技术领域technical field
本发明涉及摄像模组领域，更进一步，涉及一基于模塑工艺的摄像模组。The present invention relates to the field of camera modules, and further relates to a camera module based on molding technology.
背景技术Background technique
如图1所示，是传统COB(Chip On Board芯片封装)工艺的一摄像模组示意图。所述摄像模组包括一线路板1P、一感光芯片2P、一底座3P、一滤光片4P、马达5P和一镜头6P。所述感光芯片2P被安装于所述线路板1P，所述滤光片4P被安装于所述底座3P，所述镜头6P被安装于所述马达5P，所述马达5P被安装于所述底座3P。As shown in FIG. 1 , it is a schematic diagram of a camera module in a traditional COB (Chip On Board) process. The camera module includes a circuit board 1P, a photosensitive chip 2P, a base 3P, a filter 4P, a motor 5P and a lens 6P. The photosensitive chip 2P is installed on the circuit board 1P, the optical filter 4P is installed on the base 3P, the lens 6P is installed on the motor 5P, and the motor 5P is installed on the base 3P.
摄像模塑的光学系统是影响所述摄像模组的成像品质的关键因素，而光学系统与所述镜头6P、所述滤光片4P以及所述感光芯片2P的光轴以及光线入射防线有极大关系。而在传动的摄像模组中，所述底座3P在其中的作用就是为所述滤光片4P、所述马达5P或所述镜头6P提供安装位置，使各部件能够按光学系统的光路布置。The optical system of the camera molding is a key factor affecting the imaging quality of the camera module, and the optical system is closely related to the optical axis of the lens 6P, the filter 4P, and the photosensitive chip 2P and the light incident line of defense. big relationship. In the transmission camera module, the function of the base 3P is to provide installation positions for the optical filter 4P, the motor 5P or the lens 6P, so that each component can be arranged according to the optical path of the optical system.
可是传统COB工艺的所述底座3P通常是一个塑料支架，通过粘接的方式固定于所述线路板1P，其中存在诸多不利因素。However, the base 3P of the traditional COB process is usually a plastic bracket, which is fixed to the circuit board 1P by bonding, and there are many unfavorable factors.
首先，传统的所述底座3P由于其自身的制造因素，在平整性上较差，因此不能为所述马达5P、所述镜头6P和所述滤光片4P提供良好的安装条件，使得所述马达5P、所述镜头6P和所述滤光片4P容易出现倾斜或偏差现象，从而对于所述马达5P、所述镜头6P和所述滤光片4P的安装工艺精度要求较高。First of all, the traditional base 3P is relatively poor in flatness due to its own manufacturing factors, so it cannot provide good installation conditions for the motor 5P, the lens 6P and the filter 4P, so that the The motor 5P, the lens 6P and the filter 4P are prone to inclination or deviation, so the precision of the installation process of the motor 5P, the lens 6P and the filter 4P is relatively high.
其次，传统的所述底座3P通常是粘接于所述线路板1P，因此当所述底座3P安装固定时，容易出现倾斜或偏差，进一步增大了摄像模组整体的累积误差。Secondly, the traditional base 3P is usually bonded to the circuit board 1P, so when the base 3P is installed and fixed, it is prone to inclination or deviation, which further increases the cumulative error of the camera module as a whole.
此外，在所述线路板1P上通常被安装有一些电路器件11P，比如电阻、电容等，这些电路器件11P凸出于所述线路板1P表面，而所述底座3P则需要被安装于具有所述电路器件11P的所述线路板1P上，而传统的COB工艺中该线路板1P、该电路器件11P以及该支架3P之间的组装配合关系具有一些不利因素，为所述底座3P的安装空间较小，从而增加了摄像模组对于横向尺寸的需求。In addition, some circuit devices 11P are usually installed on the circuit board 1P, such as resistors, capacitors, etc. These circuit devices 11P protrude from the surface of the circuit board 1P, and the base 3P needs to be installed on a The circuit board 1P of the circuit device 11P, and the assembly and cooperation relationship between the circuit board 1P, the circuit device 11P and the bracket 3P in the traditional COB process has some unfavorable factors, which is the installation space of the base 3P. Smaller, which increases the demand for the horizontal size of the camera module.
发明内容Contents of the invention
本发明的一个目的在于提供一基于模塑工艺的摄像模组，其中所述摄像模组包括一线路板组件，所述线路板组件包括一封装部和一线路板部，所述封装部一一体成型于所述线路板部，为所述摄像模组的一镜头、一马达或一滤光片提供良好的安装条件。An object of the present invention is to provide a camera module based on a molding process, wherein the camera module includes a circuit board assembly, the circuit board assembly includes a packaging part and a circuit board part, and the packaging part one by one The body is formed on the circuit board to provide good installation conditions for a lens, a motor or a filter of the camera module.
本发明的一个目的在于提供一基于模塑工艺的摄像模组，其中所述线路板组件的所述封装部顶端呈平面状，所述滤光片被安装于所述封装部的顶端，从而使得所述滤光片被平整的安装。An object of the present invention is to provide a camera module based on a molding process, wherein the top of the packaging part of the circuit board assembly is flat, and the optical filter is installed on the top of the packaging part, so that The filters are mounted flat.
本发明的一个目的在于提供一基于模塑工艺的摄像模组，其中所述线路板组件的所述封装部具有一安装槽，所述滤光片被安装于所述安装槽，为所述滤光片提供平整、稳定的安装位置。An object of the present invention is to provide a camera module based on a molding process, wherein the packaging part of the circuit board assembly has a mounting groove, the filter is installed in the mounting groove, and the The light sheet provides a flat, stable mounting position.
本发明的一个目的在于提供一基于模塑工艺的摄像模组，其中所述摄像模组包括一支座，所述支座被安装于所述封装部，所述滤光片被安装于所述支座。An object of the present invention is to provide a camera module based on a molding process, wherein the camera module includes a support, the support is installed on the packaging part, and the filter is installed on the support.
本发明的一个目的在于提供一基于模塑工艺的摄像模组，其中所述镜头包括一镜筒，所述滤光片被安装于所述镜筒内，从而不需要提供额外的部件来安装所述滤光片。An object of the present invention is to provide a camera module based on a molding process, wherein the lens includes a lens barrel, and the filter is installed in the lens barrel, so that there is no need to provide additional parts to install the filter described above.
本发明的一个目的在于提供一基于模塑工艺的摄像模组，其中所述线路板部包括一线路板主体，所述线路板主体具有一通路，所述滤光片被安装于所述通路上端，从而减小所述摄像模组的后焦距。An object of the present invention is to provide a camera module based on a molding process, wherein the circuit board part includes a circuit board main body, the circuit board main body has a passage, and the optical filter is installed on the upper end of the passage , thereby reducing the back focus of the camera module.
本发明的一个目的在于提供一基于模塑工艺的摄像模组，其中所述线路部包括一至少一电路元件，所述电路元件凸出于所述线路板主体，所述电路元件被所述封装部包覆，从而不会直接暴露于外部，且增加所述封装部的可设置空间。An object of the present invention is to provide a camera module based on a molding process, wherein the circuit part includes at least one circuit element, the circuit element protrudes from the main body of the circuit board, and the circuit element is encapsulated by the package The encapsulation part is covered so as not to be directly exposed to the outside, and the configurable space of the encapsulation part is increased.
为了实现以上发明目的，本发明的一方面提供一基于模塑工艺的摄像模组，其包括：至少一镜头、至少一感光芯片和至少一线路板组件；其中所述感光芯片被安装于所述线路板组件，所述镜头位于所述感光芯片的感光路径；所述线路板组件包括一线路板部和一封装部，所述封装部基于模塑工艺一体封装连接于所述线路板部，所述封装部具有一通孔，为所述感光芯片提供感光路径。In order to achieve the purpose of the above invention, one aspect of the present invention provides a camera module based on molding technology, which includes: at least one lens, at least one photosensitive chip and at least one circuit board assembly; wherein the photosensitive chip is mounted on the A circuit board assembly, the lens is located in the photosensitive path of the photosensitive chip; the circuit board assembly includes a circuit board part and a packaging part, and the packaging part is integrally packaged and connected to the circuit board part based on a molding process, so The encapsulation part has a through hole, which provides a photosensitive path for the photosensitive chip.
根据本发明的一实施例，所述摄像模组包括至少一滤光片，所述滤光片被安装于所述封装部，以使得所述滤光片被平整地安装。According to an embodiment of the present invention, the camera module includes at least one optical filter, and the optical filter is mounted on the packaging part so that the optical filter is installed flatly.
根据本发明的一实施例，所述摄像模组中所述封装部具有一顶表面，平面地延伸，所述滤光片被安装于所述顶表面。According to an embodiment of the present invention, the packaging part in the camera module has a top surface extending in a plane, and the optical filter is installed on the top surface.
根据本发明的一实施例，所述摄像模组包括至少一马达，所述镜头被安装于所述马达，所述马达被安装于所述封装部。According to an embodiment of the present invention, the camera module includes at least one motor, the lens is mounted on the motor, and the motor is mounted on the packaging part.
根据本发明的一实施例，所述摄像模组中所述镜头被安装于所述封装部。According to an embodiment of the present invention, the lens in the camera module is mounted on the packaging part.
根据本发明的一实施例，所述摄像模组中所述封装部具有至少一安装槽，所述安装槽连通于所述通孔，所述滤光片被安装于所述安装槽。According to an embodiment of the present invention, the packaging part of the camera module has at least one installation groove, the installation groove communicates with the through hole, and the optical filter is installed in the installation groove.
根据本发明的一实施例，所述摄像模组中所述安装槽呈U型地连通于外部。According to an embodiment of the present invention, the installation groove in the camera module communicates with the outside in a U-shape.
根据本发明的一实施例，所述摄像模组包括至少一滤光片、至少一马达和至少一支座，所述滤光片被安装于所述支座，所述支座被安装于所述安装槽，所述镜头被安装于所述马达，所述马达被安装于所述封装部。According to an embodiment of the present invention, the camera module includes at least one optical filter, at least one motor and at least one support, the optical filter is installed on the support, and the support is installed on the The mounting groove is provided, the lens is mounted on the motor, and the motor is mounted on the packaging part.
根据权本发明的一实施例，所述摄像模组包括至少一支座和至少一滤光片，所述滤光片被安装于所述支座，所述支座被安装于所述安装槽。According to an embodiment of the present invention, the camera module includes at least one support and at least one filter, the filter is installed on the support, and the support is installed on the installation groove .
根据本发明的一实施例，所述摄像模组包括一支座和一滤光片，所述滤光片被安装于所述支座，所述支座被安装于所述封装部。According to an embodiment of the present invention, the camera module includes a base and a filter, the filter is installed on the base, and the base is installed on the packaging part.
根据本发明的一实施例，所述摄像模组包括至少一马达，所述马达被安装于所述支座。According to an embodiment of the present invention, the camera module includes at least one motor, and the motor is installed on the support.
根据本发明的一实施例，所述摄像模组中所述镜头被安装于所述支座。According to an embodiment of the present invention, the lens in the camera module is installed on the support.
根据本发明的一实施例，所述摄像模组中所述摄像模组包括至少一支座和至少一滤光片，所述封装部具有一安装槽，所述支座被安装于所述封装部的所述安装槽，所述滤光片被安装于所述支座。According to an embodiment of the present invention, the camera module in the camera module includes at least one support and at least one optical filter, the package part has a mounting groove, and the support is installed in the package part of the installation slot, the filter is installed on the holder.
根据本发明的一实施例，所述摄像模组中所述支座在顶部的内侧具有一第一支座槽和在底部的外侧具有一第二支座槽，所述第一支座槽用于安装所述滤光片，所述第二支座槽使所述支座卡合于所述封装部，以使所述滤光片与所述感光芯片的距离减小。According to an embodiment of the present invention, the support in the camera module has a first support groove on the inner side of the top and a second support groove on the outer side of the bottom, and the first support groove is used for When installing the optical filter, the second support groove enables the support to engage with the packaging part, so that the distance between the optical filter and the photosensitive chip is reduced.
根据本发明的一实施例，所述摄像模组中所述摄像模组包括至少一马达和至少一滤光片，所述滤光片被安装于所述马达，所述马达被安装于所述封装部。According to an embodiment of the present invention, the camera module in the camera module includes at least one motor and at least one filter, the filter is installed on the motor, and the motor is installed on the packaging department.
根据本发明的一实施例，所述摄像模组包括至少一滤光片，所述镜头包括一镜筒和至少一镜片，各所述镜片被安装于所述镜筒，所述滤光片被按安装于所述镜筒，位于各所述镜片的下方。According to an embodiment of the present invention, the camera module includes at least one optical filter, the lens includes a lens barrel and at least one lens, each lens is installed in the lens barrel, and the filter is According to being installed on the lens barrel, it is located under each of the lenses.
根据本发明的一实施例，所述摄像模组包括至少一滤光片，所述线路部包括一线路板主体，所述封装部一体封装连接于所述线路板主体，所述线路板主体具有一通路，所述感光芯片倒装于所述通路，所述滤光片覆盖于所述线路板主体的所述通路。According to an embodiment of the present invention, the camera module includes at least one optical filter, the circuit part includes a circuit board main body, the packaging part is integrally packaged and connected to the circuit board main body, and the circuit board main body has A passage, the photosensitive chip is flip-mounted on the passage, and the optical filter covers the passage on the main body of the circuit board.
根据本发明的一实施例，所述摄像模组中所述封装部以注塑或模压的方式一体封装连接于所述线路板部。According to an embodiment of the present invention, the packaging part of the camera module is integrally packaged and connected to the circuit board part by injection molding or molding.
根据本发明的一实施例，所述摄像模组中所述线路板部包括一线路板主体和至少一电路元件，所述电路元件凸出于所述线路板主体，所述封装部包覆所述电路元件，以使其不会暴露于与所述感光芯片连通的空间。According to an embodiment of the present invention, the circuit board part in the camera module includes a circuit board main body and at least one circuit element, the circuit element protrudes from the circuit board main body, and the packaging part covers the The above circuit components are not exposed to the space communicating with the photosensitive chip.
根据本发明的一实施例，所述封装部顶部的至少两侧分别具有至少一凸起台阶，其内侧形成一安装槽，所述摄像模组还包括至少一支座和至少一滤光片，所述支座安装于所述凸起台阶内侧的所述安装槽，所述滤光片安装于所述支座。According to an embodiment of the present invention, at least two sides of the top of the packaging part respectively have at least one protruding step, and a mounting groove is formed on the inner side thereof, and the camera module further includes at least one support and at least one optical filter, The support is installed in the installation groove inside the raised step, and the optical filter is installed in the support.
根据本发明的一实施例，所述封装部顶部的至少一侧的顶表面没有设置所述凸起台阶，以用于支撑所述支座。According to an embodiment of the present invention, the top surface of at least one side of the top of the package part is not provided with the raised step for supporting the support.
根据本发明的一实施例，所述凸起台阶顶表面高于所述支座的表面，所述摄像模组还包括一马达，所述马达贴装于所述凸起台阶。According to an embodiment of the present invention, the top surface of the raised step is higher than the surface of the support, and the camera module further includes a motor, and the motor is mounted on the raised step.
附图说明Description of drawings
图1是传统COB工艺的摄像模组剖视示意图。FIG. 1 is a schematic cross-sectional view of a camera module in a traditional COB process.
图2是根据本发明的第一个优选实施例的基于模塑工艺的摄像模组剖视示意图。FIG. 2 is a schematic cross-sectional view of a camera module based on a molding process according to a first preferred embodiment of the present invention.
图3是根据本发明的第一个优选实施例的基于模塑工艺的摄像模组立体分解示意图。FIG. 3 is an exploded perspective view of a camera module based on a molding process according to a first preferred embodiment of the present invention.
图4是根据本发明的第一个优选实施例的基于模塑工艺的摄像模组的另一实施方式。Fig. 4 is another embodiment of the camera module based on the molding process according to the first preferred embodiment of the present invention.
图5是根据本发明的第二个优选实施例的基于模塑工艺的摄像模组剖视示意图。FIG. 5 is a schematic cross-sectional view of a camera module based on a molding process according to a second preferred embodiment of the present invention.
图6是根据本发明的第三个优选实施例的基于模塑工艺的摄像模组剖视示意图。FIG. 6 is a schematic cross-sectional view of a camera module based on a molding process according to a third preferred embodiment of the present invention.
图7是根据本发明的第四个优选实施例的基于模塑工艺的摄像模塑剖视示意图。Fig. 7 is a schematic cross-sectional view of photo-molding based on a molding process according to a fourth preferred embodiment of the present invention.
图8是根据本发明的第五个优选实施例的基于模塑工艺的摄像模组剖视示意图。FIG. 8 is a schematic cross-sectional view of a camera module based on a molding process according to a fifth preferred embodiment of the present invention.
图9是根据本发明的第六个优选实施例的基于模塑工艺的摄像模组剖视示意图。FIG. 9 is a schematic cross-sectional view of a camera module based on a molding process according to a sixth preferred embodiment of the present invention.
图10是根据本发明的第七个优选实施例的基于模塑工艺的摄像模组剖视示意图。FIG. 10 is a schematic cross-sectional view of a camera module based on a molding process according to a seventh preferred embodiment of the present invention.
图11A、11B是根据本发明的第八个优选实施例的基于模塑工艺的摄像模组不同角度剖视示意图。11A and 11B are cross-sectional schematic diagrams from different angles of the camera module based on the molding process according to the eighth preferred embodiment of the present invention.
图12是根据本发明的第八个优选实施例的基于模塑工艺的摄像模组的部分立体图。Fig. 12 is a partial perspective view of a camera module based on a molding process according to an eighth preferred embodiment of the present invention.
具体实施方式detailed description
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention and The above terms should not be construed as limiting the present invention because the description is simplified rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation.
如图2至图4所示，是根据本发明的第一个优选实施例基于模塑工艺的摄像模组。所述摄像模组可以被应用于各种电子设备，以辅助使用可以通过所述摄像模组进行拍摄活动，例如所述摄像模组可以被用于拍摄物体或人物的图像或视频影像等。优选地，所述摄像模组可以被应用一移动电子设备，例如所述移动电子设备可以是但不限于手机或平板电脑设备。As shown in FIG. 2 to FIG. 4 , it is a camera module based on a molding process according to a first preferred embodiment of the present invention. The camera module can be applied to various electronic devices to assist the use of shooting activities through the camera module, for example, the camera module can be used to shoot images or video images of objects or people. Preferably, the camera module can be applied to a mobile electronic device, for example, the mobile electronic device can be but not limited to a mobile phone or a tablet computer device.
如图2至图4所示，所述摄像模组包括一线路板组件10、一感光芯片30和一镜头50。As shown in FIGS. 2 to 4 , the camera module includes a circuit board assembly 10 , a photosensitive chip 30 and a lens 50 .
进一步，所述感光芯片30被安装于所述线路板组件10，所述镜头50位于所述线路板组件10上，且所述镜头50位于所述感光芯片30的感光路径。所述线路板组件10可以被耦接至所述电子设备，从而与所述电子设备配合使用。本领域的技术人员应当理解的是，所述镜头50和所述芯片可以相互配合拍摄影像。具体地，被拍摄对象，如物体或人物反射的光线在通过所述镜头50之后，被所述感光芯片30接收以进行光电转化。换言之，所述感光芯片30可以将光信号转化为电信号，并且所述电信号能够通过所述线路板组件10被传送至所述电子设备，从而在所述电子设备上生成与所述拍摄对象相关的影像。Further, the photosensitive chip 30 is mounted on the circuit board assembly 10 , the lens 50 is located on the circuit board assembly 10 , and the lens 50 is located in the photosensitive path of the photosensitive chip 30 . The circuit board assembly 10 can be coupled to the electronic device, so as to cooperate with the electronic device. Those skilled in the art should understand that the lens 50 and the chip can cooperate with each other to capture images. Specifically, the light reflected by the photographed object, such as an object or person, passes through the lens 50 and is received by the photosensitive chip 30 for photoelectric conversion. In other words, the photosensitive chip 30 can convert the optical signal into an electrical signal, and the electrical signal can be transmitted to the electronic device through the circuit board assembly 10, so as to generate an image corresponding to the subject on the electronic device. related images.
所述线路板组件10包括一封装部11和一线路板部12，所述封装部11一体地封装连接于所述线路板部12，如模塑地连接于所述线路板部12。更具体地，所述封装部11通过模塑于线路板的方式(Molding On Board，MOB)模塑连接于所述线路板部，模塑工艺可以是注塑或模压等工艺。The circuit board assembly 10 includes an encapsulation part 11 and a circuit board part 12 , the encapsulation part 11 is integrally packaged and connected to the circuit board part 12 , such as connected to the circuit board part 12 by molding. More specifically, the packaging part 11 is molded and connected to the circuit board part by molding on a circuit board (MOB), and the molding process may be injection molding or compression molding.
所述线路板部12包括一线路板主体121，所述封装部11一体连接于所述线路板主体121。所述封装部11形成一通孔111，以使得所述封装部11围绕于所述感光芯片30外侧，并且提供所述镜头50和所述感光芯片30的光线通路。所述感光芯片30被设置于所述通孔111对应位置的素数线路板主体121。The circuit board part 12 includes a circuit board main body 121 , and the packaging part 11 is integrally connected to the circuit board main body 121 . A through hole 111 is formed in the encapsulation part 11 , so that the encapsulation part 11 surrounds the outside of the photosensitive chip 30 and provides a light path between the lens 50 and the photosensitive chip 30 . The photosensitive chip 30 is disposed on the prime circuit board main body 121 corresponding to the through hole 111 .
所述线路板部12包括一连接线31路和至少一电路元件122，所述连接线31路预设于所述线路板主体121，所述电路元件122电连接于所述连接电路，以供所述感光芯片30的感光工作过程。所述电路元件122可以是，举例地但不限于，电阻、电容、二极管、三极管，电位器，继电器、驱动器等。The circuit board part 12 includes a connection line 31 and at least one circuit element 122, the connection line 31 is preset in the circuit board main body 121, and the circuit element 122 is electrically connected to the connection circuit for The photosensitive working process of the photosensitive chip 30 . The circuit element 122 may be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver and the like.
值得一提的是，所述封装部11可以将所述电路元件122元件包覆于内部，因此使得所述电路元件122不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片30相连通的封闭环境中。不同传统的摄像模组中电路器件的存在方式，如阻容器件凸出于线路板的方式，从而防止灰尘、杂物停留于所述电路元件122而污染所述感光芯片30。在本发明的这个实施例中，以所述电路元件122凸出于所述线路板主体121为例进行说明，而在本发明的其他实施例中，所述电路元件122被埋设于所述线路板主体121内部，而不凸出所述线路板主体121，本领域的技术人员应当理解的是，所述电路元件122的结构、类型和被设置的位置并不是本发明的限制。可以理解的是，在传动的摄像模组中，电路器件凸出于所述线路板，而底座只能被安装于所述电路元件122的外侧，因此所述电路器件和所述底座都需要一定的空间位置，因此对线路板在横向的尺寸要求较高。而对于本发明的基于模塑工艺的摄像模组，所述封装部11一体封装于所述线路板主体121，且包覆所述电路元件122，因此所述封装部11和所述电路元件122在空间相互重叠，从而增加了所述封装部11可以向内设置的空间，减小了对所述线路板主体121外部延伸需求，从而减小所述摄像模组的横向尺寸，使其可以满足小型化需求的设备。It is worth mentioning that the packaging part 11 can wrap the circuit element 122 inside, so that the circuit element 122 will not be directly exposed to the space, more specifically, will not be exposed to the In a closed environment where the photosensitive chip 30 is connected. The existing way of the circuit components in the different traditional camera module, such as the way of the resistance container protruding from the circuit board, so as to prevent dust and sundries from staying on the circuit components 122 and contaminating the photosensitive chip 30 . In this embodiment of the present invention, it is described by taking the circuit element 122 protruding from the circuit board main body 121 as an example, while in other embodiments of the present invention, the circuit element 122 is embedded in the circuit Those skilled in the art should understand that the structure, type and location of the circuit elements 122 are not limitations of the present invention. It can be understood that, in the transmission camera module, the circuit device protrudes from the circuit board, and the base can only be installed on the outside of the circuit element 122, so the circuit device and the base need a certain Therefore, the requirements for the horizontal size of the circuit board are relatively high. For the camera module based on the molding process of the present invention, the packaging part 11 is integrally packaged on the circuit board main body 121 and covers the circuit element 122, so the packaging part 11 and the circuit element 122 The space overlaps with each other, thereby increasing the space where the packaging part 11 can be arranged inwardly, reducing the requirement for the external extension of the circuit board main body 121, thereby reducing the lateral dimension of the camera module, so that it can meet Equipment for miniaturization needs.
值得一提的是，所述封装部11包覆所述电路元件122具有保护所述电路元件122，使其免于被污染以及被误碰触的优势，同时对相应的摄像模组带来优势，但是本领域的技术人员应当理解的是，所述封装部11不限于包覆所述电路元件122。也就是说，在本发明的其他实施例中，所述封装部11可以直接模塑于没有凸出的所述电路元件122的所述线路板主体121，也可以是模塑于所述电路元件122的外侧，周围等不同位置。It is worth mentioning that the encapsulation of the circuit element 122 by the packaging part 11 has the advantage of protecting the circuit element 122 from being polluted and accidentally touched, and at the same time brings advantages to the corresponding camera module , but those skilled in the art should understand that the packaging part 11 is not limited to wrapping the circuit element 122 . That is to say, in other embodiments of the present invention, the packaging part 11 can be directly molded on the circuit board main body 121 of the circuit element 122 without protrusion, or can be molded on the circuit element 122 outside, around and other different positions.
在本发明这个实施例中，所述封装部11凸起地围绕于所述感光芯片30外侧，特别地，所述封装部11一体地闭合连接，使其具有良好的密封性，从而当所述镜头50被安装于所述感光芯片30的感光路径时，所述感光芯片30被密封于内部，从而形成对应的封闭内空间。In this embodiment of the present invention, the encapsulation part 11 surrounds the outside of the photosensitive chip 30 in a convex manner, especially, the encapsulation part 11 is integrally closed and connected so that it has good sealing performance, so that when the When the lens 50 is installed in the photosensitive path of the photosensitive chip 30 , the photosensitive chip 30 is sealed inside to form a corresponding closed inner space.
具体地，在制造所述线路板组件10时，可以选择一传统的线路板作为所述线路板主体121，在所述线路板主体121表面进行模塑。比如，在一实施例中，可以用注塑机，通过嵌入成型(Insert Molding)工艺将进行SMT工艺(SurfaceMount Technology表面贴装工艺)后的线路板进行一体封装，比如模塑封装，形成所述封装部11，或通过半导体封装中常用的模压工艺形成所述封装部11。进一步，将各所述感光芯片30贴装于所述线路板主体121，继而将各所述感光芯片30与所述线路板主体121进行电连接，比如打金线电连接。所述线路板主体121可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部11形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部11可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。Specifically, when manufacturing the circuit board assembly 10 , a traditional circuit board can be selected as the circuit board main body 121 and molded on the surface of the circuit board main body 121 . For example, in one embodiment, an injection molding machine can be used to integrally package the circuit board after the SMT process (Surface Mount Technology surface mount process) through an Insert Molding process, such as a molded package, to form the package part 11, or form the package part 11 through a molding process commonly used in semiconductor packaging. Further, each of the photosensitive chips 30 is mounted on the circuit board main body 121 , and then each of the photosensitive chips 30 is electrically connected to the circuit board main body 121 , such as by gold wires. The circuit board main body 121 can be selected as, for example but not limited to, a rigid-flex board, a ceramic substrate (without a soft board), a PCB rigid board (without a soft board), and the like. The method of forming the package part 11 can be selected, for example but not limited to, injection molding process, molding process and the like. The materials that can be selected for the packaging part 11 are, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene) etc. can be selected for the injection molding process, and rings can be used for the molding process. oxygen resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate possible implementation methods of the present invention, and are not limitations of the present invention.
在本发明的其他实施例中，制造所述线路板组件10的过程还可以是，先对所述线路板主体121进行SMT工艺，进而将所述感光芯片30贴装于所述线路板主体121，并且将所述感光芯片30与所述线路板主体121进行电连接，比如打金线电连接，继而将对所述线路板主体121进行一体封装，比如模塑封装，通过嵌入成型的方式形成所述封装部11，或通过半导体封装中常用的模压工艺形成所述封装部11。本领域的技术人员应当理解的是，所述线路板组件10的制造顺序并不是本发明的限制。In other embodiments of the present invention, the process of manufacturing the circuit board assembly 10 may also be to firstly perform an SMT process on the circuit board main body 121, and then mount the photosensitive chip 30 on the circuit board main body 121. , and the photosensitive chip 30 is electrically connected to the circuit board main body 121, such as electrically connecting with a gold wire, and then the circuit board main body 121 is integrally packaged, such as molded package, formed by insert molding The encapsulation part 11 may be formed by a molding process commonly used in semiconductor packaging. Those skilled in the art should understand that the manufacturing sequence of the circuit board assembly 10 is not a limitation of the present invention.
所述摄像模组包括一滤光片40，所述滤光片40被安装于所述封装部11，以便于为所述滤光片40提供稳定、平整的安装条件。The camera module includes a filter 40 , and the filter 40 is mounted on the packaging part 11 so as to provide a stable and flat installation condition for the filter 40 .
更具体地，在本发明的一实施例中，所述滤光片40被实施为一红外截止滤光片40(Infra-Red Cut Filter，IRCF)，所述红外截止滤光片40是利用精密光学镀膜技术在光学基片上交替镀上高折射率的光学膜，实现可见光区(400-630nm)高透，近红外(700-1100nm)截止的光学滤光片40，其可以消除红外光线对所述感光芯片30的成像影响，如CCD或CMOS。通过在所述摄像模组的成像系统中加入所述红外截止滤光片40，阻挡成像系统部分干扰成像质量的红外光，使得所述摄像模组所成影像更加符合人眼的最佳感觉。More specifically, in an embodiment of the present invention, the filter 40 is implemented as an infrared cut filter 40 (Infra-Red Cut Filter, IRCF), and the infrared cut filter 40 is made using precision The optical coating technology alternately coats the optical film with high refractive index on the optical substrate to realize the optical filter 40 with high transparency in the visible light region (400-630nm) and cut-off near infrared (700-1100nm), which can eliminate the impact of infrared light on all The imaging effect of the photosensitive chip 30, such as CCD or CMOS. By adding the infrared cut-off filter 40 in the imaging system of the camera module, the infrared light that partially interferes with the imaging quality of the imaging system is blocked, so that the image formed by the camera module is more in line with the best feeling of human eyes.
值得一提的是，由于所述感光芯片30，如CCD或CMOS，对光的感应和人眼不同，人眼只能看到380-780nm波段的可见光，而所述感光芯片30则可以感应更多波段，如红外光和紫外光，尤其对红外光十分敏感，因此在所述摄像模组中必须要将红外光加以抑制，并保持可见光的高透过，使得所述感光芯片30的感应接近于人眼，从而使得所述摄像模组拍摄的图像也符合眼睛的感应，因此所述红外截止滤光片40对于所述摄像模组是不可或缺的。It is worth mentioning that since the photosensitive chip 30, such as CCD or CMOS, has a different sensitivity to light than the human eye, the human eye can only see visible light in the 380-780nm band, while the photosensitive chip 30 can sense more light. Multi-wave bands, such as infrared light and ultraviolet light, are especially sensitive to infrared light. Therefore, in the camera module, infrared light must be suppressed, and high transmission of visible light must be maintained, so that the sensing of the photosensitive chip 30 is close to The infrared cut-off filter 40 is indispensable for the camera module, so that the image captured by the camera module is also in line with the perception of the human eye.
特别地，在本发明的实施例中，所述滤光片40可以选自组合：晶圆级红外截止滤光片、窄带滤光片、蓝玻璃IRCF。本领域的技术人员应当理解的是，所述滤光片40的类型并不是本发明的限制。In particular, in the embodiment of the present invention, the filter 40 may be selected from a combination of: wafer level infrared cut filter, narrow band filter, blue glass IRCF. Those skilled in the art should understand that the type of the filter 40 is not a limitation of the present invention.
在传统的COB组装的摄像模组中，滤光片通常被安装于塑料底座，且底座通常是通过粘接的方式安装于线路板，因此这种塑料底座以及相应的安装方式不容易出现偏移或倾斜，且塑料支架的表面平整度较差，因此不能为滤光片40提供良好的安装条件。根据本发明这个优选实施例，所述滤光片40被安装于所述封装部11，且基于模塑工艺，能够得到良好的表面平针性，因此能够为所述滤光片40提供平整的安装条件，且一体成型的方式，使得所述封装部11不易出现偏移、倾斜现象，从而减小所述滤光片40安装时的累积公差。In a traditional COB assembled camera module, the optical filter is usually mounted on a plastic base, and the base is usually mounted on the circuit board by bonding, so the plastic base and the corresponding installation method are not easy to shift Or inclined, and the flatness of the surface of the plastic bracket is poor, so it cannot provide a good installation condition for the optical filter 40 . According to this preferred embodiment of the present invention, the optical filter 40 is mounted on the packaging part 11, and based on the molding process, good surface flatness can be obtained, so that the optical filter 40 can be provided with a flat surface. The installation conditions and the way of integral molding make the packaging part 11 less likely to be shifted and tilted, thereby reducing the cumulative tolerance when the optical filter 40 is installed.
在本发明的这个实施例中，所述封装部11的顶表面112一体平面延伸，所述滤光片40被安装于所述封装部11的所述顶表面112。特别地，所述滤光片40可以通过粘接的方式连接于所述封装部11的所述顶表面112。In this embodiment of the present invention, the top surface 112 of the package part 11 extends in a plane, and the filter 40 is installed on the top surface 112 of the package part 11 . In particular, the optical filter 40 can be connected to the top surface 112 of the package part 11 by adhesive.
在本发明的这个实施例中，所述摄像模组包括一马达60，如音圈马达，所述镜头50被安装于所述马达60，以便于通过所述马达60驱动所述镜头50运动，调节所述摄像模组的焦距，也就是说，所述摄像模组为一动焦模组(AutomaticFocus Model，AFM)。In this embodiment of the present invention, the camera module includes a motor 60, such as a voice coil motor, and the lens 50 is mounted on the motor 60 so as to drive the lens 50 to move through the motor 60, The focal length of the camera module is adjusted, that is, the camera module is an Automatic Focus Model (AFM).
所述马达60被安装于所述线路板组件10的所述封装部11，进一步，所述马达60被安装于所述封装部11的所述顶表面112，也就是说，所述滤光片40和所述马达60相互协调占用所述封装部11的所述顶表面112。The motor 60 is mounted on the package part 11 of the circuit board assembly 10, further, the motor 60 is mounted on the top surface 112 of the package part 11, that is to say, the optical filter 40 and the motor 60 occupy the top surface 112 of the package 11 in coordination with each other.
所述镜头50被安装于所述马达60，所述马达60和所述滤光片40被安装于所述封装部11，从而所述封装部11相当于传统摄像模组的底座的功能，为所述马达60和所述滤光片40提供支撑、固定的位置，但是制造、组装以及形态却不同于传统COB工艺。传统的COB工艺的摄像模组的底座以粘接的方式固定于线路板，而所述封装部11通过模塑于线路板的方式固定于所述线路板主体121，不需要粘接固定过程，模塑方式相对于粘接固定方式具有更好的连接稳定性以及工艺过程的可控制性，平整性较高，为所述马达60和所述滤光片40提供良好的安装条件，且所述封装部11和所述线路板主体121不存在AA调整的胶水空间，因此省去了传统摄像模组AA调整的预留空间，使得所述摄像模组的厚度得以减小；另一方面，所述封装部11包覆所述电路元件122，使得传统底座空间和电路元件122安装空间可以在空间上重叠，不需要像传统的摄像模组，在电路器件周围预留安全距离，从而使得具有底座功能的所述封装部11可以设置在较小的尺寸，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部11代替传统的底座，避免了底座在粘贴组装时带来的倾斜误差，减小了所述摄像模组组装的累积公差。The lens 50 is mounted on the motor 60, and the motor 60 and the filter 40 are mounted on the packaging part 11, so that the packaging part 11 is equivalent to the function of the base of a traditional camera module, for The motor 60 and the filter 40 provide support and a fixed position, but the fabrication, assembly and shape are different from conventional COB processes. The base of the camera module of the traditional COB process is fixed on the circuit board by bonding, and the packaging part 11 is fixed on the circuit board main body 121 by molding on the circuit board, and no bonding and fixing process is required. Compared with the adhesive fixing method, the molding method has better connection stability and controllability of the process, and has higher flatness, which provides good installation conditions for the motor 60 and the optical filter 40, and the There is no glue space for AA adjustment between the packaging part 11 and the circuit board main body 121, so the reserved space for AA adjustment of the traditional camera module is omitted, so that the thickness of the camera module can be reduced; on the other hand, the The packaging part 11 covers the circuit element 122, so that the traditional base space and the installation space of the circuit element 122 can overlap in space, and there is no need to reserve a safe distance around the circuit element like a traditional camera module, so that there is a base The functional packaging part 11 can be set in a smaller size, thereby further providing a space for reducing the thickness of the camera module. In addition, the packaging part 11 replaces the traditional base, which avoids the tilt error caused by the base during pasting and assembly, and reduces the cumulative tolerance of the camera module assembly.
还值得一提的是，所述封装部11的形状可以更加需要确定，比如在所述电路元件122所在位置向内延伸，形成一凸出部，从而增加所述封装部11对应的宽度，而在没有所述电路元件122的位置，所述连体模塑部一致地延伸，形成比较规则的形状，且宽度较小。本领域的技术人员应当理解的是，所述封装部11的具体形状并不是本发明的限制。It is also worth mentioning that the shape of the packaging part 11 can be more determined, such as extending inward at the position of the circuit element 122 to form a protrusion, thereby increasing the corresponding width of the packaging part 11, and Where the circuit element 122 is absent, the one-piece molding extends uniformly, forming a more regular shape with a smaller width. Those skilled in the art should understand that the specific shape of the packaging part 11 is not a limitation of the present invention.
根据本发明的这个实施例，所述感光芯片30通过至少一连接线31可通电连接于所述线路板主体121，并且可通电连接于所述连接线31路。所述连接线31可以被实施为，举例地但不限于，金线、铜线、铝线、银线。特别地，所述感光芯片30的所述连接线31可以通过传统的COB方式连接于所述线路板主体121，举例地但不限于，焊接的方式。也就是说，所述感光芯片30与所述线路板主体121的连接可充分利用已有的成熟连接技术，以降低改进技术的成本，对传统的工艺和设备进行充分利用，避免资源浪费。当然，本领域的技术人员应当可以理解的是，所述感光芯片30与所述线路板主体121的连接也可以通过其它任何能够实现的本发明的发明目的的连接方式实现，本发明在这方面不受限制。According to this embodiment of the present invention, the photosensitive chip 30 can be electrically connected to the circuit board main body 121 through at least one connecting wire 31 , and can be electrically connected to the connecting wire 31 . The connection wires 31 can be implemented as, for example but not limited to, gold wires, copper wires, aluminum wires, and silver wires. In particular, the connection wire 31 of the photosensitive chip 30 can be connected to the circuit board main body 121 through a traditional COB method, for example but not limited to, a soldering method. That is to say, the connection between the photosensitive chip 30 and the circuit board main body 121 can make full use of the existing mature connection technology, so as to reduce the cost of improving the technology, make full use of the traditional process and equipment, and avoid waste of resources. Of course, those skilled in the art should understand that the connection between the photosensitive chip 30 and the circuit board main body 121 can also be realized by any other connection method that can achieve the purpose of the present invention. Unrestricted.
值得一提的是，在本发明个的这个实施例中，各所述感光芯片30被设置于所述线路板主体121的上表面，所述封装部11围绕于所述感光芯片30的外侧。在制造所述线路板组件10时，可以选择不同制造顺序，举例地但不限于，在一种实施方式中，可以先在所述线路板主体121上安装所述感光芯片30，而后在所述感光芯片30外侧，所述线路板主体121上模塑形成所述封装部11，并且将凸出于所述线路板主体121的所述电路元件122包覆于其内部。而在本发明的另一种实施方式中，可以先在所述线路板主体121上模塑形成所述封装部11，并且将凸出于所述线路板主体121的所述电路元件122包覆于其内部，继而将所述感光芯片30安装于所述线路板主体121，使其位于所述封装部11的内侧。It is worth mentioning that, in this embodiment of the present invention, each of the photosensitive chips 30 is disposed on the upper surface of the circuit board main body 121 , and the packaging portion 11 surrounds the outer side of the photosensitive chips 30 . When manufacturing the circuit board assembly 10, different manufacturing sequences can be selected. For example but not limited to, in one embodiment, the photosensitive chip 30 can be installed on the circuit board main body 121 first, and then installed on the circuit board main body 121. Outside the photosensitive chip 30 , the encapsulation part 11 is molded on the circuit board main body 121 , and the circuit element 122 protruding from the circuit board main body 121 is covered inside it. In another embodiment of the present invention, the encapsulation part 11 may be molded on the main body 121 of the circuit board first, and the circuit element 122 protruding from the main body 121 of the circuit board may be covered. Inside it, the photosensitive chip 30 is mounted on the circuit board main body 121 so that it is located inside the packaging part 11 .
参照图4，是根据本发明的第一个优选实施例的摄像模组的另一实施方式，所述摄像模组可以是一定焦模组(Fix Focus Model，FFM)。在所述摄像模组中，所述镜头50被安装于所述封装部11的顶表面112，即所述摄像模组的焦距不可以被自由地调整。所述镜头50和所述滤光片40协调配置所述封装部11的所述顶表面112。本领域的技术人员应当理解的是，所述摄像模塑的类型并不是本发明的限制。Referring to FIG. 4 , it is another implementation of the camera module according to the first preferred embodiment of the present invention, and the camera module may be a Fix Focus Model (FFM). In the camera module, the lens 50 is installed on the top surface 112 of the packaging part 11 , that is, the focal length of the camera module cannot be adjusted freely. The lens 50 and the optical filter 40 are coordinated to configure the top surface 112 of the package part 11 . It should be understood by those skilled in the art that the type of photomolding is not a limitation of the present invention.
值得一提的是，根据本发明的这个优选实施例，所述封装部11可以用来支撑安装所述滤光片40和所述镜头50，具有传统底座的功能，而基于模塑的优势，所述封装部11可以借助模具来控制所述封装部11的平整性和一致性，从而为所述摄像模组的所述滤色和所述镜头50提供平整的且一致的安装环境，从而更容易保证镜头50和滤光片40以及感光芯片30的光轴的一致性，这一点是传统的摄像模组不容易达到的。It is worth mentioning that, according to this preferred embodiment of the present invention, the packaging part 11 can be used to support and install the optical filter 40 and the lens 50, which has the function of a traditional base, and based on the advantages of molding, The package part 11 can control the flatness and consistency of the package part 11 by means of a mold, so as to provide a flat and consistent installation environment for the color filter and the lens 50 of the camera module, thereby making it more It is easy to ensure the consistency of the optical axes of the lens 50, the optical filter 40 and the photosensitive chip 30, which is not easy to achieve with traditional camera modules.
如图5所示，是根据本发明的第二个优选实施例的摄像模组。不同于上述优选实施例的是，所述封装部11具有一安装槽113A，所述安装槽113A连通于所述通孔111，以便为所述滤光片40提供充足的安装空间。也就是说，所述封装部11的所述顶表面112呈台阶状结构，而并不是一体延伸，所述顶表面112的各台阶上可用于安装所述滤光片40、所述镜头50或所述马达60。As shown in Fig. 5, it is a camera module according to the second preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the packaging part 11 has a mounting groove 113A, and the mounting groove 113A communicates with the through hole 111 to provide sufficient mounting space for the optical filter 40 . That is to say, the top surface 112 of the package part 11 has a stepped structure, rather than extending integrally, and each step of the top surface 112 can be used to install the optical filter 40, the lens 50 or The motor 60.
进一步，所述安装槽113A的高度大于所述滤光片40的厚度，以使得所述滤光片40被安装于所述安装槽113A时，所述滤光片40不会凸出于所述封装部11的顶端。Further, the height of the installation groove 113A is greater than the thickness of the filter 40, so that when the filter 40 is installed in the installation groove 113A, the filter 40 will not protrude from the The top of the package part 11.
特别地，根据本发明的这个实施例，所述滤光片40呈方形，所述安装槽113A的形状与所述滤光片40的形状相适应。也就是说，所述安装槽113A呈方环形，连通于所述通孔111。In particular, according to this embodiment of the present invention, the optical filter 40 is in a square shape, and the shape of the installation groove 113A is adapted to the shape of the optical filter 40 . That is to say, the installation groove 113A is in a square shape and communicates with the through hole 111 .
值得一提的是，在本发明的这个实施例中，所述安装槽113A可以用于安装所述滤光片40，而在本发明的其他实施中，所述安装槽113A可以用来安装所述摄像模组的马达60或所述镜头50等部件，本领域的技术人员应当理解的是，所述安装槽113的用途并不是本发明的限制。It is worth mentioning that in this embodiment of the present invention, the installation groove 113A can be used to install the filter 40, and in other implementations of the invention, the installation groove 113A can be used to install all Those skilled in the art should understand that the usage of the installation groove 113 is not a limitation of the present invention.
还值得一提的是，在本发明的这个实施例中，附图中以动焦模组为例进行说明，而在本发明的其他实施例中，所述摄像可以是一定焦模组，本领域的技术人员应当理解的是，所述摄像模组的类型并不是本发明的限制。It is also worth mentioning that in this embodiment of the present invention, the moving focus module is used as an example for illustration in the accompanying drawings, while in other embodiments of the present invention, the camera can be a fixed focus module. Those skilled in the art should understand that the type of the camera module is not a limitation of the present invention.
如图6所示，是根据本发明的第三个优选实施例的基于模塑工艺的摄像模组剖视示意图。不同于上述优选实施例的是，所述摄像模组包括一支座70B，所述支座70B用于安装所述滤光片40。所述支座70B被安装于所述封装部11，所述滤光片40被安装于所述封装部11，所述马达60或所述镜头50被安装于所述支座70B。As shown in FIG. 6 , it is a schematic cross-sectional view of a camera module based on a molding process according to a third preferred embodiment of the present invention. Different from the above-mentioned preferred embodiments, the camera module includes a support 70B, and the support 70B is used for installing the filter 40 . The mount 70B is mounted on the package 11 , the optical filter 40 is mounted on the seal 11 , and the motor 60 or the lens 50 is mounted on the mount 70B.
根据本发明的这个实施例，所述支座70B具有一第一支座槽71B和一第二支座槽72B，所述第一支座槽71B用于安装所述滤光片40，使得所述滤光片40的表面不会凸出于所述支座70B的顶端。所述第二支座槽72B，用于安装于所述封装部11，以使得所述封装部11沿所述支座70向上延伸，而所述滤光片40的位置性对向下，从而减小所述摄像模组的后焦距。According to this embodiment of the present invention, the support 70B has a first support groove 71B and a second support groove 72B, and the first support groove 71B is used to install the filter 40, so that the The surface of the filter 40 does not protrude from the top of the support 70B. The second support groove 72B is used to install the package part 11, so that the package part 11 extends upward along the support 70, and the position of the filter 40 is facing downward, so that Reduce the back focus of the camera module.
换句话说，所述支座70B向所述通孔111内延伸，且向下延伸，从而将所述滤光片40支撑于所述感光芯片30上方，且利用所述通孔111内的空间，使得滤光片40被稳定安装的同时，所述滤光片40不会占用外部空间。In other words, the support 70B extends into the through hole 111 and extends downward, so as to support the filter 40 above the photosensitive chip 30 and utilize the space in the through hole 111 , so that the optical filter 40 is installed stably and at the same time, the optical filter 40 does not occupy external space.
值得一提的是，所述支座70B向内延伸的距离位于所述感光芯片30的感光区之外，也就是说，所述支座70B不会遮挡所述感光芯片30的所述感光区，以避免影响所述感光芯片30的感光过程，所述支座70B的尺寸可以具体需求设计。It is worth mentioning that the inward extension distance of the support 70B is outside the photosensitive area of the photosensitive chip 30 , that is, the support 70B will not block the photosensitive area of the photosensitive chip 30 In order to avoid affecting the photosensitive process of the photosensitive chip 30, the size of the support 70B can be designed according to specific requirements.
在本发明的这个实施例以及相应附图中，以动焦模组为例进行说明，所述镜头50被按安装于所述马达60，所述马达60被安装于所述支座70B。也就是说，所述支座70为所述滤光片40和所述马达60提供安装位置。而在本本发明的其他实施例中，所述摄像模组还可以是一定焦模组。所述镜头50被安装于所述支座70B，也就是说，所述支座70B为所述滤光片40和所述镜头50提供安装位置，本领域的技术人员应当理解的是，所述支座70B的具体结构和所述摄像模组的类型并不是本发明的限制。In this embodiment of the present invention and the accompanying drawings, a moving focus module is taken as an example for illustration, the lens 50 is installed on the motor 60 , and the motor 60 is installed on the support 70B. That is to say, the support 70 provides installation positions for the optical filter 40 and the motor 60 . In other embodiments of the present invention, the camera module may also be a fixed-focus module. The lens 50 is installed on the support 70B, that is to say, the support 70B provides a mounting position for the filter 40 and the lens 50, those skilled in the art should understand that the The specific structure of the support 70B and the type of the camera module are not limitations of the present invention.
如图7所示，是根据本发明的第四个优选实施例的基于模塑工艺的摄像模塑剖视示意图。不同于上述优选实施例的是，所述封装部11具有一安装槽113C，所述安装槽113C连通于所述通孔111。也就是说，所述封装部11的所述顶表面112呈台阶状结构，而并不是一体延伸。As shown in FIG. 7 , it is a schematic cross-sectional view of the camera molding based on the molding process according to the fourth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiments, the packaging part 11 has a mounting groove 113C, and the mounting groove 113C communicates with the through hole 111 . That is to say, the top surface 112 of the package portion 11 has a stepped structure, rather than extending integrally.
所述摄像模组包括一支座70C，所述支座70C用于安装所述滤光片40。所述支座70C被安装于所述封装部11，所述滤光片40被安装于所述封装部11，所述马达60或所述镜头50被安装于所述封装部11。The camera module includes a support 70C, and the support 70C is used for installing the filter 40 . The holder 70C is installed in the package 11 , the optical filter 40 is installed in the package 11 , and the motor 60 or the lens 50 is installed in the package 11 .
进一步，所述支座70C被安装于所述封装部11的所述安装槽113C，且所述安装槽113C的高度大于所述支座70C的安装高度，从而使得所述支座70C不会凸出于所述封装部11的所述端部。Further, the support 70C is installed in the installation groove 113C of the packaging part 11, and the height of the installation groove 113C is greater than the installation height of the support 70C, so that the support 70C does not protrude. out of the end of the package 11 .
根据本发明的这个实施例，所述支座70C具有一第一支座槽71C和一第二支座槽72C，所述第一支座槽71C用于安装所述滤光片40，使得所述滤光片40的表面不会凸出于所述支座70C的顶端。所述第二支座槽72C，用于安装于所述封装部11，以使得所述封装部11沿所述支座70C向上延伸，而所述滤光片40的位置性对向下，从而减小所述摄像模组的后焦距。可以理解的是，在其他变形实施例中，所述支座70C也可以没有上述第二支座槽72C，所述支座72C的平整底表面直接贴装于所述封装部11。According to this embodiment of the present invention, the support 70C has a first support groove 71C and a second support groove 72C, the first support groove 71C is used to install the filter 40, so that the The surface of the filter 40 does not protrude from the top of the support 70C. The second seat groove 72C is used for mounting on the package part 11, so that the package part 11 extends upward along the seat 70C, and the position of the filter 40 faces downward, so that Reduce the back focus of the camera module. It can be understood that, in other modified embodiments, the support 70C may not have the above-mentioned second support groove 72C, and the flat bottom surface of the support 72C is directly attached to the package part 11 .
换句话说，所述支座70C向所述通孔111内延伸，且向下延伸，从而将所述滤光片40支撑于所述感光芯片30上方，且利用所述通孔111内的空间，使得滤光片40被稳定安装的同时，所述滤光片40不会占用外部空间。In other words, the support 70C extends into the through hole 111 and extends downward, so as to support the filter 40 above the photosensitive chip 30 and utilize the space in the through hole 111 , so that the optical filter 40 is installed stably and at the same time, the optical filter 40 does not occupy external space.
值得一提的是，所述支座70C向内延伸的距离位于所述感光芯片30的感光区之外，也就是说，所述支座70C不会遮挡所述感光芯片30，以避免影响所述感光芯片30的感光过程，所述支座70C的尺寸可以具体需求设计。It is worth mentioning that the inward extension distance of the support 70C is outside the photosensitive area of the photosensitive chip 30, that is to say, the support 70C will not block the photosensitive chip 30 to avoid affecting the photosensitive chip 30. Referring to the photosensitive process of the photosensitive chip 30, the size of the support 70C can be designed according to specific requirements.
不同于第三个优选实施例的是，所述第二支座槽71C和所述封装的所述安装槽113C相互配合，形成匹配的卡接结构，从而使得所述支座70C得以稳定的安装于所述安装槽113C内。相对第三个优选实施例，这个实施例中的所述滤光片40距离所述感光芯片30更小，可以获得具有更小后焦距的所述摄像模组。Different from the third preferred embodiment, the second support groove 71C and the installation groove 113C of the package cooperate with each other to form a matching snap-in structure, so that the support 70C can be installed stably in the installation groove 113C. Compared with the third preferred embodiment, the distance between the optical filter 40 and the photosensitive chip 30 in this embodiment is smaller, so that the camera module with a smaller back focus can be obtained.
在本发明的这个实施例以及相应附图中，以动焦模组为例进行说明，所述镜头50被按安装于所述马达60，所述马达60被安装于所述支座70C。也就是说，所述支座70C为所述滤光片40和所述马达60提供安装位置。而在本本发明的其他实施例中，所述摄像模组还可以是一定焦模组。所述镜头50被安装于所述支座70C，也就是说，所述支座70C为所述滤光片40和所述镜头50提供安装位置，本领域的技术人员应当理解的是，所述支座70的具体结构和所述摄像模组的类型并不是本发明的限制。In this embodiment of the present invention and corresponding drawings, a moving focus module is used as an example for illustration, the lens 50 is mounted on the motor 60 , and the motor 60 is mounted on the support 70C. That is to say, the holder 70C provides a mounting position for the filter 40 and the motor 60 . In other embodiments of the present invention, the camera module may also be a fixed-focus module. The lens 50 is installed on the support 70C, that is to say, the support 70C provides a mounting position for the filter 40 and the lens 50, those skilled in the art should understand that the The specific structure of the support 70 and the type of the camera module are not limitations of the present invention.
如图8所示，是根据本发明的第五个优选实施例的基于模塑工艺的摄像模组剖视示意图。不同于上述优选实施例的是，所述滤光片40被安装于一马达60D，所述马达60D被安装于所述封装部11，从而不需要提供额外的部件来安装所述滤光片40。As shown in FIG. 8 , it is a schematic cross-sectional view of a camera module based on a molding process according to a fifth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the optical filter 40 is installed on a motor 60D, and the motor 60D is installed on the packaging part 11, so that there is no need to provide additional components to install the optical filter 40 .
所述马达60D包括一下端部61D，所述下端部61D适于安装于所述滤光片40。也就是说，所述镜头50被安装于所述马达60D的上端，所述滤光片40被安装于所述马达60D的所述下端部61D，位于所述镜头50的下方。The motor 60D includes a lower end portion 61D, and the lower end portion 61D is adapted to be mounted on the optical filter 40 . That is to say, the lens 50 is installed on the upper end of the motor 60D, and the filter 40 is installed on the lower end 61D of the motor 60D, which is located below the lens 50 .
本发明的这个实施例中，所述滤光片40被安装于所述马达60D，从而不需要提供额外的部件来安装所述滤光片40，且所述马达60D被直接安装于所述封装部11，为所述马达60D提供平整的安装条件。In this embodiment of the present invention, the optical filter 40 is installed on the motor 60D, so that there is no need to provide additional components to install the optical filter 40, and the motor 60D is directly installed on the package The part 11 provides a flat installation condition for the motor 60D.
如图9所示，是根据本发明的第六个优选实施例的基于模塑工艺的摄像模组剖视示意图。不同于上述优选实施例的是，所述镜头50E包括一镜筒51E和至少一镜片52E，各所述镜片52E被安装于所述镜筒51E内。As shown in FIG. 9 , it is a schematic cross-sectional view of a camera module based on a molding process according to a sixth preferred embodiment of the present invention. Different from the above preferred embodiments, the lens 50E includes a lens barrel 51E and at least one lens 52E, and each lens 52E is installed in the lens barrel 51E.
根据本发明的这个实施例，所述滤光片40被按安装于所述镜筒51E内，位于各所述镜片52E的下方，从而不需要提供额外的部件来安装所述滤光片40。According to this embodiment of the present invention, the optical filter 40 is installed in the lens barrel 51E, under each of the lenses 52E, so that there is no need to provide additional components to install the optical filter 40 .
更具体地，所述镜筒51E包括一底部511E，所述底部511E用于安装所述滤光片40。所述镜筒51E的底座与所述滤光片40的形状相适应，也就是说，所述底座呈中空方形结构，以便于将所述滤光片40安装于其中。所述镜筒51E上部用于安装所述镜片52E，且所述镜片52E的形状相适应，而下部用于安装所述滤光片40，且与所述滤光片40的形状相适应，因此，所述镜筒51E整体上部呈圆管状柱体，而下部的内部呈方形，且所述圆管和所述方形一体连接。More specifically, the lens barrel 51E includes a bottom 511E for installing the filter 40 . The base of the lens barrel 51E is adapted to the shape of the optical filter 40 , that is to say, the base is a hollow square structure, so as to install the optical filter 40 therein. The upper part of the lens barrel 51E is used to install the lens 52E, and the shape of the lens 52E is adapted, and the lower part is used to install the optical filter 40, and is adapted to the shape of the optical filter 40, so , the upper part of the lens barrel 51E is in the shape of a round tube, while the inner part of the lower part is in the shape of a square, and the round tube and the square are integrally connected.
所述马达60被安装于所述封装部11，所述滤光片40被安装于所述镜筒51E，从而不需要提供额外的部件来安装所述滤光片40。The motor 60 is mounted on the packaging part 11 , and the optical filter 40 is mounted on the lens barrel 51E, so that there is no need to provide additional components to install the optical filter 40 .
如图10所示，是根据本发明的第七个优选实施例的基于模塑工艺的摄像模组剖视示意图。不同于上述优选实施例的是，所述线路板组件10包括一线路板主体121F，所述线路板主体121F具有一通路1211F，所述通路1211F的下部适于安装所述感光芯片30。各所述通路使得所述线路板主体121F上下两侧相连通，从而当所述感光芯片30由所述线路板主体121F的背面、并且感光区朝上地安装于所述线路板主体121F时，所述感光芯片30的感光区能够接收到由所述镜头50进入的光线。As shown in FIG. 10 , it is a schematic cross-sectional view of a camera module based on a molding process according to a seventh preferred embodiment of the present invention. Different from the preferred embodiment above, the circuit board assembly 10 includes a circuit board main body 121F, the circuit board main body 121F has a passage 1211F, and the lower part of the passage 1211F is suitable for installing the photosensitive chip 30 . Each of the passages connects the upper and lower sides of the circuit board main body 121F, so that when the photosensitive chip 30 is installed on the circuit board main body 121F from the back of the circuit board main body 121F with the photosensitive area facing upward, The photosensitive area of the photosensitive chip 30 can receive light entering from the lens 50 .
更进一步，所述线路板主体121F具有一外凹槽1212F，所述外凹槽1212F连通于对应的所述通路，提供所述感光芯片30的安装位置。特别地，当所述感光芯片30被安装于所述外凹槽1212F时，所述感光芯片30的外表面和所述线路板主体121F的外表面一致，位于同一平面，从而保证所述线路板组件10的表面平整性。Furthermore, the main body 121F of the circuit board has an outer groove 1212F, and the outer groove 1212F communicates with the corresponding passage to provide a mounting position for the photosensitive chip 30 . In particular, when the photosensitive chip 30 is installed in the outer groove 1212F, the outer surface of the photosensitive chip 30 is consistent with the outer surface of the circuit board main body 121F and is located on the same plane, thereby ensuring that the circuit board The surface planarity of the component 10.
在本发明的这个实施例中，所述通路呈台阶状，从而便于安装所述感光芯片30，为所述感光芯片30提供稳定的安装位置，并使其感光区展现于内空间。In this embodiment of the present invention, the passage is stepped, so as to facilitate the installation of the photosensitive chip 30 , provide a stable installation position for the photosensitive chip 30 , and expose the photosensitive area in the inner space.
值得一提的是，在本发明的这个实施例中，提供一种不同于传统的芯片安装方式，即，芯片倒装方式(Flip Chip，FC)。将所述感光芯片30从所述线路板主体121F的背面方向安装于所述线路板主体121F，而不是像上述实施例中需要从所述线路板主体121F的正面，即，从所述线路板主体121F的上方，且所述感光芯片30的感光区朝上地安装于所述线路板主体121F。这样的结构以及安装方式，使得所述感光芯片30和所述封装部11相对独立，所述感光芯片30的安装不会受到所述封装部11的影响，所述封装部11的模塑成型对所述感光芯片30的影响也较小。此外，所述感光芯片30嵌于所述线路板主体121F的外侧面，且不会凸出于所述线路板主体121F的内侧面，从而使得所述线路板主体121F内侧留出更大的空间，使得所述封装部11的高度不会受到所述感光芯片30的高度限制，使得所述封装部11能够达到更小的高度。It is worth mentioning that, in this embodiment of the present invention, a chip mounting method different from the traditional one is provided, that is, a flip chip (Flip Chip, FC) method. The photosensitive chip 30 is installed on the circuit board main body 121F from the back direction of the circuit board main body 121F, instead of from the front of the circuit board main body 121F as in the above-mentioned embodiment, that is, from the circuit board main body 121F. Above the main body 121F, and the photosensitive area of the photosensitive chip 30 is installed on the circuit board main body 121F. Such a structure and installation method make the photosensitive chip 30 and the packaging part 11 relatively independent, the installation of the photosensitive chip 30 will not be affected by the packaging part 11, and the molding of the packaging part 11 has a great influence on The influence of the photosensitive chip 30 is also small. In addition, the photosensitive chip 30 is embedded in the outer surface of the circuit board main body 121F, and does not protrude from the inner surface of the circuit board main body 121F, so that a larger space is reserved inside the circuit board main body 121F. , so that the height of the package part 11 is not limited by the height of the photosensitive chip 30 , so that the package part 11 can achieve a smaller height.
值得一提的是，在本发明的这个实施例中，所述通路的上端安装所述滤光片40，也就是说，所述滤光片40覆盖于所述线路板主体121F的所述通路，不需要将所述滤光片40安装于所述封装部11，从而极大地减小所述阵列摄像模组的后焦距，减小所述摄像的高度。特别地，所述滤光片40可以被实施例为红外截止滤光片IRCF。也就是说，所述滤光片40被安装于所述线路板主体121F，而不需要提供额外的部件，如支座。It is worth mentioning that, in this embodiment of the present invention, the optical filter 40 is installed on the upper end of the passage, that is to say, the optical filter 40 covers the passage of the circuit board main body 121F , there is no need to install the optical filter 40 on the packaging part 11, thereby greatly reducing the back focus of the array camera module and reducing the height of the camera. In particular, said filter 40 may be embodied as an infrared cut filter IRCF. That is to say, the optical filter 40 is mounted on the circuit board main body 121F without providing additional components, such as a stand.
如图11A至12所示，是根据本发明的第八个优选实施例的基于模塑工艺的摄像模组。不同于上述优选实施例的是，所述封装部11具有一安装槽113G，所述安装槽113G连通于所述通孔111。也就是说，所述封装部11的所述顶表面112G呈台阶状结构，而并不是一体延伸。As shown in FIGS. 11A to 12 , it is a camera module based on molding process according to the eighth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiments, the packaging part 11 has a mounting groove 113G, and the mounting groove 113G communicates with the through hole 111 . That is to say, the top surface 112G of the package portion 11 has a stepped structure, rather than extending integrally.
进一步，所述摄像模组包括一支座70G，所述支座70G用于安装所述滤光片40。所述支座70G被安装于所述封装部11，所述滤光片40被安装于所述支座70G，所述马达60或所述镜头50被安装于所述封装部11。Further, the camera module includes a support 70G, and the support 70G is used for installing the filter 40 . The holder 70G is mounted on the package 11 , the filter 40 is mounted on the holder 70G, and the motor 60 or the lens 50 is mounted on the package 11 .
进一步，所述封装部11在顶侧的至少两侧面具有凸起台阶114G，至少一侧面没有上述凸起台阶114，并且形成安装槽113G，所述支座70G被安装于所述封装部11的所述安装槽113G，且所述安装槽113G的高度大于所述支座70G的安装高度，从而使得所述支座70G不会凸出于所述封装部11的顶端。比如，所述安装槽113G的高度比所述支座70G的高度大0.05mm，从而当所述马达60被安装于所述封装部11时，所述马达60的底部不会直接接触于所述支座70G，且被安装一所述马达60内的所述镜头也不会接触于所述支座70G。值得一提的是，在本发明的这个实施例中，以动焦摄像模组为例进行说明，所述马达被安装于所述封装部11，而在本发明的其他实施例中，所述摄像模组还可以是定焦模组，所述镜头50被安装于所述封装部11，特别地，所述支座70G与所述镜头50的镜筒以及镜片均不直接接触。Further, the packaging part 11 has raised steps 114G on at least two sides of the top side, at least one side does not have the above-mentioned raised steps 114, and forms a mounting groove 113G, and the support 70G is installed on the top side of the packaging part 11. The installation groove 113G, and the height of the installation groove 113G is greater than the installation height of the support 70G, so that the support 70G does not protrude from the top of the package part 11 . For example, the height of the mounting groove 113G is 0.05mm larger than the height of the support 70G, so that when the motor 60 is installed in the package part 11, the bottom of the motor 60 will not directly contact the The support 70G, and the lens installed in the motor 60 will not touch the support 70G. It is worth mentioning that, in this embodiment of the present invention, a dynamic focus camera module is used as an example for illustration, the motor is installed in the packaging part 11, and in other embodiments of the present invention, the The camera module can also be a fixed-focus module, and the lens 50 is mounted on the package part 11 . In particular, the support 70G is not in direct contact with the lens barrel and lens of the lens 50 .
可以理解的是，当所述感光芯片30尺寸较大，而所述封装部11壁厚较小时，上述设计依然能够使所述封装部11提供空间以安装所述支座70G，从而以供安装所述滤光片。如图11A至图12中所示，所述封装部11的顶部可以在三个侧面形成所述凸起台阶114，另一侧没有所述凸起台阶114而直接用于支撑所述支座70G。如图11A中所示的剖示图，可以看出左右两侧都有所述凸起台阶114，其内侧用于安装所述支座70G。而图11B所示的另外的剖视图中，左侧所述封装部11的顶表面直接支撑所述支座70G，而右侧的所述凸起台阶114的内侧用于对所述支座70G进行限位。It can be understood that, when the size of the photosensitive chip 30 is large and the wall thickness of the packaging part 11 is small, the above design can still provide a space for the packaging part 11 to install the support 70G, so as to be used for installation. the filter. As shown in FIG. 11A to FIG. 12 , the top of the packaging part 11 can form the raised steps 114 on three sides, and the other side does not have the raised steps 114 and is directly used to support the support 70G. . As shown in the cross-sectional view of FIG. 11A , it can be seen that there are said raised steps 114 on the left and right sides, and the inner side thereof is used for installing the support 70G. In another cross-sectional view shown in FIG. 11B , the top surface of the package part 11 on the left directly supports the support 70G, and the inner side of the raised step 114 on the right is used to support the support 70G. limit.
而且，这个实施例中，所述凸起台阶114的顶表面可以高于所述支座70G的顶表面，这样所述马达60贴装于所述凸起台阶114，从而因为所述封装部11一体成形，并且所述马达60只与所述封装部11的所述凸起台阶114接触，从而可以减小所述马达的倾斜。Moreover, in this embodiment, the top surface of the raised step 114 may be higher than the top surface of the support 70G, so that the motor 60 is mounted on the raised step 114, so that because the packaging part 11 It is integrally formed, and the motor 60 is only in contact with the raised step 114 of the packaging part 11, so that the inclination of the motor can be reduced.
值得一提的是，所述电路元件122可以不是均匀地布置于所述线路板主体121，因此在所述线路板主体上预留的设置所述封装部11的位置并不是规则的对称关系，比如在带有所述电路元件122的一侧预留的较宽，而没有所述电路元件122的一侧相对较窄，在这种情况下存在的问题是，在所述封装部较窄的位置较难设置所述安装槽，而在本发明的这个实施例中，所述安装槽113G呈U型，也就是说，在所述封装部11较窄的侧边，所述安装槽连113G通于外部，而在所述封装部11较宽，所述安装槽113G仅连通于所述通孔111，而并不连通于外部环境，从而形成一个U型的所述安装槽113G。所述支座70G被安装于所述安装槽113G，且在所述封装部11较宽或较窄的区域都可以得到稳定的支撑，从而使得所述滤光片40被稳定地安装。It is worth mentioning that the circuit elements 122 may not be evenly arranged on the circuit board main body 121, so the reserved position on the circuit board main body for setting the package part 11 is not a regular symmetrical relationship, For example, the side with the circuit element 122 is relatively wide, and the side without the circuit element 122 is relatively narrow. In this case, the problem is that the narrower part of the package It is difficult to set the installation groove, and in this embodiment of the present invention, the installation groove 113G is U-shaped, that is to say, on the narrow side of the packaging part 11, the installation groove 113G Opening to the outside, but wider in the package part 11 , the installation groove 113G is only connected to the through hole 111 , but not connected to the external environment, thereby forming a U-shaped installation groove 113G. The support 70G is installed in the installation groove 113G, and can be stably supported in the wider or narrower area of the packaging part 11, so that the optical filter 40 can be stably installed.
值得一提的是，根据本发明的一实施例，所述安装槽113G的高度大于所述支座70G的高度，因此在所述安装槽113G的U型开口区域，当所述支座70G被安装于所述安装槽113G时，所述支座70G与所述马达60的侧面之间存在间隙，因此在所述摄像模组中，通过一密封物将所述间隙进行密封，使得所述感光芯片30与外部相互隔离。特别地，在一实施例中，所述密封物为胶体。也就是说，在组装完所述摄像模组后，通过所述胶体将所述支座于所述封装部11进行密封。It is worth mentioning that, according to an embodiment of the present invention, the height of the installation groove 113G is greater than the height of the support 70G, so in the U-shaped opening area of the installation groove 113G, when the support 70G is When installed in the installation groove 113G, there is a gap between the support 70G and the side of the motor 60, so in the camera module, a sealant is used to seal the gap, so that the photosensitive Chip 30 is isolated from the outside. Especially, in one embodiment, the sealant is glue. That is to say, after the camera module is assembled, the support is sealed to the packaging part 11 by the glue.
根据本发明的这个实施例，所述支座70G具有一第一支座槽71G和一第二支座槽72G，所述第一支座槽71G用于安装所述滤光片40，使得所述滤光片40的表面不会凸出于所述支座70G的顶端。所述第二支座槽72G，用于安装于所述封装部11，以使得所述封装部11沿所述支座70G向上延伸，而所述滤光片40的位置性对向下，从而减小所述摄像模组的后焦距。According to this embodiment of the present invention, the support 70G has a first support groove 71G and a second support groove 72G, and the first support groove 71G is used to install the filter 40, so that the The surface of the filter 40 does not protrude from the top of the support 70G. The second seat groove 72G is used for mounting on the package part 11, so that the package part 11 extends upward along the seat 70G, and the position of the filter 40 faces downward, so that Reduce the back focus of the camera module.
换句话说，所述支座70G向所述通孔111内延伸，且向下延伸，从而将所述滤光片40支撑于所述感光芯片30上方，且利用所述通孔111内的空间，使得滤光片40被稳定安装的同时，所述滤光片40不会占用外部空间。In other words, the support 70G extends into the through hole 111 and extends downward, so as to support the filter 40 above the photosensitive chip 30 and utilize the space in the through hole 111 , so that the optical filter 40 is installed stably and at the same time, the optical filter 40 does not occupy external space.
值得一提的是，所述支座70G向内延伸的距离位于所述感光芯片30的感光区之外，也就是说，所述支座70G不会遮挡所述感光芯片30，以避免影响所述感光芯片30的感光过程，所述支座70G的尺寸可以具体需求设计。It is worth mentioning that the inward extension distance of the support 70G is outside the photosensitive area of the photosensitive chip 30, that is to say, the support 70G will not block the photosensitive chip 30 to avoid affecting the photosensitive chip 30. Referring to the photosensitive process of the photosensitive chip 30, the size of the support 70G can be designed according to specific requirements.
不同于第三个优选实施例的是，所述第二支座槽71G和所述封装的所述安装槽113G相互配合，形成匹配的卡接结构，从而使得所述支座70G得以稳定的安装于所述安装槽113G内。相对第三个优选实施例，这个实施例中的所述滤光片40距离所述感光芯片30更小，可以获得具有更小后焦距的所述摄像模组。Different from the third preferred embodiment, the second support groove 71G and the installation groove 113G of the package cooperate with each other to form a matching snap-in structure, so that the support 70G can be installed stably in the installation groove 113G. Compared with the third preferred embodiment, the distance between the optical filter 40 and the photosensitive chip 30 in this embodiment is smaller, so that the camera module with a smaller back focus can be obtained.
在本发明的这个实施例以及相应附图中，以动焦模组为例进行说明，所述镜头50被按安装于所述马达60，所述马达60被安装于所述支座70G。也就是说，所述支座70C为所述滤光片40和所述马达60提供安装位置。而在本本发明的其他实施例中，所述摄像模组还可以是一定焦模组。所述镜头50被安装于所述支座70G，也就是说，所述支座70G为所述滤光片40和所述镜头50提供安装位置，本领域的技术人员应当理解的是，所述支座70G的具体结构和所述摄像模组的类型并不是本发明的限制。In this embodiment of the present invention and corresponding drawings, a moving focus module is taken as an example for illustration, the lens 50 is installed on the motor 60 , and the motor 60 is installed on the support 70G. That is to say, the holder 70C provides a mounting position for the filter 40 and the motor 60 . In other embodiments of the present invention, the camera module may also be a fixed-focus module. The lens 50 is installed on the support 70G, that is to say, the support 70G provides a mounting position for the filter 40 and the lens 50, those skilled in the art should understand that the The specific structure of the support 70G and the type of the camera module are not limitations of the present invention.
上述实施例以及附图中，以动焦模组为例进行说明本发明的原理，而在本发明的其他实施例中，所述摄像模组还可以是定焦模塑，本领域的技术人员应当理解的是，所述摄像模组的类型并不是本发明的限制。In the above embodiments and accompanying drawings, the principle of the present invention is described by taking the dynamic focus module as an example, but in other embodiments of the present invention, the camera module can also be fixed focus molding, and those skilled in the art It should be understood that the type of the camera module is not a limitation of the present invention.
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。It should be understood by those skilled in the art that the embodiments of the present invention shown in the foregoing description and drawings are only examples and do not limit the present invention. The objects of the present invention have been fully and effectively accomplished. The functions and structural principles of the present invention have been shown and described in the embodiments, and the embodiments of the present invention may have any deformation or modification without departing from the principles.
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