技术领域technical field
本发明属于导电新材料技术领域，涉及一种导热膜的制备方法。The invention belongs to the technical field of new conductive materials, and relates to a method for preparing a heat-conducting film.
背景技术Background technique
不论是机构组建或电气装置，过高的使用温度常常会造成功能变差甚至失效，此外还会缩短使用年限，因此需要不同的散热装置或机制，以避免工作温度高于临界值。Regardless of whether it is a mechanism or an electrical device, excessively high operating temperatures will often result in poor function or even failure, and will also shorten the service life, so different heat dissipation devices or mechanisms are required to avoid operating temperatures above the critical value.
随着电子器件以及产品向高集成度、高运算领域的发展，它的发热量随之增加，另一方面体积越来越小，发热更加集中。传统散热器的材质一般为铝或铜，目前无论是芯片封装还是产品系统散热，无外乎都是这两种材料直接散热或配合硅胶、风扇形成散热系统，无法满足高端电子元件的散热需求，而且对于一些有导电线路的电子元器件因金属类导热膜无法避免导电性事故而不可使用，并且容易有折伤和压痕。而有些大功率高效散热技术，比如致冷器、水循环等需要动用额外的电力才能发挥散热效果，不符合今日逐渐讲究的节能理念，也不适用于对于现下越来越注重节电与轻便的移动终端。With the development of electronic devices and products to the field of high integration and high computing, its calorific value increases accordingly. On the other hand, its volume is getting smaller and smaller, and its heat generation is more concentrated. Traditional heat sinks are generally made of aluminum or copper. At present, whether it is chip packaging or product system heat dissipation, these two materials are used to directly dissipate heat or cooperate with silica gel and fans to form a heat dissipation system, which cannot meet the heat dissipation requirements of high-end electronic components. Moreover, some electronic components with conductive lines cannot be used because the metal heat-conducting film cannot avoid conductive accidents, and are prone to breakage and indentation. However, some high-power and high-efficiency heat dissipation technologies, such as refrigerators and water circulation, require additional power to exert heat dissipation effects, which do not conform to the energy-saving concept that is becoming more and more important today, and are not suitable for mobile phones that pay more and more attention to power saving and lightness. terminal.
目前在电子器件领域，常见的热导管散热方式和导热膜方式。At present, in the field of electronic devices, heat pipes and heat conduction films are commonly used for heat dissipation.
热导管基本上是一内含工质流体的封闭腔体，利用相变进行换热。一般来说温差(或者说温度梯度)越大，交换的热量越多，热管的一个很大的优点就是在于其有很好的恒温性，即不需要在温差很大的条件下而达到很好的换热效果。这其中的原因就在于利用热管中工质的气-液相变来交换大量的热量，在物质发生相变的时候，温度是基本不变的而工质汽化(液化)的时候会需要吸收(释放)大量的潜热。于是热管的工作过程简单描述就是这样：热管里面的工质在一端从外界吸收大量的热量，由液态变化成气态，在气压的驱使下，流动到另外一端，冷凝成液体，释放出大量的汽化潜热，液体又在某种驱动力的驱使下(重力，多孔材料吸液芯的毛细作用等等)又回到另外一端吸热，如此循环。在这个过程中，热阻是非常小的。A heat pipe is basically a closed cavity containing a working fluid, which uses phase change for heat exchange. Generally speaking, the larger the temperature difference (or temperature gradient), the more heat exchanged. One of the great advantages of the heat pipe is that it has a good constant temperature, that is, it does not need to achieve a good temperature under the condition of a large temperature difference. heat transfer effect. The reason for this is that the gas-liquid phase change of the working fluid in the heat pipe is used to exchange a large amount of heat. When the phase transition occurs in the substance, the temperature is basically unchanged and when the working fluid is vaporized (liquefied), it needs to absorb ( Release) a large amount of latent heat. So the working process of the heat pipe is briefly described as follows: the working medium in the heat pipe absorbs a large amount of heat from the outside at one end, changes from a liquid state to a gaseous state, and flows to the other end under the drive of air pressure, condenses into a liquid, and releases a large amount of vaporization. Latent heat, the liquid is driven by a certain driving force (gravity, the capillary action of the porous material wick, etc.) to return to the other end to absorb heat, and so on. In this process, the thermal resistance is very small.
理论上热导管的制造工程包括从机械加工到检验的十二道工序，然而实际制造的时候往往能达到二十甚至上百道工序，且对工艺要求极高，相应的成本也极其高昂。基于热导管的散热器是由底座、热管、鳍片、以及风扇组成，体积较大，而且不同的热源器件需要定制不同的散热器结构，应用上有一定的局限性。Theoretically, the manufacturing process of heat pipes includes twelve processes from machining to inspection. However, in actual manufacturing, there are often twenty or even hundreds of processes, and the process requirements are extremely high, and the corresponding costs are extremely high. The radiator based on the heat pipe is composed of a base, a heat pipe, fins, and a fan, and has a large volume, and different heat source devices need to customize different radiator structures, which has certain limitations in application.
目前市面上的导热膜材料有天然石墨导热膜，人工石墨导热膜，纳米碳导热膜，高导热的材料碳纳米管和石墨烯也可做成导热膜，但原材料价格高，且技术不成熟。At present, the heat conduction film materials on the market include natural graphite heat conduction film, artificial graphite heat conduction film, nano-carbon heat conduction film, high heat conduction materials carbon nanotubes and graphene can also be made into heat conduction film, but the price of raw materials is high and the technology is immature.
以上所述的各种散热片和导热膜，都具有导电性能，这对于一些有导电线路的电子元器件使用中会导电，易造成短路现象，而价格动辄几千元一平方米，少则几百元一平米，无法惠及一般大众产品，只有少数高单价的产品用得起此类导热膜。The various heat sinks and thermal conductive films mentioned above all have conductive properties, which will conduct electricity for some electronic components with conductive lines, which will easily cause short circuits, and the price is often several thousand yuan per square meter, ranging from a few One hundred yuan per square meter cannot benefit general mass products, and only a few products with high unit prices can afford this type of thermal conductive film.
发明内容Contents of the invention
本发明所要解决的技术问题是提供一种导热膜，以克服现有技术存在的不足。The technical problem to be solved by the present invention is to provide a heat conduction film to overcome the deficiencies in the prior art.
为解决上述技术问题，本发明采用如下的技术方案：In order to solve the problems of the technologies described above, the present invention adopts the following technical solutions:
一种导热膜，从下到上依次为柔性基材的底层、结构层和柔性基材的表层，其特征在于：所述结构层由有突出分布在底层表面的几何块构成，相邻几何块之间形成贯通的沟槽，所述结构层的厚度为30-50微米，所述沟槽的宽度为0.5-3微米，所述沟槽内灌装有充满沟槽的压力工质，所述导热膜四周的沟槽口被封堵，所述压力工质在沟槽的压力为0.5-2MPa。A heat conduction film, from bottom to top is the bottom layer of the flexible substrate, the structural layer and the surface layer of the flexible substrate, characterized in that: the structural layer is composed of geometric blocks with protrusions distributed on the surface of the bottom layer, adjacent geometric blocks A through groove is formed between them, the thickness of the structural layer is 30-50 microns, the width of the groove is 0.5-3 microns, the pressure working fluid filled with the groove is filled in the groove, and the The groove openings around the heat conduction film are blocked, and the pressure of the pressure working medium in the groove is 0.5-2MPa.
所述结构层和表层之间通过胶粘层连接。The structural layer and the surface layer are connected through an adhesive layer.
所述几何块优选正六边形形状从而形成蜂窝状的沟槽。The geometric blocks are preferably in the shape of regular hexagons to form honeycomb grooves.
所述柔性基材为PI或者PET。所述底层的厚度为50-200微米，表层的厚度为100μm，所述压力工质为水或二氧化碳。The flexible substrate is PI or PET. The bottom layer has a thickness of 50-200 microns, the surface layer has a thickness of 100 microns, and the pressure working medium is water or carbon dioxide.
在发明的一实施例中，所述结构层为与底层呈一体结构的柔性基材。In one embodiment of the invention, the structural layer is a flexible substrate with an integral structure with the bottom layer.
在本发明的还有一实施方式中，所述结构层为结构胶。In yet another embodiment of the present invention, the structural layer is structural adhesive.
在本发明的还有一实施方式中，所述结构层为PET或金属薄膜。In yet another embodiment of the present invention, the structural layer is PET or metal film.
另外，发明还提供一种导热膜的制作方法，其特征在于，包含如下步骤：In addition, the invention also provides a method for manufacturing a thermally conductive film, which is characterized in that it includes the following steps:
A、在柔性膜的底层上制作出突出底层表面分布的几何块的结构层，相邻几何块相互间隔形成贯通的沟槽，结构层的厚度为30-50微米，槽的宽度为0.5-3微米；A. On the bottom layer of the flexible film, make a structural layer protruding from the geometric blocks distributed on the bottom surface. Adjacent geometric blocks are spaced apart from each other to form through grooves. The thickness of the structural layer is 30-50 microns, and the width of the groove is 0.5-3 Micron;
B、将柔性膜与结构层表面相粘连，封闭沟槽形成管道；B. Adhere the flexible membrane to the surface of the structural layer, and seal the groove to form a pipeline;
C、向沟槽内灌装压力工质，压力工质充满沟槽，压力工质充满后的压力为0.5-2MPa；C. Fill the groove with pressure working medium, the pressure working medium fills the groove, and the pressure after the pressure working medium is filled is 0.5-2MPa;
D、封堵导热膜四周的沟槽口。D. Block the grooves around the heat conduction film.
所述表层通过胶粘层与结构层进行连接。The surface layer is connected to the structural layer through an adhesive layer.
在本发明的一实施例中，所述步骤A是利用具有连续分布的凸起结构的模版在柔性薄膜材料表面压印，形成底层、结构层以及沟槽。In an embodiment of the present invention, the step A is to use a stencil with continuously distributed raised structures to imprint on the surface of the flexible film material to form the bottom layer, the structural layer and the grooves.
在本发明的另一实施例中，所述步骤A是在在底层表面印刷几何块图案的结构胶。In another embodiment of the present invention, the step A is to print structural glue with a geometric block pattern on the surface of the bottom layer.
在本发明的再一实施例中，所述步骤A中，先将结构层与底层进行复合，并在结构层上涂抹光刻胶，再利用带有几何网状结构的掩膜对结构层进行蚀刻，直至蚀刻到底层表面停止。In yet another embodiment of the present invention, in the step A, the structural layer and the bottom layer are firstly compounded, and photoresist is applied on the structural layer, and then the structural layer is processed using a mask with a geometric network structure. Etch until the bottom surface is etched to a stop.
采用上述技术方案，本发明的导热膜中就形成网状结构的细微管道，每一条形成的管道都有至少两条以上的相邻管道，一侧薄膜通过热传导方式从热源吸收的热量可以迅速扩散进而均匀分布在薄膜各管道中的压力工质中，压力工质再通过热传导的方式将热量传导至与之贴合的另一侧柔性材料薄膜中。柔性材料薄膜可以通过贴合金属外壳或者对流散热等方式进行散热。如此形成一个动态平衡，将热源的温度保持在一定的范围之内，而所使用的柔性材料薄膜具备电气绝缘性，适用于具有导电线路的电子元件。By adopting the above-mentioned technical scheme, fine pipes with a network structure are formed in the heat conduction film of the present invention, and each formed pipe has at least two or more adjacent pipes, and the heat absorbed by the film on one side from the heat source through heat conduction can be rapidly diffused Further, the pressure working medium is uniformly distributed in each pipeline of the film, and the pressure working medium conducts heat to the flexible material film on the other side bonded to it through heat conduction. The flexible material film can dissipate heat by bonding the metal shell or convective heat dissipation. This forms a dynamic balance that keeps the temperature of the heat source within a certain range, and the flexible material film used is electrically insulating and suitable for electronic components with conductive circuits.
因此，本发明的导热膜具有导热性、绝缘性、适用领域广、制作成本低等一系列优点。Therefore, the thermally conductive film of the present invention has a series of advantages such as thermal conductivity, insulation, wide application fields, and low manufacturing cost.
附图说明Description of drawings
下面结合附图和具体实施方式对本发明进行详细说明：The present invention is described in detail below in conjunction with accompanying drawing and specific embodiment:
图1为本发明的结构剖面图；Fig. 1 is a structural sectional view of the present invention;
图2为结构层的平面示意图。Figure 2 is a schematic plan view of the structural layer.
具体实施方式detailed description
如图1所示，本发明的导热膜，从下到上依次为柔性基材的底层100、结构层200、胶粘层300和柔性基材的表层400。As shown in FIG. 1 , the heat conduction film of the present invention includes the bottom layer 100 of the flexible substrate, the structural layer 200 , the adhesive layer 300 and the surface layer 400 of the flexible substrate from bottom to top.
结合图2所示，其中，结构层200由有突出分布在底层表面的几何块201构成，相邻几何块201之间形成贯通的沟槽202。沟槽202内灌装有压力工质，导热膜四周的沟槽口被封堵。As shown in FIG. 2 , the structural layer 200 is composed of geometric blocks 201 with protrusions distributed on the bottom surface, and through grooves 202 are formed between adjacent geometric blocks 201 . The groove 202 is filled with a pressure working fluid, and the groove openings around the heat conduction film are blocked.
底层100的厚度为100微米，结构层的厚度为30-50微米，胶粘层的厚度为20微米，表层400的厚度为100微米，沟槽的宽度为0.5-3微米。压力工质充满整个沟槽。The thickness of the bottom layer 100 is 100 microns, the thickness of the structural layer is 30-50 microns, the thickness of the adhesive layer is 20 microns, the thickness of the surface layer 400 is 100 microns, and the width of the groove is 0.5-3 microns. The pressure working fluid fills the entire groove.
底层100和表层400的柔性基材选用PET或PI，胶粘层300采用环氧胶。The flexible substrates of the bottom layer 100 and the surface layer 400 are made of PET or PI, and the adhesive layer 300 is made of epoxy glue.
在最佳的实施例中，优选正六边形的几何块形成结构层，这样的结构层中就形成了蜂窝状结构的细微管路，每一条的管路都可以和相邻的四条管路连通,由于压力工质在内部填充时候，具有很大的压力，达到0.5-2MPa，该压力使得热源处的热量能通过压力波的形式迅速向末端传递，散热效率高。In the best embodiment, it is preferable that regular hexagonal geometric blocks form a structural layer, and in such a structural layer, fine pipelines with a honeycomb structure are formed, and each pipeline can be communicated with four adjacent pipelines ,Because the pressure working medium is filled inside, it has a very high pressure, reaching 0.5-2MPa, the pressure makes the heat at the heat source can be quickly transferred to the end in the form of pressure waves, and the heat dissipation efficiency is high.
上述结构的导热膜在底层100上形成具有贯通沟槽202的结构层200可以分别通过以下三种工艺制作：The heat conduction film with the above structure forms the structural layer 200 with through grooves 202 on the bottom layer 100, which can be produced by the following three processes respectively:
1、利用具有连续分布的几何形通孔的模版在柔性薄膜材料表面压印，形成底层、结构层以及沟槽。在该工艺中，底层和结构层为一体结构。1. Using a stencil with continuously distributed geometric through holes to imprint on the surface of the flexible film material to form the bottom layer, structural layer and grooves. In this process, the base layer and the structural layer are integrated into one structure.
2、在底层表面印刷几何块图案的结构胶。该几何块图案之间形成贯通的沟槽。该结构胶采用高分子材质,例如环氧树脂，聚丙烯酸酯或聚氨酯。2. Structural glue that prints geometric block patterns on the surface of the bottom layer. Through grooves are formed between the geometric block patterns. The structural adhesive is made of polymer materials, such as epoxy resin, polyacrylate or polyurethane.
3、先将结构层与底层进行复合，并在结构层上涂抹光刻胶，在利用带有几何网状结构的掩膜对结构层进行蚀刻，直至蚀刻到底层表面停止。结构层可以为PET层或者金属层，金属层可以是铜，铝等具有高热传导性的材料。3. Composite the structural layer and the bottom layer first, and apply photoresist on the structural layer, and then use the mask with a geometric network structure to etch the structural layer until the etching reaches the surface of the bottom layer. The structural layer can be a PET layer or a metal layer, and the metal layer can be copper, aluminum and other materials with high thermal conductivity.
导热试验：Thermal conductivity test:
本导热试验采用的导热膜底层和表层的柔性基材均是采用PET,采用上述第2种工艺制作而成，结构胶为环氧树脂，胶粘层采用环氧胶。The flexible base material of the bottom layer and surface layer of the heat conduction film used in this heat conduction test is made of PET, which is made by the above-mentioned second process. The structural adhesive is epoxy resin, and the adhesive layer is epoxy glue.
导热膜的底层100的厚度为100微米，结构层的几何块为正六边形，厚度为40微米，胶粘层的厚度为20微米，表层400的厚度为100微米，沟槽的宽度为2微米。沟槽内填充的压力工质为水，压力为1MPa。The thickness of the bottom layer 100 of the thermal conductive film is 100 microns, the geometric block of the structural layer is a regular hexagon with a thickness of 40 microns, the thickness of the adhesive layer is 20 microns, the thickness of the surface layer 400 is 100 microns, and the width of the groove is 2 microns . The pressure working medium filled in the groove is water, and the pressure is 1MPa.
进行导热试验时，分别对热源和远离热源3.5cm的A点、B点进行测量。其测量结果如表1所示：When conducting the heat conduction test, measure the heat source and points A and B that are 3.5cm away from the heat source. The measurement results are shown in Table 1:
表1：本专利的导热膜进行导热试验(单位：℃)Table 1: The heat conduction test of the heat conduction film of this patent (unit: ℃)
以普通铝箔进行对比导热试验Comparative thermal conductivity test with ordinary aluminum foil
也分别对热源和远离热源3.5cm的A点、B点进行测量。其测量结果如表2所示：Also measure the heat source and points A and B that are 3.5cm away from the heat source. The measurement results are shown in Table 2:
表2：普通铝箔进行导热试验(单位：℃)Table 2: Thermal conductivity test of ordinary aluminum foil (unit: ℃)
通过上述两表比较可以发现，采用普通铝箔，无法将热源的温度快速散布，且稳定温度很难接近热源的稳定温度。而采用本发明的导热膜，导热膜上A点和B点的稳定温度很接近热源的稳定温度，说明本专利的导热膜导热快、热传导性高。From the comparison of the above two tables, it can be found that the temperature of the heat source cannot be quickly spread by using ordinary aluminum foil, and the stable temperature is difficult to approach the stable temperature of the heat source. However, with the heat conduction film of the present invention, the stable temperatures of point A and point B on the heat conduction film are very close to the stable temperature of the heat source, indicating that the heat conduction film of this patent has fast heat conduction and high thermal conductivity.
以上所述，仅是本发明的较佳实施例，并非对本发明作任何形式上的限制，任何所属技术领域中具有通常知识者，若在不脱离本发明所提出的权利要求的保护范围内，利用本发明所揭示的技术内容所作出的局部更动或修饰的等效实施例，并且未脱离本发明的技术特征内容，均仍属本发明技术特征的范围内。The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Anyone with ordinary knowledge in the technical field, if within the scope of protection of the claims that do not depart from the present invention, The equivalent embodiments of partial changes or modifications made by utilizing the technical content disclosed in the present invention, without departing from the technical features of the present invention, still fall within the scope of the technical features of the present invention.
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| CN201510069791.8ACN105990274B (en) | 2015-02-10 | 2015-02-10 | A kind of heat conducting film and preparation method thereof |
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| CN203336548U (en)* | 2013-06-28 | 2013-12-11 | 华南理工大学 | Integrated radiator based on foamy copper and micro groove channels |
| CN103488266A (en)* | 2013-10-14 | 2014-01-01 | 浙江嘉熙光电设备制造有限公司 | Thin sheet type CPU heat dissipation device and machining method thereof |
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| CN109246997A (en)* | 2018-10-30 | 2019-01-18 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
| CN112752388A (en)* | 2019-10-30 | 2021-05-04 | 江西晶润光学有限公司 | Supporting structure and flexible printed circuit board |
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