技术领域technical field
本发明涉及一种抛光垫修整装置，属于抛光修整技术领域。The invention relates to a polishing pad conditioning device, which belongs to the technical field of polishing and conditioning.
背景技术Background technique
现今技术的抛光垫修整器都是用“磨粒(例如:钻石)”作为加工刀具以移除抛光垫(Pad)材料。请参阅图1所示，抛光垫修整器Q的上方布满磨粒d。加工抛光垫的制程中，磨粒d加工是以磨削的方式移除抛光垫上的材料。The polishing pad dresser of present technology all is to use " abrasive grain (for example: diamond) " as processing tool to remove polishing pad (Pad) material. Please refer to FIG. 1 , the top of the polishing pad dresser Q is covered with abrasive grains d. In the process of machining polishing pads, abrasive grain processing is the removal of material on the polishing pad by grinding.
然而，由于抛光垫修整器Q上的磨粒d，其切削刃的形状不规则，且通常磨粒d会以较大的负斜角挤入被加工材料中，属于多点磨削的加工机制，因而在材料表面留下粗糙的犁切痕迹(ploughing)。However, due to the abrasive grain d on the polishing pad dresser Q, the shape of its cutting edge is irregular, and usually the abrasive grain d will squeeze into the processed material at a large negative bevel angle, which belongs to the processing mechanism of multi-point grinding , thus leaving rough plowing marks (ploughing) on the surface of the material.
如果为了让表面粗糙度降低，则必须使用较高密度且较细的磨粒d加工，以降低粗糙的加工痕迹。但是，修整器的制造过程中，较小颗粒的磨粒d不易与基材结合固定。反倒会因为磨粒d容易脱落而刮伤晶圆，因此对磨粒d的大小有一定的限制(目前使用常用的颗粒大小约0.1毫米(millimeter，mm)至0.3毫米之间)，而难以有效率地降低抛光垫的表面粗糙度。If the surface roughness is to be reduced, higher density and finer abrasive grains must be used to reduce rough processing marks. However, during the manufacturing process of the dresser, the abrasive grains d with smaller particles are not easy to be combined with the base material and fixed. On the contrary, it will scratch the wafer because the abrasive grain d is easy to fall off, so there is a certain limit on the size of the abrasive grain d (the commonly used particle size is between 0.1 mm (mm) and 0.3 mm at present), and it is difficult to have Efficiently reduce the surface roughness of the polishing pad.
目前业界半导体的技术已经进入7奈米(nanometer，nm)制程，所使用的抛光垫材料已经不是以往的硬式抛光垫，抛光垫表面所需要的表面粗糙度值也相对要求更低。故，如何通过结构设计以改良抛光垫修整器，有效的加工抛光垫并控制良好的表面粗糙度，来克服上述的缺失，已成为该项事业所欲解决的重要课题之一。At present, the semiconductor technology in the industry has entered the 7nm (nanometer, nm) process, the polishing pad material used is no longer the hard polishing pad in the past, and the surface roughness value required for the surface of the polishing pad is relatively lower. Therefore, how to improve the polishing pad dresser through structural design, effectively process the polishing pad and control the surface roughness to overcome the above shortcomings has become one of the important issues to be solved by this business.
发明内容Contents of the invention
本发明所要解决的技术问题在于，针对现有技术的不足提供一种抛光垫修整装置。The technical problem to be solved by the present invention is to provide a polishing pad conditioning device for the deficiencies of the prior art.
为了解决上述的技术问题，本发明所采用的其中一技术方案是，In order to solve the above-mentioned technical problems, one of the technical solutions adopted in the present invention is:
一种抛光垫修整装置，其包括：A polishing pad conditioning device, comprising:
一基座；a base;
至少一切削件，所述切削件设置在所述基座上；以及at least one cutting element disposed on the base; and
至少一定位件，所述定位件设置在所述基座上，并且凸出于所述基座的上表面。At least one positioning piece, the positioning piece is arranged on the base and protrudes from the upper surface of the base.
本发明所采用另外一技术方案是，提供一种抛光垫修整装置，其包括一基座以及至少一切削件。所述切削件设置在所述基座上，所述切削件的一顶端具有一刀刃部以及一抵靠部。Another technical solution adopted by the present invention is to provide a polishing pad conditioning device, which includes a base and at least one cutting element. The cutting piece is arranged on the base, and a top end of the cutting piece has a cutting edge portion and an abutting portion.
本发明所采用的再一技术方案是，提供一种抛光垫修整装置其包括一基座、至少一切削件以及至少一定位结构。所述切削件设置在所述基座上，其中所述切削件具有一刀刃部。所述定位结构形成在所述切削件上或所述基座上。Another technical solution adopted by the present invention is to provide a polishing pad conditioning device, which includes a base, at least one cutting element and at least one positioning structure. The cutting element is disposed on the base, wherein the cutting element has a cutting edge. The positioning structure is formed on the cutting piece or on the base.
综上所述，本发明的其中一有益效果在于，本发明实施例所提供的抛光垫修整装置，其可通过“所述定位结构形成在所述切削件上或所述基座上＂的技术手段，可以将抛光垫上多余的材料切削而不会产生隆起，使得抛光垫的抛光面能够较为平坦，以有效控制抛光垫的表面粗糙度。To sum up, one of the beneficial effects of the present invention is that the polishing pad conditioning device provided by the embodiment of the present invention can adopt the technology of "the positioning structure is formed on the cutting piece or on the base" The means can cut the excess material on the polishing pad without causing bulges, so that the polishing surface of the polishing pad can be relatively flat, so as to effectively control the surface roughness of the polishing pad.
为使能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，然而所提供的附图仅提供参考与说明用，并非用来对本发明加以限制者。In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the provided drawings are provided for reference and illustration only, and are not intended to limit the present invention.
附图说明Description of drawings
当结合附图考虑时，通过参照下面的详细描述，能够更完整更好地理解本发明以及容易得知其中许多伴随的优点，但此处所说明的附图用来提供对本发明的进一步理解，构成本发明的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定，如图其中：A more complete and better understanding of the invention, and many of its attendant advantages, will readily be learned by reference to the following detailed description when considered in conjunction with the accompanying drawings, but the accompanying drawings illustrated herein are intended to provide a further understanding of the invention and constitute A part of the present invention, the exemplary embodiment of the present invention and its description are used to explain the present invention, and do not constitute an improper limitation of the present invention, as shown in the figure:
图1为现有技术的抛光垫修整装置的立体示意图。FIG. 1 is a schematic perspective view of a polishing pad conditioning device in the prior art.
图2A为本发明其中一切削件与抛光垫接触的示意图。FIG. 2A is a schematic diagram of a cutting element in contact with a polishing pad according to the present invention.
图2B为本发明另外一切削件与抛光垫接触的示意图。FIG. 2B is a schematic diagram of another cutting element in contact with a polishing pad according to the present invention.
图2C为本发明再一切削件与抛光垫接触的示意图。FIG. 2C is a schematic diagram of yet another cutting member in contact with a polishing pad according to the present invention.
图2D为本发明又一切削件的刀刃部与抛光垫接触的示意图。FIG. 2D is a schematic diagram of another cutting element of the present invention in which the cutting edge is in contact with the polishing pad.
图3为本发明实施例1的抛光垫修整装置的立体组合图。FIG. 3 is a three-dimensional assembled view of the polishing pad conditioning device according to Embodiment 1 of the present invention.
图4为本发明实施例2的抛光垫修整装置的立体分解图。FIG. 4 is an exploded perspective view of a polishing pad conditioning device according to Embodiment 2 of the present invention.
图5为本发明实施例2的修整组件的立体图。Fig. 5 is a perspective view of a trimming assembly according to Embodiment 2 of the present invention.
图6为本发明实施例2的修整组件具有一个第一前刀面的侧视图。Fig. 6 is a side view of a dressing assembly according to Embodiment 2 of the present invention with a first rake face.
图7为本发明实施例2的修整组件具有两个第一前刀面的侧视图。Fig. 7 is a side view of the dressing assembly according to Embodiment 2 of the present invention with two first rake surfaces.
图8为本发明实施例2的修整组件具有第一前刀面以及第一抵靠部的侧视图。Fig. 8 is a side view of the dressing assembly according to Embodiment 2 of the present invention with the first rake surface and the first abutting portion.
图9为本发明实施例3的修整组件的立体图。Fig. 9 is a perspective view of a trimming assembly according to Embodiment 3 of the present invention.
图10为本发明实施例3的修整组件的侧视图。Fig. 10 is a side view of a trimming assembly according to Embodiment 3 of the present invention.
图11为本发明实施例4的修整组件的立体图。Fig. 11 is a perspective view of a trimming assembly according to Embodiment 4 of the present invention.
图12为本发明实施例4的修整组件的另外一侧视示意图。Fig. 12 is another schematic side view of the trimming assembly according to Embodiment 4 of the present invention.
图13为本发明实施例5的修整组件的立体图。Fig. 13 is a perspective view of a trimming assembly according to Embodiment 5 of the present invention.
图14为本发明实施例5的抛光垫修整装置的立体组合图。Fig. 14 is a three-dimensional combined view of the polishing pad conditioning device according to Embodiment 5 of the present invention.
图15为本发明实施例6的抛光垫修整装置的立体组合图。Fig. 15 is a three-dimensional assembled view of the polishing pad conditioning device according to Embodiment 6 of the present invention.
图16为本发明实施例7的修整组件的立体图。Fig. 16 is a perspective view of a trimming assembly according to Embodiment 7 of the present invention.
图17为本发明实施例的设置于定位结构上的微结构层的示意图。FIG. 17 is a schematic diagram of a microstructure layer disposed on a positioning structure according to an embodiment of the present invention.
下面结合附图和实施例对本发明进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
具体实施方式detailed description
显然，本领域技术人员基于本发明的宗旨所做的许多修改和变化属于本发明的保护范围。Obviously, many modifications and changes made by those skilled in the art based on the gist of the present invention belong to the protection scope of the present invention.
本技术领域技术人员可以理解，除非特意声明，这里使用的单数形式“一”、“一个”、“所述”和“该”也可包括复数形式。应该进一步理解的是，本说明书中使用的措辞“包括”是指存在所述特征、整数、步骤、操作、组件和/或组件，但是并不排除存在或添加一个或多个其它特征、整数、步骤、操作、组件、组件和/或它们的组。应该理解，当称组件、组件被“连接”到另一组件、组件时，它可以直接连接到其它组件或者组件，或者也可以存在中间组件或者组件。这里使用的措辞“和/或”包括一个或更多个相关联的列出项的任一单元和全部组合。Those skilled in the art will understand that unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the word "comprising" used in this specification refers to the presence of said features, integers, steps, operations, components and/or components, but does not exclude the presence or addition of one or more other features, integers, Steps, operations, components, components and/or groups thereof. It will be understood that when a component is referred to as being "connected" to another component, it can be directly connected to the other component or components or intervening components or components may also be present. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
本技术领域技术人员可以理解，除非另外定义，这里使用的所有术语(包括技术术语和科学术语)具有与本发明所属领域中的普通技术人员的一般理解相同的意义。还应该理解的是，诸如通用字典中定义的那些术语应该被理解为具有与现有技术的上下文中的意义一致的意义，并且除非像这里一样定义，不会用理想化或过于正式的含义来解释。Those skilled in the art can understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with the meaning in the context of the prior art, and will not be interpreted in an idealized or overly formal sense unless defined as herein Explanation.
为便于对本发明实施例的理解，下面将做进一步的解释说明，且各个实施例并不构成对本发明实施例的限定。In order to facilitate the understanding of the embodiments of the present invention, further explanations will be given below, and each embodiment does not constitute a limitation to the embodiments of the present invention.
一种通过第一切削件以有效控制抛光垫的表面粗糙度的抛光垫修整装置。A polishing pad conditioning device for effectively controlling the surface roughness of the polishing pad through a first cutting member.
以下是通过特定的具体实施例来说明本发明所公开有关“抛光垫修整装置＂的实施方式，本领域技术人员可由本说明书所公开的内容了解本发明的优点与效果。本发明可通过其它不同的具体实施例加以施行或应用，本说明书中的各项细节也可基于不同观点与应用，在不悖离本发明的精神下进行各种修饰与变更。另外，本发明的附图仅为简单示意说明，并非依实际尺寸的描绘，予以声明。以下的实施方式将进一步详细说明本发明的相关技术内容，但所公开的内容并非用以限制本发明的技术范围。The implementation of the "polishing pad conditioning device" disclosed in the present invention is described below through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. In addition, the accompanying drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, and shall be declared. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the technical scope of the present invention.
应理解，虽然本文中可能使用术语第一、第二、第三等来描述各种组件或信号等，但这些组件或信号不应受这些术语限制。这些术语乃用以区分一组件与另一组件，或者一信号与另一信号。另外，如本文中所使用，术语“或”视实际情况可能包括相关联的列出项目中的任一个或者多个的所有组合。It should be understood that although the terms first, second, third, etc. may be used herein to describe various components or signals etc., these components or signals should not be limited by these terms. These terms are used to distinguish one component from another component, or one signal from another signal. In addition, as used herein, the term "or" may include all combinations of any one or more of the associated listed items depending on the actual situation.
首先，请参阅图2A、图2B、图2C以及图2D所示，本发明提供一种抛光垫修整装置，其提供一切削件(例如第一切削件22或第二切削件23)用以修整抛光垫E上的材料。举例来说，切削件可为一片状切削件。以下先以第一切削件22进行说明。第一切削件22的一顶端具有一刀刃部K以及一抵靠部223(请参阅图2D所示，例如第一抵靠部223或第二抵靠部233)。刀刃部K位于第一切削件22的顶端的一前缘处，抵靠部223与刀刃部K相邻且并列延伸。另外，抵靠部223可为一平面或一弧面。再者，刀刃部K具有一朝向基座1(请参阅图3所示)方向延伸的前刀面(例如第一前刀面222或第二前刀面232)以及一朝向所述顶端的方向延伸的后刀面(例如第一后刀面221或第二后刀面231)，且后刀面与前刀面之间可以形成一介于30～75度之间的夹角。刀刃部K的长度可介于1～20毫米(mm)之间。须说明的是，以下先以第一切削件22的第一后刀面221及第一前刀面222进行说明。First, please refer to FIG. 2A, FIG. 2B, FIG. 2C and FIG. 2D, the present invention provides a polishing pad conditioning device, which provides a cutting element (such as a first cutting element 22 or a second cutting element 23) for dressing Material on Pad E. For example, the cutter may be a sheet cutter. The first cutting element 22 will be used for description below. A top end of the first cutting element 22 has a cutting edge portion K and an abutment portion 223 (please refer to FIG. 2D , for example, the first abutment portion 223 or the second abutment portion 233 ). The blade portion K is located at a front edge of the top end of the first cutting member 22 , and the abutting portion 223 is adjacent to and extends side by side with the blade portion K. As shown in FIG. In addition, the abutting portion 223 can be a plane or an arc. Furthermore, the blade portion K has a rake face (for example, the first rake face 222 or the second rake face 232 ) extending toward the base 1 (see FIG. 3 ) and a direction toward the tip. The extended flank (for example, the first flank 221 or the second flank 231 ), and the flank and the rake may form an included angle between 30° and 75°. The length of the blade part K can be between 1-20 millimeters (mm). It should be noted that the first flank 221 and the first rake face 222 of the first cutting element 22 will be described below.
请复参阅图2A、图2B、图2C以及图2D以说明当第一切削件22的刀刃部接触于抛光垫E的待切削面之情形。图2A为本发明其中一切削件与抛光垫接触的示意图。第一切削件22的刀刃部K与抛光垫E接触时，第一前刀面222与垂直于抛光垫E的垂直线之间形成一正斜角(rake angle)θ1而第一后刀面221与抛光垫E的待切削面完全接触。藉此在切削过程中，抛光垫E上被移除的材料(切屑chip)会沿着第一前刀面222滑移至一排屑通道。附带一提，正斜角θ1可以介于0度至60度之间，更佳的是介于30～45度之间，最佳的为45度(shearangle)。藉此，通过45度的正斜角θ1，使得第一切削件22具有最佳移除材料的剪切角，且剪切力最小。另外，正斜角θ1的角度愈大，刀刃愈锋利，愈容易移除抛光垫上的材料，但刀具强度也相对变弱。Please refer again to FIG. 2A , FIG. 2B , FIG. 2C and FIG. 2D to illustrate the situation when the cutting edge portion of the first cutting member 22 contacts the surface of the polishing pad E to be cut. FIG. 2A is a schematic diagram of a cutting element in contact with a polishing pad according to the present invention. When the blade portion K of the first cutting element 22 contacts the polishing pad E, a positive rake angle (rake angle) θ1 is formed between the first rake surface 222 and a vertical line perpendicular to the polishing pad E, and the first flank surface 221 Make full contact with the surface to be cut of the polishing pad E. Therefore, during the cutting process, the removed material (chip) on the polishing pad E will slide along the first rake surface 222 to a chip removal channel. Incidentally, the positive inclination angle θ1 may be between 0° and 60°, more preferably between 30° and 45°, and most preferably 45° (shear angle). Thereby, through the positive bevel angle θ1 of 45 degrees, the first cutting member 22 has an optimal shearing angle for removing material, and the shearing force is minimum. In addition, the larger the positive bevel angle θ1 is, the sharper the cutting edge is, and the easier it is to remove the material on the polishing pad, but the strength of the cutting tool is also relatively weak.
请参阅图2B，图2B为本发明另外一切削件与抛光垫接触的示意图。第一切削件22的刀刃部K与抛光垫接触时，第一前刀面222与垂直于抛光垫E的垂直线之间形成一正斜角θ1而后刀面221与抛光垫的待切削面之间形成一逃让角(clearance or relief angle)θ2。举例来说：逃让角θ2可以大于0度，更甚至逃让角θ2的角度介于0度至15度之间，而最佳的是逃让角θ2介于3度至7度之间。藉此，在切削过程中，逃让角θ2可以减少第一后刀面221与抛光垫E的接触而影响抛光垫E上已加工的部份，同时通过逃让角θ2也避免切削件22与抛光垫E的接触面积过大而降低切削力。Please refer to FIG. 2B . FIG. 2B is a schematic view of another cutting member in contact with the polishing pad according to the present invention. When the blade portion K of the first cutting element 22 was in contact with the polishing pad, a positive bevel angle θ1 was formed between the first rake surface 222 and a vertical line perpendicular to the polishing pad E; A clearance or relief angle θ2 is formed between them. For example, the escape angle θ2 can be greater than 0 degrees, and even the escape angle θ2 is between 0 degrees and 15 degrees, and the best escape angle θ2 is between 3 degrees and 7 degrees. Thereby, during the cutting process, the escape angle θ2 can reduce the contact between the first flank surface 221 and the polishing pad E and affect the processed part on the polishing pad E, and at the same time, the escape angle θ2 also avoids the contact between the cutting piece 22 and the polishing pad E. The contact area of the polishing pad E is too large to reduce the cutting force.
请参阅图2C，图2C为本发明再一切削件与抛光垫接触的示意图。本实施例中第一切削件22具有一第一后刀面221、一第一前刀面222以及一连接于第一后刀面221与第一前刀面222之间的第一抵靠部223。当第一切削件22的刀刃部K与抛光垫E接触时，第一抵靠部223与抛光垫E的待切削面接触，且第一前刀面222与垂直于抛光垫E的垂直线之间形成一正斜角θ1而第一后刀面221与抛光垫E的待切削面之间形成一逃让角θ2。因此，当第一切削件22切削抛光垫E上的材料时，第一抵靠部223会先对具有弹性的抛光垫E造成部分隆起以定义出需要去除的材料。接着，第一前刀面222将隆起的材料移除。藉此，第一抵靠部223的设计可以避免过度移除抛光垫E上的材料及增加第一切削件22的磨耗寿命。另外值得一提的是，第一抵靠部223还可以设计成具有一圆弧的切面。换句话说，第一抵靠部223可以作为一定位结构，且该定位结构形成或设置在第一切削件22上。然而，须说明的是，在其它实施方式中，定位结构也可以形成或设置在基座1上，且凸出于基座的1上表面(请参阅实施例2，定位结构可为图11所示的定位件24)，本发明不以此为限。值得注意的是，定位结构可用于限位第一切削件22相对于抛光垫E之间的高度，因此，定位结构(例如第一抵靠部223或定位件24)的高度可低于或等于第一切削件22的高度。又或者是，定位结构(例如第一抵靠部223或定位件24)的高度可低于或等于刀刃部K的高度，然本发明不以此为限。Please refer to FIG. 2C . FIG. 2C is a schematic view of yet another cutting member of the present invention in contact with the polishing pad. In this embodiment, the first cutting element 22 has a first relief surface 221 , a first rake surface 222 and a first abutting portion connected between the first relief surface 221 and the first rake surface 222 223. When the cutting edge portion K of the first cutting element 22 was in contact with the polishing pad E, the first abutting portion 223 was in contact with the surface to be cut of the polishing pad E, and the first rake surface 222 was in contact with the vertical line perpendicular to the polishing pad E A positive bevel angle θ1 is formed between them, and an escape angle θ2 is formed between the first relief surface 221 and the surface to be cut of the polishing pad E. Therefore, when the first cutting member 22 cuts the material on the polishing pad E, the first abutting portion 223 will first partially bulge the elastic polishing pad E to define the material to be removed. Next, the first rake face 222 removes the raised material. Therefore, the design of the first abutting portion 223 can avoid excessive removal of material on the polishing pad E and increase the wear life of the first cutting member 22 . It is also worth mentioning that the first abutting portion 223 can also be designed to have a circular cut surface. In other words, the first abutting portion 223 can serve as a positioning structure, and the positioning structure is formed or disposed on the first cutting member 22 . However, it should be noted that in other embodiments, the positioning structure can also be formed or arranged on the base 1, and protrude from the upper surface of the base 1 (please refer to Example 2, the positioning structure can be as shown in Figure 11 The positioning member 24 shown), the present invention is not limited thereto. It should be noted that the positioning structure can be used to limit the height of the first cutting member 22 relative to the polishing pad E, therefore, the height of the positioning structure (such as the first abutting portion 223 or the positioning member 24) can be lower than or equal to The height of the first cutting member 22. Alternatively, the height of the positioning structure (such as the first abutting portion 223 or the positioning member 24 ) may be lower than or equal to the height of the blade K, but the invention is not limited thereto.
请参阅图2D，图2D为本发明又一切削件的刀刃部与抛光垫接触的示意图。刀刃部K具有一后刀面221、一前刀面222，且后刀面221与前刀面222之间还可以具有一倒角R(edgeradius)，且倒角的半径介于0.01～300微米(micrometer,μm)之间。其中倒角R的设计可以用以辅助第一后刀面221推切抛光垫E上多余的材料。须特别说明的是，如图2A、2B以及2C所示的第一切削件22的刀刃部K上也可以具该倒角R。本领域具有通常知识者应可依据自身的需求调整改变第一切削件22的刀刃部K，将正斜角θ1的角度、逃让角θ2的角度以及倒角R的半径选择性的设计于第一切削件22上，本发明与此不再多加赘述。Please refer to FIG. 2D . FIG. 2D is a schematic view of another cutting element of the present invention in contact with the polishing pad. The blade part K has a flank 221 and a rake face 222, and there may also be a chamfer R (edgeradius) between the flank 221 and the rake face 222, and the radius of the chamfer is between 0.01 and 300 microns (micrometer, μm). The design of the chamfer R can be used to assist the first relief surface 221 to push and cut excess material on the polishing pad E. It should be noted that the chamfer R may also be provided on the cutting edge portion K of the first cutting element 22 as shown in FIGS. 2A , 2B and 2C. Those skilled in the art should be able to adjust and change the blade portion K of the first cutting member 22 according to their own needs, and selectively design the angle of the positive bevel angle θ1, the angle of the escape angle θ2, and the radius of the chamfer R in the second On a cutting member 22, the present invention will not repeat them here.
然而，抛光垫修整装置可以具有多种不同的变化态样。举例来说，第一切削件22可以具有不同的刀刃部K。或者，第一切削件22上可以具有多个刀刃部K。又或者，抛光垫修整装置可以具有不同的排列形式。以下将通过不同的实施例一一介绍变化态样。However, the pad conditioner can have many different variations. For example, the first cutting element 22 may have different cutting edge portions K. As shown in FIG. Alternatively, a plurality of cutting edge portions K may be provided on the first cutting member 22 . Alternatively, the pad conditioning devices may have different arrangements. Variations will be introduced one by one through different embodiments below.
实施例1：Example 1:
首先，请参阅图3并配合前述图2A至图2D所示，图3为本发明实施例1的第一切削件的立体示意图。本发明实施例提供一种抛光垫修整装置Z，其包括:一基座1以及第一切削件22。第一切削件22顶端具有一刀刃部K以及一抵靠部223(请参阅图2C及图2D)，刀刃部K位于第一切削件22的顶端的前缘处，刀刃部K具有一朝向基座1方向延伸的第一前刀面222以及一朝向所述顶端的方向延伸的第一后刀面221。其中第一后刀面221会与抛光垫E接触，且通过第一前刀面222切削移除抛光垫E上的材料。于此实施例中，刀刃部K具有介于0度至60度的正斜角θ1，以及具有介于0度至15度θ2之间的逃让角。于其它实施例中，第一切削件也可以具有如图2D所示的倒角R结构。本发明在此不做任何限制。First, please refer to FIG. 3 and in conjunction with the above-mentioned FIG. 2A to FIG. 2D , FIG. 3 is a schematic perspective view of the first cutting member according to Embodiment 1 of the present invention. An embodiment of the present invention provides a polishing pad dressing device Z, which includes: a base 1 and a first cutting member 22 . The top end of the first cutting element 22 has a blade portion K and an abutment portion 223 (see FIG. 2C and FIG. 2D ). The blade portion K is located at the front edge of the top end of the first cutting element 22. A first rake surface 222 extending toward the seat 1 and a first relief surface 221 extending toward the top end. The first rake surface 221 is in contact with the polishing pad E, and the material on the polishing pad E is removed by cutting through the first rake surface 222 . In this embodiment, the blade portion K has a positive inclination angle θ1 ranging from 0° to 60°, and an escape angle ranging from 0° to 15° θ2. In other embodiments, the first cutting element may also have a chamfered R structure as shown in FIG. 2D . The present invention is not limited in any way here.
承上述，本实施例中第一切削件22可以通过黏贴的方式直接设置在基座1上。于其它实施例中，第一切削件22也可以通过嵌入或者通过卡固的方式设置在基座1上。本领域具有通常知识者应可自行简单变化将第一切削件22设置在基座1上，本发明不以此为限。Based on the above, in this embodiment, the first cutting member 22 can be directly disposed on the base 1 by sticking. In other embodiments, the first cutting member 22 may also be disposed on the base 1 by embedding or clamping. Those skilled in the art can simply change the first cutting member 22 on the base 1 by themselves, and the present invention is not limited thereto.
实施例2：Example 2:
请参阅图4，图4为本发明实施例2的抛光垫修整装置的立体分解图。本发明实施例提供一种抛光垫修整装置Z，其包括:一基座1以及多个修整组件2。每一个修整组件2包括一设置在基座1上的承载组件21以及一设置在承载组件21上的第一切削件22，第一切削件22与承载组件21的间形成一排屑通道g。Please refer to FIG. 4 . FIG. 4 is an exploded perspective view of a polishing pad conditioning device according to Embodiment 2 of the present invention. An embodiment of the present invention provides a polishing pad conditioning device Z, which includes: a base 1 and a plurality of conditioning components 2 . Each trimming assembly 2 includes a carrying assembly 21 disposed on the base 1 and a first cutting element 22 disposed on the carrying assembly 21 , a chip removal channel g is formed between the first cutting element 22 and the carrying assembly 21 .
承接上述，基座1上具有多个容置凹槽11，且多个修整组件2分别设置在多个容置凹槽11内。举例来说，修整组件2可以用卡合、黏合、卡固、嵌入、黏贴、螺设等不同方式让修整组件2设置于容置凹槽11之中。因此，每一个修整组件2可拆卸地设置在相对应的容置凹槽11内。附带一提，修整组件2可以成对的设置在基座1上，以保持整个基座1的平衡，避免高速旋转时所产生的震动。Following the above, the base 1 has a plurality of accommodating grooves 11 , and a plurality of trimming components 2 are respectively disposed in the plurality of accommodating grooves 11 . For example, the trimming component 2 can be arranged in the accommodating groove 11 in different ways such as snapping, bonding, clamping, embedding, sticking, screwing and the like. Therefore, each trimming assembly 2 is detachably disposed in the corresponding accommodating groove 11 . Incidentally, the trimming components 2 can be arranged on the base 1 in pairs, so as to maintain the balance of the entire base 1 and avoid vibration generated during high-speed rotation.
请参阅图5，图5为本发明实施例2的修整组件的立体图。每一个修整组件2包括承载组件21以及第一切削件22。承载组件21具有一第一凸部211以及一与第一凸部211彼此分离的第二凸部212，且排屑通道g设置在第一凸部211以及第二凸部212之间。并且，第一切削件22跨设于排屑通道g上，且设置于第一凸部211以及第二凸部212上。再者，第一切削件22还可以设计成可拆卸地设置在承载组件21上。详言之，第一切削件22的顶端的前缘处具有一刀刃部K，刀刃部K具有一朝向所述顶端的方向延伸的第一后刀面221以及一朝向承载组件21方向延伸的第一前刀面222。其中第一后刀面221会与抛光垫E接触，且通过第一前刀面222切削移除抛光垫E上的材料。藉此，第一前刀面222整面移除抛光垫E上的材料使得抛光垫E更平坦，且切削后的材料可以通过排屑通道g排出。附带一提，第一切削件22的长度D 1可以为1毫米(mm)～20毫米(mm)之间，且刀刃部K的长度可以与第一切削件22的长度完全相同，或者小于第一切削件22，本发明并不以此为限制。并且，第一切削件22的刀刃部K的材料可以选用为单晶钻石、聚晶钻石(Polycrystalline Diamond,PCD)、CVD钻石(chemicalvapor deposition diamond(化学气相沈积钻石法))、硬质合金切削件结合镀CVD钻石膜、(PCD)聚晶钻石切削件结合镀CVD钻石膜、陶瓷材料结合镀CVD钻石膜或者其它材料镀CVD钻石，本发明并不以此为限制。Please refer to FIG. 5 . FIG. 5 is a perspective view of the trimming assembly according to Embodiment 2 of the present invention. Each dressing assembly 2 includes a carrier assembly 21 and a first cutting element 22 . The carrier assembly 21 has a first protruding portion 211 and a second protruding portion 212 separated from the first protruding portion 211 , and the chip removal channel g is disposed between the first protruding portion 211 and the second protruding portion 212 . Moreover, the first cutting element 22 straddles the chip removal channel g, and is disposed on the first convex portion 211 and the second convex portion 212 . Furthermore, the first cutting member 22 can also be designed to be detachably arranged on the bearing assembly 21 . In detail, the front edge of the top end of the first cutting element 22 has a blade portion K, and the blade portion K has a first relief surface 221 extending toward the direction of the top end and a first relief surface 221 extending toward the direction of the bearing assembly 21. A rake face 222 . The first rake surface 221 is in contact with the polishing pad E, and the material on the polishing pad E is removed by cutting through the first rake surface 222 . In this way, the first rake surface 222 removes the material on the polishing pad E to make the polishing pad E flatter, and the cut material can be discharged through the chip discharge channel g. Incidentally, the length D1 of the first cutting member 22 can be between 1 millimeter (mm) and 20 millimeters (mm), and the length of the blade portion K can be exactly the same as the length of the first cutting member 22, or shorter than that of the first cutting member 22. A cutting element 22, the present invention is not limited thereto. And, the material of the blade portion K of the first cutting member 22 can be selected as single crystal diamond, polycrystalline diamond (Polycrystalline Diamond, PCD), CVD diamond (chemical vapor deposition diamond (chemical vapor deposition diamond method)), cemented carbide cutting Parts combined with CVD diamond-coated film, (PCD) polycrystalline diamond cutting parts combined with CVD diamond-coated film, ceramic materials combined with CVD diamond-coated film or other materials coated with CVD diamond, the present invention is not limited thereto.
须特别说明的是，于本实施例中的第一切削件的刀刃部K设计如图2B所示的结构，具有角度介于0度至15度之间或1度至15度之间的逃让角θ2。然而，于其它实施例中第一切削件22的刀刃部K的设计可以如图2A或图2C所示，或者是第一切削件22的刀刃部K也可以设计为具有如2D所示的倒角R结构，本领域具有通常知识者应可依实际情况自行变化，在此不再多加赘述。It should be noted that the blade portion K of the first cutting member in this embodiment is designed as shown in FIG. Angle θ2. However, in other embodiments, the design of the cutting edge portion K of the first cutting element 22 can be as shown in FIG. 2A or FIG. The angle R structure can be changed by those skilled in the art according to the actual situation, and no further details are given here.
接续上述，修整组件2可以有多种不同的变化态样以提升切削移除抛光垫E上材料的效率，以及增加抛光垫修整装置的应用广度。举例来说，请一并配合图5，并参阅图6、图7以及图8，图6为本发明实施例2的修整组件具有一个第一前刀面的侧视图。图7为本发明实施例2的修整组件具有两个第一前刀面的侧视图。图8为本发明实施例2的修整组件具有第一前刀面以及第一抵靠部的侧视图。Continuing from the above, the dressing assembly 2 can have many different variations to improve the efficiency of cutting and removing materials on the polishing pad E, and to increase the application range of the polishing pad conditioning device. For example, please refer to FIG. 5 together with FIG. 6 , FIG. 7 and FIG. 8 . FIG. 6 is a side view of a dressing assembly according to Embodiment 2 of the present invention with a first rake face. Fig. 7 is a side view of the dressing assembly according to Embodiment 2 of the present invention with two first rake surfaces. Fig. 8 is a side view of the dressing assembly according to Embodiment 2 of the present invention with the first rake surface and the first abutting portion.
如图6所示，第一切削件22具有一个刀刃部K，且刀刃部K上具有一第一前刀面222，且第一前刀面222由刀刃部K的顶端延伸至承载组件21上。同样地，图6所示的实施例中的第一切削件22具有角度介于0度至15度之间的逃让角θ2。于其它实施例中，第一切削件22也可以设计成不具有逃让角θ2，或者第一切削件22的刀刃部K可以设计具有半径介于0.01～300微米的倒角R结构。本发明对于第一切削件22的设计可有任意变化，于此不再多加赘述。As shown in FIG. 6 , the first cutting member 22 has a blade portion K, and the blade portion K has a first rake surface 222 , and the first rake surface 222 extends from the top end of the blade portion K to the carrier assembly 21. . Likewise, the first cutting element 22 in the embodiment shown in FIG. 6 has an escape angle θ2 between 0° and 15°. In other embodiments, the first cutting element 22 may also be designed without escape angle θ2, or the cutting edge K of the first cutting element 22 may be designed to have a chamfer R structure with a radius of 0.01-300 microns. In the present invention, the design of the first cutting member 22 can be changed arbitrarily, so no more details are given here.
如图7所示，第一切削件22具有两个刀刃部K，且每一个刀刃部K上都具有第一前刀面222。两个第一前刀面222分别由第一后刀面221延伸至承载组件21上。于本实施例中，两个第一前刀面222分别与承载组件21所形成的角度θ3相同。于其它实施例中，两个第一前刀面222分别与承载组件21所形成的角度θ3也可以有所不同。As shown in FIG. 7 , the first cutting element 22 has two cutting edge portions K, and each cutting edge portion K has a first rake surface 222 . The two first rake surfaces 222 respectively extend from the first relief surfaces 221 to the bearing assembly 21 . In this embodiment, the angle θ3 formed by the two first rake surfaces 222 and the carrying component 21 is the same. In other embodiments, the angle θ3 formed between the two first rake surfaces 222 and the carrying component 21 may also be different.
如图8所示，修整组件2上只有一个第一切削件22，且第一切削件22具有一第一前刀面222。以图8的实施例而言，定位结构可形成在修整组件2上，进一步来说，定位结构可形成在第一切削件22上，以下以定位结构为第一抵靠部223进行说明。详细来说，第一切削件22的顶端具有至少一第一抵靠部223(定位结构)，且至少一第一抵靠部223与至少一第一前刀面222彼此相连，且第一抵靠部223的高度低于或等于刀刃部K的高度。再者，第一抵靠部223连接于第一后刀面221与第一前刀面222之间。附带一提，图8所示的第一切削件22上也可以如同图7所示的第一切削件22般具有两个第一前刀面222，且两个第一前刀面222都各别具有第一抵靠部223，其可结合图4以及图5以完成，于此不再多加赘述。图8所示的实施例中的第一切削件22还可以设计具有角度介于0度至15度之间的逃让角θ2。或者，第一切削件22的刀刃部K可以设计具有半径介于0.01～300微米的倒角R结构。本发明对于第一切削件22的设计可有任意变化，于此不再多加赘述。As shown in FIG. 8 , there is only one first cutting element 22 on the trimming assembly 2 , and the first cutting element 22 has a first rake surface 222 . Taking the embodiment of FIG. 8 as an example, the positioning structure can be formed on the trimming assembly 2 , further speaking, the positioning structure can be formed on the first cutting member 22 , and the positioning structure will be described as the first abutting portion 223 below. Specifically, the top end of the first cutting element 22 has at least one first abutting portion 223 (positioning structure), and at least one first abutting portion 223 is connected to at least one first rake face 222, and the first abutting portion The height of the rest portion 223 is lower than or equal to the height of the blade K. Furthermore, the first abutting portion 223 is connected between the first relief surface 221 and the first rake surface 222 . Incidentally, the first cutting element 22 shown in FIG. 8 may also have two first rake surfaces 222 like the first cutting element 22 shown in FIG. 7 , and the two first rake surfaces 222 are each It also has a first abutting portion 223 , which can be completed in combination with FIG. 4 and FIG. 5 , and will not be repeated here. The first cutting element 22 in the embodiment shown in FIG. 8 can also be designed to have an escape angle θ2 between 0° and 15°. Alternatively, the cutting edge portion K of the first cutting element 22 may be designed to have a chamfer R structure with a radius of 0.01-300 microns. In the present invention, the design of the first cutting member 22 can be changed arbitrarily, so no more details are given here.
实施例3：Example 3:
请参阅图9以及图10，图9为本发明实施例3的修整组件的立体图。图10为本发明实施例3的修整组件的侧视图。每一个修整组件2还包括一第二切削件23，且第二切削件23与第一切削件22彼此相邻设置。同样地，第二切削件23跨设于排屑通道g上，且设置于第一凸部211以及第二凸部212上。再者，第二切削件23也可以设计成可拆卸地设置在承载组件21上。并且，修整组件2的第一切削件22可以具有至少一第一前刀面222，第二切削件23具有至少一第二前刀面232。另外，须说明的是，在其它实施方式中也可以不用设置排屑通道g，而是直接将第一切削件22及第二切削件23设置于承载组件21上。Please refer to FIG. 9 and FIG. 10 , FIG. 9 is a perspective view of the trimming assembly according to Embodiment 3 of the present invention. Fig. 10 is a side view of a trimming assembly according to Embodiment 3 of the present invention. Each trimming assembly 2 further includes a second cutting element 23 , and the second cutting element 23 and the first cutting element 22 are disposed adjacent to each other. Likewise, the second cutting element 23 straddles the chip removal channel g, and is disposed on the first protrusion 211 and the second protrusion 212 . Moreover, the second cutting member 23 can also be designed to be detachably arranged on the bearing assembly 21 . Furthermore, the first cutting element 22 of the trimming assembly 2 may have at least one first rake face 222 , and the second cutting element 23 may have at least one second rake face 232 . In addition, it should be noted that in other embodiments, the first cutting element 22 and the second cutting element 23 may be directly arranged on the bearing assembly 21 instead of providing the chip removal channel g.
承接上述，于实施例3中第一切削件22与第二切削件23可以具有完全相同的结构。第二切削件23的结构可参考前述针对第一切削件22的多种态样(如图6至图8所示)。举例来说，复请参阅图7，第一切削件22的顶端具有至少一第一抵靠部223，至少一第一抵靠部223与至少一第一前刀面222彼此相连，第二切削件23的顶端具有至少一第二抵靠部233，且至少一第二抵靠部233与至少一第二前刀面232彼此相连。又或者，于其它实施例中第一切削件22与第二切削件23可以具有不相同的结构。举例来说，第一切削件22设计如图6所示而第二切削件设计如图7所示。本领域具有通常知识者可依实际上需求调整设计第一切削件22与第二切削件23的结构，本发明并不以此为限制。Following the above, in the third embodiment, the first cutting element 22 and the second cutting element 23 may have exactly the same structure. The structure of the second cutting member 23 can refer to the aforementioned various aspects of the first cutting member 22 (as shown in FIGS. 6 to 8 ). For example, please refer to FIG. 7 again, the top end of the first cutting member 22 has at least one first abutting portion 223, at least one first abutting portion 223 is connected to at least one first rake face 222, the second cutting The top end of the member 23 has at least one second abutting portion 233 , and the at least one second abutting portion 233 and at least one second rake surface 232 are connected to each other. Alternatively, in other embodiments, the first cutting element 22 and the second cutting element 23 may have different structures. For example, the first cutting element 22 is designed as shown in FIG. 6 and the second cutting element is designed as shown in FIG. 7 . Those skilled in the art can adjust and design the structures of the first cutting member 22 and the second cutting member 23 according to actual needs, and the present invention is not limited thereto.
实施例4：Example 4:
请参阅图11以及图12，图11为本发明实施例4的修整组件的立体图。图12为本发明实施例4的修整组件的其中一侧视示意图。于实施例4中，修整组件2具有一第一切削件22以及一定位结构，以图11及图12的实施例而言，定位结构可形成在修整组件2上，进一步来说，定位结构可形成在承载组件21上，以下以定位结构为定位件24进行说明。详细来说，定位件24(定位结构)的高度可低于或等于第一切削件22的高度，定位件24与第一切削件22并列设置在承载组件21上，用以控制第一切削件22相对于定位件24的高度差，并限制第一切削件22凸出定位件24的切削深度。更详细的来说，定位件24设置在第一切削件22的前方，因此当修整组件2与研磨垫接触时，定位件24会先接触研磨垫的待切削面，以压平凹凸不均的待切削面。接着，第一切削件22会进行切削定位件24所限制的高度差，藉以控制第一切削件22凸出于定位件24的切削深度。值得说明的是，在其它实施方式中，定位结构(定位件24)也可以具有一切削结构C，该切削结构C具有与第一切削件22的刀刃部K相同移除材料的效果。Please refer to FIG. 11 and FIG. 12 , FIG. 11 is a perspective view of the trimming assembly according to Embodiment 4 of the present invention. Fig. 12 is a schematic side view of the trimming assembly according to Embodiment 4 of the present invention. In Embodiment 4, the trimming assembly 2 has a first cutting element 22 and a positioning structure. In the embodiment of FIG. 11 and FIG. 12, the positioning structure can be formed on the trimming assembly 2. Further, the positioning structure can be It is formed on the carrier assembly 21 , and the positioning structure is used as the positioning member 24 for description below. In detail, the height of the positioning member 24 (positioning structure) can be lower than or equal to the height of the first cutting member 22, and the positioning member 24 and the first cutting member 22 are arranged side by side on the carrier assembly 21 to control the height of the first cutting member 22. 22 relative to the positioning piece 24, and limit the cutting depth of the first cutting piece 22 protruding from the positioning piece 24. In more detail, the positioning piece 24 is arranged in front of the first cutting piece 22, so when the dressing assembly 2 contacts the grinding pad, the positioning piece 24 will first contact the surface to be cut of the grinding pad to flatten the uneven surface. Surface to be cut. Then, the first cutting part 22 will cut the height difference limited by the positioning part 24 , so as to control the cutting depth of the first cutting part 22 protruding from the positioning part 24 . It is worth noting that, in other embodiments, the positioning structure (positioning member 24 ) may also have a cutting structure C, which has the same material removal effect as the cutting edge portion K of the first cutting member 22 .
接续上述，可以通过改变第一切削件22和承载组件21之间的高度与定位件24和承载组件21之间的高度以控制待切削的深度。举例来说，第一切削件22的顶端与承载组件21之间的距离为第一距离h1，定位件24的一顶面241与承载组件21之间的距离为第二距离h2，其中如图12所示，第一距离h1可大于第二距离h2。然而，于其它实施例中第一距离h1与第二距离h2可以相同或是第一距离h1略低于第二距离h2。因此，通过第一距离h1与第二距离h2之差值，第一切削件22的切削深度可以设定为该差值。第一距离h1与第二距离h2的差值可以介于0微米至100微米(micrometer,μm)之间，较佳地，第一距离h1与第二距离h2的差值可以介于20微米至50微米之间，换句话说，定位结构(定位件24或第一抵靠部223)的高度可低于第一切削件22的顶面0微米至100微米之间，或可低于第一切削件22的顶面20微米至50微米之间。附带一提，通过定位件24还可以以避免修整组件2的第一切削件22刺入抛光垫E过深，移除过多抛光垫E上的材料。另外，值得说明的是，定位件24的一顶面241可为一平面或是一弧面，本发明不以此为限。Following the above, the depth to be cut can be controlled by changing the height between the first cutting member 22 and the bearing assembly 21 and the height between the positioning member 24 and the bearing assembly 21 . For example, the distance between the top end of the first cutting member 22 and the bearing assembly 21 is the first distance h1, and the distance between a top surface 241 of the positioning member 24 and the bearing assembly 21 is the second distance h2, as shown in FIG. As shown in 12, the first distance h1 may be greater than the second distance h2. However, in other embodiments, the first distance h1 and the second distance h2 may be the same or the first distance h1 may be slightly lower than the second distance h2. Therefore, by the difference between the first distance h1 and the second distance h2, the cutting depth of the first cutting member 22 can be set to the difference. The difference between the first distance h1 and the second distance h2 can be between 0 micrometer and 100 micrometers (micrometer, μm). Preferably, the difference between the first distance h1 and the second distance h2 can be between 20 micrometers and 100 micrometers. In other words, the height of the positioning structure (positioning part 24 or first abutting portion 223) can be lower than the top surface of the first cutting part 22 between 0 micron and 100 microns, or can be lower than the first cutting part 22. The top surface of the cutting element 22 is between 20 microns and 50 microns. Incidentally, the positioning member 24 can also prevent the first cutting member 22 of the trimming assembly 2 from penetrating too deeply into the polishing pad E, thereby removing too much material on the polishing pad E. In addition, it is worth noting that a top surface 241 of the positioning member 24 can be a plane or an arc surface, and the present invention is not limited thereto.
另外，请先参阅图17所示，定位件24(定位结构)也可以具有一微结构层U，举例来说，微结构层U可以是一磨削微结构，，且通过定位件24上的磨削微结构与抛光垫E的待切削面接触，可以使得待切削面上多余的材料被定位件24所梳立。接着，第一切削件22将抛光垫E上被梳立的材料切除。值得说明的是，前述抵靠部223也可以具有一微结构层U，以达到上述效果。藉此，通过磨削的机制可产生犁切作用。微结构层U是一梳状结构。值得说明的是，微结构层U也可以是一呈粗糙状的微结构、呈颗粒状的微结构、呈数组状的微结构、呈锯齿型状的微结构、呈金字塔状的微结构或者是呈不规则状的微结构，本发明不以此为限。In addition, please refer to Fig. 17 first, the positioning member 24 (positioning structure) can also have a microstructure layer U, for example, the microstructure layer U can be a grinding microstructure, and through the positioning member 24 The grinding microstructure is in contact with the surface to be cut of the polishing pad E, so that the excess material on the surface to be cut can be combed by the positioning member 24 . Next, the first cutting member 22 cuts off the combed material on the polishing pad E. As shown in FIG. It is worth noting that the aforesaid abutting portion 223 may also have a microstructure layer U to achieve the above effect. Thereby, a plowing action can be produced by the mechanism of grinding. The microstructure layer U is a comb structure. It is worth noting that the microstructure layer U can also be a rough microstructure, a granular microstructure, an array-like microstructure, a zigzag microstructure, a pyramidal microstructure or Irregular microstructures, the present invention is not limited thereto.
本领域技术人员应理解，以上所述只是抛光垫修整装置一典型实施态样而已，本发明的后续应用可以在不同的实施态样上具有各种的变化。Those skilled in the art should understand that the above is only a typical implementation of the polishing pad conditioning device, and the subsequent application of the present invention may have various changes in different implementations.
实施例5：Example 5:
举例来说，请参阅图13以及图14，图13为本发明实施例5的修整组件的立体图。图14为本发明实施例5的抛光垫修整装置的立体组合图。如图13所示，修整组件2’具有一承载组件21’以及一设置于承载组件21’上的第一切削件22’。承载组件21’具有一平坦部213’以及一相邻于平坦部213’的第一凸部211’。平坦部213’上具有至少一锁孔214’，藉由锁孔214’用以将修整组件2’螺固于基座上。以实施例5而言，锁孔214’可包括一第一锁孔2141’、一第二锁孔2142’以及一第三锁孔2143’。藉此，使得承载组件21’具有并列的第一锁孔2141’、一第二锁孔2142’以及一第三锁孔2143’，以用以将第一切削件22’固设在基座1’上。举例来说，可先利用一固定件(螺锁件)穿过第二锁孔2142’后将第一切削件22’固设在基座1’上。接着，再利用另外两个固定件穿过第一锁孔2141’及第三锁孔2143’，以调整第一切削件22’的水平高度。须说名的是，每一个设置于基座1’上的第一切削件22’优选为保持在同一水平高度上。另外，第一切削件22’设置于第一凸部211’上，第一切削件22’具有一刀刃部K’设计成一半径介于10～100毫米(millimeter，mm)之间的圆弧边缘T。刀刃部K’具有第一后刀面221’以及第一前刀面222’，且第一后刀面221’与第二前刀面222’连接以形成一弧形刀刃部K。通过第一后刀面221’与抛光垫E的待切削面接触，第二前刀面222’可以切削多余的材料，且切削可以顺着第一凸部211’上的一斜切面215’滑移。值得一提的是，第二前刀面222’与斜切面215’可以具有相同的斜率并相互连接。又或者，第二前刀面222’与斜切面215’可以具有不同的斜率。其中承载组件21’还具有一排削切面216’，排削切面216’连接于斜切面215’与第一凸部211’之间。当第一切削件22’切削抛光垫E多于材质时，藉由排削切面216’以及斜切面215’可以辅助切削经由排削切面216’以及斜切面215’滑动排除。For example, please refer to FIG. 13 and FIG. 14 . FIG. 13 is a perspective view of a trimming assembly according to Embodiment 5 of the present invention. Fig. 14 is a three-dimensional combined view of the polishing pad conditioning device according to Embodiment 5 of the present invention. As shown in Figure 13, the trimming assembly 2' has a carrying assembly 21' and a first cutting element 22' disposed on the carrying assembly 21'. The carrying component 21' has a flat portion 213' and a first convex portion 211' adjacent to the flat portion 213'. There is at least one lock hole 214' on the flat part 213', and the lock hole 214' is used to screw the trimming component 2' on the base. For example 5, the lock hole 214' may include a first lock hole 2141', a second lock hole 2142' and a third lock hole 2143'. In this way, the carrier assembly 21' has a first locking hole 2141', a second locking hole 2142' and a third locking hole 2143' in parallel to fix the first cutting part 22' on the base 1 'superior. For example, a fixing piece (screw lock piece) can be used to pass through the second locking hole 2142' first, and then the first cutting piece 22' can be fixed on the base 1'. Then, another two fixing pieces are used to pass through the first locking hole 2141' and the third locking hole 2143' to adjust the level of the first cutting piece 22'. It should be noted that each of the first cutting elements 22' disposed on the base 1' is preferably maintained at the same level. In addition, the first cutting part 22' is disposed on the first convex part 211', and the first cutting part 22' has a cutting edge part K' designed as a circular arc edge with a radius between 10-100 millimeters (mm). T. The blade portion K' has a first relief surface 221' and a first rake surface 222', and the first relief surface 221' is connected to the second rake surface 222' to form an arc-shaped blade portion K. Through the contact of the first flank 221' with the surface to be cut of the polishing pad E, the second rake surface 222' can cut excess material, and the cutting can slide along a beveled surface 215' on the first protrusion 211' shift. It is worth mentioning that the second rake surface 222' and the chamfered surface 215' may have the same slope and be connected to each other. Alternatively, the second rake surface 222' and the chamfered surface 215' may have different slopes. The bearing component 21' also has a row of cutting surfaces 216', and the row of cutting surfaces 216' is connected between the chamfered surface 215' and the first convex portion 211'. When the first cutting member 22' cuts more polishing pad E than the material, the cutting surface 216' and the beveled surface 215' can assist the cutting to be slidably eliminated through the beveled surface 216' and the beveled surface 215'.
请参阅图14所示，抛光垫修整装置Z’具有两两对称排列的修整组件2’，且每一个修整组件2’的前方都分别具有一定位结构，以下以定位结构为定位件3’进行说明。详细来说，以图14的实施例来说，定位件3’(定位结构)可形成在基座1’上，且定位件3’的高度可低于或等于刀刃部K’的高度。修整组件2’可通过一螺丝(图中未标号)螺固于锁孔214’内，以螺合修整组件2’与基座1’。附带一提，定位件3’与修整组件2’之间具有一预定距离，使得第一前刀面222’、斜切面215’和定位件3’之间会形成一空间。因此当第一前刀面222’所切削后的材料可以滑移至定位件3’与修整组件2’所形成的空间中，使得此预定距离类似于前述实施例中的排屑通道g。另外，值得说明的是，定位件3’(定位结构)的一顶面(图中未标号)可为一平面或一弧面。进一步来说，定位件3’的位置也非得如图式所示的设置于修整组件2’前端，在其它实施方式中定位件3”也可以设置于两个修整组件2’之间，或是将定位件3”’设置于基座1’的中间。须注意的是，定位件3’、定位件3”、定位件3”’可以择一设置或是依需求而选择性的设置。值得说明的是，在其它实施方式中，定位结构(定位件3’,3”,3”’)也可以具有一切削结构C(图14中未示出，请参阅图12所示)，该切削结构C具有与第一切削件22的刀刃部K相同的切削效果。需注意的是，定位件3’也可以设置有如同前述实施例所述的微结构层U。Please refer to Fig. 14, the polishing pad dressing device Z' has dressing assemblies 2' symmetrically arranged in pairs, and each dressing assembly 2' has a positioning structure in front of it. illustrate. In detail, in the embodiment of Fig. 14, the positioning member 3' (positioning structure) can be formed on the base 1', and the height of the positioning member 3' can be lower than or equal to the height of the blade K'. The trimming component 2' can be screwed in the locking hole 214' by a screw (not labeled in the figure), so as to screw the trimming component 2' and the base 1'. Incidentally, there is a predetermined distance between the positioning member 3' and the trimming assembly 2', so that a space is formed between the first rake surface 222', the chamfered surface 215' and the positioning member 3'. Therefore, the material cut by the first rake surface 222' can slide into the space formed by the positioning member 3' and the trimming assembly 2', so that the predetermined distance is similar to the chip removal channel g in the foregoing embodiment. In addition, it is worth noting that a top surface (not labeled in the figure) of the positioning member 3' (positioning structure) can be a plane or an arc. Furthermore, the position of the positioning element 3' does not have to be arranged at the front end of the trimming assembly 2' as shown in the figure. In other embodiments, the positioning element 3" can also be arranged between the two trimming assemblies 2', or Set the positioning part 3"' in the middle of the base 1'. It should be noted that the positioning member 3', the positioning member 3", and the positioning member 3"' can be selected or selectively provided according to requirements. It is worth noting that, in other embodiments, the positioning structure (positioning member 3', 3", 3"') may also have a cutting structure C (not shown in FIG. 14, please refer to FIG. 12), the The cutting structure C has the same cutting effect as the cutting edge portion K of the first cutting element 22 . It should be noted that the positioning member 3' can also be provided with the microstructure layer U as described in the previous embodiments.
实施例6：Embodiment 6:
再者，抛光垫修整装置Z上的修整组件还可以有不同的排列方式以加强加工抛光垫的效率。请参阅图15，图15为本发明实施例6的抛光垫修整装置的立体组合图。修整组件2可以排列成放射状的设置在基座1上，例如:顺时针或逆时针。于本实施例中，将修整组件2呈逆时针的设置于基座1上，可以使得抛光垫修整装置M于抛光垫上旋转时，通过切线运动将切屑排出。于其它实施例中，修整组件2也可以通过其它的排列方式设置在基座1上，以增加加工抛光垫时候的效率。本领域具有通常知识者可依实际上的需求调整设计修整组件2的排列方式，只要修整组件2呈现对称方式或平均分布在基座上面以避免震动即可，本发明并不以此为限制。Furthermore, the dressing components on the polishing pad dressing device Z can also be arranged in different ways to enhance the efficiency of processing the polishing pad. Please refer to FIG. 15 . FIG. 15 is a three-dimensional assembled view of a polishing pad conditioning device according to Embodiment 6 of the present invention. The trimming assembly 2 can be arranged on the base 1 radially, for example: clockwise or counterclockwise. In this embodiment, the dressing assembly 2 is arranged counterclockwise on the base 1, so that when the polishing pad dressing device M rotates on the polishing pad, chips can be discharged through tangential motion. In other embodiments, the trimming assembly 2 can also be arranged on the base 1 in other arrangements, so as to increase the efficiency when processing the polishing pad. Those skilled in the art can adjust and design the arrangement of the trimming components 2 according to actual needs, as long as the trimming components 2 are symmetrical or evenly distributed on the base to avoid vibration, the present invention is not limited thereto.
实施例7：Embodiment 7:
请参阅图16所示，图16为本发明实施例7的修整组件的立体图。修整组件2”具有一第一切削件22”，第一切削件22”具有一刀刃部K”、一第一后刀面221”及一第一前刀面222”，刀刃部K”、第一后刀面221”及第一前刀面222”的特征如同前述实施例所述，在此容不再赘述。值得注意的是，第一切削件22”的材质可选自金属(例如但不限于：钼(Molybdenum,Mo)、铁(Fe)或钒(Vanadium,V))、合金(例如但不限于：碳化钨(Tungsten Carbide,WC))、聚晶钻石(Polycrystalline Diamond,PCD)、陶瓷(例如但不限于：碳化硅(Silicon carbide,SiC)或氧化铝(Al2O3))。再者，第一切削件22”上还可设置有一薄膜层P，举例来说，该薄膜层P可以为一钻石膜，且钻石膜可以是CVD钻石、多晶钻石或奈米钻石等，本发明不以此为限。值得注意的是，薄膜层P也可以完全包覆抛光垫修整装置Z或覆盖第一切削件22”，本发明不以薄膜层P是否完全包覆第一切削件22”或仅覆盖刀刃部K”为限。换句话说，抛光垫修整装置Z的整体外表面可以镀上一层薄膜层P。Please refer to FIG. 16 , which is a perspective view of a trimming assembly according to Embodiment 7 of the present invention. The trimming assembly 2" has a first cutting element 22", the first cutting element 22" has a blade portion K", a first relief surface 221" and a first rake surface 222", the blade portion K", the The features of a flank 221 ″ and the first rake face 222 ″ are the same as those described in the foregoing embodiments, and will not be repeated here. It should be noted that the material of the first cutting element 22 ″ can be selected from metal (such as but Not limited to: molybdenum (Molybdenum, Mo), iron (Fe) or vanadium (Vanadium, V)), alloys (such as but not limited to: tungsten carbide (Tungsten Carbide, WC)), polycrystalline diamond (Polycrystalline Diamond, PCD), Ceramics (such as but not limited to: silicon carbide (Silicon carbide, SiC) or aluminum oxide (Al2 O3 )). Furthermore, a film layer P can also be arranged on the first cutting part 22 ", for example, the film layer P can be a diamond film, and the diamond film can be CVD diamond, polycrystalline diamond or nano-diamond, etc. The invention is not limited to this. It should be noted that the film layer P can also completely cover the polishing pad conditioning device Z or cover the first cutting part 22 ", and whether the present invention completely covers the first cutting part 22 with the film layer P "Or only cover the blade part K". In other words, the entire outer surface of the pad conditioner Z may be coated with a thin film layer P.
值得说明的是，第一切削件22”还包括一平坦部224，且平坦部224上具有至少一锁孔225，通过锁孔225的设置可用以将修整组件2”螺固于基座上。以实施例7而言，锁孔225可包括一第一锁孔2251、一第二锁孔2252以及一第三锁孔2253。藉此，以用以将第一切削件22”固设在基座上，也可以调整高度水平。It is worth noting that the first cutting member 22" also includes a flat portion 224, and the flat portion 224 has at least one locking hole 225, and the setting of the locking hole 225 can be used to screw the trimming assembly 2" onto the base. In the seventh embodiment, the lock hole 225 may include a first lock hole 2251 , a second lock hole 2252 and a third lock hole 2253 . Thereby, the first cutting element 22" can be fixed on the base, and the height level can also be adjusted.
本发明的其中一有益效果在于，本发明实施例所提供的抛光垫修整装置，其可通过“所述定位结构(第一抵靠部223、定位件24或定位件3’)形成在所述切削件(第一切削件22或第二切削件23)上或所述基座(1,1’)上，其中所述定位结构的高度低于或等于所述切削件的刀刃部(k,K’,K”)的高度＂的技术手段，可以将抛光垫E上多余的材料切削而不会产生隆起，使得抛光垫E的抛光面能够较为平坦，以有效控制抛光垫E的表面粗糙度。One of the beneficial effects of the present invention is that the polishing pad conditioning device provided by the embodiment of the present invention can be formed on the said positioning structure (the first abutting portion 223, the positioning member 24 or the positioning member 3') On the cutting element (the first cutting element 22 or the second cutting element 23) or on the base (1, 1'), wherein the height of the positioning structure is lower than or equal to the cutting edge portion (k, K', K") "height" technical means can cut the excess material on the polishing pad E without bulging, so that the polishing surface of the polishing pad E can be relatively flat, so as to effectively control the surface roughness of the polishing pad E .
【符号说明】【Symbol Description】
抛光垫修整 Q、Z、Z’Pad Conditioning Q, Z, Z’
装置device
基座 1、1’ 容置凹槽 11Base 1, 1’ receiving recess 11
修整组件 2、2’、2” 承载组件 21、21’Trim Assembly 2, 2’, 2” Carrier Assembly 21, 21’
第一凸部 211 211、211’First protrusion 211 211, 211'
第二凸部 212 212Second convex part 212 212
平坦部 213’Flat 213’
锁孔 214’Keyhole 214'
第一锁孔 2141’The first keyhole 2141’
第二锁孔 2142’Second keyhole 2142’
第三锁孔 2143’The third keyhole 2143’
斜切面 215’Miter 215'
第一切削件 22、22’、22”First Cutting Part 22, 22’, 22”
第一后刀面 221、221’、221”First flank 221, 221’, 221”
第一前刀面 222、222’、222”First rake face 222, 222’, 222”
第一抵靠部 223First abutment 223
平坦部 224Flat 224
锁孔 225Keyhole 225
第一锁孔 2251First keyhole 2251
第二锁孔 2252Second keyhole 2252
第三锁孔 2253The third keyhole 2253
第二切削件 23Second Cutting Part 23
第二后刀面 231Second flank 231
第二前刀面 232Second rake face 232
第二抵靠部 233Second abutment 233
定位件 24Positioner 24
顶面 241top 241
定位件 3’,3”,3”’Positioner 3’,3”,3”’
刀刃部 K、K’、K”Blade K, K’, K”
薄膜层 PFilm layer P
长度 D1Length D1
排屑通道 gChip channel g
正斜角 θ1Positive Slope θ1
逃让角 θ2escape angle θ2
角度 θ3Angle θ3
第一距离 h1first distance h1
第二距离 h2Second distance h2
磨粒 dAbrasive grain d
抛光垫 EPolishing Pad E
倒角 RChamfer R
圆弧边缘 Trounded edge T
切削结构 CCutting structure C
微结构层 UMicrostructure layer U
以上所述仅为本发明的较佳可行实施例，非因此局限本发明的专利范围，故举凡运用本发明说明书及附图内容所做的等效技术变化，均包含于本发明的保护范围内。The above descriptions are only preferred feasible embodiments of the present invention, and therefore do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description of the present invention and the contents of the accompanying drawings are included in the protection scope of the present invention. .
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610629089.7ACN106078517A (en) | 2016-08-03 | 2016-08-03 | Polishing pad dressing device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610629089.7ACN106078517A (en) | 2016-08-03 | 2016-08-03 | Polishing pad dressing device |
| Publication Number | Publication Date |
|---|---|
| CN106078517Atrue CN106078517A (en) | 2016-11-09 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610629089.7APendingCN106078517A (en) | 2016-08-03 | 2016-08-03 | Polishing pad dressing device |
| Country | Link |
|---|---|
| CN (1) | CN106078517A (en) |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
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