技术领域technical field
本发明涉及半导体领域，尤其涉及一种复合LED玻璃基面板的封装方法和面板。The invention relates to the field of semiconductors, in particular to a method for packaging a composite LED glass substrate panel and the panel.
背景技术Background technique
传统的半导体发光晶片的制作工艺，在下游应用前要先做封装(PACKAGE)，然后再将封装后的晶片固定在应用产品的电路载体(如PCB)上去实现相关的电性连接和功能。The traditional manufacturing process of semiconductor light-emitting chips requires packaging (PACKAGE) before downstream applications, and then the packaged chips are fixed on the circuit carrier (such as PCB) of the application product to realize related electrical connections and functions.
封装过程，主要是在合理的支架(FRAME)上使用例如有导电性的银胶等，固定安装晶片的其中的一个电极并实现电性连接，然后再通过超声波焊线机把晶片的另一电极用金线或铝线等焊接并连接到支架的另一独立电性引脚；最后再用透明环氧树脂等材料把晶片、支架的一部分和连接它们的金线或铝线等一起用预先做好的浇注模浇注密封起来。有部分电性支架的引脚是外露的，可以作为与其他电子器件配套使用时进行表面贴装(SMT)连接或双列直插式封装(DIP)等安装在应用产品的电性载体(如PCB)之上使用。The packaging process is mainly to use conductive silver glue on a reasonable frame (FRAME), etc., to fix and install one of the electrodes of the chip and realize electrical connection, and then connect the other electrode of the chip through an ultrasonic wire bonding machine. Solder with gold wire or aluminum wire and connect to another independent electrical pin of the bracket; finally, use transparent epoxy resin and other materials to pre-make the chip, part of the bracket and the gold wire or aluminum wire connecting them. A good pouring mold is poured and sealed. The pins of some electrical brackets are exposed, which can be used as an electrical carrier for surface mount (SMT) connection or dual in-line package (DIP) when used with other electronic devices (such as used on the PCB).
在传统的封装工序里，由于需要有引线焊接，必然会在发光面上留下不透明的金线或铝线等熔焊点，这些熔焊点会遮住部分的光射出，而且会在单独的点光源的光斑里留下枯空的“黑”心点，从而由此方法制得的发光晶片并不是理想的点光源那样的均匀光斑。In the traditional packaging process, due to the need for wire bonding, opaque gold wires or aluminum wires and other solder joints will inevitably be left on the light-emitting surface. In the light spot of the point light source, there are empty "black" centers, so that the light-emitting wafer made by this method is not a uniform light spot like an ideal point light source.
与此同时，在半导体发光应用愈发普及的情况下，对半导体发光器件在小间距高密度尺寸下的应用，以及低成本等，都提出了巨大的要求。At the same time, as semiconductor light-emitting applications become more and more popular, there are huge requirements for the application of semiconductor light-emitting devices in small-pitch, high-density dimensions, and low cost.
发明内容Contents of the invention
有鉴于此，本发明提供了一种复合LED玻璃基面板的封装方法和面板，所述方法工艺简单，适于大规模生产应用，通过采用熔融的低温玻璃粉作为固晶媒介，使得其固化后是透明的，不会形成影响透光的光斑，制备得到的面板透光度不低于85％，显示效果和一致性好，工艺成本低，能够满足LED显示技术在高密度领域应用的需要。In view of this, the present invention provides a packaging method and panel of a composite LED glass-based panel. The method is simple in process and suitable for large-scale production and application. By using molten low-temperature glass frit as a solid crystal medium, it can It is transparent and will not form light spots that affect light transmission. The light transmittance of the prepared panel is not less than 85%, the display effect and consistency are good, the process cost is low, and it can meet the needs of the application of LED display technology in high-density fields.
第一方面，本发明提供了一种复合LED玻璃基面板的封装方法，包括：In the first aspect, the present invention provides a packaging method for a composite LED glass-based panel, comprising:
制备玻璃基板，所述玻璃基板包括用于装入多个LED晶片的矩阵坑位；preparing a glass substrate comprising matrix pits for loading a plurality of LED wafers;
将所述多个LED晶片根据设计排布成晶片阵列，所述晶片阵列中的多个LED晶片位置与所述矩阵坑位的位置一一对应；Arranging the multiple LED chips into a chip array according to the design, the positions of the multiple LED chips in the chip array correspond to the positions of the matrix pits one by one;
向所述玻璃基板的矩阵坑位中装载低玻粉；Loading low glass powder into the matrix pits of the glass substrate;
将装载有低玻粉的玻璃基板置于加热冷却系统中，在加热冷却系统的母模上，以300℃-500℃的温度条件下，将低玻粉熔为液体状的低玻粉熔料；Place the glass substrate loaded with low glass powder in the heating and cooling system, and melt the low glass powder into a liquid low glass powder melt on the master mold of the heating and cooling system at a temperature of 300°C-500°C ;
通过加热冷却系统的公模上的真空吸嘴矩阵模头的吸嘴吸起所述多个LED晶片，移至与母模相对应位置，使所述多个LED晶片的出光面与对应的矩阵坑位中的低玻粉溶料相结合；The suction nozzles of the vacuum nozzle matrix die on the male mold of the heating and cooling system suck up the plurality of LED chips and move to the corresponding position with the female mold, so that the light-emitting surfaces of the multiple LED chips are aligned with the corresponding matrix. Combined with the low glass powder melting material in the pit;
控制所述加热冷却系统降温，使多个所述LED晶片固晶到相应矩阵坑位中，得到所述复合LED玻璃基面板。The heating and cooling system is controlled to lower the temperature, so that multiple LED wafers are solidified into corresponding matrix pits to obtain the composite LED glass-based panel.
优选的，在所述将所述多个LED晶片根据设计排布装入所述矩阵坑位的相应位置之前还包括：Preferably, before the arrangement of the plurality of LED chips into the corresponding positions of the matrix pits according to the design, the method further includes:
制备LED晶片；Prepare LED chips;
对LED晶片进行测试，用以根据不同测试结果对所述LED晶片进行分组；testing the LED chips to group the LED chips according to different test results;
将所述LED晶片倒模至扩展膜上形成晶片矩阵；所述扩展膜与所述LED晶片的出光面相黏贴；Inverting the LED chip onto the expansion film to form a chip matrix; the expansion film is glued to the light-emitting surface of the LED chip;
拉伸所述扩展膜，对所述晶片矩阵进行扩晶，形成所述晶片阵列。Stretching the expansion film to expand the wafer matrix to form the wafer array.
进一步优选的，所述LED晶片包括多色LED晶片。Further preferably, the LED chip includes a multi-color LED chip.
进一步优选的，所述多色LED晶片包括：红色LED晶片、蓝色LED晶片和绿色LED晶片；Further preferably, the multi-color LED chip includes: a red LED chip, a blue LED chip and a green LED chip;
在所述晶片阵列中，所述红色LED晶片、蓝色LED晶片和绿色LED晶片等间隔等间距排布。In the chip array, the red LED chip, the blue LED chip and the green LED chip are arranged at equal intervals.
优选的，所述方法还包括：Preferably, the method also includes:
对所述复合LED玻璃基面板中的LED晶片的电极一侧进行研磨抛光；Grinding and polishing the electrode side of the LED chip in the composite LED glass substrate panel;
将所述复合LED玻璃基面板进行退火；Annealing the composite LED glass substrate panel;
清洗、干燥后，进行测试；After cleaning and drying, test;
将测试通过的复合LED玻璃基面板包装待用。The composite LED glass substrate panel that has passed the test is packaged for use.
第二方面，本发明实施例提供了一种第一方面提供的方法制备的复合LED玻璃基面板。In the second aspect, the embodiment of the present invention provides a composite LED glass substrate panel prepared by the method provided in the first aspect.
本发明实施例提供的一种复合LED玻璃基面板的封装方法，工艺简单，适于大规模生产应用，通过采用熔融的低温玻璃粉作为固晶媒介，使得其固化后是透明的，不会形成影响透光的光斑，制备得到的面板透光度不低于85％，显示效果和一致性好，工艺成本低，能够满足LED显示技术在高密度领域应用的需要。The packaging method of a composite LED glass-based panel provided by the embodiment of the present invention has a simple process and is suitable for large-scale production and application. By using molten low-temperature glass frit as a solid crystal medium, it is transparent after solidification and does not form The light spots affecting the light transmission, the light transmission of the prepared panel is not less than 85%, the display effect and consistency are good, the process cost is low, and it can meet the needs of the application of LED display technology in high-density fields.
附图说明Description of drawings
图1为本发明实施例提供的复合LED玻璃基面板的封装方法的流程图；Fig. 1 is the flowchart of the encapsulation method of composite LED glass substrate panel provided by the embodiment of the present invention;
图2为本发明实施例提供的复合LED玻璃基面板的封装过程示意图之一；Fig. 2 is one of the schematic diagrams of the encapsulation process of the composite LED glass substrate panel provided by the embodiment of the present invention;
图3为本发明实施例提供的复合LED玻璃基面板的封装过程示意图之二；Fig. 3 is the second schematic diagram of the encapsulation process of the composite LED glass substrate panel provided by the embodiment of the present invention;
图4为本发明实施例提供的复合LED玻璃基面板的封装过程示意图之三；Fig. 4 is the third schematic diagram of the encapsulation process of the composite LED glass substrate panel provided by the embodiment of the present invention;
图5为本发明实施例提供的复合LED玻璃基面板的封装过程示意图之四；Fig. 5 is the fourth schematic diagram of the encapsulation process of the composite LED glass substrate panel provided by the embodiment of the present invention;
图6a为本发明实施例提供的复合LED玻璃基面板的封装过程示意图之五；Fig. 6a is the fifth schematic diagram of the encapsulation process of the composite LED glass substrate panel provided by the embodiment of the present invention;
图6b为本发明实施例提供的复合LED玻璃基面板的封装过程示意图之六；Figure 6b is the sixth schematic diagram of the packaging process of the composite LED glass substrate panel provided by the embodiment of the present invention;
图7为本发明实施例提供的复合LED玻璃基面板的封装过程示意图之七；Fig. 7 is the seventh schematic diagram of the packaging process of the composite LED glass substrate panel provided by the embodiment of the present invention;
图8为本发明实施例提供的复合LED玻璃基面板的示意图。Fig. 8 is a schematic diagram of a composite LED glass substrate panel provided by an embodiment of the present invention.
下面通过附图和实施例，对本发明的技术方案做进一步的详细描述。The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.
具体实施方式detailed description
本发明的复合LED玻璃基面板的封装方法，主要用于LED显示屏，超小间距LED显示屏，超高密度LED显示屏，LED正发光电视，LED正发光监视器，LED视频墙，LED指示，LED特殊照明等领域。The packaging method of the composite LED glass-based panel of the present invention is mainly used for LED display screens, ultra-fine-pitch LED display screens, ultra-high-density LED display screens, LED positive-emitting TVs, LED positive-emitting monitors, LED video walls, and LED indicators , LED special lighting and other fields.
图1为本发明实施例提供的复合LED玻璃基面板的封装方法流程图。图2-图8为本发明实施例的复合LED玻璃基面板的封装过程示意图，各示意图仅用来更好地理解本发明的意图，但并不意于限定本发明的保护范围。Fig. 1 is a flow chart of a packaging method for a composite LED glass substrate panel provided by an embodiment of the present invention. 2-8 are schematic diagrams of the encapsulation process of the composite LED glass substrate panel according to the embodiment of the present invention. The schematic diagrams are only used to better understand the intent of the present invention, but are not intended to limit the protection scope of the present invention.
下面以图1并结合图2-图8对本发明的封装方法进行说明。The encapsulation method of the present invention will be described below with reference to FIG. 1 and in conjunction with FIGS. 2-8 .
如图1所示，本发明实施例提供的复合LED玻璃基面板的封装方法流程图包括如下步骤：As shown in Figure 1, the flow chart of the packaging method of the composite LED glass substrate panel provided by the embodiment of the present invention includes the following steps:
步骤110，制备玻璃基板；Step 110, preparing a glass substrate;
具体的，玻璃基板1包括用于装入多个LED晶片的矩阵坑位；Specifically, the glass substrate 1 includes matrix pits for loading multiple LED chips;
如图2所示，矩阵坑位中，每个坑位11的大小、深度、间隔间距都一样。坑位11的截面形状为梯形，与LED晶片的截面形状一致。As shown in FIG. 2 , in the matrix pits, the size, depth and spacing of each pit 11 are the same. The cross-sectional shape of the pit 11 is trapezoidal, consistent with the cross-sectional shape of the LED chip.
步骤120，将多个LED晶片根据设计排布成晶片阵列；Step 120, arranging a plurality of LED chips into a chip array according to the design;
具体的，首先，将多个LED晶片倒模至扩展膜上，形成如图3所示的晶片矩阵。晶片矩阵中，每个LED晶片2之间等间隔排列。扩展膜3与LED晶片2的出光面相黏贴。Specifically, firstly, a plurality of LED chips are reverse molded onto the expansion film to form a chip matrix as shown in FIG. 3 . In the chip matrix, each LED chip 2 is arranged at equal intervals. The expansion film 3 is glued to the light emitting surface of the LED chip 2 .
LED晶片可以是单色LED晶片，也可以包括多色LED晶片。The LED chip can be a single-color LED chip, and can also include a multi-color LED chip.
如果是多色LED晶片的情况下，不同颜色的LED晶片首先需要进行测试，以根据不同测试结果对每种颜色的多个LED晶片进行分组，然后再根据需要排列放置。在图3所示的例子中，是一排红色LED晶片(图中以R表示)，一排绿色LED晶片(图中以G表示)，一排蓝色LED晶片(图中以B表示)。In the case of multi-color LED chips, LED chips of different colors need to be tested first, so as to group multiple LED chips of each color according to different test results, and then arrange and place them as required. In the example shown in Figure 3, it is a row of red LED chips (represented by R among the figures), a row of green LED chips (represented by G among the figures), and a row of blue LED chips (represented by B among the figures).
随后，拉伸扩展膜，对所述晶片矩阵进行扩晶，形成所述晶片阵列，如图4所示。在晶片阵列中，红色LED晶片、蓝色LED晶片和绿色LED晶片等间隔等间距排布。并且，晶片阵列中的多个LED晶片位置与矩阵坑位的位置一一对应。Subsequently, the expansion film is stretched to expand the wafer matrix to form the wafer array, as shown in FIG. 4 . In the chip array, the red LED chip, the blue LED chip and the green LED chip are arranged at equal intervals. Moreover, the positions of the plurality of LED chips in the chip array are in one-to-one correspondence with the positions of the matrix pits.
步骤130，向所述玻璃基板的矩阵坑位中装载低玻粉；Step 130, loading low glass powder into the matrix pits of the glass substrate;
具体的，可以通过粉料装载机完成低玻粉的装载。低玻粉5在坑位11中的状态如图6a所示。Specifically, the loading of low glass powder can be completed by a powder loader. The state of the low glass powder 5 in the pit 11 is shown in Fig. 6a.
步骤140，将装载有低玻粉的玻璃基板置于加热冷却系统中，在加热冷却系统的母模上，以300℃-500℃的温度条件下，将低玻粉熔为液体状的低玻粉熔料；Step 140, place the glass substrate loaded with low glass powder in the heating and cooling system, and melt the low glass powder into liquid low glass powder on the master mold of the heating and cooling system at a temperature of 300°C-500°C. Powder melt;
具体的，加热冷却系统4可以如图5所示，包括公模41和母模42。Specifically, the heating and cooling system 4 may include a male mold 41 and a female mold 42 as shown in FIG. 5 .
母模42用于装载玻璃基板，底部具有加热管421，可以通过加热管421加热石墨422。公模41具有真空泵411和吸嘴412，吸嘴412上吸附LED晶片2。通过石墨422对玻璃基板1进行加热，使其中的低玻粉呈熔融态。熔融态的低玻粉溶料51在坑位11中的状态如图6b所示。The master mold 42 is used to load the glass substrate, and has a heating tube 421 at the bottom, and the graphite 422 can be heated through the heating tube 421 . The male mold 41 has a vacuum pump 411 and a suction nozzle 412, and the LED chip 2 is adsorbed on the suction nozzle 412. The glass substrate 1 is heated by the graphite 422, so that the low glass powder therein is in a molten state. The state of the molten low glass powder material 51 in the pit 11 is shown in Fig. 6b.
步骤150，通过加热冷却系统的公模上的真空吸嘴矩阵模头的吸嘴，吸起所述多个LED晶片，移至与母模相对应位置，使所述多个LED晶片的出光面与对应的矩阵坑位中的低玻粉溶料相结合；Step 150, through the suction nozzles of the vacuum nozzle matrix die on the male mold of the heating and cooling system, the plurality of LED chips are sucked up and moved to positions corresponding to the female mold, so that the light-emitting surfaces of the plurality of LED chips are Combined with the low glass powder material in the corresponding matrix pit;
具体的，真空吸嘴矩阵模头结合图7所示，多个吸嘴412等间距排列，间距与玻璃基板中矩阵坑位之间的间距设置相同。Specifically, as shown in FIG. 7 in conjunction with the vacuum nozzle matrix die head, a plurality of suction nozzles 412 are arranged at equal intervals, and the intervals are set to be the same as the intervals between the matrix pits in the glass substrate.
通过真空泵411将吸嘴412保持在一定真空度下，将LED晶片2由扩展膜3上吸取到吸嘴412上。The suction nozzle 412 is kept under a certain degree of vacuum by the vacuum pump 411 , and the LED chip 2 is sucked onto the suction nozzle 412 from the expansion film 3 .
随后控制公模41的模头步进向下移动，直到与母模42吻合。这时，公模41模头的吸嘴412上的LED晶片2的出光面已浸入在低玻熔液里。Subsequently, the die head of the male mold 41 is controlled to move downward step by step until matching with the female mold 42 . At this time, the light-emitting surface of the LED chip 2 on the suction nozzle 412 of the die head of the male mold 41 has been immersed in the low glass melt.
步骤160，控制所述加热冷却系统降温，使多个所述LED晶片固晶到相应矩阵坑位中，得到所述复合LED玻璃基面板。Step 160, controlling the heating and cooling system to lower the temperature, so that a plurality of the LED wafers are solidified into corresponding matrix pits to obtain the composite LED glass substrate panel.
具体的，在浸入之后，保温数秒，然后开始冷却，降至室温。低玻粉5逐渐由熔融态凝固，使LED晶片2固晶到相应矩阵坑位11中，吸嘴412释放，即形成复合LED玻璃基面板。具体如图8所示。Specifically, after immersion, keep warm for several seconds, then start to cool down to room temperature. The low glass powder 5 is gradually solidified from the molten state, so that the LED chip 2 is solidified into the corresponding matrix hole 11, and the suction nozzle 412 is released, that is, a composite LED glass substrate panel is formed. Specifically shown in Figure 8.
在完成上述各个步骤之后，还需要对所述复合LED玻璃基面板中的LED晶片的电极一侧进行研磨抛光，以去除可能从扩展膜上粘黏留下的残胶。After the above steps are completed, the electrode side of the LED chip in the composite LED glass substrate panel needs to be ground and polished to remove the residual glue that may be stuck on the expansion film.
最后，将复合LED玻璃基面板进行退火，清洗、干燥后，进行测试，并将测试通过的复合LED玻璃基面板包装待用。Finally, the composite LED glass-based panel is annealed, cleaned and dried, and then tested, and the composite LED glass-based panel that passes the test is packaged for use.
本发明提供的复合LED玻璃基面板的封装方法，工艺简单，适于大规模生产应用，通过采用熔融的低温玻璃粉作为固晶媒介，使得其固化后是透明的，不会形成影响透光的光斑，制备得到的面板透光度不低于85％，显示效果和一致性好，工艺成本低，能够满足LED显示技术在高密度领域应用的需要。The packaging method of the composite LED glass-based panel provided by the present invention has a simple process and is suitable for large-scale production and application. By using molten low-temperature glass frit as the crystal-fixing medium, it is transparent after solidification, and will not form a barrier that affects light transmission. light spot, the light transmittance of the prepared panel is not less than 85%, the display effect and consistency are good, the process cost is low, and it can meet the needs of the application of LED display technology in high-density fields.
本发明上述方法制备的复合LED玻璃基面板是具有发光LED晶片的玻璃基板，可以用做超高密度LED显示模组之集成部件或单独用于仪器显示器之部件，在部件后集成工序里加工上不透明ITO驱动电路就可以显示视频图像文字等。The composite LED glass substrate panel prepared by the above method of the present invention is a glass substrate with light-emitting LED chips, which can be used as an integrated component of an ultra-high-density LED display module or a component used solely for an instrument display, and processed in the post-integration process of the component The opaque ITO drive circuit can display video, image, text, etc.
以上所述的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施方式而已，并不用于限定本发明的保护范围，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the scope of the present invention. Protection scope, within the spirit and principles of the present invention, any modification, equivalent replacement, improvement, etc., shall be included in the protection scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510355337.9ACN106299079A (en) | 2015-06-24 | 2015-06-24 | The method for packing of a kind of composite LED glass base plane and panel |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510355337.9ACN106299079A (en) | 2015-06-24 | 2015-06-24 | The method for packing of a kind of composite LED glass base plane and panel |
| Publication Number | Publication Date |
|---|---|
| CN106299079Atrue CN106299079A (en) | 2017-01-04 |
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| CN201510355337.9APendingCN106299079A (en) | 2015-06-24 | 2015-06-24 | The method for packing of a kind of composite LED glass base plane and panel |
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| WO2019042031A1 (en)* | 2017-08-30 | 2019-03-07 | 深圳市奥拓电子股份有限公司 | Temperature and humidity control panel and led display screen |
| CN110911543A (en)* | 2019-11-28 | 2020-03-24 | 南京百富润玻璃有限公司 | Manufacturing method of LED photoelectric display glass for large display screen |
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| CN102730974A (en)* | 2012-06-08 | 2012-10-17 | 王双喜 | Slurry for preparation of glass fluorescent layer used for LED encapsulation |
| CN103258938A (en)* | 2013-05-03 | 2013-08-21 | 杭州耀迪科技有限公司 | Manufacturing method of heat conduction light-emitting diode (LED) light bar package substrate comprising fluorescent powder |
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| WO2019042031A1 (en)* | 2017-08-30 | 2019-03-07 | 深圳市奥拓电子股份有限公司 | Temperature and humidity control panel and led display screen |
| CN107564929A (en)* | 2017-09-22 | 2018-01-09 | 厦门乾照光电股份有限公司 | A kind of array base palte and preparation method thereof, display panel, display device |
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| CN110911543A (en)* | 2019-11-28 | 2020-03-24 | 南京百富润玻璃有限公司 | Manufacturing method of LED photoelectric display glass for large display screen |
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| RJ01 | Rejection of invention patent application after publication | Application publication date:20170104 | |
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