技术领域technical field
本发明涉及一种具有微/纳复合碳纳米管阵列结构的硅基微型脉动热管冷却器，应用于集成IC电子元器件的高效温控冷却技术领域。The invention relates to a silicon-based micro-pulsation heat pipe cooler with a micro/nano composite carbon nanotube array structure, which is applied to the technical field of high-efficiency temperature-controlled cooling of integrated IC electronic components.
背景技术Background technique
随着微电子技术和大规模集成电路的迅速发展，微电子芯片的发热强度越来越大，生成的热量若无法及时排除，将严重影响微电子元件甚至整个系统的工作性能和使用寿命。因此，发展高效紧凑的微电子温控技术，以解决芯片冷却空间狭小、散热困难等问题是当前该领域发展所面临的紧迫任务。With the rapid development of microelectronics technology and large-scale integrated circuits, the heating intensity of microelectronic chips is increasing. If the generated heat cannot be removed in time, it will seriously affect the working performance and service life of microelectronic components and even the entire system. Therefore, it is an urgent task for the development of this field to develop efficient and compact microelectronic temperature control technology to solve the problems of narrow chip cooling space and difficult heat dissipation.
在各种微电子器件散热冷却技术中，脉动热管因其结构简单、无需吸液芯以及独特的散热性能和良好的空间适应性正日益受到关注，被认为是一种极具发展前景的新型散热冷却技术。而通过MEMS技术加工的硅基微型脉动热管由于整体尺寸较小，能够与散热空间高度受限的微电子芯片直接集成而在微电子器件散热领域得到广泛运用，但研究发现随着加热功率的增大，微型脉动热管蒸发段容易出现“烧干”现象，振荡被抑制，温控能力下降。McCarthy等在《Nanoscale and Microscale Thermophysical Engineering》（微/纳尺度热物理工程）（2014年卷3，18期）上发表的“Materials, Fabrication, andManufacturing of Micro/Nanostructured Surfaces for Phase-Change Heat TransferEnhancement”（微/纳结构表面的设计与加工及其相变传热性能分析）一文中指出，微纳复合结构表面能够有效驱动液相流动和促进液膜蒸发，提高电子器件冷却温控的能力，因此将微/纳复合结构作为吸液芯对微型脉动热管传热性能提高具有较高的潜在应用价值。根据MEMS技术在微加工方面的独特优势和硅表面成熟的碳纳米管阵列生长技术，适当调整或改进微型脉动热管的通道表面使其成为微/纳复合碳纳米管阵列结构表面，可提高热管承载热负荷能力和冷却温控性能。Among various heat dissipation and cooling technologies for microelectronic devices, pulsating heat pipes are attracting increasing attention because of their simple structure, no need for liquid-absorbing cores, unique heat dissipation performance and good space adaptability, and are considered to be a new type of heat dissipation with great development prospects. cooling technology. Silicon-based micro-pulsating heat pipes processed by MEMS technology are widely used in the field of heat dissipation of microelectronic devices due to their small overall size and can be directly integrated with microelectronic chips with limited heat dissipation space. The evaporation section of the large and micro pulsating heat pipe is prone to "burn out" phenomenon, the oscillation is suppressed, and the temperature control ability is reduced. "Materials, Fabrication, and Manufacturing of Micro/Nanostructured Surfaces for Phase-Change Heat Transfer Enhancement" published by McCarthy et al. in "Nanoscale and Microscale Thermophysical Engineering" (Volume 3, Issue 18, 2014) ( The design and processing of micro/nano structure surface and its phase change heat transfer performance analysis) pointed out in the article that the micro/nano composite structure surface can effectively drive liquid phase flow and promote liquid film evaporation, and improve the ability of cooling and temperature control of electronic devices. The micro/nano composite structure has high potential application value as a liquid-absorbing core to improve the heat transfer performance of micro-pulsating heat pipes. According to the unique advantages of MEMS technology in micromachining and the mature carbon nanotube array growth technology on the silicon surface, properly adjusting or improving the channel surface of the micro pulsation heat pipe to make it a micro/nano composite carbon nanotube array structure surface can improve the heat pipe load capacity. Thermal load capacity and cooling temperature control performance.
发明内容Contents of the invention
本发明的目的在于克服普通通道硅基微型脉动热管内部工质蒸发段易发生“烧干”和温度不均匀以及现有微型脉动热管启动状态差等技术缺陷，通过改变脉动热管通道表面结构设计出一种兼具吸液芯热管和普通脉动热管的特点，能明显改善热管的启动状态和提高其冷却温控性能以及承载热负荷能力的微/纳复合碳纳米管阵列结构的硅基微型脉动热管。The purpose of the present invention is to overcome the technical defects such as "burning dry" and uneven temperature in the internal working fluid evaporation section of the silicon-based micro pulsating heat pipe with ordinary channels, and the poor start-up state of the existing micro pulsating heat pipes. A silicon-based micro-pulsating heat pipe with a micro/nano composite carbon nanotube array structure that has the characteristics of both a liquid-absorbing wick heat pipe and an ordinary pulsating heat pipe, which can significantly improve the start-up state of the heat pipe, improve its cooling temperature control performance and heat load carrying capacity .
为实现上述发明目的，本发明采用的技术方案为：一种具有微/纳复合结构的硅基微型脉动热管，包括复合为一体的半导体硅片和耐热硼硅酸玻璃片，所述半导体硅片上刻蚀有若干微槽道和抽真空/注液微槽道，所述微槽道与所述抽真空/注液微槽道连通，所述微槽道表面为微/纳复合结构表面；所述耐热硼硅酸玻璃片上加工有抽真空/注液孔；所述抽真空/注液孔与半导体硅片上的抽真空/注液微槽道的顶端位置相对应。In order to achieve the purpose of the above invention, the technical solution adopted by the present invention is: a silicon-based micro-pulsating heat pipe with a micro/nano composite structure, including a composite semiconductor silicon chip and a heat-resistant borosilicate glass chip, the semiconductor silicon There are several micro-channels and vacuum/injection micro-channels etched on the chip, the micro-channels communicate with the vacuum/liquid injection micro-channels, and the surface of the micro-channels is a micro/nano composite structure surface ; The heat-resistant borosilicate glass sheet is processed with a vacuum/liquid injection hole; the vacuum/liquid injection hole corresponds to the top position of the vacuum/liquid injection micro channel on the semiconductor silicon wafer.
上述方案中，所述半导体硅片和所述耐热硼硅酸玻璃片通过高压静电键合为一体。In the above solution, the semiconductor silicon chip and the heat-resistant borosilicate glass chip are bonded together through high-voltage electrostatic bonding.
上述方案中，所述微槽道上的微/纳复合结构表面通过碳纳米管阵列生长技术形成。In the above solution, the surface of the micro/nano composite structure on the micro channel is formed by carbon nanotube array growth technology.
上述方案中，所述半导体硅片上刻蚀有若干条平行的微槽道，每条微槽道的两端形成U型弯头，微槽道右侧有与之想连通的抽真空/注液微槽道。In the above scheme, several parallel micro-grooves are etched on the semiconductor silicon wafer, and U-shaped elbows are formed at both ends of each micro-groove, and there is a vacuum/injection valve connected to the right side of the micro-groove. liquid microchannel.
上述方案中，所述抽真空/注液微通道内液体工质充注体积占整个热管回路总体积的40%~70%；所充液体工质为低沸点的相变工质FC-72或FC7100或R141b。In the above scheme, the filling volume of the liquid working medium in the vacuum pumping/liquid injection microchannel accounts for 40% to 70% of the total volume of the entire heat pipe circuit; FC7100 or R141b.
上述方案中，所述微槽道宽度为200 μm~800 μm；所述微槽道横截面形状为矩形或梯形。In the above solution, the width of the micro-channel is 200 μm-800 μm; the cross-sectional shape of the micro-channel is rectangular or trapezoidal.
上述方案中，所述微/纳复合结构表面由碳纳米管管束阵列形成微肋或微腔。In the above solution, the surface of the micro/nano composite structure is formed of microribs or microcavities by arrays of carbon nanotube bundles.
上述方案中，所述微肋或微腔的横截面形状为三角形或者方形或者圆形；所述微肋或微腔的横截面当量直径为数微米至数十微米；所述微肋或微腔的高度为数微米至数十微米量级；所述微肋或微腔与相邻微肋或微腔的纵、横向间距均为数微米至数十微米。In the above scheme, the cross-sectional shape of the micro-rib or micro-cavity is triangular or square or circular; the equivalent diameter of the cross-section of the micro-rib or micro-cavity is several microns to tens of microns; the micro-rib or micro-cavity is The height is on the order of several micrometers to tens of micrometers; the vertical and lateral distances between the micro-rib or microcavity and adjacent microribs or microcavities are both several micrometers to tens of micrometers.
上述方案中，所述的微肋或微腔阵列排列方式为顺排或叉排。In the above solution, the micro-rib or micro-cavity array is arranged in a straight row or a fork row.
本发明的硅基微型脉动热管通过与半导体芯片直接集成为一体，应用于微电子器件的散热冷却。The silicon-based micro-pulsation heat pipe of the invention is directly integrated with a semiconductor chip, and is applied to heat dissipation and cooling of microelectronic devices.
本发明的有益效果：本发明将图形化的碳纳米阵列通过气相沉积方式直接生长覆盖在加工得到的微通道底面，形成微/纳复合结构，有效驱动液相流动和促进液膜蒸发，增大其冷却温控能力。相比较现有普通通道微型脉动热管，本发明的微/纳复合结构的硅基微型脉动热管还具有如下优势：（1）本发明所述的微通道表面的微肋/微腔结构可继承微型热管传统吸液芯的功能，利用汽相流动逸出与液相输运传递和补充，而形成微肋/微腔的碳纳米管管束阵列则可进一步提高毛细力和增大薄液膜蒸发面积，有效增强热管内工质的润湿和再润湿性能。（2）本发明所述的微通道表面的微/纳复合碳纳米管阵列结构增加了形成沸腾核化点的表面孔隙数量，在蒸发段附近的任意位置都有可能发生核化现象，由此降低热管的启动温度和缩短热管的启动时间，增强传热能力。（3）本发明中所述的微/纳复合碳纳米管阵列结构表面设计能有效促进通道内工质由冷凝段向蒸发段补充，明显抑制蒸发段“烧干”状态的出现，有力提升其承载热负荷的能力和冷却温控性能，由此平衡微电子芯片“热点”温度并增强热管整体均温性。（4）本发明的微/纳复合结构的硅基微型脉动热管能够与微电子芯片集成为一体，无需额外功耗而有效提高芯片的冷却效果和承载热负荷能力。Beneficial effects of the present invention: the present invention directly grows the patterned carbon nano-array on the bottom surface of the processed microchannel through vapor deposition to form a micro/nano composite structure, effectively drives the liquid phase flow and promotes the evaporation of the liquid film, and increases the Its cooling temperature control ability. Compared with the existing ordinary channel micro-pulsation heat pipes, the silicon-based micro-pulsation heat pipes of the micro/nano composite structure of the present invention also have the following advantages: (1) The micro-rib/micro-cavity structure on the surface of the micro-channel described in the present invention can inherit micro The function of the traditional liquid-absorbing wick of the heat pipe is to use the vapor phase flow escape and the liquid phase transport to transfer and replenish, while the carbon nanotube bundle array forming a micro-rib/micro-cavity can further improve the capillary force and increase the evaporation area of the thin liquid film , effectively enhance the wetting and rewetting performance of the working medium in the heat pipe. (2) The micro/nano composite carbon nanotube array structure on the surface of the microchannel of the present invention increases the number of surface pores forming boiling nucleation points, and nucleation may occur at any position near the evaporation section, thus Reduce the start-up temperature of the heat pipe and shorten the start-up time of the heat pipe, and enhance the heat transfer capacity. (3) The surface design of the micro/nano composite carbon nanotube array structure described in the present invention can effectively promote the replenishment of the working fluid in the channel from the condensation section to the evaporation section, significantly inhibit the occurrence of the "burned out" state in the evaporation section, and effectively improve its The ability to carry heat loads and cooling temperature control performance, thereby balancing the "hot spot" temperature of the microelectronic chip and enhancing the overall temperature uniformity of the heat pipe. (4) The silicon-based micro pulsating heat pipe of the micro/nano composite structure of the present invention can be integrated with the microelectronic chip, effectively improving the cooling effect and heat load carrying capacity of the chip without additional power consumption.
附图说明Description of drawings
图1为本发明中微/纳复合碳纳米管阵列结构的硅基微型脉动热管硅片结构示意图。Fig. 1 is a schematic diagram of the structure of a silicon-based micro pulsating heat pipe silicon wafer with a micro/nano composite carbon nanotube array structure in the present invention.
图2为图1中M处的局部放大图。Fig. 2 is a partial enlarged view of the M in Fig. 1 .
图3为图1中A-A处截面示意图。Fig. 3 is a schematic cross-sectional view at A-A in Fig. 1 .
图4为图2中B-B处截面示意图。Fig. 4 is a schematic cross-sectional view at B-B in Fig. 2 .
图5为本发明中微/纳复合碳纳米管阵列结构的硅基微型脉动热管玻璃片结构示意图。Fig. 5 is a schematic structural diagram of a silicon-based micro pulsating heat pipe glass sheet with a micro/nano composite carbon nanotube array structure in the present invention.
图6为本发明中微/纳复合碳纳米管阵列结构的硅基微型脉动热管的一种微/纳复合结构表面。Fig. 6 is a surface of a micro/nano composite structure of a silicon-based micro pulsating heat pipe with a micro/nano composite carbon nanotube array structure in the present invention.
图7为本发明中微/纳复合碳纳米管阵列结构的硅基微型脉动热管的第二种微/纳复合结构表面。Fig. 7 is the surface of the second micro/nano composite structure of the silicon-based micro pulsating heat pipe with micro/nano composite carbon nanotube array structure in the present invention.
图8为本发明中微/纳复合碳纳米管阵列结构的硅基微型脉动热管的第三种微/纳复合结构表面。Fig. 8 is the surface of the third micro/nano composite structure of the silicon-based micro pulsating heat pipe with micro/nano composite carbon nanotube array structure in the present invention.
图中：1、硅片；2、微槽道； 3、抽真空/注液微槽道；4、硼硅酸玻璃片；5、微/纳复合结构表面；6、微肋；7、碳纳米管；8、抽真空/充注孔；9、微腔。In the figure: 1. Silicon wafer; 2. Micro channel; 3. Vacuumizing/injecting micro channel; 4. Borosilicate glass sheet; 5. Micro/nano composite structure surface; 6. Micro rib; 7. Carbon Nanotubes; 8. Vacuumizing/filling holes; 9. Microcavities.
具体实施方式detailed description
为进一步了解本发明的内容，下面将结合说明书附图和具体实施例对本发明进行详细描述。In order to further understand the content of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
本发明通过MEMS静电键合技术，将硼硅酸玻璃片4与刻蚀具有微/纳复合结构表面5的硅片1通过阳极键合技术合为一体，形成由玻璃密封的微/纳结构硅基微型脉动热管。The present invention integrates the borosilicate glass sheet 4 and the silicon sheet 1 etched with the micro/nano composite structure surface 5 through the anodic bonding technology through the MEMS electrostatic bonding technology to form a micro/nano structured silicon sealed by glass. Based on micro pulsating heat pipes.
实施例1：如图1~图6所示，微/纳复合结构的硅基微型脉动热管由一对半导体的硅片1和耐热的硼硅酸玻璃片4键合而成。其中硅片1与硼硅酸玻璃片4接触的表面通过等离子干刻技术刻蚀有矩形截面的微槽道2；微槽道2表面通过硅基表面碳纳米管阵列生长技术覆盖一层碳纳米管7，从而形成具有微肋6复合结构的微/纳复合结构表面5；硼硅酸玻璃片4上加工有抽真空/注液孔8；抽真空/注液孔8与抽真空/注液微槽道3的顶端位置相对应。从所述的抽真空/注液孔8充注50%体积分数的FC-72。Embodiment 1: As shown in Figures 1 to 6, a silicon-based micro-pulsation heat pipe with a micro/nano composite structure is formed by bonding a pair of semiconductor silicon wafers 1 and heat-resistant borosilicate glass wafers 4 . The surface of the silicon wafer 1 in contact with the borosilicate glass wafer 4 is etched with a microchannel 2 with a rectangular cross-section by plasma dry etching technology; the surface of the microchannel 2 is covered with a layer of carbon nanotubes by the silicon-based surface carbon nanotube array growth technology. tube 7, thereby forming a micro/nano composite structure surface 5 with a micro-rib 6 composite structure; the borosilicate glass sheet 4 is processed with a vacuum/liquid injection hole 8; the vacuum/liquid injection hole 8 and the vacuum/liquid injection The top positions of the microchannels 3 are corresponding. Fill 50% volume fraction of FC-72 from the vacuum/injection hole 8.
图1~图4中，硅片1大小为50 mm×20 mm，其中热管纵向长度为38 mm，横向宽度为18 mm。硅片上刻有12条中心线与硅片边界相互平行的微槽道，并在两侧各形成6个U型弯头。微槽道的横截面形状为矩形，深度280 μm，宽度为800 μm，通道横截面当量直径414.8 μm。图6中，微肋复合结构碳纳米管阵列的微肋6截面形状为圆形，直径为20 μm，微肋6高度为5 μm，微肋横向和纵向间距均为20μm，微肋排列方式为顺排。In Figures 1 to 4, the size of the silicon chip 1 is 50 mm × 20 mm, the longitudinal length of the heat pipe is 38 mm, and the lateral width is 18 mm. The silicon wafer is engraved with 12 micro-grooves whose center lines are parallel to the silicon wafer boundary, and 6 U-shaped bends are formed on both sides. The cross-sectional shape of the microchannel is rectangular, the depth is 280 μm, the width is 800 μm, and the equivalent diameter of the channel cross-section is 414.8 μm. In Fig. 6, the cross-sectional shape of the micro-rib 6 of the micro-rib composite structure carbon nanotube array is circular, the diameter is 20 μm, the height of the micro-rib 6 is 5 μm, the horizontal and vertical distances of the micro-rib are both 20 μm, and the arrangement of the micro-rib is as follows: line up.
根据前述的工作原理，该微肋结构能够继承微型热管传统吸液芯功能，利用汽相流动逸出与液相输运传递和补充，而微肋内的碳纳米管管束则在微肋基础上进一步提高毛细泵功和增大薄液膜蒸发面积，有效增强热管内工质的润湿和再润湿效果，增强传热温控能力。According to the aforementioned working principle, the micro-rib structure can inherit the function of the traditional liquid-absorbing core of the micro-heat pipe, and use the vapor phase flow escape and liquid phase transport to transfer and supplement, while the carbon nanotube bundles in the micro-rib are on the basis of the micro-rib. Further improve the capillary pump work and increase the evaporation area of the thin liquid film, effectively enhance the wetting and rewetting effect of the working medium in the heat pipe, and enhance the heat transfer and temperature control ability.
实施例2：如图1~图4、图5和图7所示，同实施例1，所不同的是该微纳复合结构的硅基微型脉动热管的微槽道2表面的微肋复合结构与图6中的存在一定差别。本微槽道横截面形状与深度均与实施例1相同，图7中微肋复合结构的碳纳米管阵列的微肋高度、直径和纵/横向间距均与图6相同，但是碳纳米管管束的排列方式为叉排。Embodiment 2: as shown in Fig. 1 ~ Fig. 4, Fig. 5 and Fig. 7, with embodiment 1, the difference is the micro-rib composite structure on the surface of the micro-groove 2 of the silicon-based micro-pulsation heat pipe of the micro-nano composite structure There is a certain difference with that in Figure 6. The cross-sectional shape and depth of the micro-channel are the same as in Example 1, and the micro-rib height, diameter and vertical/lateral spacing of the carbon nanotube array of the micro-rib composite structure in Fig. 7 are all the same as Fig. 6, but the carbon nanotube bundles The arrangement is fork row.
同样，如图7所示的微纳复合结构硅基微型脉动热管继承了传统热管的吸液芯功能，并增强了管内工质的润湿和再润湿效果，有效增强传热温控能力。Similarly, the silicon-based micro pulsation heat pipe with micro-nano composite structure as shown in Figure 7 inherits the liquid-absorbing core function of the traditional heat pipe, and enhances the wetting and rewetting effect of the working medium in the tube, effectively enhancing the heat transfer and temperature control ability.
实施例3：同实施例1和实施例2，微纳复合结构硅基微型脉动热管的微槽道横截面形状与深度均与实施例1相同，所不同的是其微槽道表面如图8。图8中微纳复合结构为碳纳米管阵列的微腔9，其中，微腔9的形状、高度、排列方式和疏密程度与实施例1相同。Embodiment 3: Same as Embodiment 1 and Embodiment 2, the cross-sectional shape and depth of the micro-channel of the micro-nano composite structure silicon-based micro-pulsation heat pipe are the same as in Example 1, except that the surface of the micro-channel is as shown in Figure 8 . In FIG. 8 , the micro-nano composite structure is a microcavity 9 of a carbon nanotube array, wherein the shape, height, arrangement and density of the microcavity 9 are the same as those in Example 1.
本发明的实施方式并不受上述实施例的限制，其中微肋/腔的直径、微肋/腔间的中心距、高度等均可根据实际需要进行调整。虽然以上描述了本发明的一个具体实施方案，但本领域内的科技人员应当理解，这些实施实例可以做出多种变更或修改，而不背离本发明的原理和实质，本发明的范围仅有所附权利要求书限定。The embodiments of the present invention are not limited by the above examples, and the diameter of the micro-ribs/cavities, the center-to-center distance between the micro-ribs/cavities, the height, etc. can be adjusted according to actual needs. Although a specific embodiment of the present invention has been described above, those skilled in the art should understand that these implementation examples can make various changes or modifications without departing from the principle and essence of the present invention, and the scope of the present invention only defined by the appended claims.
| Application Number | Priority Date | Filing Date | Title |
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| CN201611150519.3ACN106643243A (en) | 2016-12-14 | 2016-12-14 | Silicon-based micro pulse heat pipe with micro/nano composite structures |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611150519.3ACN106643243A (en) | 2016-12-14 | 2016-12-14 | Silicon-based micro pulse heat pipe with micro/nano composite structures |
| Publication Number | Publication Date |
|---|---|
| CN106643243Atrue CN106643243A (en) | 2017-05-10 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611150519.3APendingCN106643243A (en) | 2016-12-14 | 2016-12-14 | Silicon-based micro pulse heat pipe with micro/nano composite structures |
| Country | Link |
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| CN (1) | CN106643243A (en) |
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| CN103940269A (en)* | 2014-04-25 | 2014-07-23 | 上海交通大学 | Heat tube based on carbon nano tube wick and manufacturing method of heat tube |
| CN104406440A (en)* | 2014-11-06 | 2015-03-11 | 江苏大学 | Silicon-based miniature loop heat pipe cooler |
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| CN107197609A (en)* | 2017-06-15 | 2017-09-22 | 北京机械设备研究所 | A kind of closed electronics rack device and assembly method based on micro heat pipe temperature-uniforming plate |
| CN107197609B (en)* | 2017-06-15 | 2019-05-21 | 北京机械设备研究所 | A kind of closed electronics rack device and assembly method based on micro heat pipe temperature-uniforming plate |
| CN109059592A (en)* | 2018-09-05 | 2018-12-21 | 中国科学院工程热物理研究所 | Microchannel and the composite construction of nanometer stick array and preparation method thereof |
| CN109980317A (en)* | 2019-03-15 | 2019-07-05 | 北京航空航天大学 | With the spatial overlay cold plate for actively adjusting cooling capacity distribution |
| DE102021214936A1 (en) | 2021-12-22 | 2023-06-22 | Robert Bosch Gesellschaft mit beschränkter Haftung | cooler |
| CN119789368A (en)* | 2024-12-05 | 2025-04-08 | 西安交通大学 | A pulsating heat pipe radiator based on microchannel flat tube |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | Application publication date:20170510 | |
| RJ01 | Rejection of invention patent application after publication |