技术领域technical field
本发明涉及一种电子设备领域，尤其涉及一种芯片、电路板和移动终端。The invention relates to the field of electronic equipment, in particular to a chip, a circuit board and a mobile terminal.
背景技术Background technique
现有智能手机、平板电脑等移动终端的配置越来越高，其内部的芯片主频越来越高，功耗越来越大，其发热量也相应变大，如果这些热量达不到控制或转移，将会带来两个方面的影响：1.芯片温度过高，导致终端运算变慢，甚至卡顿；2.芯片温度传递至终端外壳，导致外壳温度较高，使用时会出现烫手、烫耳朵等问题。The configuration of existing mobile terminals such as smartphones and tablet computers is getting higher and higher, the main frequency of the chips inside them is getting higher and higher, the power consumption is getting higher and higher, and the heat generated is correspondingly larger. If the heat cannot be controlled Or transfer, it will bring two impacts: 1. The temperature of the chip is too high, which will cause the terminal operation to slow down or even freeze; 2. The temperature of the chip will be transmitted to the terminal shell, resulting in a high temperature of the shell, which will cause hot hands when using , hot ears and other issues.
为解决移动终端的发热问题，目前业内一般是通过导热硅胶加石墨片等把热量散发出去，因导热硅胶导热系数小，效果差，芯片热量的散发效率不高，发明人在实施上述技术方案时发现由于散热石墨片的设置受位置的局限较大，对发热量较大的位置无法进行直接散热，从而导致其散热性能较差。In order to solve the heating problem of mobile terminals, the industry generally dissipates heat through heat-conducting silica gel plus graphite sheets, etc., due to the small thermal conductivity of heat-conducting silica gel, the effect is poor, and the heat dissipation efficiency of the chip is not high. When the inventor implemented the above technical solution It is found that the location of the heat-dissipating graphite sheet is limited by the position, and it is impossible to directly dissipate heat at the position with a large calorific value, resulting in poor heat dissipation performance.
发明内容Contents of the invention
本发明所要解决的技术问题在于，提供一种能够吸热储热的芯片、电路板和移动终端。The technical problem to be solved by the present invention is to provide a chip, a circuit board and a mobile terminal capable of absorbing and storing heat.
为了解决上述技术问题，一方面，本发明的实施例提供了一种芯片，其特征在于，包括芯片本体及吸热储热件；所述吸热储热件设置于所述芯片本体上，所述吸热储热件包括泡棉及具有吸热和储热功能的材料属性的吸热储热材料，所述吸热储热材料用于吸收所述芯片本体上的热量并储存所述热量，所述吸热储热材料设置于所述泡棉。In order to solve the above technical problems, on the one hand, an embodiment of the present invention provides a chip, which is characterized in that it includes a chip body and a heat-absorbing and heat-storage element; the heat-absorbing and heat-storage element is arranged on the chip body, so The heat-absorbing heat-storage element includes foam and a heat-absorbing heat-storage material with material properties of heat-absorbing and heat-storage functions, and the heat-absorbing heat-storage material is used to absorb heat on the chip body and store the heat, The heat absorption and heat storage material is disposed on the foam.
其中，所述吸热储热材料包括二氧化硅和聚乙二醇，所述二氧化硅和聚乙二醇质量比为1：1～1：9其中，所述吸热储热材料由以所述二氧化硅为囊壁、以所述聚乙二醇为囊芯的微囊构成。Wherein, the endothermic heat storage material includes silicon dioxide and polyethylene glycol, and the mass ratio of silicon dioxide and polyethylene glycol is 1:1 to 1:9. Wherein, the endothermic heat storage material is composed of The silicon dioxide is composed of a microcapsule with a capsule wall and the polyethylene glycol as a capsule core.
其中，所述吸热储热件还包括稀释溶剂和粘结溶液，所述吸热储热材料、所述稀释溶剂和所述粘结溶液混合并涂布于所述泡棉上。Wherein, the heat-absorbing heat-storage element further includes a diluting solvent and a bonding solution, and the heat-absorbing heat-storing material, the diluting solvent, and the bonding solution are mixed and coated on the foam.
其中，所述吸热储热件还包括钛酸酯偶联剂和胶层，所述吸热储热材料和所述钛酸酯偶联剂混合制成片状材料，所述胶层层叠连接于所述泡棉与所述片状材料之间；所述片状材料上远离所述泡棉的一面连接至所述芯片本体。Wherein, the heat-absorbing heat-storage element further includes a titanate coupling agent and an adhesive layer, the heat-absorbing heat-storage material and the titanate coupling agent are mixed to form a sheet material, and the adhesive layers are laminated and connected Between the foam and the sheet material; the side of the sheet material away from the foam is connected to the chip body.
其中，所述泡棉的周面上设置有所述吸热储热材料。Wherein, the heat absorption and heat storage material is provided on the peripheral surface of the foam.
其中，所述泡棉的整体外表面上均设置有所述吸热储热材料。Wherein, the heat-absorbing heat-storage material is provided on the entire outer surface of the foam.
其中，所述泡棉上设置有通孔，所述通孔中设置有所述吸热储热材料，所述吸热储热材料的一端连接至所述芯片本体。Wherein, the foam is provided with a through hole, and the heat absorption and heat storage material is provided in the through hole, and one end of the heat absorption and heat storage material is connected to the chip body.
另一方面，本发明提供了一种电路板，包括板体和如前述的芯片，所述芯片贴装于所述板体上。In another aspect, the present invention provides a circuit board, which includes a board body and the aforementioned chip, and the chip is mounted on the board body.
其中，所述电路板还包括屏蔽装置，所述屏蔽装置设置于所述板体上，所述屏蔽装置罩设于所述芯片本体，所述吸热储热件压紧在所述芯片本体与所述屏蔽装置之间。Wherein, the circuit board further includes a shielding device, the shielding device is arranged on the board body, the shielding device is arranged on the chip body, and the heat absorbing heat storage element is pressed tightly between the chip body and the chip body. between the shielding devices.
再一方面，本发明提供了一种移动终端，包括如前述的电路板。In another aspect, the present invention provides a mobile terminal, including the aforementioned circuit board.
本发明提供的芯片、电路板和移动终端，通过在芯片本体上设置吸热储热件，吸热储热件包括泡棉及具有吸热和储热功能的吸热储热材料，吸热储热材料能够对芯片上的热量进行吸收，并且将热量储存在自身，当芯片本体的温度降下来后，将储存的热量散发到空气中，从而降低芯片本体的热量，进而使得具有该芯片的电路板和移动终端具有较佳的散热性能，提高设备使用的可靠性，减少了发热对芯片、电路板及移动终端的影响；泡棉可以与移动终端的壳体等结构件进行接触连接，利用泡棉自身的弹性，可以使得吸热储热件与芯片本体紧密接触，有效吸收芯片本体的热量，且对芯片本体起到减震作用，保证芯片本体运行的可靠性。In the chip, circuit board and mobile terminal provided by the present invention, heat absorbing and heat storing parts are arranged on the chip body, and the heat absorbing and heat storing parts include foam and heat absorbing and heat storing materials with heat absorbing and heat storing functions. The thermal material can absorb the heat on the chip and store the heat in itself. When the temperature of the chip body drops, the stored heat will be dissipated into the air, thereby reducing the heat of the chip body and making the circuit with the chip The board and mobile terminal have better heat dissipation performance, which improves the reliability of the equipment and reduces the impact of heat on the chip, circuit board and mobile terminal; The elasticity of the cotton itself can make the heat-absorbing and heat-storage parts in close contact with the chip body, effectively absorb the heat of the chip body, and play a shock-absorbing effect on the chip body, ensuring the reliability of the chip body.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1是本发明第一实施例提供的电路板的结构示意图；Fig. 1 is a schematic structural diagram of a circuit board provided by the first embodiment of the present invention;
图2是本发明第二实施例提供的电路板的结构示意图；2 is a schematic structural diagram of a circuit board provided by a second embodiment of the present invention;
图3是本发明第三实施例提供的电路板的结构示意图；3 is a schematic structural diagram of a circuit board provided by a third embodiment of the present invention;
图4是本发明第四实施例提供的电路板的结构示意图。FIG. 4 is a schematic structural diagram of a circuit board provided by a fourth embodiment of the present invention.
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.
本发明实施例涉及的移动终端可以是任何具备通信和存储功能的设备，例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。The mobile terminal involved in the embodiment of the present invention can be any device with communication and storage functions, such as: tablet computer, mobile phone, e-reader, remote controller, personal computer (Personal Computer, PC), notebook computer, vehicle-mounted equipment, network TV , wearable devices and other smart devices with network functions.
请参考图1，为本发明提供的一种移动终端，包括电路板100，电路板100包括板体1、芯片2和屏蔽罩3。芯片2贴装于板体1上，屏蔽罩3设置于板体1上且罩设于芯片2，以对芯片2起到屏蔽作用。Referring to FIG. 1 , a mobile terminal provided by the present invention includes a circuit board 100 , and the circuit board 100 includes a board body 1 , a chip 2 and a shielding case 3 . The chip 2 is mounted on the board body 1 , and the shielding cover 3 is arranged on the board body 1 and covers the chip 2 to shield the chip 2 .
在本实施例中，电路板100的板体1上集成各种元器件，其中包括贴装于其上的芯片2。芯片2包括芯片本体21及吸热储热件22；吸热储热件22设置于芯片本体21上。吸热储热件22包括泡棉221及具有吸热和储热功能的材料属性的吸热储热材料222，所述吸热储热材料222用于吸收芯片本体21上的热量并储存所述热量，吸热储热材料222设置于所述泡棉221。芯片本体21通过若干个引脚连接至电路板100的板体1上。可以理解的，芯片本体21可以为中央处理器芯片、电源管理芯片、或充电管理芯片中的至少一种。上述芯片2的发热较大，其需要较佳的散热性能，在上述芯片2设置吸热储热材料222，能够将热量吸收并在储热到一定的温度后散发至空气中，从而能够进一步提高移动终端的可靠性。利用泡棉221可以与移动终端的壳体等结构件进行接触连接，从而对芯片本体21起到减震作用，保证芯片本体21运行的可靠性，本实施例中，泡棉221与屏蔽罩3连接。In this embodiment, various components are integrated on the board body 1 of the circuit board 100 , including the chips 2 mounted thereon. The chip 2 includes a chip body 21 and a heat-absorbing and heat-storage element 22 ; the heat-absorbing and heat-storage element 22 is disposed on the chip body 21 . The heat-absorbing heat-storage element 22 includes foam 221 and a heat-absorbing heat-storage material 222 with material properties of heat-absorbing and heat-storing functions, and the heat-absorbing heat-storage material 222 is used to absorb heat on the chip body 21 and store the For heat, the heat-absorbing heat-storage material 222 is disposed on the foam 221 . The chip body 21 is connected to the board body 1 of the circuit board 100 through several pins. It can be understood that the chip body 21 may be at least one of a central processing unit chip, a power management chip, or a charging management chip. The above-mentioned chip 2 generates a lot of heat, which needs better heat dissipation performance. The heat-absorbing heat storage material 222 is arranged on the above-mentioned chip 2, which can absorb heat and distribute it to the air after heat storage reaches a certain temperature, thereby further improving Reliability of mobile terminals. The foam 221 can be used to contact and connect with structural parts such as the housing of the mobile terminal, so as to play a shock-absorbing effect on the chip body 21 and ensure the reliability of the operation of the chip body 21. In this embodiment, the foam 221 and the shielding cover 3 connect.
在本实施例中，吸热储热材料222可以为一种相变材料，其能够随着温度变化而改变物理性质并能吸收大量的热量，随着吸收的热量的增加，吸热储热材料222从一种相逐渐转化为另一种相，在吸收充足的热量后会稳定维持另一种相并不再吸热，而当芯片本体21没有热源产生或者热量较低时，吸热储热材料222进行散热并逐渐随着热量的减少由另一种相逐渐恢复为原来的相。其中，吸热储热材料222可以随着温度的变化从固相向液相或者液相向固相转变，或固相向气相或者液相向固相转变，或者液相向气相或者气相向液相转变。In this embodiment, the heat-absorbing heat storage material 222 can be a phase-change material, which can change its physical properties as the temperature changes and can absorb a large amount of heat. As the absorbed heat increases, the heat-absorbing heat storage material 222 gradually transforms from one phase to another. After absorbing enough heat, it will stably maintain the other phase and no longer absorb heat. When the chip body 21 has no heat source or the heat is low, it will absorb heat and store heat. The material 222 dissipates heat and gradually returns from another phase to the original phase as the heat decreases. Wherein, the endothermic heat storage material 222 can change from solid phase to liquid phase or liquid phase to solid phase, or solid phase to gas phase or liquid phase to solid phase transition, or liquid phase to gas phase or gas phase to liquid phase as the temperature changes. phase transition.
吸热储热材料222可以设置于泡棉221的整体外表面上或者部分外表面上。本实施例中，泡棉221的整体外表面上均设置有吸热储热材料222，吸热储热材料222将泡棉221的整体外表面覆盖，以增大吸热储热材料222与芯片本体21及屏蔽罩3之间的接触面积。芯片本体21上的热量达到一定温度时，吸热储热材料222对芯片本体21上的热量进行吸热和储热，来对芯片本体21进行降温。此处，在其他实施方式中，吸热储热材料222可以仅设置在泡棉221的周面上，或者设置在泡棉221朝向芯片本体21的表面上。The heat absorption and heat storage material 222 may be disposed on the entire outer surface or part of the outer surface of the foam 221 . In this embodiment, the entire outer surface of the foam 221 is provided with an endothermic heat storage material 222, and the endothermic heat storage material 222 covers the entire outer surface of the foam 221 to increase the contact between the endothermic heat storage material 222 and the chip. The contact area between the body 21 and the shield 3 . When the heat on the chip body 21 reaches a certain temperature, the heat absorption and heat storage material 222 absorbs and stores the heat on the chip body 21 to cool down the chip body 21 . Here, in other embodiments, the heat absorption and heat storage material 222 may be disposed only on the peripheral surface of the foam 221 , or disposed on the surface of the foam 221 facing the chip body 21 .
本发明提供的移动终端通过设置具有吸热和储热功能的吸热储热材料222，吸热储热材料222能够对芯片本体21上的热量进行吸收，并且将热量储存在自身，当芯片2的温度降下来后，将储存的热量散发到空气中，从而降低芯片本体21的热量，从而移动终端具有较佳的散热性能，提高移动终端使用的可靠性。In the mobile terminal provided by the present invention, by setting the heat-absorbing heat-storage material 222 with heat-absorbing and heat-storage functions, the heat-absorbing heat-storage material 222 can absorb the heat on the chip body 21 and store the heat in itself, when the chip 2 After the temperature of the chip is lowered, the stored heat is dissipated into the air, thereby reducing the heat of the chip body 21, so that the mobile terminal has better heat dissipation performance and improves the reliability of the mobile terminal.
为了更进一步的改进，吸热储热材料222优选为包括二氧化硅和聚乙二醇，二氧化硅和聚乙二醇的质量比为1：1～1：9。发明人通过大量的实验得出，将二氧化硅和聚乙二醇以质量比为1：1～1：9混合能够制得的有机相变材料具有适宜的相变温度，能够及时吸收芯片本体的热量，来进一步提高芯片2和移动终端的可靠性。具体的，该吸热储热材料222混合制得的相变温度为40度，即在芯片本体产生的热量达到40度后，吸热储热材料222进行相变吸热，将芯片本体的热量带走，以对芯片本体进行降温。当然，在其它实施例中，吸热储热材料222还可以为无机相变材料，或者复合相变材料等。For further improvement, the endothermic heat storage material 222 preferably includes silicon dioxide and polyethylene glycol, and the mass ratio of silicon dioxide and polyethylene glycol is 1:1˜1:9. The inventor obtained through a large number of experiments that the organic phase change material that can be prepared by mixing silicon dioxide and polyethylene glycol at a mass ratio of 1:1 to 1:9 has a suitable phase transition temperature and can absorb the chip body in time. heat to further improve the reliability of the chip 2 and the mobile terminal. Specifically, the phase transition temperature obtained by mixing the endothermic heat storage material 222 is 40 degrees, that is, after the heat generated by the chip body reaches 40 degrees, the endothermic heat storage material 222 undergoes a phase change and absorbs heat, and the heat of the chip body Take it away to cool down the chip body. Certainly, in other embodiments, the heat absorption and heat storage material 222 may also be an inorganic phase change material, or a composite phase change material, and the like.
为了更进一步的改进，吸热储热材料222由以二氧化硅为囊壁、以聚乙二醇为囊芯的微囊构成。该微囊结构的吸热储热材料222能够较佳地对芯片本体21进行吸热储热，进而达到较佳的散热性能。具体的，将聚乙二醇加入到一定浓度的硅溶胶中，待全部溶解后，滴加CaCl2促凝剂溶液，在强力搅拌下，使得聚乙二醇在硅溶胶中发生溶胶-凝胶反应，静置后形成三维网络结构凝胶；将凝胶在80℃烘箱中鼓风干燥24～48h，冷却至室温，即能够得到以有机硅氧化合物在碱性条件下产生的二氧化硅凝胶为囊壁、以乳化后的聚乙二醇为囊芯的微胶囊。即二氧化硅作为囊壁包裹住作为囊芯的聚乙二醇，使得聚乙二醇在从固相-液相的过程中不会泄漏，能够很好的被二氧化硅包裹住。该形成微胶囊结构的吸热散热材料在芯片本体21的热量的温度达到40度后，开始吸收芯片本体21上的热量，并且囊芯本身逐渐从固相-液相，当囊芯都转化为液相后，吸热储热材料222吸收的热量已经饱和，其停止吸收热量，而在本体外部的温度逐渐降低至预设温度后，囊芯将吸收的热量散发出来，传递到空气中，并且囊芯会随着其身热量的逐渐减少而逐渐从液相-固相，从而对芯片本体21进行直接的降温，提高移动终端的散热性能和可靠性。当然，在其它实施例中，吸热储热材料222还可以为其它结构，使得吸热储热材料222能够从固相-气相。For further improvement, the heat-absorbing and heat-storage material 222 is composed of microcapsules with silicon dioxide as the capsule wall and polyethylene glycol as the capsule core. The heat-absorbing and heat-storage material 222 of the microcapsule structure can better absorb and store heat on the chip body 21 , thereby achieving better heat dissipation performance. Specifically, polyethylene glycol is added to a certain concentration of silica sol, and after it is completely dissolved,CaCl2 coagulant solution is added dropwise, and under strong stirring, polyethylene glycol undergoes sol-gel formation in the silica sol react, and form a three-dimensional network structure gel after standing; air-dry the gel in an oven at 80°C for 24-48 hours, and cool to room temperature, that is, the silica gel produced by organosiloxane compounds under alkaline conditions can be obtained. The gel is the capsule wall, and the emulsified polyethylene glycol is the microcapsule of the capsule core. That is, silicon dioxide acts as a capsule wall to wrap polyethylene glycol as a capsule core, so that polyethylene glycol will not leak during the process from solid phase to liquid phase, and can be well wrapped by silicon dioxide. The heat-absorbing and heat-dissipating material forming the microcapsule structure starts to absorb the heat on the chip body 21 after the heat temperature of the chip body 21 reaches 40 degrees, and the capsule core itself gradually changes from the solid phase to the liquid phase. After the liquid phase, the heat absorbed by the heat-absorbing heat storage material 222 has been saturated, and it stops absorbing heat, and after the temperature outside the body gradually drops to the preset temperature, the capsule core emits the absorbed heat and transfers it to the air, and The capsule core will gradually change from the liquid phase to the solid phase as its body heat gradually decreases, thereby directly cooling the chip body 21 and improving the heat dissipation performance and reliability of the mobile terminal. Of course, in other embodiments, the endothermic heat storage material 222 can also be of other structures, so that the endothermic heat storage material 222 can change from solid phase to gas phase.
吸热储热件22还包括稀释溶剂和粘结溶液，吸热储热材料222、稀释溶剂和粘结溶液混合并涂布于泡棉221上。通过将稀释溶剂、粘结溶液与吸热储热材料222混合后涂布在泡棉221上形成吸热储热件22，使得吸热储热件22直接具有附着力，无需再另外增加胶层即可涂布于泡棉221上，同时便于将吸热储热件22整体粘接至芯片本体21与屏蔽罩3之间，还可以利用泡棉221的形变性能起到减震作用，从而提供了一种使用较为便利的吸热储热件22。The heat-absorbing heat storage element 22 also includes a dilution solvent and a binding solution, and the heat-absorbing heat storage material 222 , the dilution solvent and the binding solution are mixed and coated on the foam 221 . The heat-absorbing heat-storage element 22 is formed by mixing the dilution solvent, the bonding solution, and the heat-absorbing heat-storage material 222 on the foam 221, so that the heat-absorbing heat-storage element 22 has direct adhesion, and no additional adhesive layer is required It can be coated on the foam 221, and at the same time, it is convenient to integrally bond the heat-absorbing and heat-storage element 22 between the chip body 21 and the shielding cover 3, and the deformation performance of the foam 221 can also be used to play a shock-absorbing role, thereby providing A heat-absorbing heat-storage element 22 that is more convenient to use is provided.
在本实施例中，将吸热储热材料222捣碎并强力搅拌得到粉末，由于粉体的直径远远大于微囊的直径，因此不会破坏吸热储热材料222中的微囊结构，即不会影响吸热储热材料222的吸热储热功能，在粉末状的吸热储热材料222添加进稀释溶剂及添加特殊粘结溶液混合(比如：甲醇二甲苯，丙烯酸树脂等)，再采用涂布的形式堆积成一定厚度附在泡棉221上形成吸热储热件22，使得吸热储热件22具有附着力，可以整体粘接在芯片本体21上。此处，在其他实施方式中，也可以直接将吸热储热材料222涂布在泡棉221上形成吸热储热件22，再通过粘接或直接贴合方式使得吸热储热件22与芯片本体21相连，从而实现吸热储热的功能。In this embodiment, the endothermic heat storage material 222 is crushed and vigorously stirred to obtain powder. Since the diameter of the powder is much larger than that of the microcapsules, the microcapsule structure in the endothermic heat storage material 222 will not be destroyed. That is, it will not affect the heat-absorbing and heat-storage function of the heat-absorbing heat-storage material 222, adding a diluting solvent and a special bonding solution (for example: methanol xylene, acrylic resin, etc.) Then it is piled up in the form of coating to a certain thickness and attached to the foam 221 to form the heat-absorbing heat-storage element 22 , so that the heat-absorbing heat-storage element 22 has adhesion and can be bonded on the chip body 21 as a whole. Here, in other embodiments, the heat-absorbing heat-storage material 222 can also be directly coated on the foam 221 to form the heat-absorbing heat-storage element 22, and then the heat-absorbing heat-storage element 22 can be formed by bonding or direct bonding. It is connected with the chip body 21 to realize the function of heat absorption and heat storage.
吸热储热件22压紧在所述芯片本体21与所述屏蔽罩3之间，以利用吸热储热件22的泡棉221起到较好的减震作用，同时可以使得吸热储热件22与芯片本体21紧密连接，利于吸热储热材料222吸收芯片本体21的热量。此处，在其他实施方式中，如某些芯片本体21不需要屏蔽罩3，也可以利用移动终端的其他结构件，例如壳体等，压在吸热储热件22上，使得吸热储热件22压紧于芯片本体21上，将吸热储热件22与芯片本体21紧密连接，且起到较好的减震作用。The heat-absorbing heat-storage element 22 is pressed tightly between the chip body 21 and the shield 3, so that the foam 221 of the heat-absorbing heat-storage element 22 can play a better shock absorption effect, and at the same time, the heat-absorbing heat-storage element can The thermal element 22 is closely connected with the chip body 21 , which is beneficial for the heat absorption and heat storage material 222 to absorb the heat of the chip body 21 . Here, in other embodiments, if some chip bodies 21 do not need the shielding cover 3, other structural parts of the mobile terminal, such as the casing, can also be used to press on the heat-absorbing heat-storage element 22, so that the heat-absorbing heat-storage element 22 The heat element 22 is pressed tightly on the chip body 21, closely connects the heat-absorbing heat storage element 22 and the chip body 21, and plays a better shock-absorbing effect.
本实施例中，屏蔽罩3包括屏蔽支架31及屏蔽盖32，屏蔽支架31固定于所述线路板，且环绕在所述芯片本体21的四周，屏蔽支架31与芯片本体21间隙设置，屏蔽盖32固定于屏蔽支架31，泡棉221压紧在屏蔽盖32与芯片本体21之间，利用屏蔽支架31与屏蔽盖32的配合，可以方便屏蔽罩3与芯片本体21及板体1之间的装配连接，屏蔽支架31与芯片本体21之间形成的间隙，可以避免屏蔽支架31对芯片本体21造成干涉。In this embodiment, the shielding cover 3 includes a shielding bracket 31 and a shielding cover 32. The shielding bracket 31 is fixed on the circuit board and surrounds the chip body 21. The shielding bracket 31 and the chip body 21 are provided with a gap. The shielding cover 32 is fixed on the shielding bracket 31, and the foam 221 is pressed between the shielding cover 32 and the chip body 21. By using the cooperation of the shielding bracket 31 and the shielding cover 32, the shielding cover 3, the chip body 21 and the board body 1 can be conveniently connected. The assembly connection and the gap formed between the shielding bracket 31 and the chip body 21 can prevent the shielding bracket 31 from interfering with the chip body 21 .
当移动终端开始装配时，首先在本体设置吸热储热件22，接着将芯片2贴装于电路板100的板体1上，再安装屏蔽罩3，使将吸热储热件22压紧在屏蔽罩3与芯片本体21之间。最后将电路板100装配于移动终端内。其中，形成微胶囊结构的吸热散热材料在本体的热量温度达到40度后，开始吸收本体上的热量，并且囊芯本身逐渐从固相-液相，当囊芯都转化为液相后，吸热储热材料222吸收的热量已经饱和，其停止吸收热量，而在本体外部的温度逐渐降低至预设温度后，囊芯将吸收的热量散发出来，传递到空气中，并且囊芯会随着其身热量的逐渐减少而逐渐从液相-固相，从而对本体进行直接的降温，提高移动终端的散热性能和可靠性。When the mobile terminal starts to be assembled, the heat-absorbing heat-storage element 22 is first arranged on the main body, then the chip 2 is mounted on the board body 1 of the circuit board 100, and the shielding cover 3 is installed to press the heat-absorbing heat-storage element 22 tightly. Between the shield 3 and the chip body 21 . Finally, the circuit board 100 is assembled in the mobile terminal. Among them, the heat-absorbing and heat-dissipating material forming the microcapsule structure begins to absorb the heat on the body after the heat temperature of the body reaches 40 degrees, and the capsule core itself gradually changes from the solid phase to the liquid phase. When the capsule core is transformed into the liquid phase, The heat absorbed by the heat-absorbing heat storage material 222 has been saturated, and it stops absorbing heat, and after the temperature outside the body gradually drops to the preset temperature, the capsule core will emit the absorbed heat and transfer it to the air, and the capsule core will follow With the gradual reduction of body heat, it gradually changes from liquid phase to solid phase, thereby directly cooling the body and improving the heat dissipation performance and reliability of the mobile terminal.
本发明提供的移动终端通过在芯片2的芯片本体21上设置吸热储热件22，吸热储热件22包括具有吸热和储热功能的吸热储热材料222能够对芯片本体21上的热量进行吸收，并且将热量储存在自身，当芯片2的温度降下来后，将储存的热量散发到空气中，从而降低芯片本体21的热量，从而移动终端具有较佳的散热性能，提高移动终端使用的可靠性。The mobile terminal provided by the present invention is provided with a heat-absorbing heat-storage element 22 on the chip body 21 of the chip 2, and the heat-absorbing heat-storage element 22 includes a heat-absorbing heat-storage material 222 with heat-absorbing and heat-storage functions, which can absorb the heat and store the heat in itself. When the temperature of the chip 2 drops, the stored heat is dissipated into the air, thereby reducing the heat of the chip body 21, so that the mobile terminal has better heat dissipation performance and improves the mobile terminal. End-use reliability.
本发明提供的移动终端还通过将二氧化硅和聚乙二醇以质量比为1：1～1：9混合能够制得的有机相变材料具有适宜的相变温度，能够及时吸收本体的热量，来进一步提高芯片2和移动终端的可靠性。The mobile terminal provided by the present invention can also obtain an organic phase change material by mixing silicon dioxide and polyethylene glycol at a mass ratio of 1:1 to 1:9, which has a suitable phase change temperature and can absorb the heat of the body in time. , to further improve the reliability of the chip 2 and the mobile terminal.
本发明提供的移动终端还通过将吸热储热材料222制成微囊结构，能够较佳对芯片本体21进行吸热储热，进而达到较佳的散热性能。The mobile terminal provided by the present invention can better absorb and store heat on the chip body 21 by making the heat-absorbing heat-storage material 222 into a microcapsule structure, thereby achieving better heat dissipation performance.
本发明提供的移动终端还通过将稀释溶剂、粘结溶液与吸热储热材料222混合设置在泡棉221上形成吸热储热件22，使得吸热储热件22直接具有附着力，无需再另外增加胶层即可涂布于芯片本体21上，从而提供了一种使用较为便利的吸热储热件22。The mobile terminal provided by the present invention also forms the heat-absorbing heat-storage element 22 by mixing the dilution solvent, the bonding solution, and the heat-absorbing heat-storage material 222 on the foam 221, so that the heat-absorbing heat-storage element 22 has direct adhesion without An additional adhesive layer can be applied on the chip body 21 , thereby providing a heat absorbing heat storage element 22 that is more convenient to use.
如图2所示，本发明的第二实施例提供一种移动终端，与本发明第一实施例提供的移动终端的基本结构大致相同，其不同之处在于吸热储热件22a的结构。本实施例中，吸热储热件22a包括泡棉221a、设置在泡棉221a上且具有吸热和储热功能的材料属性的吸热储热材料、钛酸酯偶联剂及胶层224a，吸热储热材料和钛酸酯偶联剂混合制成片状材料223a，胶层224a层叠连接于所述泡棉221a与所述片状材料223a之间，片状材料223a上远离所述泡棉221a的一面连接至所述芯片本体21。利用胶层224a，可以将带有吸热储热材料粘接在泡棉221a上，以便使得二者连接为一个整体。As shown in FIG. 2 , the second embodiment of the present invention provides a mobile terminal, which has substantially the same basic structure as the mobile terminal provided by the first embodiment of the present invention, the difference lies in the structure of the heat absorbing heat storage element 22a. In this embodiment, the heat-absorbing heat-storage element 22a includes foam 221a, a heat-absorbing heat-storage material disposed on the foam 221a and having material properties of heat absorption and heat storage, a titanate coupling agent, and an adhesive layer 224a The endothermic heat storage material and the titanate coupling agent are mixed to form a sheet material 223a, and the adhesive layer 224a is stacked and connected between the foam 221a and the sheet material 223a, and the sheet material 223a is far away from the One side of the foam 221 a is connected to the chip body 21 . The adhesive layer 224a can be used to bond the heat-absorbing and heat-storage material to the foam 221a, so that the two are connected as a whole.
通过将吸热储热材料与钛酸酯偶联剂混合制成片状材料223a，再通过胶层224a层叠连接于泡棉221a与所述片状材料223a之间形成吸热储热件22a，不仅使得吸热储热件22a能够按照芯片本体21的形状去进行裁切，进而能够与泡棉221a具有较佳的配合，片状的吸热储热件22a应用较为方便，直接粘上即可，不用等待其冷却形成涂层。The heat-absorbing heat-storage material is mixed with a titanate coupling agent to form a sheet-shaped material 223a, and then laminated and connected between the foam 221a and the sheet-shaped material 223a through an adhesive layer 224a to form the heat-absorbing heat-storage element 22a, Not only can the heat-absorbing and heat-storage element 22a be cut according to the shape of the chip body 21, but it can also have better cooperation with the foam 221a, and the sheet-shaped heat-absorbing and heat-storage element 22a is more convenient to use, just stick it on , without waiting for it to cool to form a coating.
在本实施例中，将吸热储热材料捣碎并强力搅拌得到粉末，由于粉体的直径远远大于微囊的直径，因此不会破坏吸热储热材料中的微囊结构，即不会影响吸热储热材料的吸热储热功能，在粉末状的吸热储热材料添加钛酸酯偶联剂疏水改性得到无机拟有机复合定形相变材料，再将该无机拟有机复合定形相变材料经压片机压片制得薄片状即片状材料223a，片状材料223a通过胶层224a层叠连接上泡棉221a形成吸热储热件22a。可以理解的，胶层224a可以为背胶、双面胶或离型膜等。吸热储热件22a可以根据芯片本体21a的形状裁剪成一定形状，贴合在芯片本体21a上，实现吸热储热的功能。In this embodiment, the endothermic heat storage material is crushed and vigorously stirred to obtain a powder. Since the diameter of the powder is much larger than that of the microcapsules, the structure of the microcapsules in the endothermic heat storage material will not be destroyed, that is, no It will affect the endothermic heat storage function of the endothermic heat storage material. Add titanate coupling agent hydrophobic modification to the powder endothermic heat storage material to obtain an inorganic pseudo-organic composite shape-setting phase change material, and then compound the inorganic pseudo-organic The shaped phase change material is compressed by a tablet machine to form a thin sheet material 223a, and the sheet material 223a is laminated and connected to the foam 221a through the adhesive layer 224a to form the heat absorbing heat storage element 22a. It can be understood that the adhesive layer 224a can be back adhesive, double-sided adhesive or release film, etc. The heat-absorbing and heat-storage element 22a can be cut into a certain shape according to the shape of the chip body 21a, and pasted on the chip body 21a to realize the function of heat-absorbing and heat-storing.
本实施例中，片状材料223a上远离泡棉221a的一面连接至芯片本体21a，片状材料223a可以直接贴合于所述芯片本体21a的顶面，也可以通过背胶、双面胶、离型膜、导热胶等粘接在所述芯片本体21a的顶面，以便吸热储热材料吸收所述芯片本体21a的热量。In this embodiment, the side of the sheet material 223a away from the foam 221a is connected to the chip body 21a, and the sheet material 223a can be directly attached to the top surface of the chip body 21a, or can be glued through adhesive, double-sided adhesive, A release film, heat-conducting glue, etc. are adhered to the top surface of the chip body 21a, so that the heat absorbing heat storage material absorbs the heat of the chip body 21a.
本发明提供的移动终端还通过将吸热储热材料与钛酸酯偶联剂混合制成片状材料223a，再通过胶层224a层叠连接于片状材料223a上形成吸热储热件22a，不仅使得吸热储热件22a能够按照本体的形状去进行裁切，而且片状的吸热储热件22a应用较为方便，直接粘上即可，不用等待其冷却形成涂层。The mobile terminal provided by the present invention also mixes the heat-absorbing heat-storage material with a titanate coupling agent to form a sheet-shaped material 223a, and then laminates and connects it to the sheet-shaped material 223a through an adhesive layer 224a to form a heat-absorbing heat-storage element 22a. Not only the heat-absorbing and heat-storage element 22a can be cut according to the shape of the body, but also the sheet-shaped heat-absorbing and heat-storage element 22a is more convenient to apply, just stick it directly, without waiting for it to cool to form a coating.
在上述实施方式中，吸热储热材料设置在泡棉的整体外表面上，或者吸热储热材料设置在泡棉朝向芯片本体的表面上，吸热储热材料与泡棉的结合方式并不绝限于上述实施例。In the above embodiments, the heat-absorbing and heat-storage material is arranged on the entire outer surface of the foam, or the heat-absorbing and heat-storage material is arranged on the surface of the foam facing the chip body, and the combination of the heat-absorbing and heat-storage material and the foam It is not limited to the above-mentioned embodiments.
如本发明第三实施例中，结合图3所示，吸热储热材料222b可以仅设置在泡棉221b的周面上，具体地，吸热储热材料222b可以涂布在泡棉221b的四周周面上，也可以是，吸热储热材料222b加工成环形，泡棉221b嵌入在吸热储热材料222b形成的环形区域中。In the third embodiment of the present invention, as shown in FIG. 3 , the heat-absorbing and heat-storage material 222b can be arranged only on the peripheral surface of the foam 221b, specifically, the heat-absorbing and heat-storage material 222b can be coated on the foam 221b On the peripheral surface, the heat absorption and heat storage material 222b may also be processed into a ring shape, and the foam 221b is embedded in the ring-shaped area formed by the heat absorption and heat storage material 222b.
再如本发明提供的第四实施例，结合图4所示，泡棉221c上可以开设通孔，通孔中设置有吸热储热材料222c，使得吸热储热材料222c嵌入在泡棉221c中，吸热储热材料222c的一端可以连接至芯片本体21a，另一端可以连接至屏蔽罩3或其他结构件，以便吸热储热材料222c吸收芯片本体21a的热量，通孔可以设置多个，根据芯片2的主要发热部位设置通孔的位置。In the fourth embodiment provided by the present invention, as shown in FIG. 4 , a through hole can be opened on the foam 221c, and an endothermic heat storage material 222c is arranged in the through hole, so that the endothermic heat storage material 222c is embedded in the foam 221c Among them, one end of the heat-absorbing heat-storage material 222c can be connected to the chip body 21a, and the other end can be connected to the shield 3 or other structural parts, so that the heat-absorbing heat-storage material 222c absorbs the heat of the chip body 21a, and a plurality of through holes can be provided. , according to the main heat-generating parts of the chip 2, the positions of the through holes are set.
或者，吸热储热材料可以采用以上几种方式的结合设置在泡棉上，例如，泡棉朝上芯片本体的表面上设置吸热储热材料，并且泡棉上开设有通孔，通孔中注入有吸热储热材料。或者，泡棉的周面上及朝向芯片本体的表面上设置有吸热储热材料。Alternatively, the heat-absorbing and heat-storage material can be arranged on the foam in a combination of the above methods, for example, the heat-absorbing and heat-storage material is arranged on the surface of the foam facing upward to the chip body, and a through hole is opened on the foam, and the through hole Injected with endothermic heat storage material. Alternatively, a heat absorbing heat storage material is provided on the peripheral surface of the foam and on the surface facing the chip body.
本发明提供的移动终端通过在芯片本体上设置吸热储热件，吸热储热件包括具有吸热和储热功能的吸热储热材料能够对芯片本体上的热量进行吸收，并且将热量储存在自身，当芯片本体的温度降下来后，将储存的热量散发到空气中，从而降低芯片本体的热量，从而移动终端具有较佳的散热性能，提高移动终端使用的可靠性。泡棉可以与移动终端的壳体等结构件进行接触连接，利用泡棉自身的弹性，可以使得吸热储热件与芯片本体紧密接触，有效吸收芯片本体的热量，且对芯片本体起到减震作用，保证芯片本体运行的可靠性。The mobile terminal provided by the present invention can absorb heat on the chip body by arranging heat absorbing heat storage parts on the chip body. Stored in itself, when the temperature of the chip body drops, the stored heat is dissipated into the air, thereby reducing the heat of the chip body, so that the mobile terminal has better heat dissipation performance and improves the reliability of the mobile terminal. The foam can be connected with structural parts such as the shell of the mobile terminal. Using the elasticity of the foam itself, the heat-absorbing heat storage part can be closely contacted with the chip body, effectively absorbing the heat of the chip body, and reducing the heat of the chip body. Shock effect, to ensure the reliability of the operation of the chip body.
以上的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。The above embodiments do not limit the protection scope of the technical solution. Any modifications, equivalent replacements and improvements made within the spirit and principles of the above implementation methods shall be included in the protection scope of the technical solution.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287175.4ACN105873417B (en) | 2016-04-29 | 2016-04-29 | A kind of chip, circuit board and mobile terminal |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287175.4ACN105873417B (en) | 2016-04-29 | 2016-04-29 | A kind of chip, circuit board and mobile terminal |
| Publication Number | Publication Date |
|---|---|
| CN105873417Atrue CN105873417A (en) | 2016-08-17 |
| CN105873417B CN105873417B (en) | 2019-02-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610287175.4AExpired - Fee RelatedCN105873417B (en) | 2016-04-29 | 2016-04-29 | A kind of chip, circuit board and mobile terminal |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information | Address after:523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after:GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before:523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before:GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. | |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee | Granted publication date:20190201 |