【The content of the invention】
To overcome the detecting precision existing for the current electronic equipment with pressure sensorLow problem, the present invention provide a kind of detecting precision higher three-dimensional input module.
The invention provides a kind of technical scheme for solving above-mentioned technical problem：A kind of threeDimension input module, including one first touch control electrode layer and a second touch control electrode layer, instituteState and on the first touch control electrode layer, be provided with a plurality of first direction touch control electrode, described secondA plurality of second direction touch control electrode, the three-dimensional input mould are provided with touch control electrode layerBlock using mutual capacitance mode detect in response to touch control operation produce touching signals, described threeDimension input module further includes the compound pressure sensitivity layer of a flexibility, the compound pressure sensitivity layerIncluding a flexible substrate layer, the flexible substrate layer opposite sides is respectively arranged with oneOne pressure sensitivity layer and one second pressure sensitivity layer, the first pressure sensitivity layer and the second pressure sensitivity layerOn be respectively arranged with least one first pressure sensitivity unit and at least one second pressure sensitivity unit, instituteState the first pressure sensitivity unit and the second pressure sensitivity unit pressure is produced in response to touch control operationSignal, the three-dimensional input module detect pressure signal using self-capacitance mode.
Preferably, in pressure signal detecting process, the second pressure sensitivity unit conductThe temperature-compensating object of the first pressure sensitivity unit.
Preferably, the three-dimensional input module further includes that a three dimensional signal processes electricityRoad, the first pressure sensitivity unit are produced respectively with the corresponding second pressure sensitivity unitThe dry signal linear correlation of heat, by computing electricity is arranged in the three dimensional signal process circuitBoth hot dry signals are cancelled out each other to eliminate pressure signal error in road.
Preferably, the computing circuit be signed magnitude arithmetic(al) circuit, scaling circuitAnd the combination of one or more in calculus computing circuit.
Preferably, under pressure signal stacked system, the first pressure sensitivity layer and describedThe noise signal of the second pressure sensitivity layer is offset, the double enhancing of pressure signal.
Preferably, the first pressure sensitivity layer is the pressure sensitivity material system using positive temperature coefficientInto positive temperature coefficient pressure sensitivity layer, the second pressure sensitivity layer is using negative temperature coefficientNegative temperature coefficient pressure sensitivity layer made by pressure sensitivity material.
Preferably, the positive temperature coefficient absolute value of the positive temperature coefficient pressure sensitivity layer with it is negativeThe negative temperature coefficient absolute value of temperature coefficient pressure sensitivity layer is equal or linear.
Preferably as described the of the temperature-compensating object of the first pressure sensitivity unitTwo pressure sensitivity unit materials are identical, and shaped position and size are corresponding.
Preferably, the first pressure sensitivity layer and/or the second pressure sensitivity layer material are piezoelectricityMaterial, is the piezoelectric selected from monocrystal, film class, ceramic-like or polymerization speciesIn one or more combination.
Preferably, the three-dimensional input module further includes an at least thermal insulation layer, instituteState the side that an at least thermal insulation layer is arranged on the compound pressure sensitivity layer.
Compared with prior art, three-dimensional input module provided by the present invention is into such asLower advantage：
Three-dimensional input module of the invention can not only detect touch point position, and canThe pressure value of touch point is detected, the three-dimensional input module is provided with a compound pressure sensitivity layer,Which can be used for detecting the pressing force value at touch point.The compound pressure sensitivity layer is at least wrappedA flexible substrate layer is included, the flexible substrate layer is made using flexible material, and which canIt is sensitive sense deform upon in the pressure produced by touch point, carry to a certain extentThe pressure detection precision of three-dimensional input module is risen.
The both sides of the flexible substrate layer are provided with the first pressure sensitivity layer and the second pressure sensitivity layer,The first pressure sensitivity unit being located on the first pressure sensitivity layer and the second pressure sensitivity layer respectively and the second pressureSense unit size position corresponds, mutual in the first pressure sensitivity unit and the second pressure sensitivity unitFor temperature-compensating references object when, due to the correspondence of its size positions, its respective instituteAs the brought noise warning signal such as temperature and other interference received is unanimously, electric through computingRoad etc. can preferably eliminate other produced by during pressure signal is detected after processingNoise warning signal.Adherence pressure detects precision；It is especially using just in the first pressure sensitivity layerIt is using negative temperature coefficient that the pressure sensitivity material of temperature coefficient makes the second pressure sensitivity layerWhen pressure sensitivity material is made, its can reach temperature-compensating can reach again pressure signal foldPlus effect.It is overall that there is flexible design, the advantages of rational in infrastructure.
【Specific embodiment】
In order that the purpose of the present invention, technical scheme and advantage become more apparent, withLower combination accompanying drawing and embodiment, the present invention will be described in further detail.ShouldUnderstand, specific embodiment described herein only to explain the present invention, and withoutIt is of the invention in limiting.
Fig. 1 is referred to, first embodiment of the invention three-dimensional input module 10 is from top to bottom(in the present invention, up and down, top, the position word such as bottom be only used for limiting and specifyRelative position on view, rather than absolute position) include a upper substrate 11, successivelyLaminating layer 12, one first touch control electrode layer 131, one first insulating barrier 14, one is combinedPressure sensitivity layer 10s, one second insulating barrier 14 ', a second touch control electrode layer 132 andThree dimensional signal process circuit 18.
First insulating barrier 14 and the second insulating barrier 14 ' are respectively as the first touch control electrode layer131 with the bearing bed of second touch control electrode layer 132, and in 13 (bag of touch control electrode layerInclude the first touch control electrode layer 131 and second touch control electrode layer 132) with compound pressure sensitivity layerInsulating effect is played between 10s.Wherein, the first touch control electrode layer 131 and the second touch-control electricityBecause the mutual capacitance effect caused by touch control operation can be as two-dimensional position between pole layer 132(i.e. X and Y-direction) detecting is used, and compound pressure sensitivity layer 10s is then to as anotherThe detecting of dimension (i.e. Z-direction) pressure value is used.The touch control electrode layer 13 and compound pressureSense layer 10s is electrical with three dimensional signal process circuit 18 by conductor wire (figure is not regarded)Connection.
The upper substrate 11 can be assumed that the touch cover plate for electronic equipment, so-called lidPlate includes a touch operation surface and a component mounting surface, and its touch operation surface is used for fingerOr pointer etc. carries out touch control operation, component mounting surface is then used for installing touch control electrode groupPart or display module etc..11 material of upper substrate can be PEEK (polyetheRetherketone polyether-ether-ketones), (Polyimide polyamides is sub- for PIAmine), (polyethyleneterephthalate gathers right PETPET), PC (Merlon Merlon), PES are (poly-EGS ethylene glycol succinate, PMMA (polymethyl methacrylate polymethylMethacrylate) and its any material such as both compounds, but not withThis is limited and can use soft glass or thinning glass cover-plate.
Laminating layer 12 can select OCA (Optical transparent adhesive, Optical Clear) or LOCA (Liquid optical clear adhesive, Liquid Optical Clear AdhesiveAdhesive)。
The three dimensional signal process circuit 18 is arranged under second touch control electrode layer 132Side, its position are not construed as limiting, and which can also be arranged above second touch control electrode layer 132Or the other positions of its side etc..
The material of insulating barrier (the first insulating barrier 14 and the second insulating barrier 14 ') is preferredFor SiO2 (silica) or Si3N4 (silicon nitride), can be with other embodimentFrom flexible parent metal, with being more preferably transparent flexible material, which can also be firmProperty base material, such as ultra-thin glass, sapphire glass, PI (polyimides), PC are (poly-Carbonic ester), polyether sulfone (PES), polymethyl methacrylate (PMMA), pressure gramIt is power, acrylic nitrile-butadiene-styrene (ABS), polyamide (PA), poly-It is benzimidazole polybutene (PB), polybutylene terephthalate (PBT) (PBT), poly-It is ester (PE), polyether-ether-ketone (PEEK), PEI (PEI), poly-Etherimide, polyethylene (PE), polyethylene terephthalate (PET),Polystyrene (PS), polytetrafluoroethylene (PTFE) (PTFE), polyurethane (PU),Polyvinyl chloride (PVC) L-type PLA (PLLA) etc., is not limited to.
Fig. 2A and Fig. 2 B are referred to, first touch control electrode layer 131 includes a plurality ofThe first direction touch control electrode 134 of (X-direction) parallel equidistant arrangement in the first direction,Second touch control electrode layer 132 is included between a plurality of (Y-direction) in a second direction parallel gradeAway from the second direction touch control electrode 135 of arrangement, X-direction is orthogonal with Y-direction.DescribedOne direction touch control electrode 134 defines array arrangement with second direction touch control electrode 135Multiple touch control units, when the touch control unit detects the touch-control behaviour from upper substrate 11Corresponding electric signal transmission is produced after work to three dimensional signal process circuit 18.
Respectively with 4 first direction touch control electrodes 134 and 4 in Fig. 2A and Fig. 2 BCarry out as a example by second direction touch control electrode 135 it is schematically illustrate, in fact, quantity is notIt is restricted.Most preferably, the first direction touch control electrode 134 and second direction touch-controlThe set location of electrode 135 is complementary.In the present embodiment, the X-direction and Y sideTo orthogonal, but the angle angle of X and Y-direction is not construed as limiting.Only with rhombus in diagramTouch control electrode (first direction touch control electrode 134 and the second direction touch control electrode of strip135) illustrate as a example by, in fact, the shape of touch control electrode can be series connectionThe other shapes such as triangle, the circle of series connection, rectangle, waveform, which is not limitedIt is fixed.Touch control electrode material can be indium-tin-oxide (ITO), CNT, Graphene,Nano-silver thread, metal grill etc..
As shown in fig. 1, the compound pressure sensitivity layer 10s at least includes one from top to bottomFirst pressure sensitivity layer 15, a flexible substrate layer 16 and one second pressure sensitivity layer 17, it is describedFirst pressure sensitivity layer 15 and the second pressure sensitivity layer 17 are arranged on 16 both sides of flexible substrate layer simultaneouslyUsing flexible substrate layer 16 as bearing bed.
Fig. 3 A are referred to, on the first pressure sensitivity layer 15, at least one first is provided withPressure sensitivity unit 151, only with the first pressure sensitivity unit 151 of 5 × 8 row arrays of row in Fig. 3 AAs a example by illustrating, its actual quantity and Array Design are not restricted, depending on specifically needingDepending on asking.The first pressure sensitivity unit 151 is rectangle, and its shape can also be otherPolygon, it is circular, it is trapezoidal etc. it is irregularly shaped in one or more.
Must notice, for example, on the first pressure sensitivity layer 15 per one first pressure sensitivity unit151 can be connected to integrated circuit by two conductor wires forms closing conductive loops, in order to sharp everyOne first pressure sensitivity unit 151 performs the detecting of self-capacitance pressure sensitivity, on the first pressure sensitivity layer 15A plurality of conductor wire first can carry out signal through this layer of corresponding flexible circuit board (not shown)Derive；In the same manner, the second pressure sensitivity layer 17 also can be respective per one second pressure sensitivity unit 171Form closing conductive loops to detect with sharp self-capacitance pressure sensitivity, and it is corresponding soft by this layerProperty circuit board (not shown) carries out signal derivation.
Fig. 3 B are referred to, Fig. 3 B are the cut away view at IV-IV place along Fig. 3 A, are located atThe first pressure sensitivity layer 15 and the second pressure sensitivity layer 17 of 16 upper and lower surface of the flexible substrate layerGeomery and position correspondence, are provided with the second pressure sensitivity unit on the second pressure sensitivity layer 17171, position between multiple first pressure sensitivity units 151 and multiple second pressure sensitivity units 171Correspond.171 preferred material phase of first pressure sensitivity unit 151 and the second pressure sensitivity unitTogether.Touch control operation person when the upper surface of upper substrate 11 carries out touch control operation, the touch-controlCorresponding at least one first pressure sensitivity unit 151 at point, or at least one first pressure sensitivity unit151 will be under pressure simultaneously with least one second pressure sensitivity unit 171.
Fig. 4 is referred to, as the variant embodiment of first and second pressure sensitivity layer 15,17：First pressure sensitivity layer 15 ' prolongs first direction (e.g. X-direction) arrangement PVDF from multiple(Polyvinylidene Fluoride polyvinyladine florides) piezoelectricity bar 151 ' (equivalent toFirst pressure sensitivity unit) making, and the second pressure sensitivity layer 17 ' prolongs second direction from multiple(e.g. Y-direction) arrangement PVDF piezoelectricity bar 171 ' (equivalent to the second pressure sensitivity unit)To make；In fact, the first pressure sensitivity unit and the second pressure sensitivity on the first pressure sensitivity layer 15 'The second pressure sensitivity unit on layer 17 ' can be crisscross arranged with other forms or complementaryArrange, do not limited to.
The first pressure sensitivity unit 151 and/or the second pressure sensitivity unit 171 are grasped by touch-controlMake produced by pressure and cause deformation, deflection or shear etc. compliance reaction so as toThe piezoelectric for causing at least one electrical property to change, is selected from monocrystal, thinOne or more combination in film class, ceramic-like or polymerization species equipressure electric material.InPiezoelectric described in specific embodiment can be nano level tin indium oxide (Indium TinOxide, ITO), tin-antiomony oxide (Antimony Doped Tin Oxide, ATO), ZnO(zinc oxide) and titanium oxide zirconium, indium zinc oxide (IndiumZinc Oxide, IZO),The metalloid oxides such as zinc oxide aluminum (Aluminum Zinc Oxide, AZO), stoneOne or more in English, barium titanate or lead zirconate titanate (PZT) and piezoelectric ceramics etc. etc.Material with piezoelectricity or pressure drag property.It can also be dispersed in insulation, it is transparent,Indium tin oxide (ITO) in deformable matrix, the tin oxide (ATO) for mixing antimony,Mix the zinc oxide (AZO) or the particle of other transparent conductive oxides of aluminium, the baseMatter may include polymeric material, e.g. any one of copolymer or terpolymer),Preferably transparent piezoelectric of the light transmittance more than 70% (optimum light transmittance is more than 90%)Material.
The flexible substrate layer 16 is flexible material, it is preferred that thickness is less than 500 μm,More preferably, thickness is less than 200 μm.16 material of flexible substrate layer can be polymer film,The polymer film such as includes polyethylene terephthalate (PET), poly- naphthalene twoFormic acid glycol ester (PEN), polymethyl methacrylate (PMMA) or poly- carbonic acidThe film of ester, thin glass sheet (for example, 100 μ m-thicks or thinner) or soda-lime-silica glass.With being more preferably transparent flexible material, light transmittance is (preferably saturating more than 80%Light rate is more than 90%).
Three dimensional signal process circuit 18 is integrated on one chip, three dimensional signal process electricityRoad 18 is with processing pressure signal and the function of touching signals.Touch control unit and pressure sensitivityThe touching signals of unit (the first pressure sensitivity unit 151 and the second pressure sensitivity unit 171) and pressureThe detecting mode of force signal has various, in the present invention, is detected using mutual capacitance modeTouching signals, detect pressure signal by the way of self-capacitance.
The mutual capacitance mode is detected touching signals and is specially：The touch control unit is byOne direction touch control electrode 131 is defined with second direction touch control electrode 132, and which hasCapacity effect, i.e. first direction touch control electrode 131 and second direction touch control electrode 132Between form electric capacity, top crown of the first direction touch control electrode 131 equivalent to electric capacity,The second direction touch control electrode 132 works as user's finger equivalent to the bottom crown of electric capacityOr pointer etc. is when carrying out touch control operation on upper substrate 11, have impact on that touch point is to be touchedCoupling (i.e. mutual capacitance effect) on control unit between bottom crown, so as to change the twoCapacitance between pole plate.The change of the capacitance forms touching signals and is transferred to threeDimensional signal process circuit 18, after the three dimensional signal process circuit 18 carries out signal transactingConfirm the position of touch point.
The self-capacitance mode is detected pressure signal and is specially：Each pressure sensitivity unit is at leastIncluding two electrodes, the pressure sensitivity unit can be measured because of push action by two electrodeProduced pressure signal, two electrode are that a pressure-driven electrode and a pressure are receivedElectrode (schemes not regarding, i.e., each pressure sensitivity unit of two electrodes construction is complete loopsInput electrode and output electrode), the pressure-driven electrode receives driving pulse, that is, pressPower driving electrodes send pumping signal, and pressure receiving electrode receives pressure signal and passes throughCircuit conducts pressure signal to three dimensional signal process circuit 18, three dimensional signal process electricityRoad 18 carries out processing to pressure signal and determines pressing force value size.
Pressure sensitivity layer (the first pressure sensitivity layer 15 and the second pressure sensitivity layer 17) is from piezoelectric systemInto its piezoelectric property has otherness because of the difference of its local environment.With the first pressureIllustrate as a example by sense unit 151, the first pressure sensitivity unit 151 under normal temperature is pressedDuring pressure, in theory, the first pressure sensitivity unit 151 should be able to produce size for d'sPressure signal, but due to the impact of temperature change, 151 actual institute of the first pressure sensitivity unitThe pressure signal D=d+s of generation, s are brought to the first pressure sensitivity unit 151 by temperatureThe dry signal of heat, the hot dry signal s change because of the difference of temperature, and this causesPressure signal detected by our reality can be with the first pressure sensitivity unit 151 only because of pressureThere is error in produced actual pressure signal, such case is that we are not intended to generation, when the first pressure sensitivity unit 151 due on the first pressure sensitivity layer 15 is respectively withOn two pressure sensitivity layers 17 the neighbouring corresponding second pressure sensitivity unit 171 of institute have it is substantially the same orClose thermal coefficient of expansion etc., therefore, the pressure letter brought by the rwo temperature influenceNumber measures of dispersion it is equal or approximate (into approximate quantity increase or linear related increase and decrease relation).Therefore, we can be by the first pressure sensitivity unit 151 on the first pressure sensitivity layer 15 respectively withOn two pressure sensitivity layers 17, the second corresponding pressure sensitivity unit 171 is used as mutual temperature-compensatingReferences object detects error to eliminate the pressure signal brought by hot dry signal.
As a kind of standards Example for eliminating hot dry signal：The first pressure sensitivity unit151 or phases identical with the hot dry signal that corresponding second pressure sensitivity unit 171 is produced respectivelyClosely, (adopt differential electrical by computing circuit being arranged in three dimensional signal process circuit 18The combination of road, computing circuit or computing circuit, such as signed magnitude arithmetic(al) circuit, ratio fortuneCalculate circuit, calculus computing circuit etc.) both hot dry signals are cancelled out each otherTo eliminate pressure signal error.Using the first pressure sensitivity unit 151 and the second pressure sensitivity unitHot dry signal suffered by 171 is identical and any signal processing mode for taking is offsettingThe method of the dry signal of heat is belonged in the design philosophy of temperature-compensating in the present embodiment.During the actual detecting of pressure signal, not only have hot dry signal and produce, which is alsoOther interference signals are had, to illustrate only by taking hot dry signal as an example in the present invention.
Preferably select as one kind, the first pressure sensitivity layer 15 and the second pressure sensitivity layer 17Made using different material, specially the first pressure sensitivity layer 15 is using positive temperaturePositive temperature coefficient pressure sensitivity layer made by the pressure sensitivity material of coefficient, the second pressure sensitivity layer 17It is negative temperature coefficient pressure sensitivity layer made by the pressure sensitivity material using negative temperature coefficient, it is describedThe positive temperature coefficient absolute value of positive temperature coefficient pressure sensitivity layer and negative temperature coefficient pressure sensitivity layer itNegative temperature coefficient absolute value linear (including equal).The positive temperature coefficient pressureThe noise warning signal of sense layer and negative temperature coefficient pressure sensitivity layer produced by under the influence of equivalent environmentSize is identical or proportional, but its opposite polarity, therefore, in pressure signal superposition sideUnder formula, can directly pass through summation operation circuit (positive temperature coefficient and negative temperature coefficientIdentical situation) or passing ratio computing circuit and summation operation etc. combination by describedThe noise signal of one pressure sensitivity layer 15 and the second pressure sensitivity layer 17 is offset (i.e. such as firstPressure signal D1=d+s produced by 151 reality of pressure sensitivity unit, and the second pressure sensitivity unitPressure signal D2=d-s produced by 171 reality, under pressure signal stacked system,D1+D2=d+s+d-s=2d), pressure signal at least obtains double enhancing.Using positive temperatureThe pressure sensitivity material of degree coefficient not only can be reached with the cooperation of the pressure sensitivity material of negative temperature coefficientThe noise reduction brought by temperature-compensating is arrived, which has also reached pressure signal superposition instituteThe pressure signal enhancing effect brought.
Compared with prior art, the three-dimensional input module 10 submitted to by the present invention at least hasHave the following advantages：
1. present invention three-dimensional input module 10 can not only detect touch point position, andThe pressure value of touch point can be detected, the three-dimensional input module 10 is provided with one and is combinedPressure sensitivity layer 10s, which can be used for detecting the pressing force value at touch point.The compound pressureSense layer 10s at least includes a flexible substrate layer 16, and the flexible substrate layer 16 is using softProperty material make, which sensitive can sense shape occurs in the pressure produced by touch pointBecome, improve the pressure detection spirit precision of three-dimensional input module 10 to a certain extent.The both sides of the flexible substrate layer 16 are provided with the first pressure sensitivity layer 15 and the second pressure sensitivityLayer 17, respectively the first pressure sensitivity on the first pressure sensitivity layer 15 and the second pressure sensitivity layer 17Unit 151 and 171 size positions of the second pressure sensitivity unit are corresponded, in the first pressure sensitivityDuring the references object of unit 151 and the second temperature-compensating each other of pressure sensitivity unit 171, byIn the correspondence of its size positions, which is each suffered such as temperature and other interference institute bandsThe noise warning signal for coming is consistent, after the process such as computing circuit can preferably eliminate pressureOther noise warning signals produced by during force signal detecting.Adherence pressure detects precision；Especially the first pressure sensitivity layer 15 be made using the pressure sensitivity material of positive temperature coefficient it is describedWhen second pressure sensitivity layer 17 is to be made using the pressure sensitivity material of negative temperature coefficient, which is i.e. reachableThe effect of pressure signal superposition can be reached again to temperature-compensating.It is overall that there is design spiritIt is living, the advantages of rational in infrastructure.
2. the detecting of touch point position in the present invention uses the mode of mutual capacitance and detectsSurvey, in response to the touching signals type produced by push action be capacitance signal, firstPressure sensitivity layer 15 and the second pressure sensitivity layer 17 are made using piezoelectric, and which is in response to pressingPressure signal type produced by action is also capacitance signal, touching signals and pressure letterNumber response signal type identical (being all electric capacity signal), its be easy to the detecting of signal andProcess.Especially in signal transacting, due to the type of described two signals it is identical,The production firm of three-dimensional input module 10 need not design two sets of independent hardware devices and come rightPressure signal and touching signals are processed, using integrated three-dimensional letter on a chipNumber process circuit 18 can realize that touching signals and the process of pressure signal (are supportedSelf-capacitance during mutual capacitance measurement and pressure sensitivity during touch-control such as measures at the capacitance signal detecting).The integrated level of three-dimensional input module 10 is which enhanced, the cost of hardware device is reduced.The signal detection pattern is equally applicable to the other embodiment of the present invention.
Fig. 5 is referred to, second embodiment of the invention three-dimensional input module 50 is from top to bottomSuccessively including a upper substrate 511, one first touch control electrode layer 512, substrate layer 513,One second touch control electrode layer 514, a laminating layer 52, a compound pressure sensitivity layer 50s andThree dimensional signal process circuit 58, substrate layer 513 are made for transparent insulation material, thereonLower surface is respectively as the first touch control electrode layer 512 and second touch control electrode layer 514Bearing bed.Pressure sensitivity layer 10s is combined in the compound pressure sensitivity layer 50s and first embodimentStructure and pressure signal detecting principle are consistent, and which is from top to bottom successively including one first pressureSense layer 55, a flexible substrate layer 56 and one second pressure sensitivity layer 57, first pressureSense layer 55 and the second pressure sensitivity layer 57 are arranged on 56 both sides of flexible substrate layer and with flexibilitySubstrate layer 56 is used as bearing bed.The present embodiment is the difference is that only with the first enforcement：The compound pressure sensitivity layer 50s is not embedded in the first touch control electrode layer 512 and second and touchesBetween control electrode layer 514, but it is positioned at the first touch control electrode layer 512 and second and touchesControl 514 homonymy of electrode layer.That is the first touch control electrode layer 512 and second touch control electrode layer514 are located between upper substrate 511 and compound pressure sensitivity layer 50s.
The compound pressure sensitivity layer 50s of the three-dimensional input module 50 proposed by this enforcement is located at and touchesControl electrode layer (including the first touch control electrode layer 512 and second touch control electrode layer 514) oneSide, due to touch control electrode layer and compound pressure sensitivity layer 10s it is relatively independent, therefore, Liang ZhekeMade by different vendor with separating, then can be made by simple laminating and both be hadThere is touch detection again with pressure detection with three-dimensional input module 50, in manufactureMutual independence can reduce the fraction defective of final finished to a certain extent.This kind outerThe setting of hanging structure causes the maintenance of three-dimensional input module 50 to become possibility, works as touch-controlWhen electrode layer or compound pressure sensitivity layer 50s a portions go wrong, we can be with non-The replacement operation of corresponding component is easily carried out often.In order to cater to the needs in market, passThe contact panel of the single function of system will be on the verge of being replaced, but using provided by the present inventionThree-dimensional input module 50 is quite different, and we can be being passed by the simple operations such as laminating groundThe side plug-in one of system contact panel is combined pressure sensitivity layer 50s to realize to conventional touch face" upgrading " of plate, it is to avoid the conventional touch panel made is eliminated what is broughtEnergy waste, and no matter existing contact panel to be which kind of structure can pass through plug-in" upgrading " is realized in formula design.
First touch control electrode layer 512 can be arranged on base with second touch control electrode layer 514The relative both sides of material layer 513, i.e., such as glass thin membrane type (Glass-film type；GF2)Framework, which can also be separately positioned on different substrate layers, i.e., such as diaphragm type(Glass-film-film type；GFF), or the first touch control electrode layer 512 and second is touchedControl electrode layer 514 is interlaced, i.e., be touch-control (single-side type as built bridge；SITO)Or both between no overlap, i.e., as one-layer multi-point touch control (non-cross type) shapeFormula is arranged in the same plane.
Refer to Fig. 6 A, third embodiment of the invention three-dimensional input module (non-label) withFirst embodiment three-dimensional input module 10 the difference is that only：First pressure sensitivity unit751a is different from the first pressure sensitivity unit 151 (referring to Fig. 3 A) in first embodiment, toolBody be the first pressure sensitivity unit 751a be square-wave-shaped, due to pressing when, pressure sensitivity materialMarginal portion is easier to experience pressure and deform so as to cause sending out for pressure signalIt is raw, therefore the first pressure sensitivity unit 751a is set to into square-wave-shaped, due to the square-wave-shapedFirst pressure sensitivity unit 751a marginal portions size substantially increases, the first pressure sensitivity unit 751aThere is better pressure detection sensitivity.The first pressure sensitivity unit 751a shapes are alsoCan be polyline shaped (such as the first pressure sensitivity unit 751b in Fig. 6 B), convoluted or itsHis shape such as irregular.First pressure sensitivity unit 751a and/or the second pressure sensitivity unit size are mostIt is good to be less than or equal to 1 square centimeter, to preferable pressure detection density can be obtained.
More particularly, when the directionality that the first pressure sensitivity unit 751a is usedPressure-strain pressure sensitivity material, the directionality pressure-strain pressure sensitivity material have direction specialProperty：In some or multiple specific directions occur strain responses (effective strain react,Sliding pressure action towards specific direction is detected for example) when, which can detect accordinglyPressure signal, conversely, being difficult to strain responses in unspecified directions, or occursDuring strain responses (invalid strain responses), which can hardly be detected pressure signalGeneration or the probability that can be detected of pressure signal it is relatively low.If can adopt in Fig. 6 AWith the directionality pressure-strain pressure sensitivity material in Y-direction, then the first pressure sensitivity unitWhen 751a produces strain responses in the Y direction, produced by the first pressure sensitivity unit 751aPressure signal can be detected, conversely, in the X direction (in unspecified directions)During generation strain responses, pressure signal is difficult to produce.Having from these material behaviorsBeneficial effect is that finer detecting is carried out to pressure direction.
As in Fig. 6 B, the first pressure sensitivity unit 751b adopts 45 ° (only to carry out as a example by 45 °Illustrate, which can also be that other are arbitrarily angled) direction of effective strain reaction on pathProperty pressure-strain pressure sensitivity material；Certainly, the first pressure sensitivity unit 751a may also be configured toThe directionality pressure-strain pressure sensitivity material of effective strain reaction can occur on few 2 directions(mean value of the pressure signal in desirable multiple directions to calculate total pressure signal).Thus, the first pressure sensitivity unit 751a and its variant embodiment can be used to be configured in it is specificAt touch point, for enriching function or raising touch-control sensitivity at single touch pointTo avoid operational error from bringing signal to judge by accident.
Fourth embodiment of the invention three-dimensional input module (not shown) is implemented with firstThree-dimensional input module 10 in example the difference is that only：The three-dimensional input moduleBetween its compound pressure sensitivity layer and upper substrate, an at least thermal insulation layer is selectively set, due toThree-dimensional input module is either applied to the electricity of consumer electronics product or industrial class etc.Sub- product, used as touch operation surface, which is exposed in air the upper substrate, heatEasily it is transferred to inside three-dimensional input module from upper substrate.The thermal insulation layer act as resistanceValue heat passes to compound pressure sensitivity layer from upper substrate direction, it is to avoid temperature change is to compoundThe hot dry effect brought by pressure sensitivity layer.Further, can be below compound pressure sensitivity layerArrange another thermal insulation layer to prevent the heat produced by display device etc. from affecting pressure signalDetecting precision.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit thisInvention, all any modifications for being made within the principle of the present invention and change equivalentEntering etc. all should be comprising within protection scope of the present invention.