A kind of printing consumables storage chipTechnical field
The present invention relates to 3d printing technique field, more particularly, to a kind of printing consumables storage chip.
Background technology
3d printing technique occurs in the mid-90 in 20th century, and the technology such as actually utilize photocuring and ply of paper to fold isNew rapid molding device.It is essentially identical with common print operation principle, and printer " prints material built with liquid or powder etc.Material ", after being connected with computer, is controlled by computer and " printed material " is stacked up from level to level, finally the blueprint on computerBecome in kind.This printing technique is referred to as 3d three-dimensional printing technology.
However, its storage inconvenience of existing 3d printed material, and be not easy to efficiently to print raw material taking-up, this is askedTopic is urgently to be resolved hurrily.
Content of the invention
It is an object of the invention to overcoming the deficiency of above-mentioned prior art and providing a kind of printing consumables storage chip.
For achieving the above object, the present invention provides a kind of printing consumables storage chip, comprising:
Base, is distributed with several grooves on described base, be provided with several connecting tubes in described groove；Described base with eachThe corresponding front side of groove is additionally provided with outlet tube, and described outlet tube is respectively connected with each connecting tube in same groove；
Rubber cushion；Described rubber cushion is located at the bottom of described base；
Chip, described chip is made using resistant material, has cavity in chip, and the bottom of chip is provided with several and connectsTake over one-to-one discharging opening；The top of chip is additionally provided with charging aperture.
Preferably, also include a sub- mcu, described sub- mcu is arranged at the outer peripheral edge of groove,
Described sub- mcu also distinguishes phase with pressure transducer, temperature sensor, viscosity sensor, flow transducer, electromagnetic valveEven；
Described pressure transducer, temperature sensor, viscosity sensor are separately mounted to chip internal and are connected with sub- mcu；The inside of described connecting tube is provided with flow transducer and electromagnetic valve.
Preferably, it is contained with the low-temperature metal alloy of molten state in described chip.
Preferably, it is provided with defecator in described connecting tube.
Preferably, it is contained with molten glass in described chip.
Preferably, it is contained with molten state wax in described chip.
Preferably, it is provided with electric heater unit in described base.
Preferably, the outer surface of described base is provided with thermal insulation layer.
The invention has the beneficial effects as follows:
1st, good stability of the present invention, reliability is high, easy for operation, novel in design, and practical, low cost usesLife-span length is it is easy to popularization and application.
2nd, pass through to arrange sub- mcu, opened setting pressure transducer in order to measure chip in order to control each electromagnetic valveInternal pressure, by arranging temperature sensor (as thermal resistance), in order to measure the temperature of molten state material, by arranging viscositySensor is in order to measure the mobility of molten state material.By arranging base and chip, in chip, it is contained with molten state material, corePiece is hot-swappable with base, after the material in chip is using finishing, after material feeding, can be arranged on chip hot plug againOn base, chip is attached by the way of snap joint with base.Connection speed is fast.Outlet tube from base for the material is defeatedGo out, on base, chip lines up array, can placing different materials, thus having the multiformity of material, making in different chipsUse very convenient.
Brief description
Fig. 1 is the structural representation of heretofore described base；
Fig. 2 is the structural representation of heretofore described chip；
Fig. 3 is the circuit theory diagrams of the present invention；
Reference:
Base 10；Groove 20；Connecting tube 201；Outlet tube 30；Chip 40；Discharging opening 401；Sub- mcu90；Pressure transducer901；Temperature sensor 902；Viscosity sensor 903；Flow transducer 904；Electromagnetic valve 906.
The realization of the object of the invention, functional characteristics and advantage will be described further in conjunction with the embodiments referring to the drawings.
Specific embodiment
Referring to figs. 1 to 2, the present invention provides a kind of printing consumables storage chip 40, includings base 10, described base 10 dividesIt is furnished with several grooves 20, in described groove 20, be provided with several connecting tubes 201；Before described base 10 is corresponding with each groove 20Side is additionally provided with outlet tube 30, and described outlet tube 30 is respectively connected with each connecting tube 201 in same groove 20；Rubber cushion；DescribedRubber cushion is located at the bottom of described base 10；Chip 40, described chip 40 is made using resistant material, has sky in chip 40Chamber, the bottom of chip 40 is provided with the several and one-to-one discharging opening 401 of connecting tube 201；The top of chip 40 is additionally provided with chargingMouth (figure is not depending on going out).
Refer to Fig. 3, one embodiment of the present of invention, also include a sub- mcu90, described sub- mcu90 is arranged on grooveAt 20 outer peripheral edge, described sub- mcu90 is also passed with pressure transducer 901, temperature sensor 902, viscosity sensor 903, flowSensor 904, electromagnetic valve 906 are respectively connected with；Described pressure transducer 901, temperature sensor 902, viscosity sensor 903 are pacified respectivelyIt is contained in chip 40 inside and be connected with sub- mcu90；The inside of described connecting tube 201 is provided with flow transducer 904 and electromagnetic valve906.
One embodiment of the present of invention, is contained with the low-temperature metal alloy of molten state in described chip 40.These liquid goldGenus can be pumped in chip 40 using feed pump.
One embodiment of the present of invention, is provided with defecator in described connecting tube 201.As adopted wire netting, in order to filterImpurity, such as solid particle polluter.
One embodiment of the present of invention, is contained with molten glass in described chip 40.
One embodiment of the present of invention, is contained with molten state wax in described chip 40.
One embodiment of the present of invention, is provided with electric heater unit in described base 10.Described electric heater unit also with temperature controlDevice is connected, by adjusting attemperating unit, in order to the efficiency of heating of adjusting base 10.
One embodiment of the present of invention, the outer surface of described base 10 is provided with thermal insulation layer.As PE Foam layer.
In sum, good stability of the present invention, reliability is high, easy for operation, novel in design, practical, costLow, long service life is it is easy to popularization and application.By arranging sub- mcu90, opened setting in order to control each electromagnetic valve 906Pressure transducer 901 in order to measure the pressure within chip 40, by arrange temperature sensor 902 (as thermal resistance), in order to surveyThe temperature of amount molten state material, by arranging viscosity sensor 903 in order to measure the mobility of molten state material.By arranging bottomSeat 10 and chip 40, are contained with molten state material, chip 40 is hot-swappable with base 10, the material in chip 40 in chip 40After finishing, can be arranged on again on base 10 by chip 40 hot plug, after material feeding, chip 40 and base 10 are using fastThe mode of quick coupling is attached.Connection speed is fast.Outlet tube 30 from base 10 for the material exports, on base 10, chip 40Line up array, different materials being placed in different chips 40, thus having the multiformity of material, using very squareJust.
Although embodiments of the invention have been shown and described above it is to be understood that above-described embodiment is exampleProperty it is impossible to be interpreted as limitation of the present invention, those of ordinary skill in the art is in the principle without departing from the present invention and objectiveIn the case of above-described embodiment can be changed within the scope of the invention, change, replace and modification.