指纹传感器的成本和制作难度，突破当前超声指纹采集技术的瓶颈，提高超声指纹传感器的综合性能，为我国未来微型化、低成本、高精度、高可靠性的移动智能终端身份认证产业的发展提供技术支持。The CMUT linear array device disclosed in the present invention comprises an array device sound-transmitting sealed package, a high-frequency CMUT line array chip integrated with transceivers, and an array electrode PCB lead package. Utilizing the advantages of ultrasonic penetration through the shell material of the smart terminal, the non-porous design of the shell of the smart terminal can be realized, and the waterproof and dustproof performance of the smart terminal can be improved; at the same time, the new CMUT array chip has both the broadband of the capacitive ultrasonic sensor and the high receiving sensitivity It also makes full use of MEMS micromachining technology, which is suitable for making micro high-density arrays, realizes high-consistency mass production of array elements, is conducive to the integration of sensors and signal processing circuits, and can effectively reduce the cost and production difficulty of ultrasonic fingerprint sensors. , break through the current bottleneck of ultrasonic fingerprint collection technology, improve the comprehensive performance of ultrasonic fingerprint sensors, and provide technical support for the development of my country's future miniaturized, low-cost, high-precision, and high-reliability mobile smart terminal identity authentication industry.
本发明装置设计合理，具有结构简单、微型化、低成本、易阵列加工、适于大批量生产等优点，可实现智能终端外壳无孔式设计，提高智能终端的防水防尘性能；同时也有效提高了湿手及水下指纹识别的识别精度、效率以及安全可靠性。The device of the invention is reasonably designed, has the advantages of simple structure, miniaturization, low cost, easy array processing, and is suitable for mass production, etc., and can realize the non-porous design of the shell of the intelligent terminal, and improve the waterproof and dustproof performance of the intelligent terminal; at the same time, it is also effective The identification accuracy, efficiency, safety and reliability of wet hand and underwater fingerprint identification are improved.
附图说明Description of drawings
图1表示本发明专利CMUT线性阵列装置封装结构示意图。FIG. 1 shows a schematic diagram of the packaging structure of the patented CMUT linear array device of the present invention.
图2表示本发明CMUT线性阵列芯片布局示意图。Fig. 2 shows a schematic layout diagram of a CMUT linear array chip of the present invention.
图3表示本发明换能器单个敏感单元结构示意图。Fig. 3 shows a schematic diagram of the structure of a single sensitive unit of the transducer of the present invention.
图4表示本发明CMUT阵列制备示意图。Fig. 4 shows a schematic diagram of the preparation of the CMUT array of the present invention.
图5表示本发明CMUT阵列金属线电极引线键合PCB板示意图。FIG. 5 shows a schematic diagram of a CMUT array metal wire electrode wire-bonded PCB board according to the present invention.
图6a表示本发明CMUT阵列工作方式图（发射）。Fig. 6a shows the diagram of the working mode of the CMUT array of the present invention (transmitting).
图6b表示本发明CMUT阵列工作方式图（接收）。Fig. 6b shows the working diagram (receiving) of the CMUT array of the present invention.
图中：1-透声强化玻璃，2-硅油透声介质，3-CMUT阵列芯片，4-阵列芯片PCB引线板，5-屏蔽干扰信号的铜箔，6-环氧树脂背衬吸声材料，7-（PVC）外壳，8-阵元，9-隔离槽，10-芯片焊盘，11-敏感单元结构，12-上电极，13-隔离层，14-振动薄膜，15-真空腔，16-氧化层（绝缘层），17-公共硅衬底，18-下电极，19- PCB矩形覆金区域，20-PCB下电极引出孔，21-金属引线，22-PCB连接焊盘，23-PCB上电极引出孔，24-引出导线。In the figure: 1-sound-transmitting strengthened glass, 2-silicon oil sound-transmitting medium, 3-CMUT array chip, 4-array chip PCB lead board, 5-copper foil for shielding interference signals, 6-epoxy resin backing sound-absorbing material , 7-(PVC) shell, 8-element, 9-isolation slot, 10-chip pad, 11-sensitive unit structure, 12-upper electrode, 13-isolation layer, 14-vibrating film, 15-vacuum chamber, 16-Oxide layer (insulation layer), 17-Common silicon substrate, 18-Bottom electrode, 19-PCB rectangular gold-covered area, 20-PCB lower electrode lead-out hole, 21-Metal lead, 22-PCB connection pad, 23 -Electrode lead-out holes on the PCB, 24- lead-out wires.
具体实施方式detailed description
下面结合附图对本发明的具体实施例进行详细说明。Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
本发明以当前移动智能终端通讯领域重点发展的自动指纹识别方式为背景，瞄准MEMS技术、超声指纹识别技术的发展前沿，针对目前MEMS超声指纹识别中的关键科学问题和应用需求，提供一种用于识别的微电容超声波换能器线性阵列装置，主要用于防水智能终端超声指纹识别。Based on the background of the automatic fingerprint identification method that is currently being developed in the field of mobile intelligent terminal communication, the present invention aims at the development frontier of MEMS technology and ultrasonic fingerprint identification technology, and provides a method for the key scientific problems and application requirements in the current MEMS ultrasonic fingerprint identification. Microcapacitor ultrasonic transducer linear array device for identification, mainly used for ultrasonic fingerprint identification of waterproof smart terminals.
一种用于防水智能终端超声指纹识别的微电容超声波换能器线性阵列装置，包括阵列装置透声密封封装、收发一体高频CMUT线性阵列芯片以及阵列电极引线封装。主要由透声强化玻璃、硅油透声介质、CMUT阵列芯片、PCB引线封装、屏蔽干扰信号的铜箔和具有高阻抗、高衰减的环氧树脂背衬吸声材料以及消除杂散声场、易加工的PVC外壳构成。A microcapacitor ultrasonic transducer linear array device for ultrasonic fingerprint identification of a waterproof smart terminal, comprising an array device sound-transmitting sealed package, a transceiver-integrated high-frequency CMUT linear array chip, and an array electrode lead package. It is mainly composed of sound-transmitting strengthened glass, silicone oil sound-transmitting medium, CMUT array chip, PCB lead package, copper foil for shielding interference signals, and epoxy resin backing sound-absorbing material with high impedance and high attenuation, as well as eliminating stray sound field and easy processing Made of PVC shell.
具体连接关系如图1所示，PVC外壳7内安装阵列芯片PCB引线板4，阵列芯片PCB引线板4上表面电连接CMUT阵列芯片3，PVC外壳7上位于CMUT阵列芯片3前方密封安装透声强化玻璃1，所述CMUT阵列芯片3与透声强化玻璃1之间充填硅油透声介质2；PVC壳体内位于阵列芯片PCB引线板4背面封装屏蔽干扰信号的铜箔5，PVC壳体内为阵列芯片PCB引线板4和铜箔5的四周封装环氧树脂被衬吸声材料6；阵列芯片PCB引线板4的引出导线24穿出外壳7，连接后续处理电路。The specific connection relationship is shown in Figure 1, the array chip PCB lead plate 4 is installed in the PVC shell 7, the upper surface of the array chip PCB lead plate 4 is electrically connected to the CMUT array chip 3, and the PVC shell 7 is located in front of the CMUT array chip 3 and is sealed and installed through sound Strengthened glass 1, the silicone oil sound-transmitting medium 2 is filled between the CMUT array chip 3 and the sound-transmitting strengthened glass 1; the copper foil 5 for shielding interference signals is packaged in the PVC shell on the back of the PCB lead plate 4 of the array chip, and the PVC shell is an array Chip PCB lead board 4 and copper foil 5 are encapsulated with epoxy resin and lined with sound-absorbing material 6; lead wires 24 of array chip PCB lead board 4 pass through shell 7 to connect to subsequent processing circuits.
线性CMUT阵列工作频率15MHz，由384个相同的收发一体的CMUT阵元芯片等间距（0.5倍波长）排列构成，并通过金丝键合封装技术将CMUT芯片通过引出导线连接至外部控制电路。具体为，如图2所示，CMUT阵列芯片3通过384个阵元8排成一排构成，每个阵元由2×88个敏感单元11排列构成；具体如下：如图3所示，包括公共硅衬底17，公共硅衬底17的上表面为氧化层（绝缘层）16、其下表面覆盖一体化下电极18，所述氧化层16的上表面开设有若干圆柱形真空腔15，所述氧化层16的上表面键合振动薄膜14，所述振动薄膜14的上表面设隔离层13，围绕隔离层13的四周边缘处及其内部开设有下沉的隔离槽9，所述隔离槽9贯穿隔离层13和振动薄膜14后，其槽底开设于氧化层16上；所述隔离层13的上表面上正对每个真空腔15的中心位置处设有图形化上电极12；所述氧化层16上的真空腔15位于同一隔离区域内后形成一个阵元8；所述隔离层13的上表面位于一个阵元内的两端边缘处位置分别设有芯片焊盘10，一个阵元内相邻上电极12通过金属引线21连接，该阵元内所有上电极分为上下两部分；位于上端的芯片焊盘10与离其最近的一个上电极12之间通过金属引线21连接，即上半部分的上电极与上端的芯片焊盘电连接；位于下端的芯片焊盘10与离其最近的一个上电极12之间通过金属引线21连接，即下半部分的上电极与下端的芯片焊盘电连接。The linear CMUT array has an operating frequency of 15MHz, and is composed of 384 identical CMUT array chips with integrated transceivers arranged at equal intervals (0.5 times the wavelength). The CMUT chips are connected to the external control circuit through lead-out wires through gold wire bonding packaging technology. Specifically, as shown in Figure 2, the CMUT array chip 3 is composed of 384 array elements 8 arranged in a row, and each array element is composed of 2×88 sensitive units 11; the details are as follows: as shown in Figure 3, including A common silicon substrate 17, the upper surface of the common silicon substrate 17 is an oxide layer (insulating layer) 16, and its lower surface covers an integrated lower electrode 18, and the upper surface of the oxide layer 16 is provided with several cylindrical vacuum chambers 15, The upper surface of the oxide layer 16 is bonded with a vibrating film 14, the upper surface of the vibrating film 14 is provided with an isolation layer 13, and the surrounding edge of the isolation layer 13 and its inside are provided with a sunken isolation groove 9. After the groove 9 penetrates the isolation layer 13 and the vibrating film 14, the bottom of the groove is opened on the oxide layer 16; the upper surface of the isolation layer 13 is provided with a patterned upper electrode 12 facing the center of each vacuum chamber 15; The vacuum cavity 15 on the oxide layer 16 is located in the same isolation area to form an array element 8; the upper surface of the isolation layer 13 is located at the two ends of the array element and the positions are respectively provided with chip pads 10, a Adjacent upper electrodes 12 in the array element are connected by metal leads 21, and all upper electrodes in the array element are divided into upper and lower parts; the chip pad 10 at the upper end is connected to the nearest upper electrode 12 by metal leads 21 , that is, the upper electrode of the upper half is electrically connected to the chip pad at the upper end; the chip pad 10 at the lower end is connected to the nearest upper electrode 12 through a metal lead 21, that is, the upper electrode of the lower half is connected to the lower end The chip pads are electrically connected.
如图5所示，CMUT阵列芯片3的下电极18通过导电胶粘贴在阵列芯片PCB引线板4上表面中部的PCB矩形覆金区域19，PCB矩形覆金区域19通过金属引线连接PCB下电极引出孔20，所述PCB下电极引出孔20连接引出导线，CMUT阵列芯片3的N个阵元8的芯片焊盘10与阵列芯片PCB引线板4相应位置的PCB连接焊盘22通过金属引线21一一连接；每个PCB连接焊盘22通过金属引线连接各自的PCB上电极引出孔23，PCB上电极引出孔23统一连接引出导线，连接后续处理电路；或者，为了实现相位控制，可以将n个相邻通道导线统一在一起，利用384/n个分散导线引出，连接控制电路。具体的处理方法本领域技术人员根据实际情况采用已有的编程技术进行设计，在此不再赘述。As shown in Figure 5, the lower electrode 18 of the CMUT array chip 3 is pasted on the PCB rectangular gold-coated area 19 in the middle of the upper surface of the array chip PCB lead plate 4 through conductive glue, and the PCB rectangular gold-coated area 19 is connected to the lower electrode of the PCB through a metal lead. The lead-out hole 20, the lead-out hole 20 of the lower electrode of the PCB is connected to the lead wire, the chip pad 10 of the N array elements 8 of the CMUT array chip 3 and the PCB connection pad 22 at the corresponding position of the array chip PCB lead plate 4 pass through the metal lead 21 One-to-one connection; each PCB connection pad 22 is connected to its respective electrode lead-out hole 23 on the PCB through a metal lead, and the electrode lead-out hole 23 on the PCB is uniformly connected to the lead-out wire and connected to the subsequent processing circuit; or, in order to realize phase control, n The wires of two adjacent channels are unified together, and are led out by 384/n scattered wires to connect the control circuit. The specific processing method is designed by those skilled in the art using existing programming technology according to the actual situation, and will not be repeated here.
具体制备时，CMUT阵列芯片3长度10mm、宽度8mm。上电极12的厚度和半径分别为1.1μm和12.25μm；隔离层13厚度为0.1μm；振动薄膜14的厚度与半径分别为2.2μm和24.5μm；圆柱形真空腔15的半径和高度分别为24.5μm和0.25μm；圆柱形真空腔15底面距离公共硅衬底17上表面厚度为0.15μm；公共硅衬底17厚度为300μm；下电极18厚度为1μm。During specific preparation, the CMUT array chip 3 has a length of 10 mm and a width of 8 mm. The thickness and radius of the upper electrode 12 are 1.1 μm and 12.25 μm respectively; the thickness of the isolation layer 13 is 0.1 μm; the thickness and radius of the vibrating film 14 are 2.2 μm and 24.5 μm respectively; the radius and height of the cylindrical vacuum chamber 15 are 24.5 μm respectively. μm and 0.25 μm; the bottom surface of the cylindrical vacuum chamber 15 is 0.15 μm thick from the upper surface of the common silicon substrate 17; the thickness of the common silicon substrate 17 is 300 μm; the thickness of the lower electrode 18 is 1 μm.
CMUT线性阵列芯片的加工工艺包括如下步骤：The processing technology of CMUT linear array chip includes the following steps:
1、如图4（a）所示，进行备片。选择硅片和SOI晶片，并进行标准RCA清洗，去除各种有机物、金尘埃和自然氧化层等；图中，Wafer1为硅片，Wafer2为SOI片。1. As shown in Figure 4(a), perform film preparation. Select silicon wafers and SOI wafers, and perform standard RCA cleaning to remove various organic matter, gold dust, and natural oxide layers; in the figure, Wafer1 is a silicon wafer, and Wafer2 is an SOI wafer.
2、如图4（b）所示，对硅片双面热氧化处理，使其上下表面都形成氧化层。然后对上表面氧化硅进行刻蚀形成真空腔，同时留0.15μm厚度的二氧化硅作为绝缘层；2. As shown in Figure 4(b), thermal oxidation treatment is performed on both sides of the silicon wafer to form an oxide layer on both the upper and lower surfaces. Then etch the silicon oxide on the upper surface to form a vacuum cavity, while leaving 0.15 μm thick silicon dioxide as an insulating layer;
3、如图4（c）所示，对硅片进行标准RCA清洗并进行激活，激活后使硅片上表面的氧化层与SOI晶片在真空环境下采用硅-硅键合工艺进行低温键合。3. As shown in Figure 4(c), perform standard RCA cleaning and activation on the silicon wafer. After activation, the oxide layer on the upper surface of the silicon wafer and the SOI wafer are bonded at a low temperature using a silicon-silicon bonding process in a vacuum environment .
4、如图4（d）所示，键合后用TMAH溶液对SOI晶片的衬底硅进行腐蚀，清洗后再用BOE溶液腐蚀掉硅片下表面上的氧化层和SOI晶片上的氧化层，此时的硅片即为硅衬底、SOI晶片剩余的硅层即为振动薄膜，初步形成微电容超声传感器的结构。4. As shown in Figure 4(d), after bonding, use TMAH solution to etch the substrate silicon of the SOI wafer, and after cleaning, use BOE solution to etch the oxide layer on the lower surface of the silicon wafer and the oxide layer on the SOI wafer At this time, the silicon wafer is the silicon substrate, and the remaining silicon layer of the SOI wafer is the vibration film, which initially forms the structure of the microcapacitive ultrasonic sensor.
5、如图4（e）所示，采用LPCVD工艺在振动薄膜上沉积一层二氧化硅层作为0.1μm厚度的隔离层；在隔离层的上表面溅射金属，并用剥离的方法形成上电极和焊盘，围绕隔离层的四周边缘处及内部刻蚀出隔离槽，形成阵元阵列，并用TMAH溶液腐蚀出隔离槽，隔离槽贯穿隔离层和振动薄膜后，其槽底开设于氧化层上；通过金属引线连接各上电极及焊盘；在硅片的背面注入磷，与硅片形成良好的欧姆接触，并溅射金属Al形成一体化下电极。5. As shown in Figure 4(e), use LPCVD to deposit a silicon dioxide layer on the vibrating film as a 0.1μm-thick isolation layer; sputter metal on the upper surface of the isolation layer, and use the lift-off method to form the upper electrode and pads, etch isolation grooves around the edge and inside of the isolation layer to form an array of elements, and use TMAH solution to etch the isolation grooves. After the isolation grooves penetrate the isolation layer and the vibration film, the bottom of the grooves is opened on the oxide layer. Connect the upper electrodes and pads through metal wires; inject phosphorus on the back of the silicon wafer to form a good ohmic contact with the silicon wafer, and sputter metal Al to form an integrated lower electrode.
具体封装过程如下：The specific packaging process is as follows:
（a）铜箔胶带固定，将铜箔胶带粘贴至PVC外壳内部（PCB板固定台下方）。(a) Copper foil tape is fixed, and the copper foil tape is pasted inside the PVC shell (under the PCB board fixing table).
（b）芯片引线固定封装，CMUT下电极通过导电胶与PCB矩形覆金区域粘贴，利用金丝键合将384个CMUT芯片的阵元的上电极的芯片焊盘与PCB引线板相应位置的连接焊盘相连接。(b) The chip leads are fixed and packaged. The lower electrode of the CMUT is pasted on the rectangular gold-covered area of the PCB through conductive glue, and the chip pads of the upper electrodes of the array elements of the 384 CMUT chips are connected to the corresponding positions of the PCB lead board by using gold wire bonding. The pads are connected.
（c）引出导线一端引入PVC外壳，并在PCB引线板的上下电极引线孔处焊接，另一端连接控制电路。(c) One end of the lead wire is introduced into the PVC shell, and welded at the upper and lower electrode lead holes of the PCB lead plate, and the other end is connected to the control circuit.
（d）放置固化后的环氧树脂吸声材料至PCB引线板安装台下方，并用螺钉拧紧在PCB 固定在安装台上。(d) Place the cured epoxy resin sound-absorbing material under the PCB lead plate mounting table, and screw it on the PCB to fix it on the mounting table.
（e）利用聚氨酯胶粘贴透声强化玻璃进行密封。(e) Sealing with polyurethane adhesive to acoustically strengthened glass.
（f）从PVC腔体外壳外侧用注射器注入硅油排出腔体中的空气气泡，尽可能保证真空。(f) Use a syringe to inject silicone oil from the outside of the PVC cavity shell to discharge the air bubbles in the cavity and ensure a vacuum as much as possible.
（g）在注射孔上拧紧螺丝并涂抹聚氨酯胶，完成最后密封。(g) Tighten the screw on the injection hole and apply polyurethane glue to complete the final seal.
本防水智能终端超声指纹识别的微电容超声波换能器线性阵列探头装置工作方式如图6a和6b所示，从图中可以看出不论是CMUT工作在发射模式还是接收模式都存在直流偏置电压施加在敏感单元上下电极，直流偏置电压产生的静电力将敏感单元振动薄膜拉向极板下端，但由于薄膜自身存在反向的回复力，使得薄膜很快静止达到平衡状态。若在此刻对薄膜再次施加一定频率的交流激励电压，便会使振动薄膜发生挠曲，辐射相应频率的超声波；若在平衡状态下，薄膜受到声压变化引起挠曲，进而极板间电容变化产生微弱的电流信号，后经跨阻放大等处理电路实现回波电压信号接收。The working mode of the microcapacitor ultrasonic transducer linear array probe device for ultrasonic fingerprint recognition of the waterproof intelligent terminal is shown in Figures 6a and 6b. It can be seen from the figure that there is a DC bias voltage whether the CMUT works in the transmitting mode or the receiving mode Applied to the upper and lower electrodes of the sensitive unit, the electrostatic force generated by the DC bias voltage pulls the vibrating membrane of the sensitive unit to the lower end of the plate, but due to the reverse restoring force of the membrane itself, the membrane quickly stops and reaches an equilibrium state. If an AC excitation voltage of a certain frequency is applied to the membrane again at this moment, the vibrating membrane will be deflected and ultrasonic waves of the corresponding frequency will be radiated; if in a balanced state, the membrane is deflected by the change of sound pressure, and the capacitance between the plates will change. A weak current signal is generated, and then the echo voltage signal is received by a processing circuit such as transimpedance amplification.
本发明的智能终端微型化超声指纹识别线阵装置在湿手环境下，手指无需紧密接触，将手指短暂的停放在智能终端屏幕外壳上，感应或者手动启动，便可实现指纹识别；在水下，手指无需接触智能终端（手指表皮至终端屏幕距离保持在5mm内），短暂的停放便可实现手指非接触指纹识别。The miniaturized ultrasonic fingerprint recognition line array device for smart terminals of the present invention can realize fingerprint recognition by simply parking the fingers on the screen shell of the smart terminal for a short time without close contact with fingers in a wet hand environment; under water , the finger does not need to touch the smart terminal (the distance from the finger skin to the terminal screen is kept within 5mm), and the non-contact fingerprint recognition of the finger can be realized after a short parking.
本发明结合波束控制和线性形扫描成像方式相结合的技术，通过对阵列各个阵元波束发射/接收延时控制和幅度控制，实现超声波束的偏转聚焦效果，对指纹表皮核心部分及皮下组织进行大范围扫描；再对扫描回波信号分别进行动态滤波、包络检波、对数压缩、灰度转换、三维坐标系构建、像素映射和插值填充等信号处理方法实现指纹的三维图像重建。最终结合以保存的指纹库信息和采集到的指纹信息特征匹配比对，实现指纹的扫描成像识别。The present invention combines beam control and linear scanning imaging methods, and realizes the deflection and focusing effect of ultrasonic beams by controlling the transmission/reception delay and amplitude control of each element of the array, and the core part of the fingerprint epidermis and the subcutaneous tissue. Large-scale scanning; and then perform signal processing methods such as dynamic filtering, envelope detection, logarithmic compression, grayscale conversion, three-dimensional coordinate system construction, pixel mapping and interpolation filling on the scanning echo signals to realize three-dimensional image reconstruction of fingerprints. Finally, the stored fingerprint database information is matched and compared with the collected fingerprint information features to realize the scanning and imaging recognition of fingerprints.
针对目前接触式指纹采集技术易受手指环境影响、可靠性难保障，难以在防水移动终端展开应用，以及现有超声指纹传感器阵列成本高、批量制造一致性差的问题，本发明创新性地提出了用于防水智能终端指纹识别的微电容超声波换能器线阵装置，对湿手以及水下指纹识别技术具有更好的识别精度和可靠性。利用超声波穿透终端外壳材质的优势，可实现终端外壳无孔式设计，提高智能终端的防水防尘性能；同时新型CMUT既具有电容式超声传感器的宽频带和高接收灵敏度的优势，也充分利用了MEMS微加工技术适合制作微型高密度阵列，实现阵元的高一致性批量化生产，有利于传感器与信号处理电路集成等优势，可有效降低超声指纹传感器的成本和制作难度，突破当前超声指纹采集技术的瓶颈，提高超声指纹传感器的综合性能，为智能终端领域指纹识别技术的发展提供新的动力。Aiming at the problems that the current contact fingerprint collection technology is easily affected by the finger environment, its reliability is difficult to guarantee, it is difficult to apply it in waterproof mobile terminals, and the existing ultrasonic fingerprint sensor array has high cost and poor batch manufacturing consistency, the present invention innovatively proposes The microcapacitor ultrasonic transducer linear array device used for fingerprint recognition of waterproof smart terminals has better recognition accuracy and reliability for wet hands and underwater fingerprint recognition technology. Utilizing the advantages of ultrasound penetrating the material of the terminal shell, the non-porous design of the terminal shell can be realized, and the waterproof and dustproof performance of the smart terminal can be improved. The MEMS micromachining technology is suitable for the production of micro-high-density arrays, realizes high-consistency mass production of array elements, and is conducive to the integration of sensors and signal processing circuits. It can effectively reduce the cost and production difficulty of ultrasonic fingerprint sensors, and break through the current ultrasonic fingerprint sensors. The bottleneck of acquisition technology improves the comprehensive performance of ultrasonic fingerprint sensors and provides new impetus for the development of fingerprint recognition technology in the field of smart terminals.
所应说明的是，以上实施例仅用以说明本发明的技术方案而非限制，尽管参照本发明实施例进行了详细说明，本领域的普通技术人员应当理解，对本发明的技术方案进行修改或者等同替换，都不脱离本发明的技术方案的精神和范围，其均应涵盖本发明的权利要求保护范围中。It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although detailed descriptions have been made with reference to the embodiments of the present invention, those of ordinary skill in the art should understand that the technical solutions of the present invention are modified or Equivalent replacements do not deviate from the spirit and scope of the technical solutions of the present invention, and all of them should be included in the protection scope of the claims of the present invention.
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| CN201710273030.3ACN106951887B (en) | 2017-04-25 | 2017-04-25 | Microcapacitive ultrasonic transducer linear array device for identification |
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| CN201710273030.3ACN106951887B (en) | 2017-04-25 | 2017-04-25 | Microcapacitive ultrasonic transducer linear array device for identification |
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