Summary of the invention
Embodiments provide the processing method of cabling in a kind of PCB aperture, to solve existing PCBIn hole, in routing technology hole, circuit precision is difficult to grasp and the problem of circuit on destructible PCB.
The present invention provides the processing method of cabling in a kind of PCB aperture, it is characterised in that including:
Thering is provided PCB multilayer board, described PCB multilayer board has plated through-hole；
Hole wall at described plated through-hole arranges resist layer；
Drill is utilized to be removed by the part resist layer on the hole wall of described plated through-hole；
The hole copper etching do not protected by resist layer of described plated through-hole being removed, the hole copper of reservation is formed extremelyCircuit in few two holes independent of each other.
As can be seen from the above technical solutions, the embodiment of the present invention has the advantage that
In the embodiment of the present invention, the hole wall at the plated through-hole of PCB multilayer board arranges resist layer, utilizes and boresPart resist layer on the hole wall of plated through-hole is removed by cutter, by not protected by resist layer of plated through-holeHole copper etching is removed, and the hole copper of reservation forms circuit at least two holes independent of each other, anti-by arrangingLose layer and control the size of drill so that the hole copper of part being removed, in formation hole during circuit, is not breakingThe prototype of bad plated through-hole, when this improves multi-line in hole, the precision of the course of processing, also will not breakCircuit on bad PCB, improves the efficiency of processing.
Accompanying drawing explanation
In order to be illustrated more clearly that embodiment of the present invention technical scheme, below will be to embodiment and prior artIn description, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is onlyIt is only some embodiments of the present invention, for those of ordinary skill in the art, is not paying creativenessOn the premise of work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of the processing method of circuit in a kind of PCB aperture in the embodiment of the present invention；
Fig. 2 is the schematic diagram of PCB multilayer board in the embodiment of the present invention；
Fig. 3 is the schematic diagram forming resist layer in the embodiment of the present invention；
Fig. 4 is the schematic diagram of many prismatics drill bit in the embodiment of the present invention；
Fig. 5 is the schematic diagram forming resist layer figure in the embodiment of the present invention；
Fig. 6 is to form the schematic diagram of circuit in hole in the embodiment of the present invention.
Detailed description of the invention
Embodiments provide the processing method of circuit in a kind of PCB aperture, be used for solving existingIn PCB aperture, in routing technology hole, circuit precision is difficult to grasp and the problem of circuit on destructible PCB.
In order to make those skilled in the art be more fully understood that the present invention program, real below in conjunction with the present inventionExecute the accompanying drawing in example, the technical scheme in the embodiment of the present invention be clearly and completely described, it is clear thatDescribed embodiment is only the embodiment of a present invention part rather than whole embodiments.Based onEmbodiment in the present invention, those of ordinary skill in the art are obtained under not making creative work premiseThe every other embodiment obtained, all should belong to the scope of protection of the invention.
Below by specific embodiment, it is described in detail respectively.
Refer to Fig. 1, the processing method of circuit in the embodiment of the present invention a kind of PCB aperture of offer, it may include:
101, providing PCB multilayer board, PCB multilayer board has plated through-hole；
In the embodiment of the present invention, it is provided that a kind of PCB multilayer board, PCB multilayer board has plated through-hole, asShown in Fig. 2, PCB multilayer board 20 has the plated through-hole of circle, and the hole wall 201 of plated through-hole is copper.
It should be noted that PCB multilayer board can use one piece of dual platen to make internal layer, two pieces of single sided boards are madeOuter layer, or two pieces two-sided make internal layer, two pieces of one sides make outer layer, replaced one by adhesive materialRise and conductive pattern is interconnected forming four layers or six layers of PCB multilayer board, concrete making by design requirementProcess and the number of plies do not limit.
102, the hole wall at plated through-hole arranges resist layer；
In the embodiment of the present invention, as it is shown on figure 3, use electroplating technology at hole wall 201 table of plated through-holeFace plating last layer stannum or slicker solder, as resist layer 301, it should be noted that resist layer 301 can also beOther erosion-resisting material, does not limits.
103, drill is utilized to be removed by the part resist layer on the hole wall of plated through-hole；
In the embodiment of the present invention, drill has many prismatics drill bit, and as shown in Figure 4, drill bit 401 is Rhizoma SparganiiShape drill bit, it should be noted that the diameter of drill bit is not more than the diameter of plated through-hole, the shape of drill bit withDepending on material is according to practical situation, do not limit, control drill bit 401 and be perpendicular to plated through-holeIt is positioned over the first opening part of plated through-hole, controls drill and carry out the rotation of presetting angle, so that boreResist layer 301 in rotational angle is removed by the corner angle of 401 when rotating, then by drill bit 401 from goldThe first opening part in genusization hole moves to the second opening part, be formed in parallel with plated through-hole axis threeBar resist layer independent of each other figure 501, it should be noted that the quantity of resist layer figure 501 and widthDepend on presetting angle and the corner angle quantity of drill bit 401 that drill rotates, do not limit.
104, the hole copper etching do not protected by resist layer of plated through-hole is removed.
In the embodiment of the present invention, use alkaline etching technique the plated through-hole shown in Fig. 5 is etched, not byThe hole copper of resist layer figure 501 protection will be removed, and the hole copper of reservation is formed in three holes independent of each otherCircuit, it should be noted that in hole the quantity of circuit and width depend on presetting angle that drill rotates withAnd the corner angle quantity of drill bit 401, do not limit.Such as in hole circuit can be four, sixBar, or more a plurality of etc..
In some embodiments of the invention, after step 104, resist layer figure 501 is removed,Obtain circuit 601 in hole as shown in Figure 6.
In some embodiments of the invention, the orifice ring of plated through-hole is divided at least two part, oftenIn one cylindrical void, circuit is by a part for orifice ring and the connection in PCB multilayer board.
Therefore, the hole wall at the plated through-hole of PCB multilayer board arranges resist layer, utilizes drill by goldPart resist layer on the hole wall in genusization hole is removed, and is lost by the hole copper do not protected by resist layer of plated through-holeCarving and remove, the hole copper of reservation forms circuit at least two holes independent of each other, by arrange resist layer andControl the size of drill so that removed by the hole copper of part, in formation hole during circuit, do not destroying metalChanging the prototype in hole, when this improves multi-line in hole, the precision of the course of processing, also will not destroy PCBOn circuit, improve the efficiency of processing.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and does not has in certain embodimentThe part described in detail, may refer to the associated description of other embodiments.
The microetch processing system provided the embodiment of the present invention above and equipment are described in detail, butThe explanation of above example is only intended to help to understand method and the core concept thereof of the present invention, should not be understoodFor limitation of the present invention.Those skilled in the art, according to the thought of the present invention, in the present inventionIn the technical scope disclosed, the change that can readily occur in or replacement, all should contain the protection model in the present inventionWithin enclosing.