技术领域technical field
本发明涉及一种电子总成及电子装置，且特别是涉及一种具有散热功能的电子总成及电子装置。The invention relates to an electronic assembly and an electronic device, and in particular to an electronic assembly and an electronic device with heat dissipation function.
背景技术Background technique
由于多功能及薄型化的设计，例如智能型手机和平板电脑等电子装置非常流行。这类型的电子装置通常配备有中央处理器等会发热的元件，故必须经由散热措施来降低这些发热元件的温度，以确保这些发热元件能正常运作。Electronic devices such as smartphones and tablet computers are very popular due to their multifunctional and thin designs. This type of electronic device is usually equipped with heat-generating components such as a central processing unit, so heat dissipation measures must be taken to reduce the temperature of these heat-generating components to ensure that these heat-generating components can operate normally.
图1绘示一种现有的电子总成。请参考图1，电子总成10构成自智能型手机内部的多个电子元件，其包括电路板11、中央处理单元12(即一种发热元件)、屏蔽盖13及热管14。中央处理单元12及屏蔽盖13均安装在电路板11上。屏蔽盖13笼罩中央处理单元12，且屏蔽盖13的顶部经由散热垫15热耦接至中央处理单元12的顶部。热管14也热耦接至屏蔽盖13的顶部，使得中央处理单元12的热能经由散热垫15及屏蔽盖13传导至热管14，以经由热管14传导至他处进行散热。FIG. 1 illustrates a conventional electronic assembly. Please refer to FIG. 1 , the electronic assembly 10 is composed of multiple electronic components inside the smart phone, which includes a circuit board 11 , a central processing unit 12 (ie a heating element), a shielding cover 13 and a heat pipe 14 . Both the central processing unit 12 and the shielding cover 13 are installed on the circuit board 11 . The shield cover 13 covers the central processing unit 12 , and the top of the shield cover 13 is thermally coupled to the top of the central processing unit 12 via the heat dissipation pad 15 . The heat pipe 14 is also thermally coupled to the top of the shield cover 13 , so that the heat energy of the central processing unit 12 is conducted to the heat pipe 14 through the heat dissipation pad 15 and the shield cover 13 , so as to be conducted to other places for heat dissipation through the heat pipe 14 .
请再参考图1，由于电子总成10采用元件堆叠的结构，所以在智能型手机外观不断薄型化的情况下，电子总成10的整体厚度也不断减少，使得热管14的厚度受到严格限制。在某些设计下，热管14的厚度甚至必须小于0.5毫米(mm)，因而降低热管14的效能。同样地，由于电子总成10采用元件堆叠的结构，中央处理单元12的热阻发生在中央处理单元12与散热垫15之间、散热垫15与屏蔽盖13之间和屏蔽盖13与热管14之间，而这样的热阻造成一定程度的衰减(例如摄氏20度的温差)，因而造成散热效能的降低。Please refer to FIG. 1 again. Since the electronic assembly 10 adopts a component stacking structure, the overall thickness of the electronic assembly 10 is also continuously reduced as the appearance of smart phones continues to become thinner, so that the thickness of the heat pipe 14 is strictly limited. In some designs, the thickness of the heat pipe 14 must even be less than 0.5 millimeters (mm), thereby reducing the effectiveness of the heat pipe 14 . Likewise, since the electronic assembly 10 adopts a stacked structure of components, the thermal resistance of the central processing unit 12 occurs between the central processing unit 12 and the cooling pad 15, between the cooling pad 15 and the shielding cover 13, and between the shielding cover 13 and the heat pipe 14. Between, and such a thermal resistance causes a certain degree of attenuation (for example, a temperature difference of 20 degrees Celsius), thus resulting in a reduction in heat dissipation performance.
发明内容Contents of the invention
本发明的目的在于提供一种电子总成，用以提高热管对于发热元件的散热效果。The object of the present invention is to provide an electronic assembly for improving the heat dissipation effect of the heat pipe on the heating element.
本发明的再一目的在于提供一种电子装置，用以提高热管对于发热元件的散热效果。Another object of the present invention is to provide an electronic device for improving the heat dissipation effect of the heat pipe on the heating element.
为达上述目的，本发明提供一种电子总成，其包括电路板、发热元件及热管。发热元件具有底面及连接于底面的侧面。发热元件以底面安装至电路板。热管热耦接至发热元件的侧面，以吸收来自发热元件的热。To achieve the above purpose, the present invention provides an electronic assembly, which includes a circuit board, a heating element and a heat pipe. The heating element has a bottom surface and a side surface connected to the bottom surface. The heating element is installed on the circuit board with the bottom surface. The heat pipe is thermally coupled to the side of the heating element to absorb heat from the heating element.
本发明提供一种电子装置，其包括壳体、显示器及电子总成。显示器安装在壳体上。电子总成设置在壳体内。电子总成包括电路板、发热元件及热管。发热元件具有底面及连接于底面的侧面。发热元件以底面安装至电路板。热管热耦接至发热元件的侧面，以吸收来自发热元件的热。The invention provides an electronic device, which includes a casing, a display and an electronic assembly. The display is mounted on the housing. The electronic assembly is arranged in the casing. Electronic assembly includes circuit board, heating element and heat pipe. The heating element has a bottom surface and a side surface connected to the bottom surface. The heating element is installed on the circuit board with the bottom surface. The heat pipe is thermally coupled to the side of the heating element to absorb heat from the heating element.
基于上述，相较于现有的元件堆叠方式严格限制热管的厚度，在本发明中，发热元件安装在电路板上并以其侧面热耦接至热管，因而放宽热管的厚度限制，使得热管的效能得以提高。Based on the above, compared with the existing element stacking method that strictly limits the thickness of the heat pipe, in the present invention, the heating element is mounted on the circuit board and thermally coupled to the heat pipe by its side, thus relaxing the thickness limit of the heat pipe, making the heat pipe Effectiveness is improved.
为让本发明的上述特征和优点能更明显易懂，下文特举实施例，并配合所附的附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
附图说明Description of drawings
图1为现有的电子装置的局部断面图；Fig. 1 is a partial sectional view of an existing electronic device;
图2为本发明的一实施例的电子总成的局部断面图；Fig. 2 is a partial sectional view of an electronic assembly according to an embodiment of the present invention;
图3为图2的电子总成的部分元件的俯视图；Fig. 3 is a top view of some components of the electronic assembly of Fig. 2;
图4为本发明的另一实施例的电子总成的俯视图；4 is a top view of an electronic assembly according to another embodiment of the present invention;
图5为本发明的另一实施例的电子总成的俯视图；5 is a top view of an electronic assembly according to another embodiment of the present invention;
图6为本发明的另一实施例的电子总成的俯视图；6 is a top view of an electronic assembly according to another embodiment of the present invention;
图7为本发明的一实施例的电子总成的局部断面图；Fig. 7 is a partial sectional view of an electronic assembly according to an embodiment of the present invention;
图8为本发明的另一实施例的电子装置的断面图。FIG. 8 is a cross-sectional view of an electronic device according to another embodiment of the present invention.
符号说明Symbol Description
10：电子总成10: Electronic assembly
11：电路板11: Circuit board
12：中央处理单元12: Central processing unit
13：屏蔽盖13: shielding cover
14：热管14: heat pipe
15：散热垫15: cooling pad
50：电子装置50: Electronic device
52：壳体52: Housing
54：显示器54: Display
100：电子总成100: electronic assembly
110：电路板110: circuit board
120：发热元件120: heating element
120a：底面120a: bottom surface
120b：侧面120b: side
120c：顶面120c: top surface
122：逻辑芯片模块122: logic chip module
124：存储器模块124: memory module
130：热管130: heat pipe
140：屏蔽盖140: shielding cover
151：第一导热层151: The first heat conduction layer
152：第二导热层152: Second heat conduction layer
153：第三导热层153: The third heat conduction layer
154：第四导热层154: The fourth heat conduction layer
具体实施方式detailed description
图2是本发明的一实施例的电子总成的局部断面图。请参考图2，在本实施例中，电子总成100可适用于电子装置，特别是薄型化的电子装置，例如智能型手机或平板电脑等。电子总成100包括电路板110、发热元件120及热管130。电路板110可以是主机板或模块板等。发热元件120是在运作时会发出热来升高自身温度而需要冷却的元件，例如是中央处理单元(CPU)、绘图处理单元(GPU)、充电装置元件(charging IC)、电源滤波扼流器(power chock)、放大器电路组(RFPA)等，本发明不限于此。发热元件120具有底面120a及连接于底面120a的侧面120b。发热元件120以底面120a安装至电路板110。热管130热耦接至发热元件120的侧面120b，以吸收来自发热元件120的热。热管130利用其内部的介质在其蒸发端蒸发后在冷凝端冷凝的相变过程，以快速传导热。相较于现有的电子总成(例如在图1中的电子总成)采用元件堆叠在电路板上的结构，在本实施例中，电子总成100采用元件并排在电路板110上的结构，让热管130可热耦接至发热元件120的侧面120b，因而放宽热管130的厚度限制，使得热管130的效能得以提高。FIG. 2 is a partial cross-sectional view of an electronic assembly according to an embodiment of the present invention. Please refer to FIG. 2 , in this embodiment, the electronic assembly 100 is suitable for electronic devices, especially thin electronic devices, such as smart phones or tablet computers. The electronic assembly 100 includes a circuit board 110 , a heating element 120 and a heat pipe 130 . The circuit board 110 may be a main board or a module board or the like. The heating element 120 is an element that emits heat to increase its temperature during operation and needs to be cooled, such as a central processing unit (CPU), a graphics processing unit (GPU), a charging device element (charging IC), a power filter choke (power chock), amplifier circuit group (RFPA), etc., the present invention is not limited thereto. The heating element 120 has a bottom surface 120a and a side surface 120b connected to the bottom surface 120a. The heating element 120 is mounted on the circuit board 110 with the bottom surface 120a. The heat pipe 130 is thermally coupled to the side surface 120 b of the heating element 120 to absorb heat from the heating element 120 . The heat pipe 130 utilizes the phase change process in which the medium inside it evaporates at the evaporating end and then condenses at the condensing end to quickly conduct heat. Compared with the existing electronic assembly (such as the electronic assembly in FIG. 1 ) which adopts a structure in which components are stacked on a circuit board, in this embodiment, the electronic assembly 100 adopts a structure in which components are arranged side by side on a circuit board 110 , so that the heat pipe 130 can be thermally coupled to the side surface 120 b of the heating element 120 , thus relaxing the thickness limitation of the heat pipe 130 , so that the efficiency of the heat pipe 130 can be improved.
在本实施例中，电子总成100还可包括第一导热层151。第一导热层151配置于发热元件120的侧面120b与热管130之间，使得发热元件120可经由第一导热层151热耦接至热管130，以将发热元件120的热传导至热管130。第一导热层151可以是散热垫、相变化材料(Phase Change Material，PCM)层或其他具有高导热性的材料层。此外，电子总成100还可包括第二导热层152。第二导热层152可配置于电路板110与热管130之间，使得电路板110可经由第二导热层152热耦接至热管130，以将电路板110的热传导至热管130。第二导热层152可以是散热垫、相变化材料(PCM)层或其他具有高导热性的材料层。In this embodiment, the electronic assembly 100 may further include a first heat conducting layer 151 . The first heat conducting layer 151 is disposed between the side surface 120 b of the heating element 120 and the heat pipe 130 , so that the heating element 120 can be thermally coupled to the heat pipe 130 through the first heat conducting layer 151 to conduct heat from the heating element 120 to the heat pipe 130 . The first thermal conduction layer 151 may be a thermal pad, a phase change material (Phase Change Material, PCM) layer or other material layers with high thermal conductivity. In addition, the electronic assembly 100 may further include a second heat conduction layer 152 . The second heat conduction layer 152 can be disposed between the circuit board 110 and the heat pipe 130 , so that the circuit board 110 can be thermally coupled to the heat pipe 130 through the second heat conduction layer 152 to conduct heat from the circuit board 110 to the heat pipe 130 . The second thermal conduction layer 152 may be a thermal pad, a phase change material (PCM) layer or other material layers with high thermal conductivity.
为了防止电磁干扰(EMI)影响特定种类的发热元件120，在本实施例中，电子总成100还可包括屏蔽盖140。屏蔽盖140安装至电路板110并与热管130包围发热元件120。屏蔽盖140通常是以金属制成，因而具有良好的导热性。因此，发热元件120也可热耦接至屏蔽盖140，使得屏蔽盖140也可提供辅助的散热。发热元件120具有连接其侧面120b的顶面120c，且发热元件120可以其顶面120c热耦接至屏蔽盖140。相较于现有的电子总成(例如在图1中的电子总成)采用元件堆叠在电路板上的结构，在本实施例中，电子总成100采用元件并排在电路板110上的结构，让发热元件120可不经由屏蔽盖140而热耦接至热管130，因而减少发热元件120至热管130之间的热阻，使得热管130的效能得以提高。In order to prevent electromagnetic interference (EMI) from affecting certain types of heating elements 120 , in this embodiment, the electronic assembly 100 may further include a shielding cover 140 . The shielding cover 140 is installed on the circuit board 110 and surrounds the heating element 120 with the heat pipe 130 . The shielding cover 140 is usually made of metal, so it has good thermal conductivity. Therefore, the heating element 120 can also be thermally coupled to the shielding cover 140 so that the shielding cover 140 can also provide auxiliary heat dissipation. The heating element 120 has a top surface 120c connected to its side surface 120b, and the heating element 120 can be thermally coupled to the shielding cover 140 by its top surface 120c. Compared with the existing electronic assembly (such as the electronic assembly in FIG. 1 ) which adopts a structure in which components are stacked on a circuit board, in this embodiment, the electronic assembly 100 adopts a structure in which components are arranged side by side on a circuit board 110 Therefore, the heating element 120 can be thermally coupled to the heat pipe 130 without the shielding cover 140 , thereby reducing the thermal resistance between the heating element 120 and the heat pipe 130 , so that the efficiency of the heat pipe 130 can be improved.
在本实施例中，电子总成100还可包括第三导热层153。第三导热层153配置于发热元件120与屏蔽盖140之间，使得发热元件120可经由第三导热层153热耦接至屏蔽盖140，以将发热元件120的热传导至屏蔽盖140。第三导热层153可以是散热垫、相变化材料(PCM)层或其他具有高导热性的材料层。此外，热管130可热耦接至屏蔽盖140，使得发热元件120的热可经由屏蔽盖140而传导至热管130。在本实施例中，电子总成100还可包括第四导热层154。第四导热层154配置于热管130与屏蔽盖140之间，使得屏蔽盖140可经由第四导热层154热耦接至热管130，以将屏蔽盖140的热传导至热管130。第四导热层154可以是散热垫、相变化材料(PCM)层或其他具有高导热性的材料层。In this embodiment, the electronic assembly 100 may further include a third heat conducting layer 153 . The third heat conducting layer 153 is disposed between the heating element 120 and the shielding cover 140 , so that the heating element 120 can be thermally coupled to the shielding cover 140 via the third heat conducting layer 153 to conduct heat from the heating element 120 to the shielding cover 140 . The third thermal conduction layer 153 may be a thermal pad, a phase change material (PCM) layer or other material layers with high thermal conductivity. In addition, the heat pipe 130 can be thermally coupled to the shield cover 140 , so that the heat of the heating element 120 can be conducted to the heat pipe 130 through the shield cover 140 . In this embodiment, the electronic assembly 100 may further include a fourth heat conducting layer 154 . The fourth heat conducting layer 154 is disposed between the heat pipe 130 and the shielding cover 140 , so that the shielding cover 140 can be thermally coupled to the heat pipe 130 via the fourth heat conducting layer 154 to conduct heat from the shielding cover 140 to the heat pipe 130 . The fourth thermal conduction layer 154 may be a thermal pad, a phase change material (PCM) layer or other material layers with high thermal conductivity.
图3是图2的电子总成的部分元件的俯视图。请参考图3，在本实施例中，发热元件120安装至电路板110，而热管130可热耦接至发热元件120的侧边。图4是本发明的另一实施例的电子总成的俯视图。请参考图4，在另一实施例中，热管130可热耦接至发热元件120的两个相邻侧边。图5是本发明的另一实施例的电子总成的俯视图。请参考图5，在另一实施例中，热管130可热耦接至发热元件120的三个相邻侧边。图6是本发明的另一实施例的电子总成的俯视图。请参考图6，在另一实施例中，热管130可热耦接至发热元件120的四个相邻侧边，使得热管130围绕整个发热元件120。FIG. 3 is a top view of some components of the electronic assembly of FIG. 2 . Please refer to FIG. 3 , in this embodiment, the heating element 120 is installed on the circuit board 110 , and the heat pipe 130 can be thermally coupled to the side of the heating element 120 . FIG. 4 is a top view of an electronic assembly according to another embodiment of the present invention. Please refer to FIG. 4 , in another embodiment, the heat pipe 130 can be thermally coupled to two adjacent sides of the heating element 120 . FIG. 5 is a top view of an electronic assembly according to another embodiment of the present invention. Please refer to FIG. 5 , in another embodiment, the heat pipe 130 can be thermally coupled to three adjacent sides of the heating element 120 . FIG. 6 is a top view of an electronic assembly according to another embodiment of the present invention. Please refer to FIG. 6 , in another embodiment, the heat pipe 130 can be thermally coupled to four adjacent sides of the heating element 120 such that the heat pipe 130 surrounds the entire heating element 120 .
图7是本发明的一实施例的电子总成的局部断面图。请参考图7，在本实施例中，发热元件120可包括逻辑芯片模块122及存储器模块124，以构成芯片组(chipset)。逻辑芯片模块122安装至电路板110，且存储器模块124堆叠至逻辑芯片模块122，使得逻辑芯片模块122位于电路板110与存储器模块124之间。逻辑芯片模块122例如是中央处理单元芯片封装体，而存储器模块124例如是多存储器芯片封装体，因而构成PoP(Package on Package)型态的封装堆叠结构。相比较于存储器模块124，逻辑芯片模块122是主要的发热来源。逻辑芯片模块122的热可直接传递至设置位于逻辑芯片模块122旁侧的热管130，而不需经由存储器模块124及屏蔽盖140再传导至热管130，因而获得良好的散热效果。FIG. 7 is a partial cross-sectional view of an electronic assembly according to an embodiment of the present invention. Please refer to FIG. 7 , in this embodiment, the heating element 120 may include a logic chip module 122 and a memory module 124 to form a chipset. The logic chip module 122 is installed on the circuit board 110 , and the memory module 124 is stacked on the logic chip module 122 such that the logic chip module 122 is located between the circuit board 110 and the memory module 124 . The logic chip module 122 is, for example, a central processing unit chip package, and the memory module 124 is, for example, a multi-memory chip package, thus forming a PoP (Package on Package) package stack structure. Compared with the memory module 124 , the logic chip module 122 is the main source of heat generation. The heat from the logic chip module 122 can be directly transferred to the heat pipe 130 disposed beside the logic chip module 122 without being conducted to the heat pipe 130 through the memory module 124 and the shielding cover 140 , thus obtaining a good heat dissipation effect.
图8是本发明的另一实施例的电子装置的断面图。请参考图8，在本实施例中，电子装置50可为薄型化的电子装置，例如智能型手机或平板电脑等。电子装置50包括壳体52、显示器54及相同或相似于图1的实施例的电子总成100。显示器54安装在壳体52，而电子总成100设置在壳体52内。在本实施例中，显示器54可为触控显示器。电子总成100除可与图1的实施例相同或相似以外，还可为上述其他实施例的电子总成100。因此，电子总成100的详细描述，可参考上述实施例的具体说明。FIG. 8 is a cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 8 , in this embodiment, the electronic device 50 can be a thin electronic device, such as a smart phone or a tablet computer. The electronic device 50 includes a casing 52 , a display 54 and an electronic assembly 100 that is the same or similar to the embodiment of FIG. 1 . The display 54 is installed in the housing 52 , and the electronic assembly 100 is disposed in the housing 52 . In this embodiment, the display 54 can be a touch display. In addition to being the same or similar to the embodiment in FIG. 1 , the electronic assembly 100 may also be the electronic assembly 100 in other embodiments described above. Therefore, for a detailed description of the electronic assembly 100 , reference may be made to the specific descriptions of the above-mentioned embodiments.
综上所述，相较于现有的元件堆叠方式严格限制热管的厚度，在本发明中，发热元件安装在电路板上并以其侧面热耦接至热管，因而放宽热管的厚度限制，使得热管的效能得以提高。To sum up, compared with the existing element stacking method that strictly limits the thickness of the heat pipe, in the present invention, the heating element is mounted on the circuit board and thermally coupled to the heat pipe by its side, thus relaxing the thickness limit of the heat pipe, making The efficiency of the heat pipe is improved.
相较于现有的元件堆叠方式增加发热元件与热管之间的热阻，在本发明中，热管热耦接至发热元件的侧面，故发热元件可不经由屏蔽盖而热耦接至热管，因而减少发热元件至热管之间的热阻，使得热管的效能得以提高。Compared with the existing element stacking method, the thermal resistance between the heating element and the heat pipe is increased. In the present invention, the heat pipe is thermally coupled to the side of the heating element, so the heating element can be thermally coupled to the heat pipe without the shielding cover, thus The thermal resistance between the heating element and the heat pipe is reduced, so that the efficiency of the heat pipe is improved.
在本发明中，当发热元件包括依序堆叠的逻辑芯片模块及存储器模块时，位于存储器模块下方的逻辑芯片模块的热可直接传递至设置位于逻辑芯片模块旁侧的热管，而不需经由存储器模块及屏蔽盖再传导至热管，因而获得良好的散热效果。In the present invention, when the heating element includes logic chip modules and memory modules stacked in sequence, the heat from the logic chip modules below the memory modules can be directly transferred to the heat pipes located beside the logic chip modules without passing through the memory modules. The module and the shield cover are then conducted to the heat pipe, thus obtaining a good heat dissipation effect.
虽然结合以上实施例公开了本发明，然而其并非用以限定本发明，任何所属技术领域中具有通常知识者，在不脱离本发明的精神和范围内，可作些许的更动与润饰，故本发明的保护范围应当以附上的权利要求所界定的为准。Although the present invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the appended claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510399102.XACN106341969A (en) | 2015-07-09 | 2015-07-09 | Electronic assembly and electronic device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510399102.XACN106341969A (en) | 2015-07-09 | 2015-07-09 | Electronic assembly and electronic device |
| Publication Number | Publication Date |
|---|---|
| CN106341969Atrue CN106341969A (en) | 2017-01-18 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510399102.XAPendingCN106341969A (en) | 2015-07-09 | 2015-07-09 | Electronic assembly and electronic device |
| Country | Link |
|---|---|
| CN (1) | CN106341969A (en) |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | Application publication date:20170118 |