A kind of manufacture method of integrated circuit package structureTechnical field
The present invention relates to integrated antenna package field, be specifically related to the manufacture method of a kind of integrated circuit package structure.
Background technology
In integrated antenna package, due to electromagnetic radiation or the electromagnetic radiation in the external world of electronic device own, often leadCausing the jitter of integrated circuit, circuit malfunction, in prior art, is by easily by electromagnetic interference or send the half of electromagnetic waveConductor element is encapsulated in specific integrated circuit, and this packaging body is being given electronic shield, and the component of its shielding is often oneIndividual metal cover body, such packaging body volume is relatively big and encapsulation is the most nimble.
Summary of the invention
Based on the problem solved in above-mentioned encapsulation, the invention provides the manufacture method of a kind of integrated circuit package structure,It comprises the following steps:
(1) temporary base of a large area hard is provided；
(2) being fixed on by electromagnetic component on described temporary base, this electromagnetic component is easily by electromagnetic interference or send electromagnetic waveSemiconductor element, its fixed form can be fixed by fixing glue；
(3) the first encapsulating material is set on described temporary base, and electromagnetic component is completely covered；
(4) after solidifying described encapsulating material, thinning described encapsulating material to suitable thickness but do not spill described electromagnetic component；
(5) form the first through hole at electromagnetic chip corresponding to the position of multiple electrodes, form the around the border of electromagnetic chipTwo through holes, the sectional area of described first through hole is identical with the area of described electrode；
(6) form conductive material on top of the encapsulation material, and fill full described first and second through holes, the most only etch encapsulating materialOn the first conductive material, formed electrical connection the first and second through holes line layer.
(7) remove temporary base 1, carry out packaging body described in singulation by laser along the center of the second through hole, andThe width of described second through hole 5 after cutting is more than the width of the first through hole.
(8) obtain encapsulating monomer, wherein, that the second through hole includes being connected with multiple described electrodes respectively, be electrically isolated from each otherSome；
(9) provide one to have reeded heat-radiating substrate, coat one layer of thermal conductive insulation glue at bottom portion of groove, utilize this heat conductive insulatingEncapsulation monomer solid is scheduled on bottom portion of groove by glue, and utilizes the second encapsulating material to fill and seal described encapsulation monomer；
(10) lead at the third through-hole filling deviateing the described electromagnetic chip center position boring formation described line layer of exposureIsoelectric substance is to form the outer terminal that connects, and is coupled with other electronic components by outer even terminal, forms integrated circuit package structure；
It is characterized in that: the width of the second through hole after cutting is for more than or equal to 1mm.
Present invention also offers the manufacture method of another kind of integrated circuit package structure, it comprises the following steps:
(1) temporary base of a large area hard is provided；
(2) being fixed on by electromagnetic component on described temporary base, this electromagnetic component is easily by electromagnetic interference or send electromagnetic waveSemiconductor element, its fixed form is fixed by fixing glue；
(3) the first encapsulating material is set on described temporary base, and electromagnetic component is completely covered；
(4) after solidifying described encapsulating material, thinning described encapsulating material to suitable thickness but do not spill described electromagnetic component；
(5) form the first through hole at electromagnetic chip corresponding to the position of multiple electrodes, form the around the border of electromagnetic chipTwo through holes, the sectional area of described first through hole is identical with the area of described electrode；
(6) form conductive material on top of the encapsulation material, and fill full described first and second through holes, the most only etch encapsulating materialOn the first conductive material, formed electrical connection the first and second through holes line layer；
(7) remove temporary base 1, carry out packaging body described in singulation by laser along the center of the second through hole, and cutAfter the width of described second through hole 5 more than the width of the first through hole.
(8) obtain encapsulating monomer, wherein, that the second through hole includes being connected with multiple described electrodes respectively, be electrically isolated from each otherSome；
(9) provide one to have reeded heat-radiating substrate, coat one layer of thermal conductive insulation glue at bottom portion of groove, utilize this heat conductive insulatingEncapsulation monomer solid is scheduled on bottom portion of groove by glue, and utilizes the second encapsulating material to fill and seal described encapsulation monomer.
(10) deviateing the third through-hole of the described electromagnetic chip center position boring formation described line layer of exposure and filling outFill the second conductive material and connect outward terminal to be formed, and be coupled with other electronic components by outer even terminal, form integrated circuitEncapsulating structure；
It is characterized in that: the area of the lateral parts that described second through hole fills described first conductive material accounts for described encapsulation monomerThe 50%-90% of lateral area.
Wherein, fixing glue includes pressure-sensitive solidification glue, heat-curable glue, optic-solidified adhesive, silicone grease, epoxy resin etc..
Wherein, described temporary base is ceramic substrate, silicon substrate or plastic base.
Wherein, other electronic components described include controller, MOS transistor, resistance etc..
Advantages of the present invention is as follows:
The present invention passes through area and the thickness of Control peripheral circuit layer (the second through hole), forms the preferable packaging body of electronic shield,Without being further added by the components such as electro-magnetic shielding cover in follow-up integrated antenna package, reduce encapsulation volume, enhance the spirit of encapsulationActivity.
Accompanying drawing explanation
Fig. 1-8,10-11 are the process schematic of the manufacture method of the integrated circuit package structure of the present invention；
Fig. 9 is the top view that Fig. 8 encapsulates monomer.
Detailed description of the invention
Seeing Fig. 1-11, present invention firstly provides the method for packing of a kind of integrated circuit, concrete steps will entered as followsLine description, the position noun such as upper and lower, left and right appeared in description, side is both with respect to the position relationship in schematic diagram.
Seeing Fig. 1, it is provided that a temporary base 1, this substrate is large area hard substrate, such as ceramic substrate, silicon substrate, mouldsMaterial substrate etc..
Seeing Fig. 2, be fixed on temporary base 1 by electromagnetic component 2, this electromagnetic component is easily by electromagnetic interference or sendThe semiconductor element of electromagnetic wave, such as RF element, photodetector, sensor, photelectric receiver etc., its fixed form can be passed throughFixing glue is fixed, and this fixing glue includes pressure-sensitive solidification glue, heat-curable glue, optic-solidified adhesive, silicone grease, epoxy resin etc..
Seeing Fig. 3, arrange encapsulating material 3, and electromagnetic component 2 is completely covered on temporary base 1, this encapsulating material is permissibleIt is the encapsulants such as polyimides, heat reactive resin or light-cured resin.
Seeing Fig. 4, after solidifying described encapsulating material 3, thinning described encapsulating material 3 to suitable thickness but does not spill instituteState electromagnetic component 2.
Seeing Fig. 5, the position corresponding to electrode at electromagnetic chip 2 forms the first through hole 4, at all casts around electromagnetic chip 2Becoming the second through hole 5, the sectional area of described first through hole 4 is identical with the area of described electrode, and the width of described second through hole 5 is more thanThe width of the first through hole 4, size is more than 2mm width, so can more preferably stop interference or other groups of Electromagnetic Interference of electromagnetic wavePart.
See Fig. 6, encapsulating material 3 forms conductive material 6, and fill full described first and 5 second through holes 4,5, soAfter only etch the conductive material 6 on encapsulating material 3, form the line layer of electrical connection the first and second through holes, described conductive materialCan be prevented from the material that electromagnetic wave penetrates, such as metal etc..
See Fig. 7, remove temporary base 1, carry out encapsulating described in singulation along the center of the second through hole 5 by laser 7Body, described laser may be replaced by the width of described second through hole 5 after machine cuts, and cutting still greater than the first through holeThe width of 4, the width of the second through hole 5 after cutting is more than or equal to 1mm.
Seeing Fig. 8, obtain encapsulating monomer 100, its top view is as it is shown in figure 9, four the most corresponding four first of electrodes lead toHole 4, four the second through holes 5 of surrounding around the side of described electromagnetic component 2, and, the second through hole 5 includes respectively with described fourFour parts that individual electrode is connected, that be electrically isolated from each other, certainly, the difference of its electromagnetic component, number of poles, the first through hole 4 andThe number of the second through hole 5 is the most different, but in any case, described second through hole fills the area of the lateral parts of conductive material 6Account for the 50%-90% of described encapsulation monomer 100 lateral area, only in this way could preferably play the effect of electromagnetic shielding.
See Figure 10, it is provided that one has reeded heat-radiating substrate 8, and this heat-radiating substrate 8 can be ceramic substrate, macromoleculeHeat-radiating substrates etc., coat one layer of thermal conductive insulation glue 9 at bottom portion of groove, utilize this thermal conductive insulation glue 9 to be fixed on by encapsulation monomer 100Bottom portion of groove, and utilize encapsulating material 10 to fill and seal described encapsulation monomer 100.
With reference to Figure 11, formed in the position boring of deviation chip center and expose the through hole of described line layer and fill conducting objectsMatter is to form the outer terminal 11 that connects, and is coupled with other electronic components by outer even terminal, and other electronic components described include controlDevice processed, MOS transistor, resistance etc..
The present invention passes through area and the thickness of Control peripheral circuit layer (the second through hole), forms electronic shield and preferably encapsulatesBody, without being further added by the components such as electro-magnetic shielding cover in follow-up integrated antenna package, reduces encapsulation volume, enhances encapsulationMotility.
It is last that it is noted that obviously above-described embodiment is only for clearly demonstrating example of the present invention, and alsoThe non-restriction to embodiment.For those of ordinary skill in the field, can also do on the basis of the above descriptionGo out change or the variation of other multi-form.Here without also cannot all of embodiment be given exhaustive.And thus drawnWhat Shen went out obviously changes or changes among still in protection scope of the present invention.