技术领域technical field
本发明涉及换热技术领域，特别是涉及一种微通道冷却器。The invention relates to the technical field of heat exchange, in particular to a microchannel cooler.
背景技术Background technique
随着半导体精细化加工制作技术的迅速发展，以此为技术基础的微机电系统(MEMS)加工工艺也日渐成熟，并在军事、医疗、航空航天、化学生物工程、材料科学等众多领域得到了广泛的应用。在MEMS系统中，广泛存在着与流体流动换热相关的微通道器件或设备，微通道器件具有结构紧凑、质量轻、效率高等方面的优势并且也满足了设备精细化的要求。With the rapid development of semiconductor fine processing technology, the micro-electromechanical system (MEMS) processing technology based on this technology is becoming more and more mature, and has been widely used in military, medical, aerospace, chemical and biological engineering, material science and many other fields. Wide range of applications. In MEMS systems, microchannel devices or devices related to fluid flow and heat exchange widely exist. Microchannel devices have the advantages of compact structure, light weight, and high efficiency, and also meet the requirements of equipment refinement.
但是传统的微通道换热设备为了满足设备微型化、封装集成化的要求，其特征尺寸通常在微米至毫米量级，此类微通道的特征尺寸较小，流体在微通道中流动时由于流体与微通道之间接触的比表面积较大，增加了流体与微通道内壁之间的粘滞阻力。从而，增加了驱动流体流动的泵的功消耗，同时也带来了由于驱动流体流动的压力过大导致微通道器件容易破裂的安全隐患。However, in order to meet the requirements of equipment miniaturization and packaging integration, the traditional microchannel heat exchange equipment usually has a characteristic size in the order of microns to millimeters. The characteristic size of this type of microchannel is small. The specific surface area in contact with the microchannel is larger, which increases the viscous resistance between the fluid and the inner wall of the microchannel. Therefore, the work consumption of the pump driving the fluid flow is increased, and at the same time, a safety hazard that the microchannel device is easily broken due to excessive pressure driving the fluid flow is brought.
因此，如何改善微通道内壁的表面性能，降低微通道内的流体流动的阻力，已成为装置微型化应用的一个关键技术问题。Therefore, how to improve the surface properties of the inner wall of the microchannel and reduce the resistance of fluid flow in the microchannel has become a key technical issue in the application of device miniaturization.
发明内容Contents of the invention
本发明的目的是提供一种微通道冷却器，以解决上述现有技术存在的问题，可以调节微通道内表面的局部润湿特性，降低流体与壁面之间的粘滞阻力，并且增强换热性能。The purpose of the present invention is to provide a microchannel cooler to solve the above-mentioned problems in the prior art, which can adjust the local wetting characteristics of the inner surface of the microchannel, reduce the viscous resistance between the fluid and the wall, and enhance heat transfer performance.
为实现上述目的，本发明提供了如下方案：本发明提供一种微通道冷却器，包括微通道本体，所述微通道本体的一端设置有流体入口，另一端设置有流体出口；所述微通道本体的内壁上还布置有若干条超疏水微结构层。To achieve the above object, the present invention provides the following scheme: the present invention provides a microchannel cooler, comprising a microchannel body, one end of the microchannel body is provided with a fluid inlet, and the other end is provided with a fluid outlet; the microchannel Several super-hydrophobic microstructure layers are arranged on the inner wall of the body.
可选的，所述微通道本体采用高导热材料制成。Optionally, the microchannel body is made of high thermal conductivity material.
可选的，所述微通道本体采用硅、铜、铝或合金钢制成。Optionally, the microchannel body is made of silicon, copper, aluminum or alloy steel.
可选的，所述超疏水微结构层是通过在所述微通道本体的内壁上进行机械刻蚀、等离子体刻蚀、激光刻蚀或化学刻蚀，并通过含氟溶液进行表面改性所制备形成的具有微纳结构的粗糙表面。Optionally, the super-hydrophobic microstructure layer is formed by performing mechanical etching, plasma etching, laser etching or chemical etching on the inner wall of the microchannel body, and performing surface modification by a fluorine-containing solution. The rough surface with micro-nano structure is prepared.
可选的，所述超疏水微结构层的润湿角为120°-160°。Optionally, the wetting angle of the superhydrophobic microstructure layer is 120°-160°.
可选的，所述超疏水微结构层交替布置在所述微通道本体内壁的各个壁面上。Optionally, the super-hydrophobic microstructure layers are arranged alternately on each wall surface of the inner wall of the microchannel body.
可选的，所述超疏水微结构层呈类螺旋型交替布置在所述微通道本体内壁的各个壁面上。Optionally, the super-hydrophobic microstructure layers are alternately arranged in a helical shape on each wall surface of the inner wall of the microchannel body.
可选的，所述超疏水微结构层间隔布置在所述微通道本体的内壁底面。Optionally, the superhydrophobic microstructure layer is arranged at intervals on the bottom surface of the inner wall of the microchannel body.
可选的，所述超疏水微结构层的润湿角沿着流体的流动方向逐渐呈梯度降低。Optionally, the wetting angle of the super-hydrophobic microstructure layer gradually decreases along the flow direction of the fluid in a gradient.
可选的，还包括有亲水微结构层，所述亲水微结构层和所述超疏水微结构层交替布置。Optionally, a hydrophilic microstructure layer is also included, and the hydrophilic microstructure layer and the superhydrophobic microstructure layer are alternately arranged.
本发明相对于现有技术取得了以下技术效果：Compared with the prior art, the present invention has achieved the following technical effects:
微通道本体的内壁上布置有超疏水微结构层，降低流体与内壁表面之间的直接接触，为此可以降低流体与壁面之间的粘滞阻力；A super-hydrophobic microstructure layer is arranged on the inner wall of the microchannel body to reduce the direct contact between the fluid and the inner wall surface, thereby reducing the viscous resistance between the fluid and the wall surface;
超疏水微结构层交替布置在所述微通道本体内壁的各个壁面上，一方面，流体与超疏水微结构层接触时会降低流体与壁面之间的粘滞阻力；另一方面，由于局部润湿特性的不同会造成流体局部流动速度的增加及流体的扰动，为此可以在降低流动阻力的同时强化对流换热。The superhydrophobic microstructure layers are alternately arranged on the inner walls of the microchannel body. On the one hand, when the fluid contacts the superhydrophobic microstructure layers, the viscous resistance between the fluid and the wall will be reduced; on the other hand, due to the local wetting The difference in wet characteristics will cause the increase of the local flow velocity of the fluid and the disturbance of the fluid. Therefore, the convective heat transfer can be enhanced while reducing the flow resistance.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required in the embodiments. Obviously, the accompanying drawings in the following description are only some of the present invention. Embodiments, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.
图1为本发明实施例一微通道冷却器的结构示意图；Fig. 1 is the structural representation of embodiment one microchannel cooler of the present invention;
图2为超疏水微结构层呈类螺旋型交替布置的结构示意图；Fig. 2 is a structural schematic diagram of a superhydrophobic microstructure layer arranged alternately in a helical type;
图3为实施例二微通道冷却器的结构示意图；Fig. 3 is the structural representation of embodiment two microchannel coolers;
图4为实施例三微通道冷却器的结构示意图；Fig. 4 is the structural representation of embodiment three microchannel coolers;
图5为实施例四微通道冷却器的结构示意图；Fig. 5 is the structural representation of embodiment four microchannel coolers;
其中，1为微通道本体，2为超疏水微结构层，3为亲水微结构层，11为流体入口，12为流体出口。Among them, 1 is the microchannel body, 2 is the super-hydrophobic microstructure layer, 3 is the hydrophilic microstructure layer, 11 is the fluid inlet, and 12 is the fluid outlet.
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
本发明的目的是提供一种微通道冷却器，以解决现有技术存在的问题，可以调节微通道本体内壁表面的局部润湿特性，降低流体与壁面之间的粘滞阻力，并且增强换热性能。The purpose of the present invention is to provide a microchannel cooler to solve the problems in the prior art, which can adjust the local wetting characteristics of the inner wall surface of the microchannel body, reduce the viscous resistance between the fluid and the wall, and enhance heat transfer performance.
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本发明作进一步详细的说明。In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
实施例一、Embodiment one,
本实施例提供一种微通道冷却器，如图1所示，包括微通道本体1，微通道本体1的一端设置有流体入口11，另一端设置有流体出口12；微通道本体1的内壁上还设置有若干超疏水微结构层2。The present embodiment provides a kind of microchannel cooler, as shown in Figure 1, comprises microchannel body 1, and one end of microchannel body 1 is provided with fluid inlet 11, and the other end is provided with fluid outlet 12; Several super-hydrophobic microstructure layers 2 are also provided.
形成超疏水微结构层2的核心技术是表面超疏水处理技术，通过改变材料表面的形貌特征和表面能的大小，来影响表面的接触状态及润湿特性，进而能够有效的降低微通道内流体流动的阻力。超疏水微结构层2的形成需要满足两个基本的条件：物质表面具有微观粗糙结构及较低的表面自由能；本实施例中通过机械刻蚀、等离子体刻蚀、激光刻蚀、化学刻蚀或者其他刻蚀方式，在微通道本体1的内壁表面进行剥离或去除材料，形成具有微纳结构的粗糙表面；然后再通过配备一定比例和组分的表面能较低的含氟溶液，例如氟硅烷等的多组分溶液，对具有微纳结构的粗糙表面进行表面改性，最后形成具有超疏水特性的超疏水微结构层2。超疏水微结构层2能够捕获一层微纳米级别的空气，降低流体与内壁表面之间的直接接触，为此可以降低流体与壁面之间的粘滞阻力。The core technology for forming the super-hydrophobic microstructure layer 2 is the surface super-hydrophobic treatment technology, which affects the contact state and wetting characteristics of the surface by changing the surface morphology and surface energy of the material, thereby effectively reducing the microchannel internal resistance to fluid flow. The formation of the superhydrophobic microstructure layer 2 needs to meet two basic conditions: the surface of the material has a microscopic rough structure and low surface free energy; in this embodiment, mechanical etching, plasma etching, laser etching, chemical etching Etching or other etching methods, peeling off or removing material on the inner wall surface of the microchannel body 1, forming a rough surface with a micro-nano structure; A multi-component solution such as fluorosilane, etc., is used to modify the rough surface with a micro-nano structure, and finally form a super-hydrophobic microstructure layer 2 with super-hydrophobic properties. The super-hydrophobic microstructure layer 2 can capture a layer of micro-nano-level air, reduce the direct contact between the fluid and the inner wall surface, and thus reduce the viscous resistance between the fluid and the wall surface.
微通道本体1的内壁表面通过超疏水处理，流体流动的阻力会降低。然而，超疏水微结构层2的微纳结构中滞留的空气薄层会降低微通道本体1的冷却特性。因此，本实施例中超疏水微结构层2交替布置在微通道本体1内壁的各个壁面上，一方面，流体与超疏水微结构层2接触时会降低流体与壁面之间的粘滞阻力；另一方面，由于局部润湿特性的不同会造成流体局部流动速度的增加及流体的扰动，为此可以在降低流动阻力的同时强化对流换热；超疏水微结构层2的条纹宽度、相邻条纹之间的距离，可以根据需求进行调节，而且超疏水微结构层2也可以如图2所示，呈类螺旋型交替布置在微通道本体1内壁的各个壁面上。The surface of the inner wall of the microchannel body 1 is treated with superhydrophobic treatment, so that the resistance of fluid flow will be reduced. However, the air thin layer trapped in the micro-nano structure of the super-hydrophobic micro-structure layer 2 will reduce the cooling performance of the micro-channel body 1 . Therefore, in the present embodiment, the super-hydrophobic microstructure layer 2 is alternately arranged on each wall surface of the microchannel body 1 inner wall. On the one hand, when the fluid contacts the super-hydrophobic microstructure layer 2, the viscous resistance between the fluid and the wall surface can be reduced; On the one hand, due to the difference in local wetting characteristics, the local flow velocity of the fluid will increase and the fluid will be disturbed, so the convective heat transfer can be enhanced while reducing the flow resistance; the stripe width of the superhydrophobic microstructure layer 2, the adjacent stripe width The distance between them can be adjusted according to requirements, and the super-hydrophobic microstructure layer 2 can also be alternately arranged on each wall surface of the inner wall of the microchannel body 1 in a helical shape as shown in FIG. 2 .
超疏水微结构层2的润湿角控制在120°-160°的范围内，从而可以确保其超疏水性能；而且超疏水微结构层2的润湿角沿着流体的流动方向逐渐呈梯度降低，以实现流体的自驱动流动，降低驱动流体流动所需的泵功。The wetting angle of the superhydrophobic microstructure layer 2 is controlled within the range of 120°-160°, thereby ensuring its superhydrophobic performance; and the wetting angle of the superhydrophobic microstructure layer 2 gradually decreases along the flow direction of the fluid , so as to realize the self-driven flow of the fluid and reduce the pump work required to drive the fluid flow.
微通道本体1采用硅、铜、铝或合金钢等高导热材料制成，也能提高微通道冷却器的换热性能。The microchannel body 1 is made of high thermal conductivity materials such as silicon, copper, aluminum or alloy steel, which can also improve the heat transfer performance of the microchannel cooler.
实施例二、Embodiment two,
本实施例为在实施例一的基础上进行改进的实施例，其与实施例一的不同之处仅在于超疏水微结构层2的布置方式，如图3所示，超疏水微结构层2间隔布置在微通道本体1的内壁底面。This embodiment is an embodiment improved on the basis of Embodiment 1, and its difference from Embodiment 1 is only the arrangement of the super-hydrophobic microstructure layer 2, as shown in Figure 3, the super-hydrophobic microstructure layer 2 The intervals are arranged on the bottom surface of the inner wall of the microchannel body 1 .
实施例三、Embodiment three,
本实施例为在实施例一的基础上进行改进的实施例，其与实施例一的不同之处仅在于超疏水微结构层2的布置方式，如图4所示，超疏水微结构层2布置在微通道本体1的整个内壁底面，润湿角沿着流体的流动方向逐渐呈梯度降低，从而可以实现流体的自驱动流动，降低驱动流体流动所需的泵功。This embodiment is an embodiment improved on the basis of Embodiment 1, and its difference from Embodiment 1 is only the arrangement of the super-hydrophobic microstructure layer 2, as shown in Figure 4, the super-hydrophobic microstructure layer 2 Arranged on the entire bottom surface of the inner wall of the microchannel body 1, the wetting angle gradually decreases along the flow direction of the fluid in a gradient, so that the self-driven flow of the fluid can be realized and the pump work required to drive the fluid flow can be reduced.
实施例四、Embodiment four,
本实施例为在实施例一的基础上进行改进的实施例，如图5所示，其与实施例一的不同之处仅在于还包括有亲水微结构层3，亲水微结构层3和超疏水微结构层2交替布置；可以克服微通道本体1的内壁表面完全经过疏水处理所带来的换热性能的恶化以及完全通过亲水处理所带来的流动阻力的显著增加。This embodiment is an embodiment improved on the basis of Embodiment 1, as shown in Figure 5, its difference from Embodiment 1 is that it also includes a hydrophilic microstructure layer 3, and the hydrophilic microstructure layer 3 Arranged alternately with the super-hydrophobic microstructure layer 2; it can overcome the deterioration of the heat exchange performance caused by the complete hydrophobic treatment of the inner wall surface of the microchannel body 1 and the significant increase in the flow resistance caused by the complete hydrophilic treatment.
本发明中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处。综上所述，本说明书内容不应理解为对本发明的限制。In the present invention, specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only used to help understand the method and core idea of the present invention; meanwhile, for those of ordinary skill in the art, according to the present invention The idea of the invention will have changes in the specific implementation and scope of application. In summary, the contents of this specification should not be construed as limiting the present invention.
| Application Number | Priority Date | Filing Date | Title |
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| CN201710040426.3ACN106802095A (en) | 2017-01-20 | 2017-01-20 | A kind of microchannel cooling |
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| CN201710040426.3ACN106802095A (en) | 2017-01-20 | 2017-01-20 | A kind of microchannel cooling |
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| CN106802095Atrue CN106802095A (en) | 2017-06-06 |
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| RJ01 | Rejection of invention patent application after publication | Application publication date:20170606 |