A kind of dynamics detection method for substrateTechnical field
The present invention relates to a kind of pressure detection method of glass substrate more particularly to a kind of dynamics detection sides for substrateMethod.
Background technique
By the way that strain resistor is arranged on substrate, can be caused according to the strain that strain resistor is generated when substrate stress is bentResistance variations detect the stress of substrate, such as pressing force of the finger on substrate.
This strain resistor is generally made as the Thin film conductive line of detour, in order to improve measuring accuracy, in a mechanics senseIt answers unit (i.e. a sensing point) that at least four strain resistors are set, is detected with constituting bridge circuit.Strain resistor is not as a result,Biggish area can be only occupied, there are also complicated cablings.
However, each above-mentioned mechanics sensing unit only realizes the pressure detection of a position, in order to realize multiple positionsThe detection set, needs the higher mechanics sensing unit of density of setting on substrate, and each mechanics sensing unit include toThe bridge circuit that few four strain resistors are constituted, thus will cause the arrangement of strain resistor and the difficulty of line arrangement.
Summary of the invention
It is this for substrate the technical problem to be solved in the present invention is to provide a kind of dynamics detection method for substrateDynamics detection method can reduce the quantity of mechanics sensing unit on mechanics tablet, so that arranging strain on mechanics tabletResistance and route are more easier.The technical solution adopted is as follows:
A kind of dynamics detection method for substrate is based on a mechanics tablet, and mechanics tablet includes touch sensing layerWith mechanics inductive layer, mechanics inductive layer includes multiple mechanics sensing units, and mechanics sensing unit includes at least one strain resistor,It is characterized by comprising following steps:
1) touch position P of the finger on substrate is detected by the touch sensing layer；
2) by n mechanics sensing unit on mechanics inductive layer, detect that the pressure as caused by touch position P passes respectivelyComponent fn is passed, wherein n >=1；
3) the distance between touch position P and above-mentioned each mechanics sensing unit ln are calculated；
4) the pressure transmitting component fn and touch position P that is detected according to above-mentioned each mechanics sensing unit and eachThe distance between a mechanics sensing unit ln calculates separately the pressing force component F n of touch position P, then passes through each pressing force pointAmount Fn calculates total pressing force F of touch position P.
Above-mentioned touch sensing layer can be the touch sensitive layer based on capacitance principle, be capacitance touch screen.
Detect that pressure caused by touch position P passes by least one mechanics sensing unit on the periphery touch position PComponent fn is passed, and the distance between each mechanics sensing unit and touch position P ln is cooperated to calculate the pressing force of touch position PComponent F n, then total pressing force F of touch position P is calculated by each pressing force component F n, briefly, at touch position PTotal pressing force F obtained by least one mechanics sensing unit on the periphery touch position P, therefore, be not necessarily at touch position PMechanics sensing unit is set, so that the number of mechanics strain unit on mechanics tablet is reduced, so that the cloth on mechanics tabletIt sets strain resistor and route is more easier, or improve pressure detection precision.
As a preferred solution of the present invention, in the step 4), the pressure that is detected by each mechanics sensing unitComponent fn, and the proportional relation of the pressing force component F n and distance ln according to touch position P are transmitted, calculates touch position P'sPressing force component F n, specially, wherein k is cross force Transfer Parameters related with the material of substrate and thickness.OnK is stated as only cross force Transfer Parameters related with the material of substrate and thickness, can directly be measured by experiment.Using linear mouldType can approximatively extrapolate the pressing force component F of touch position Pn, computationally more it is easy.
As a preferred solution of the present invention, in the step 4), the pressure that is detected by each mechanics sensing unitComponent fn, and the proportional relation of the pressing force component F n and distance ln according to touch position P are transmitted, calculates touch position P'sPressing force component F n, specially, wherein k is cross force related with the material of substrate and thickness transmittingParameter.Above-mentioned k is only cross force Transfer Parameters related with the material of substrate and thickness, can directly be measured by experiment.UsingThe case where exponential function is calculated, is more nearly real estate bending and generates strain.
As a preferred solution of the present invention, in the step 2), n >=3；In the step 4), total pressing of touch position PThe specific calculation of power F is。
As the further preferred embodiment of the present invention, in the step 2, n=4, and 4 mechanics sensing units and touchingPosition P is closest.
Compared with the prior art, the invention has the following advantages:
Total pressing force F at touch position P obtained by least one mechanics sensing unit on the periphery touch position P, becauseThis, no setting is required at touch position P mechanics sensing unit, so that the number of mechanics strain unit on mechanics tablet is reduced,So that arranging that strain resistor and route are more easier on mechanics tablet, or improve pressure detection precision.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of mechanics tablet；
Fig. 2 is the schematic diagram for total pressing force F that the embodiment of the present invention one calculates touch position P.
Specific embodiment
It is described further with reference to the accompanying drawing with the preferred embodiment of the present invention.
Embodiment one
As shown in Figure 1 and Figure 2, a kind of dynamics detection method for substrate is based on a mechanics tablet 1, mechanics tablet1 includes touch sensing layer 2 and mechanics inductive layer 3, and mechanics inductive layer 3 includes multiple mechanics sensing units 4, mechanics sensing unit 4Comprising multiple strain resistors, include the following steps:
1) touch position P of the finger on substrate 5 is detected by touch sensing layer 2；
2) pass through the 4(tetra- near touch position P on mechanics inductive layer 3) a mechanics sensing unit 4, it is detected respectively by touchingTouch the transmitting of pressure caused by the P of position component f1、f2、f3、f4；
3) the distance between touch position P and above-mentioned each mechanics sensing unit 4 l are calculated1、l2、l3、l4；
4) component f is transmitted according to the pressure that above-mentioned each mechanics sensing unit 4 is detected1、f2、f3、f4, and touchingThe distance between position P and each mechanics sensing unit 4 l1、l2、l3、l4, calculate separately the pressing force component F of touch position P1、F2、F3、F4, wherein the calculation of the pressing force component F n of touch position P be specially, n=1,2,3,4, wherein kFor cross force Transfer Parameters related with the material of substrate 5 and thickness, then pass through each pressing force component F1、F2、F3、F4It calculatesTotal pressing force F of touch position P, specific calculation are out。
Above-mentioned n is also possible to 1,2,3,5,6 etc..
Embodiment two
In the case where other parts are the same as example 1, difference is only that the pressing force component of touch position PThe calculation of Fn is different, specifically, in step 4), the specific calculation of the pressing force component F n of touch position P is, wherein k is cross force Transfer Parameters related with the material of substrate 5 and thickness.
In addition, it should be noted that, the specific embodiments described in this specification, each section title etc. can notTogether, the equivalent or simple change that all structure, feature and principles described according to the invention patent design are done, is included in the present inventionIn the protection scope of patent.Those skilled in the art can do described specific embodiment various eachThe mode that the modify or supplement or adopt of sample is similar substitutes, and without departing from structure of the invention or surmounts the claimsDefined range, is within the scope of protection of the invention.