A kind of MEMS inertia combination measurement moduleTechnical field
The present invention relates to MEMS inertia combined navigation technical field, more particularly, to a kind of measurement of MEMS inertia combinationModule.
Background technology
At present, MEMS inertial sensor is widely used in Aeronautics and Astronautics, navigation, auto industry, robot and consumption electricityThe fields such as sub- product.MEMS inertial sensor mainly includes MEMS gyroscope and mems accelerometer, for measuring the angle of carrierSpeed and acceleration.
Divide according to precision, MEMS inertial sensor can be divided into low precision and middle high accuracy.Low precision MEMS inertia sensingDevice relies on the integrated level of its superelevation to design, and three-axis gyroscope, three axis accelerometer is encapsulated in a monomer chip, volume is notTo ten cubic millimeters, it is widely used in the consumer electronics products such as mobile phone, wearable device.But low precision MEMS inertial sensorMeasurement error and noise are very big, especially big in humiture excursion, and acutely, the complicated special industry of electromagnetic environment should for vibrationWith field, trueness error can exponentially dissipate, or even damages.Middle high accuracy MEMS inertial sensor compares coarse sensorVolume is big, single-chip only one or two measurement axis integrated, needs to form Inertial Measurement Unit by special installation form, withWhen need more complicated peripheral circuit.Miniaturization with motion carriers such as Aeronautics and Astronautics, navigation, auto industry, robots is sent outExhibition, such as SUAV, microrobot, the weight demands deficiency hectogram to load, to micro-miniature inertial measuring equipmentMiniaturization, lightweight, propose requirements at the higher level in high precision.
Based on inertial navigation system, its reason can provide full inertia combined navigation system mainly due to inertial navigationThe navigational parameter in face, i.e. the position of high dynamic, speed, attitude information, this is that other navigation system can not be compared.But it is usedProperty navigation positioning error accumulate in time, especially MEMS inertial sensor error big so that MEMS inertial navigation system cannotAs independent navigation mode, position, dissipate in the speed short time acutely it is necessary to carry out information fusion by other sensors,Using Multiple Information Sources, complement each other, error is carried out with auxiliary and revises, the higher inertia combination of composition redundance, navigation accuracyMeasuring system.
Existing inertia combination measuring system, is all that Inertial Measurement Unit is individually designed, and inertia process plate needs to installIn extra support, metal machining structure, by the levelness of machining, perpendicularity required precision, to expect to protectThe card orthogonality of measurement axis and easy for installation, even if using low-density lightweight metal material, also brings along the extra of several hectogramsWeight.And the aiding sensors equipment that integrated navigation needs, it is impossible to design with combining together of Inertial Measurement Unit, brings extraSpace waste.The MEMS inertia combination measurement module of traditional design thinking cannot meet to miniaturization, light-weighted realityBorder demand.
In prior art, the design form of MEMS inertia combination measurement module, it is primarily present following shortcoming：
No matter 1 adopts the mounting bracket of which kind of form, mechanical stage body, MEMS Inertial Measurement Unit all can be greatly increasedWeight and volume, brings complexity to assembling simultaneously, seriously constrains further miniaturization, lightweight development；
2nd, due to the machinery processing apparatus using special construction, MEMS Inertial Measurement Unit cannot be with integrated navigation needsAiding sensors carry out integrated design, are unfavorable for that breaking through the constraint of the confined space leads it is impossible to form complete integrated combinationBoat parameters measurement module.
Content of the invention
The present invention provides a kind of MEMS inertia combination overcoming the problems referred to above or solving the above problems at least in part to surveyAmount module.
According to an aspect of the present invention, provide a kind of MEMS inertia combination measurement module, including by being arranged on circuitMultiple fixing devices at plate flat square carry out being laminated fixing MEMS Inertial Measurement Unit circuit board and auxiliary information measurementCircuit board unit；
Described MEMS Inertial Measurement Unit circuit board is included at X-axis inertia process plate, Y-axis inertia process plate and Z axis inertiaReason plate；
Pass through connector between described auxiliary information measuring unit circuit board and described MEMS Inertial Measurement Unit circuit boardSocket carries out circuit with socket connector pin and is connected.
Further, the side of described MEMS Inertial Measurement Unit circuit board is provided with the first groove, with the first texturearunaperpendicularOpposite side be provided with the second groove；
Described X-axis inertia process plate is installed on the first groove by way of clamping, and described Y-axis inertia process plate is passed throughThe mode of clamping is installed on the second groove；
Described Z axis inertia process plate is arranged in described MEMS Inertial Measurement Unit circuit board plane；
Described X-axis inertia process plate, Y-axis inertia process plate and Z axis inertia process plate are mutual in three dimensions X, Y, Z-directionPerpendicular quadrature.
The application proposes MEMS inertia combination measurement module, by the circuit board form of particular design, efficiently solvesThe installation question of Inertial Measurement Unit, can save mounting bracket or install stage body, greatly reduce weight and volume；VerticallyThe inertia process plate installed takes full advantage of the lamination gap of connector installation, reduce further whole height and bottom circuitPlate suqare, by the integrated design with aiding sensors circuit board it is achieved that complete integrated navigation parameter measurement.
Brief description
Fig. 1 is MEMS inertia combination measurement module schematic diagram of the present invention；
Fig. 2 is MEMS Inertial Measurement Unit circuit board of the present invention/Z axis inertia process plate schematic diagram；
Fig. 3 is auxiliary information measuring circuit plate cell schematics of the present invention；
Fig. 4 be auxiliary information measuring circuit Slab element main view of the present invention, look squarely, side-looking, left front schematic top plan view, wherein scheme4a is front view, and Fig. 4 b is plan view, and Fig. 4 c is side view, Fig. 4 d is left front top view；
Fig. 5 is MEMS Inertial Measurement Unit circuit board of the present invention/Z axis inertia process plate main view, look squarely, side-looking, left front bowDepending on, the right side after schematic top plan view, wherein, Fig. 5 a be front view, Fig. 5 b be plan view, Fig. 5 c be side view, Fig. 5 d be left front vertical viewFigure, Fig. 5 e are top view behind the right side；
Fig. 6 be X-axis inertia process plate of the present invention main view, look squarely, side-looking, left front schematic top plan view, wherein, based on Fig. 6 aView, Fig. 6 b is plan view, and Fig. 6 c is side view, Fig. 6 d is left front top view；
Fig. 7 be Y-axis inertia process plate of the present invention main view, look squarely, side-looking, left front schematic top plan view, wherein, based on Fig. 7 aView, Fig. 7 b is plan view, and Fig. 7 c is side view, Fig. 7 d is left front top view.
Description of reference numerals
1st, MEMS Inertial Measurement Unit circuit board, 2, auxiliary information measuring circuit Slab element, 3, fixing device, 11, X-axis is used toProperty process plate, 12, Y-axis inertia process plate, 13, Z axis inertia process plate, 111, X-axis MEMS inertial sensor, 121, Y-axis MEMSInertial sensor, 131, Z axis MEMS inertial sensor, 14, X-axis pad, 15, Y-axis pad, 16, Z axis pad, 21, GNSS receivesMachine, 22, magnetometer, 23, barometer, 10, socket connector pin, 20, connector receptable.
Specific embodiment
With reference to the accompanying drawings and examples, the specific embodiment of the present invention is described in further detail.Hereinafter implementExample is used for the present invention is described, but is not limited to the scope of the present invention.
In the prior art scheme, by way of design and installation support or machining stage body, MEMS will be welded withThe circuit board of inertial sensor is arranged on the support designing or stage body, in order to ensure the orthogonal vertical of measurement axis.
And practical situation is, as single package body, its measurement axis be there is MEMS inertial sensor with welded encapsulation faceOne mounting shift angle, the size of mounting shift angle is related to the production technology of MEMS producer, and difference is larger.Secondly, MEMS is used toProperty sensor during being welded to circuit board, the difference of welding procedure will also result in measurement axis and circuit board mounting planeMounting shift angle, comprehensively gets off, and mounting shift angle maximum is up to 1 °～2 °.So, by precision machined mounting bracket or stage body LaiEnsure the mode not science of measurement coordinate system precision, bring simultaneously extra design complexities, weight and volume change big,There is still a need for calibration facility compensates to mounting shift angle after installation.
The present invention from improvement mounting means and optimize volume weight two in terms of start with, and with aiding sensors measuring unitIntegrated design, there is provided ultra-compact MEMS inertia combination measurement module, and achieve complete integrated navigation parameter measurementScheme.
As shown in figure 1, a kind of MEMS inertia combination measurement module schematic diagram, including by being arranged on circuit board plane right angleMultiple fixing devices 3 at place carry out being laminated fixing MEMS Inertial Measurement Unit circuit board 1 and auxiliary information measuring circuit plate listUnit 2；
Described fixing device 3 can be screw device；The quantity of fixing device is 3 in the present embodiment.
Described MEMS Inertial Measurement Unit circuit board 1 includes X-axis inertia process plate 11, Y-axis inertia process plate 12 and Z axis and is used toProperty process plate 13；
As shown in Figure 2,3, 4, described auxiliary information measuring unit circuit board 2 and described MEMS Inertial Measurement Unit circuit boardCarry out circuit by connector receptable 20 with socket connector pin 10 between 1 to be connected.
Described connector receptable 20 may be mounted at described MEMS Inertial Measurement Unit circuit board 1 it is also possible to be arranged on instituteState on auxiliary information measuring unit circuit board 2, be arranged on the use of socket connector pin 10 is then corresponding with connector receptable 20On different circuit boards.
As shown in figure 5, the side of described MEMS Inertial Measurement Unit circuit board 1 is provided with the first groove, with the first grooveVertical opposite side is provided with the second groove；
Do not lose installation accuracy, the width of described first groove and the width of the second groove and electricity for ensureing easy for installationRoad plate thickness is equal, or is less than 0.15mm more than circuit plate thickness.
Described X-axis inertia process plate 11 is installed on the first groove, described Y-axis inertia process plate 12 by way of clampingIt is installed on the second groove by way of clamping；
Described Z axis inertia process plate 13 is arranged in described MEMS Inertial Measurement Unit circuit board 1 plane；Fig. 2, Fig. 5 instituteState MEMS Inertial Measurement Unit circuit board 1 and be Z axis inertia process plate 13；
Described X-axis inertia process plate 11, Y-axis inertia process plate 12 and Z axis inertia process plate 13 are in three dimensions X, Y, Z sideTo orthogonal orthogonal.
As shown in fig. 6, the X-axis that described X-axis inertia process plate 11 includes X-axis circuit board and is arranged on X-axis circuit board 11MEMS inertial sensor 111；
Described X-axis circuit board 11 is respectively arranged with X-axis groove in relative both sides, and described X-axis groove is used to described MEMSProperty measuring unit circuit board 1 circuit board there are same widths, stand out be less than predictive error；Described X-axis texturearunaperpendicular clampingIn described first groove；
Described X-axis groove vicinity is distributed with pad, with described MEMS Inertial Measurement Unit circuit board 1 by way of weldingOn X-axis pad 14 carry out circuit connection.
As described in Figure 7, the Y-axis that described Y-axis inertia process plate 12 includes Y-axis circuit board and is arranged on Y-axis circuit board 12MEMS inertial sensor 121；
Described Y-axis circuit board 12 is respectively arranged with Y-axis groove in relative both sides, and described Y-axis groove is used to described MEMSProperty measuring unit circuit board 1 circuit board there are same widths, stand out be less than predictive error；Described Y-axis texturearunaperpendicular clampingIn described second groove；
Described Y-axis groove vicinity is distributed with pad, with described MEMS Inertial Measurement Unit circuit board 1 by way of weldingOn Y-axis pad 15 carry out circuit connection.
As shown in Fig. 2 described Z axis inertia process plate 13 includes Z axis MEMS inertial sensor 131, by way of weldingCarry out circuit with the Z axis pad 16 on described MEMS Inertial Measurement Unit circuit board 1 to be connected.
Described X-axis inertia process plate 11 exceeds the apical side height of described MEMS Inertial Measurement Unit circuit board 1, less than stackingHighly；Described Y-axis inertia process plate 12 exceeds the apical side height of described MEMS Inertial Measurement Unit circuit board 1, high less than stackingDegree.
Described X-axis MEMS inertial sensor 111, Y-axis MEMS inertial sensor 121 and 131 points of Z axis MEMS inertial sensorDo not include MEMS gyroscope and/or mems accelerometer.
The foregoing describe described X-axis inertia process plate 11, Y-axis inertia process plate 12 and Z axis inertia process plate 13 in three-dimensionalThe orthogonal orthogonal concrete installation of space X, Y, Z-direction and method of attachment, vertically arranged X-axis inertia process plate 11, Y-axis are used toProperty process plate 12 exceed the height of Z axis inertia process plate 13 bottom surface and less than described MEMS Inertial Measurement Unit circuit board and auxiliaryThe stack height of information measuring circuitry Slab element.
When implementing, thicken circuit plate thickness it is ensured that installing and there is enough rigidity, intensity and hardness.Meanwhile, according to peaceThe device layout of device, circuit board, reduces size to greatest extent.
As shown in Figure 2,3, also include being arranged on described MEMS Inertial Measurement Unit circuit board 1 or be arranged at described auxiliaryOne or more of GNSS receiver 21 on supplementary information measuring unit circuit board 2, magnetometer 22 and barometer 23.
GNSS receiver 21, magnetometer 22 and barometer 23 both can be arranged on MEMS Inertial Measurement Unit circuit board,Can also be arranged on auxiliary information measuring circuit Slab element, a kind of, two or three of combination in any therein can be comprised.
As shown in Figure 3,4, the L-shaped indent in side of described auxiliary information measuring unit circuit board 2, physical dimension is less thanDescribed MEMS Inertial Measurement Unit circuit board 1；Described auxiliary information measuring unit circuit board 2 and described MEMS Inertial Measurement UnitCircuit board 1 carries out circuit connection by connector, relatively and lamination installation, the assembly after installation increases in height, itsExtension is determined by MEMS Inertial Measurement Unit size.
A kind of MEMS inertia combination measurement module of the present invention, its core is MEMS Inertial Measurement Unit, mainComprise three MEMS gyroscope and/or three mems accelerometers, for measuring three-dimensional angular velocity and acceleration.ReasonThink under installation situation, the measurement axis of three MEMS gyroscope are mutually perpendicular to, the measurement axis of three mems accelerometers are mutually perpendicular to,Constitute the XYZ measurement coordinate system of orthogonal vertical.
Described MEMS inertia combination measurement module is as a completely independent work system, described MEMS inertia measurement listFirst circuit board 1 and described auxiliary information measuring unit circuit board 2 also include embedded for data acquisition and navigation operations respectivelyFormula main control computer, signal conditioning circuit and/or other peripheral circuits.
The version of the present invention, is only achieved that the company of perpendicular plate and base plate by the special mounting form of circuit boardConnect, fix and communicate, efficiently solved under small area, Very Low Clearance require with structure mode simple, with low costHigh accuracy install fixation problem.Exactly because institute's preferably version, could be by MEMS Inertial Measurement Unit and auxiliary sensingDevice carries out integrated design, there is provided a kind of complete MEMS inertia combination measurement module scheme.
Finally, the present processes only preferably embodiment, is not intended to limit protection scope of the present invention.AllWithin the spirit and principles in the present invention, any modification, equivalent substitution and improvement made etc., should be included in the protection of the present inventionWithin the scope of.