Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Accompanying drawing givesThe better embodiment of the present invention.But, the present invention can be realized by many different forms, however it is not limited to is retouched belowThe embodiment stated.On the contrary, provide the purpose of these embodiments be make to the disclosure understand more thoroughComprehensively.
Unless otherwise defined, the technology people of all of technology used herein and scientific terminology and the technical field belonging to the present inventionThe implication that member is generally understood that is identical.The term used the most in the description of the invention is intended merely to describe concrete enforcementThe purpose of mode, it is not intended that in limiting the present invention.Term as used herein "and/or" includes one or more relevant instituteArbitrary and all of combination of list of items.
Embodiments provide a kind of flexible body temperature patch, including:
Have first surface and with first surface back to the flexible base layer of second surface,
At least for monitoring the functional circuit layer of body temperature, including being arranged at conducting wire and the functional device of described first surface, instituteState functional device to be electrically combined with described conducting wire；
Further, the integral thickness of described body temperature patch is less than 2mm.
Described body temperature pastes because of its flexible and ultra-thin feature, is affixed on human body and does not interferes with comfortableness, and it is bent to well adapt to human bodyLine and the most firm fit on human body, and less there will be because of scraping the unexpected problem such as come off from human body.
Described " being arranged at " may be implemented in a variety of ways, such as: described functional circuit layer can be integrally molded in described first surface；Or, described functional circuit layer also adheres to described first surface；Or, described functional circuit layer is known also by industryOther suitable method be attached to described first surface, be not described in detail herein.
In some preferred embodiments of the present invention, functional circuit layer shape can be made by modes such as printing, physical/chemical depositionsBecome described first surface, to reduce described body temperature patch integral thickness, and simplify the processing procedure of described body temperature patch.
Further, in some embodiments, the conducting wire in described functional circuit layer can use printed pattern technology systemStandby, it is formed directly in the first surface of described flexible substrates.
Further, in some embodiments, the first surface of described flexible substrates also can be formed with groove, described function electricityConducting wire in the floor of road can be embedded in described groove with a part or whole part, and this kind is designed with and helps reduce described body temperature furtherThe thickness of patch.
Further, described conducting wire can use printing technology to prepare, including silk screen printing, ink jet printing, intaglio printing,Letterpress, trans-printing, aerosol printing and mixed printing etc., and it is not limited to this, and the patterned conductive line being consequently formedRoad can be dispensed directly onto the first surface of described flexible substrates or a part or whole part is located at what the first surface of described flexible substrates was formedIn groove, and surface, conducting wire has good electric conductivity, is beneficial to functional device integrated.
Further, described conducting wire also can be imprinted with the groove that technology preparation is formed at the first surface of described flexible substratesIn.
Further, described functional device can be combined by suitable method multiple known to industry between conducting wire.Such as,In some preferred embodiments of the present invention, low-temperature bounding method can be used to realize the integrated of functional device and conducting wire and shapeBecome described functional circuit layer.Wherein, described soldered temperature is preferably shorter than 160 DEG C, to reduce functional device and conductionThe damage etc. of circuit, and ensure both the most in electrical contact and bond strength.
Further, the functional device in described functional circuit layer can be selected for the functional device of suitable type known to industry, especiallyBeing the functional device of one or more miniaturization, these functional devices connect formation by conducting wire and have temperature-monitoring functionPerformance loop.Such as, described functional device preferably uses miniature patch device or the functional device of solutionization printing preparation, itsThickness is preferably smaller than 1.5mm, and wherein the size of discrete device is preferably smaller than 7mm*7mm.
Further, the functional device in described functional circuit layer can include temperature sensor, power module, control module,One or more in communication module, display module etc., the most also can also include other functional module.
Further, described flexible base layer can use polymer thin-film material or composite film material, and its thickness is preferably smaller than100 μm, are further preferably no larger than 60 μm, particularly preferably less than 30 μm.
Wherein, described polymer thin-film material include polydimethylsiloxane, polymethyl methacrylate, polyethylene, polypropylene,Polrvinyl chloride, polyethylene terephthalate, Merlon, PEN and polyimides etc., but be not limited toThis.And described composite film material can include mixing material or the multilayer polymer film material of different polymer.
More preferred, described flexible base layer is less than 1.5mm with the thickness of functional circuit layer.
More preferred, described functional circuit layer be smaller in size than 3cm*3cm, so that described body temperature patch can be affixed on all easilySuch as positions such as human body axillary fossas, and then realize the accurate measurement to body temperature, and do not affect the regular event of human body.
Further, in some embodiments of the present invention, for enabling users to more get information about relevant body temperature information, alsoCan described body temperature stick also can integrally disposed information display module etc., such as can pass through color change, numeral, word etc. toUser shows the module of body temperature information, particularly flexible information display module (such as flexible display screen) etc..
Further, in some embodiments of the present invention, it is possible to wireless communication module etc. is set in described body temperature pastes, makesObtain described body temperature patch and wirelessly temperature information can be transferred to external equipment.Wherein, described wireless mode include bluetooth,Zigbee, wifi, GPRS etc., but it is not limited to this.
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include sealing coat, and described sealing coat is arrangedIn described functional circuit layer surface and with functional circuit layer electric insulation, at least can affect described functional circuit layer performance for preventionImpurity (such as steam etc., but be not limited to this) entered function circuit layer.
More preferred, described sealing coat can be membrane structure, and its thickness is less than 0.5mm, and on the one hand it have aforementioned function,I.e. isolation steam and the impurity of other influences circuit performance, on the other hand, this sealing coat also can be strengthened functional circuit layer and tie with otherAdhesion between structure layer (encapsulated layer the most hereafter will addressed).
Wherein, the material of described sealing coat can selected from insulation, the organic or inorganic material with good water vapor rejection performance orSuitable polymeric material etc. known to its composite etc., such as industry, but it is not limited to this.
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include encapsulated layer, in order to described body temperatureThe internal structure of patch is packaged and protects.
Wherein, described encapsulated layer can cover in the first surface of described flexible base layer, and by functional circuit layer and that may be presentSealing coat is coated with, and forms single-face packaging structure, functional circuit layer to be formed good protection, and less increase described body temperature patchThickness.
Wherein, described encapsulated layer also can be coated with described flexible base layer, functional circuit layer and sealing coat, particularly can be by describedThe overall parcel such as flexible base layer, functional circuit layer and sealing coat, with the overall structure that described body temperature is pasted formed well packaged andProtection.
Preferably, remaining component in described flexible body temperature pastes, in addition to described encapsulated layer is all wrapped in described encapsulation by entiretyIn layer.
Wherein, described encapsulated layer can be selected for the material formation that industry is known, have good flexibility and biological safety.Preferably,The composition material of described sealing coat all can should have with the composition material of the composition material of described encapsulated layer and flexible base layer preferablyThe compatibility, so that the combination that described encapsulated layer can be the best with remaining structure division in described body temperature patch.
More preferred, described encapsulated layer can use the flexible silicon glue material of food stage or medical grade to be formed, and it is safe and harmless, energyDirectly and human body good fit, the problems such as allergy will not be produced, and the comfort level of human body skin can be promoted.
Further, at least one also it is distributed at least one structure sheaf in described flexible body temperature pastes, in addition to described encapsulated layerBlind hole or at least one through hole, described encapsulated layer local is located at and (is also formed anchor structure in this at least one blind hole or this at least one through holeIt is regarded as a kind of anti-skid structure), nationality is mutually disengaged with flexible base layer etc. preventing described encapsulated layer.
More preferred, at least one blind hole or at least one through hole are distributed in described flexible base layer and/or described functional circuit layer,Described encapsulated layer local is located at into forming anchor structure in this at least one blind hole or this at least one through hole.
In certain embodiments, described anchor structure can include being formed at the blind hole in described flexible base layer or through hole, passes throughEncapsulating material is injected described blind hole or through hole and solidify to form rivet-like structure, can effectively by the encapsulated layer that formed with softThe combination that property basal layer more fastens, and without adding other auxiliary anti-slipping material etc..
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include screen layer, and nationality is to eliminate the external worldElectronic interferences signal etc..
Wherein, described screen layer may be disposed at first surface and/or the second surface of described flexible base layer, preferably second surface,Or also can be coated with described body temperature patch, but it is mutual with the information of external device should not affect described body temperature patch.
Wherein, described screen layer can be attached to first surface and/or the second surface of described flexible base layer, it is possible to is directly formedThe first surface of described flexible base layer and/or second surface.More preferred, described screen layer is packaged in described encapsulated layer.
Further, described screen layer can be such as by shapes such as metal, material with carbon element, conducting polymers in a variety of formsThe conductive network become, can also be the patterned structures layer etc. of these materials formation.
In some embodiments, described screen layer includes the conductive network mainly formed by transparent or opaque conductive material.ExampleAs, the conductive network formed by metal, CNT, Graphene, ITO etc. can be used, it can be effectively isolated extraneous electricityThe interference that functional circuit layer is caused by magnetic signal.These conductive networks can be formed by printing (such as silk screen printing), it is possible toInterweaved by linear conductance material etc. and formed, it is possible to by continuous print two dimension planar conductive material is carried out machining or physics,Chemical etching forms (such as photoetching, dry or wet etch).
In some embodiments, described screen layer may also comprise that mainly formed by transparent or opaque conductive material, have and setDetermine the conductive layer of graphic structure.It is for instance possible to use by metal film, carbon nano-tube film, graphene film, ITO layer etc. through machineryThe laminate structure with patterned structures that processing or physics, chemical etching (such as photoetching, dry or wet etch) are formed,Can also be formed by modes such as printings (such as silk screen printing).
Particularly, form described screen layer according to transparent material, the outward appearance that described flexible body temperature patch is the most unique can be given.And if described functional circuit layer comprises photoelectric cell, during the most miniature photovoltaic device etc., it additionally aids ambient transmission and entersIn described flexible body temperature patch.
In some embodiments, described screen layer can be attached at the second of described flexible base layer by modes such as adhesion, bondingsOn surface or described second surface and described functional circuit layer.
In some embodiments, described screen layer is also wholely set with described flexible base layer, such as, can pass through physics, changeLearn the modes such as deposition (such as plating, metal sputtering, coating) to be attached directly to by conductive material in described flexible base layer, fromAnd form described screen layer.Use such set-up mode, screen layer and flexible base layer etc. on the one hand can be made more to fastenIn conjunction with and ensure device performance, on the other hand also contribute to preferably controlling the integral thickness of described flexible body temperature patch.
One of embodiment as the embodiment of the present invention, described conducting wire can have single or multiple lift structure.Wherein, instituteThe circuit stating multiple structure can use the techniques such as multi-sheet printed method to prepare, it is possible to by needing the circuit table of line or gap bridgeThe upper insulating barrier of face printing, republishes conduction cross-line to realize connection and multiple structure.
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include at least one drying layer, described dryLayer may be disposed at described body temperature and pastes the side surface fitted with human body, also may be provided at this side surface phase pasted with described body temperatureBack to opposite side surface, certainly, it is possible to this both side surface pasted at described body temperature arranges described drying layer simultaneously.By describedDrying layer, can intercept steam, prevents steam to the functional device (such as temperature sensor) in described functional circuit layer and leadingThe impact of electric line.Wherein, can have multiple in order to form the material of described drying layer, such as, can be fibre plate or silica gel materialMaterial etc..Preferably, the thickness of described drying layer is less than 0.2mm.
One of optimal enforcement scheme as the embodiment of the present invention, described body temperature patch may also include adhered layer, and described adhered layer can setIt is placed in described body temperature and pastes the side surface fitted with human body, can be easily by the most square for described body temperature patch by described adhered layerThe most firm fits with human body skin.
Wherein, described adhered layer preferably by safety non-toxic, non-stimulated, can the cohesive material that remove of noresidue be formed, the most rawThing medical aquogel etc..
Further, the present invention also can cover release layer on described adhered layer, in order to avoid described adhered layer pastes not at described body temperatureTarnish in the case of being used and lost efficacy.
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is further illustrated, so that innovation essence of the present invention is easy to reasonSolve, but these relevant embodiment explanations are not intended that the restriction to range of the present invention.
Referring to be a kind of flexible body temperature patch in a preferred embodiment of the invention shown in Fig. 1 a, it includes flexible base layer101, functional circuit layer 102, sealing coat 103 and encapsulated layer 104.
Foregoing soft basal layer 101 include first surface and with this first surface back to second surface, on described first surfaceIt is provided with described functional circuit layer 102.
Foregoing soft basal layer 101 uses polymer thin-film material or composite film material, and its thickness is less than 100 μm, the leastIn 60 μm, it is further preferably no larger than 30 μm.Further, aforementioned polymer thin-film material can use poly terephthalic acid second twoEster (PET) etc..
Conducting wire that aforementioned functional circuit layer 102 includes being arranged at the first surface of described flexible base layer and with described conductor wireThe functional device that road electrically combines.
Aforesaid conductive circuit can be to prepare formation on the first surface of flexible base layer 101 by printing technology.Such as, may be usedElectrocondution slurry is graphically printed on the first surface of flexible substrates 101 by screen printing technique etc., more post-treated makeElectrocondution slurry solidifies, and forms live width and is less than the described conducting wire of 30 μm more than 50 μm, thickness more than 0.5 μm.
Aforementioned functional device includes one or more in temperature-sensing element, control module, power module etc., and such as electricityOther elements such as resistance, electric capacity, but it is not limited to this.
More preferred, for ensureing normal work and the electric performance stablity of aforementioned functional circuit layer, also can be at described functional circuitThe first surface of layer 102 arranges sealing coat 103, and the thickness of described sealing coat 103 is less than 0.5mm, has the work of isolation steamWith, prevent steam entered function circuit layer 102 and affect the normal work of circuit, the most also in order in insulation package layer 104 itsHis impurity is on conducting wire in functional circuit layer 102 and the impact of functional device.It addition, aforementioned sealing coat 103 also has regulation and controlAforementioned functional circuit layer 102 and the effect at encapsulated layer 104 interface, make aforementioned functional circuit layer 102 by sealing coat 103 and envelopeDress layer 104 strong bonded.
Aforementioned encapsulation layer 104 preferably employs the flexible silicon glue material of food stage or medical grade and is formed, in order to wrap flexible base layer101, functional circuit layer 102 and sealing coat 103, plays protection and the effect of encapsulation.Have the most soft because of silica gel itself simultaneouslyProperty, make whole body temperature patch have flexibility, and well can fit with human body.
Preferably, the thickness of described encapsulated layer is less than 1mm, and the integral thickness of described body temperature patch is less than 2mm, so can be bigThe described body temperature of big raising pastes the comfortableness worn.
More preferred, for improving stability and the anti-interference of aforementioned functional circuit layer 102, it is also possible in described flexible substratesThe second surface of layer 101 covers a screen layer 105 (refering to Fig. 1 b) by coating method etc..
More preferred, in the present embodiment, refering to shown in Fig. 1 c, some blind holes also can be set in flexible base layer 101106 (or through holes), described encapsulated layer local is located at into forming anchor structure (or claiming anti-skid structure) in these blind holes, and nationality is with effectivelyThe combination that the encapsulated layer formed and flexible base layer are more fastened by ground.Or, it is possible in described flexible substrates 101 and meritCan arrange one or more through hole or blind hole on the overall structure layer of circuit layer formation, encapsulating material is fed into described through hole or blind holeAnd it solidify to form anchor structure.Or, it is possible to described flexible base layer 101, functional circuit layer 102 and sealing coat 103 (and/ or drying layer, screen layer) etc. the overall structure layer that formed of functional layer one or more through hole or blind hole be set, encapsulating material irrigatesEnter described through hole or blind hole and solidify to form anchor structure.
More preferred, in the present embodiment, on encapsulated layer 104, also can be covered with adhered layer 107, such as, see Fig. 1 dShown in, thereby adhered layer 107, flexible body temperature patch can be directly adhered to body surface in use, simple to operation,This adhered layer can use conventional sticky stuff, the most medical or food stage cohesive material to be formed.
More preferred, in the present embodiment, on functional circuit layer 102, also can be covered with drying layer 108, such as, seeShown in Fig. 1 e, thereby drying layer 108 can intercept steam, prevents steam to the functional device in described functional circuit layer (such asTemperature sensor) and the impact of conducting wire.Wherein, can have multiple in order to form the material of described drying layer, the most permissibleIt is fibre plate or silica gel material etc..Preferably, the thickness of described drying layer is less than 0.2mm.
Referring to shown in Fig. 2, in one embodiment of the invention, the conducting wire 202 in described flexible body temperature patch can be straightConnect the surface being formed at flexible base layer 201.
More preferred, for making, between described conducting wire 202 and flexible base layer 201, there is good adhesion, Ke YiBefore conductive circuit 202, the first surface to described flexible base layer 101 carries out oxygen plasma pre-treatment, thereby can increase structureBecome described flexible base layer base material surface can and itself and electrocondution slurry between molecular binding affinities.
On the surface, conducting wire 202 of the first surface formation of described flexible base layer 201, there is good leading by previous processElectrical and flexible.
Further, functional device electrically can be combined with described conducting wire 202 and form described functional circuit layer.Such as,By low-temperature bounding method, functional device can be integrated on the flexible electrical polar curve in described conducting wire 202.
Refer to shown in Fig. 4, in one embodiment of the invention, Silkscreen print technology can be used solder 403It is printed on the surface of the conducting wire 402 being formed at flexible base layer 401 first surface, then by paster technique by discrete meritCan be accurately placed on the flexible electrical polar curve in conducting wire 402 by device.Because solder 403 itself has certain viscosity,The functional device 404 that is placed on conducting wire 402 can be sticked to prevent it from vibrating landing, then after post processing, low temperatureSolder 403 solidify to form solid-state conductive layer, makes the pin of functional device electrically connect with conducting wire 402 and fix functional device404。
The circuit good for obtaining flex capability, the functional device 404 in aforementioned functional circuit layer has preferably employed miniature patch deviceFunctional device prepared by part or solution, the thickness of functional device 404 (can use discrete device) is less than 1mm, is smaller in size than7mm*7mm.Owing to the size of these functional devices 404 is little, it is evenly distributed, and then makes functional circuit layer still have fine flexibility.
Referring to shown in Fig. 5, in one embodiment of the invention, in flexible body temperature patch, aforesaid conductive circuit also can be adoptedUse multilamellar line structure.Described multilamellar line structure can use repeatedly print process to prepare, for example, it is possible to first wire 502 is prepared in printing,Between two electrodes 502, need inkjet printing insulating barrier 503 below the circuit that cross-line interconnects, insulating barrier 503 cover needs byOn the electrode 502 ' striden across.Then, then by silk screen printing preparation bridging wire 504, odt circuit structure is formed.Equally,Circuit is also dependent on demand, it is achieved three layers and above circuit structure, and its method is similar to.
In previously-described implementation of the present invention, when described flexible body temperature is attached to application, the portion such as axillary fossa of human body can be attached atPosition, the temperature-sensing element sensing temperature signal in its functional circuit layer, and it is sent to control module, more wirelessly (exampleSuch as bluetooth approach etc.) temperature signal is sent to external smart terminal (such as mobile phone, panel computer etc.), thus body temperature can be realizedReal-time continuous monitoring.
In another preferred embodiment of the present invention, the structure of a kind of flexible body temperature patch also see shown in Fig. 1 a, i.e. alsoFlexible base layer 101, functional circuit layer 102, sealing coat 103 and encapsulated layer 104 can be included.
Described flexible base layer 101 include first surface and with this first surface back to second surface, on described first surfaceIt is provided with described functional circuit layer 102.
Described flexible base layer 101 uses polymer thin-film material or composite film material, and its thickness is less than 100 μm, it is preferred thatThickness is less than 60 μm, it is further preferred that thickness is less than 30 μm.Wherein, described polymer thin-film material can use poly-methylAcrylic acid methyl ester. etc..Same, for improving stability and anti-interference, the described flexible base layer of described functional circuit layer 102The second surface of 101 also can be coated with a screen layer by coating process.
Conducting wire that described functional circuit layer 102 includes being formed at described flexible base layer 101 first surface and with described conductionThe functional device that circuit electrically combines.
More preferred, for ensureing normal work and the electric performance stablity of aforementioned functional circuit layer, also can be at described functional circuitThe first surface of layer 102 arranges sealing coat 103, and the thickness of described sealing coat 103 is less than 0.5mm, has the work of isolation steamWith, prevent steam entered function circuit layer 102 and affect the normal work of circuit, the most also in order in insulation package layer 104 itsHis impurity is on conducting wire in functional circuit layer 102 and the impact of functional device.It addition, aforementioned sealing coat 103 also has regulation and controlAforementioned functional circuit layer 102 and the effect at encapsulated layer 104 interface, make aforementioned functional circuit layer 102 by sealing coat 103 and envelopeDress layer 104 strong bonded.
Aforementioned encapsulation layer 104 preferably employs the flexible silicon glue material of food stage or medical grade and is formed, in order to wrap flexible base layer101, functional circuit layer 102 and sealing coat 103, plays protection and the effect of encapsulation.Have the most soft because of silica gel itself simultaneouslyProperty, make whole body temperature patch have flexibility, and well can fit with human body.
Preferably, the thickness of described encapsulated layer is less than 1mm, and the integral thickness of described body temperature patch is less than 2mm, so can be bigThe described body temperature of big raising pastes the comfortableness worn.
Referring to shown in Fig. 3, in one embodiment of the invention, the conducting wire 302 in described flexible body temperature patch can setIn groove on the first surface of described flexible base layer 301.Hot pressing in the preparation, can be passed through in described conducting wire 302Or UV method for stamping imprints out groove at the first surface of flexible base layer 301, then by consent technology, electrocondution slurry is filled upGroove, through post processing, electrocondution slurry solidify to form conducting wire 302.Owing to conducting wire 302 is formed at flexible base layerIn 301 so that it is with flexible base layer 301, there is good adhesion, improve the anti-around folding endurance energy of flexible circuitry.
The surface, conducting wire 302 being formed in described flexible base layer 301 groove has good electric conductivity, can lead to subsequentlyCross low-temperature bounding method etc. to be integrated on conducting wire 302 by functional device.
Refer to shown in Fig. 4, in one embodiment of the invention, Silkscreen print technology can be used anisotropic glue 403It is printed on the surface of the conducting wire 402 being formed at flexible base layer 401 first surface, then by paster technique by discrete meritCan be accurately placed on the flexible electrical polar curve in conducting wire 402 by device.Because anisotropic glue 403 itself has certain viscosity,The functional device 404 that is placed on conducting wire 402 can be sticked to prevent it from vibrating landing, then after post processing, everyOpposite sex glue 403 solidify to form solid-state conductive layer, makes the pin of functional device electrically connect with conducting wire 402 and fix effectorPart 404.
The circuit good for obtaining flex capability, the functional device 404 in aforementioned functional circuit layer has preferably employed miniature patch deviceFunctional device prepared by part or solution, the thickness of functional device 404 (can use discrete device) is less than 1mm, is smaller in size than5mm*5mm.Owing to the size of these functional devices 404 is little, it is evenly distributed, and then makes functional circuit layer still have fine flexibility.
Referring to shown in Fig. 5, in one embodiment of the invention, in flexible body temperature patch, aforesaid conductive circuit also can be adoptedUse multilamellar line structure.Described multilamellar line structure can use repeatedly print process to prepare, for example, it is possible to first wire 502 is prepared in printing,Between two electrodes 502, need inkjet printing insulating barrier 503 below the circuit that cross-line interconnects, insulating barrier 503 cover needs byOn the electrode 502 ' striden across.Then, then by silk screen printing preparation bridging wire 504, odt circuit structure is formed.Equally,Circuit is also dependent on demand, it is achieved three layers and above circuit structure, and its method is similar to.
In previously-described implementation of the present invention, when described flexible body temperature is attached to application, the portion such as axillary fossa of human body can be attached atPosition, the temperature-sensing element sensing temperature signal in its functional circuit layer, and it is sent to control module, more wirelessly (exampleSuch as bluetooth approach etc.) temperature signal is sent to external smart terminal (such as mobile phone, panel computer etc.), thus body temperature can be realizedReal-time continuous monitoring.
In previously-described implementation of the present invention, flexible body temperature patch uses printed electronics to be prepared, and has thin, soft, littleFeature, substantially increase the comfortableness that human body is worn, be integrated with Radio Transmission Technology simultaneously, it is possible to achieve to human body temperature believeThe monitoring in real time of breath and transmission.
It should be noted that in this article, the relational terms of such as first and second or the like be used merely to an entity orOperation separate with another entity or operating space, and not necessarily require or imply these entities or operate between exist any thisPlant actual relation or order.And, term " includes ", " comprising " or its any other variant are intended to nonexcludabilityComprise so that include that the process of a series of key element, method, article or equipment not only include those key elements, but alsoIncluding other key elements being not expressly set out, or also include want intrinsic for this process, method, article or equipmentElement.In the case of there is no more restriction, statement " including ... " key element limited, it is not excluded that including described wantingProcess, method, article or the equipment of element there is also other identical element.
The above is only the detailed description of the invention of the application, it is noted that for those skilled in the art,On the premise of without departing from the application principle, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as this ShenProtection domain please.