技术领域technical field
本发明涉及一种图像获取模块及其组装方法，尤指一种省去调焦时间且增加平整度的图像获取模块及其组装方法。The invention relates to an image acquisition module and an assembly method thereof, in particular to an image acquisition module and an assembly method thereof which save time for focusing and increase flatness.
背景技术Background technique
近几年来，如移动电话、PDA等手持式装置具有取像模块配备的趋势已日益普遍，并伴随着产品市场对手持式装置功能要求更好及体积更小的市场需求下，取像模块已面临到更高画质与小型化的双重要求。针对取像模块画质的提升，一方面是提高像素，市场的趋势是由原VGA等级的30像素，已进步到目前市面上所常见的两百万像素、三百万像素，更甚者已推出更高等级的八百万像素以上的级别。除了像素的提升外，另一方面是关心取像的清晰度，因此手持式装置的取像模块也由定焦取像功能朝向类似照相机的光学自动对焦功能、甚或是光学变焦功能发展。In recent years, it has become increasingly common for handheld devices such as mobile phones and PDAs to be equipped with imaging modules. With the market demand for better functions and smaller volumes of handheld devices in the product market, imaging modules have become Faced with the dual requirements of higher image quality and miniaturization. For the improvement of the picture quality of the imaging module, on the one hand, it is to increase the pixels. The market trend has been improved from the original VGA level of 30 pixels to the current common 2 million pixels, 3 million pixels, and even worse. Introduce a higher level of more than 8 megapixels. In addition to the improvement of pixels, another concern is the clarity of image capture. Therefore, the image capture module of the handheld device is also developing from the fixed-focus image capture function to the optical auto-focus function similar to a camera, or even the optical zoom function.
光学自动对焦功能的操作原理是依照标的物的不同远、近距离，以适当地移动取像模块中的镜头，进而使得取像标的物体的光学图像得以准确地聚焦在图像传感器上，以产生清晰的图像。以目前一般常见到在取像模块中带动镜头移动的致动方式，其包括有步进马达致动、压电致动以及音圈马达(Voice Coil Motor，VCM)致动等方式。然而，当已知取像模块中的图像传感器及支架以电路板做为堆叠基准面而依序堆叠其上时，将会造成支架相对于图像传感器的组装倾角过大，造成已知取像模块所获取到的图像品质无法得到有效的改善。另外，已知取像模块相对于图像传感器所采用的人工对焦会耗费许多时间。The operating principle of the optical autofocus function is to appropriately move the lens in the imaging module according to the different distances and short distances of the target object, so that the optical image of the captured object can be accurately focused on the image sensor to produce a clear image. Image. Currently, common actuation methods for moving the lens in the imaging module include stepping motor actuation, piezoelectric actuation, and voice coil motor (Voice Coil Motor, VCM) actuation. However, when the image sensor and the bracket in the known imaging module are stacked sequentially on the circuit board as the stacking reference plane, the assembly inclination angle of the bracket relative to the image sensor will be too large, causing the known imaging module The acquired image quality cannot be effectively improved. In addition, it is known that the manual focusing of the imaging module relative to the image sensor will consume a lot of time.
发明内容Contents of the invention
本发明实施例在于提供一种省去调焦时间且增加平整度的图像获取模块及其组装方法，其可有效解决“当已知取像模块中的图像传感器及支架以电路板作为堆叠基准面而依序堆叠其上时，将会造成支架相对于图像传感器的组装倾角过大，造成已知取像模块所获取到的图像品质无法得到有效的改善”及“已知取像模块相对于图像传感器所采用的人工对焦会耗费许多时间”的缺陷。The embodiment of the present invention is to provide an image acquisition module and its assembly method that saves the focusing time and increases the flatness, which can effectively solve the problem of "when the image sensor and the bracket in the known imaging module use the circuit board as the stacking reference plane." And when stacked on it in sequence, it will cause the assembly inclination angle of the bracket relative to the image sensor to be too large, causing the image quality obtained by the known imaging module to be unable to be effectively improved." The manual focus used by the sensor takes a lot of time” defect.
本发明其中一实施例所提供的一种省去调焦时间且增加平整度的图像获取模块，其包括：一图像感测单元、一框架壳体、一致动器结构及一滤光元件。所述图像感测单元包括一承载基板及一设置在所述承载基板上且电性连接于所述承载基板的图像感测芯片，其中所述图像感测芯片的顶端具有一通过一激光光源的水平校正后所得到的第一水平上表面。所述框架壳体设置在所述承载基板上且包围所述图像感测芯片。所述致动器结构设置在所述框架壳体上且位于所述图像感测芯片的上方，其中所述致动器结构包括一设置在所述框架壳体上的镜头承载座及一设置在所述镜头承载座内且位于所述图像感测芯片的上方的可移动镜头组件，所述镜头承载座的内部具有一围绕状可动件，所述可移动镜头组件通过至少两个固定胶体以固定在所述围绕状可动件内，且所述可移动镜头组件通过所述围绕状可动件的带动以可活动地设置在所述镜头承载座内。所述滤光元件设置在所述框架壳体上且位于所述图像感测芯片与所述可移动镜头组件之间，其中所述滤光元件的顶端具有一通过所述激光光源的水平校正后所得到的第二水平上表面，且所述滤光元件的所述第二水平上表面相距所述图像感测芯片的所述第一水平上表面的距离定义为一预设的固定调焦距离。其中，所述可移动镜头组件直接设置在所述滤光元件的所述第二水平上表面上，以省去所述可移动镜头组件相对于所述图像感测芯片的调焦时间。其中，所述图像感测芯片的所述第一水平上表面与所述滤光元件的所述第二 水平上表面彼此平行，以增加所述可移动镜头组件相对于所述图像感测芯片的组装平整度。An embodiment of the present invention provides an image acquisition module that saves time for focusing and increases flatness, which includes: an image sensing unit, a frame housing, an actuator structure, and a filter element. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein the top of the image sensing chip has a The first horizontal upper surface obtained after horizontal correction. The frame case is disposed on the carrier substrate and surrounds the image sensing chip. The actuator structure is arranged on the frame housing and is located above the image sensing chip, wherein the actuator structure includes a lens bearing seat arranged on the frame housing and a lens holder arranged on the The movable lens assembly in the lens carrying seat and above the image sensor chip, the lens carrying seat has a surrounding movable part inside, and the movable lens assembly is fixed by at least two colloids It is fixed in the surrounding movable part, and the movable lens assembly is movably arranged in the lens bearing seat driven by the surrounding movable part. The filter element is arranged on the frame housing and is located between the image sensing chip and the movable lens assembly, wherein the top of the filter element has a level corrected by the laser light source The obtained second horizontal upper surface, and the distance between the second horizontal upper surface of the filter element and the first horizontal upper surface of the image sensing chip is defined as a preset fixed focusing distance . Wherein, the movable lens assembly is directly arranged on the second horizontal upper surface of the filter element, so as to save the focusing time of the movable lens assembly relative to the image sensing chip. Wherein, the first horizontal upper surface of the image sensing chip and the second horizontal upper surface of the filter element are parallel to each other, so as to increase the distance between the movable lens assembly and the image sensing chip. Assembly flatness.
本发明另外一实施例所提供的一种省去调焦时间且增加平整度的图像获取模块，其包括：一图像感测单元、一框架壳体、一致动器结构及一滤光元件。所述图像感测单元包括一承载基板及一设置在所述承载基板上且电性连接于所述承载基板的图像感测芯片，其中所述图像感测芯片的顶端具有一第一水平上表面。所述框架壳体设置在所述承载基板上且包围所述图像感测芯片。所述致动器结构设置在所述框架壳体上且位于所述图像感测芯片的上方，其中所述致动器结构包括一设置在所述框架壳体上的镜头承载座及一可活动地设置在所述镜头承载座内且位于所述图像感测芯片的上方的可移动镜头组件。所述滤光元件设置在所述框架壳体上且位于所述图像感测芯片与所述可移动镜头组件之间，其中所述滤光元件的顶端具有一第二水平上表面，且所述滤光元件的所述第二水平上表面相距所述图像感测芯片的所述第一水平上表面的距离定义为一预设的固定调焦距离。其中，所述可移动镜头组件直接设置在所述滤光元件的所述第二水平上表面上，以省去所述可移动镜头组件相对于所述图像感测芯片的调焦时间。其中，所述图像感测芯片的所述第一水平上表面与所述滤光元件的所述第二水平上表面彼此平行，以增加所述可移动镜头组件相对于所述图像感测芯片的组装平整度。Another embodiment of the present invention provides an image acquisition module that saves focusing time and increases flatness, which includes: an image sensing unit, a frame housing, an actuator structure, and a filter element. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein the top of the image sensing chip has a first horizontal upper surface . The frame case is disposed on the carrier substrate and surrounds the image sensing chip. The actuator structure is arranged on the frame casing and is located above the image sensing chip, wherein the actuator structure includes a lens bearing seat arranged on the frame casing and a movable The movable lens assembly is arranged in the lens bearing seat and above the image sensing chip. The filter element is arranged on the frame housing and is located between the image sensing chip and the movable lens assembly, wherein the top of the filter element has a second horizontal upper surface, and the The distance between the second horizontal upper surface of the filter element and the first horizontal upper surface of the image sensing chip is defined as a preset fixed focusing distance. Wherein, the movable lens assembly is directly arranged on the second horizontal upper surface of the filter element, so as to save the focusing time of the movable lens assembly relative to the image sensing chip. Wherein, the first horizontal upper surface of the image sensing chip and the second horizontal upper surface of the filter element are parallel to each other, so as to increase the distance between the movable lens assembly and the image sensing chip. Assembly flatness.
本发明另外再一实施例所提供的一种省去调焦时间且增加平整度的图像获取模块的组装方法，其包括下列步骤：提供一图像感测单元及一框架壳体，其中所述图像感测单元包括一承载基板及一设置在所述承载基板上且电性连接于所述承载基板的图像感测芯片，且所述框架壳体设置在所述承载基板上且包围所述图像感测芯片；所述图像感测芯片通过一激光光源的水平校正，以得到一位于所述图像感测芯片的顶端上的第一水平上表面；将一滤光元件设置在所述框架壳体上且位于所述图像感测芯片的正上方；所述滤光元件通过所述激光光源的水平校正，以得到一位于所述滤光 元件的顶端上的第二水平上表面，其中所述滤光元件的所述第二水平上表面相距所述图像感测芯片的所述第一水平上表面的距离定义为一预设的固定调焦距离；提供一致动器结构，其中所述致动器结构设置在所述框架壳体上且位于所述图像感测芯片的上方，其中所述致动器结构包括一设置在所述框架壳体上的镜头承载座及一设置在所述镜头承载座内且位于所述图像感测芯片的上方的可移动镜头组件，且所述镜头承载座的内部具有一围绕状可动件，其中所述可移动镜头组件直接设置在所述滤光元件的所述第二水平上表面上，以省去所述可移动镜头组件相对于所述图像感测芯片的调焦时间，且所述图像感测芯片的所述第一水平上表面与所述滤光元件的所述第二水平上表面彼此平行，以增加所述可移动镜头组件相对于所述图像感测芯片的组装平整度；以及，通过至少两个固定胶体，以将所述可移动镜头组件固定在所述围绕状可动件内，其中所述可移动镜头组件通过所述围绕状可动件的带动，以可活动地设置在所述镜头承载座内。Another embodiment of the present invention provides a method for assembling an image acquisition module that saves focusing time and increases flatness, which includes the following steps: providing an image sensing unit and a frame housing, wherein the image The sensing unit includes a carrier substrate and an image sensing chip arranged on the carrier substrate and electrically connected to the carrier substrate, and the frame housing is arranged on the carrier substrate and surrounds the image sensor measuring chip; the image sensing chip is corrected horizontally by a laser light source to obtain a first horizontal upper surface located on the top of the image sensing chip; a filter element is arranged on the frame housing and located directly above the image sensing chip; the filter element is corrected horizontally by the laser light source to obtain a second horizontal upper surface located on the top of the filter element, wherein the filter element The distance between the second horizontal upper surface of the element and the first horizontal upper surface of the image sensing chip is defined as a preset fixed focusing distance; an actuator structure is provided, wherein the actuator structure It is arranged on the frame housing and located above the image sensing chip, wherein the actuator structure includes a lens bearing seat arranged on the frame housing and a lens bearing seat arranged in the lens bearing seat and a movable lens assembly located above the image sensing chip, and the inside of the lens bearing seat has a surrounding movable member, wherein the movable lens assembly is directly arranged on the filter element on the second horizontal upper surface, so as to save the focusing time of the movable lens assembly relative to the image sensing chip, and the first horizontal upper surface of the image sensing chip and the filter element The second horizontal upper surfaces are parallel to each other, so as to increase the flatness of the assembly of the movable lens assembly relative to the image sensing chip; and at least two fixing colloids are used to fix the movable lens assembly In the surrounding movable part, the movable lens assembly is driven by the surrounding movable part to be movably arranged in the lens bearing seat.
本发明的有益效果可以在于，本发明实施例所提供的图像获取模块及其组装方法，其可通过“所述图像感测芯片的顶端具有一通过一激光光源的水平校正后所得到的第一水平上表面，所述滤光元件的顶端具有一通过所述激光光源的水平校正后所得到的第二水平上表面，且所述图像感测芯片的所述第一水平上表面与所述滤光元件的所述第二水平上表面彼此平行”的设计，以有效降低所述可移动镜头组件相对于所述图像感测芯片的组装倾角，藉此以确保所述可移动镜头组件相对于所述图像感测芯片的平整性。因此，当所述滤光元件的所述第二水平上表面相距所述图像感测芯片的所述第一水平上表面的距离被预先定义为一预设的固定调焦距离时，所述可移动镜头组件就可以直接设置在所述滤光元件的所述第二水平上表面上，藉此以省去所述可移动镜头组件相对于所述图像感测芯片的调焦时间。The beneficial effect of the present invention may lie in that the image acquisition module and its assembly method provided by the embodiment of the present invention can be achieved by "the top of the image sensing chip has a first horizontal correction obtained by a laser light source. A horizontal upper surface, the top of the filter element has a second horizontal upper surface obtained after the horizontal correction of the laser light source, and the first horizontal upper surface of the image sensing chip and the filter The second horizontal upper surface of the optical element is designed to be parallel to each other to effectively reduce the assembly inclination angle of the movable lens assembly relative to the image sensing chip, thereby ensuring that the movable lens assembly is relatively The planarity of the above-mentioned image sensing chip. Therefore, when the distance between the second horizontal upper surface of the filter element and the first horizontal upper surface of the image sensing chip is predefined as a preset fixed focusing distance, the possible The movable lens assembly can be directly arranged on the second horizontal upper surface of the filter element, thereby saving the time for focusing the movable lens assembly relative to the image sensing chip.
为使能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，然而所附图式仅提供参考与说明用，并非用来对本发明加以限制者。In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the attached drawings are provided for reference and illustration only, and are not intended to limit the present invention.
附图说明Description of drawings
图1为本发明省去调焦时间且增加平整度的图像获取模块的组装方法的流程图。FIG. 1 is a flowchart of an assembly method of an image acquisition module that saves focusing time and increases flatness according to the present invention.
图2为本发明步骤S100及S102的侧视剖面示意图。FIG. 2 is a schematic cross-sectional side view of steps S100 and S102 of the present invention.
图3为本发明步骤S104及S106的侧视剖面示意图。FIG. 3 is a schematic cross-sectional side view of steps S104 and S106 of the present invention.
图4为本发明步骤S108及S110的侧视剖面示意图。FIG. 4 is a schematic cross-sectional side view of steps S108 and S110 of the present invention.
【符号说明】【Symbol Description】
图像获取模块 MImage Acquisition Module M
图像感测单元 1Image sensing unit 1
承载基板 10Carrier substrate 10
图像感测芯片 11Image sensor chip 11
第一水平上表面 110First level upper surface 110
框架壳体 2frame housing 2
顶端开口 200Top opening 200
致动器结构 3Actuator Structure 3
镜头承载座 30Lens mount 30
内围绕表面 300Inner surrounding surface 300
可移动镜头组件 31Movable Lens Assembly 31
底端平面 310Bottom plane 310
外周围表面 311outer peripheral surface 311
围绕状可动件 30MAround the movable part 30M
滤光元件 4filter element 4
第二水平上表面 4002nd level upper surface 400
固定胶体 HFixed Colloid H
激光光源 SLaser light source S
预定位置 PPredetermined position P
第一激光光束 L1First laser beam L1
第一反射光束 R1First reflected beam R1
第二激光光束 L2Second laser beam L2
第二反射光束 R2Second reflected beam R2
固定调焦距离 DFixed focus distance D
调焦距离 FFocusing distance F
具体实施方式detailed description
以下通过特定的具体实例说明本发明所披露“省去调焦时间且增加平整度的图像获取模块及其组装方法”的实施方式，本领域的普通技术人员可由本说明书所披露的内容轻易了解本发明的其他优点与效果。本发明也可通过其他不同的具体实施例加以施行或应用，本说明书中的各项细节也可基于不同观点与应用，在不悖离本发明的精神下进行各种修饰与变更。又本发明的图式仅为简单说明，并非依实际尺寸描绘，也即未反应出相关构成的实际尺寸，先予叙明。以下的实施方式进一步详细说明本发明的相关技术内容，但并非用以限制本发明的技术范畴。The implementation of the "image acquisition module and its assembly method that saves focusing time and increases flatness" disclosed in the present invention is described below through specific examples. Those skilled in the art can easily understand the present invention from the content disclosed in this specification. Other advantages and effects of the invention. The present invention can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. Moreover, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, that is, they do not reflect the actual size of the relevant components, and are described in advance. The following embodiments further describe the relevant technical contents of the present invention in detail, but are not intended to limit the technical scope of the present invention.
请参阅图1至图4所示，本发明提供一种省去调焦时间且增加平整度的图像获取模块M的组装方法，其大致上可包括下列几个步骤：Please refer to Fig. 1 to Fig. 4, the present invention provides a method for assembling an image acquisition module M that saves focusing time and increases flatness, which generally includes the following steps:
首先，步骤S100为：配合图1及图2所示，提供一图像感测单元1及一框架壳体2，其中图像感测单元1包括一承载基板10及一设置在承载基板10上且电性连接于承载基板10的图像感测芯片11，并且框架壳体2设置在承载基板10上且包围图像感测芯片11。举例来说，如图2所示，图像感测芯片11可为CMOS图像感测芯片，并且图像感测芯片11可通过黏着胶体(未标号，例如UV黏着胶、热硬化胶、或炉内硬化胶等等)，以设置在承载基板10上。另外，框架壳体2也可通过黏着胶体(例如UV黏着胶、热硬化胶、或炉内硬化胶等等)，以设置在承载基板10上。此外，承载基板10可为一上表面具有多个导电焊垫(未标号)的电路基板，图像感测芯片11的上表面具有多个导电焊垫(未标号)，并且图像感测芯片11的每一个导电焊垫可通过一导电线(未标号)，以电性连接于承载基板10的导电焊垫，藉此以达成图像感测芯片11与承载基板10之间的电性导通。Firstly, step S100 is: as shown in FIG. 1 and FIG. 2, an image sensing unit 1 and a frame housing 2 are provided, wherein the image sensing unit 1 includes a carrier substrate 10 and a circuit board arranged on the carrier substrate 10 and electrically The image sensing chip 11 is connected to the carrier substrate 10 , and the frame case 2 is disposed on the carrier substrate 10 and surrounds the image sensing chip 11 . For example, as shown in FIG. 2 , the image sensing chip 11 can be a CMOS image sensing chip, and the image sensing chip 11 can be bonded by an adhesive (unlabeled, such as UV adhesive, thermosetting adhesive, or oven-hardened adhesive). glue, etc.) to be disposed on the carrier substrate 10. In addition, the frame case 2 can also be disposed on the carrier substrate 10 by adhesive (such as UV adhesive, thermosetting adhesive, or oven-hardening adhesive, etc.). In addition, the carrier substrate 10 can be a circuit substrate with a plurality of conductive pads (not labeled) on the upper surface, the upper surface of the image sensing chip 11 has a plurality of conductive pads (not labeled), and the image sensing chip 11 Each conductive pad can be electrically connected to the conductive pad of the carrier substrate 10 through a conductive wire (not labeled), so as to achieve electrical conduction between the image sensing chip 11 and the carrier substrate 10 .
接着，步骤S102为：配合图1及图2所示，图像感测芯片11通过一激光光源S的水平校正，以得到一位于图像感测芯片11的顶端上的第一 水平上表面110。更进一步来说，激光光源S被设置在图像感测芯片11的上方的一预定位置P(例如固定位置)上，以用于产生一直接垂直投射在图像感测芯片11的第一水平上表面110上的第一激光光束L1。激光光源S所产生的第一激光光束L1会通过图像感测芯片11的第一水平上表面110的反射，以形成一直接垂直投射在预定位置P上或非常接近预定位置P的第一反射光束R1。换言之，当图像感测芯片11的顶端调整至水平状态时，第一激光光束L1通过图像感测芯片11的顶端的反射所产生的第一反射光束R1就会直接垂直返回至预定位置P上，或者是第一反射光束R1会产生一在可容许误差范围内的偏斜而非常接近预定位置P。此时，图像感测芯片11的顶端就是可作为水平基准面的第一水平上表面110。Next, step S102 is: as shown in FIG. 1 and FIG. 2 , the image sensor chip 11 is horizontally calibrated by a laser light source S to obtain a first horizontal upper surface 110 on the top of the image sensor chip 11 . Furthermore, the laser light source S is arranged at a predetermined position P (for example, a fixed position) above the image sensing chip 11 to generate a direct vertical projection onto the first horizontal upper surface of the image sensing chip 11. 110 on the first laser beam L1. The first laser beam L1 generated by the laser light source S will be reflected by the first horizontal upper surface 110 of the image sensing chip 11 to form a first reflected beam directly vertically projected on or very close to the predetermined position P R1. In other words, when the top of the image sensing chip 11 is adjusted to a horizontal state, the first reflected beam R1 generated by the reflection of the first laser beam L1 from the top of the image sensing chip 11 will directly return to the predetermined position P vertically, Or the first reflected light beam R1 will produce a deflection within the allowable error range and be very close to the predetermined position P. At this time, the top of the image sensing chip 11 is the first horizontal upper surface 110 that can be used as a horizontal reference plane.
然后，步骤S104为：配合图1及图3所示，将一滤光元件4设置在框架壳体2上且位于图像感测芯片11的正上方。更进一步来说，如图3所示，框架壳体2的顶端具有一位于图像感测芯片11的正上方的顶端开口200，并且框架壳体2的顶端开口200被滤光元件4所封闭。举例来说，滤光元件4可为一表面涂布有抗红外线(IR)层及/或抗反射(AR)层的平面玻璃板，并且滤光元件4可通过多个第一黏着胶体(未标号)，以固定在框架壳体2的一凹陷空间内，以封闭框架壳体2的顶端开口200。Then, step S104 is: as shown in FIG. 1 and FIG. 3 , disposing a filter element 4 on the frame case 2 and directly above the image sensing chip 11 . Furthermore, as shown in FIG. 3 , the top of the frame housing 2 has a top opening 200 directly above the image sensing chip 11 , and the top opening 200 of the frame housing 2 is closed by the filter element 4 . For example, the filter element 4 can be a flat glass plate coated with an anti-infrared (IR) layer and/or an anti-reflection (AR) layer on the surface, and the filter element 4 can be passed through a plurality of first adhesive colloids (not shown). label) to be fixed in a recessed space of the frame housing 2 to close the top opening 200 of the frame housing 2.
紧接着，步骤S106为：配合图1及图3所示，滤光元件4通过激光光源S的水平校正，以得到一位于滤光元件4的顶端上的第二水平上表面400，其中滤光元件4的第二水平上表面400相距图像感测芯片11的第一水平上表面110的距离定义为一预设的固定调焦距离D。更进一步来说，激光光源S(例如激光水平仪)设置在滤光元件4的上方的预定位置P上，以用于产生一直接垂直投射在滤光元件4的第二水平上表面400上的第二激光光束L2。激光光源S所产生的第二激光光束L2会通过滤光元件4的第二水平上表面400的反射，以形成一直接垂直投射在预定位置P上或非常接近预定位置P的第二反射光束R2。换言之，当滤光元件4的顶端调整至水平状态时，第二激光光束L2通过滤光元件4的顶端的反射所产生 的第二反射光束R2就会直接垂直返回至预定位置P上，或者是第二反射光束R2会产生一在可容许误差范围内的偏斜而非常接近预定位置P。此时，滤光元件4的顶端就会形成平行于第一水平上表面110的第二水平上表面400。Next, step S106 is: as shown in Figure 1 and Figure 3, the filter element 4 is corrected horizontally by the laser light source S to obtain a second horizontal upper surface 400 on the top of the filter element 4, wherein the filter element 4 The distance between the second horizontal upper surface 400 of the device 4 and the first horizontal upper surface 110 of the image sensor chip 11 is defined as a preset fixed focusing distance D. Furthermore, the laser light source S (such as a laser level) is arranged at a predetermined position P above the filter element 4, so as to generate a first vertical projection on the second horizontal upper surface 400 of the filter element 4. Two laser beams L2. The second laser beam L2 generated by the laser light source S will be reflected by the second horizontal upper surface 400 of the filter element 4 to form a second reflected beam R2 directly vertically projected on or very close to the predetermined position P . In other words, when the top of the filter element 4 is adjusted to a horizontal state, the second reflected beam R2 generated by the reflection of the second laser beam L2 from the top of the filter element 4 will directly return to the predetermined position P vertically, or The second reflected light beam R2 produces a deflection within the allowable error range and is very close to the predetermined position P. At this time, the top of the filter element 4 forms a second horizontal upper surface 400 parallel to the first horizontal upper surface 110 .
值得一提的是，激光光源S所产生的第一激光光束L1也可以是倾斜投射在图像感测芯片11的第一水平上表面110上，并且激光光源S所产生的第二激光光束L2也可以是倾斜投射在滤光元件4的第二水平上表面400上，只要是能够使得“第一激光光束L1通过图像感测芯片11的顶端的反射所产生的第一反射光束R1”及“第二激光光束L2通过滤光元件4的顶端的反射所产生的第二反射光束R2”会反射到同一点上的方式，也可达到“图像感测芯片11的顶端与滤光元件4的顶端会彼此平行，以增加可移动镜头组件31相对于图像感测芯片11的组装平整度”的目的。It is worth mentioning that the first laser beam L1 generated by the laser light source S can also be obliquely projected on the first horizontal upper surface 110 of the image sensing chip 11, and the second laser beam L2 generated by the laser light source S can also be It can be obliquely projected on the second horizontal upper surface 400 of the filter element 4, as long as it can make "the first reflected light beam R1 generated by the reflection of the first laser beam L1 through the top of the image sensing chip 11" and "the first laser beam L1". The second reflected light beam R2" produced by the reflection of the top of the two laser beams L2 through the filter element 4" will be reflected on the same point, and it can also be achieved that "the top of the image sensing chip 11 and the top of the filter element 4 will be in contact with each other. parallel to each other, so as to increase the flatness of the assembly of the movable lens assembly 31 relative to the image sensing chip 11".
然后，步骤S108为：配合图1及图3所示，提供一致动器结构3，其中致动器结构3设置在框架壳体2上且位于图像感测芯片11的上方，其中致动器结构3包括一设置在框架壳体2上的镜头承载座30(lens holder)及一设置在镜头承载座30内且位于图像感测芯片11的上方的可移动镜头组件31，并且镜头承载座30的内部具有一围绕状可动件30M，其中可移动镜头组件31直接设置在滤光元件4的第二水平上表面400上，以省去可移动镜头组件31相对于图像感测芯片11的调焦时间，且图像感测芯片11的第一水平上表面110与滤光元件4的第二水平上表面400彼此平行，以增加“直接设置在滤光元件4的第二水平上表面400上”的可移动镜头组件31相对于图像感测芯片11的组装平整度。藉此，由于图像感测芯片11的第一水平上表面110与滤光元件4的第二水平上表面400会彼此平行，所以当可移动镜头组件31直接设置在滤光元件4的第二水平上表面400上时，本发明不仅将可有效降低可移动镜头组件31相对于图像感测芯片11的组装倾角，以确保可移动镜头组件31相对于图像感测 芯片11的平整性，并且也可省去可移动镜头组件31相对于图像感测芯片11的调焦时间。Then, step S108 is: as shown in FIG. 1 and FIG. 3 , an actuator structure 3 is provided, wherein the actuator structure 3 is arranged on the frame housing 2 and located above the image sensing chip 11, wherein the actuator structure 3 includes a lens holder 30 (lens holder) arranged on the frame housing 2 and a movable lens assembly 31 arranged in the lens holder 30 and above the image sensing chip 11, and the lens holder 30 There is a surrounding movable part 30M inside, wherein the movable lens assembly 31 is directly arranged on the second horizontal upper surface 400 of the filter element 4, so as to save the focusing of the movable lens assembly 31 relative to the image sensor chip 11 time, and the first horizontal upper surface 110 of the image sensing chip 11 and the second horizontal upper surface 400 of the filter element 4 are parallel to each other, so as to increase the "directly arranged on the second horizontal upper surface 400 of the filter element 4" The assembly flatness of the movable lens assembly 31 relative to the image sensing chip 11 . Thereby, since the first horizontal upper surface 110 of the image sensing chip 11 and the second horizontal upper surface 400 of the filter element 4 are parallel to each other, when the movable lens assembly 31 is directly arranged on the second level of the filter element 4 When the upper surface 400 is on the upper surface 400, the present invention can not only effectively reduce the assembly inclination angle of the movable lens assembly 31 relative to the image sensing chip 11, so as to ensure the flatness of the movable lens assembly 31 relative to the image sensing chip 11, but also can The focusing time of the movable lens assembly 31 relative to the image sensing chip 11 is omitted.
更进一步来说，可移动镜头组件31的底端具有一直接接触滤光元件4的第二水平上表面400的底端平面310，可移动镜头组件31的底端平面310相距图像感测芯片11的第一水平上表面110的一调焦距离F会完全或大致上等于“滤光元件4的第二水平上表面400相距图像感测芯片11的第一水平上表面110”的预设的固定调焦距离D。Furthermore, the bottom end of the movable lens assembly 31 has a bottom plane 310 directly contacting the second horizontal upper surface 400 of the filter element 4, and the bottom plane 310 of the movable lens assembly 31 is away from the image sensing chip 11 A focus distance F of the first horizontal upper surface 110 of the first horizontal upper surface 110 will be completely or substantially equal to the preset fixed distance between the second horizontal upper surface 400 of the filter element 4 and the first horizontal upper surface 110 of the image sensor chip 11. Focusing distance D.
举例来说，围绕状可动件30M的一内围绕表面300及可移动镜头组件31的一外周围表面311都是无螺牙表面。镜头承载座30也是可以通过黏着胶体(例如UV黏着胶、热硬化胶、或炉内硬化胶等等)，以设置在框架壳体2上，并且可移动镜头组件31可由多个光学透镜(未标号)所组成。另外，值得一提的是，如图4所示，致动器结构3可为一音圈致动器(voicecoil actuator)。然而，本发明不以此为限，例如本发明的致动器结构3也可以一具有固定式镜头组件的光学辅助结构来取代。For example, an inner surrounding surface 300 of the surrounding movable member 30M and an outer peripheral surface 311 of the movable lens assembly 31 are both screwless surfaces. The lens holder 30 can also be arranged on the frame housing 2 through adhesives (such as UV adhesives, thermosetting adhesives, or furnace hardening adhesives, etc.), and the movable lens assembly 31 can be formed by a plurality of optical lenses (not shown). label) composed of. In addition, it is worth mentioning that, as shown in FIG. 4 , the actuator structure 3 can be a voice coil actuator. However, the present invention is not limited thereto. For example, the actuator structure 3 of the present invention can also be replaced by an optical auxiliary structure with a fixed lens assembly.
最后，步骤S110为：配合图1及图4所示，在“图像感测芯片11的第一水平上表面110与滤光元件4的第二水平上表面400彼此平行”且“可移动镜头组件31直接设置在滤光元件4的第二水平上表面400上”的情况下，可通过至少两个固定胶体H，以将可移动镜头组件31固定在围绕状可动件30M内，其中可移动镜头组件31可通过围绕状可动件30M的带动，以可活动地设置在镜头承载座30内。Finally, step S110 is: as shown in FIG. 1 and FIG. 4 , when “the first horizontal upper surface 110 of the image sensing chip 11 and the second horizontal upper surface 400 of the filter element 4 are parallel to each other” and “the movable lens assembly 31 is directly arranged on the second horizontal upper surface 400 of the filter element 4", at least two fixing colloids H can be used to fix the movable lens assembly 31 in the surrounding movable member 30M, which can be moved The lens assembly 31 can be movably disposed in the lens holder 30 by being driven by the surrounding movable member 30M.
藉此，通过上述步骤S100至步骤S110所披露的组装方式，本发明可提供一种省去调焦时间且增加平整度的图像获取模块M，其包括：一图像感测单元1、一框架壳体2、一致动器结构3及一滤光元件4，其中图像感测芯片11的顶端具有一通过激光光源S的水平校正后所得到的第一水平上表面110，并且滤光元件4的顶端具有一通过激光光源S的水平校正后所得到的第二水平上表面400。因此，当滤光元件4的第二水平上表面 400相距图像感测芯片11的第一水平上表面110的距离被预先定义为一预设的固定调焦距离D时，可移动镜头组件31就可以直接设置在滤光元件4的第二水平上表面400上，藉此以省去可移动镜头组件31相对于图像感测芯片11的调焦时间，并且图像感测芯片11的第一水平上表面110与滤光元件4的第二水平上表面400会彼此平行，以增加可移动镜头组件31相对于图像感测芯片11的组装平整度。Thus, through the assembling method disclosed in the above steps S100 to S110, the present invention can provide an image acquisition module M that saves the time for focusing and increases the flatness, which includes: an image sensing unit 1, a frame shell Body 2, an actuator structure 3 and a filter element 4, wherein the top of the image sensing chip 11 has a first horizontal upper surface 110 obtained after the horizontal correction of the laser light source S, and the top of the filter element 4 It has a second horizontal upper surface 400 obtained by leveling the laser light source S. Therefore, when the distance between the second horizontal upper surface 400 of the filter element 4 and the first horizontal upper surface 110 of the image sensing chip 11 is predefined as a preset fixed focusing distance D, the movable lens assembly 31 is It can be directly arranged on the second level upper surface 400 of the filter element 4, thereby saving the time for focusing the movable lens assembly 31 relative to the image sensing chip 11, and on the first level of the image sensing chip 11 The surface 110 and the second horizontal upper surface 400 of the filter element 4 are parallel to each other, so as to increase the assembly flatness of the movable lens assembly 31 relative to the image sensing chip 11 .
〔实施例的可能效果〕[Possible effects of the embodiment]
综上所述，本发明的有益效果可以在于，本发明实施例所提供的图像获取模块M及其组装方法，其可通过“图像感测芯片11的顶端具有一通过激光光源S的水平校正后所得到的第一水平上表面110，滤光元件4的顶端具有一通过激光光源S的水平校正后所得到的第二水平上表面400，且图像感测芯片11的第一水平上表面110与滤光元件4的第二水平上表面400彼此平行”的设计，以有效降低可移动镜头组件31相对于图像感测芯片11的组装倾角，藉此以确保可移动镜头组件31相对于图像感测芯片11的平整性。因此，当滤光元件4的第二水平上表面400相距图像感测芯片11的第一水平上表面110的距离被预先定义为一预设的固定调焦距离D时，可移动镜头组件31就可以直接设置在滤光元件4的第二水平上表面400上，藉此以省去可移动镜头组件31相对于图像感测芯片11的调焦时间。To sum up, the beneficial effect of the present invention may lie in that the image acquisition module M and its assembly method provided by the embodiment of the present invention can be achieved by "the top of the image sensing chip 11 has a level corrected by the laser light source S The obtained first horizontal upper surface 110, the top of the filter element 4 has a second horizontal upper surface 400 obtained after the horizontal correction of the laser light source S, and the first horizontal upper surface 110 of the image sensing chip 11 is connected to The second horizontal upper surface 400 of the filter element 4 is designed to be parallel to each other to effectively reduce the assembly inclination angle of the movable lens assembly 31 relative to the image sensing chip 11, thereby ensuring that the movable lens assembly 31 is relatively The planarity of chip 11. Therefore, when the distance between the second horizontal upper surface 400 of the filter element 4 and the first horizontal upper surface 110 of the image sensing chip 11 is predefined as a preset fixed focusing distance D, the movable lens assembly 31 is It can be directly disposed on the second horizontal upper surface 400 of the filter element 4 , thereby saving the time for focusing the movable lens assembly 31 relative to the image sensing chip 11 .
以上所述仅为本发明的优选可行实施例，非因此局限本发明的专利范围，故举凡运用本发明说明书及图式内容所做的等效技术变化，均包含于本发明的保护范围内。The above descriptions are only preferred feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410191478.7ACN105898113B (en) | 2014-05-07 | 2014-05-07 | Image acquisition module and assembling method thereof |
| Application Number | Priority Date | Filing Date | Title |
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| CN201410191478.7ACN105898113B (en) | 2014-05-07 | 2014-05-07 | Image acquisition module and assembling method thereof |
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| CN105898113A CN105898113A (en) | 2016-08-24 |
| CN105898113Btrue CN105898113B (en) | 2017-12-12 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201410191478.7AActiveCN105898113B (en) | 2014-05-07 | 2014-05-07 | Image acquisition module and assembling method thereof |
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| CN (1) | CN105898113B (en) |
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| CN2606337Y (en)* | 2003-03-25 | 2004-03-10 | 武汉大学 | Gyrotheodolites with laser calibrators |
| CN2606879Y (en)* | 2003-04-09 | 2004-03-17 | 武汉大学 | Gyrotheodolite with laser collimator |
| CN101114039A (en)* | 2006-07-28 | 2008-01-30 | 鸿富锦精密工业（深圳）有限公司 | Lens module |
| CN102377920A (en)* | 2010-08-26 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Camera module and assembling method thereof |
| CN202617250U (en)* | 2012-06-04 | 2012-12-19 | 美细耐斯(上海)电子有限公司 | Camera module |
| CN203120017U (en)* | 2012-12-25 | 2013-08-07 | 信利光电(汕尾)有限公司 | Shooting module |
| CN203225826U (en)* | 2013-04-16 | 2013-10-02 | 南昌欧菲光电技术有限公司 | Camera module assembly |
| CN103279001A (en)* | 2013-06-05 | 2013-09-04 | 南昌欧菲光电技术有限公司 | Support structure and camera shooting module with support structure |
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| TR01 | Transfer of patent right | Effective date of registration:20181126 Address after:Room 2018, Sha Tin business centre, 24 Sha Tau Street, 18, Fo Tan Shan, New Territories, Hongkong, China Patentee after:Lijing Innovation Co., Ltd. Address before:Taipei City, Taiwan, China Patentee before:Lite-On Technology Corporation | |
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| TR01 | Transfer of patent right | Effective date of registration:20200818 Address after:No. 25, spectrum West Road, Science City, Guangzhou high tech Industrial Development Zone, Guangzhou, Guangdong Patentee after:LUXVISIONS INNOVATION Ltd. Address before:Room 2018, Sha Tin business centre, 24 Sha Tau Street, 18, Fo Tan Shan, New Territories, Hongkong, China Patentee before:Lijing Innovation Co.,Ltd. |