Telemetering type temperature sensorTechnical field
The present invention relates to electrical accessorie technical field, specifically a kind of telemetering type temperature sensor.
Background technology
Temperature sensor (temperature transducer) refers to that can experience temperature and be converted into usable output signalSensor.
Existing temperature sensor is to clamping thermistor between gold leaf in two gold leaf one end using metal frameworkAfter chip, heat under vacuum conditions, pressurize, the diaphragm-type thermistor that two polyimides diaphragms are made is bonded up and downTemperature sensor.But, existing temperature sensor tool as described above has disadvantages that.Due between two polyimides diaphragmsBe provided with thermistor chip and be not provided with thermistor chip position between be formed with difference in height, it is difficult to pass through apply a level pressurePower equably pastes all sites could be realized, it is necessary to pass through high price apparatus, and be difficult batch production.
Also, gold leaf can only be based in outside diaphragm to be connected to external circuit, when the gold leaf to projecting applies repeatedlyGold leaf is possible to break during external force.First thermistor chip is clipped between gold leaf when thermistor chip is adhered into gold leafThen (soldering) is welded, because gold leaf needs to maintain a certain size, therefore, cannot not only produce less than a scaleVery little product, and variously-shaped product cannot be produced.
Further, since each sensor diaphragm is equipped with a thermistor chip, and in order to determine teleworkThe temperature of sensing of standing needs wired delivery module, therefore, not only manufacturing expense increases, and when multiple temperature sensors are setIt is difficult distribution.And, mounted temperature sensor has what is caused by wire due to wire is connected into thermistorThe problems such as coupling part of weight increase or wire and thermistor is because of vibration deterioration.
When thermistor chip without being accurately installed on measured element very much, it may appear that cannot measure or measureThe larger situation of value deviation.
The content of the invention
The present invention proposes a kind of telemetering type temperature sensor, solve temperature sensor in the prior art be difficult distribution, intoThis height, easily deterioration, the problem that need to accurately install.
The technical proposal of the invention is realized in this way：
A kind of telemetering type temperature sensor, including sensor diaphragm and connector modules；
The sensor diaphragm includes：
The temperature compensating element of the temperature-sensitive element of some film-forms and a film-form；
Some conductive wires films, each temperature-sensitive element and temperature compensating element are connected to a pair of conductive wiring film,The other end of some conductive wires films is connected to jointing；
Upper insulating properties film and lower insulating properties film, the upper insulation film are fitted in the upper of the lower insulating properties filmSide；The temperature-sensitive element, temperature compensating element, conductive wires film and jointing be folded in the upper insulating properties film and underBetween insulating properties film；
Some infrared absorbing films are fitted with above the upper insulating properties film, the infrared absorbing film is located at instituteState the surface of temperature-sensitive element；
Some infrared reflection films are fitted with below the lower insulating properties film, the infrared reflection film is located at instituteState the underface of temperature-sensitive element；
It is provided with protective layer below the lower insulating properties film, the protective layer is by the lower insulating properties film and infrared rayReflectance coating is covered；
The connector modules have the side of jointing located at the sensor diaphragm；
The connector modules include a main controller, and the main controller is connected with wireless communication module and power supply, the masterControl device is electrically connected with the jointing.
Further, the upper insulating properties film and lower insulating properties film are formed by infrared transmitting film.
Further, the temperature-sensitive element and temperature compensating element are the film heat of the film forming on the lower insulating properties filmQuick resistive element.
Further, the jointing and conductive wires film are formed by mode of printing.
Further, the connector modules include a housing, and one end of the housing has for accommodating the sensingThe holding tank of device diaphragm one end, the top of the holding tank is hinged with rotatable lid by articulated elements；
Downwardly projecting conductive bonding pin is provided with the inside of the lid, the bottom of the holding tank is provided with for accommodatingState the pin-and-hole of conductive bonding pin；
There is the sensor diaphragm side of jointing to be contained in the holding tank, and the conductive bonding pin is passed throughThe lower end that the sensor diaphragm has the position of jointing, the conductive bonding pin is placed in the pin-and-hole.
Beneficial effects of the present invention are：
Telemetering type arrangement of temperature sensor of the invention is simple, reasonable in design；The present invention is lightweight and thin, installation and resistance toShaking property is excellent, even if there is the position deviation somewhat can also to accurately measure temperature；Temperature compensating element can determine surrounding environmentTemperature, improves accuracy of detection；Can by temperature value Wireless transceiver to remote central control terminal, can remote monitoring, take arrange in timeApply；The present invention is simple to manufacture, with low cost.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existingThe accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only thisSome embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be withOther accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of one embodiment of the invention；
Fig. 2 is the structural representation of sensor diaphragm one embodiment in the present invention.
Wherein：
1st, temperature-sensitive element；2nd, conductive wires film；3rd, jointing；4th, upper insulating properties film；5th, lower insulating properties film；6、Infrared absorbing film；7th, infrared reflection film；8th, housing；9th, holding tank；10th, lid；11st, conductive bonding pin；12nd, pin-and-hole；13、Protective layer；14th, temperature compensating element.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, completeSite preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based onEmbodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not madeEmbodiment, belongs to the scope of protection of the invention.
As Figure 1-Figure 2, the telemetering type temperature sensor in the present embodiment, including sensor diaphragm and connector mouldBlock.
The sensor diaphragm includes：The temperature compensating element 14 of the film-form of temperature-sensitive element 1 and of some film-forms；IfDry conductive wires film 2, each temperature-sensitive element 1 and temperature compensating element 14 are connected to a pair of conductive wiring film 2, Ruo GansuoThe other end for stating conductive wires film 2 is connected to jointing 3；Upper insulating properties film 4 and lower insulating properties film 5, it is describedUpper insulation film is fitted in the top of the lower insulating properties film 5；The temperature-sensitive element 1, temperature compensating element 14, electric conductivity are matched somebody with somebodyLine film 2 and jointing 3 are folded between the upper insulating properties film 4 and lower insulating properties film 5；The upper insulating properties film 4Top be fitted with some infrared absorbing films 6, the infrared absorbing film 6 is located at the surface of the temperature-sensitive element 1；InstituteThe lower section for stating lower insulating properties film 5 is fitted with some infrared reflection films 7, and the infrared reflection film 7 is located at the temperature-sensitiveThe underface of element 1；The lower section of the lower insulating properties film 5 is provided with protective layer 13, and the protective layer 13 is by the lower insulating propertiesFilm 5 and infrared reflection film 7 are covered.In the present embodiment, the quantity of temperature-sensitive element 1 is 3.
In the present embodiment, the upper insulating properties film 4 and lower insulating properties film 5 are formed by infrared transmitting film.InstituteState temperature-sensitive element 1 and thin-film thermistor element that temperature compensating element 14 is the film forming on the lower insulating properties film 5.It is describedJointing 3 and conductive wires film 2 are formed by mode of printing.
The connector modules have the side of jointing 3 located at the sensor diaphragm；The connector modules bagA main controller is included, the main controller is connected with wireless communication module and power supply, and the main controller is electrically connected with the jointing 3Connect.
In the present embodiment, the connector modules include a housing 8, and one end of the housing 8 is with described for accommodatingThe holding tank 9 of sensor diaphragm one end, the top of the holding tank 9 is hinged with rotatable lid 10 by articulated elements；It is describedThe inner side of lid 10 is provided with downwardly projecting conductive bonding pin 11, and the bottom of the holding tank 9 is provided with for accommodating the conductionThe pin-and-hole 12 of connecting pin 11；There is the sensor diaphragm side of jointing 3 to be contained in the holding tank 9, described to leadElectrical connector pin 11 has the position of jointing 3 through the sensor diaphragm, and the lower end of the conductive bonding pin 11 is placed inIn the pin-and-hole 12.
In the present embodiment, upper insulating properties film 4 clamps temperature-sensitive element 1, temperature-compensating between lower insulating properties film 5The state of element 14, conductive wires film 2 and jointing 3 is pasted on lower insulating properties film 5.That is, temperature-sensitive element 1, temperatureCompensating element, 14, conductive wires film 2 and jointing 3 are clamped by a pair of insulating properties films.In addition, lower insulating properties film 5 andUpper insulating properties film 4 is formed by infrared transmitting film.In the present embodiment, lower insulating properties film 5 and upper insulating properties film 4 byPolyimide resin piece is formed.
The temperature-sensitive element 1 and temperature compensating element 14 can use thin-film thermistor element.In the present embodiment, temperature-sensitiveElement 1 and temperature compensating element 14 use following thin-film thermistor element：By Mn-Co systems metal composite oxide or in Mn-The composition metal oxidation that at least one metal composite oxide comprising Ni, Fe, Cu is constituted in Co systems metal composite oxideThing film and be formed on the metal composite oxide film and be connected to the resistance measurements such as the comb poles of conductive wires film 2 useMetal electrode (diagram is omitted).
The infrared absorbing film 6 is formed by the material with the infrared absorption rate higher than upper insulating properties film 4, for exampleFormed by the film comprising infrared absorbing materials such as carbon blacks or infrared ray-absorbable glass-film.That is, by the infrared ray absorbingFilm 6 absorbs the infrared ray from determinand radiation, then by the heat transfer of upper insulating properties film 4, makes the temperature-sensitive element 1 of underfaceTemperature change.The infrared absorbing film 6 covers the temperature-sensitive element 1 with the size less times greater than temperature-sensitive element 1.
The infrared reflection film 7 is formed by the material with the infrared emission rate less than lower insulating properties film 5, for exampleAluminium-vapour deposition film or aluminium foil by minute surface etc. are formed.The infrared reflection film 7 is with less times greater than temperature-sensitive element 1 and infrared absorbing film6 size covers them.
The infrared ray absorbing temperature of the measurement of infrared absorbing film 6 is based on due to temperature-sensitive element 1, even if therefore not being pasted on surveyDetermine to realize that contact is fixed on object, as long as being arranged close to state, even if generation position deviation somewhat can also be surveyed exactlyConstant temperature degree, mitigates installation operation and installation workload.Even if that is, setting when with measure object apart from slight variation, it is also possible toFully absorbed with infrared absorbing film 6 come the infrared ray of measure object radiation, temperature measuring is carried out well therefore, it is possible to precision.
Temperature compensating element 14 as determine ambient temperature reference, according to temperature compensating element 14 and temperature-sensitive element1 detection relative value can improve the ultrared accuracy of detection of temperature-sensitive element 1.
And, wire is not used as distribution, and be utilized on lower insulating properties film 5 with pattern form integral printingConductive wires film 2, therefore, it is possible to suppress the increase of weight, improve the resistance to vibration of distribution.
In addition, infrared reflection film 7 is set, it is red beyond being cut down from measure object by infrared reflection film 7The interference that outside line causes, it is possible to carry out the temperature measuring of higher precision.
Further, since temperature-sensitive element 1, temperature compensating element 14 and conductive wires film 2 by lower insulating properties film 5 and it is upper absolutelyEdge film 4 is clamped, therefore, temperature-sensitive element 1, temperature compensating element 14 and conductive wires film 2 will not expose, and can use insulationProperty film while protect them, further improve the resistance to vibration of distribution.
In the present embodiment, the connector modules accommodate the sensor diaphragm has one end of jointing 3, by electricityThe temperature value Wireless transceiver that will be sensed after connection sensing temperature is to remote work station.The front end of the housing 8 of connector modules is to openFormula is put, and is formed with the holding tank 9 for accommodating sensor diaphragm one end, the top of the holding tank 9 is hinged by articulated elementsThere is rotatable lid 10.
The inner side of the lid 10 is provided with downwardly projecting conductive bonding pin 11, and the bottom correspondence of the holding tank 9 is conductiveConnecting pin 11 is provided with pin-and-hole 12.The lid 10 is installed on the appearance of the housing 8 at the end of jointing 3 of the sensor diaphragmCovered when receiving in groove 9 on holding tank 9, now, the conductive bonding pin 11 runs through jointing 3, the conductive bonding pin 11End is placed in pin-and-hole 12.The conductive bonding pin 11 is mutually in status of electrically connecting when running through jointing 3.Also, can lead toThe conductive bonding pin 11 is crossed through sensor diaphragm to prevent the sensor diaphragm to be disconnected device module.
The main controller for being electrically connected to the conductive bonding pin 11 is provided with the housing 8, the temperature value that main controller is exportedIt is sent to the wireless communication module and power supply of remote work station.
When the present embodiment works, temperature-sensitive element 1 and temperature compensating element 14 experience the change of temperature, such as film temperature-sensitive electricityResistance element varies with temperature its resistance and changes, and main controller reads its increased resistance value, and is converted into temperature value, thenBy wireless communication module by the temperature value Wireless transceiver for converting to remote central control room.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the inventionWithin god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.