Water-cooling type heat radiation module and use this water-cooling type heat radiation module charging pile moduleTechnical field
The present invention relates to heat abstractor field, particularly relate to water-cooling type heat radiation module and use this water-cooling type heat radiation moduleCharging pile module.
Background technology
Along with the fast development of new-energy automobile, electric automobile sales volume sustainable growth in the world, current electric motor carEnergy-storage system mostly use lithium ion battery, lithium ion battery has energy and compares the advantage such as higher, the most lightweight, but due to lithiumIon battery uses organic electrolyte, inflammable and explosive, inherently there is poor stability, has the danger that blast occurs, to electronicAutomobile brings great hidden danger.The electrolyte of domestic ni-mh class electrokinetic cell (super capacitor) is aqueous electrolyte, from allOn solve the problem that battery is inflammable and explosive, through development for many years, the Large Copacity of ni-mh class electrokinetic cell (super capacitor), canThe feature of high current charge-discharge (maximum 2000A) is applicable to electric automobile, is particularly suited for city bus bus.
For adapting to the fast development of ev industry, domestic various places set up electric motorcar charging station one after another.The most domestic fillCharging pile template in power station is high power charging device, and its multiple components and parts comprised operationally can distribute biggerHeat (such as: metal-oxide-semiconductor), in order to avoid the components and parts of heating are burned because temperature is higher, so charging pile template is respectively provided withHave the heat abstractor dispelled the heat for the components and parts that metal-oxide-semiconductor etc. is generated heat, common heat abstractor be fan heat, fan toThe components and parts of heating blow heat radiation, but while blowing is dispelled the heat, also the materials such as dust can be blown into charging pileTemplate, especially under dry climatic environment, (such as northern China) is easier to the materials such as dust are blown into charging pile template,Will gather the materials such as thicker dust in long-term charging pile template in the past, when running into the weather of humidity, the material such as dust is fillingBonding in electricity stake template, thus can pollute and damage charging pile template.
Additionally, be not only charging pile template, other the dress with the components and parts that operationally can produce more heat transferPutting, its radiating mode is generally also and is dispelled the heat by fan, and the mainframe box of such as desktop computer so, also there will be as aboveDescribed pollution also damages the situation of device.
Therefore, a kind of the components and parts of heating can be dispelled the heat, and will not pollute, damage the heat radiation of components and parts generated heatDevice urgently occurs.
Summary of the invention
It is an object of the invention to provide a kind of water-cooling type heat radiation module and use the charging pile of this water-cooling type heat radiation moduleModule, it is achieved that the purpose dispelled the heat and avoid dust to pollute, thus customer service the deficiencies in the prior art.
For reaching above-mentioned purpose, technical scheme is as follows:
A kind of water-cooling type heat radiation module, including heat-absorbing block, liquid storage block, semiconductor refrigeration chip and radiator, described suctionBeing provided with liquid flowing water route in hot block, offer reservoir in described liquid storage block, described liquid storage block is connected with described heat-absorbing blockLogical, both are internal is vacuum environment, and forms closed circuit, and described radiator is positioned at described liquid storage block away from described heat-absorbing blockOne side, and be pasted with at least one described semiconductor refrigeration chip between the two, the positive pole of those semiconductor refrigeration chips andNegative pole connects power supply respectively.
Preferably, the liquid outlet of described liquid storage block passes sequentially through drawing liquid pump and connects the import of pipeline and described heat-absorbing block evenLogical, the inlet of described liquid storage block and the outlet of described heat-absorbing block.
Preferably, described liquid storage block includes the liquid storage plate of two pieces of relative laminatings, and both be internally formed described reservoir.
Preferably, described liquid flowing water route presents "] " type, one end of described heat-absorbing block has been positioned apart from import and has gone outMouthful, described inlet and outlet respectively with in described heat-absorbing block liquid flow water route two bifurcated mouths connect.
Preferably, described radiator is made up of multi-disc fin.
Preferably, described liquid is pure water.
A kind of charging pile module using water-cooling type heat radiation module, including housing, has installation cavity, institute in described housingStating the one end in installation cavity body and be provided with multiple components and parts, the other end in described installation cavity body installs above-mentioned water-cooling type heat radiationModule, described heat-absorbing block fits tightly or close with components and parts at least one described, and described liquid storage block is in described radiator and is somebody's turn to doForm isolation strip between a little components and parts so that those components and parts to be located in described housing relative with what described liquid storage block was formedIn sealing area.
Preferably, the position described housing corresponding to described radiator offers louvre.
Preferably, being additionally provided with at least one fan in described installation cavity body, this water-cooling type heat radiation module is positioned at those yuanBetween device and described fan and form distance piece, it is used for preventing dust to be blown into described components and parts.
Preferably, those fans are arranged at the described radiator side away from those components and parts, and have one between the twoFixed space.
Compared with prior art, advantages of the present invention at least that:
1) present invention is operationally, and heat-absorbing block, by the heat absorption of heating element, then absorbs thermal source in heat-absorbing blockHeat is connected pipeline by second and carries to liquid storage block by liquid, and then, the one of semiconductor refrigeration chip is in liquid storage blockThe liquid with heat cools down, and meanwhile, radiator carries out radiating treatment to the another side of semiconductor refrigeration chip, tightlyThen, the liquid after being cooled passes sequentially through drawing liquid pump and the first connection pipeline is flowed into heat-absorbing block by the import on heat-absorbing blockIn, thus heating element is cooled down, and while cooling, liquid is by the heat absorption of heating element, and tailing edgeLiquid flowing water route to flow out from the outlet of heat-absorbing block, and heat is carried to liquid storage block again by the second connection pipelineCooled, this is a cycle of operation.By above-mentioned design, can avoid prior art directly utilizes the direct Caulis Seu Radix Kadsurae Oblongifoliae of fanThe situation that dust that is hot and that cause pollutes.
2) liquid storage block forms isolation strip between radiator and those components and parts, so that those components and parts are located in shellIn the opposing seal region that body and liquid storage block are formed, this design, can avoid affecting the radiating effect of radiator.
3) fan can improve radiating effect further, and water-cooling type heat radiation module between components and parts and fan alsoForm distance piece, be used for preventing dust to be blown into components and parts.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, prior art and embodiment will be described belowThe accompanying drawing used required in is briefly described.
Fig. 1 is the structural representation one of water-cooling type heat radiation module disclosed in the embodiment of the present invention one；
Fig. 2 is the structural representation two using water-cooling type heat radiation module disclosed in the embodiment of the present invention one；
Fig. 3 is semiconductor refrigeration chip disclosed in the embodiment of the present invention one and the structural representation of liquid storage block；
Fig. 4 is the structural representation one of heat-absorbing block disclosed in the embodiment of the present invention one；
Fig. 5 is the structural representation of the intermediate plate of heat-absorbing block disclosed in the embodiment of the present invention one；
Fig. 6 is the structural representation two of heat-absorbing block disclosed in the embodiment of the present invention one；
Fig. 7 is the structural representation of the mainboard of heat-absorbing block disclosed in the embodiment of the present invention one；
Fig. 8 is the internal structure of the charging pile module using water-cooling type heat radiation module disclosed in the embodiment of the present invention twoSchematic diagram (removing upper shell)；
Fig. 9 is the internal structure of the charging pile module using water-cooling type heat radiation module disclosed in the embodiment of the present invention threeSchematic diagram (removing upper shell).
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, completeDescribe wholely.
Embodiment one:
See a kind of water-cooling type heat radiation module shown in Fig. 1-7, including heat-absorbing block 1, liquid storage block 2, semiconductor refrigeration chip 3And radiator 4, it is provided with liquid flowing water route 11 in heat-absorbing block 1, in liquid storage block 2, offers reservoir, liquid storage block 2 and heat absorptionBlock 1 is connected, and both are internal is vacuum environment, and forms closed circuit, and radiator 4 is positioned at liquid storage block 2 away from the one of heat-absorbing block 1Side, and it is pasted with at least one semiconductor refrigeration chip 3, the positive pole of those semiconductor refrigeration chips 3 and negative pole between the twoConnect power supply respectively.
It is known that semiconductor refrigeration chip 3, it is again thermoelectric module, is a kind of heat pump.Its advantage is not slideParts, apply and are restricted in some spaces, and reliability requirement is high, the occasion polluted without cold-producing medium.Utilize semi-conducting materialPeltier effect, when the galvanic couple that unidirectional current is connected into by two kinds of different semi-conducting materials, can distinguish in the both sides of galvanic coupleAbsorb heat and release heat, it is possible to achieve the purpose of refrigeration.Therefore, the one side of semiconductor refrigeration chip 3 absorbs heat, and it is anotherOne side releases heat, and the semiconductor refrigeration chip 3 that the present invention provides is by suitable wiring (connection power supply), so that withThe one side of radiator 4 laminating releases heat (heat radiation), absorbs heat (heat absorption) with the one side of liquid storage block 2 laminating, and radiator 4 is justIt is that semiconductor refrigeration chip 3 is carried out radiating treatment.
Seeing shown in Fig. 1-2, the liquid outlet of liquid storage block 2 passes sequentially through drawing liquid pump 7 and first and connects pipeline 8 and heat-absorbing block 1Import C3 connection, the inlet of liquid storage block 2 by second connection pipeline 9 connect with the outlet C4 of heat-absorbing block 1.
Shown in Figure 3, liquid storage block 2 includes the liquid storage plate of two pieces of relative laminatings, and both be internally formed reservoir.
Seeing shown in Fig. 4-7, heat-absorbing block 1 can use two kinds of versions:
Heat-absorbing block 1 version one: see shown in Fig. 4-5, heat-absorbing block 1 includes intermediate plate C1 and is fixedly arranged on intermediate plate respectivelyThe side plate C2 of C1 both sides, wherein, one end of intermediate plate C1 offers end and has been positioned apart from import C3 and outlet C4, intermediate plate C1Inside it is provided with in "] " liquid of type flowing water route 11, should "] " the liquid flowing water route 11 of type is laterally to be set by one piece of transverse slat C5It is placed in the groove in intermediate plate C1 and is formed, and one end of this transverse slat C5 is provided with import C3 and outlet C4 with intermediate plate C1One end fixing connect, retain certain space between the other end and the other end of intermediate plate C1 of this transverse slat C5.Liquid is by enteringMouthful C3 walks one "] after entering " flow out from outlet C4 after type route.
Heat-absorbing block 1 version two: see shown in Fig. 6-7, heat-absorbing block 1 includes mainboard C6 and fits with mainboard C6 and consolidateFixed side plate C7, the one side of mainboard C6 is outwardly, and it is internally provided with "] " type liquid flowing water route 11, it is somebody's turn to do "] " type liquidBody flowing water route 11 is to be horizontally set in the groove in mainboard C6 by one piece of transverse slat C5 and formed, and the one of this transverse slat C5Holding the one end being provided with import C3 and outlet C4 with intermediate plate C1 to fix to be connected, the other end of this transverse slat C5 is another with intermediate plate C1'sCertain space is retained between one end.Liquid walks one "] after being entered by import C3 " flow out from outlet C4 after type route.
Seeing shown in Fig. 1-2, radiator 4 is made up of multi-disc fin 41.Additionally, the liquid that the present embodiment uses is pureWater.Other the liquid with refrigeration can certainly be selected, be not limited to pure water.
The operation principle of this water-cooling type heat radiation module is as follows:
Heat-absorbing block 1 by the heat absorption of heating element, then absorbs the liquid of thermal source by heat by the in heat-absorbing block 1Two connect pipeline 9 carries to liquid storage block 2, and then, the one of semiconductor refrigeration chip 3 has the liquid of heat in liquid storage block 2Body cools down, and meanwhile, radiator 4 carries out radiating treatment to the another side of semiconductor refrigeration chip 3, and then, coldBut the liquid after passes sequentially through drawing liquid pump 7 and the first connection pipeline 8 is flowed in heat-absorbing block 1 by the import C3 on heat-absorbing block 1, fromAnd heating element is cooled down, and while cooling, liquid is by the heat absorption of heating element, then along liquidFlowing water route 11 is flowed out from the outlet C4 of heat-absorbing block 1, and by the second connection pipeline 9, heat is carried quilt to liquid storage block 2Again cooling down, this is a cycle of operation.By above-mentioned design, can avoid that prior art directly utilizes fan 6 and directly blowThe situation that the dust that wind dispels the heat and causes pollutes.
It should be added that at this, in cold conditions, by semiconductor refrigerating in contrast with the previous embodimentThe mode of connection (connection power supply) of chip 3, so that the one side that semiconductor refrigeration chip 3 and liquid storage block 2 are fitted releases heat(heat radiation), meanwhile, the another side of semiconductor refrigeration chip 3 absorbs heat (heat absorption), and now, in liquid storage block 2, liquid is heated, quiltLiquid after heating passes sequentially through drawing liquid pump 7 and first and connects pipeline 8 by heat-absorbing block 1 (now heat-absorbing block 1 is equivalent to radiating block)On import C3 flow in heat-absorbing block 1, thus components and parts are heated, and while heating, liquid are cold by components and partsBut, and flow out from the outlet C4 of heat-absorbing block 1 along liquid flowing water route 11, and will be carried to liquid storage by the second connection pipeline 9In block 2, thus proceed to be heated, as a circulation.Certainly, correspondingly work without radiator, or will heat radiationDevice changes warming sheet into, thus the another side of semiconductor refrigeration chip 3 is carried out heat treated.Therefore, the present invention can also be suitable forHeat treated in components and parts, however it is not limited to for the radiating treatment of components and parts.
Embodiment two:
See a kind of charging pile module using above-mentioned water-cooling type heat radiation module shown in Fig. 1-8, including housing 5, housing 5Inside there is installation cavity 51, the one end in cavity 51 is installed and is provided with multiple components and parts K, the other end in cavity 51 is installed and installsAbove-mentioned water-cooling type heat radiation module, heat-absorbing block 1 fits tightly or close with at least one components and parts K, and liquid storage block 2 is in radiator 4And form isolation strip between those components and parts K so that those components and parts K to be located in housing 5 relative with what liquid storage block 2 was formedIn sealing area H.
Liquid storage block 2 forms isolation strip between radiator 4 and those components and parts K, so that those components and parts K is located inIn the opposing seal region H that housing 5 and liquid storage block 2 are formed, this design, can avoid affecting the radiating effect of radiator 4.
Preferably, position housing 5 corresponding to radiator 4 offers louvre 52.Louvre 52 will be for dispelling the heatHeat is distributed to housing 5 outside by device 4.
Embodiment three:
A kind of charging pile module using above-mentioned water-cooling type heat radiation module seeing shown in Fig. 1-7 and Fig. 9, the present embodiment withThe difference of embodiment two is, is additionally provided with at least one fan 6 in installing cavity 51, and this water-cooling type heat radiation module is positioned at thoseBetween components and parts and fan 6 and form distance piece, it is used for preventing dust to be blown into components and parts.Corresponding to the position of fan 6 on housing 5Place offers louvre 53.Fan 6 is set and can improve the effect of heat radiation further.Remaining, the present embodiment three and enforcementThe part that example two is identical repeats no more.
Preferably, those fans 6 are arranged at the radiator 4 side away from those components and parts, and have certain between the twoSpace.
Furthermore, it is necessary to explanation, the water-cooling type heat radiation module not only limit the use of in charging pile module that the present invention provides, and alsoMay be used for battery bag, computer host box etc., all devices with heating element all can install above-mentioned water-cooling typeHeat radiation module, the above-mentioned charging pile module using water-cooling type heat radiation module is only typically to implement example.
Multiple amendment to these embodiments will be apparent from, herein for those skilled in the artDefined General Principle can realize without departing from the spirit or scope of the present invention in other embodiments.CauseThis, the present invention is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein and newThe widest scope that grain husk feature is consistent.