技术领域technical field
本发明涉及计算机技术领域，尤其涉及一种计算机CPU散热装置。The invention relates to the technical field of computers, in particular to a computer CPU cooling device.
背景技术Background technique
中央处理器（CPU）是一块超大规模的集成电路，是一台计算机的运算核心（Core）和控制核心（ Control Unit），它的功能主要是解释计算机指令以及处理计算机软件中的数据。The central processing unit (CPU) is a very large-scale integrated circuit, which is the computing core (Core) and control core (Control Unit) of a computer. Its main function is to interpret computer instructions and process data in computer software.
中央处理器主要包括运算器（算术逻辑运算单元，ALU，Arithmetic Logic Unit）和高速缓冲存储器（Cache）及实现它们之间联系的数据（Data）、控制及状态的总线（Bus）。它与内部存储器（Memory）和输入/输出（I/O）设备合称为电子计算机三大核心部件。The central processing unit mainly includes an arithmetic unit (ALU, Arithmetic Logic Unit), a cache memory (Cache), and a bus (Bus) for realizing data (Data), control, and status between them. It, together with internal memory (Memory) and input/output (I/O) devices, is called the three core components of an electronic computer.
因为CPU是计算机中最为重要的部分，计算机在工作时，CPU需要进行大量的运算，因此会散发大量的热量，如果不能及时的将CPU产生的热量散去，则可能导致计算机出现故障。Because the CPU is the most important part of the computer. When the computer is working, the CPU needs to perform a large number of calculations, so it will emit a lot of heat. If the heat generated by the CPU cannot be dissipated in time, it may cause the computer to malfunction.
发明内容Contents of the invention
本发明的目的就在于为了解决上述问题而提供一种计算机CPU散热装置。The object of the present invention is to provide a computer CPU cooling device in order to solve the above problems.
本发明通过以下技术方案来实现上述目的：The present invention achieves the above object through the following technical solutions:
一种计算机CPU散热装置，包括散热风扇、水冷泵、蛇形水冷管和网状水冷管，所述蛇形水冷管沿所述CPU的四周呈环形分布，所述网状水冷管水平设置在所述CPU的上方，且所述网状水冷管的下侧面通过散热硅胶粘接在所述CPU的上侧面，所述散热风扇的底端通过散热硅胶粘接在所述网状水冷管的上侧面，所述蛇形水冷管和所述网状水冷管的进出水口均与所述水冷泵连通。A computer CPU cooling device, comprising a cooling fan, a water-cooling pump, a serpentine water-cooling tube and a mesh water-cooling tube, the snake-shaped water-cooling tube is distributed in a ring around the CPU, and the mesh water-cooling tube is horizontally arranged on the above the CPU, and the lower side of the mesh water-cooling tube is bonded to the upper side of the CPU through heat-dissipating silica gel, and the bottom end of the cooling fan is bonded to the upper side of the mesh water-cooling pipe through heat-dissipating silica gel , the inlet and outlet of the serpentine water-cooling pipe and the mesh water-cooling pipe are both connected with the water-cooling pump.
进一步，还包括散热鳍片，多个所述散热鳍片设置在所述CPU的四周，所述散热鳍片的下端与所述CPU的侧面固定连接，所述散热鳍片的上端环绕设置在所述散热风扇的四周。Further, it also includes heat dissipation fins, a plurality of heat dissipation fins are arranged around the CPU, the lower ends of the heat dissipation fins are fixedly connected to the side surfaces of the CPU, and the upper ends of the heat dissipation fins are arranged around the CPU. around the cooling fan.
优选地，所述散热鳍片与所述CPU的中轴线呈锐角夹角。Preferably, the cooling fins form an acute angle with the central axis of the CPU.
更进一步，还包括导热条，所述导热条设置在所述网状水冷管与所述CPU之间，且所述导热片的两端分别与所述散热鳍片的下端固定连接。Furthermore, it also includes a heat conduction strip, the heat conduction strip is arranged between the mesh water cooling tube and the CPU, and the two ends of the heat conduction sheet are respectively fixedly connected to the lower ends of the heat dissipation fins.
本发明的有益效果在于：The beneficial effects of the present invention are:
本发明一种计算机CPU散热装置通过在CPU的四周以及上侧面散装水冷管，并结合散热风扇，提升对CPU的散热性能，避免其出现温度过高的情况，使其可以正常的工作。A computer CPU cooling device of the present invention improves the cooling performance of the CPU by installing water-cooling pipes in bulk around and on the upper side of the CPU, and combining with a cooling fan, so as to avoid excessive temperature and enable it to work normally.
附图说明Description of drawings
图1是本发明所述一种计算机CPU散热装置的结构示意图；Fig. 1 is the structural representation of a kind of computer CPU cooling device of the present invention;
图2是本发明所述一种计算机CPU散热装置的俯视图。Fig. 2 is a top view of a computer CPU cooling device according to the present invention.
具体实施方式detailed description
下面结合附图对本发明作进一步说明：The present invention will be further described below in conjunction with accompanying drawing:
如图1和图2所示，本发明一种计算机CPU散热装置，包括散热风扇2、水冷泵、蛇形水冷管3、网状水冷管4、散热鳍片5和导热条6，蛇形水冷管3沿CPU1的四周呈环形分布，网状水冷管4水平设置在CPU1的上方，且网状水冷管4的下侧面通过散热硅胶粘接在CPU1的上侧面，散热风扇2的底端通过散热硅胶粘接在网状水冷管4的上侧面，蛇形水冷管3和网状水冷管4的进出水口均与水冷泵连通，多个散热鳍片5设置在CPU1的四周，散热鳍片5的下端与CPU1的侧面固定连接，散热鳍片5的上端环绕设置在散热风扇2的四周，散热鳍片5与CPU1的中轴线呈锐角夹角，导热条6设置在网状水冷管4与CPU1之间，且导热片的两端分别与散热鳍片5的下端固定连接。As shown in Fig. 1 and Fig. 2, a kind of computer CPU cooling device of the present invention comprises cooling fan 2, water cooling pump, serpentine water cooling tube 3, mesh water cooling tube 4, radiating fin 5 and heat conduction bar 6, and serpentine water cooling The tubes 3 are distributed in a circular shape around the CPU1, the mesh water-cooling tube 4 is horizontally arranged above the CPU1, and the lower side of the mesh water-cooling tube 4 is bonded to the upper side of the CPU1 through heat-dissipating silica gel, and the bottom of the cooling fan 2 passes through the heat-dissipating Silica gel is bonded to the upper side of the mesh water-cooling tube 4, the water inlet and outlet of the serpentine water-cooling tube 3 and the mesh water-cooling tube 4 are connected with the water-cooling pump, and a plurality of cooling fins 5 are arranged around the CPU1. The lower end is fixedly connected to the side of the CPU1, the upper end of the heat dissipation fin 5 is arranged around the heat dissipation fan 2, the heat dissipation fin 5 forms an acute angle with the central axis of the CPU1, and the heat conduction strip 6 is arranged between the mesh water cooling tube 4 and the CPU1. Between, and the two ends of the heat conduction sheet are respectively fixedly connected with the lower ends of the heat dissipation fins 5 .
本发明一种计算机CPU1散热装置的工作原理如下：The working principle of a kind of computer CPU1 cooling device of the present invention is as follows:
图中对导热条6进行了省略。In the figure, the heat conducting strip 6 is omitted.
在需要对CPU1进行散热时，通过水冷泵向蛇形水冷管3和网状水冷管4的进水口内泵入冷却液，冷却液经过蛇形水冷管3和网状水冷管4，将与蛇形水冷管3和网状水冷管4接触的CPU1上的热量带走，然后回送至水冷泵内进行冷却。When it is necessary to dissipate heat from the CPU1, the cooling liquid is pumped into the water inlets of the serpentine water cooling tube 3 and the mesh water cooling tube 4 through the water cooling pump, and the cooling liquid passes through the serpentine water cooling tube 3 and the mesh water cooling tube 4, and will The heat on the CPU1 contacted by the shaped water-cooling tube 3 and the mesh-shaped water-cooling tube 4 is taken away, and then sent back to the water-cooling pump for cooling.
与此同时，导热条6将CPU1上的部分热量传导至散热鳍片5上，同时散热鳍片5将CPU1上的热量吸附，并且通过散热风扇2对CPU1和散热鳍片5进行散热处理，达到对CPU1进行散热的效果。At the same time, the heat conduction strip 6 conducts part of the heat on the CPU1 to the heat dissipation fins 5, and the heat dissipation fins 5 absorb the heat on the CPU1 at the same time, and the CPU1 and the heat dissipation fins 5 are radiated by the heat dissipation fan 2 to achieve The effect of cooling CPU1.
本发明的技术方案不限于上述具体实施例的限制，凡是根据本发明的技术方案做出的技术变形，均落入本发明的保护范围之内。The technical solution of the present invention is not limited to the limitations of the above-mentioned specific embodiments, and any technical deformation made according to the technical solution of the present invention falls within the protection scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610834415.8ACN106383561A (en) | 2016-09-21 | 2016-09-21 | Computer CPU cooling apparatus |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610834415.8ACN106383561A (en) | 2016-09-21 | 2016-09-21 | Computer CPU cooling apparatus |
| Publication Number | Publication Date |
|---|---|
| CN106383561Atrue CN106383561A (en) | 2017-02-08 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610834415.8APendingCN106383561A (en) | 2016-09-21 | 2016-09-21 | Computer CPU cooling apparatus |
| Country | Link |
|---|---|
| CN (1) | CN106383561A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110632996A (en)* | 2019-09-12 | 2019-12-31 | 苏州浪潮智能科技有限公司 | Liquid cooling equipment, liquid cooling method and liquid cooling system |
| CN112443519A (en)* | 2020-12-11 | 2021-03-05 | 宋俊 | Integral sealing type hydraulic pump station |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2696033Y (en)* | 2004-04-29 | 2005-04-27 | 廖彦凯 | Water-cooled computer cooling device |
| CN2919359Y (en)* | 2006-05-26 | 2007-07-04 | 佛山市顺德区汉达精密电子科技有限公司 | Water-cooled computer heat radiating device |
| CN101080158A (en)* | 2006-05-26 | 2007-11-28 | 华硕电脑股份有限公司 | heat sink |
| US20080017350A1 (en)* | 2006-07-21 | 2008-01-24 | Foxconn Technology Co., Ltd. | Heat sink |
| CN203706120U (en)* | 2014-01-24 | 2014-07-09 | 东莞仁海科技股份有限公司 | Efficient CPU radiator |
| CN203870540U (en)* | 2014-03-12 | 2014-10-08 | 江西科技学院 | Computer radiator |
| CN104898812A (en)* | 2015-06-29 | 2015-09-09 | 邢茹 | Computer heat dissipation device |
| CN205263734U (en)* | 2015-11-05 | 2016-05-25 | 深圳市超频三科技股份有限公司 | Liquid cooling ware is listened to temperature |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2696033Y (en)* | 2004-04-29 | 2005-04-27 | 廖彦凯 | Water-cooled computer cooling device |
| CN2919359Y (en)* | 2006-05-26 | 2007-07-04 | 佛山市顺德区汉达精密电子科技有限公司 | Water-cooled computer heat radiating device |
| CN101080158A (en)* | 2006-05-26 | 2007-11-28 | 华硕电脑股份有限公司 | heat sink |
| US20080017350A1 (en)* | 2006-07-21 | 2008-01-24 | Foxconn Technology Co., Ltd. | Heat sink |
| CN203706120U (en)* | 2014-01-24 | 2014-07-09 | 东莞仁海科技股份有限公司 | Efficient CPU radiator |
| CN203870540U (en)* | 2014-03-12 | 2014-10-08 | 江西科技学院 | Computer radiator |
| CN104898812A (en)* | 2015-06-29 | 2015-09-09 | 邢茹 | Computer heat dissipation device |
| CN205263734U (en)* | 2015-11-05 | 2016-05-25 | 深圳市超频三科技股份有限公司 | Liquid cooling ware is listened to temperature |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110632996A (en)* | 2019-09-12 | 2019-12-31 | 苏州浪潮智能科技有限公司 | Liquid cooling equipment, liquid cooling method and liquid cooling system |
| CN112443519A (en)* | 2020-12-11 | 2021-03-05 | 宋俊 | Integral sealing type hydraulic pump station |
| CN112443519B (en)* | 2020-12-11 | 2022-09-09 | 山东军成机械科技有限公司 | Integral sealing type hydraulic pump station |
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|---|---|---|
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | Application publication date:20170208 | |
| RJ01 | Rejection of invention patent application after publication |