技术领域technical field
本发明涉及移动终端技术领域，尤其是涉及一种PCB板及具有其的移动终端。The invention relates to the technical field of mobile terminals, in particular to a PCB board and a mobile terminal having the same.
背景技术Background technique
随着电子产品的快速发展，产品的机身越来越趋向于薄、轻巧化，产品内部的空间布局也会越来越紧凑。相关技术中，相邻层的PCB布线很容易带来信号之间的相互干扰，从而影响PCB板的正常工作。With the rapid development of electronic products, the body of the product tends to be thinner and lighter, and the space layout inside the product will become more and more compact. In the related art, the PCB wiring on adjacent layers is likely to cause mutual interference between signals, thereby affecting the normal operation of the PCB board.
发明内容Contents of the invention
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本发明提出一种PCB板，所述PCB板具有相邻层线路信号干扰小的优点。The present invention aims to solve one of the technical problems in the related art at least to a certain extent. For this reason, the present invention proposes a PCB board, which has the advantage of less interference of adjacent layer circuit signals.
本发明还提出一种移动终端，所述移动终端包括上述PCB板。The present invention also proposes a mobile terminal, which includes the above-mentioned PCB board.
根据本发明实施例的PCB板，包括多层层叠放置的导电层，多层所述导电层包括第一导电层和与所述第一导电层相邻的第二导电层，所述第一导电层上铺设有第一布线线路，所述第二导电层上设有第二布线线路，所述第一布线线路的面积为S，所述第二布线线路在所述第一导电层上投影与所述第一布线线路重叠的面积为S’，所述S和所述S’满足：1/4≤S’/S≤3/5。The PCB board according to the embodiment of the present invention includes multiple layers of conductive layers stacked on top of each other, the multi-layer conductive layers include a first conductive layer and a second conductive layer adjacent to the first conductive layer, and the first conductive layer A first wiring line is laid on the layer, a second wiring line is arranged on the second conductive layer, the area of the first wiring line is S, and the projection of the second wiring line on the first conductive layer is the same as The overlapping area of the first wiring line is S', and the S and S' satisfy: 1/4≦S'/S≦3/5.
根据本发明实施例的PCB板，通过使第二布线线路在第一导电层上的投影与第一布线线路的重叠面积S’和第一布线线路的面积S满足1/4≤S’/S≤3/5，可以减小第一导电层和第二导电层之间信号的相互干扰，提高了第一布线线路和第二布线线路信号传输的性能，提高PCB板工作的可靠性。According to the PCB board of the embodiment of the present invention, by making the overlapping area S' of the projection of the second wiring line on the first conductive layer and the first wiring line and the area S of the first wiring line satisfy 1/4≤S'/S ≤3/5, can reduce the mutual interference of signals between the first conductive layer and the second conductive layer, improve the performance of signal transmission between the first wiring line and the second wiring line, and improve the reliability of the PCB board.
根据本发明的一些实施例，所述S和所述S’满足：1/3≤S’/S≤3/5。According to some embodiments of the present invention, the S and the S' satisfy: 1/3≤S'/S≤3/5.
根据本发明的一些实施例，所述S和所述S’满足：1/4≤S’/S≤1/2。According to some embodiments of the present invention, the S and the S' satisfy: 1/4≤S'/S≤1/2.
根据本发明的一些实施例，所述S和所述S’满足：1/3≤S’/S≤1/2。According to some embodiments of the present invention, the S and the S' satisfy: 1/3≤S'/S≤1/2.
根据本发明的一些实施例，所述第一布线线路的延伸方向与所述第二布线线路延伸方向相同。According to some embodiments of the present invention, the extending direction of the first wiring line is the same as the extending direction of the second wiring line.
根据本发明的一些实施例，所述第一布线线路的延伸方向与所述第二布线线路延伸方向之间的夹角为α，所述α满足：0＜α≤80°。According to some embodiments of the present invention, the angle between the extending direction of the first wiring line and the extending direction of the second wiring line is α, and the α satisfies: 0<α≦80°.
根据本发明的一些实施例，所述第一布线线路的延伸方向与所述第二布线线路延伸方向之间的夹角为α，所述α满足：α＝90°。According to some embodiments of the present invention, the angle between the extending direction of the first wiring line and the extending direction of the second wiring line is α, and the α satisfies: α=90°.
根据本发明实施例的移动终端，包括上述PCB板。A mobile terminal according to an embodiment of the present invention includes the above-mentioned PCB board.
根据本发明实施例的移动终端，通过设置上述PCB板，可以减小第一导电层和第二导电层之间信号的相互干扰，提高第一布线线路和第二布线线路信号传输的质量，提高移动终端的性能。According to the mobile terminal of the embodiment of the present invention, by arranging the above-mentioned PCB board, the mutual interference of signals between the first conductive layer and the second conductive layer can be reduced, the quality of signal transmission between the first wiring line and the second wiring line can be improved, and the performance of mobile terminals.
根据本发明的一些实施例，所述移动终端为手机、平板电脑或笔记本电脑。According to some embodiments of the present invention, the mobile terminal is a mobile phone, a tablet computer or a notebook computer.
附图说明Description of drawings
图1是根据本发明实施例的PCB板的布线结构示意图；Fig. 1 is a schematic diagram of the wiring structure of a PCB board according to an embodiment of the present invention;
图2是根据本发明实施例的PCB板的布线结构示意图。FIG. 2 is a schematic diagram of a wiring structure of a PCB board according to an embodiment of the present invention.
附图标记：Reference signs:
PCB板100，PCB board 100,
第一布线线路1，第二布线线路2，绝缘PP片3。The first wiring line 1, the second wiring line 2, and the insulating PP sheet 3.
具体实施方式Detailed ways
下面详细描述本发明的实施例，所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
下面参考图1和图2描述根据本发明实施例的PCB板100。The following describes a PCB board 100 according to an embodiment of the present invention with reference to FIGS. 1 and 2 .
如图1和图2所示，根据本发明实施例的PCB板100，包括多层层叠放置的导电层，多层导电层包括第一导电层和与第一导电层相邻的第二导电层，第一导电层上铺设有第一布线线路1，第二导电层上设有第二布线线路2，第一布线线路1的面积为S，第二布线线路2在第一导电层上投影与第一布线线路1重叠的面积为S’，S和S’满足：1/4≤S’/S≤3/5。由此，可以减小第一布线线路1和第二布线线路2之间信号的相互干扰，提高了第一布线线路1和第二布线线路2信号传输的性能，提高PCB板100工作的可靠性。As shown in Figures 1 and 2, the PCB board 100 according to the embodiment of the present invention includes a multi-layer conductive layer stacked, and the multi-layer conductive layer includes a first conductive layer and a second conductive layer adjacent to the first conductive layer , the first wiring line 1 is laid on the first conductive layer, the second wiring line 2 is arranged on the second conductive layer, the area of the first wiring line 1 is S, and the projection of the second wiring line 2 on the first conductive layer is the same as The overlapping area of the first wiring line 1 is S', and S and S' satisfy: 1/4≤S'/S≤3/5. Thus, the mutual interference of signals between the first wiring line 1 and the second wiring line 2 can be reduced, the performance of signal transmission between the first wiring line 1 and the second wiring line 2 can be improved, and the reliability of the operation of the PCB board 100 can be improved. .
如图1所示，第一布线线路1和第二布线线路2交错布置，第二布线线路2在第一导电层上的投影与第一布线线路1的重叠面积仅为第一布线线路1和第二布线线路2交叉点处的面积，第一导电层和第二导电层信号的干扰也只发生在第一布线线路1和第二布线线路2的交叉点的位置处，极大地降低了第一导电层和第二导电层之间的信号干扰，提高了信号传输的质量，提高了产品的性能。As shown in Figure 1, the first wiring lines 1 and the second wiring lines 2 are arranged alternately, and the overlapping area of the projection of the second wiring lines 2 on the first conductive layer and the first wiring lines 1 is only the first wiring lines 1 and the first wiring lines 1. The area at the intersection of the second wiring line 2, the interference of the first conductive layer and the second conductive layer signal also only occurs at the intersection of the first wiring line 1 and the second wiring line 2, which greatly reduces the first wiring line 1 and the second wiring line 2. Signal interference between the first conductive layer and the second conductive layer improves the quality of signal transmission and improves the performance of products.
如图2所示，第一布线线路1和第二布线线路2大体沿同一方向延伸，第二布线线路2在第一导电层上的投影位于第一布线线路1的一侧，第一导电层和第二导电层信号干扰只发生在第一布线线路1的一侧，极大地降低了第一导电层和第二导电层之间的信号干扰，提高了信号传输的质量，提高了产品的性能。As shown in Figure 2, the first wiring line 1 and the second wiring line 2 generally extend along the same direction, the projection of the second wiring line 2 on the first conductive layer is located on one side of the first wiring line 1, and the first conductive layer The signal interference with the second conductive layer only occurs on one side of the first wiring line 1, which greatly reduces the signal interference between the first conductive layer and the second conductive layer, improves the quality of signal transmission, and improves the performance of the product .
根据本发明实施例的PCB板100，通过使第二布线线路2在第一导电层上的投影与第一布线线路1的重叠面积S’和第一布线线路1的面积S满足1/4≤S’/S≤3/5，可以减小第一导电层和第二导电层之间信号的相互干扰，提高了第一布线线路1和第二布线线路2信号传输的性能，提高PCB板100工作的可靠性。According to the PCB board 100 of the embodiment of the present invention, by making the overlapping area S' of the projection of the second wiring line 2 on the first conductive layer and the first wiring line 1 and the area S of the first wiring line 1 satisfy 1/4≤ S'/S≤3/5, which can reduce the mutual interference of signals between the first conductive layer and the second conductive layer, improve the performance of signal transmission between the first wiring line 1 and the second wiring line 2, and improve the PCB board 100 work reliability.
在本发明的一些实施例中，S和S’满足：1/3≤S’/S≤3/5。由此，可以进一步减小第一导电层和第二导电层之间信号的相互干扰，提高了第一布线线路1和第二布线线路2信号传输的性能，提高PCB板100工作的可靠性。In some embodiments of the present invention, S and S' satisfy: 1/3≤S'/S≤3/5. Thus, the mutual interference of signals between the first conductive layer and the second conductive layer can be further reduced, the performance of signal transmission between the first wiring line 1 and the second wiring line 2 is improved, and the reliability of the PCB board 100 is improved.
在本发明的一些实施例中，S和S’满足：1/4≤S’/S≤1/2。由此，可以进一步减小第一导电层和第二导电层之间信号的相互干扰，提高了第一布线线路1和第二布线线路2信号传输的性能，提高PCB板100工作的可靠性。In some embodiments of the present invention, S and S' satisfy: 1/4≤S'/S≤1/2. Thus, the mutual interference of signals between the first conductive layer and the second conductive layer can be further reduced, the performance of signal transmission between the first wiring line 1 and the second wiring line 2 is improved, and the reliability of the PCB board 100 is improved.
在本发明的一些实施例中，S和S’满足：1/3≤S’/S≤1/2。由此，可以进一步减小第一导电层和第二导电层之间信号的相互干扰，提高了第一布线线路1和第二布线线路2信号传输的性能，提高PCB板100工作的可靠性。In some embodiments of the present invention, S and S' satisfy: 1/3≤S'/S≤1/2. Thus, the mutual interference of signals between the first conductive layer and the second conductive layer can be further reduced, the performance of signal transmission between the first wiring line 1 and the second wiring line 2 is improved, and the reliability of the PCB board 100 is improved.
在本发明的一些实施例中，如图2所示，第一布线线路1的延伸方向与第二布线线路2延伸方向相同。第二布线线路2在第一导电层上的投影位于第一布线线路1的一侧，第一导电层和第二导电层信号干扰只发生在第一布线线路1的一侧，极大地降低了第一导电层和第二导电层之间的信号干扰，提高了信号传输的质量，提高了产品的性能。这样在进行压合加工时，第一导电层和第二导电层线路不会成形较大的断差，确保PCB压合加工制作时不会切断第一导电层和第二导电层之间的薄层绝缘PP片3，提高PCB制作良率，确保信号功能。In some embodiments of the present invention, as shown in FIG. 2 , the extending direction of the first wiring line 1 is the same as the extending direction of the second wiring line 2 . The projection of the second wiring line 2 on the first conductive layer is located on one side of the first wiring line 1, and the signal interference between the first conductive layer and the second conductive layer only occurs on one side of the first wiring line 1, which greatly reduces the Signal interference between the first conductive layer and the second conductive layer improves the quality of signal transmission and improves the performance of products. In this way, during the lamination process, the first conductive layer and the second conductive layer will not form a large gap, ensuring that the thin film between the first conductive layer and the second conductive layer will not be cut off during the PCB lamination process. Layer insulation PP sheet 3 improves PCB production yield and ensures signal function.
相关技术中，第一布线线路和第二布线线路的延伸方向相同，且第一布线线路和第二布线线路交错设置，第二布线线路在第一导电层上的投影和第一布线线路无重叠，由此可以减小第一布线线路和第二布线线路之间的信号干扰，但由于PCB板层与层之间的绝缘PP片很薄，第一布线线路和第二布线线路信号交错相切走线，形成很大的断差，在PCB板进行压合加工制作时。上下层线路相切压合会把薄层绝缘PP片切断，从而导致上下层线路相互接触，导致信号短路的风险，导致PCB板制作不良。In the related art, the extension direction of the first wiring line and the second wiring line are the same, and the first wiring line and the second wiring line are arranged alternately, and the projection of the second wiring line on the first conductive layer does not overlap with the first wiring line , so that the signal interference between the first wiring line and the second wiring line can be reduced, but because the insulating PP sheet between the PCB board layers is very thin, the signals of the first wiring line and the second wiring line are staggered and tangent The wiring forms a large gap when the PCB board is pressed and processed. The tangential pressing of the upper and lower layers of the circuit will cut off the thin insulating PP sheet, which will cause the upper and lower layers of the circuit to contact each other, resulting in the risk of signal short circuit, resulting in poor PCB board production.
在本发明的一些实施例中，第一布线线路1的延伸方向与第二布线线路2延伸方向之间的夹角为α，α满足：0＜α≤80°。第二布线线路2在第一导电层上的投影与第一布线线路1的重叠面积仅为第一布线线路1和第二布线线路2交叉点处的面积，第一导电层和第二导电层信号的干扰也只发生在第一布线线路1和第二布线线路2的交叉点的位置处，极大地降低了第一导电层和第二导电层之间的信号干扰，提高了信号传输的质量，提高了产品的性能。In some embodiments of the present invention, the angle between the extending direction of the first wiring line 1 and the extending direction of the second wiring line 2 is α, and α satisfies: 0<α≦80°. The overlapping area of the projection of the second wiring line 2 on the first conductive layer and the first wiring line 1 is only the area at the intersection of the first wiring line 1 and the second wiring line 2, the first conductive layer and the second conductive layer Signal interference also only occurs at the intersection of the first wiring line 1 and the second wiring line 2, which greatly reduces the signal interference between the first conductive layer and the second conductive layer, and improves the quality of signal transmission , improve the performance of the product.
在本发明的一些实施例中，如图1所示，第一布线线路1的延伸方向与第二布线线路2延伸方向之间的夹角为α，α满足：α＝90°。第二布线线路2在第一导电层上的投影与第一布线线路1的重叠面积仅为第一布线线路1和第二布线线路2交叉点处的面积，第一导电层和第二导电层信号的干扰也只发生在第一布线线路1和第二布线线路2的交叉点的位置处，极大地降低了第一导电层和第二导电层之间的信号干扰，提高了信号传输的质量，提高了产品的性能。同时，便于PCB板100布线。In some embodiments of the present invention, as shown in FIG. 1 , the angle between the extending direction of the first wiring line 1 and the extending direction of the second wiring line 2 is α, and α satisfies: α=90°. The overlapping area of the projection of the second wiring line 2 on the first conductive layer and the first wiring line 1 is only the area at the intersection of the first wiring line 1 and the second wiring line 2, the first conductive layer and the second conductive layer Signal interference also only occurs at the intersection of the first wiring line 1 and the second wiring line 2, which greatly reduces the signal interference between the first conductive layer and the second conductive layer, and improves the quality of signal transmission , improve the performance of the product. At the same time, it facilitates the wiring of the PCB board 100 .
下面参考图1和图2描述根据本发明两个具体实施例的PCB板100，下述描述只是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。The PCB board 100 according to two specific embodiments of the present invention will be described below with reference to FIG. 1 and FIG. 2 . The following descriptions are only exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.
实施例一Embodiment one
如图1所示，根据本发明实施例的PCB板100，包括多层层叠放置的导电层，多层导电层包括第一导电层和与第一导电层相邻的第二导电层，第一导电层上铺设有第一布线线路1，第二导电层上设有第二布线线路2，第一布线线路1的面积为S，第二布线线路2在第一导电层上投影与第一布线线路1重叠的面积为S’，S和S’满足：1/4≤S’/S≤3/5。As shown in FIG. 1 , the PCB board 100 according to the embodiment of the present invention includes multiple layers of conductive layers stacked on top of each other. The multi-layer conductive layer includes a first conductive layer and a second conductive layer adjacent to the first conductive layer. The first wiring line 1 is laid on the conductive layer, and the second wiring line 2 is arranged on the second conductive layer. The area of the first wiring line 1 is S, and the second wiring line 2 is projected on the first conductive layer with the first wiring line. The overlapping area of line 1 is S', and S and S' satisfy: 1/4≤S'/S≤3/5.
第一布线线路1的延伸方向和第二布线线路2的延伸方向之间的夹角为α，α＝90°，即第一布线线路1和第二布线线路2垂直设置。第一布线线路1沿水平方向延伸，第二布线线路2沿竖直方向延伸，第二布线线路2在第一导电层上的投影与第一布线线路1的重叠面积仅为第一布线线路1和第二布线线路2交叉点处的面积，第一导电层和第二导电层信号的干扰也只发生在第一布线线路1和第二布线线路2的交叉点的位置处，极大地降低了第一导电层和第二导电层之间的信号干扰，提高了信号传输的质量，提高了产品的性能。The angle between the extending direction of the first wiring line 1 and the extending direction of the second wiring line 2 is α, where α=90°, that is, the first wiring line 1 and the second wiring line 2 are vertically arranged. The first wiring line 1 extends in the horizontal direction, the second wiring line 2 extends in the vertical direction, and the overlapping area of the projection of the second wiring line 2 on the first conductive layer and the first wiring line 1 is only the first wiring line 1 and the area at the intersection of the second wiring line 2, the interference of the first conductive layer and the second conductive layer signal only occurs at the intersection of the first wiring line 1 and the second wiring line 2, which greatly reduces Signal interference between the first conductive layer and the second conductive layer improves the quality of signal transmission and improves the performance of products.
实施例二Embodiment two
如图2所示，本实施例与实施例一的结构大致相同，不同之处仅在于第一布线线路1的延伸方向和第二布线线路2的延伸方向相同，第二布线线路2在第一导电层上的投影位于第一布线线路1的一侧，第一导电层和第二导电层信号干扰只发生在第一布线线路1的一侧，极大地降低了第一导电层和第二导电层之间的信号干扰，提高了信号传输的质量，提高了产品的性能。As shown in Figure 2, the structure of this embodiment is substantially the same as that of Embodiment 1, the only difference is that the extension direction of the first wiring line 1 is the same as that of the second wiring line 2, and the second wiring line 2 is in the first The projection on the conductive layer is located on one side of the first wiring line 1, and the signal interference between the first conductive layer and the second conductive layer only occurs on one side of the first wiring line 1, which greatly reduces the performance of the first conductive layer and the second conductive layer. Signal interference between layers improves the quality of signal transmission and improves product performance.
同时，在进行压合加工时，第一导电层和第二导电层线路不会成形较大的断差，确保PCB压合加工制作时不会切断第一导电层和第二导电层之间的薄层绝缘PP片3，提高PCB制作良率，确保信号功能。At the same time, during the pressing process, the first conductive layer and the second conductive layer will not form a large gap, ensuring that the connection between the first conductive layer and the second conductive layer will not be cut off during the PCB pressing process. Thin-layer insulating PP sheet 3 improves PCB production yield and ensures signal function.
根据本发明实施例的移动终端，包括上述PCB板100，通过设置上述PCB板100，可以减小第一导电层和第二导电层之间信号的相互干扰，提高第一布线线路1和第二布线线路2信号传输的质量，提高移动终端的性能。The mobile terminal according to the embodiment of the present invention includes the above-mentioned PCB board 100. By arranging the above-mentioned PCB board 100, the mutual interference of signals between the first conductive layer and the second conductive layer can be reduced, and the first wiring line 1 and the second conductive layer can be improved. Wiring line 2 signal transmission quality improves mobile terminal performance.
在本发明的一些实施例中，移动终端为手机、平板电脑或笔记本电脑。当手机、平板电脑或笔记本电脑采用上述PCB板100后，可以提高其的性能。In some embodiments of the present invention, the mobile terminal is a mobile phone, a tablet computer or a notebook computer. When the above-mentioned PCB board 100 is used in a mobile phone, a tablet computer or a notebook computer, its performance can be improved.
在本发明的描述中，需要理解的是，术语“上”、“下”、“竖直”、“水平”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "vertical", "horizontal" etc. is based on the orientation or positional relationship shown in the drawings, and is only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless specifically defined otherwise.
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或彼此可通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; can be mechanically connected, can also be electrically connected or can communicate with each other; can be directly connected, can also be indirectly connected through an intermediary, can be the internal communication of two components or the interaction relationship between two components, Unless expressly defined otherwise. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505735.9ACN106102302B (en) | 2016-06-28 | 2016-06-28 | Pcb board and there is its mobile terminal |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505735.9ACN106102302B (en) | 2016-06-28 | 2016-06-28 | Pcb board and there is its mobile terminal |
| Publication Number | Publication Date |
|---|---|
| CN106102302A CN106102302A (en) | 2016-11-09 |
| CN106102302Btrue CN106102302B (en) | 2018-02-27 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610505735.9AExpired - Fee RelatedCN106102302B (en) | 2016-06-28 | 2016-06-28 | Pcb board and there is its mobile terminal |
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| CN (1) | CN106102302B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN119907180A (en)* | 2025-01-16 | 2025-04-29 | 武汉华星光电技术有限公司 | Circuit board assembly and display device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2731907Y (en)* | 2004-08-24 | 2005-10-05 | 华为技术有限公司 | Multilayer printed circuit board |
| US20100200281A1 (en)* | 2009-02-06 | 2010-08-12 | Tatung Company | Circuit board structure |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203608194U (en)* | 2013-10-15 | 2014-05-21 | 深圳市冠旭电子有限公司 | Circuit board with antenna and USB interface, and wireless receiving and transmitting device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2731907Y (en)* | 2004-08-24 | 2005-10-05 | 华为技术有限公司 | Multilayer printed circuit board |
| US20100200281A1 (en)* | 2009-02-06 | 2010-08-12 | Tatung Company | Circuit board structure |
| Publication number | Publication date |
|---|---|
| CN106102302A (en) | 2016-11-09 |
| Publication | Publication Date | Title |
|---|---|---|
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