技术领域technical field
本发明涉及一种新能源技术领域，特别涉及一种低温固化型导电银浆料的制备方法。The invention relates to a new energy technology field, in particular to a preparation method of a low-temperature curing conductive silver paste.
背景技术Background technique
太阳能是一种取之不尽、用之不竭的清洁型能源，随着煤炭、石油等不可再生能源的日益枯竭，开发、利用太阳能成为大热点，太阳能电池就是利用太阳能的一种重要手段。Solar energy is an inexhaustible clean energy. With the depletion of non-renewable energy such as coal and oil, the development and utilization of solar energy has become a hot spot. Solar cells are an important means of utilizing solar energy.
目前，晶硅太阳能电池技术已日渐成熟，转换效率接近20%；大多数研究者都在研究如何提高太阳能电池的转换效率；晶硅异质结太阳能电池理论计算出其转换效率为29%，目前生产出的晶硅异质结太阳能电池的转换效率为22~23%之间，实验室的转换效率则高达25%，且该晶硅异质结太阳能电池的耐温性和稳定性均比普通的晶硅太阳能电池好，主要是因为晶硅异质结太阳能电池的电极是采用了低温导电银浆料，而电极的浆料影响晶硅异质结太阳能电池的填充因子，从而影响其转换效率；制造电极的方法很多，丝网印刷及共烧是目前最为普遍的一种生产工艺。晶硅异质结太阳能电池正面电极用导电浆料与背面电极均通过丝网印刷将导电银浆料涂覆在电池上并通过低温烧结在硅片两面形成正负电极；共烧结后的晶硅异质结太阳能电池的电极必须附着牢固、不落灰，硅片不易变形，并且易于焊接，便于用导线将光照产生的电流收集并导出。目前大多数的低温导电银浆由于其粘稠度以及导电性等性质导致晶硅异质结太阳能电池的填充因子不高，因此有必要开发一种提高太阳能电池的填充因子的低温固化导电银浆料。At present, the technology of crystalline silicon solar cells has matured day by day, and the conversion efficiency is close to 20%; most researchers are studying how to improve the conversion efficiency of solar cells; the theoretical calculation of crystalline silicon heterojunction solar cells has a conversion efficiency of 29%. The conversion efficiency of the crystalline silicon heterojunction solar cells produced is between 22 and 23%, and the conversion efficiency of the laboratory is as high as 25%, and the temperature resistance and stability of the crystalline silicon heterojunction solar cells are higher than ordinary solar cells. The crystalline silicon solar cell is good, mainly because the electrode of the crystalline silicon heterojunction solar cell uses a low-temperature conductive silver paste, and the paste of the electrode affects the fill factor of the crystalline silicon heterojunction solar cell, thereby affecting its conversion efficiency ; There are many ways to manufacture electrodes, and screen printing and co-firing are the most common production processes at present. Both the conductive paste for the front electrode and the back electrode of the crystalline silicon heterojunction solar cell are coated with the conductive silver paste on the cell by screen printing, and the positive and negative electrodes are formed on both sides of the silicon wafer by low-temperature sintering; the co-sintered crystalline silicon The electrodes of heterojunction solar cells must be firmly attached and free of dust, and the silicon wafers are not easy to deform and easy to weld, so that it is convenient to use wires to collect and export the current generated by light. At present, most low-temperature conductive silver pastes have low fill factors for crystalline silicon heterojunction solar cells due to their viscosity and conductivity. Therefore, it is necessary to develop a low-temperature curable conductive silver paste that improves the fill factor of solar cells. material.
发明内容Contents of the invention
本发明要解决的技术问题是，提供一种低温固化型导电银浆料的制备方法。The technical problem to be solved by the present invention is to provide a method for preparing a low-temperature curing conductive silver paste.
为了解决上述问题，本发明采用的技术方案是，该低温固化型导电银浆料的制备方法，其配方的各组分按重量比为：纳米银粉86~92wt%，纳米铝粉0.5~2wt%，热塑性树脂2~4wt%，添加剂0.1~2 wt%，溶剂1~10wt%。In order to solve the above problems, the technical solution adopted in the present invention is, the preparation method of the low-temperature curing type conductive silver paste, the components of the formula are by weight: nano-silver powder 86 ~ 92wt%, nano-aluminum powder 0.5 ~ 2wt% , thermoplastic resin 2~4wt%, additive 0.1~2wt%, solvent 1~10wt%.
进一步改进在于，其配方的各组分按重量比为：纳米银粉92wt%，纳米铝粉0.5wt%，热塑性树脂2wt%，添加剂0.5 wt%，溶剂5wt%。Further improvement lies in that the weight ratio of each component of the formula is: nano-silver powder 92wt%, nano-aluminum powder 0.5wt%, thermoplastic resin 2wt%, additive 0.5wt%, solvent 5wt%.
进一步改进在于，所述溶剂为丁基卡必醇醋酸酯或/和丁基卡必醇。A further improvement is that the solvent is butyl carbitol acetate or/and butyl carbitol.
进一步改进在于，热塑性树脂采取聚酰胺树脂与聚碳酸酯树脂按照质量比例 3：97~10：90 混合的混合物。A further improvement is that the thermoplastic resin is a mixture of polyamide resin and polycarbonate resin in a mass ratio of 3:97~10:90.
进一步改进在于，所述纳米银粉为球形银粉，所述球形银粉的粒径中值D50＝50-200nm。A further improvement is that the nano-silver powder is a spherical silver powder, and the median diameter of the spherical silver powder is D50=50-200nm.
进一步改进在于，所述添加剂为咪唑类固化剂。A further improvement is that the additive is an imidazole curing agent.
采用上述技术方案，所得到的低温固化型导电银浆料的制备方法具有低温固化且固化时间短，所制得的太阳能电池的电极高宽比大，提高了太阳能电池的填充因子，从而提高了太阳能电池的转换效率。Adopt the above-mentioned technical scheme, the preparation method of the obtained low-temperature curing type conductive silver paste has low-temperature curing and short curing time, and the electrode aspect ratio of the obtained solar cell is large, which improves the fill factor of the solar cell, thereby improving the Conversion efficiency of solar cells.
本发明要解决的技术问题是，提供一种低温固化型导电银浆料的制备方法，其制备工艺简单，可操作性强，生产率高且采用该方法所制备的低温固化型导电银浆料的制备方法成本低，且产量大，适用于商业广泛推广。The technical problem to be solved by the present invention is to provide a preparation method of low-temperature curing type conductive silver paste, which has simple preparation process, strong operability, high productivity and the low-temperature curing type conductive silver paste prepared by the method has the advantages of: The preparation method has low cost and large output, and is suitable for extensive commercial promotion.
为了解决上述问题，本发明采用的技术方案是，该低温固化型导电银浆料的制备方法，包括以下步骤：In order to solve the above problems, the technical solution adopted in the present invention is that the preparation method of the low-temperature curing type conductive silver paste comprises the following steps:
（1）按比例称量原料，备用；(1) Weigh the raw materials in proportion and set aside;
（2）将纳米银粉和纳米铝粉放入球磨机，边搅拌边研磨，使纳米银粉和纳米铝粉混合均匀，且混合粉末的粒径小于100nm，备用；(2) Put the nano-silver powder and nano-aluminum powder into a ball mill, and grind while stirring, so that the nano-silver powder and nano-aluminum powder are mixed evenly, and the particle size of the mixed powder is less than 100nm, and set aside;
（3）将热塑性树脂、添加剂和溶剂放入搅拌缸内溶解，并加热搅拌，加热温度为80~90℃，搅拌速度为600~800 r/min，搅拌和加热时间为2~3h；(3) Put the thermoplastic resin, additives and solvent into the mixing tank to dissolve, and heat and stir. The heating temperature is 80~90℃, the stirring speed is 600~800 r/min, and the stirring and heating time is 2~3h;
（4）将步骤（2）中的混合粉末加入搅拌缸，继续加热搅拌，加热温度为40~60℃，搅拌速度为2600~3500 r/min，搅拌和加热时间为4~6h；混合均匀成糊浆状，则制得低温固化导电银浆料。(4) Add the mixed powder in step (2) into the mixing tank, continue heating and stirring, the heating temperature is 40~60°C, the stirring speed is 2600~3500 r/min, the stirring and heating time is 4~6h; If it is paste-like, a low-temperature curing conductive silver paste is prepared.
具体实施方式Detailed ways
实施例1：该低温固化型导电银浆料，其配方的各组分按重量比为：纳米银粉92wt%，纳米铝粉0.5wt%，热塑性树脂2wt%，添加剂0.5 wt%，溶剂5wt%；所述溶剂为丁基卡必醇醋酸酯；热塑性树脂采取聚酰胺树脂与聚碳酸酯树脂按照质量比例6：94混合的混合物；所述纳米银粉为球形银粉，所述球形银粉的粒径中值D50＝50-200nm；所述添加剂为咪唑类固化剂。Embodiment 1: this low-temperature curing type conductive silver paste, each component of its formula is by weight: nano-silver powder 92wt%, nano-aluminum powder 0.5wt%, thermoplastic resin 2wt%, additive 0.5wt%, solvent 5wt%; The solvent is butyl carbitol acetate; the thermoplastic resin is a mixture of polyamide resin and polycarbonate resin in a mass ratio of 6:94; the nano-silver powder is spherical silver powder, and the median particle diameter of the spherical silver powder is D50=50-200nm; the additive is an imidazole curing agent.
该低温固化型导电银浆料的制备方法，包括以下步骤：The preparation method of this low-temperature curing type conductive silver paste comprises the following steps:
（1）按比例称量原料，备用；(1) Weigh the raw materials in proportion and set aside;
（2）将纳米银粉和纳米铝粉放入球磨机，边搅拌边研磨，使纳米银粉和纳米铝粉混合均匀，且混合粉末的粒径小于100nm，备用；(2) Put the nano-silver powder and nano-aluminum powder into a ball mill, and grind while stirring, so that the nano-silver powder and nano-aluminum powder are mixed evenly, and the particle size of the mixed powder is less than 100nm, and set aside;
（3）将热塑性树脂、添加剂和溶剂放入搅拌缸内溶解，并加热搅拌，加热温度为80℃，搅拌速度为700 r/min，搅拌和加热时间为2.5h；(3) Dissolve the thermoplastic resin, additives and solvents in a mixing tank, and heat and stir. The heating temperature is 80°C, the stirring speed is 700 r/min, and the stirring and heating time is 2.5 hours;
（4）将步骤（2）中的混合粉末加入搅拌缸，继续加热搅拌，加热温度为50℃，搅拌速度为3000 r/min，搅拌和加热时间为5h；混合均匀成糊浆状，则制得低温固化导电银浆料。(4) Add the mixed powder in step (2) into the mixing tank, continue heating and stirring, the heating temperature is 50°C, the stirring speed is 3000 r/min, and the stirring and heating time is 5 hours; mix evenly and form a paste, then the preparation A low-temperature curing conductive silver paste was obtained.
实施例2：该低温固化型导电银浆料，其配方的各组分按重量比例为：纳米银粉86wt%，纳米铝粉2wt%，热塑性树脂4wt%，添加剂2 wt%，溶剂6wt%；所述溶剂为丁基卡必醇；热塑性树脂采取聚酰胺树脂与聚碳酸酯树脂按照质量比例 3：97混合的混合物；所述纳米银粉为球形银粉，所述球形银粉的粒径中值D50＝50-200nm；所述添加剂为咪唑类固化剂。Embodiment 2: this low-temperature curing type conductive silver paste, each component of its formula is by weight: nano-silver powder 86wt%, nano-aluminum powder 2wt%, thermoplastic resin 4wt%, additive 2 wt%, solvent 6wt%; The solvent is butyl carbitol; the thermoplastic resin is a mixture of polyamide resin and polycarbonate resin in a mass ratio of 3:97; the nano-silver powder is spherical silver powder, and the particle size median D50=50 of the spherical silver powder -200nm; the additive is an imidazole curing agent.
该低温固化型导电银浆料的制备方法，包括以下步骤：The preparation method of this low-temperature curing type conductive silver paste comprises the following steps:
（1）按比例称量原料，备用；(1) Weigh the raw materials in proportion and set aside;
（2）将纳米银粉和纳米铝粉放入球磨机，边搅拌边研磨，使纳米银粉和纳米铝粉混合均匀，且混合粉末的粒径小于100nm，备用；(2) Put the nano-silver powder and nano-aluminum powder into a ball mill, and grind while stirring, so that the nano-silver powder and nano-aluminum powder are mixed evenly, and the particle size of the mixed powder is less than 100nm, and set aside;
（3）将热塑性树脂、添加剂和溶剂放入搅拌缸内溶解，并加热搅拌，加热温度为90℃，搅拌速度为800 r/min，搅拌和加热时间为2h；(3) Dissolve the thermoplastic resin, additives and solvents in a mixing tank, and heat and stir. The heating temperature is 90°C, the stirring speed is 800 r/min, and the stirring and heating time is 2 hours;
（4）将步骤（2）中的混合粉末加入搅拌缸，继续加热搅拌，加热温度为60℃，搅拌速度为3500 r/min，搅拌和加热时间为4h；混合均匀成糊浆状，则制得低温固化导电银浆料。(4) Add the mixed powder in step (2) into the mixing tank, continue heating and stirring, the heating temperature is 60°C, the stirring speed is 3500 r/min, and the stirring and heating time is 4 hours; mix evenly and form a paste, then the preparation A low-temperature curing conductive silver paste was obtained.
实施例3：该低温固化型导电银浆料，其配方的各组分按重量比例为：纳米银粉90wt%，纳米铝粉1wt%，热塑性树脂3wt%，添加剂1 wt%，溶剂5wt%；所述溶剂为丁基卡必醇醋酸酯和丁基卡必醇；热塑性树脂采取聚酰胺树脂与聚碳酸酯树脂按照质量比例 10：90 混合的混合物；所述纳米银粉为球形银粉，所述球形银粉的粒径中值D50＝50-200nm；所述添加剂为咪唑类固化剂。Embodiment 3: this low-temperature curing type conductive silver paste, each component of its formula is by weight: nano-silver powder 90wt%, nano-aluminum powder 1wt%, thermoplastic resin 3wt%, additive 1 wt%, solvent 5wt%; The solvent is butyl carbitol acetate and butyl carbitol; the thermoplastic resin is a mixture of polyamide resin and polycarbonate resin in a mass ratio of 10:90; the nano-silver powder is spherical silver powder, and the spherical silver powder The median particle size D50=50-200nm; the additive is an imidazole curing agent.
该低温固化型导电银浆料的制备方法，包括以下步骤：The preparation method of this low-temperature curing type conductive silver paste comprises the following steps:
（1）按比例称量原料，备用；(1) Weigh the raw materials in proportion and set aside;
（2）将纳米银粉和纳米铝粉放入球磨机，边搅拌边研磨，使纳米银粉和纳米铝粉混合均匀，且混合粉末的粒径小于100nm，备用；(2) Put the nano-silver powder and nano-aluminum powder into a ball mill, and grind while stirring, so that the nano-silver powder and nano-aluminum powder are mixed evenly, and the particle size of the mixed powder is less than 100nm, and set aside;
（3）将热塑性树脂、添加剂和溶剂放入搅拌缸内溶解，并加热搅拌，加热温度为85℃，搅拌速度为600 r/min，搅拌和加热时间为3h；(3) Dissolve the thermoplastic resin, additives and solvents in a mixing tank, and heat and stir. The heating temperature is 85°C, the stirring speed is 600 r/min, and the stirring and heating time is 3 hours;
（4）将步骤（2）中的混合粉末加入搅拌缸，继续加热搅拌，加热温度为40℃，搅拌速度为2600r/min，搅拌和加热时间为6h；混合均匀成糊浆状，则制得低温固化导电银浆料。(4) Add the mixed powder in step (2) into the mixing tank, continue heating and stirring, the heating temperature is 40°C, the stirring speed is 2600r/min, and the stirring and heating time is 6h; mix evenly and form a paste, then the prepared Low temperature curing conductive silver paste.
采用上述实施例所制得的低温导银浆，采用丝网印刷工艺应用于晶硅异质结太阳能电池后，其填充因子：实施例1＞实施例3＞实施例2。The low-temperature silver conductive paste prepared in the above examples is applied to crystalline silicon heterojunction solar cells by the screen printing process, and its fill factor is as follows: Example 1>Example 3>Example 2.
最后，还需要注意的是，以上列举的仅是本发明的若干个具体实施例。显然，本发明不限于以上实施例，还可以有许多变形。本领域的普通技术人员能从本发明公开的内容直接导出或联想到的所有变形，均应认为是本发明的保护范围。Finally, it should be noted that the above examples are only some specific embodiments of the present invention. Obviously, the present invention is not limited to the above embodiments, and many variations are possible. All deformations that can be directly derived or associated by those skilled in the art from the content disclosed in the present invention should be considered as the protection scope of the present invention.
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| CN201610253683.0ACN105761778B (en) | 2016-04-22 | 2016-04-22 | A kind of preparation method of low temperature curing type conductive silver paste |
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| CN201610253683.0ACN105761778B (en) | 2016-04-22 | 2016-04-22 | A kind of preparation method of low temperature curing type conductive silver paste |
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